Electronic device anti-high overload potting method and potting system

Abstract

The invention relates to the technical field of steering engine controllers, in particular to an anti-high-overload potting method and system for an electronic device. A gap outside the electronic device is blocked, and a glue inlet and an exhaust port of the electronic device are reserved; mounting an electronic device on the base; preparing a pouring sealant; pouring sealant is placed in a sealant storage container; in a vacuum environment, the pouring sealant flows into the electronic device through the distribution container; when the pouring sealant flows out of the exhaust port, keeping for a first time under third vacuum pressure, and closing the sealant feeding port; releasing the pressure; and after the pouring sealant is cured for a second time, obtaining a target electronic device. The filling and sealing system comprises filling and sealing equipment and vacuum equipment. The filling and sealing equipment comprises a glue storage container, a piston, a distribution container, a base, a first supporting piece, a second supporting piece and a linkage piece. The base, the distribution container, the glue storage container and the piston are sequentially arranged in the y-axis direction from bottom to top. Therefore, the speed of encapsulating the electronic device is improved, and the high overload resistance of the electronic device is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of steering gear controllers, and in particular to a high overload resistance potting method and a potting system for electronic devices. Background Art

[0002] High overload resistant guided shells will form high overload loads when fired. High overload weapon equipment has harsh working conditions, and ultra-high overload resistant servos have harsh working conditions. The mechanical impact strength of the servo controller product is as high as 25,000g, which is difficult for general product structures to withstand. In order to ensure that the fully enclosed structure of the high overload resistant servo controller electronic components works normally after high impact conditions, and to avoid damage or failure of components caused by high overload impact, which may cause loss of servo function, the servo controller electronic components need to take reinforcement protection measures to improve the reliability of the electric servo electronic circuit in resisting high overload impact.

[0003] At present, there are relatively few studies on the reliability of potting of electronic components with special structures. Therefore, it is of great significance to strengthen the research on potting protection of fully enclosed electronic circuits. In order to ensure the reliability of electronic products in this type of equipment, electronic products are usually installed in a fully enclosed high-rigidity shell structure, and then vacuum potting is performed with adhesives to meet the requirements of mechanical impact resistance and high and low temperature impact.

[0004] The existing methods have the following disadvantages:

[0005] 1) At present, the potting materials of many electronic components in products have limited resistance to high overload impact. Basically, the high overload impact after potting is below 20,000g, which cannot meet the impact requirements of ultra-high overload resistance of more than 25,000g;

[0006] 2) The current fully enclosed structure potting method has certain defects. The structure after vacuum potting has not achieved the purpose of full penetration. There are many places deep inside the potting structure where glue is missing. Under high overload impact, it is easy to cause damage or failure of components and loss of product function;

[0007] 3) After the electronic components of many products are potted, it is not easy to disassemble the electronic components due to the high bonding performance between the potting glue and the electronic components, so they cannot be repaired. Once a component has a problem, it can only be forcibly dismantled, which is not convenient for repairing the electronic components and can easily lead to the scrapping of the electronic component structure, causing unnecessary economic losses.

[0008] The present invention is guided by the high overload resistance demand of the high overload steering gear controller and carries out research on the potting technology of fully enclosed structure electronic devices. Summary of the invention

[0009] In order to solve the problem that the potting materials of existing electronic devices have limited ability to resist high overload impact, the present invention provides an electronic device high overload resistance potting method and potting system.

[0010] According to a first aspect of the present invention, the present invention provides a method for encapsulating an electronic device against high overload, comprising the following steps:

[0011] The gap outside the electronic device is sealed to reserve a glue inlet and an exhaust port for the electronic device;

[0012] The electronic device is mounted on a base, with the opening directions of the glue inlet and the exhaust port facing upwards;

[0013] Prepare potting glue;

[0014] Placing the potting glue in a glue storage container;

[0015] Evacuate the vacuum hood;

[0016] In a vacuum environment when the first vacuum pressure in the vacuum cover drops to a second vacuum pressure, the glue outlet of the glue storage container is opened, and the potting glue flows into the distribution container; when the potting glue in the distribution container reaches a preset capacity, the glue outlet is closed, and the glue delivery port of the distribution container is opened, and the potting glue flows into the interior of the electronic device through the glue delivery port and the glue inlet in sequence;

[0017] When the potting glue flows out of the exhaust port, the third vacuum pressure is maintained for a first time, and the glue feeding port is closed;

[0018] Pressure relief;

[0019] After the potting glue in the electronic device is cured for a second time, the glue inlet and the exhaust port are blocked to obtain a target electronic device.

[0020] According to an embodiment of the present invention, the potting glue includes AB type glue and adhesive glue, and the mass ratio of the AB type glue to the adhesive glue is 4:1.

[0021] According to an embodiment of the present invention, the AB type glue includes A type glue and B type glue, and the mass ratio of the A type glue to the B type glue is 1:1; the adhesive glue includes a silicone rubber adhesive.

[0022] According to an embodiment of the present invention, the particle size of the potting glue is ≤20 μm, and the viscosity of the potting glue is ≤3500 mPa.s.

[0023] According to an embodiment of the present invention, when the glue delivery port is closed, the distribution container has a first residual amount of potting glue, and the exhaust port has a second residual amount of potting glue.

[0024] According to a second aspect of the present invention, the present invention provides an electronic device high overload resistance potting system, comprising:

[0025] Filling equipment and vacuum equipment;

[0026] The vacuum equipment comprises a vacuum cover, a base and a pressure regulator, wherein the vacuum cover is mounted on the base, and the output end of the pressure regulator is connected to the vacuum cover;

[0027] The potting equipment is located in the vacuum cover;

[0028] The potting equipment includes a glue storage container, a piston, a distribution container, a base, a first support member, a second support member, and a linkage member;

[0029] The base, the distribution container, the glue storage container and the piston are arranged in sequence along the y-axis direction from bottom to top, the base is installed on the base, the first support member and the second support member are fixed to the base, the distribution container is connected to the first support member, the distribution container and the base have a first spacing, the glue storage container is connected to the second support member, the glue storage container is communicated with the distribution container, the piston is connected to the linkage member, the linkage member is rotatably connected with the second support member, and the linkage member drives the piston away from or close to the glue storage container when it moves, and when the piston abuts against the inner peripheral wall of the glue storage container, the passage connecting the glue storage container and the distribution container is blocked;

[0030] The base is provided with n positioning grooves, and the bottom of the dispensing container is provided with m glue delivery ports, wherein n and m are natural numbers, and n≥m≥1.

[0031] According to one embodiment of the present invention, the discharge end of the dispensing container is in a conical structure, and the glue delivery port is provided with a valve.

[0032] According to one embodiment of the present invention, the lower end of the glue storage container is of a conical structure, and the glue outlet of the glue storage container is located at the bottom of the glue storage container, and the piston includes a first conical portion, a cylindrical portion, and a second conical portion connected in sequence, and the cone end of the first conical portion faces a direction opposite to the cone end of the second conical portion, the first conical portion is connected to the linkage, and the first cross-sectional area of ​​the cylindrical portion is larger than the second cross-sectional area of ​​the glue outlet, and when the piston abuts against the inner circumferential wall of the glue storage container, the first cross-sectional area covers the second cross-sectional area, and the second conical portion is located at the glue delivery port.

[0033] According to one embodiment of the present invention, the connecting member includes a first connecting rod and a second connecting rod, one end of the first connecting rod is connected to the driving member outside the vacuum cover, the other end of the first connecting rod is rotatably connected to the first end of the second connecting rod, the second end of the second connecting rod is connected to the piston away from the first connecting rod, the second end of the second connecting rod is rotatably connected to the second support member close to the first connecting rod, and the first connecting rod is slidably connected to the second support member.

[0034] According to one embodiment of the present invention, the second support member is provided with a cavity slideway for sliding of the first connecting rod, and all the first connecting rods and the cavity slideway wall of the second support member have a second spacing, and the second spacing is within a preset spacing range.

[0035] According to an embodiment of the present invention, a limiting plate is provided at one end of the first connecting rod close to the second connecting rod.

[0036] According to one embodiment of the present invention, the positioning groove is used to position the electronic device, the glue inlet of the electronic device is connected to the glue delivery port through a first pipeline, the exhaust port of the electronic device is connected to a second pipeline, the second pipeline is made of a transparent material, and the second pipeline has a preset length.

[0037] The present invention has the following beneficial effects.

[0038] 1. The present invention adopts a vacuum potting method. Under a vacuum environment, when the vacuum degree meets the requirements, the glue delivery port of the distribution container is opened, and the vacuum state is maintained while the electronic device is potted with glue, so that the inside of the electronic device is fully soaked with potting glue. The potted electronic device of the present invention can withstand performance tests such as overload shock and temperature shock exceeding 25,000g, breaking through the potting protection technology of fully enclosed structure products against ultra-high overload.

[0039] 2. The electronic device after potting of the present invention is easy to disassemble, which reduces the damage to the electronic device caused by reworking the electronic device. After disassembly, the potting glue and the electronic device structure have a high degree of separation, and there is no residual glue on the electronic device, which is convenient for reworking and comprehensive cleaning of the electronic device.

[0040] 3. The present invention selects a suitable potting glue material and utilizes the fact that the potting glue in the closed space of the electronic device has no deformation space and cannot deform, so that the potting glue is equivalent to a rigid body, so that the electronic device can meet the mechanical impact requirements of resisting ultra-high overload of more than 25000g.

[0041] 4. In the present invention, the base, the distribution container, the glue storage container and the piston are arranged in sequence from bottom to top along the y-axis direction, forming a spatial layout in which the distribution container is located above the base, the glue storage container is located above the distribution container and the piston is located above the glue storage container, thereby improving structural integration, reducing space occupation area, and facilitating adaptation to a smaller vacuum cover environment. At the same time, the smaller the vacuum cover used, the lower the energy consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 A flow chart showing the method for encapsulating an electronic device against high overload according to the present invention is shown;

[0043] Figure 2 The schematic diagram of the structure of the electronic device anti-high overload potting system of the present invention is shown;

[0044] Figure 3 Another structural schematic diagram of the electronic device high overload resistance potting system of the present invention is shown;

[0045] Figure 4 A schematic diagram of the top view of the base of the present invention is shown;

[0046] Figure 5 The present invention is shown Figure 2 or Figure 3 A schematic diagram of the structure of the distribution container;

[0047] Figure 6 A schematic diagram of the piston structure of the present invention is shown.

[0048] Figure markings: 01-vacuum equipment; 11-vacuum cover; 12-base; 02-filling equipment; 21-glue storage container; 22-mounting ring; 23-piston; 24-distribution container; 25-glue delivery port; 26-base; 27-positioning groove; 28-baffle; 29-first support member; 291-support seat; 292-support rod; 30-second support member; 31-mounting sleeve; 32-groove; 33-third support member; 34-linking member; 341-first linking rod; 342-second linking rod; 35-protrusion; 03-electronic device; 04-second pipeline. DETAILED DESCRIPTION

[0049] The present disclosure will now be discussed with reference to several exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and thus implement the present disclosure, rather than implying any limitation on the scope of the present disclosure.

[0050] As used herein, the term "including" and its variants are to be interpreted as open-ended terms meaning "including but not limited to". The term "based on" is to be interpreted as "based at least in part on". The terms "one embodiment" and "an embodiment" are to be interpreted as "at least one embodiment". The term "another embodiment" is to be interpreted as "at least one other embodiment". The orientation or position relationship indicated by the terms "upper", "lower", "left", "right", "front", "back", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal" and the like is based on the orientation or position relationship shown in the accompanying drawings. These terms are mainly for better describing the present application and its embodiments, and are not used to limit the indicated devices, elements or components to have a specific orientation, or to be constructed and operated in a specific orientation. In addition, in addition to being used to indicate an orientation or position relationship, some of the above terms may also be used to indicate other meanings, such as the term "upper" may also be used to indicate a certain dependency or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in this application can be understood according to the specific circumstances. In addition, the terms "install", "set", "provided with", "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be an internal connection between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances. In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, "plurality" means two or more.

[0051] This embodiment discloses a method for encapsulating an electronic device against high overload. Figure 1 As shown, the following steps are included:

[0052] The gap outside the electronic device 03 is sealed, and a glue inlet and an exhaust port of the electronic device 03 are reserved;

[0053] The electronic device 03 is mounted on the base 26, with the opening directions of the glue inlet and the exhaust port facing upwards;

[0054] Prepare potting glue;

[0055] The potting glue is placed in a glue storage container 21;

[0056] Evacuate the vacuum cover 11;

[0057] In a vacuum environment when the first vacuum pressure in the vacuum cover 11 drops to the second vacuum pressure, the glue outlet of the glue storage container 21 is opened, and the potting glue flows into the distribution container 24. When the potting glue in the distribution container 24 reaches a preset capacity, the glue outlet is closed, and the glue delivery port 25 of the distribution container 24 is opened, and the potting glue flows into the electronic device 03 through the glue delivery port 25 and the glue inlet in sequence.

[0058] When the potting glue flows out of the exhaust port, the third vacuum pressure is maintained for a first time, and the glue delivery port 25 is closed;

[0059] Pressure relief;

[0060] After the potting glue in the electronic device 03 is cured for a second time, the glue inlet and the exhaust port are blocked to obtain the target electronic device 03.

[0061] When implementing this embodiment, single-component silicone rubber GD414 is used to seal the tiny gap outside the electronic device 03, and the glue inlet and exhaust port of the electronic device 03 are reserved. After the gap is sealed, the electronic device 03 is installed on the base 26 in the vacuum cover 11, with the end with the glue inlet and exhaust port facing upward. Prepare potting glue. Potting is potting in a vacuum environment. Pour the prepared potting glue into the glue storage container 21, start the vacuum equipment 01, and start to evacuate the vacuum cover 11. When the first vacuum pressure in the vacuum cover 11 drops to the second vacuum pressure, start to release the potting glue, open the glue outlet of the glue storage container 21, and the potting glue in the glue storage cup flows into the distribution container 24. When the potting glue in the distribution container 24 reaches the preset capacity, close the glue outlet, and then open the glue delivery port 25 of the distribution container 24. The potting glue in the distribution container 24 flows into the glue inlet of the electronic device 03 through the glue delivery port 25, and the potting glue flows into the interior of the electronic device 03 through the glue inlet. When potting glue flows out of the exhaust port, it means that most of the gaps in the electronic device 03 are filled. In order to ensure that all the gaps in the electronic device 03 are filled, maintain the third vacuum environment for the first time, and then close the glue delivery port 25 of the distribution container 24 to complete the potting of the electronic device 03. The pressure is released, the vacuum device 01 is closed, and after the potting glue inside the electronic device 03 is cured for a second time, the excess potting glue on the glue inlet and the exhaust port of the electronic device 03 is cut off, and the glue inlet and the exhaust port are sealed with silicone rubber GD414 to obtain the target electronic device 03 potted with potting glue.

[0062] The target electronic device 03 obtained in this embodiment was subjected to normal temperature hammer test, low temperature hammer test and high temperature hammer test respectively. The condition of normal temperature hammer test was that the electronic device 03 was subjected to 25000g mechanical impact 3 times at room temperature. The condition of low temperature hammer test was that the electronic device 03 was refrigerated at -55℃ for 3h, and then subjected to 25000g mechanical impact 3 times. The condition of high temperature hammer test was that the electronic device 03 was heated at 70℃ for 3h, and then subjected to 25000g mechanical impact 3 times. The performance of the electronic device 03 after each test was tested. It was found that the functions of the electronic device 03 were normal after ultra-high overload impact, and the impact test with additional impact was normal, indicating that this embodiment can effectively protect the electronic device 03 of fully enclosed structure circuit board and the like against high overload impact.

[0063] In this embodiment, the gap outside the electronic device 03 is first sealed, and the electronic device 03 is installed in a suitable position before the potting glue is configured, so as to avoid the potting glue being prepared in advance, which may cause the potting glue to solidify and affect the subsequent potting. By placing the glue inlet of the electronic device 03 upward, it is convenient for the potting glue to quickly enter the inside of the electronic device 03, and by placing the exhaust port of the electronic device 03 upward, it is difficult for the potting glue to flow out from the exhaust port, so that the potting glue can stay in the electronic device 03 for a longer time, and then the potting glue can flow into other gaps that are not easy to reach, ensuring that when the potting glue flows out from the exhaust port, most of the internal structure of the electronic device 03 is soaked by the potting glue, thereby improving the filling effect of the electronic device 03. Since the potting is only started under the second vacuum pressure environment, a part of time will be consumed in the process of dropping from the first vacuum pressure to the second vacuum pressure. During this period of time, the potting glue is in a state of non-flow, which may cause the potting glue to delaminate and solidify. By storing the potting glue in the glue storage container 21 and then flowing it into the distribution container 24, and finally flowing it from the distribution container 24 into the electronic device 03, when the potting glue flows from the glue storage container 21 into the distribution container 24, the flow state of the potting glue has the effect of disturbing the potting glue, thereby avoiding the potting glue from solidifying and delaminate. This embodiment uses a vacuum potting method. Under a vacuum environment, when the vacuum degree meets the requirements, the glue delivery port 25 of the distribution container 24 is opened, and the vacuum state is maintained while the electronic device 03 is injected with glue for potting, so that when the potting glue flows into the electronic device 03, the potting glue is only affected by the force of its own flow, and is not subject to resistance, thereby increasing the flow efficiency of the potting glue, ensuring that the small gaps in the enclosed space are fully penetrated, and the inside of the electronic device 03 is fully soaked without lack of potting glue. The electronic device 03 after potting in this embodiment can withstand performance tests such as overload shock and temperature shock exceeding 25000g, breaking through the potting protection technology of fully enclosed structure products against ultra-high overload. The electronic device 03 after potting in this embodiment is easy to disassemble, reducing the damage to the electronic device 03 caused by repairing the electronic device 03. After disassembly, the potting glue and the electronic device 03 have a high degree of separation, and there is no residual glue in the electronic device 03, which is convenient for repairing and fully cleaning the electronic device 03.

[0064] In the process of applying the encapsulation system of this embodiment, when the pressure is released, it is necessary to keep the piston 23 completely drooping due to gravity, that is, the piston 23 is in a state of closing the channel connecting the glue storage container 21 and the distribution container 24. Otherwise, a pressure difference may easily occur, causing the piston 23 to rise, causing the residual glue in the glue storage container 21 to continue to flow out, resulting in excessive glue flowing out of the electronic device 03 and flowing everywhere.

[0065] In this embodiment, the potting glue in the distribution container 24 can flow into multiple electronic devices 03 at the same time, thereby improving work efficiency.

[0066] Normally, the amount of potting glue consumed to pot an electronic device 03 is about ten grams.

[0067] In some embodiments, the angle formed by the projection line extending in the opposite direction of the glue inlet opening and the projection line extending in the opposite direction of the exhaust port opening is less than 180°, preferably less than 45°, thereby improving the accuracy of judging whether the internal structure of the electronic device 03 is filled with potting glue through the exhaust port.

[0068] In some embodiments, the electronic device 03 is a controller.

[0069] In some embodiments, the first vacuum pressure>the second vacuum pressure>the third vacuum pressure. Preferably, the first vacuum pressure>10Pa, the third vacuum pressure<10Pa, and more preferably, the second vacuum pressure=10Pa.

[0070] In some examples, the first vacuum pressure and the third vacuum pressure do not represent constant values ​​but may change dynamically.

[0071] In some embodiments, the first time is at least 10 min.

[0072] In some embodiments, the potting glue inside the electronic device 03 is cured at room temperature for at least 24 hours to ensure that the potting glue is completely cured. The second time is at least 24 hours.

[0073] In some embodiments, after the potting glue flows into the interior of the electronic device 03 at the inlet, the potting glue flows out of the exhaust port within 5 minutes.

[0074] In some embodiments, before potting, the potting device 02 is cleaned and dried, the cleaned and dried potting device 02 is assembled, and the potting device 02 is connected to the vacuum device 01 for standby use.

[0075] In some embodiments, the cross-sectional area of ​​the glue outlet of the glue storage container 21 is larger than the cross-sectional area of ​​the glue delivery port 25 of the distribution container 24, so as to ensure the flow rate of the glue.

[0076] According to an embodiment of the present invention, the potting glue includes AB type glue and adhesive glue, and the mass ratio of the AB type glue to the adhesive glue is 4:1.

[0077] In this embodiment, the potting glue is prepared according to the requirements, and the compatibility of the potting glue and the structure of the potting device 02 that contacts during potting is first verified. After the structure of the potting device 02 has no effect on the performance of the potting glue, it is determined that the potting device 02 can be used for potting. Compatibility verification is to avoid the loss of activity of the platinum catalyst in the addition-type AB type glue due to the AB type glue in the potting glue being easy to react with organic compounds of nitrogen, phosphorus, sulfur, metal salts of organic acids and other substances, thereby affecting the curing of the potting glue. In this embodiment, by selecting a suitable potting glue material, the potting glue in the enclosed space of the electronic device 03 has no deformation space and cannot be deformed, so that the potting glue is equivalent to a rigid body, so that the electronic device 03 can meet the mechanical impact requirements of resisting ultra-high overloads of more than 25,000g. By setting the appropriate ratio of the AB type glue and the adhesive glue, the strength of the potting glue after curing is guaranteed, and excessive adhesion is avoided.

[0078] According to an embodiment of the present invention, the AB type glue includes A type glue and B type glue, and the mass ratio of the A type glue to the B type glue is 1:1; the adhesive glue includes a silicone rubber adhesive.

[0079] In this embodiment, the AB type glue is 2532 thermal conductive potting glue produced by Beijing Tianshan New Material Technology Co., Ltd. In addition to being a silicone rubber adhesive, the adhesive glue in this embodiment can also be replaced by other adhesives having similar effects to the silicone rubber adhesive.

[0080] According to an embodiment of the present invention, the particle size of the potting glue is ≤20 μm, and the viscosity of the potting glue is ≤3500 mPa.s.

[0081] In this embodiment, too large a particle size of the filler may lead to clogging of the aperture of the electronic device 03 , and too high a viscosity may lead to poor fluidity, both of which may result in failure to completely penetrate the interior of the electronic device 03 .

[0082] In some embodiments, the potting glue can be operated for ≥ 60 minutes at room temperature. If the operating time is too short, potting will be difficult.

[0083] According to an embodiment of the present invention, when the glue delivery port 25 is closed, the distribution container 24 has a first residual amount of potting glue, and the exhaust port has a second residual amount of potting glue.

[0084] In this embodiment, by arranging that the distribution container 24 has a first surplus of potting glue and the exhaust port has a second surplus of potting glue, it is further ensured that the amount of potting glue is sufficient to fill the electronic device 03.

[0085] According to the second aspect of the present invention, Figure 2-6 As shown, this embodiment provides an electronic device 03 anti-high overload potting system, including:

[0086] Filling equipment 02 and vacuum equipment 01;

[0087] The vacuum equipment 01 comprises a vacuum cover 11, a base 12 and a pressure regulator, wherein the vacuum cover 11 is mounted on the base 12, and the output end of the pressure regulator is connected to the vacuum cover 11;

[0088] The potting device 02 is located in the vacuum cover 11;

[0089] The potting device 02 includes a glue storage container 21, a piston 23, a distribution container 24, a base 26, a first support member 29, a second support member 30, and a linkage member 34;

[0090] From bottom to top, the base 26, the distribution container 24, the glue storage container 21 and the piston 23 are arranged in sequence along the y-axis direction, the base 26 is installed on the base 12, the first support member 29 and the second support member 30 are fixed to the base 26, the distribution container 24 is connected to the first support member 29, the distribution container 24 and the base 26 have a first distance, the glue storage container 21 is connected to the second support member 30, the glue storage container 21 is communicated with the distribution container 24, the piston 23 is connected to the linkage member 34, the linkage member 34 is rotatably connected with the second support member 30, and the linkage member 34 drives the piston 23 away from or close to the glue storage container 21 when it moves, and when the piston 23 abuts against the inner peripheral wall of the glue storage container 21, the passage connecting the glue storage container 21 and the distribution container 24 is blocked;

[0091] The base 26 is provided with n positioning grooves 27 , and the bottom of the dispensing container 24 is provided with m glue delivery ports 25 , wherein n and m are natural numbers, and n≥m≥1.

[0092] In this embodiment, the base 26, the distribution container 24, the glue storage container 21 and the piston 23 are arranged in sequence from bottom to top along the y-axis direction, forming a spatial layout in which the distribution container 24 is located above the base 26, the glue storage container 21 is located above the distribution container 24, and the piston 23 is located above the glue storage container 21, thereby improving structural integration, reducing space occupation area, and facilitating adaptation to a smaller vacuum hood 11 environment. At the same time, the smaller the vacuum hood used, the lower the energy consumption. The first support member 29 provides support for the distribution container 24, the second support member 30 provides support for the glue storage cup and the connecting member 34, and the second support member 30 also provides a movable space for the connecting member 34. The connecting member 34 provides support for the piston 23, and the connecting member 34 can drive the piston 23 away from and close to the glue storage container 21 when it moves. When the piston 23 abuts against the inner wall of the glue storage container 21, the channel connecting the glue storage container 21 and the distribution container 24 is blocked, that is, the piston 23 blocks the glue outlet, forming a closed glue outlet state. When the piston 23 is away from the glue outlet of the distribution container 24, the glue outlet state is opened. The device with the positioning grooves 27 facilitates the positioning of the electronic device 03. The relationship between the number of positioning grooves 27 and the number of glue delivery ports 25 ensures that when there is an electronic device 03 at each position, the distribution container 24 can be connected to all the electronic devices 03 through the glue delivery ports 25. The arrangement of n positioning grooves 27 and m glue delivery ports 25 enables the potting device 02 to pot multiple electronic devices 03 at the same time, thereby improving work efficiency. The vacuum device 01 provides a vacuum environment for the potting device 02 when it is working. Through the cooperation between the glue storage container 21 and the distribution container 24, the glue liquid can be first stored in the glue storage container 21 and then flow into the distribution container 24, and finally flow out from the distribution container 24. When the glue liquid flows from the glue storage container 21 into the distribution container 24, the flow state of the glue liquid has a phenomenon of disturbing the glue liquid, thereby avoiding the phenomenon of solidification and stratification of the glue liquid.

[0093] In some embodiments, baffles 28 are provided on both sides of the positioning groove 27 , so as to assist in positioning the electronic device 03 when the electronic device 03 is located on the positioning groove 27 .

[0094] In some embodiments, the vacuum cover 11 is made of a transparent material to facilitate observation of the grouting status.

[0095] In some embodiments, the activity mode of driving the linkage includes mechanical energy or electrical energy.

[0096] In some embodiments, the glue outlet of the glue storage container 21 extends into the interior of the distribution container 24, which facilitates the rate at which the glue in the glue storage container 21 flows into the distribution container 24 and avoids the glue splashing when the glue in the glue storage container 21 flows into the distribution container 24.

[0097] In some embodiments, Figure 2As shown, the second support member 30 is connected to a mounting sleeve 31, which is sleeved on the outer periphery of the glue storage container 21. The outer periphery of the glue storage container 21 is provided with a mounting ring 22 that cooperates with the mounting sleeve 31, and the mounting ring 22 abuts against the mounting sleeve 31; or, as shown Figure 3 As shown, the mounting sleeve 31 is provided with a groove 32, and the mounting sleeve 31 is sleeved on the outer periphery of the glue storage container 21, and the outer periphery of the glue storage container 21 is provided with a convex ring that matches the groove 32. It is convenient for the glue storage container 21 to be connected and positioned through the mounting sleeve 31.

[0098] In some embodiments, there are at least two second support members 30 , one of which is connected to the linkage member, and the two support members are connected to the mounting sleeve 31 to provide reliability in supporting the glue storage container 21 .

[0099] In some embodiments, the base 26 is mounted on the base 12 through the third support member 33, and there is a distance between the bases 12 and the base 12. The positioning groove 27 is a through hole on the base 26. The setting of the distance facilitates the electronic device 03 to be inserted into the positioning groove 27, which is convenient for easy cleaning when the potting device 02 may drop glue during operation. Preferably, the third support member 33 is a plurality of bolts, and the base 26 is mounted on the base 12 through the plurality of bolts.

[0100] In some embodiments, the first distance is greater than a height of the electronic device 03 .

[0101] In some embodiments, the first support member 29 includes a support seat 291 and at least two support rods 292, the support rods 292 are connected to the support seat 291, the support seat 291 is provided with a support groove, the support groove is for accommodating the distribution container 24, the support groove is a through-opening structure, so that the distribution container 24 is formed in a state of being clamped in the support groove, and the glue delivery port 25 of the distribution container 24 extends out of the support groove.

[0102] According to one embodiment of the present invention, Figure 5 As shown, the discharging end of the distribution container 24 is of a conical structure, and the glue delivery port 25 is provided with a valve.

[0103] In this embodiment, the discharging end of the dispensing container 24 is in a conical structure to facilitate the outflow of the contained glue. The opening and closing of the glue outlet 25 can be controlled by the inventive arrangement.

[0104] In some embodiments, the dispensing container 24 is a rectangular cavity structure, and the discharge end is a conical structure.

[0105] According to one embodiment of the present invention, Figure 2 , Figure 3 , Figure 6As shown, the lower end of the glue storage container 21 is of a conical structure, and the glue outlet of the glue storage container 21 is located at the bottom of the glue storage container 21. The piston 23 includes a first conical portion, a cylindrical portion, and a second conical portion connected in sequence. The direction of the cone end of the first conical portion is opposite to the direction of the cone end of the second conical portion. The first conical portion is connected to the linkage. The first cross-sectional area of ​​the cylindrical portion is larger than the second cross-sectional area of ​​the glue outlet. When the piston 23 abuts against the inner circumferential wall of the glue storage container 21, the first cross-sectional area covers the second cross-sectional area, and the second conical portion is located at the glue delivery port 25.

[0106] In this embodiment, the lower end of the glue storage container 21 is in a conical structure and guides the stored glue to flow out. The first conical portion and the second conical portion are provided to increase the separation efficiency between the glue and the piston 23 and reduce the amount of liquid attached to the piston 23. The cross-section of the cylindrical portion is provided to facilitate opening and blocking the glue delivery port 25.

[0107] In some embodiments, the first conical portion, the cylindrical portion, and the second conical portion are coaxial, so that when the linkage member drives the piston 23 to move, the piston 23 is guided to move toward the glue delivery port 25 through the second conical portion.

[0108] In some embodiments, the inner wall of the glue storage container 21 is provided with a first inclined contact surface, and the piston 23 is provided with a second inclined contact surface that matches the first inclined contact surface. This embodiment provides a structural arrangement of the piston 23, which facilitates opening and blocking the glue delivery port 25 through the piston 23.

[0109] According to one embodiment of the present invention, Figure 2 and Figure 3 As shown, the connecting member includes a first connecting rod 341 and a second connecting rod 342, one end of the first connecting rod 341 is connected to the driving member outside the vacuum cover 11, the other end of the first connecting rod 341 is rotatably connected to the first end of the second connecting rod 342, the second end of the second connecting rod 342 is connected to the piston 23 away from the first connecting rod 341, the second end of the second connecting rod 342 is rotatably connected to the second support member 30 close to the first connecting rod 341, and the first connecting rod 341 is slidably connected to the second support member 30.

[0110] In this embodiment, the first linkage rod 341 and the second linkage rod 342 are rotatably connected, and the second linkage rod 342 is also rotatably connected to the second support member 30. At the same time, the second linkage rod 342 is supported by the second support member 30, so that the second linkage rod 342 uses the second support member 30 as a fulcrum, and the second linkage rod 342 can swing. The central axis of the first linkage rod 341 forms an angle with the central axis of the second linkage rod 342, and the central axis of the second linkage rod 342 forms an angle with the central axis of the piston 23. The central axis of the first linkage rod 341 is parallel to the central axis of the piston 23, so that when the driving member drives the first linkage rod 341 to move, the first linkage rod 341 drives the second linkage rod 342 to move, and the second linkage rod 342 drives the piston 23 to rise or fall. In this embodiment, the driving member can be a telescopic member, and one end of the first linkage rod 341 extends out of the bottom of the vacuum cover 11 and is connected to the output end of the telescopic member, so that the telescopic member drives the first linkage rod 341 to move.

[0111] In some embodiments, the second connecting rod 342 is provided with a first rotating shaft and a second rotating shaft, the first connecting rod 341 is provided with a first rotating hole, the second supporting member 30 is provided with a second rotating hole, the first rotating shaft is rotatably connected to the first rotating hole, and the second rotating shaft is rotatably connected to the second rotating hole.

[0112] In some embodiments, the second linkage rod 342 is connected to the piston 23 via a traction rope, and the piston 23 is in a freely hanging state.

[0113] According to one embodiment of the present invention, the second support member 30 is provided with a cavity slide for sliding the first connecting rod 341 , and all first connecting rods 341 and the cavity slide wall of the second support member 30 have a second spacing, and the second spacing is within a preset spacing range.

[0114] In this embodiment, one end of the first connecting rod 341 extends from the cavity slide to the bottom of the vacuum cover 11 and is connected to the driving member. By setting the second spacing within the preset spacing range, the first connecting rod 341 is easy to slide in the cavity slide, while avoiding the second spacing being too large to affect the vacuum environment inside the vacuum cover 11.

[0115] Preferably, the preset spacing is less than 0.5 mm.

[0116] In some embodiments, the cavity slide is provided with a slider extending in the vertical direction, and the peripheral wall of the first connecting rod 341 is provided with a sliding groove cooperating with the slider, so that when the first connecting rod 341 slides relative to the cavity slide to drive the second connecting rod 342 to lift the piston 23, the sliding groove limits the slider in the horizontal direction to avoid deflection and further improve the structural stability.

[0117] According to an embodiment of the present invention, a limiting plate is disposed at one end of the first connecting rod 341 close to the second connecting rod 342 .

[0118] In this embodiment, the limit plate is provided to limit the maximum rising height of the piston 23. Specifically, when the first linkage rod 341 slides downward relative to the cavity slideway, the limit plate abuts against the top of the second support member 30 to prevent the first linkage rod 341 from sliding downward.

[0119] According to one embodiment of the present invention, Figure 4 As shown, the positioning groove 27 is used to position the electronic device 03, the glue inlet of the electronic device 03 is connected to the glue delivery port 25 through a first pipeline, and the exhaust port of the electronic device 03 is connected to the second pipeline 04, the second pipeline 04 is made of a transparent material, and the second pipeline 04 has a preset length.

[0120] In this embodiment, the second pipeline 04 is made of a transparent material, so that when the electronic device 03 is potted, it is easy to observe whether there is glue through the second pipeline 04. The second pipeline 04 has a preset length to ensure that the second pipeline 04 can accommodate enough glue to avoid overflow of glue from the second pipeline 04, thereby maintaining a clean working environment.

[0121] In some embodiments, the first pipeline is made of a transparent material, which facilitates the detection of whether there is glue flowing through the first pipeline and whether the glue in the first pipeline is in a flowing state.

[0122] Those skilled in the art will appreciate that the above-mentioned embodiments are specific examples for implementing the present disclosure, and in actual applications, various changes may be made thereto in form and detail without departing from the scope of the present disclosure.

Claims

1. A method for encapsulating electronic devices against high overload, characterized in that: The steps include: The gap outside the electronic device is sealed to reserve a glue inlet and an exhaust port for the electronic device; The electronic device is mounted on a base, with the opening directions of the glue inlet and the exhaust port facing upwards; Prepare potting glue; Placing the potting glue in a glue storage container; Evacuate the vacuum hood; In a vacuum environment when the first vacuum pressure in the vacuum cover drops to a second vacuum pressure, the glue outlet of the glue storage container is opened, and the potting glue flows into the distribution container; when the potting glue in the distribution container reaches a preset capacity, the glue outlet is closed, and the glue delivery port of the distribution container is opened, and the potting glue flows into the interior of the electronic device through the glue delivery port and the glue inlet in sequence; When the potting glue flows out of the exhaust port, the third vacuum pressure is maintained for a first time, and the glue feeding port is closed; Pressure relief; After the potting glue in the electronic device is cured for a second time, the glue inlet and the exhaust port are blocked to obtain a target electronic device.

2. The method for encapsulating an electronic device against high overload according to claim 1, characterized in that: The potting glue includes AB type glue and adhesive glue, and the mass ratio of the AB type glue to the adhesive glue is 4:

1.

3. The method for encapsulating an electronic device against high overload according to claim 2, characterized in that: The AB type glue includes A type glue and B type glue, and the mass ratio of the A type glue to the B type glue is 1:1; the attachment glue includes silicone rubber adhesive.

4. The method for encapsulating an electronic device against high overload according to claim 1, characterized in that: The particle size of the potting glue is ≤20 μm, and the viscosity of the potting glue is ≤3500 mPa.s.

5. The method for encapsulating an electronic device against high overload according to claim 1, characterized in that: When the glue delivery port is closed, the distribution container has a first residual amount of potting glue, and the exhaust port has a second residual amount of potting glue.

6. An electronic device high overload resistance potting system, characterized in that: include: Filling equipment and vacuum equipment; The vacuum equipment comprises a vacuum cover, a base and a pressure regulator, wherein the vacuum cover is mounted on the base, and the output end of the pressure regulator is connected to the vacuum cover; The potting equipment is located in the vacuum cover; The potting equipment includes a glue storage container, a piston, a distribution container, a base, a first support member, a second support member, and a linkage member; The base, the distribution container, the glue storage container and the piston are arranged in sequence along the y-axis direction from bottom to top, the base is installed on the base, the first support member and the second support member are fixed to the base, the distribution container is connected to the first support member, the distribution container and the base have a first spacing, the glue storage container is connected to the second support member, the glue storage container is communicated with the distribution container, the piston is connected to the linkage member, the linkage member is rotatably connected with the second support member, and the linkage member drives the piston away from or close to the glue storage container when it moves, and when the piston abuts against the inner peripheral wall of the glue storage container, the passage connecting the glue storage container and the distribution container is blocked; The base is provided with n positioning grooves, and the bottom of the dispensing container is provided with m glue delivery ports, wherein n and m are natural numbers, and n≥m≥1.

7. The electronic device high overload resistance potting system according to claim 6, characterized in that: The discharging end of the distribution container is in a conical structure, and the glue delivery port is provided with a valve.

8. The electronic device high overload resistance potting system according to claim 6, characterized in that: The lower end of the glue storage container is in a conical structure, and the glue outlet of the glue storage container is located at the bottom of the glue storage container. The piston includes a first conical portion, a cylindrical portion and a second conical portion connected in sequence. The cone end of the first conical portion faces a direction opposite to that of the cone end of the second conical portion. The first conical portion is connected to the linkage. The first cross-sectional area of ​​the cylindrical portion is larger than the second cross-sectional area of ​​the glue outlet. When the piston abuts against the inner circumferential wall of the glue storage container, the first cross-sectional area covers the second cross-sectional area, and the second conical portion is located at the glue delivery port.

9. The electronic device high overload resistance potting system according to claim 6, characterized in that: The connecting member includes a first connecting rod and a second connecting rod, one end of the first connecting rod is connected to the driving member outside the vacuum cover, the other end of the first connecting rod is rotatably connected to the first end of the second connecting rod, the second end of the second connecting rod is connected to the piston away from the first connecting rod, the second end of the second connecting rod is rotatably connected to the second support member close to the first connecting rod, and the first connecting rod is slidably connected to the second support member.

10. The electronic device high overload resistance potting system according to claim 9, characterized in that: The second support member is provided with a cavity slideway for the first connecting rod to slide, and all the first connecting rods and the wall surface of the cavity slideway of the second support member have a second spacing, and the second spacing is within a preset spacing range.

11. The electronic device high overload resistance potting system according to claim 9, characterized in that: A limiting plate is arranged at one end of the first connecting rod close to the second connecting rod.

12. The electronic device high overload resistance potting system according to claim 6, characterized in that: The positioning groove is used for positioning the electronic device. The glue inlet of the electronic device is connected to the glue delivery port through a first pipeline. The exhaust port of the electronic device is connected to a second pipeline. The second pipeline is made of a transparent material and has a preset length.

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