Printed circuit board

Abstract

The invention provides a printed circuit board. The printed circuit board comprises an insulating layer; a wiring layer disposed on an outermost side of the insulating layer and including a first pad and a first pattern; a first pillar disposed on the first pattern; and a resist layer disposed on the insulating layer and covering the wiring layer and the first pillar, in which the resist layer may have a first protrusion in a region covering the first pillar, and may have a first opening exposing the first pad from the resist layer.

Description

[0001] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0119267 filed on September 7, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0002] The present disclosure relates to a printed circuit board. Background Art

[0003] Generally, the bump bonding structure is applied to the bonding of the chip and the substrate. For example, the pad formed on the chip may contact the microball attached to the upper part of the substrate to connect the chip and the substrate. On the other hand, in such a bump bonding structure, when the volume control of the solder ball fails, when the shape of the solder ball is abnormal, or when the alignment of the chip and the substrate is abnormal, defects may occur in the chip assembly. For example, adjacent solder balls may contact each other, resulting in a short circuit defect. Summary of the invention

[0004] An aspect of the present disclosure is to provide a printed circuit board that can improve a short circuit defect in a bump bonding structure.

[0005] One of several solutions proposed by the present disclosure is to form a protrusion that can act as a dam around an opening exposing the pad by forming a pillar around the outermost pad for bump bonding of the substrate and covering the pillar with a resist layer.

[0006] For example, a printed circuit board according to an example embodiment may include: an insulating layer; a wiring layer disposed on the outermost side of the insulating layer and including a first pad and a first pattern; a first column disposed on the first pattern; and a resist layer disposed on the insulating layer and covering the wiring layer and the first column, wherein the resist layer may include a first protrusion in an area covering the first column and a first opening above the first pad.

[0007] For example, a printed circuit board according to an example embodiment may include: an insulating layer; a metal pad disposed at the outermost side of the insulating layer; a metal column disposed at the outermost side of the insulating layer and surrounding the metal pad, wherein the outermost surface of the metal column is disposed above the outermost surface of the metal pad; and a resist layer disposed on the outermost surface of the insulating layer and covering the metal pad and the metal column, wherein the outermost surface of the resist layer may protrude in a region covering the metal column, and the resist layer may include an opening above the metal pad.

[0008] The effect of the present disclosure is to provide a printed circuit board that can improve the short-circuit defect in the bump bonding structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which: Figure 1 is a block diagram schematically illustrating an example of an electronic device system; Figure 2 is a perspective view schematically showing an example of an electronic device; Figure 3 is a cross-sectional view schematically showing an example of a printed circuit board; Figure 4 It is schematically shown Figure 3 A top view of a printed circuit board is shown; Figure 5 It is schematically shown Figure 3 A process diagram of an example of manufacturing a printed circuit board is shown; Figure 6 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board; Figure 7 It is schematically shown Figure 6 A top view of a printed circuit board is shown; Figure 8 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board; Fig. 9 It is schematically shown Figure 8 A top view of a printed circuit board is shown; Fig.10 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board; Fig.11 It is schematically shown Fig.10 A top view of a printed circuit board is shown; Fig.12 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board; Fig.13 It is schematically shown Fig.12 A top view of a printed circuit board is shown; Fig.14 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board; and Fig.15 It is schematically shown Fig.14 A top view of the printed circuit board is shown. DETAILED DESCRIPTION

[0010] Hereinafter, the present disclosure will be described with reference to the accompanying drawings. In the accompanying drawings, the shapes and sizes of elements may be exaggerated or reduced for clear description.

[0011] Electronic Devices Figure 1 is a block diagram schematically illustrating an example of an electronic device system.

[0012] Reference Figure 1 , a main board 1010 is housed in the electronic device 1000. Chip-related components 1020, network-related components 1030, and other components 1040 are physically and / or electrically connected to the main board 1010. These components are also coupled to other electronic components to be described below through various signal lines 1090.

[0013] The chip-related components 1020 may include: memory chips, such as volatile memory (e.g., DRAM), non-volatile memory (e.g., ROM, flash memory), etc.; application processor chips, such as central processing units (e.g., CPU), graphics processors (e.g., GPU), digital signal processors, cryptographic processors, microprocessors, microcontrollers, etc.; and logic chips, such as analog-to-digital converters (ADCs), application-specific integrated circuits (ASICs), etc. However, the chip-related components 1020 are not limited thereto, and may also include other types of chip-related components. In addition, the chip-related components 1020 may be combined with each other. The chip-related components 1020 may have the form of a package including the above-mentioned chips and / or electronic components.

[0014] The network-related components 1030 may include components compatible with or operating according to protocols such as: Wireless Fidelity (Wi-Fi) (such as the IEEE 802.11 series), Worldwide Interoperability for Microwave Access (WiMAX) (such as the IEEE 802.16 series), IEEE 802.20, Long Term Evolution (LTE), Evolution-Data Optimized (Ev-DO), High Speed ​​Packet Access Plus (HSPA+), High Speed ​​Downlink Packet Access Plus (HSDPA+), High Speed ​​Uplink Packet Access Plus (HSUPA+), Global System for Mobile Communications (GSM), Enhanced Data Rates for GSM Evolution (EDGE), Global Positioning System (GPS), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Time Division Multiple Access (TDMA), Digital Enhanced Cordless Telecommunications (DECT), Bluetooth, Wireless Local Area Network (Wireless LAN), Third Generation Mobile Communication Technology (3G) Protocol, Fourth Generation Mobile Communication Technology (4G) Protocol, and Fifth Generation Mobile Communication Technology (5G) Protocol, as well as any other wireless standards or protocols and wired standards or protocols specified thereafter. However, the network-related component 1030 is not limited thereto, and may also include components compatible with or operating according to any of a variety of other wireless standards or protocols and wired standards or protocols. In addition, the network-related component 1030 may be combined with the chip-related component 1020.

[0015] Other components 1040 may include high frequency inductors, ferrite inductors, power inductors, ferrite beads, low temperature co-fired ceramic (LTCC) components, electromagnetic interference (EMI) filters, multilayer ceramic capacitors (MLCC), etc. However, other components are not limited thereto, and may also include passive components in the form of chip components for various other purposes. In addition, other components 1040 may be combined with chip-related components 1020 and / or network-related components 1030.

[0016] Depending on the type of the electronic device 1000, the electronic device 1000 may include other electronic components that are physically and / or electrically connected to the mainboard 1010 or that are not physically and / or electrically connected to the mainboard 1010. These other electronic components may include, for example, a camera 1050, an antenna 1060, a display 1070, and a battery 1080. However, these other electronic components are not limited thereto, but may also include an audio codec, a video codec, a power amplifier, a compass, an accelerometer, a gyroscope, a speaker, a mass storage device (e.g., a hard disk drive), a compact disk (CD) drive, a digital versatile disk (DVD) drive, etc. In addition, depending on the type of the electronic device 1000, the electronic device 1000 may also include other electronic components for various purposes.

[0017] The electronic device 1000 may be a smart phone, a personal digital assistant, a digital video camera, a digital camera, a network system, a computer, a monitor, a tablet PC, a laptop PC, a netbook PC, a television, a video game console, a smart watch, or an automotive component. However, the electronic device 1000 is not limited thereto, and may be any other electronic device capable of processing data in addition to the above-mentioned electronic devices.

[0018] Figure 2 is a perspective view schematically showing an example of an electronic device.

[0019] Reference Figure 2, the electronic device may be, for example, a smart phone 1100. A mainboard 1110 may be housed in the smart phone 1100, and various components 1120 may be physically and / or electrically connected to the mainboard 1110. In addition, other components (such as a camera module 1130 and / or a speaker 1140) that are physically and / or electrically connected to the mainboard 1110 or that are not physically and / or electrically connected to the mainboard 1110 may be housed in the smart phone 1100. Some of the components 1120 may be the above-mentioned chip-related components, for example, a component package 1121, but the present disclosure is not limited thereto. The component package 1121 may have the form of a printed circuit board on which an electronic component (including an active component and / or a passive component) is surface-mounted. Alternatively, the component package 1121 may have the form of a printed circuit board in which an electronic component (including an active component and / or a passive component) is embedded. On the other hand, the electronic device is not necessarily limited to the smart phone 1100, and may be other electronic devices as described above.

[0020] Printed Circuit Board Figure 3 is a cross-sectional view schematically showing an example of a printed circuit board, Figure 4 It is schematically shown Figure 3 A top view of the printed circuit board is shown.

[0021] Reference Figure 3 and Figure 4 A printed circuit board 100A according to an example embodiment may include: an insulating layer 110; a wiring layer 120 disposed on the outermost side of the insulating layer 110 and including first and second pads 121 and 122 spaced apart from each other and a first pattern 123; first pillars 131 and second pillars 132 spaced apart from each other on the first pattern 123; and a resist layer 140 disposed on the insulating layer 110 and having first and second openings h1 and h2 exposing the first and second pads 121 and 122, respectively, and having first and second protrusions 141 and 142, respectively, in regions covering the first and second pillars 131 and 132, respectively. The first and second pillars 131 and 132 may be disposed to surround the first and second pads 121 and 122, respectively, and the first and second protrusions 141 and 142 may be disposed to surround the first and second openings h1 and h2, respectively. The first surface treatment layer P1 and the second surface treatment layer P2 may be respectively disposed on an exposed surface (i.e., an outermost surface) of the first pad 121 and an exposed surface (i.e., an outermost surface) of the second pad 122, and a first solder bump 151 and a second solder bump 152 filling the first opening h1 and the second opening h2, respectively, and connected to the first surface treatment layer P1 and the second surface treatment layer P2 may be disposed on the anti-etching layer 140.

[0022] As described above, the printed circuit board 100A according to the example embodiment may have a bump bonding structure, and an electronic component such as a chip may be mounted on the bump bonding structure. In this case, the first column 131 and the second column 132 set at a higher height may be respectively arranged around the first pad 121 and the second pad 122. For example, the upper surface of the first column 131 and the upper surface of the second column 132 may be respectively arranged to be higher than the upper surface of the first pad 121 and the upper surface of the second pad 122. Therefore, the first protrusion 141 and the second protrusion 142 may be respectively arranged around the first opening h1 and the second opening h2 in the form of a dam. For example, the first column 131 and the second column 132 may respectively surround the first pad 121 and the second pad 122 in an annular manner, so that the first protrusion 141 and the second protrusion 142 may also respectively surround the first opening h1 and the second opening h2 in an annular manner. Therefore, in a bump bonding process of attaching an electronic component such as a chip to the first solder bump 151 and the second solder bump 152, a short circuit caused by the first solder bump 151 and the second solder bump 152 being connected to each other can be effectively prevented. Figure 3 and Figure 4 Only two pads and two columns respectively surrounding the two pads in a ring shape are shown, but the present disclosure is not limited to this. The printed circuit board may also include three or more pads and three or more columns respectively surrounding the three or more pads in a ring shape, or the printed circuit board may include one pad and one column surrounding the one pad in a ring shape.

[0023] In addition, if necessary, the printed circuit board 100A according to the example embodiment may further include a wiring structure 180, and the insulating layer 110 may be the uppermost insulating material layer of the wiring structure 180. For example, the wiring structure 180 may be a multilayer substrate including a plurality of insulating material layers, a plurality of conductive wiring layers, and a plurality of via layers. Therefore, the printed circuit board 100A according to the example embodiment may also be a multilayer package board. The wiring structure 180 may be a core-type substrate or a coreless substrate. The wiring structure 180 may be an organic substrate, but may also be a silicon substrate or a ceramic substrate if necessary.

[0024] Hereinafter, components of a printed circuit board 100A according to example embodiments will be described in more detail with reference to the accompanying drawings.

[0025] The insulating layer 110 may include an insulating material. The insulating material may include a thermosetting resin such as an epoxy resin, a thermoplastic resin such as polyimide, or a material including an inorganic filler, an organic filler and / or glass fiber (for example, the glass fiber may be woven into a glass fabric (for example, glass cloth)) and a resin. For example, the insulating material may be a non-photosensitive insulating material such as Ajinomoto Build-up Film (ABF) or prepreg (PPG), but the present disclosure is not limited thereto, and other polymer materials may be used as the insulating material.

[0026] The wiring layer 120 may include a metal material. The metal material may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) and / or alloys thereof. The metal material may preferably include copper (Cu), but the present disclosure is not limited thereto. The wiring layer 120 may perform various functions according to the design. For example, the wiring layer 120 may include a signal pattern, a power pattern, and a ground pattern. Each of these patterns may have various forms, such as a line, a plane, a pad, etc. For example, each of the first pad 121 and the second pad 122 may be a signal pattern in a pad shape, and the first pattern 123 may be a ground pattern in a plane shape, but the present disclosure is not limited thereto. The wiring layer 120 may include a seed layer m and a plating layer M formed on the seed layer. The seed layer m may be an electroless plating layer (or a chemical plating layer) and / or a sputtering layer, and the plating layer M may be an electrolytic plating layer (or an electroplating layer), but the present disclosure is not limited thereto. As an example, the seed layer m may be a chemical copper plating layer, and the plating layer M may be an electroplated copper layer, but the present disclosure is not limited thereto. The wiring layer 120 may protrude upward based on the upper surface of the insulating layer 110. For example, the wiring layer 120 may have a protruding pattern.

[0027] The first column 131 and the second column 132 may include a metal material. The metal material may include copper (Cu), aluminum (Al), silver (Ag), tin (Sn), gold (Au), nickel (Ni), lead (Pb), titanium (Ti) and / or alloys thereof. The metal material may preferably include copper (Cu), but the present disclosure is not limited thereto. The first column 131 and the second column 132 may include an electrolytic plating layer (or an electroplating layer), but the present disclosure is not limited thereto. As an example, the electroplating layer of the first column 131 and the second column 132 may be an electroplated copper layer, but the present disclosure is not limited thereto.

[0028] The resist layer 140 may include a liquid solder resist, but the present disclosure is not limited thereto. The resist layer 140 may have a first opening h1 and a second opening h2, and the first opening h1 and the second opening h2 may be formed using solder mask definition (SMD) and / or non-solder mask definition (NSMD). The upper surface of the resist layer 140 may protrude at the first protrusion 141 and the second protrusion 142. In addition, the first column 131 and / or the second column 132 may be embedded in the resist layer 140.

[0029] The first surface treatment layer P1 and the second surface treatment layer P2 are not particularly limited as long as they are known in the art, and the first surface treatment layer P1 and the second surface treatment layer P2 can be formed using, for example, electrolytic gold plating, electroless gold plating, organic solderability preservative (OSP) or electroless tin plating, electroless silver plating, electroless nickel plating / alternative gold plating, direct immersion gold (DIG) plating or hot air solder leveling (HASL), but the present disclosure is not limited thereto.

[0030] The first and second solder bumps 151 and 152 may be formed using a low melting point metal, for example, solder such as tin (Sn)-aluminum (Al)-copper (Cu), but this is merely an example and the material thereof is not limited thereto.

[0031] Figure 5 It is schematically shown Figure 3 A process diagram of an example of manufacturing a printed circuit board is shown.

[0032] Reference Figure 5, first, a method of forming a circuit on an insulating layer 110 is provided, for example, a wiring layer 120 including a first pad 121 and a first pattern 123 is formed using a semi-additive process (SAP), a modified semi-additive process (MSAP), and an embedded trace substrate (ETS). Next, a resist film 210 covering the wiring layer 120 is formed on the insulating layer 110, and an opening pattern 211 exposing the first pattern 123 is formed in the resist film 210 in a form surrounding the first pad 121 through an exposure and development process. Next, the opening pattern 211 is filled with plating to form a first column 131 on the first pattern 123, and the resist film 210 is removed. Next, a resist layer 140 covering the first pad 121, the first pattern 123, and the first column 131 is formed on the insulating layer 110 to form a first protrusion 141. The resist layer 140 may be formed by coating a liquid material. Next, through exposure and development processes, a first opening h1 exposing the first pad 121 is formed in the resist layer 140. In addition, a first surface treatment layer P1 is formed on the surface of the first pad 121 exposed by the first opening h1. In addition, the second pad 122, the second column 132, the second opening h2, and the second surface treatment layer P2 can be formed using a method substantially the same as the method described above for forming the first pad 121, the first column 131, the first opening h1, and the first surface treatment layer P1. In addition, for ease of explanation, the wiring structure 180 and the first solder bump 151 and the second solder bump 152 are omitted, which can be formed by a known substrate process. The printed circuit board 100A according to the above example can be manufactured by a series of processes, and other redundant descriptions will be omitted.

[0033] Figure 6 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board.

[0034] Figure 7 It is schematically shown Figure 6 A top view of the printed circuit board is shown.

[0035] Reference Figure 6 and Figure 7 , compared with the printed circuit board 100A according to the above-described example embodiment, in the printed circuit board 100B according to another example embodiment, the wiring layer 120 may further include a second pattern 124 spaced apart from the first pattern 123, and the second pillar 132 may be disposed on the second pattern 124. Similar to the first pattern 123, the second pattern 124 may be a ground pattern in a planar shape, but the present disclosure is not limited thereto. The other contents are substantially the same as those described above, and thus redundant descriptions thereof will be omitted.

[0036] Figure 8 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board.

[0037] Fig. 9 It is schematically shown Figure 8 A top view of the printed circuit board is shown.

[0038] Reference Figure 8 and Fig. 9 In a printed circuit board 100C according to another example embodiment, the second column 132 in the printed circuit board 100A according to the above-described example embodiment may be omitted, and the first column 131 may be disposed around the first pad 121 and the second pad 122. Similarly, the second protrusion 142 may be omitted, and the first protrusion 141 may be disposed around the first opening h1 and the second opening h2. For example, there may be a situation where solder bumps connected to the ground or power supply are connected to each other, and in this case, a more diverse design may be applied to avoid this situation. Alternatively, if necessary, the entire area where the electronic components are mounted may be completely surrounded by the first column 131. In this case, the first protrusion 141 may prevent the bottom filler from flowing. The other contents are substantially the same as those described above, and their redundant descriptions are omitted.

[0039] Fig.10 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board.

[0040] Fig.11 It is schematically shown Fig.10 A top view of the printed circuit board is shown.

[0041] Reference Fig.10 and Fig.11 In a printed circuit board 100D according to another exemplary embodiment, compared with the printed circuit board 100A according to the above exemplary embodiment, the wiring layer 120 may be buried in the insulating layer 110 from the upper surface of the insulating layer 110. For example, the first pad 121 and the second pad 122 and the first pattern 123 may be embedded patterns. Other contents are substantially the same as the above contents, and redundant descriptions thereof are omitted.

[0042] Fig.12 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board.

[0043] Fig.13 It is schematically shown Fig.12 A top view of the printed circuit board is shown.

[0044] Reference Fig.12 and Fig.13In a printed circuit board 100E according to another exemplary embodiment, compared with the printed circuit board 100B according to the above-described another exemplary embodiment, the wiring layer 120 may be buried in the insulating layer 110 from the upper surface of the insulating layer 110. For example, the first pad 121 and the second pad 122 and the first pattern 123 and the second pattern 124 may be embedded patterns. Other contents are substantially the same as those described above, and redundant descriptions thereof are omitted.

[0045] Fig.14 is a cross-sectional view schematically illustrating another example embodiment of a printed circuit board.

[0046] Fig.15 It is schematically shown Fig.14 A top view of the printed circuit board is shown.

[0047] Reference Fig.14 and Fig.15 In a printed circuit board 100F according to another exemplary embodiment, compared with the printed circuit board 100C according to the above-described other exemplary embodiment, the wiring layer 120 may be buried in the insulating layer 110 from the upper surface of the insulating layer 110. For example, the first pad 121 and the second pad 122 and the first pattern 123 may be embedded patterns. Other contents are substantially the same as those described above, and redundant descriptions thereof are omitted.

[0048] In the present disclosure, the expression "covering" may include a case of covering a part as well as a case of covering the whole, and may also include a case of direct covering as well as a case of indirect covering. In addition, the expression "filling" may include not only a case of complete filling, but also a case of approximately filling, for example, may include a case where there are some holes or gaps. In addition, the expression "surrounding" may include not only a case of complete surrounding, but also a case of approximately surrounding. In addition, "exposing" may include a case of partial exposure as well as a case of complete exposure, and "exposing" may refer to exposure from an embedded corresponding component. For example, "exposing a pad through an opening" may refer to exposing a pad from a resist layer, and a surface treatment layer or the like may be further provided on the exposed pad.

[0049] In the present disclosure, the meaning of "cross section" may refer to the cross-sectional shape when an object is cut vertically, or the cross-sectional shape when the object is observed from a side perspective. In addition, the meaning of "plane" may refer to the cross-sectional shape when an object is cut horizontally, or the plane shape when the object is observed from a top or bottom perspective.

[0050] In the present disclosure, thickness, width, length, depth, etc. can be measured based on a cross section of a polished or cut printed circuit board using a scanning microscope or an optical microscope. The cut section can be a vertical section or a horizontal section, and each value thereof can be determined based on the desired cut section. In the case where the value is not constant, the value can be determined as the average value of the values ​​measured at any 5 points. The width of the upper and / or lower part of the through hole can be measured on a cross section cut along the central axis of the through hole in the thickness direction of the substrate. The depth of the through hole can be measured as the distance from the upper part to the lower part of each object on a cross section cut along the central axis of each object in the thickness direction of the substrate.

[0051] In the present disclosure, "lower side", "lower part" and "lower surface" are used to refer to the downward direction relative to the cross section of the drawings, and "upper side", "upper part" and "upper surface" are used to refer to the opposite direction. In addition, "side", "side surface" and the like are used to indicate directions perpendicular to the "upper surface" and the "lower surface". However, these descriptions define directions for the convenience of explanation, but the scope of the claims is not particularly limited by the description of such directions, and the concepts of "upper part" and "lower part" may change at any time.

[0052] In the present disclosure, the meaning of "connection" includes not only the concept of direct connection, but also the concept of indirect connection through an adhesive layer or the like. In addition, the meaning of "electrical connection" includes the concepts of physical connection and non-physical connection. In addition, expressions such as "first" and "second" are used to distinguish one component from another component and do not limit the order and / or importance of the components. In some cases, a first component may be referred to as a second component, or similarly, a second component may be referred to as a first component without departing from the scope of the claims.

[0053] The expression "exemplary embodiment" used in this disclosure does not mean the same embodiment, but is provided to illustrate different unique features. However, the exemplary embodiments presented above do not exclude implementation in combination with features of other exemplary embodiments. For example, even if the content described in a specific exemplary embodiment is not described in other exemplary embodiments, it can be understood as an interpretation related to the other exemplary embodiments unless there is an interpretation contrary or contradictory to the content in other exemplary embodiments.

[0054] The terms used in the present disclosure are only used to describe example embodiments and are not intended to limit the present disclosure. In this case, unless the context clearly indicates a different meaning, a singular expression includes a plural expression.

Claims

1. A printed circuit board, comprising: Insulation layer; a wiring layer disposed on the outermost side of the insulating layer and including a first pad and a first pattern; a first column, arranged on the first pattern; as well as a resist layer disposed on the insulating layer and covering the wiring layer and the first pillar, The resist layer includes a first protrusion in a region covering the first column and a first opening above the first pad.

2. The printed circuit board according to claim 1, further comprising a second column, the second column being disposed on the first pattern and spaced apart from the first column, in, The wiring layer further includes a second pad spaced apart from the first pad, and The resist layer also includes a second protrusion in a region covering the second pillar and a second opening over the second pad.

3. The printed circuit board according to claim 2, in, The first column is arranged to surround the first pad, The second column is arranged to surround the second pad, The first protrusion is disposed around the first opening, and The second protrusion is disposed to surround the second opening.

4. The printed circuit board according to claim 2, further comprising: a first surface treatment layer disposed in the first opening and disposed on an outermost surface of the first pad; a second surface treatment layer disposed in the second opening and disposed on an outermost surface of the second pad; a first solder bump disposed on the resist layer, filling the first opening, and connected to the first surface treatment layer; as well as A second solder bump is disposed on the resist layer, fills the second opening, and is connected to the second surface finish layer.

5. The printed circuit board according to claim 1, in, The wiring layer further includes a second pad spaced apart from the first pad and a second pattern spaced apart from the first pattern, The printed circuit board further includes a second column disposed on the second pattern and spaced apart from the first column, and The resist layer also includes a second protrusion in a region covering the second pillar, and a second opening over the second pad.

6. The printed circuit board according to claim 5, in, The first column is arranged to surround the first pad, The second column is arranged to surround the second pad, The first protrusion is disposed around the first opening, and The second protrusion is disposed to surround the second opening.

7. The printed circuit board according to claim 5, further comprising: a first surface treatment layer disposed in the first opening and disposed on an outermost surface of the first pad; a second surface treatment layer disposed in the second opening and disposed on an outermost surface of the second pad; a first solder bump disposed on the resist layer, filling the first opening, and connected to the first surface treatment layer; as well as A second solder bump is disposed on the resist layer, fills the second opening, and is connected to the second surface finish layer.

8. The printed circuit board according to claim 1, in, The wiring layer further includes a second pad spaced apart from the first pad, and The resist layer also has a second opening over the second pad.

9. The printed circuit board according to claim 8, in, The first column is disposed to surround the first pad and the second pad, and The first protrusion is disposed to surround the first opening and the second opening.

10. The printed circuit board according to claim 8, further comprising: a first surface treatment layer disposed in the first opening and disposed on an outermost surface of the first pad; a second surface treatment layer disposed in the second opening and disposed on an outermost surface of the second pad; a first solder bump disposed on the resist layer, filling the first opening, and connected to the first surface treatment layer; as well as A second solder bump is disposed on the resist layer, fills the second opening, and is connected to the second surface finish layer.

11. The printed circuit board according to claim 1, in, The wiring layer protrudes outward from the outermost side of the insulating layer.

12. The printed circuit board according to claim 1, in, The wiring layer is buried in the insulating layer from the upper surface of the insulating layer.

13. The printed circuit board according to claim 1, comprising: A wiring structure comprising a plurality of insulating material layers, a plurality of conductive wiring layers and a plurality of via layers, The insulating layer provided with the wiring layer is the outermost insulating material layer among the plurality of insulating material layers.

14. The printed circuit board according to claim 1, wherein: At least a portion of the first pad is exposed from the resist layer.

15. The printed circuit board according to claim 1, wherein The first pillars are embedded in the resist layer.

16. The printed circuit board according to claim 1, wherein The first pillar comprises copper.

17. A printed circuit board, comprising: Insulation layer; A metal pad is disposed at the outermost side of the insulating layer; a metal column disposed at the outermost side of the insulating layer and surrounding the metal pad, wherein the outermost surface of the metal column is disposed above the outermost surface of the metal pad; and a resist layer disposed on the outermost surface of the insulating layer and covering the metal pad and the metal column, The outermost surface of the resist layer protrudes in a region covering the metal pillar, and the resist layer includes an opening above the metal pad.

18. The printed circuit board according to claim 17, in, The metal pillar annularly surrounds the metal pad.

19. The printed circuit board according to claim 18, comprising a plurality of the metal pads and a plurality of the metal pillars, and Each of the plurality of metal pillars annularly surrounds at least one of the plurality of metal pads.

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