Depth information camera module

Abstract

A depth information camera module disclosed by the present invention comprises a projection module, a receiving module and a circuit board, the projection module comprises a light source chip assembly, and the receiving module comprises a photosensitive chip and an optical lens arranged on a photosensitive light path of a first photosensitive area of the photosensitive chip. The light source chip assembly and the light sensing chip are respectively connected to the circuit board, and the light source chip assembly and the light sensing chip have overlapped parts in the height direction, so that the transverse size of the depth information camera module is reduced.

Description

Technical Field

[0001] The present invention relates to the field of photography, and in particular to a depth information photography module. Background Art

[0002] With the improvement of living standards, consumers have higher and higher requirements for the camera functions of mobile phones, tablets and other terminal devices. For example, consumers' demand for the distance measurement function of terminal devices has also increased. However, since depth cameras with distance measurement functions need to be equipped with projection modules and receiving modules, and the projection modules and receiving modules of existing depth cameras are arranged side by side, the size of depth cameras is large and needs to occupy a large and valuable internal space of terminal devices, resulting in the development trend of depth cameras being unable to meet the development trend of thin and light terminal devices.

[0003] Therefore, an improved depth information camera module is needed to meet the configuration requirements of future terminal devices. Summary of the invention

[0004] One object of the present invention is to provide a depth information camera module, wherein the light source chip assembly and the photosensitive chip of the depth information camera module have an overlapping portion in the height direction to reduce the lateral size of the depth information camera module.

[0005] One object of the present invention is to provide a depth information camera module, wherein the circuit board and the front packaging part of the depth information camera module isolate the first photosensitive area and the second photosensitive area of ​​the photosensitive chip to prevent the sensing light generated by the light source chip assembly from directly reaching the first photosensitive area of ​​the photosensitive chip inside the depth information camera module, so as to ensure the sensing accuracy of the depth information camera module.

[0006] One object of the present invention is to provide a depth information camera module, wherein a light shielding portion is arranged between the circuit board and the non-photosensitive area of ​​the photosensitive chip to prevent a gap from being generated between the non-photosensitive area of ​​the photosensitive chip and the back side of the circuit board, so as to prevent the sensing light generated by the light source chip assembly from directly reaching the first photosensitive area of ​​the photosensitive chip inside the depth information camera module, thereby ensuring the sensing accuracy of the depth information camera module.

[0007] One object of the present invention is to provide a depth information camera module, wherein the bracket of the depth information camera module includes a bracket tube, and the bracket tube is mounted on the top surface of the front packaging part and covers the second photosensitive window of the front packaging part, so that when the light source chip assembly generates sensing light, the second photosensitive area of ​​the photosensitive chip can receive the sensing light inside the depth information camera module.

[0008] One object of the present invention is to provide a depth information camera module, wherein a support arm of the support extends laterally from a shoulder of the support tube, and the optical lens is assembled to the support arm. In this way, the depth information camera module increases the mounting area of ​​the top surface of the support and the front packaging part to improve the reliability of the mounting relationship between the support and the front packaging part, while allowing the optical lens and the shoulder of the support tube to have an overlapping portion in the height direction to reduce the lateral size of the depth information camera module.

[0009] According to one aspect of the present invention, the present invention provides a depth information camera module, comprising:

[0010] A projection module, wherein the projection module comprises a light source chip assembly;

[0011] A receiving module, wherein the receiving module comprises a photosensitive chip and an optical lens disposed in a photosensitive light path of a first photosensitive area of ​​the photosensitive chip; and

[0012] A circuit board, wherein the light source chip assembly and the photosensitive chip are respectively connected to the circuit board, wherein the light source chip assembly and the photosensitive chip have an overlapping portion in a height direction.

[0013] According to one embodiment of the present invention, the circuit board has a plate front side, a plate back side corresponding to the plate front side, and a first opening extending from the plate front side to the plate back side, wherein the light source chip assembly is mounted on the plate front side of the circuit board, the photosensitive chip is mounted on the plate back side of the circuit board, and the first photosensitive area of ​​the photosensitive chip corresponds to the first opening of the circuit board.

[0014] According to one embodiment of the present invention, the depth information camera module further includes a non-light-transmissive front packaging part, the front packaging part has a light source window and a first photosensitive window, the front packaging part is arranged on the front side of the plate material of the circuit board, and the light-emitting area of ​​the light source chip assembly corresponds to the light source window of the front packaging part, the sensing light generated by the light source chip assembly is allowed to be projected outward through the light source window of the front packaging part, the first opening of the circuit board corresponds to the first photosensitive window of the front packaging part, and the external light incident from the optical lens is allowed to reach the first photosensitive area of ​​the photosensitive chip through the first photosensitive window of the front packaging part and the first opening of the circuit board.

[0015] According to one embodiment of the present invention, the projection module includes a diffractive optical element, the depth information camera module includes a bracket, the bracket includes a bracket tube, the diffractive optical element is assembled in the bracket tube, wherein the bracket tube is mounted on the top surface of the front packaging part, so that the extended optical element is set in the output light path of the light source chip assembly by the bracket tube.

[0016] According to one embodiment of the present invention, the bracket includes a bracket arm, the bracket arm has a bracket channel, the bracket arm extends laterally from one side of the bottom of the bracket tube, wherein the bracket arm is mounted on the top surface of the front packaging portion in a manner that the bracket channel and the first photosensitive window correspond, wherein the optical lens is assembled to the bracket arm, and the bracket channel of the bracket arm corresponds to the optical lens.

[0017] According to one embodiment of the present invention, the thickness of the adhesive used to bond the optical lens and the bracket arm is greater than the thickness of the adhesive used to bond the bracket and the top surface of the front packaging part.

[0018] According to one embodiment of the present invention, the circuit board has a second opening, the second opening extends from the front side of the plate to the back side of the plate, the second photosensitive area of ​​the photosensitive chip corresponds to the second opening of the circuit board, wherein the front packaging part has a second photosensitive window, the second photosensitive window corresponds to the second opening of the circuit board, wherein the bracket tube covers the second photosensitive window of the front packaging part.

[0019] According to one embodiment of the present invention, the depth information camera module further includes a light shielding portion, which is located between the back side of the plate of the circuit board and the non-photosensitive area of ​​the photosensitive chip, and at least one of the first photosensitive area and the second photosensitive area of ​​the photosensitive chip is surrounded by the light shielding portion.

[0020] According to one embodiment of the present invention, the photosensitive chip has a non-photosensitive area, and the non-photosensitive area has an edge portion and a partition portion, wherein the edge portion is located outside the first photosensitive area and the second photosensitive area, and the partition portion separates the first photosensitive area and the second photosensitive area so that the first photosensitive area and the second photosensitive area are independent of each other, wherein the chip pad of the photosensitive chip is arranged at the edge portion of the non-photosensitive area, wherein the depth information camera module further includes a light-shielding portion, and the light-shielding portion is located between the back side of the plate material of the circuit board and the partition portion of the non-photosensitive area of ​​the photosensitive chip.

[0021] According to one embodiment of the present invention, the depth information camera module includes a light-transmitting element, and the light-transmitting element is entirely located in the second opening of the circuit board.

[0022] According to one embodiment of the present invention, the depth information camera module includes a light-transmitting element, the bottom of the light-transmitting element extends to the second opening of the circuit board, and the top of the light-transmitting element extends to the second light-sensitive window of the front packaging part.

[0023] According to one embodiment of the present invention, the bottom of the light-transmitting element is inserted into the second opening of the circuit board, and the front packaging part is integrally combined with the front surface of the plate material of the circuit board and the light source chip assembly during molding and wraps the side of the top of the light-transmitting element and exposes the top surface of the light-transmitting element; or the bottom of the light-transmitting element is inserted into the second opening of the circuit board, and the top of the light-transmitting element is inserted into the second light-sensitive window of the front packaging part.

[0024] According to one embodiment of the present invention, a portion of the light-transmitting element is molded in the second opening of the circuit board, and another portion of the light-transmitting element protrudes from the front side of the plate material of the circuit board, and the front packaging portion wraps the side of the top of the light-transmitting element during molding and exposes the top surface of the light-transmitting element.

[0025] According to an embodiment of the present invention, a reflective film is disposed on the peripheral wall of the light-transmitting element.

[0026] According to one embodiment of the present invention, the projection module includes a reflective element, which is suspended directly above the second photosensitive window of the front packaging part to allow the second photosensitive area of ​​the photosensitive chip to face the reflective surface of the reflective element in the height direction.

[0027] According to one embodiment of the present invention, the reflective element is arranged on the inner wall of the bracket tube so that the reflective element is suspended by the bracket tube directly above the second photosensitive window of the front packaging part; or, the reflective element is applied to the inner wall of the bracket tube so that the reflective element is suspended by the bracket tube directly above the second photosensitive window of the front packaging part. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a cross-sectional schematic diagram of a depth information camera module according to a preferred embodiment of the present invention.

[0029] Figure 2 It is a top view schematic diagram of the partial structure of the depth information camera module according to the above preferred embodiment of the present invention.

[0030] Figure 3 It is a cross-sectional schematic diagram of a deformation example of the depth information camera module according to the above-mentioned preferred embodiment of the present invention.

[0031] Figure 4 It is a cross-sectional schematic diagram of another modified example of the depth information camera module according to the above preferred embodiment of the present invention.

[0032] Figure 5 It is a cross-sectional schematic diagram of another modified example of the depth information camera module according to the above preferred embodiment of the present invention.

[0033] Figure 6 It is a cross-sectional schematic diagram of another modified example of the depth information camera module according to the above preferred embodiment of the present invention. DETAILED DESCRIPTION

[0034] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components described below or illustrated in the following figures. The present invention can have other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used here are for descriptive purposes and should not be considered restrictive. The use of "including", "comprising" or "having" and its variations herein is intended to cover the items and their equivalents and additional items displayed below. Unless otherwise specified or limited, the terms "install", "connect", "support" and "couple" and their variations are widely used and cover direct installation and indirect installation, connection, support and connection. In addition, "connect" and "couple" are not limited to physical or mechanical connections or connections.

[0035] Furthermore, on the first aspect, in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second aspect, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0036] With reference to the accompanying drawings of the present invention Figure 1 and Figure 2A depth information camera module according to a preferred embodiment of the present invention will be disclosed and explained in the following description, wherein the depth information camera module includes a projection module 10, a receiving module 20 and a circuit board 30.

[0037] Specifically, the projection module 10 includes a light source chip assembly 11, wherein the light emitting area of ​​the light source chip assembly 11 can generate sensing light. Further, the projection module 10 includes a diffractive optical element (DOE) 12, which is arranged in the outgoing light path of the light source chip assembly 11, wherein the sensing light generated by the light emitting area of ​​the light source chip assembly 11 can be projected to the outside of the depth information camera module after passing through the diffractive optical element 12, for example, the sensing light generated by the light emitting area of ​​the light source chip assembly 11 can be projected toward a direction of a measured object after passing through the diffractive optical element 12. The diffractive optical element 12 is used to diffract the sensing light generated by the light emitting area of ​​the light source chip assembly 11 to form a desired light beam. The receiving module 20 includes a photosensitive chip 21 and an optical lens 22 arranged in the photosensitive optical path of the photosensitive chip 21. The external light of the depth information camera module (for example, the sensing light reflected by the measured object) can reach the photosensitive chip 21 after passing through the optical lens 22. The light source chip assembly 11 and the photosensitive chip 21 are respectively connected to the same circuit board 30, and the light source chip assembly 11 and the photosensitive chip 21 have an overlapping portion in the height direction to reduce the lateral size of the depth information camera module.

[0038] It can be understood by those skilled in the art that the depth information camera module of the present invention is a time of flight (ToF) module, which obtains the three-dimensional information of the object to be measured by measuring the flight time of the sensing light projected by the projection module 10 in space. For example, the distance information or surface depth information of the object to be measured can be measured by the depth information camera module. Specifically, the projection module 10 is used to project sensing light in the direction of the object to be measured, wherein at least part of the sensing light is reflected by the object to be measured, and the receiving module 20 is used to receive the sensing light reflected by the object to be measured, and the three-dimensional information of the object to be measured is obtained by calculating the flight time of the sensing light (that is, the time difference between the projection module 10 starting to project the sensing light and the receiving module 20 receiving the sensing light).

[0039] Continue to refer to the attached Figure 1 and Figure 2, the circuit board 30 has a plate front 31, a plate back 32 corresponding to the plate front 31, and a first opening 33 extending from the plate front 31 to the plate back 32, the light source chip assembly 11 is mounted on the plate front 31 of the circuit board 30, the photosensitive chip 21 is mounted on the plate back 32 of the circuit board 30, and the first photosensitive area 211 of the photosensitive chip 21 corresponds to the first opening 33 of the circuit board 30, and the optical lens 22 is arranged in the photosensitive light path of the first photosensitive area 211 of the photosensitive chip 21, so that the depth information camera module can avoid the mutual interference between the light source chip assembly 11 and the photosensitive chip 21, so that the light source chip assembly 11 and the photosensitive chip 21 have an overlapping part in the height direction. In other words, the depth information camera module does not require the circuit board 30 to reserve a position on the plate front 31 for simultaneously mounting the light source chip assembly 11 and the photosensitive chip 21, so as to reduce the lateral size of the depth information camera module. The shape of the first opening 33 of the circuit board 30 is consistent with the shape of the first photosensitive area 211 of the photosensitive chip 21, and the size of the first opening 33 of the circuit board 30 is slightly larger than the size of the first photosensitive area 211 of the photosensitive chip 21 to avoid the circuit board 30 blocking external light passing through the optical lens 22.

[0040] In some embodiments of the depth information camera module of the present invention, the light source chip assembly 11 includes a driver chip 111 and at least one light source chip 112, and the driver chip 111 and the light source chip 112 are stacked and arranged on the front surface 31 of the plate of the circuit board 30 to reduce the lateral size of the depth information camera module. Specifically, based on the surface mounting technology (Surface Mounting Technology, SMT), the driver chip 111 can be mounted on the front surface 31 of the plate of the circuit board 30, wherein the light source chip 112 is stacked and mounted above the driver chip 111, and based on the wire bonding process, the light source chip 112 can be electrically connected to the driver chip 111 or electrically connected to the circuit board 30, so that the driver chip 111 and the light source chip 112 are stacked and arranged on the front surface 31 of the plate of the circuit board 30. It can be understood that the wire bonding process refers to the process of electrically connecting two components that need to be electrically connected through wires such as gold wires.

[0041] The process of stacking the light source chip 112 on top of the driver chip 111 may be: first, bonding the light source chip 112 on top of the driver chip 111 by glue, and secondly, electrically connecting the light source chip 112 to the driver chip 111 or electrically connecting to the circuit board 30 by a wire bonding process. In this way, in the process of electrically connecting the light source chip 112 and the driver chip 111 or electrically connecting the light source chip 112 and the circuit board 30 by a wire bonding process, the relative position of the light source chip 112 and the circuit board 30 can be reliably maintained at the designed position to improve the yield of the depth information camera module.

[0042] It is worth mentioning that the specific type of the light source chip 112 is not limited in the depth information camera module of the present invention. For example, the light source chip 112 can be a light source in the form of a vertical cavity surface emitting laser (Vertical Cavity Surface Emitting Laser, abbreviated as VCSEL, which can also be translated as vertical resonant cavity surface emitting laser), an edge emitting laser (Edge Emitting Laser, EEL), a light emitting diode (Light Emitting Diode, LED), a laser diode (Laser Diode, LD), etc., wherein the edge emitting laser can be a Fabry Perot (FP) laser, a distributed feedback (DFB) laser, an electro-absorption modulated laser (Electro-absorption Modulated, EML), etc.

[0043] It is also worth mentioning that the number of the light source chips 112 is not limited in the depth information camera module of the present invention, and it can be singular or plural. In the embodiment where the number of the light source chips 112 is plural, the plural light source chips 112 can be arranged regularly, such as in an array, or can be arranged irregularly and randomly. In addition, in the embodiment where the number of the light source chips 112 is plural, the specific types of the plural light source chips 112 can be the same or different.

[0044] Continue to refer to the attached Figure 1 and Figure 2The depth information camera module further includes a non-light-transmissive front packaging part 40, the front packaging part 40 has a light source window 41 and a first light-sensitive window 42, the front packaging part 40 is integrally combined with the light source chip component 11 and the plate front 31 of the circuit board 30, and the light-emitting area of ​​the light source chip component 11 corresponds to the light source window 41 of the front packaging part 40, so as to allow the sensing light generated by the light source chip component 11 to be emitted through the light source window 41 of the front packaging part 40 and the diffractive optical element 12, and the first opening 33 of the circuit board 30 corresponds to the first light-sensitive window 42 of the front packaging part 40, so as to allow the sensing light reflected by the object to be measured to reach the first light-sensitive area 211 of the photosensitive chip 21 through the first light-sensitive window 42 of the front packaging part 40 and the first opening 33 of the circuit board 30 after passing through the optical lens 22.

[0045] It can be understood that, since the front packaging part 40 is integrally combined with the light source chip assembly 11 and the plate front 31 of the circuit board 30, the front packaging part 40 enables the light source chip assembly 11 to be reliably mounted on the plate front 31 of the circuit board 30, thereby preventing the light source chip assembly 11 from falling off from the plate front 31 of the circuit board 30. At the same time, the front packaging part 40 can improve the flatness of the circuit board 30 and reinforce the strength of the circuit board 30, thereby preventing the circuit board 30 from being deformed. In addition, since the front packaging part 40 is integrally combined with the light source chip assembly 11, the front packaging part 40 wraps the edge of the light source chip assembly 11, so that the heat generated by the light source chip assembly 11 when projecting sensing light to the outside of the depth information camera module can be quickly radiated outward through the front packaging part 40, so as to help reduce the operating temperature of the depth information camera module and avoid the performance degradation or failure of the depth information camera module due to long-term high temperature.

[0046] In other examples of the depth information camera module of the present invention, the front packaging part 40 can be a preformed part, and the front packaging part 40 is arranged on the front side 31 of the plate of the circuit board 30. For example, the front packaging part 40 can be bonded to the front side 31 of the plate of the circuit board 30 by adhesives such as glue, wherein the light-emitting area 11 of the light source chip assembly 11 corresponds to the light source window 41 of the front packaging part 40, so as to allow the sensing light generated by the light source chip assembly 11 to be emitted through the light source window 41 of the front packaging part 40 and the diffraction optical element 12, and the first opening 33 of the circuit board 30 corresponds to the first photosensitive window 42 of the front packaging part 40, so as to allow the sensing light reflected by the object to be measured to reach the first photosensitive area 211 of the photosensitive chip 21 through the first photosensitive window 42 of the front packaging part 40 and the first opening 33 of the circuit board 30 after passing through the optical lens 22.

[0047] Continue to refer to the attached Figure 1 and Figure 2 The depth information camera module further includes a back packaging part 50, the back packaging part 50 has a mounting channel 51, the back packaging part 50 is integrally combined with the back surface 32 of the board 30, and the first opening 33 of the circuit board 30 corresponds to the mounting channel 51 of the back packaging part 50. The photosensitive chip 21 is mounted on the back surface 32 of the board 30 through the mounting channel 51 of the back packaging part 50.

[0048] It can be understood that, by integrally combining the back side packaging part 50 with the back side 32 of the plate of the circuit board 30, the back side packaging part 50 can not only reinforce the strength of the circuit board 30 and prevent the circuit board 30 from deformation, but also further improve the heat dissipation capacity of the depth information camera module, which is conducive to further reducing the operating temperature of the depth information camera module.

[0049] Preferably, the bottom surface of the back packaging portion 50 is flush with or lower than the bottom surface of the photosensitive chip 21. In this way, whether in the process of assembling the depth information camera module or in the process of assembling the depth information camera module in the terminal device, the back packaging portion 50 can prevent the photosensitive chip 21 from being collided in the circumferential direction of the photosensitive chip 21, so as to ensure the reliability and stability of the depth information camera module.

[0050] In other examples of the depth information camera module of the present invention, the back side packaging portion 50 may be a preformed part, and the back side packaging portion 50 is disposed on the back side 32 of the plate of the circuit board 30. For example, the back side packaging portion 50 may be bonded to the back side 32 of the plate of the circuit board 30 by adhesives such as glue.

[0051] In some embodiments of the depth information camera module of the present invention, the front packaging part 40 may be firstly integrated with the plate front 31 of the circuit board 30 and the light source chip assembly 11, and then the back packaging part 50 may be integrated with the plate back 32 of the circuit board 30. In some embodiments of the depth information camera module of the present invention, the back packaging part 50 may be firstly integrated with the plate back 32 of the circuit board 30, and then the front packaging part 40 may be integrated with the plate front 31 of the circuit board 30 and the light source chip assembly 11. In some embodiments of the depth information camera module of the present invention, the front packaging part 40 and the back packaging part 50 are made by the same process, that is, while the front packaging part 40 is integrated with the plate front 31 of the circuit board 30 and the light source chip assembly 11, the back packaging part 50 is allowed to be integrated with the plate back 32 of the circuit board 30.

[0052] It is worth mentioning that the specific manner in which the front side packaging part 40 is integrated with the front side 31 of the board 30 and the light source chip assembly 11, and the back side packaging part 50 is integrated with the back side 32 of the board 30 is not limited in the depth information camera module of the present invention. For example, based on the molding process, the front side packaging part 40 can be integrated with the front side 31 of the board 30 and the light source chip assembly 11, and the back side packaging part 50 can be integrated with the back side 32 of the board 30, and by virtue of the mold advantage, the bottom surface of the front side packaging part 40 and the bottom surface of the back side packaging part 50 can have good flatness.

[0053] Continue to refer to the attached Figure 1 and Figure 2 The depth information camera module further includes a plurality of electronic components 60, which may be resistors, capacitors, processors, drivers, diodes, memory chips, etc. The front side 31 of the board and / or the back side 32 of the board of the circuit board 30 may be mounted with the electronic components 60, wherein the front side packaging portion 40 wraps the electronic components 60 mounted on the front side 31 of the board of the circuit board 30, and the back side packaging portion 50 wraps the electronic components 60 mounted on the back side 32 of the board of the circuit board 30.

[0054] It can be understood that, since the light source chip assembly 11 is mounted on the front side 31 of the board 30 of the circuit board 30, the light source chip assembly 11 and the electronic components 60 mounted on the back side 32 of the board 30 of the circuit board 30 can overlap in height, and accordingly, since the photosensitive chip 21 is mounted on the back side 32 of the board 30 of the circuit board 30, the photosensitive chip 21 and the electronic components 60 mounted on the front side 31 of the board 30 of the circuit board 30 can overlap in height, and in this way, the lateral size of the depth information camera module can be reduced. At the same time, the light source chip assembly 11 and the electronic components 60 mounted on the front side 31 of the board 30 of the circuit board 30 can overlap in the horizontal direction, and the photosensitive chip 21 and the electronic components 60 mounted on the back side 32 of the board 30 of the circuit board 30 can overlap in the horizontal direction, so that the height size of the depth information camera module can also be controlled within a reasonable range.

[0055] Continue to refer to the attached Figure 1 and Figure 2 The depth information camera module includes a non-light-transmissive bracket 70, and the bracket 70 includes a bracket tube 71. The bracket tube 71 includes a barrel 711 and a shoulder 712 extending laterally outward from the bottom of the barrel 711. The diffractive optical element 12 is assembled in the barrel 711 of the bracket tube 71, wherein the shoulder 712 of the bracket tube 71 is mounted on the top surface of the front packaging part 40. For example, the shoulder 712 of the bracket tube 71 can be mounted on the top surface of the front packaging part 40 by glue, so that the diffractive optical element 12 is set in the output light path of the light source chip assembly 11 by the bracket tube 71.

[0056] Preferably, the projection module 10 further comprises a light-transmitting protection element 13, the protection element 13 is assembled to the cylinder body 711 of the support cylinder 71, and the protection element 13 is located outside the diffractive optical element 12, so that the protection element 13 protects the diffractive optical element 12. Figure 1 and Figure 2 In this specific example of the depth information camera module shown, there is a gap between the protection element 13 and the diffractive optical element 12. Optionally, in other examples of the depth information camera module of the present invention, the protection element 13 can be stacked on top of the diffractive optical element 12.

[0057] Continue to refer to the attached Figure 1 and Figure 2The bracket 70 further includes a bracket arm 72, and the bracket arm 72 has a bracket channel 721, wherein the bracket arm 72 extends laterally from one side of the shoulder 712 of the bracket tube 71, and the bracket arm 72 is mounted on the top surface of the front packaging portion 40 in a manner corresponding to the bracket channel 721 and the first photosensitive window 42. For example, the bracket arm 72 can be mounted on the top surface of the front packaging portion 40 by glue, so that the bracket arm 72 can increase the mounting area of ​​the bracket 70 and the top surface of the front packaging portion 40, so that the bracket 70 is reliably mounted on the top surface of the front packaging portion 40, wherein the optical lens 22 is assembled on the bracket arm 72, so that the optical lens 22 is set by the bracket arm 72 on the photosensitive light path of the first photosensitive area 211 of the photosensitive chip 21.

[0058] It can be understood that, through the above-mentioned structure, the depth information camera module can increase the mounting area of ​​the bracket 70 and the front packaging part 40 to improve the reliability of the mounting relationship between the bracket 70 and the front packaging part 40, while allowing the optical lens 22 and the shoulder 712 of the bracket tube 71 to have an overlapping portion in the height direction to reduce the lateral size of the depth information camera module.

[0059] In addition, in the process of mounting the bracket 70 on the top surface of the front packaging part 40 and assembling the optical lens 22 on the bracket arm 72 of the bracket 70, first, after being identified by machine vision, the bracket 70 can be directly fixed to the top surface of the front packaging part 40 by glue or other adhesives. At this time, the bracket tube 71 of the bracket 70 keeps the diffraction optical element 12 in the output light path of the light source chip assembly 11. Secondly, the optical lens 22 is assembled on the bracket arm 72 of the bracket 70 by glue or other adhesives after active calibration. At this time, the bracket arm 72 keeps the optical lens 22 in the photosensitive light path of the first photosensitive area 211 of the photosensitive chip 21, wherein active calibration refers to continuing to adjust the position of the optical lens 22 based on the image acquired from the first photosensitive area 211 of the photosensitive chip 21. It is understandable that, since the optical lens 22 needs to be actively calibrated, the thickness of the glue or other adhesive between the optical lens 22 and the bracket arm 72 is greater than the thickness of the glue or other adhesive between the bracket 70 and the top surface of the front packaging part 40.

[0060] Continue to refer to the attached Figure 1 and Figure 2The circuit board 30 has a second opening 34, and the second opening 34 extends from the front side 31 of the plate to the back side 32 of the plate, wherein the second photosensitive area 212 of the photosensitive chip 21 corresponds to the second opening 34 of the circuit board 30, wherein the front packaging part 40 has a second photosensitive window 43, and the second opening 34 of the circuit board 30 corresponds to the second photosensitive window 43 of the front packaging part 40, and the bracket tube 71 is configured to cover the second photosensitive window 43 of the front packaging part 40, so that the sensing light projected by the light source chip assembly 11 toward the bracket tube 71 can reach the second photosensitive area 212 of the photosensitive chip 21 through the second photosensitive window 43 of the front packaging part 40 and the second opening 34 of the circuit board 30.

[0061] It can be understood that since the bracket tube 71 is arranged to cover the second photosensitive window 43 of the front packaging part 40, the portion of the sensing light projected by the light source chip assembly 11 toward the bracket tube 71 that is not projected outward through the diffraction optical element 12 and the protective element 13 is blocked from entering the receiving module 20, so as to avoid interfering with the sensing light reflected by the object to be measured and entering the receiving module 20 through the optical lens 22, thereby ensuring the sensing accuracy of the depth information camera module.

[0062] It can also be understood that when the light source chip assembly 11 of the projection module 10 projects sensing light toward the outside of the depth information camera module, the portion projected by the light source chip assembly 11 to the bracket tube 71 and not projected outwardly by the diffractive optical element 12 and the protective element 13 is allowed to pass through the second photosensitive window 43 of the front packaging portion 40 and the second opening 34 of the circuit board 30 to reach the second photosensitive area 212 of the photosensitive chip 21, so as to obtain the projection time point, that is, the second photosensitive area 212 of the photosensitive chip 21. The sensing light generated by the light source chip assembly 11 is directly received inside the projection module 10. The sensing light reflected by the object to be measured is allowed to pass through the first photosensitive window 42 of the front packaging part 40 and the first opening 33 of the circuit board 30 to reach the first photosensitive area 211 of the photosensitive chip 21 after passing through the optical lens 22 of the receiving module 20, so as to obtain the receiving time point. By calculating the time difference between the projection time point and the receiving time point, the flight time of the sensing light in space can be obtained, and then the three-dimensional information of the object to be measured can be obtained.

[0063] It is worth mentioning that since the depth information camera module only uses the time point when the second photosensitive area 212 of the photosensitive chip 21 receives the sensing light generated by the light source chip assembly 11 as the projection time point, therefore, on the one hand, the area of ​​the second photosensitive area 212 of the photosensitive chip 21 may be smaller than the area of ​​the first photosensitive area 211. For example, in some embodiments of the depth information camera module of the present invention, the second photosensitive area 212 of the photosensitive chip 21 may include only one pixel or multiple pixels. On the other hand, the size of the second opening 34 of the circuit board 30 may be greater than, equal to or smaller than the size of the second photosensitive area 212 of the photosensitive chip 21. Nevertheless, in the attached Figure 1 and Figure 2 In this specific example of the depth information camera module of the present invention shown, the size of the second opening 34 of the circuit board 30 is designed to be larger than the size of the second photosensitive area 212 of the photosensitive chip 21, so that when sensing light is generated in the light-emitting area of ​​the light source chip assembly 11, more sensing light is allowed to reach the second photosensitive area 212 of the photosensitive chip 21 through the second photosensitive window 43 of the front packaging portion 40 and the second opening 34 of the circuit board 30.

[0064] It is worth mentioning that the shape of the second opening 34 of the circuit board 30 is not limited in the depth information camera module of the present invention, and it can be circular, rectangular, or rounded rectangular, etc.

[0065] It is also worth mentioning that in some embodiments of the depth information camera module of the present invention, the size of the second opening 34 of the circuit board 30 increases from the back side 32 of the plate to the front side 31 of the plate, so as to increase the amount of sensing light reaching the second photosensitive area 212 of the photosensitive chip 21 through the second photosensitive window 43 of the front packaging part 40 and the second opening 34 of the circuit board 30. In other embodiments of the depth information camera module of the present invention, the size of the second opening 34 of the circuit board 30 increases from the front side 31 of the plate to the back side 32 of the plate, so that after the sensing light reaches the second opening 34 of the circuit board 30 through the second photosensitive window 43 of the front packaging part 40, it is not easy to be reflected by the inner wall of the circuit board 30 used to form the second opening 34, so that most of the sensing light reaching the second opening 34 of the circuit board 30 reaches the second photosensitive area 212 of the photosensitive chip 21. Of course, in other examples of the depth information camera module of the present invention, the second opening 34 of the circuit board 30 is a straight-cylindrical opening.

[0066] In addition, the specific manner in which the photosensitive chip 21 is formed with the first photosensitive area 211 and the second photosensitive area 212 is not limited in the depth information camera module of the present invention. For example, in some embodiments of the depth information camera module of the present invention, the photosensitive chip 21 is formed with the first photosensitive area 211 and the second photosensitive area 212 of different sizes on the front of the photosensitive chip 21 during manufacturing. In some other embodiments of the depth information camera module of the present invention, the photosensitive chip 21 has a complete photosensitive area during manufacturing, and a mask is stacked on the complete photosensitive area to cover a portion of the complete photosensitive area, so that the remaining portion forms the first photosensitive area 211 and the second photosensitive area 212 of different sizes.

[0067] It can be understood that no matter how the photosensitive chip 21 is formed with the first photosensitive chip 211 and the second photosensitive area 212, the photosensitive chip 21 has a non-photosensitive area 213, and the non-photosensitive area 213 has an edge portion 2131 and a separating portion 2132, and the edge portion 2131 is located on the outside of the first photosensitive area 211 and the second photosensitive area 212, and the separating portion 2132 separates the first photosensitive area 211 and the second photosensitive area 212, so that the first photosensitive area 211 and the second photosensitive area 212 are independent of each other. That is, a portion of the edge portion 2131 of the non-photosensitive region 213 and the partition portion 2132 surround the first photosensitive region 211, that is, the first photosensitive region 211 is surrounded by the non-photosensitive region 213, and another portion of the edge portion 2131 of the non-photosensitive region 213 and the partition portion 2132 surround the second photosensitive region 212, that is, the second photosensitive region 212 is surrounded by the non-photosensitive region 213. It can be understood that in the embodiment of the photosensitive chip 21 in which the partition portion 2132 of the non-photosensitive region 213 is formed by a mask, the chip pad of the photosensitive chip 21 is located at the edge portion 2131 of the non-photosensitive region 213.

[0068] Preferably, the inner side surface of the light source window 41 of the front packaging part 40 is an inclined surface, and its radial dimension gradually increases from bottom to top, so as to facilitate demolding when the front packaging part 40 is molded by means of a mold and to facilitate the emission of sensing light generated by the light source chip assembly 11. The inner side surfaces of the first light-sensitive window 42 and the second light-sensitive window 43 of the front packaging part 40 are inclined surfaces, and their radial dimensions gradually increase from bottom to top, so as to facilitate demolding when the front packaging part 40 is molded by means of a mold and to facilitate the sensing light to be incident on the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21.

[0069] Reference Figure 1 In this specific example of the depth information camera module of the present invention, the photosensitive chip 21 is attached upside down to the back side 32 of the board of the circuit board 30 by means of hot pressing bonding, so that the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 can correspond to the first opening 33 and the second opening 34 of the circuit board 30 respectively.

[0070] Specifically, a sheet pad is provided on the back side 32 of the sheet of the circuit board 30, a first solder is provided on the sheet pad of the circuit board 30, a chip pad is provided on the non-photosensitive area 213 of the photosensitive chip 21, for example, the chip pad can be provided at the edge portion 2131 of the non-photosensitive area 213 of the photosensitive chip 21, or can be provided at the separation portion 2132 of the non-photosensitive area 213, a second solder is provided on the chip pad of the photosensitive chip 21, when the photosensitive chip 21 is stacked on the circuit board 30, the position of the pad of the photosensitive chip 21 corresponds to the position of the sheet pad of the circuit board 30, then, the first solder and the second solder are bonded by hot pressing to realize the mounting between the circuit board 30 and the photosensitive chip 21. It can be understood that after the first pad and the second pad are bonded by hot pressing, the chip pad of the photosensitive chip 21 and the sheet pad of the circuit board 30 are connected. Preferably, a non-conductive glue is provided at the bonding position between the photosensitive chip 21 and the circuit board 30. The non-conductive glue can enhance the connection strength between the photosensitive chip 21 and the circuit board 30 while protecting the solder, so that the photosensitive chip 21 can be reliably mounted on the circuit board 30.

[0071] It is worth mentioning that the material of the solder is not limited in the depth information camera module of the present invention. For example, in some embodiments of the depth information camera module of the present invention, the first solder may be a tin material, and the second solder may be a gold material. After the first solder of the tin material and the second solder of the gold material are hot-pressed and bonded, the photosensitive chip 21 can be mounted on the circuit board 30.

[0072] Continue to refer to the attached Figure 1Since the second photosensitive area 212 of the photosensitive chip 21 directly receives the sensing light generated by the light source chip assembly 11 inside the projection module 10 to obtain the projection time point, the first photosensitive area 211 of the photosensitive chip 21 receives the sensing light reflected by the measured object to obtain the receiving time point, and the first photosensitive area 211 and the second photosensitive area 212 are located at different positions on the same side of the same photosensitive chip 21, in order to avoid the sensing light generated by the light source chip assembly 11 from being projected outside the depth information camera module In the case of direct transmission to the first photosensitive area 211 of the photosensitive chip 21, the depth information camera module further includes at least one light shielding portion 80, the light shielding portion 80 is located between the back side 32 of the board of the circuit board 30 and the non-photosensitive area 213 of the photosensitive chip 21, and at least one of the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 is surrounded by the light shielding portion 80, so as to isolate the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 by the light shielding portion 80.

[0073] The shading portion 80 can be formed by glue applied between the back side 32 of the plate of the circuit board 30 and the non-photosensitive area 213 of the photosensitive chip 21. In this way, the shading portion 80 can not only isolate the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21, but also can bond the back side 32 of the plate of the circuit board 30 and the non-photosensitive area 213 of the photosensitive chip 21, thereby enhancing the connection strength between the photosensitive chip 21 and the circuit board 30, so that the photosensitive chip 21 can be reliably mounted on the circuit board 30.

[0074] In the attached Figure 1 and Figure 2 In the specific example of the depth information camera module of the present invention shown, the chip pad of the photosensitive chip 21 is only arranged at the edge portion 2131 of the non-photosensitive area 213, that is, the partition portion 2132 of the non-photosensitive area 213 of the photosensitive chip 21 is not provided with a chip pad. After the photosensitive chip 21 is mounted on the back side 32 of the plate of the circuit board 30, in order to avoid the formation of a gap between the photosensitive chip 21 and the circuit board 30 at the position corresponding to the partition portion 2132 of the non-photosensitive area 213, the depth information camera module needs to set the shading portion 80 between the photosensitive chip 21 and the circuit board 30 at the position corresponding to the partition portion 2132 of the non-photosensitive area 213, so as to avoid the first photosensitive area 211 of the photosensitive chip 21 directly receiving the sensing light generated by the light source chip assembly 11 inside the depth information camera module.

[0075] In some embodiments of the depth information camera module of the present invention, the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 are respectively surrounded by the light shielding portion 80, so that the light outside the depth information camera module is prevented from reaching the first photosensitive area 211 and the second photosensitive area 212 of the photosensitive chip 21 through the mounting position of the photosensitive chip 21 and the circuit board 30. Preferably, the glue used to form the light shielding portion 80 can be a non-conductive glue used to protect solder during the thermal compression bonding process.

[0076] Attached Figure 3 A variation of the depth information camera module according to the preferred embodiment of the present invention is shown, and the attached Figure 1 and Figure 2 The depth information camera module shown is different in that Figure 3 In this specific example of the depth information camera module of the present invention shown, the depth information camera module further includes a light-transmitting element 90, which is arranged above the second photosensitive area 212 of the photosensitive chip 21, wherein the sensing light generated by the light source chip assembly 11 is allowed to reach the second photosensitive area 212 of the photosensitive chip 21 after passing through the light-transmitting element 90.

[0077] Specifically, in the attached Figure 3 In this specific example of the depth information camera module shown, the bottom of the light-transmitting element 90 extends to and is held in the second opening 34 of the circuit board 30, and the top of the light-transmitting element 90 extends to and is held in the second light-sensitive window 43 of the front packaging part 40, so that the light-transmitting element 90 is held above the second light-sensitive area 212 of the light-sensitive chip 21 by the circuit board 30 and the front packaging part 40. Preferably, a reflective film 100 is provided on the peripheral wall of the light-transmitting element 90 to allow more sensing light to reach the second light-sensitive area 212 of the light-sensitive chip 21. In some embodiments of the depth information camera module of the present invention, the reflective film 100 may be mounted on the peripheral wall of the light-transmitting element 90. In other embodiments of the depth information camera module of the present invention, the reflective film 100 may be applied to the peripheral wall of the light-transmitting element 90.

[0078] In some embodiments of the depth information camera module of the present invention, the light-transmitting element 90 is a preformed part. For example, the light-transmitting element 90 may be an optical fiber, or other material made of glass or plastic, wherein the bottom of the light-transmitting element 90 is inserted into the second opening 34 of the circuit board 30, and the front packaging part 40 wraps the top of the light-transmitting element 90 during molding and exposes the top surface of the front packaging part 40, so that the bottom of the light-transmitting element 90 extends to and is retained in the second opening 34 of the circuit board 30, and the top of the light-transmitting element 90 extends to and is retained in the second light-sensitive window 43 of the front packaging part 40. In some embodiments of the depth information camera module of the present invention, the light-transmitting element 90 is integrally formed on the circuit board 30, and the bottom of the light-transmitting element 90 is formed in the second opening 34 of the circuit board 30, and the top of the light-transmitting element 90 protrudes from the front side 31 of the plate of the circuit board 30. For example, a molding process can be used to allow a transparent molding material to form the light-transmitting element 90 on the circuit board 30, and the front packaging part 40 wraps the top of the light-transmitting element 90 during molding and exposes the top surface of the front packaging part 40, so that the bottom of the light-transmitting element 90 extends to and is retained in the second opening 34 of the circuit board 30, and the top of the light-transmitting element 90 extends to and is retained in the second light-sensitive window 43 of the front packaging part 40.

[0079] Attached Figure 4 A variation of the depth information camera module according to the preferred embodiment of the present invention is shown, and the attached Figure 3 The depth information camera module shown is different in that Figure 4 In this specific example of the depth information camera module of the present invention shown, the light-transmitting element 90 is located as a whole in the second opening 34 of the circuit board 30, that is, the height position of the top surface of the light-transmitting element 90 is flush with or slightly lower than the front surface 31 of the board of the circuit board 30, and the light-transmitting element 90 corresponds to the second photosensitive window 43 of the front packaging part 40, so that the sensing light generated by the light source chip assembly 11 is allowed to reach the second photosensitive area 212 of the photosensitive chip 21 through the second photosensitive window 43 of the front packaging part 40 and the light-transmitting element 90.

[0080] Attached Figure 5 A variation of the depth information camera module according to the preferred embodiment of the present invention is shown, and the attached Figure 1 and Figure 2 The depth information camera module shown is different in that Figure 5In the specific example of the depth information camera module of the present invention shown, the projection module 10 further includes a reflective element 14, which is suspended directly above the second photosensitive window 43 of the front packaging portion 40 to allow the second photosensitive area 212 of the photosensitive chip 21 to correspond to the reflective element 14 in the height direction, so that the sensing light generated by the light source chip assembly 11 can be reflected by the reflective surface 141 of the reflective element 14 toward the second photosensitive area 212 of the photosensitive chip 21, so as to improve the accuracy of obtaining the projection time point. The extension direction of the reflective surface 141 of the reflective element 14 and the extension direction of the plate front 31 of the circuit board 30 can be parallel to each other or have an angle, which is selected according to needs.

[0081] In some embodiments of the depth information camera module of the present invention, the reflective element 14 is a prefabricated part, which can be a reflector, and the reflective element 14 is disposed on the inner wall of the bracket tube 71 of the bracket 70. For example, the reflective element 14 can be bonded to the inner wall of the bracket tube 71 by glue, so that the reflective element 14 is suspended by the bracket tube 71 just above the second light-sensitive window 43 of the front packaging part 40. In some other embodiments of the depth information camera module of the present invention, the reflective element 14 can be applied to the inner wall of the bracket tube 71, so that the reflective element 14 is suspended by the bracket tube 71 just above the second light-sensitive window 43 of the front packaging part 40.

[0082] Attached Figure 6 A variation of the depth information camera module according to the preferred embodiment of the present invention is shown, and the attached Figure 1 and Figure 2 The depth information camera module shown is different in that Figure 6In this specific example of the depth information camera module of the present invention shown, the receiving module 20 further includes a filter element 23, which is mounted on the front packaging part 40, so that the filter element 23 is maintained between the first photosensitive area 211 of the photosensitive chip 21 and the optical lens 22 by the front packaging part 40, so as to filter the stray light part of the light entering the receiving module 20 through the optical lens 22. For example, in the specific example of the depth information camera module in which the first photosensitive area 211 of the photosensitive chip 21 only needs to receive infrared light, the filter element 23 is configured to filter light other than infrared light. Preferably, the top surface of the front packaging part 40 surrounding the first photosensitive window 42 is concave to form a mounting groove 44, and the filter element 23 is mounted in the mounting groove 44 of the front packaging part 40 to avoid the setting of the filter element 23 increasing the height dimension of the depth information camera module.

[0083] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A depth information camera module, characterized in that: include: A projection module, wherein the projection module comprises a light source chip assembly; A receiving module, wherein the receiving module comprises a photosensitive chip and an optical lens disposed in a photosensitive light path of a first photosensitive area of ​​the photosensitive chip; as well as A circuit board, wherein the light source chip assembly and the photosensitive chip are respectively connected to the circuit board, wherein the light source chip assembly and the photosensitive chip have an overlapping portion in a height direction.

2. The depth information camera module according to claim 1, wherein the circuit board has a front side of the board, a back side of the board corresponding to the front side of the board, and a first opening extending from the front side of the board to the back side of the board, wherein the light source chip assembly is mounted on the front side of the board of the circuit board, the photosensitive chip is mounted on the back side of the board of the circuit board, and the first photosensitive area of ​​the photosensitive chip corresponds to the first opening of the circuit board.

3. The depth information camera module according to claim 2, wherein the depth information camera module further includes a non-light-transmissive front packaging part, the front packaging part having a light source window and a first photosensitive window, the front packaging part is arranged on the front side of the plate of the circuit board, and the light-emitting area of ​​the light source chip assembly corresponds to the light source window of the front packaging part, the sensing light generated by the light source chip assembly is allowed to be projected outward through the light source window of the front packaging part, the first opening of the circuit board corresponds to the first photosensitive window of the front packaging part, and the external light incident from the optical lens is allowed to reach the first photosensitive area of ​​the photosensitive chip through the first photosensitive window of the front packaging part and the first opening of the circuit board.

4. The depth information camera module according to claim 3, wherein the projection module includes a diffraction optical element, the depth information camera module includes a bracket, the bracket includes a bracket tube, the diffraction optical element is assembled in the bracket tube, wherein the bracket tube is mounted on the top surface of the front packaging part so that the extension optical element is set in the output light path of the light source chip assembly by the bracket tube.

5. The depth information camera module according to claim 4, wherein the bracket includes a bracket arm, the bracket arm has a bracket channel, the bracket arm extends laterally from one side of the bottom of the bracket tube, wherein the bracket arm is mounted on the top surface of the front packaging portion in a manner that the bracket channel and the first photosensitive window correspond, wherein the optical lens is assembled to the bracket arm, and the bracket channel of the bracket arm corresponds to the optical lens.

6. The depth information camera module according to claim 5, wherein the thickness of the adhesive used to bond the optical lens and the bracket arm is greater than the thickness of the adhesive used to bond the bracket and the top surface of the front packaging part.

7. The depth information camera module according to claim 4, 5 or 6, wherein the circuit board has a second opening, the second opening extends from the front side of the plate to the back side of the plate, the second photosensitive area of ​​the photosensitive chip corresponds to the second opening of the circuit board, wherein the front packaging part has a second photosensitive window, the second photosensitive window corresponds to the second opening of the circuit board, and the bracket tube covers the second photosensitive window of the front packaging part.

8. The depth information camera module according to claim 7, wherein the depth information camera module further comprises a light shielding portion, the light shielding portion is located between the back side of the plate of the circuit board and the non-photosensitive area of ​​the photosensitive chip, and at least one of the first photosensitive area and the second photosensitive area of ​​the photosensitive chip is surrounded by the light shielding portion.

9. The depth information camera module according to claim 7, wherein the photosensitive chip has a non-photosensitive area, the non-photosensitive area has an edge portion and a partition portion, the edge portion is located on the outside of the first photosensitive area and the second photosensitive area, the partition portion separates the first photosensitive area and the second photosensitive area so that the first photosensitive area and the second photosensitive area are independent of each other, wherein the chip pad of the photosensitive chip is arranged at the edge portion of the non-photosensitive area, wherein the depth information camera module further includes a shading portion, and the shading portion is located between the back side of the plate of the circuit board and the partition portion of the non-photosensitive area of ​​the photosensitive chip. 10 . The depth information camera module according to claim 7 , wherein the depth information camera module comprises a light-transmitting element, and the light-transmitting element is entirely located in the second opening of the circuit board.

11. The depth information camera module according to claim 7, wherein the depth information camera module comprises a light-transmitting element, the bottom of the light-transmitting element extends to the second opening of the circuit board, and the top of the light-transmitting element extends to the second light-sensitive window of the front packaging part.

12. The depth information camera module according to claim 11, wherein the bottom of the light-transmitting element is inserted into the second opening of the circuit board, and the front packaging part is integrally combined with the front surface of the plate material of the circuit board and the light source chip assembly during molding and wraps the side of the top of the light-transmitting element and exposes the top surface of the light-transmitting element; or the bottom of the light-transmitting element is inserted into the second opening of the circuit board, and the top of the light-transmitting element is inserted into the second light-sensitive window of the front packaging part.

13. The depth information camera module according to claim 11, wherein a portion of the light-transmitting element is molded in the second opening of the circuit board, another portion of the light-transmitting element protrudes from the front side of the plate of the circuit board, and the front packaging portion wraps the side of the top of the light-transmitting element during molding and exposes the top surface of the light-transmitting element.

14. The depth information camera module according to claim 11, wherein a reflective film is provided on the peripheral wall of the light-transmitting element.

15. The depth information camera module according to claim 7, wherein the projection module comprises a reflective element, and the reflective element is suspended directly above the second photosensitive window of the front packaging portion to allow the second photosensitive area of ​​the photosensitive chip to face the reflective surface of the reflective element in the height direction.

16. The depth information camera module according to claim 15, wherein the reflective element is arranged on the inner wall of the bracket tube so that the reflective element is suspended by the bracket tube directly above the second photosensitive window of the front packaging part; or, the reflective element is applied to the inner wall of the bracket tube so that the reflective element is suspended by the bracket tube directly above the second photosensitive window of the front packaging part.

Images