Heat dissipation layer of display module, display module and display device

Abstract

The present invention discloses a heat dissipation layer of a display module, a display module, and a display device. In one embodiment, the heat dissipation layer of the display module comprises: a base layer; a foam layer disposed on the base layer; a graphite layer disposed on a side of the foam layer away from the base layer; a support layer disposed on a side of the foam layer away from the base layer, the graphite layer and the support layer being located on the same surface of the foam layer, the orthographic projection of the support layer on the base layer surrounding the orthographic projection of the graphite layer on the base layer; and a conductive metal layer disposed on a side of the support layer and the graphite layer away from the base layer. The heat dissipation layer further comprises: a plurality of glue injection holes provided in at least one of the conductive metal layer and the support layer, the orthographic projections of the glue injection holes on the base layer being distributed within the orthographic projection of the support layer on the base layer; and a first adhesive layer filling the glue injection holes.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and more particularly to a heat dissipation layer of a display module, a display module, and a display device. Background Art

[0002] In recent years, with the rapid development of OLED (organic light-emitting diode) display technology, its display quality and power consumption have significantly improved compared to LCD (liquid crystal display), making it popular with end customers. As shipments increase, the number of returns and repair requests from end customers also increases. This forces the module to meet the requirements of disassembly strength to prevent damage to the module's film layer (or the film layer of the module after disassembly), thereby reducing unnecessary losses during the disassembly and repair process. Therefore, improving the bonding viscosity between the film layers of the display module can improve product yield. Summary of the Invention

[0003] An object of the present invention is to provide a heat dissipation layer of a display module, a display module, and a display device to solve at least one of the problems existing in the prior art.

[0004] In order to achieve the above object, the present invention adopts the following technical solutions:

[0005] A first aspect of the present invention provides a heat dissipation layer of a display module, the heat dissipation layer comprising:

[0006] basal layer;

[0007] a foam layer disposed on the base layer;

[0008] A graphite layer disposed on a side of the foam layer away from the base layer;

[0009] A support layer is provided on a side of the foam layer away from the base layer, the graphite layer and the support layer are located on the same surface of the foam layer, and an orthographic projection of the support layer on the base layer surrounds an orthographic projection of the graphite layer on the base layer; and

[0010] a conductive metal layer disposed on a side of the support layer and the graphite layer away from the base layer;

[0011] The heat dissipation layer further comprises:

[0012] a plurality of glue injection holes are provided in at least one of the conductive metal layer and the support layer, wherein the orthographic projections of the glue injection holes on the base layer are distributed within the orthographic projections of the support layer on the base layer; and

[0013] A first adhesive layer is filled in the glue injection hole.

[0014] In an optional embodiment,

[0015] The glue injection hole includes a first glue injection hole extending from the surface of the conductive metal layer away from the base layer to the surface of the conductive metal layer close to the base layer.

[0016] The surface of the first adhesive layer filled in the first glue injection hole away from the base layer is flush with the surface of the conductive metal layer away from the base layer.

[0017] In an optional embodiment,

[0018] The glue injection hole includes a second glue injection hole extending from the surface of the support layer away from the base layer to the surface of the support layer close to the base layer.

[0019] The surface of the first adhesive layer filled in the second glue injection hole away from the base layer is bonded and fixed to the surface of the conductive metal layer close to the base layer.

[0020] In an optional embodiment,

[0021] The glue injection hole includes a third glue injection hole, which is opened from the surface of the conductive metal layer away from the base layer or from the surface of the support layer away from the base layer, extends toward the base layer and penetrates one or more layers of the conductive metal layer or the support layer, and penetrates one or more layers of the foam layer and the base layer.

[0022] In an optional embodiment,

[0023] When the supporting layer is penetrated by the second glue injection hole or the third glue injection hole, the supporting layer has an annular gap between the projection boundary of the orthographic projection of the base layer and the projection boundary of the orthographic projection of the graphite layer on the base layer, and the annular groove formed by the side walls of the supporting layer and the graphite layer at the corresponding position of the annular gap is filled with the second adhesive layer.

[0024] In an optional embodiment,

[0025] The support layer further comprises:

[0026] a plurality of exhaust holes, wherein the orthographic projection of the exhaust holes on the base layer is smaller than the orthographic projection of the second glue injection hole or the third glue injection hole on the base layer;

[0027] a first exhaust passage communicating with the exhaust hole and the annular groove;

[0028] A second exhaust passage is connected between the second glue injection hole and the annular groove or between the third glue injection hole and the annular groove.

[0029] In an optional embodiment,

[0030] The bottom boundary aperture of the second glue injection hole close to the base layer is larger than the top boundary aperture of the second glue injection hole away from the base layer.

[0031] or

[0032] The bottom boundary aperture of the third glue injection hole close to the base layer is larger than the top boundary aperture of the third glue injection hole away from the base layer.

[0033] In an optional embodiment,

[0034] The support layer includes a first side portion, a second side portion opposite to the first side portion, a third side portion connecting the first side portion and the second side portion on the same side, and a fourth side portion opposite to the third side portion.

[0035] The glue injection holes are located at the first side, the second side, the third side, and the fourth side.

[0036] In an optional embodiment,

[0037] Each side includes a plurality of glue injection holes, and the plurality of glue injection holes located on the same side are arranged at intervals;

[0038] or

[0039] The positive projection of the glue injection hole located at one edge on the base layer includes a plurality of continuous bending projections.

[0040] A second aspect of the present invention provides a display module, comprising:

[0041] frame;

[0042] In the heat dissipation layer described in the first aspect of the present invention, the frame and the surface of the first adhesive layer away from the base layer are fixed; and

[0043] A display panel is located on a surface of the base layer away from the foam layer.

[0044] In an optional embodiment,

[0045] When the glue injection hole is the second glue injection hole, or

[0046] When the glue injection hole is the third glue injection hole, and the third glue injection hole is opened from the surface of the support layer away from the base layer,

[0047] The display module further includes a third adhesive layer located between the frame and the conductive metal layer.

[0048] A third aspect of the present invention provides a display device, comprising the display module according to the second aspect of the present invention.

[0049] The beneficial effects of the present invention are as follows:

[0050] In an embodiment of the present invention, glue injection holes are provided for at least part of the film layer at the edge of the heat dissipation layer, and a first adhesive layer is filled in the glue injection holes to increase the interlayer viscosity between adjacent film layers, thereby improving the problem of delamination when the end customer disassembles the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] The specific embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0052] Figure 1 A schematic diagram showing a layer structure in which the heat dissipation layer is a first glue injection hole according to an embodiment of the present invention;

[0053] Figure 2 Show Figure 1 A schematic top view of the first glue injection hole of the illustrated embodiment;

[0054] Figure 3 A schematic diagram showing the layer structure of the heat dissipation layer of another embodiment of the present invention as a second glue injection hole;

[0055] Figure 4 Show Figure 3 Schematic diagram of the forces acting on the heat dissipation layer and the third adhesive layer when they are separated;

[0056] Figure 5 Show Figure 3 A schematic top view of the second glue injection hole of the illustrated embodiment;

[0057] Figure 6 A schematic diagram showing the layer structure of the heat dissipation layer of another embodiment of the present invention as the third glue injection hole;

[0058] Figure 7 A schematic diagram showing the layer structure of the heat dissipation layer of another embodiment of the present invention as the third glue injection hole;

[0059] Figure 8 A schematic diagram showing a layer structure in which the third glue injection hole is a truncated cone structure according to another embodiment of the present invention;

[0060] Figure 9 Show Figure 8 Schematic diagram of the forces acting on the heat dissipation layer and the third adhesive layer when they are separated;

[0061] Figure 10 A schematic top view of the structure showing a support layer with a glue injection hole provided thereon according to an embodiment of the present invention;

[0062] Figure 11 Schematic diagram of a top view of the structure of a support layer with a glue injection hole in an embodiment of the present invention

[0063] Figure 12 A schematic structural diagram of a display module according to an embodiment of the present invention is shown;

[0064] Figure 13 A schematic structural diagram of a display module according to another embodiment of the present invention is shown. DETAILED DESCRIPTION

[0065] In order to more clearly illustrate the present invention, the present invention will be further described below in conjunction with the embodiments and drawings. Similar components in the drawings are represented by the same reference numerals. It should be understood by those skilled in the art that the following specific description is illustrative rather than restrictive and should not be used to limit the scope of protection of the present invention.

[0066] In order to improve the film separation problem of the display module during the disassembly and repair process, the embodiments of the present invention provide a heat dissipation layer of the display module, a display module and a display device to solve the above problem.

[0067] The first embodiment of the present invention provides a heat dissipation layer 20 of a display module, such as Figures 1 to 13 As shown, the heat dissipation layer 20 includes:

[0068] Basal layer 201;

[0069] A foam layer 202 disposed on the base layer 201;

[0070] A graphite layer 203 disposed on a side of the foam layer 202 away from the base layer 201;

[0071] A support layer 204 is provided on a side of the foam layer 202 away from the base layer 201. The graphite layer 203 and the support layer 204 are located on the same surface of the foam layer 202. The orthographic projection of the support layer 204 on the base layer 201 surrounds the orthographic projection of the graphite layer 203 on the base layer 201. Exemplarily, the material of the support layer 204 is polyethylene terephthalate (PET), which has a good supporting effect.

[0072] A conductive metal layer 205 disposed on a side of the support layer 204 and the graphite layer 203 away from the base layer 201;

[0073] The heat dissipation layer 20 further includes:

[0074] A plurality of glue injection holes 206 are provided in at least one of the conductive metal layer 205 and the support layer 204 , wherein the orthographic projections of the glue injection holes 206 on the base layer 201 are distributed in the orthographic projections of the support layer 204 on the base layer 201 ; and

[0075] A first adhesive layer 207 is filled in the glue injection hole 206 .

[0076] In the embodiment of the present invention, a glue injection hole 206 is provided for at least part of the film layer at the edge of the heat dissipation layer 20, and a first adhesive layer 207 is filled in the glue injection hole 206 to increase the interlayer viscosity between adjacent film layers, thereby improving the problem of delamination when the end customer disassembles the device.

[0077] In the embodiment of the present invention, the glue injection hole 206 is provided in at least one of the conductive metal layer 205 and the support layer 204 . That is, the glue injection hole 206 has different implementations. The heat dissipation layer 20 of the embodiment of the present invention is described below.

[0078] In an optional embodiment, if Figure 1 and Figure 2 As shown, Figure 1 Shown Figure 2 Schematic diagram of the structure of the heat dissipation layer 20 at the middle AA interface position, the injection hole 206 includes a first injection hole 2061, which extends from the surface of the conductive metal layer 205 away from the base layer 201 to the surface of the conductive metal layer 205 close to the base layer 201.

[0079] The first glue injection hole 2061 of the embodiment of the present invention is opened at the edge position of the conductive metal layer 205, and the orthographic projection of the first glue injection hole 2061 on the base layer 201 is distributed in the orthographic projection of the support layer 204 on the base layer 201, that is, the first glue injection hole 2061 is opened on the upper surface of the conductive metal layer 205 at the corresponding position of the support layer 204, and the first glue injection hole 2061 only penetrates the conductive metal layer 205, and the other membrane layers, such as the support layer 204, the foam layer 202 and the base layer 201, do not have the first glue injection hole 2061.

[0080] In this embodiment, the surface of the first adhesive layer 207 filled in the first glue injection hole 2061, which is away from the base layer 201, is flush with the surface of the conductive metal layer 205, which is away from the base layer 201. Therefore, the surface of the first adhesive layer 207 and the surface of the conductive metal layer 205, which are away from the base layer 201, are flush.

[0081] Based on this structure, the surface of the first adhesive layer 207 away from the base layer 201 can serve as a frame for bonding subsequent processes. The frame is directly bonded and fixed to the first adhesive layer 207, reducing the bonding area between the heat dissipation layer 20 and the frame, so that the bonding area between the support layer 204 and the conductive metal layer 205 is larger than the bonding area between the heat dissipation layer 20 and the frame. By reducing the difficulty of separating the frame and the heat dissipation layer 20 during the disassembly process, the risk of delamination of the support layer 204 and the conductive metal layer 205 is reduced.

[0082] In an optional embodiment, if Figure 2As shown, the support layer 204 includes a first side portion 2041, a second side portion 2042 arranged opposite to the first side portion 2041, a third side portion 2043 connecting the first side portion 2041 and the second side portion 2042 on the same side, and a fourth side portion 2044 arranged opposite to the third side portion 2043.

[0083] In this embodiment, the orthographic projections of the glue injection holes 206 on the base layer 201 are located on the first edge 2041, the second edge 2042, the third edge 2043, and the fourth edge 2044. That is, the glue injection holes 206 are opened on the surface of the conductive metal layer 205 at corresponding positions on the support layer 204. The multiple glue injection holes 206 are in an annular structure, which not only ensures the overall adhesion of the heat dissipation layer 20 and the frame in subsequent processes, but also further reduces the difficulty of disassembly. Similarly, the first adhesive layer 207 filled in the glue injection holes 206 is also called an annular structure to achieve adhesive fixation of the entire heat dissipation layer 20.

[0084] In an optional embodiment, multiple glue injection holes 206 located on the same side are arranged at intervals, such as Figure 2 As shown, the orthographic projection of the first glue injection hole 2061 on the base layer 201 is a rectangular projection, as shown in FIG. Figure 2 As shown, the first side 2041 and the second side 2042 are both provided with a plurality of rectangular first glue injection holes 2061, and there are gaps between adjacent first glue injection holes 2061. The gaps reduce the bonding area, but the total length of the gaps between all adjacent first glue injection holes 2061 is less than the total length of the hole bodies of all glue injection holes 206. On the basis of ensuring the bonding effect, the difficulty of splitting is reduced, and the separation of the film layer of the heat dissipation layer 20 is avoided.

[0085] In an embodiment of the present invention, the boundary distance DS1 between the boundary of the rectangular first glue injection hole 2061 and the boundary of the conductive metal layer 205 is 2 mm, the W1 width of the first glue injection hole 2061 is 3 mm, and the hole depth of the first glue injection hole 2061 penetrating the conductive metal layer 205 is 0.03 mm. The hole depth is the same as the thickness of the conductive metal layer 205, and the length can be set according to the actual product situation.

[0086] In an optional embodiment, if Figure 3 、 Figure 4 and Figure 5 As shown, Figure 5 Shown Figure 3FIG2 is a schematic diagram of the layer structure of the heat dissipation layer 20 at the BB cross-section. The glue injection holes 206 include a second glue injection hole 2062 extending from the surface of the support layer 204 away from the base layer 201 to the surface of the support layer 204 closer to the base layer 201. That is, unlike the first embodiment in which the first glue injection hole 2061 was located in the conductive metal layer 205 at the top of the heat dissipation layer 20, the second glue injection hole 2062 in this embodiment is located in the intermediate film layer of the heat dissipation layer 20. In this embodiment, the first adhesive layer 207 is filled in the second glue injection hole 2062, which passes through the support layer 204. The surface of the first adhesive layer 207 away from the base layer 201 is bonded and fixed to the surface of the conductive metal layer 205 closer to the base layer 201. That is, the bottom of the first adhesive layer 207 contacts the foam layer 202, and the top of the first adhesive layer 207 contacts the conductive metal layer 205.

[0087] When the whole machine is disassembled, the third adhesive layer 40 attached to the heat dissipation layer 20 needs to be removed. Figure 4 As shown, the third adhesive layer 40 is subjected to an upward pulling force F1, and the conductive metal layer 205 bonded to the third adhesive layer 40 is also directly subjected to an upward pulling force F2. The pulling force F2 between the conductive metal layer 205 and the support layer 204 is offset by the bonding force F3 between the first adhesive layer 207 and the conductive metal layer 205. That is, when: F2 = F3 and > F1, under this design scheme, the bonding force between the conductive metal layer 205 of the heat dissipation layer 20 and the foam layer 202 is effectively increased.

[0088] In an optional embodiment, the plurality of second glue injection holes 2062 located on the same side are arranged at intervals, such as Figure 5 As shown, the orthographic projection of the second glue injection holes 2062 on the base layer 201 is a circular projection. Multiple circular second glue injection holes 2062 are provided on each of the first side 2041, the second side 2042, the third side 2043, and the fourth side 2044. Adjacent second glue injection holes 2062 are spaced apart. The gaps reduce the bonding area, ensuring the bonding effect while reducing the difficulty of disassembly and preventing separation of the film layers of the heat dissipation layer 20. For example, the diameter of the second glue injection holes 2062 can be set to 5 mm, the depth of the second glue injection holes 2062 is equal to the thickness of the support layer 204, for example, 0.05 mm, and the hole distance DS2 between adjacent second glue injection holes 2062 is set to 20 mm.

[0089] In one embodiment, Figure 2 As shown, the orthographic projection of the first glue injection hole 2061 on the base layer 201 is a rectangular projection, and the plurality of first glue injection holes 2061 located on the same side are arranged at intervals. Figure 5As shown, each side includes multiple circular second glue injection holes 2062, and multiple second glue injection holes 2062 located on the same side are arranged at intervals. This embodiment can be applied to the embodiment of the first glue injection hole 2061 or the second glue injection hole 2062, and those skilled in the art can design it according to actual application.

[0090] In an optional embodiment, if Figure 6 and Figure 7 As shown, the glue injection hole 206 includes a third glue injection hole 2063, which is opened from the surface of the conductive metal layer 205 away from the base layer 201 or from the surface of the support layer 204 away from the base layer 201, extends toward the base layer 201 and penetrates one or more layers of the conductive metal layer 205 or the support layer 204, and penetrates one or more layers of the foam layer 202 and the base layer 201.

[0091] The glue injection hole 206 may not be limited to the support layer 204 and the conductive metal layer 205. In this embodiment, the third glue injection hole 2063 penetrates multiple film layers of the heat dissipation layer 20 to increase the adhesion between the first adhesive layer 207 located in the third glue injection hole 2063 and the film layers of the multiple heat dissipation layers 20.

[0092] For example, Figure 6 As shown, the third glue injection hole 2063 passes through the support layer 204 and the foam layer 202. For example, the aperture D1 of the third glue injection hole 2063 can be set to 5 mm, and the depth of the third glue injection hole 2063 is the total thickness of the support layer 204 and the foam layer 202. For example, the depth of the third glue injection hole 2063 is 0.15 mm, and the hole spacing DS3 between adjacent third glue injection holes 2063 is set to 20 mm.

[0093] like Figure 7 As shown, the third glue injection hole 2063 passes through the conductive metal layer 205, the support layer 204 and the foam layer 202. In another example, the third glue injection hole 2063 can also pass through the conductive metal layer 205, the support layer 204, the foam layer 202 and the base layer 201, thereby increasing the contact area between the first adhesive layer 207 and each film layer, thereby improving the pull-out resistance between the first adhesive layer 207 and each film layer.

[0094] In an optional embodiment, if Figure 8 As shown, the bottom boundary aperture of the third glue injection hole 2063 close to the base layer 201 is larger than the top boundary aperture of the third glue injection hole 2063 away from the base layer 201 .

[0095] In this embodiment, Figure 8As shown, the drilling shape of the third glue injection hole 2063 is a "truncated cone" structure. For example, the bottom diameter D3 of the third glue injection hole 2063 is 8 mm, the top diameter D2 of the third glue injection hole 2063 is 5 mm, and the distance DS3 between the hole centers of adjacent third glue injection holes 2063 is 20 mm. The height of the first adhesive layer 207 is the total thickness of the film layer penetrated by the third glue injection hole 2063, for example Figure 8 As shown, the height of the first adhesive layer 207 is the total thickness of the support layer 204 and the foam layer 202 , for example, the height of the first adhesive layer 207 is 0.15 mm.

[0096] In this embodiment, the contact area between the first adhesive layer 207 located in the third glue injection hole 2063 and each film layer of the heat dissipation layer 20 is increased. Figure 9 As shown, during the disassembly of the entire machine, the third adhesive layer 40 attached to the heat dissipation layer 20 needs to be removed. At this time, the third adhesive layer 40 is subjected to an upward pulling force F1, and the conductive metal layer 205 bonded to the third adhesive layer 40 is also directly subjected to an upward pulling force F2. The pulling force F2 between the conductive metal layer 205 and the support layer 204 is offset by the bonding force F5 between the first adhesive layer 207 and the conductive metal layer 205. In addition, additional downward forces F3 and F4 will be generated between the first adhesive layer 207 of the frustum structure and the support layer 204, and between the first adhesive layer 207 and the foam layer 202. Under this design scheme, the bonding force between the conductive metal layer 205 and the foam layer 202 of the heat dissipation layer 20 is effectively increased, thereby improving the poor separation of the film layers of the heat dissipation layer 20.

[0097] Based on the same principle, in another optional embodiment, the bottom boundary aperture of the second glue injection hole 2062 close to the base layer 201 is larger than the top boundary aperture of the second glue injection hole 2062 away from the base layer 201. The bottom boundary aperture of the first glue injection hole 2061 close to the base layer 201 is larger than the top boundary aperture of the first glue injection hole 2061 away from the base layer 201.

[0098] That is to say, the first glue injection hole 2061 and the second glue injection hole 2062 of the embodiment of the present invention can be designed to have a large bottom diameter and a small top diameter, thereby increasing the bonding area between the first adhesive layer 207 located in the first glue injection hole 2061 or the second glue injection hole 2062 and the various film layers to which they are bonded, so as to improve the adhesion of the film layers of the heat dissipation layer 20.

[0099] Unlike the problem of separation of the heat dissipation layer 20 film layer that occurs during the disassembly process, a frame-shaped mold will appear after the heat dissipation layer 20 and other film layers of similar modules are bonded together. The inventors conducted research and experiments on the manufacturing process and film layer structure of the display module and found that there is a process gap between the support layer 204 and the graphite layer 203. The width of the gap is generally 0.2 mm. The gas in the gap causes the formation of an inevitable frame-shaped mold during the bonding process of the various film layers of the display module.

[0100] like Figure 10 As shown, in an optional embodiment, when the support layer 204 is penetrated by the second glue injection hole 2062 or the third glue injection hole 2063, the support layer 204 has an annular gap between the projection boundary of the orthographic projection of the base layer 201 and the projection boundary of the orthographic projection of the graphite layer 203 on the base layer 201, and the annular groove formed by the side wall of the support layer 204 and the graphite layer 203 at the corresponding position of the annular gap is filled with a second adhesive layer 208.

[0101] like Figure 10 As shown, in this embodiment, a second adhesive layer 208 is filled in the annular gap between the support layer 204 and the graphite layer 203, and the second adhesive layer 208 is used to discharge the gas in the annular gap, thereby improving the mold printing defect.

[0102] In the embodiment of the present invention, the second adhesive layer 208 is arranged on the same layer as the first adhesive layer 207 located on the support layer 204, that is, when the first adhesive layer 207 is filled in the second glue injection hole 2062 located in the support layer 204, the second adhesive layer 208 is also filled in the annular gap.

[0103] In an optional embodiment, if Figure 10 As shown, the support layer 204 further includes:

[0104] a plurality of exhaust holes 2045 , wherein the orthographic projection of the exhaust holes 2045 on the base layer 201 is smaller than the orthographic projection of the second glue injection hole 2062 or the third glue injection hole 2063 on the base layer 201 ;

[0105] a first exhaust passage 2046 communicating with the exhaust hole 2045 and the annular groove;

[0106] A second exhaust channel 2047 is connected between the second glue injection hole 2062 and the annular groove or between the third glue injection hole 2063 and the annular groove.

[0107] In the embodiment of the present invention, the annular groove and each exhaust hole 2045 are connected through the first exhaust channel 2046, and the annular groove and the second glue injection hole 2062 or the third glue injection hole 2063 corresponding to the support layer 204 are connected by the second exhaust channel 2047, so as to discharge the air at the annular gap position and avoid the formation of a frame-shaped mold.

[0108] In another embodiment, Figure 11 As shown, the orthographic projection of each second glue injection hole 2062 located on one edge of the base layer 201 comprises multiple continuous curved projections, and adjacent second glue injection holes 2062 located on adjacent edges are spaced apart. For example, in this embodiment, the width W2 of the serpentine projection of the second glue injection hole 2062 is 3 mm, and the distance DS2 between the edge of the second glue injection hole 2062 on the side closest to the support layer 204 and the edge of the support layer 204 is 3 mm.

[0109] Figure 11 The structure shown is applied to the situation where the viscosity of the frame and the heat dissipation layer 20 is high during the disassembly process of the entire machine. In this embodiment, the structure of the second glue injection hole 2062 is set to be "snake-shaped" when viewed from above. This setting can effectively increase the contact area between the first adhesive layer 207 and the side wall of the support layer 204, and increase the contact area between the first adhesive layer 207 and the conductive metal layer 205, thereby improving the viscosity between the various film layers of the heat dissipation layer 20, and achieving the purpose of enhancing the pull-out resistance of the film layer of the heat dissipation layer 20.

[0110] Based on the above principles, the positive projection of the second glue injection hole 2062 on the base layer 201 of the embodiment of the present invention can also be set to other shapes. For example, each second glue injection hole 2062 can be set to "rectangular", "S-shaped" and "△", etc., so as to increase the contact area between the first adhesive layer 207 and the conductive metal layer 205 in the second glue injection hole 2062, and increase the contact area between the first adhesive layer 207 and the side wall of the support layer 204 in the second glue injection hole 2062 as design criteria. Those skilled in the art will design according to actual applications.

[0111] It is also worth mentioning that the structural design of the second glue injection hole 2062 with a "snake-shaped" structure in the embodiment of the present invention can also be applied to the embodiment of the third glue injection hole 2063, that is, when the third glue injection hole 2063 passes through multiple film layers of the heat dissipation layer 20, the third glue injection hole 2063 can be set to a serpentine structure. The relevant principles can be referred to the above description and will not be repeated here.

[0112] The embodiment of the present invention provides a display module 1, such as Figure 12 and Figure 13 As shown, the display module 1 includes:

[0113] Frame 10;

[0114] The heat dissipation layer 20 according to any one of the embodiments of the present invention, the frame 10 and the first adhesive layer 207 are fixed to a surface away from the base layer 201; and

[0115] The display panel 30 is located on a surface of the base layer 201 away from the foam layer 202 .

[0116] In this embodiment of the present invention, the heat dissipation layer 20 is fixedly attached to the non-light-emitting surface of the display panel 30, and the frame 10 is attached to the heat dissipation layer 20, forming a display panel 30-heat dissipation layer 20-frame 10 composite structure. Based on the heat dissipation layer 20 of this embodiment of the present invention, the film adhesion between the heat dissipation layer 20 is improved. When separating the heat dissipation layer 20 and the frame 10, the poor separation of the heat dissipation layer 20 can be improved while maintaining the same separation force.

[0117] like Figure 12 As shown, when the glue injection hole 206 is the first glue injection hole 2061, the surface of the first adhesive layer 207 filled in the first glue injection hole 2061 is flush with the conductive metal layer 205. Therefore, the first adhesive layer 207 not only improves the film adhesion between the conductive metal layer 205 and the support layer 204, but also directly bonds and secures the first adhesive layer 207 to the frame 10. Therefore, the first adhesive layer 207 also secures the frame 10 to the heat dissipation layer 20. Therefore, under this design, the original third adhesive layer 40 between the frame 10 and the heat dissipation layer 20 can be omitted, reducing the thickness of the display module 1 and the cost of the display module 1. Based on the same principle, when the glue injection hole 206 is the third glue injection hole 2063, and the third glue injection hole 2063 is opened on the surface of the conductive metal layer 205 away from the base layer 201, the third adhesive layer 40 is also not required, and the same effect can be achieved.

[0118] In an optional embodiment, if Figure 13 As shown, when the glue injection hole 206 is the second glue injection hole 2062 , the display module 1 further includes a third adhesive layer 40 located between the frame 10 and the conductive metal layer 205 for fixing the heat dissipation layer 20 and the conductive metal layer 205 .

[0119] Based on the same principle, in another optional embodiment, when the glue injection hole 206 is the third glue injection hole 2063, and the third glue injection hole 2063 is opened from the surface of the support layer 204 away from the base layer 201, a third adhesive layer 40 is further provided between the frame 10 and the conductive metal layer 205 to achieve fixation between the heat dissipation layer 20 and the conductive metal layer 205.

[0120] Another embodiment of the present invention provides a display device comprising the display module of the aforementioned embodiment of the present invention. The display device can be any product or component with a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigation system, and the like, and is not limited to such product or component in this embodiment.

[0121] In the description of the present invention, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus comprising the element.

[0122] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not limitations on the implementation methods of the present invention. For ordinary technicians in this field, other different forms of changes or modifications can be made based on the above description. It is impossible to list all the implementation methods here. All obvious changes or modifications derived from the technical solution of the present invention are still within the scope of protection of the present invention.

Claims

1. A heat dissipation layer of a display module, characterized in that: The heat dissipation layer comprises: basal layer; a foam layer disposed on the base layer; A graphite layer disposed on a side of the foam layer away from the base layer; A support layer is provided on a side of the foam layer away from the base layer, the graphite layer and the support layer are located on the same surface of the foam layer, and an orthographic projection of the support layer on the base layer surrounds an orthographic projection of the graphite layer on the base layer; and a conductive metal layer disposed on a side of the support layer and the graphite layer away from the base layer; The heat dissipation layer further comprises: a plurality of glue injection holes are provided in at least one of the conductive metal layer and the support layer, wherein the orthographic projections of the glue injection holes on the base layer are distributed within the orthographic projections of the support layer on the base layer; and A first adhesive layer is filled in the glue injection hole.

2. The heat dissipation layer according to claim 1, characterized in that The glue injection hole includes a first glue injection hole extending from the surface of the conductive metal layer away from the base layer to the surface of the conductive metal layer close to the base layer. The surface of the first adhesive layer filled in the first glue injection hole away from the base layer is flush with the surface of the conductive metal layer away from the base layer.

3. The heat dissipation layer according to claim 1, characterized in that The glue injection hole includes a second glue injection hole extending from the surface of the support layer away from the base layer to the surface of the support layer close to the base layer. The surface of the first adhesive layer filled in the second glue injection hole away from the base layer is bonded and fixed to the surface of the conductive metal layer close to the base layer.

4. The heat dissipation layer according to claim 1, characterized in that The glue injection hole includes a third glue injection hole, which is opened from the surface of the conductive metal layer away from the base layer or from the surface of the support layer away from the base layer, extends toward the base layer and penetrates one or more layers of the conductive metal layer or the support layer, and penetrates one or more layers of the foam layer and the base layer.

5. The heat dissipation layer according to any one of claims 3 or 4, characterized in that: When the supporting layer is penetrated by the second glue injection hole or the third glue injection hole, the supporting layer has an annular gap between the projection boundary of the orthographic projection of the base layer and the projection boundary of the orthographic projection of the graphite layer on the base layer, and the annular groove formed by the side walls of the supporting layer and the graphite layer at the corresponding position of the annular gap is filled with the second adhesive layer.

6. The heat dissipation layer according to claim 5, characterized in that The support layer further comprises: a plurality of exhaust holes, wherein the orthographic projection of the exhaust holes on the base layer is smaller than the orthographic projection of the second glue injection hole or the third glue injection hole on the base layer; a first exhaust passage communicating with the exhaust hole and the annular groove; A second exhaust passage is connected between the second glue injection hole and the annular groove or between the third glue injection hole and the annular groove.

7. The heat dissipation layer according to any one of claims 3 or 4, characterized in that: The bottom boundary aperture of the second glue injection hole close to the base layer is larger than the top boundary aperture of the second glue injection hole away from the base layer. or The bottom boundary aperture of the third glue injection hole close to the base layer is larger than the top boundary aperture of the third glue injection hole away from the base layer.

8. The heat dissipation layer according to claim 1, characterized in that The support layer includes a first side portion, a second side portion opposite to the first side portion, a third side portion connecting the first side portion and the second side portion on the same side, and a fourth side portion opposite to the third side portion. The glue injection holes are located at the first side, the second side, the third side, and the fourth side.

9. The heat dissipation layer according to claim 8, characterized in that Each side includes a plurality of glue injection holes, and the plurality of glue injection holes located on the same side are arranged at intervals; or The positive projection of the glue injection hole located at one edge on the base layer includes a plurality of continuous bending projections.

10. A display module, characterized in that: The display module includes: frame; The heat dissipation layer according to any one of claims 1 to 9, and a display panel located on a surface of the base layer away from the foam layer; When the glue injection hole is opened on the surface of the conductive metal layer away from the base layer, the frame and the surface of the first adhesive layer away from the base layer are fixed; When the glue injection hole is opened on the surface of the support layer away from the base layer, the display module further includes a third adhesive layer located between the frame and the conductive metal layer.

11. A display device, characterized in that: The display device includes the display module according to claim 10.

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