Voltage-induced resistor copper foil, high-voltage pulse-resistant PCB board and manufacturing method thereof

Abstract

The present invention proposes a voltage-induced resistance copper foil, comprising a first copper foil, a groove array is provided on the front of the first copper foil, the grooves are filled with voltage-induced resistance materials, the plane of the voltage-induced resistance materials is polished to be flush with the plane of the adjacent first copper foil; a copper disk is plated in the center of the top surface of the voltage-induced resistance material, and the outer diameter of the copper disk is smaller than the inner diameter of the groove. The present invention imparts the voltage-induced resistance function to the copper foil body to form a new functional copper foil material, so that the copper foil body has the basic function of conductivity and also has the protection function against instantaneous high-voltage electric pulses generally required by electronic circuits; this solves the thorny instantaneous high-voltage pulse problems such as ESD and EMP that need to be solved in the component assembly process in the electronic circuit in the source material of the electronic circuit, thereby greatly saving the social cost of the electronic manufacturing industry in terms of anti-pulse protection.

Description

Technical Field

[0001] The invention relates to the technical field of electronic manufacturing, and in particular to a voltage-induced resistor copper foil and a manufacturing method thereof. Background Art

[0002] In the circuits of electronic devices, in order to prevent the impact of instantaneous high-voltage pulse energy, such as static electricity, surge and transient potential field induction energy, most of them are equipped with protection circuits for these transient energies to prevent sensitive electronic components from being destroyed by these transient energies. At present, these protection circuits are completed by discrete components such as TVS tubes, ceramic varistors, polymer electrostatic suppressors, and other protection devices set on the circuit surface. Since these discrete devices set on the circuit surface will occupy a large amount of PCB board area, the protection of electronic equipment can only be balanced between reducing the size of the equipment and increasing the protection range of the equipment circuit. This is also the reason why the electronic circuits of today's electronic equipment do not have all-round protection against instantaneous high-voltage electrical pulse impacts. It is also because of manufacturing cost considerations that it is impossible to provide comprehensive protection for all pins of all sensitive devices in the circuit.

[0003] Electronic-grade copper foil is one of the basic materials of the electronics industry and is widely used in various electronic and electrical products. The largest applications are batteries and copper clad laminates (CCL).

[0004] Whether it is rolled copper foil or electrolytic copper foil, the main highlight of its application in the electronics field is its reliable conductive performance. The use is relatively single, and the market competition is also prominent in price. For example, CCL and PCB are etched into various patterns in electronic circuits, and they are only used to realize the distribution function of electron flow. Its value is at best reflected in the price difference of its shape change process, and the value content has limited room for appreciation.

[0005] A Chinese patent with publication number CN205005337U discloses a functional foil capable of absorbing instantaneous high-voltage electric pulse energy, including a metal ground substrate, a functional material layer and a circuit metal layer. The metal ground substrate is etched with a ground wire, and the circuit metal layer is etched to include a ground wire and a ground electrode. The patent uses the intersection between the ground wire and the ground wire formed by the functional material interval to complete the instantaneous electric energy release, omitting the through-hole construction process, making the processing simpler and more cost-effective.

[0006] However, the patent directly coats the voltage-induced resistance material along the ground line on the metal ground line substrate, which has the following two defects:

[0007] First, it is impossible to ensure that the voltage-induced resistor material on the entire metal ground substrate is completely polished and flat (that is, the thickness of the material cannot be guaranteed to be completely consistent). The thickness of the voltage-induced resistor material has an error of at least ±5%. Since the starting voltage of the material resistance brought about by the change of each micron of the material layer thickness reaches nearly 30V, the starting voltage difference of the material resistance brought about by a 5-micron thickness difference is as high as 150V (the starting voltage of the voltage-induced resistor material is the voltage applied to the material when the resistance value of the material is reduced to nearly 0). This will make the electrical performance of each grounding point connected to the circuit highly inconsistent, resulting in some grounding points being able to absorb the high-voltage pulse when a momentary high-voltage pulse appears in the circuit, while some grounding points cannot absorb the high-voltage pulse;

[0008] Secondly, there is the thermal effect problem caused by laying voltage-induced resistor materials over a large area. The surface of the material is prone to local bulging due to thermal expansion or cracking due to cold contraction, which leads to poor electrical performance of the grounding point. Summary of the invention

[0009] The present invention provides a voltage-induced resistor copper foil and a manufacturing method thereof, which uses the groove size to limit the material thickness of each array point to be absolutely consistent, thereby solving the problem that the functional foil in the prior art cannot ensure that the thickness of the voltage-induced resistor material is completely consistent, resulting in highly inconsistent electrical performance of each grounding point connected to the circuit.

[0010] The technical solution of the present invention is achieved in this way:

[0011] A first aspect of the present invention provides a voltage-induced resistance copper foil, comprising a first copper foil, wherein a groove array is provided on the front side of the first copper foil, wherein the grooves are filled with a voltage-induced resistance material, and the top surface of the voltage-induced resistance material is polished to be flush with the top surface of the first copper foil; a copper disk is plated at the center of the top surface of the voltage-induced resistance material, wherein the outer diameter of the copper disk is smaller than the inner diameter of the groove, and the copper disk is isolated from the first copper foil by the voltage-induced resistance material.

[0012] Specifically, the voltage-variable resistor material is a polymer composite nano voltage-variable resistor soft film or a material obtained by mixing a polymer with conductive particles.

[0013] Specifically, the thickness of the first copper foil is 15-45 μm, the depth of the groove is 20-35 μm, the inner diameter of the groove is 1.2-1.5 mm, and the outer diameter of the copper disk is 0.4-1.3 mm.

[0014] Specifically, a via hole is provided in the center of the bottom surface of the groove.

[0015] A second aspect of the present invention provides a method for manufacturing a voltage-induced resistor copper foil, comprising the following steps:

[0016] forming a groove array on the front surface of the first copper foil;

[0017] Filling the voltage-induced resistance material into the groove, ensuring that the voltage-induced resistance material fills the groove and the top surface of the voltage-induced resistance material is higher than the top surface of the first copper foil, and placing the first copper foil filled with the voltage-induced resistance material into a high-temperature box for curing;

[0018] Taking out the cured first copper foil, and grinding the top surface of the voltage-induced resistor material until it is flush with the surrounding first copper foil;

[0019] Copper is plated on the top surface of the voltage-induced resistor material and the top surface of the first copper foil adjacent to the periphery, and then a copper disk is obtained in the center of the top surface of the voltage-induced resistor material by etching.

[0020] Specifically, the groove is formed by punching with a punching machine in cooperation with a die, or is naturally formed by using a convex dot array roller in a copper foil forming process.

[0021] Specifically, the voltage-induced resistor material is printed in the groove by a printing mold or dispensed in the groove by a dispensing machine, and the curing temperature of the high-temperature box is 150° C. and the curing time is 120 minutes.

[0022] The third aspect of the present invention provides a high-voltage pulse resistant PCB board, comprising the above-mentioned voltage-induced resistor copper foil, the back of the first copper foil is connected to the second copper foil through an insulating connecting material, a via hole is provided in the center of the bottom surface of the groove, a through hole is provided in the center of the copper disk, the through hole passes through the copper disk, the voltage-induced resistor material, the via hole, the connecting material and the second copper foil in sequence, and the diameter of the through hole is smaller than the diameter of the through hole; the inner wall of the through hole is plated with hole copper, the copper disk is electrically connected to the second copper foil through the hole copper, and the first copper foil is electrically connected to the grounding equivalent capacitor; the hole copper point on the back of the second copper foil is connected to the etched connection line of the point to be protected on the PCB board circuit.

[0023] A fourth aspect of the present invention provides a method for manufacturing a high voltage pulse resistant PCB board, comprising the following steps:

[0024] An array of via holes is formed on the front surface of the first copper foil, and grooves are formed on the front surface of the first copper foil with each via hole as the center;

[0025] Filling the voltage-induced resistance material into the groove, ensuring that the voltage-induced resistance material fills the groove and the top surface of the voltage-induced resistance material is higher than the top surface of the first copper foil, and placing the first copper foil filled with the voltage-induced resistance material into a high-temperature box for curing;

[0026] Taking out the cured first copper foil, and grinding the top surface of the voltage-induced resistor material until it is flush with the surrounding first copper foil;

[0027] Copper is plated on the top surface of the voltage-induced resistor material and the top surface of the first copper foil adjacent to the periphery, and then a copper plate is obtained in the center of the top surface of the voltage-induced resistor material by etching;

[0028] Coating an insulating connecting material on the back of the first copper foil, and connecting the second copper foil to the first copper foil through the connecting material;

[0029] A through hole is opened in the center of the copper plate, and copper is plated on the inner wall of the through hole;

[0030] A connecting line is etched on the back side of the second copper foil to electrically connect the hole copper point with the point to be protected on the PCB board circuit.

[0031] Compared with the prior art, the beneficial effects of the present invention are:

[0032] (1) Compared with the functional foil in the prior art, the present application utilizes the prior art to produce many groove arrays with completely consistent length, width and depth on the surface of the copper foil through precise control, and polishes the voltage-induced resistance material filled in the groove to be flush with the top surface of the first copper foil, ensuring that the thickness of the voltage-induced resistance material at each grounding point is completely consistent, thereby ensuring that the electrical performance of each grounding point connected to the circuit is consistent and the reliability of the circuit's resistance to high-voltage pulses. At the same time, due to the small laying area in the groove, the thermal effect has little effect on the electrical performance of the voltage-induced resistance material at each grounding point;

[0033] (2) The present invention imparts the voltage-induced resistance function to the copper foil body, forming a new functional copper foil material, which enables the copper foil body to have the basic function of conductivity and the protection function against instantaneous pulses generally required by electronic circuits; by only arranging grooves, voltage-induced resistance materials and copper plates in an array on one side of the copper foil body, the thorny problem of resisting high-voltage pulses in electronic circuits can be transferred to the source basic materials for manufacturing PCBs to solve, thereby saving a lot of social costs. It not only provides an extremely broad imagination space for the application of copper foil in the design of electronic circuits, but also enhances the use value of copper foil itself, bringing higher benefits to the front-end industry of the electronics industry (copper foil manufacturers). At the same time, it also greatly enhances the practical value of each link of CCL and PCB, and greatly reduces the high protection cost caused by using other methods to solve the anti-pulse problem in the electronic assembly process, thereby reducing the protection cost against high-voltage pulses for the end industry of the electronics industry (CCL, PCB manufacturers). BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0035] Figure 1 A schematic diagram of the cross-sectional structure of a voltage-induced resistor copper foil according to the present invention;

[0036] Figure 2 This is a schematic diagram of the front structure of a voltage-induced resistor copper foil of the present invention;

[0037] Figure 3 This is a schematic diagram of the structure after the top and back surfaces of the first copper foil are filled in an embodiment of the present invention;

[0038] Figure 4 This is a schematic cross-sectional structure diagram of a second copper foil connected to a first copper foil through a connecting material in an embodiment of the present invention;

[0039] Figure 5 This is a schematic cross-sectional structure diagram of a high-voltage pulse resistant PCB board with a through hole opened in the center of a copper disk in an embodiment of the present invention;

[0040] Figure 6 This is a schematic diagram of the front structure of a high-voltage pulse resistant PCB board according to an embodiment of the present invention;

[0041] Figure 7 This is a schematic diagram of the back structure of a high-voltage pulse resistant PCB board in an embodiment of the present invention;

[0042] In the figure: 1, first copper foil; 2, groove; 3, voltage-induced resistor material; 4, copper disk; 5, connecting material; 6, second copper foil; 7, via; 8, through hole; 9, hole copper; 10, connecting wire. DETAILED DESCRIPTION

[0043] The technical solution of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0044] Reference Figure 1 , Figure 2In a first aspect, an embodiment of the present invention provides a voltage-induced resistance copper foil, comprising a first copper foil 1, wherein a groove 2 array is provided on the front side of the first copper foil 1, wherein the groove 2 is filled with a voltage-induced resistance material 3, and the top surface of the voltage-induced resistance material 3 is polished to be flush with the top surface of the first copper foil 1; a copper disk 4 is plated at the center of the top surface of the voltage-induced resistance material 3, wherein the outer diameter of the copper disk 4 is smaller than the inner diameter of the groove 2, and the copper disk 4 is isolated from the first copper foil 1 by the voltage-induced resistance material 3.

[0045] Specifically, the voltage-variable resistor material 3 is a polymer composite nano voltage-variable resistor soft film or a material obtained by mixing a polymer with conductive particles (the preparation method of the material can refer to patent application number 201210314982.2).

[0046] In this embodiment, the electrical characteristics of the voltage-induced resistor material 3 are as follows: under normal operating voltage, its resistance value is close to infinity; when an abnormally high voltage pulse occurs, its resistance value will rapidly decrease and tend to 0, causing the abnormally high voltage pulse to pass through the material and discharge to the ground in the form of current; when the abnormally high voltage pulse passes, the resistance value of the material rapidly rises back to near infinity.

[0047] Specifically, the thickness of the first copper foil 1 is 15 to 45 μm, the depth of the groove 2 is 20 to 35 μm, the inner diameter of the groove 2 is 1.2 to 1.5 mm, the outer diameter of the copper disk 4 is 0.4 to 1.3 mm, and the thickness of the copper disk 4 in this embodiment is 6 to 15 μm. The width of the insulating ring between the outer edge of the copper disk 4 and the inner edge of the groove 2 (i.e., the annular area outside the overlapping area between the copper disk 4 and the top surface of the voltage-induced resistor material 3 in the groove 2) is 0.1 mm.

[0048] Specifically, a via hole 7 is provided at the center of the bottom surface of the groove 2 , and the via hole 7 is used to prevent the hole copper 9 from being short-circuited with the first copper foil 1 during subsequent processing.

[0049] A second aspect of an embodiment of the present invention provides a method for manufacturing a voltage-induced resistor copper foil, comprising the following steps:

[0050] An array of grooves 2 is formed on the front surface of the first copper foil 1;

[0051] Fill the voltage-induced resistance material 3 into the groove 2 (the filling thickness is 45-85 μm, ensuring that the voltage-induced resistance material 3 fills the groove 2 and the top surface of the voltage-induced resistance material 3 is higher than the top surface of the first copper foil 1), and place the first copper foil 1 filled with the voltage-induced resistance material 3 into a high-temperature box for curing;

[0052] The cured first copper foil 1 is taken out, the top surface of the voltage-induced resistor material 3 is polished to be flush with the surrounding first copper foil 1, and a copper plate 4 is plated on the top surface of the voltage-induced resistor material 3 (by chemical copper plating or sputtering copper plating).

[0053] Specifically, the grooves 2 are formed by punching with a punching machine in cooperation with a die, or the copper foil having the groove 2 array is naturally generated by a convex dot array roller in the copper foil production process.

[0054] Specifically, if a punching machine is used in conjunction with a mold to punch and produce an array of grooves 2, an array of convex points corresponding to the grooves 2 will be formed on the back of the first copper foil 1, and the via 7 is opened in the center of the convex point array. It is necessary to make the bottom surface of the convex point and the back surface of the surrounding first copper foil 1 be aligned with each other to form a consistent plane by copper plating on the back of the first copper foil 1; and the top surface of the first copper foil 1 in the non-groove 2 area is aligned with the top surface of the copper plate 4 to a consistent plane by copper plating, such as Figure 3 If the groove 2 array is naturally generated by the convex dot array roller in the copper foil production process, there is no convex dot array on the back of the first copper foil 1, and the back of the first copper foil 1 does not need to be copper plated to fill, and only the top surface of the first copper foil 1, which is not the groove 2, needs to be filled to the same plane with the top surface of the copper plate 4 by copper plating.

[0055] Specifically, the voltage-induced resistor material 3 is printed in the groove 2 by a printing mold or dispensed in the groove 2 by a dispensing machine, and the curing temperature of the high-temperature box is 150° C. and the curing time is 120 minutes.

[0056] The voltage-induced resistor copper foil in this embodiment has the following functions:

[0057] Each copper disc 4 of the voltage-induced variable resistance copper foil has a resistance value close to infinity with the surrounding first copper foil 1 under normal working voltage. When an abnormally high voltage stimulates one of the copper discs 4, the resistance value between this copper disc 4 and the surrounding first copper foil 1 will rapidly decrease and tend to 0, so that the voltage induced on this copper disc 4 releases energy in the form of current to the surrounding first copper foil 1 through the voltage-induced variable resistance material 3 with zero resistance. When this abnormal voltage passes, the resistance value between the copper disc 4 and the surrounding first copper foil 1 returns to close to infinity. Such a function is connected to the circuit, so that the components on the connected line can be protected from instantaneous high-voltage pulses.

[0058] The present invention does not change the basic functions and properties of copper foil. When used as the basic material of copper-clad laminate, it does not change the subsequent CCL manufacturing process. It is just that the CCL produced by using this functional copper foil naturally has the function of absorbing instantaneous high-voltage pulses, and the PCB produced by downstream PCB manufacturers using CCL with this function also naturally has the function of resisting high-voltage pulses. In this way, the thorny instantaneous high-voltage pulse problems such as ESD and EMP that need to be solved in the component assembly process of electronic circuits are solved in the source materials of electronic circuits, thereby greatly saving social costs. If the functional copper foil does not need to use the anti-pulse function in practical applications, it can also be used as ordinary copper foil.

[0059] The voltage-induced varistor copper foil of the present embodiment can be used to manufacture a single anti-pulse component. When used to manufacture a single anti-pulse component, the copper disk 4 can be used as the first electrode pad, and any point on the first copper foil 1 can be used as the second electrode pad; the first copper foil 1 is sliced ​​according to the size of the single component, and the first copper foil of the corresponding size is cut out; and the single component is packaged according to the corresponding specifications, so that high-voltage pulse resistant electronic components of different specifications can be obtained.

[0060] The voltage-induced varistor copper foil of the present embodiment can also be used to manufacture a combined anti-pulse component. A single anti-pulse component only needs to use one of the array grooves 2, which can be obtained by cutting the first copper foil 1 or making only one groove 2 on the first copper foil 1. When manufacturing a combined anti-pulse component, copper foil with a corresponding number of grooves 2 can be cut on the first copper foil 1 according to the number of combinations, or a corresponding number of grooves 2 can be made on the first copper foil 1.

[0061] like Figures 4 to 7 As shown, the third aspect of the embodiment of the present invention provides a high-voltage pulse resistant PCB board, including the above-mentioned voltage-induced resistance copper foil, the back of the first copper foil 1 is connected to the second copper foil 6 through the insulating connecting material 5, the bottom center of the groove 2 is provided with a via 7 (the via 7 is also filled with the voltage-induced resistance material 3), the center of the copper disk 4 is provided with a through hole 8, the through hole 8 passes through the copper disk 4, the voltage-induced resistance material 3, the via 7, the connecting material 5 and the second copper foil 6 in sequence, and the diameter of the through hole 8 is smaller than the diameter of the via 7; the inner wall of the through hole 8 is plated with a hole copper 9, the copper disk 4 is electrically connected to the second copper foil 6 through the hole copper 9, and the first copper foil 1 is electrically connected to the grounding equivalent capacitor; the hole copper point on the back of the second copper foil 6 is connected to the etched connection line 10 of the point to be protected on the PCB board circuit. When the PCB needs only selective protection, the connection lines 10 can be etched only at the points that need protection to connect with the copper holes on the back of the second copper foil 6; when the PCB needs full protection, the connection lines 10 are etched for all non-ground copper wires on the PCB.

[0062] A fourth aspect of the embodiments of the present invention provides a method for manufacturing a high-voltage pulse resistant PCB board, comprising the following steps:

[0063] An array of via holes 7 is formed on the front surface of the first copper foil 1 (by drilling, etching or laser processing), and grooves 2 are formed on the front surface of the first copper foil 1 with each via hole 7 as the center.

[0064] Fill the voltage-induced resistance material 3 into the groove 2 (the filling thickness is 45-85 μm, ensuring that the voltage-induced resistance material 3 fills the groove 2 and the top surface of the voltage-induced resistance material 3 is higher than the top surface of the first copper foil 1), and place the first copper foil 1 filled with the voltage-induced resistance material 3 into a high-temperature box for curing;

[0065] The cured first copper foil 1 is taken out, the top surface of the voltage-induced resistor material 3 is polished to be flush with the surrounding first copper foil 1, and a copper plate 4 is plated on the top surface of the voltage-induced resistor material 3 to obtain a first copper foil 1 with a copper plate 4 array on the top surface, such as Figure 6 As shown;

[0066] An insulating connecting material 5 is coated on the back of the first copper foil 1, and the second copper foil 6 is connected to the first copper foil 1 through the connecting material 5. Figure 4 As shown; after curing, a PCB substrate with a copper disk 4 array on one side and the appearance of the other side is exactly the same as the original CCL product;

[0067] A through hole 8 is opened in the center of the copper plate 4 (the position of the through hole 8 cannot be deviated to avoid the inner wall of the through hole 8 contacting the edge of the via hole 7 on the back of the first copper foil 1 and causing a short circuit. The through hole 8 can be opened only in the center of the copper plate 4 that is needed, and the copper plate 4 that is not needed does not need to be opened), and copper 9 is plated on the inner wall of the through hole 8 to electrically connect the copper plate 4 to the second copper foil 6. Figure 5 As shown;

[0068] A connecting line 10 is etched on the back of the second copper foil 6 to electrically connect the hole copper point with the point to be protected on the PCB board circuit. Figure 7 As shown;

[0069] Finally, after completing other production processes of the PCB board, a PCB board with high-voltage pulse resistance can be obtained. If some circuits in the PCB board are connected to the copper dot lines of the holes, a PCB board with partial high-voltage pulse resistance can be obtained. If all circuits in the PCB board are connected to the copper dot lines of the holes, a PCB board with full high-voltage pulse resistance can be obtained.

[0070] A layer of copper foil is used as the ground plane (ground wire), which is a common practice in PCB manufacturing. A number of grooves 2 are created on this ground wire (generally 6,000 grooves / ㎡) so that this ground wire can not only drain and distribute energy, but also naturally absorb high-voltage pulses. An array of grooves 2 on one side can solve the problem of full pulse protection of the entire circuit board. There is no need to consider the traditional method of adding single protection components in the electronic circuit assembly process. This saves the number of PCB layers, reduces the PCB thickness, and does not occupy the PCB surface area. While improving the utilization rate of copper foil, it also increases the value of ordinary copper foil, saving a lot of social costs.

[0071] The working principle of the high voltage pulse resistant PCB board in this embodiment is as follows:

[0072] When the voltage passing through the point to be protected on the PCB board circuit is normal, the resistance value of the voltage-induced resistor material 3 in the groove 2 is infinite, and the circuit between the point to be protected and the grounding equivalent capacitor is equivalent to a "break", which will not affect the normal operation of the components at the protection point; when the voltage passing through the point to be protected is abnormal (such as the occurrence of high-voltage pulses such as static electricity), the resistance value of the voltage-induced resistor material 3 in the groove 2 is rapidly reduced to close to 0, and the high-voltage pulse will be transmitted to the hole copper point on the back of the second copper foil 6 through the etched connecting line 10 in the form of current, and then transmitted to the copper plate 4 through the hole copper 9 on the inner wall of the through hole 8, and then transmitted to the first copper foil 1 through the voltage-induced resistor material 3 with a resistance value of 0 to be absorbed by the grounding equivalent capacitor, thereby avoiding damage to the electronic components at the point to be protected by the high-voltage pulse.

[0073] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A method for manufacturing a voltage-induced resistor copper foil, characterized in that: The following steps are involved: Making a groove (2) array on the front side of the first copper foil (1); Filling the voltage-induced resistance material (3) into the groove (2), ensuring that the voltage-induced resistance material (3) fills the groove (2) and the top surface of the voltage-induced resistance material (3) is higher than the top surface of the first copper foil (1), and placing the first copper foil (1) filled with the voltage-induced resistance material (3) in a high-temperature box for curing; Taking out the cured first copper foil (1), and grinding the top surface of the voltage-induced resistor material (3) until it is flush with the surrounding first copper foil (1); Copper is plated on the top surface of the voltage-induced resistor material (3) and the top surface of the first copper foil (1) adjacent to the periphery, and then a copper disk is obtained in the center of the top surface of the voltage-induced resistor material (3) by etching; The electrical characteristics of the voltage-induced resistance material (3) are as follows: under normal operating voltage, its resistance value is close to infinity; when an abnormally high voltage pulse occurs, its resistance value rapidly decreases and approaches 0, so that the abnormally high voltage pulse passes through the material and is discharged to the ground in the form of current; when the abnormally high voltage pulse passes, the resistance value of the material rapidly rises back to close to infinity.

2. The method for manufacturing a voltage-variable resistor copper foil according to claim 1, characterized in that: The groove (2) is formed by punching with a punching machine in cooperation with a die, or is naturally formed by using a convex dot array roller in a copper foil forming process.

3. The method for manufacturing a voltage-variable resistor copper foil according to claim 1, characterized in that: The voltage-induced resistor material (3) is printed in the groove (2) by a printing mold or dispensed in the groove (2) by a dispensing machine; the curing temperature of the high-temperature box is 150° C., and the curing time is 120 minutes.

4. A voltage-induced resistor copper foil, manufactured by the method for manufacturing a voltage-induced resistor copper foil as claimed in claim 1, characterized in that: The invention comprises a first copper foil (1), wherein a groove (2) array is provided on the front side of the first copper foil (1), wherein the groove (2) is filled with a voltage-induced resistance material (3), and the top surface of the voltage-induced resistance material (3) is polished to be flush with the top surface of the first copper foil (1); a copper disk (4) is plated at the center of the top surface of the voltage-induced resistance material (3), wherein the outer diameter of the copper disk (4) is smaller than the inner diameter of the groove (2), and the copper disk (4) and the first copper foil (1) are isolated by the voltage-induced resistance material (3).

5. The voltage-variable resistor copper foil as claimed in claim 4, characterized in that: The voltage-variable resistor material (3) is a polymer composite nanometer voltage-variable resistor soft film or a material obtained by mixing a polymer with conductive particles.

6. The voltage-variable resistor copper foil according to claim 4, characterized in that: The thickness of the first copper foil (1) is 15 to 45 μm, the depth of the groove (2) is 20 to 35 μm, the inner diameter of the groove (2) is 1.2 to 1.5 mm, and the outer diameter of the copper disk (4) is 0.4 to 1.3 mm.

7. The voltage-variable resistor copper foil according to claim 4, characterized in that: A through hole (7) is provided in the center of the bottom surface of the groove (2).

8. A PCB board resistant to high voltage pulses, characterized in that: The invention comprises a voltage-induced resistor copper foil as claimed in any one of claims 4 to 7, wherein the back side of the first copper foil (1) is connected to the second copper foil (6) through an insulating connecting material (5), a via hole (7) is provided at the center of the bottom surface of the groove (2), a through hole (8) is provided at the center of the copper plate (4), the through hole (8) passes through the copper plate (4), the voltage-induced resistor material (3), the via hole (7), the connecting material (5) and the second copper foil (6) in sequence, and the diameter of the through hole (8) is smaller than the diameter of the via hole (7); the inner wall of the through hole (8) is plated with a hole copper (9), the copper plate (4) and the second copper foil (6) are electrically connected through the hole copper (9), and the first copper foil (1) is electrically connected to a grounding equivalent capacitor; the hole copper point on the back side of the second copper foil (6) is connected to a point to be protected on a PCB circuit through an etched connecting line (10).

9. A method for manufacturing a high-voltage pulse resistant PCB board, used for manufacturing the high-voltage pulse resistant PCB board as claimed in claim 8, characterized in that: The following steps are involved: An array of via holes (7) is provided on the front surface of the first copper foil (1), and grooves (2) are formed on the front surface of the first copper foil (1) with each via hole (7) as the center; Filling the voltage-induced resistance material (3) into the groove (2), ensuring that the voltage-induced resistance material (3) fills the groove (2) and the top surface of the voltage-induced resistance material (3) is higher than the top surface of the first copper foil (1), and placing the first copper foil (1) filled with the voltage-induced resistance material (3) in a high-temperature box for curing; Taking out the cured first copper foil (1), and grinding the top surface of the voltage-induced resistor material (3) until it is flush with the surrounding first copper foil (1); Copper is plated on the top surface of the voltage-induced resistor material (3) and the top surface of the first copper foil (1) adjacent to the periphery, and then a copper disk is obtained in the center of the top surface of the voltage-induced resistor material (3) by etching; Coating an insulating connecting material (5) on the back side of the first copper foil (1), and connecting the second copper foil (6) to the first copper foil (1) via the connecting material (5); A through hole (8) is formed in the center of the copper plate (4), and copper (9) is plated on the inner wall of the through hole (8); A connecting line (10) is etched on the back side of the second copper foil (6) to electrically connect the hole copper point with the point to be protected on the PCB circuit.

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