Laser cutting device for integrated circuit board production

Abstract

The present invention relates to the technical field of integrated circuit board production, and in particular to a laser cutting device for integrated circuit board production, comprising a clamping assembly, wherein the clamping assembly comprises a base plate, a movable plate connected to the base plate, a first transmission member arranged at the upper end of the base plate, a second transmission member cooperating with the first transmission member, a limit frame fixedly connected to one side of the movable plate, and a pressing block connected to the limit frame. The device of the present invention places the integrated circuit board on a support plate between two movable plates, and the pressing block can press and limit the integrated circuit board during the integrated circuit board cutting process, and the pressing block will not cause friction damage to the integrated circuit board during the cutting process, and does not require workers to hold the circuit board for manual cutting, thus avoiding the circuit board from shifting during the cutting process. At the same time, the pressing block gradually leaves the circuit board after the cutting of the circuit board is completed, and the circuit board can slide down the inclined groove for collection after the cutting is completed, which has better practicality.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit board production, in particular to a laser cutting device for integrated circuit board production. Background Art

[0002] Integrated circuit boards (ICs) are manufactured using semiconductor technology, with numerous transistors, resistors, capacitors, and other components fabricated on a small single-crystal silicon wafer. These components are then combined into a complete electronic circuit using multilayer wiring or tunnel wiring. ICs are primarily made of silicone, hence their typically green color. Circuit boards made of different materials have varying characteristics and are used in different applications.

[0003] Integrated circuit boards need to be cut during the reproduction process. Most integrated circuit boards are rectangular, so larger integrated circuit boards need to be cut into multiple regular rectangles during the reproduction process. However, when manually holding the circuit board for cutting, the circuit board may shift during the process, resulting in cutting errors, which is less practical. Summary of the Invention

[0004] In view of the above problems existing in the prior art, the present invention is proposed.

[0005] Therefore, the technical problem to be solved by the present invention is that when manually holding a circuit board and cutting it, the circuit board may shift during the process, resulting in cutting errors, which has poor practicality.

[0006] In order to solve the above technical problems, the present invention provides the following technical solutions: A laser cutting device for integrated circuit board production, comprising a laser cutting machine and a clamping assembly, wherein the clamping assembly includes a substrate, a movable plate connected to the substrate, a first transmission member arranged at the upper end of the substrate, a second transmission member cooperating with the first transmission member, a limit frame fixedly connected to one side of the movable plate, and a pressing block connected to the limit frame, and the laser cutting machine is installed at the upper end of the substrate.

[0007] As a preferred solution of the laser cutting device for integrated circuit board production described in the present invention, the substrate includes a slide and a first magnetic block, the slide is fixedly connected to the top of the substrate, the slide is symmetrically arranged along the center line of the substrate, and the first magnetic block is fixedly connected to the top of the substrate.

[0008] As a preferred solution of the laser cutting device for integrated circuit board production described in the present invention, wherein: the movable plate includes a sliding rod, a support plate, a baffle, an arc groove, a second magnetic block and a handle, the sliding rod is fixedly connected to the bottom of the movable plate, the sliding rod is slidably matched with the slide, the support plate is connected to the movable plate, the baffle is fixedly connected to one side of the support plate, the arc groove is opened on one side of the movable plate, the second magnetic block is fixedly connected to one side of the sliding rod, the first magnetic block is matched with the second magnetic block, and the handle is fixedly connected to the other side of the movable plate.

[0009] As a preferred solution of the laser cutting device for integrated circuit board production described in the present invention, the sliding bar includes a fixed block and a chain, the fixed block is fixedly connected to one side of the sliding bar, and one end of the chain is fixedly connected to one side of the fixed block.

[0010] As a preferred solution of the laser cutting device for integrated circuit board production described in the present invention, a connecting rod is fixedly connected to one side of the support plate, the connecting rod slides in conjunction with the arc groove, an inclined groove is provided at the connection between the baffle plate and the support plate, and a second torsion spring is fixedly connected between the baffle plate and the movable plate.

[0011] As a preferred solution of the laser cutting device for integrated circuit board production described in the present invention, wherein: the first transmission member includes a first limiting sleeve, a first sprocket, an annular plate and a first torsion spring, the first limiting sleeve is fixedly connected to the top of the substrate, one side of the first sprocket is rotatably connected to the first limiting sleeve, the annular plate is fixedly connected to the top of the substrate, and the first torsion spring is fixedly connected between the annular plate and the other side of the first sprocket.

[0012] As a preferred solution of the laser cutting device for integrated circuit board production described in the present invention, the second transmission member includes a second limiting sleeve and a second sprocket, the second limiting sleeve is fixedly connected to the top of the substrate, and one side of the second sprocket is rotatably connected to the second limiting sleeve.

[0013] As a preferred solution of the laser cutting device for integrated circuit board production described in the present invention, the chain is provided with a plurality of matching grooves for engaging with the first sprocket and the second sprocket, and the other end of the chain is fixedly connected to the top of the pressing block.

[0014] As a preferred solution of the laser cutting device for integrated circuit board production described in the present invention, the limit frame includes a first spring and a displacement rod, one end of the first spring is fixedly connected to the bottom of the inner wall of the limit frame, the displacement rod is fixedly connected to the other end of the first spring, the displacement rod is slidably connected to the limit frame, and one side of the displacement rod is fixedly connected to the pressing block.

[0015] As a preferred solution of the laser cutting device for integrated circuit board production described in the present invention, the pressing block includes a through slot, an axle rod and a rolling wheel, the through slot is opened at the bottom of the pressing block, the axle rod is rotatably connected to the inner wall of the through slot, and the rolling wheel is fixedly connected to the circumferential surface of the axle rod.

[0016] The beneficial effects of the present invention are as follows: the integrated circuit board is placed on the supporting plate between the two movable plates, and the pressing block can press and limit the integrated circuit board during the integrated circuit board cutting process, and the pressing block will not cause friction damage to the integrated circuit board during the cutting process, and workers do not need to hold the circuit board for manual cutting, which avoids the circuit board from shifting during the cutting process. At the same time, after the circuit board cutting is completed, the pressing block gradually leaves the circuit board, and the circuit board can slide along the inclined groove for collection after the cutting is completed, which has better practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort. Among them:

[0018] Figure 1 A schematic diagram of the overall structure of a laser cutting device for integrated circuit board production according to an embodiment of the present invention;

[0019] Figure 2 A schematic diagram of the overall structure of a laser cutting device for integrated circuit board production according to an embodiment of the present invention from another angle;

[0020] Figure 3 A schematic side view of a laser cutting device for producing integrated circuit boards according to an embodiment of the present invention;

[0021] Figure 4 A schematic diagram of the chain structure of a laser cutting device for integrated circuit board production according to an embodiment of the present invention;

[0022] Figure 5 This is an enlarged schematic diagram of the structure of a laser cutting device G for integrated circuit board production according to an embodiment of the present invention;

[0023] Figure 6 This is an enlarged schematic diagram of the structure of a laser cutting device H for integrated circuit board production according to an embodiment of the present invention;

[0024] Figure 7This is an enlarged schematic diagram of the structure of a laser cutting device K for integrated circuit board production according to an embodiment of the present invention;

[0025] Figure 8 This is an enlarged schematic diagram of the Z structure of a laser cutting device for integrated circuit board production according to an embodiment of the present invention;

[0026] Figure 9 This is a schematic diagram of the structure of an elastic member in a laser cutting device for producing integrated circuit boards according to an embodiment of the present invention. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0028] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] Next, the present invention is described in detail with reference to schematic diagrams. For ease of illustration, when describing embodiments of the present invention, cross-sectional views illustrating device structures may be partially enlarged and not to scale. Furthermore, these schematic diagrams are merely illustrative and should not limit the scope of protection of the present invention. Furthermore, in actual production, three-dimensional dimensions, including length, width, and depth, should be included.

[0030] Furthermore, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it refer to a separate or selective embodiment that is mutually exclusive with other embodiments.

[0031] Example 1

[0032] Reference Figure 1 - Figure 8 This embodiment provides a laser cutting device for integrated circuit board production, including a laser cutting machine and a clamping assembly 100. The clamping assembly 100 includes a substrate 101, a movable plate 102 connected to the substrate 101, a first transmission member 103 arranged at the upper end of the substrate 101, a second transmission member 104 cooperating with the first transmission member 103, a limit frame 105 fixedly connected to one side of the movable plate 102, and a pressing block 106 connected to the limit frame 105.

[0033] The laser cutting machine is installed on the upper end of the base plate 101 .

[0034] Furthermore, the base plate 101 includes a slide 101a and a first magnetic block 101b. The slide 101a is fixedly connected to the top of the base plate 101. The slide 101a is symmetrically arranged along the center line of the base plate 101. The first magnetic block 101b is fixedly connected to the top of the base plate 101.

[0035] Furthermore, the movable plate 102 includes a sliding rod 102a, a support plate 102b, a baffle 102c, an arc-shaped groove 102d, a second magnetic block 102e and a handle 102f. The sliding rod 102a is fixedly connected to the bottom of the movable plate 102, the sliding rod 102a slides with the slide 101a, the support plate 102b is connected to the movable plate 102, the baffle 102c is fixedly connected to one side of the support plate 102b, the arc-shaped groove 102d is opened on one side of the movable plate 102, the second magnetic block 102e is fixedly connected to one side of the sliding rod 102a, the first magnetic block 101b cooperates with the second magnetic block 102e, and the handle 102f is fixedly connected to the other side of the movable plate 102.

[0036] It should be noted that the first magnetic block 101b and the second magnetic block 102e are magnetically connected to ensure the stability of the device during the circuit board cutting process.

[0037] In addition, the handle 102f facilitates pushing the movable plate 102 to cut the circuit board.

[0038] Furthermore, the slide bar 102a includes a fixed block 102a-1 and a chain 102a-2. The fixed block 102a-1 is fixedly connected to one side of the slide bar 102a, and one end of the chain 102a-2 is fixedly connected to one side of the fixed block 102a-1.

[0039] Furthermore, the first transmission member 103 includes a first limiting sleeve 103a, a first sprocket 103b, an annular plate 103c and a first torsion spring 103d. The first limiting sleeve 103a is fixedly connected to the top of the base plate 101, one side of the first sprocket 103b is rotatably connected to the first limiting sleeve 103a, the annular plate 103c is fixedly connected to the top of the base plate 101, and the first torsion spring 103d is fixedly connected between the annular plate 103c and the other side of the first sprocket 103b.

[0040] Furthermore, the second transmission member 104 includes a second limiting sleeve 104a and a second sprocket 104b. The second limiting sleeve 104a is fixedly connected to the top of the base plate 101, and one side of the second sprocket 104b is rotatably connected to the second limiting sleeve 104a.

[0041] Furthermore, the chain 102a - 2 is provided with a plurality of matching grooves 102a - 2a that engage with the first sprocket 103b and the second sprocket 104b , and the other end of the chain 102a - 2 is fixedly connected to the top of the pressing block 106 .

[0042] Furthermore, the limit frame 105 includes a first spring 105a and a displacement rod 105b, one end of the first spring 105a is fixedly connected to the bottom of the inner wall of the limit frame 105, the displacement rod 105b is fixedly connected to the other end of the first spring 105a, the displacement rod 105b is slidingly connected to the limit frame 105, and one side of the displacement rod 105b is fixedly connected to the pressing block 106.

[0043] It should be noted that, during the process of the pressing block 106 being separated from the circuit board, the first spring 105 a is in a compressed state.

[0044] Furthermore, the pressing block 106 includes a through slot 106a, a shaft 106b and a rolling wheel 106c. The through slot 106a is opened at the bottom of the pressing block 106, the shaft 106b is rotatably connected to the inner wall of the through slot 106a, and the rolling wheel 106c is fixedly connected to the circumferential surface of the shaft 106b.

[0045] It should be noted that a rubber pad is provided on the circumferential surface of the rolling wheel 106 c , which can prevent the rolling wheel 106 c from making rigid contact with the circuit board, thereby providing better protection for the circuit board.

[0046] During use, first push the movable plate 102 through the handle 102f. When the sliding rod 102a at the bottom of the movable plate 102 slides on the slide 101a, the chain 102a-2 can be pulled through the fixed block 102a-1. The chain can drive the first sprocket 103b to rotate, and the first sprocket 103b drives the first torsion spring 103d to compress. At this time, the chain 102a-2 drives the pressing block 106 to rise through the second sprocket 104b. At this time, the first spring 105a is compressed, and then the circuit board to be cut is placed on the support plate 102b, and the movable plate 102 is reset backward until the first magnetic block 101b and the second magnetic block 102e are magnetically connected. At this time, the pressing block 106 can press the circuit board.

[0047] Example 2

[0048] Reference Figure 1 - Figure 9 Based on the previous embodiment, this embodiment provides a laser cutting device for integrated circuit board production, wherein a connecting rod 102b-1 is fixedly connected to one side of the support plate 102b, the connecting rod 102b-1 slides in conjunction with the arc-shaped groove 102d, an inclined groove 102c-1 is provided at the connection between the baffle 102c and the support plate 102b, and a second torsion spring 102c-2 is fixedly connected between the baffle 102c and the movable plate 102.

[0049] It should be noted that the connecting rod 102b-1 slides in conjunction with the arc groove 102d, which enables the support plate 102b to have better pressure resistance when the pressing block 106 presses the circuit board, and the second torsion spring 102c-2 is in a compressed state when the pressing block 106 presses the circuit board.

[0050] in addition, Figure 1 - Figure 9 The structure in the figure is only used as a reference for mechanical transmission and is not a structural scale diagram of the final product.

[0051] Furthermore, an elastic member 107 is provided on the movable plate 102, and the elastic member 107 includes a pop-up plate 107a, a sloped block 107b, a connecting shaft 107c and a second spring 107d. The pop-up plate 107a is slidably connected to a first groove opened on one side of the movable plate 102, and the sloped block 107b is slidably connected to a second groove opened on one side of the slide rod 102a. The first groove and the second groove are connected through a third groove. The connecting shaft 107c is fixedly connected between the pop-up plate 107a and the sloped block 107b, and the second spring 107d is fixedly connected between the connecting shaft 107c and the inner wall of the third groove.

[0052] It should be noted that when the movable plate 102 is pushed, the inclined surface of the inclined block 107b contacts the slide 101a and gradually squeezes into the second groove, thereby driving the second spring 107d to compress. At this time, the pop-up plate 107a enters the first groove and will not affect the movement of the support plate 102b. When the movable plate 102 is reset, the second spring 107d is also reset. At this time, the pop-up plate 107a can pop out, thereby pushing the cut circuit board, so that the cut circuit board can better slide through the inclined groove 102c-1 to the collection device at the bottom.

[0053] When in use, first push the movable plate 102 through the handle 102f. When the slide bar 102a at the bottom of the movable plate 102 slides on the slide 101a, it can pull the chain 102a-2 through the fixed block 102a-1. The chain can drive the first sprocket 103b to rotate. The first sprocket 103b drives the first torsion spring 103d to compress. At this time, the chain 102a-2 drives the pressing block 106 to rise through the second sprocket 104b. At this time, the first spring 105a is compressed. Then the circuit board to be cut is placed on the support plate 102b, and the movable plate 102 is reset backward until the first magnetic block 101 b is magnetically connected to the second magnetic block 102e. At this time, the pressing block 106 can press the circuit board. After the entire block is cut, continue to push the movable plate 102 forward. At this time, the rolling wheel 106b rolls on the circuit board, and the pressing block 106 gradually rises. The second torsion spring 102c-2 is reset, which can drive the support plate 102b to gradually tilt. At this time, since the circuit board is cut into two halves, due to the thrust of the pop-up plate 107a on the circuit board after reset, the circuit board will slide along the inclined surface of the inclined groove 102c-1. After the cutting is completed, the circuit board can slide along the inclined groove to the collection device, which has better practicality.

[0054] It should be noted that the movable plate 102 can be automatically pushed by connecting the electric telescopic rod to the handle 102f.

[0055] It is important to note that the construction and arrangement of the present application shown in a number of different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, it should be readily understood by those who refer to this disclosure that many modifications are possible (e.g., the size, scale, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, directional changes, etc.) without departing substantially from the novel teachings and advantages of the subject matter described in this application. For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of the element may be inverted or otherwise changed, and the nature or number or position of the discrete elements may be altered or changed. Therefore, all such modifications are intended to be included within the scope of the present invention. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "means plus function" clause is intended to cover the structure described herein that performs the function, and is not only structurally equivalent but also equivalent structures. Other replacements, modifications, changes, and omissions may be made in the design, operating conditions, and arrangement of the exemplary embodiments without departing from the scope of the present invention. Therefore, the invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0056] Additionally, in order to provide a concise description of exemplary embodiments, all features of an actual embodiment (ie, those features that are not relevant to the best mode presently contemplated for carrying out the invention or those that are not relevant to implementing the invention) may not be described.

[0057] It will be appreciated that in the development of any actual embodiment, as in any engineering or design project, numerous implementation-specific decisions may be made. Such a development effort may be complex and time-consuming, but will, for those of ordinary skill having the benefit of this disclosure, be a routine undertaking of design, fabrication, and production without undue experimentation.

[0058] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A laser cutting device for integrated circuit board production, characterized in that: include, Laser cutting machine and pressing assembly (100); The clamping assembly (100) includes a base plate (101), a movable plate (102) connected to the base plate (101), a first transmission member (103) arranged at the upper end of the base plate (101), a second transmission member (104) cooperating with the first transmission member (103), a limit frame (105) fixedly connected to one side of the movable plate (102), and a pressing block (106) connected to the limit frame (105), and the laser cutting machine is installed at the upper end of the base plate (101); The substrate (101) comprises a slide (101a) and a first magnetic block (101b), wherein the slide (101a) is fixedly connected to the top of the substrate (101), the slide (101a) is symmetrically arranged along the center line of the substrate (101), and the first magnetic block (101b) is fixedly connected to the top of the substrate (101); The movable plate (102) includes a slide bar (102a), a support plate (102b), a baffle (102c), an arc groove (102d), a second magnetic block (102e) and a handle (102f), wherein the slide bar (102a) is fixedly connected to the bottom of the movable plate (102), the slide bar (102a) is slidably matched with the slide table (101a), the support plate (102b) is connected to the movable plate (102), the baffle (102c) is fixedly connected to one side of the support plate (102b), the arc groove (102d) is opened on one side of the movable plate (102), the second magnetic block (102e) is fixedly connected to one side of the slide bar (102a), the first magnetic block (101b) is matched with the second magnetic block (102e), and the handle (102f) is fixedly connected to the other side of the movable plate (102); The sliding rod (102a) comprises a fixed block (102a-1) and a chain (102a-2), wherein the fixed block (102a-1) is fixedly connected to one side of the sliding rod (102a), and one end of the chain (102a-2) is fixedly connected to one side of the fixed block (102a-1); The first transmission member (103) comprises a first limiting sleeve (103a), a first sprocket (103b), an annular plate (103c) and a first torsion spring (103d), wherein the first limiting sleeve (103a) is fixedly connected to the top of the base plate (101), one side of the first sprocket (103b) is rotatably connected to the first limiting sleeve (103a), the annular plate (103c) is fixedly connected to the top of the base plate (101), and the first torsion spring (103d) is fixedly connected between the annular plate (103c) and the other side of the first sprocket (103b); The second transmission member (104) comprises a second limiting sleeve (104a) and a second sprocket (104b), wherein the second limiting sleeve (104a) is fixedly connected to the top of the base plate (101), and one side of the second sprocket (104b) is rotatably connected to the second limiting sleeve (104a); The chain (102a-2) is provided with a plurality of matching grooves (102a-2a) that engage with the first sprocket (103b) and the second sprocket (104b), and the other end of the chain (102a-2) is fixedly connected to the top of the pressing block (106).

2. The laser cutting device for integrated circuit board production according to claim 1, characterized in that: A connecting rod (102b-1) is fixedly connected to one side of the support plate (102b), the connecting rod (102b-1) is slidably engaged with the arc-shaped groove (102d), an inclined groove (102c-1) is provided at the connection between the baffle plate (102c) and the support plate (102b), and a second torsion spring (102c-2) is fixedly connected between the baffle plate (102c) and the movable plate (102).

3. The laser cutting device for integrated circuit board production according to claim 2, characterized in that: The limit frame (105) includes a first spring (105a) and a displacement rod (105b), one end of the first spring (105a) is fixedly connected to the bottom of the inner wall of the limit frame (105), and the displacement rod (105b) is fixedly connected to the other end of the first spring (105a). The displacement rod (105b) is slidably connected to the limit frame (105), and one side of the displacement rod (105b) is fixedly connected to the pressing block (106).

4. The laser cutting device for integrated circuit board production according to claim 3, characterized in that: The pressing block (106) comprises a through slot (106a), a shaft (106b) and a rolling wheel (106c), wherein the through slot (106a) is opened at the bottom of the pressing block (106), the shaft (106b) is rotatably connected to the inner wall of the through slot (106a), and the rolling wheel (106c) is fixedly connected to the circumferential surface of the shaft (106b).

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