Bonding device

Abstract

The present invention provides a bonding device capable of preventing bending deformation of a plate assembly and suppressing an increase in a conductive contact area, thereby improving a bonding effect. An engagement device for engaging a plate assembly including a first plate and a second plate includes an anvil, a probe, a shoulder member, a drive mechanism, a power source, and a control component. The anvil is configured to support a first surface of the plate assembly provided by the first plate. The probe is disposed at a position corresponding to the anvil opposite a second surface of the plate assembly provided by the second plate. The shoulder member is disposed around the probe, and has a through-hole through which the probe passes, and a contact surface for pressing the second surface. Wherein the anvil has a hemispherical surface facing the first surface and at least partially conductive, and a receiving surface disposed at a position corresponding to the abutment surface of the shoulder member and at least partially insulated, and the anvil contacts the first surface with the hemispherical surface and the receiving surface.

Description

Technical Field

[0001] The invention relates to a joining device. Background Art

[0002] In the prior art, as methods for joining multiple metal sheets, resistance welding and friction stir joining can be cited, which can suppress gas generation more than general joining methods and can reduce the negative environmental impact on air quality. In addition, friction stir joining consumes less electricity than general joining methods, which helps to improve energy efficiency during manufacturing. Among them, when three or more metal sheets made of different materials are joined by resistance welding, it is difficult to maintain a stable joining strength for a long time. Friction stir joining is limited by the range of materials that can be effectively stirred and is not suitable for joining three or more metal sheets. Therefore, a joining technology that uses resistance welding and friction stir joining to join three or more metal sheets has also been developed (such as patent document 1).

[0003] In such a joining device, when a plate assembly consisting of a plurality of metal plates is placed between an anvil and a probe of the joining device to be joined by energizing, both ends of the plate assembly are easily bent and deformed by the abutment of shoulder members provided around the probe, thereby increasing the conductive contact area between the bent and deformed plate assembly and the anvil (i.e., expanding the current path). At this time, it may be difficult to generate a nugget for joining, resulting in difficulty in improving the joining effect.

[0004] In view of the above problems of the prior art, the main purpose of the present invention is to provide a bonding device that can prevent the bending deformation of the plate assembly and suppress the increase of the conductive contact area, thereby improving the bonding effect. In addition, it is expected to help reduce the environmental impact on the air and improve the energy efficiency during manufacturing.

[0005] [Prior art literature]

[0006] [Patent Document]

[0007] [Patent Document 1] Japanese Patent Publication No. 2023-013804 Summary of the invention

[0008] The present invention provides a bonding device which can prevent bending deformation of a plate assembly and suppress the increase of a conductive contact area, thereby improving the bonding effect.

[0009] The present invention provides a joining device, which is used to join a plate assembly including a first plate member and a second plate member configured to abut against the first plate member, and includes: an anvil, configured to support the first surface of the plate assembly provided by the first plate member; a probe, configured at a position corresponding to the anvil and opposite to the second surface of the plate assembly provided by the second plate member; a shoulder member, configured around the probe and having a through hole for the probe to pass through, and an abutment surface for pressing the second surface; a driving mechanism, configured to rotate the probe around a central axis intersecting the second surface and advance or retreat along the central axis toward the second plate member; a power source, electrically connecting the anvil and the shoulder member so that current flows between the anvil and the shoulder member through the plate assembly; and a control component, controlling the operation of the driving mechanism and the power source, wherein the anvil has a hemispherical surface facing the first surface and being at least partially conductive, and a receiving surface configured at a position corresponding to the abutment surface of the shoulder member and being at least partially insulated, and the anvil contacts the first surface with the hemispherical surface and the receiving surface.

[0010] In one embodiment of the present invention, the anvil includes a handle component, a top component, and a receiving component, the handle component has a tapered portion at the front end, the top component has the hemispherical surface at the front end portion, and has a locking portion on the inner surface of the base end portion that is engaged with the tapered portion, the receiving component surrounds the outer surface of the top component and overlaps with the tapered portion in the width direction, and has the receiving surface at the front end portion.

[0011] In one embodiment of the present invention, the handle member has an edge portion located below the tapered portion, the top member is mounted on the handle member, and a lower end portion of the top member abuts against the edge portion of the handle member.

[0012] In one embodiment of the present invention, the receiving part includes a receiving portion and a retaining portion, the receiving portion has the receiving surface in contact with the first plate, the retaining portion surrounds the receiving portion and engages with the handle part, and the receiving portion and the retaining portion are separate components respectively provided.

[0013] Based on the above, in the joining device of the present invention, the anvil has a hemispherical surface that faces the first surface of the first plate and is at least partially conductive, and a receiving surface that is arranged at a position corresponding to the abutment surface of the shoulder component and is at least partially insulated, and the anvil contacts the first surface with the hemispherical surface and the receiving surface. In this way, the anvil in the joining device reduces the conductive contact area with the first plate via the hemispherical surface, and at the same time receives the load from the shoulder component during the joining process via the receiving surface, thereby preventing the conductive contact area between the plate assembly and the anvil from increasing due to the bending deformation of the plate assembly (i.e., preventing the current path from expanding), and can fully generate a molten core for joining by energizing. Accordingly, the joining device of the present invention can prevent the bending deformation of the plate assembly and suppress the increase of the conductive contact area, thereby improving the joining effect.

[0014] In order to make the above features and advantages of the present invention more clearly understood, embodiments are given below with reference to the accompanying drawings for detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a cross-sectional schematic diagram of a joining device according to an embodiment of the present invention used to join a plate assembly including a first plate member and a second plate member;

[0016] Figure 2 yes Figure 1 A partial enlarged schematic diagram of the bonding device during the bonding process is shown;

[0017] Figure 3 yes Figure 1 A schematic cross-sectional view of an anvil used in the bonding device is shown.

[0018] Description of Reference Numerals

[0019] 100: joining device;

[0020] 110: anvil;

[0021] 110a: hemispherical surface;

[0022] 110b: receiving surface;

[0023] 112: handle component;

[0024] 112a: flow path;

[0025] 112b: tapered portion;

[0026] 112c: margin;

[0027] 114: top part;

[0028] 114a: snap-fitting portion;

[0029] 114b: lower end portion;

[0030] 116: Accepting parts;

[0031] 116a: receiving part;

[0032] 116b: holding part;

[0033] 120: probe;

[0034] 130: shoulder member;

[0035] 132: through hole;

[0036] 134: abutment surface;

[0037] 140: driving mechanism;

[0038] 142: Rotation drive mechanism;

[0039] 144: forward / reverse driving mechanism;

[0040] 150: Power supply;

[0041] 160: control components;

[0042] C: central axis;

[0043] P: plate assembly;

[0044] P1: first plate;

[0045] P2: second plate;

[0046] P3: middle plate;

[0047] R1, R2: region;

[0048] S1: first surface;

[0049] S2: Second surface. DETAILED DESCRIPTION

[0050] Reference will now be made in detail to exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Figure 1 is a cross-sectional schematic diagram of a joining device according to an embodiment of the present invention used to join a plate assembly including a first plate member and a second plate member, Figure 2 yes Figure 1 The enlarged schematic diagram of the bonding device during the bonding process is shown in FIG. Figure 3 yes Figure 1 The cross-sectional view of the anvil used in the bonding device shown in FIG. Figures 1 to 3100 and its operation method are described below. In the following description, the joining device 100 conducts joining by energizing the panel assembly P in a vertical direction, but the direction is merely exemplary, and the present invention can be applied to panel assemblies oriented in any desired direction and from any desired direction, such as laterally, upwardly, and obliquely, without departing from the scope of the present invention. The present invention does not limit the processing method of the joining device 100 for joining the panel assembly P, which can be adjusted according to the needs.

[0051] Please refer to Figure 1 In this embodiment, the joining device 100 is used to join a plate assembly P including a first plate member P1 and a second plate member P2 configured to abut against the first plate member P1. The first plate member P1 and the second plate member P2 in the plate assembly P extend along a horizontal plane, and the plate assembly P may include more plates (for example, an intermediate plate member P3 sandwiched between the first plate member P1 and the second plate member P2) according to requirements. In addition, the plates in the plate assembly P are all conductive plates made of metal materials. The first plate member P1 and the intermediate plate member P3 may be made of the same material or similar materials, while the second plate member P2 may be made of different or dissimilar materials. Furthermore, the materials of the first plate member P1 and the intermediate plate member P3 have higher strength and higher resistance than the materials of the second plate member P2. For example, the first plate member P1 and the intermediate plate member P3 are iron plates, and the second plate member P2 is an aluminum plate. However, the present invention does not limit the number and material of the plates in the plate assembly P, which can be adjusted according to requirements.

[0052] Furthermore, in this embodiment, if Figure 1As shown, the joining device 100 includes an anvil 110, a probe 120, a shoulder member 130, a driving mechanism 140, a power supply 150, and a control component 160. The anvil 110 is configured to support a first surface S1 of the plate assembly P provided by the first plate member P1. The probe 120 is configured at a position corresponding to the anvil 110 (for example, above), and is opposite to a second surface S2 of the plate assembly P provided by the second plate member P2. The shoulder member 130 is configured around the probe 120 (for example, an annular member surrounding the probe 120), and has a through hole 132 for the probe 120 to pass through, and an abutment surface 134 for pressing the second surface S2. The driving mechanism 140 is configured to rotate the probe 120 around a central axis C intersecting the second surface S2, and to advance or retreat along the central axis C toward the second plate member P2. The power source 150 electrically connects the anvil 110 and the shoulder member 130 so that current flows between the anvil 110 and the shoulder member 130 through the plate assembly P. The control component 160 controls the operation of the driving mechanism 140 and the power source 150. Furthermore, the anvil 110 has a semi-spherical surface 110a facing the first surface S1 and at least partially conductive, and a receiving surface 110b arranged at a position corresponding to the abutting surface 134 of the shoulder member 130 and at least partially insulated, and the anvil 110 contacts the first surface S1 with the semi-spherical surface 110a and the receiving surface 110b.

[0053] Specifically, in this embodiment, if Figure 1 As shown, at least a portion of the anvil 110 (e.g., a portion corresponding to the hemispherical surface 110a) is made of a conductive material, so that the anvil 110 can abut against the first surface S1 of the plate assembly P provided by the first plate member P1 with the at least partially conductive hemispherical surface 110a. In addition, at least a portion of the anvil 110 (e.g., a portion corresponding to the receiving surface 110b) is made of an insulating material, so that the anvil 110 can abut against the first surface S1 of the plate assembly P provided by the first plate member P1 with the at least partially insulating receiving surface 110b. Accordingly, the probe 120 is arranged above the anvil 110 and corresponds to the anvil 110, and extends along the central axis C. The probe 120 is made of a hard material and preferably has a cylindrical shape (the center of the circle corresponds to the central axis C). Furthermore, the probe 120 is connected to the driving mechanism 140, so that it can rotate around the central axis C and move forward or backward along the central axis C toward the second plate P2 (i.e., move up and down in the vertical direction) through the driving of the driving mechanism 140. However, the present invention does not limit the specific structure of the anvil 110 and the probe 120, which can be adjusted according to needs.

[0054] In addition, in this embodiment, Figure 1As shown, the shoulder member 130 has a shape that is rotationally symmetrical about the central axis C, and is arranged above the anvil 110 and surrounds the probe 120. A through hole 132 is provided in the middle portion of the shoulder member 130, and a contact surface 134 is formed at the lower end portion. The shoulder member 130 can be made of a hard material, but is not limited to this. The through hole 132 is arranged along the central axis C, and preferably has a circular hole shape. The inner diameter of the through hole 132 is larger than the outer diameter of the probe 120. When the probe 120 is driven by the driving mechanism 140 to move toward the second plate P2, the probe 120 passes through the through hole 132 (such as Figure 1 As shown in the figure, the through hole 132 is concentrically separated from the probe 120. Moreover, the probe 120 can also rotate along the central axis C. Here, although the probe 120 and the shoulder member 130 are illustrated as components separated from each other, the shoulder member 130 can also be provided with a support structure for supporting the probe 120 (that is, the shoulder member 130 is connected to the probe 120). Moreover, the inner diameter of the through hole 132 can be only slightly larger than the outer diameter of the probe 120, and when the probe 120 rotates around the central axis C, the inner circumferential surface of the through hole 132 can be in sliding contact with the outer circumferential surface of the probe 120. The present invention does not limit the specific structure of the shoulder member 130 and its connection relationship with the probe 120, which can be adjusted according to needs.

[0055] In addition, in this embodiment, Figure 1 As shown, the driving mechanism 140 includes a rotation driving mechanism 142 for rotating the probe 120 around the central axis C, and an advance / retract driving mechanism 144 for advancing or retreating the probe 120 along the central axis C. In addition, the driving mechanism 140 is controlled by the control component 160, thereby causing the probe 120 to rotate around the central axis C and advance or retreat along the central axis C. In addition, in other embodiments not shown, the anvil 110 and the shoulder member 130 can also be configured to be movable via the drive of the driving mechanism 140, so that the movement of the anvil 110 and the shoulder member 130 can also be controlled by the control component 160. Alternatively, the anvil 110 for supporting the plate assembly P and the shoulder member 130 for abutting the plate assembly P can also be moved or driven via other mechanisms. The present invention does not limit the specific structure and connection method of the driving mechanism 140, which can be adjusted according to needs.

[0056] In addition, in the present embodiment, the power source 150 electrically connects the anvil 110 and the shoulder member 130 (for example, each is connected by a sliding contact mechanism or a flexible cable not shown). At least a portion of the anvil 110 is conductive (for example, the hemispherical surface 110a), and at least a portion of the shoulder member 130 is conductive (for example, the abutment surface 134). Furthermore, the control component 160 controls the operation of the power source 150 so that the current flows between the anvil 110 and the shoulder member 130. In this case, since the hemispherical surface 110a of the anvil 110 contacts the first surface S1 provided by the first plate member P1 and the abutment surface 134 of the shoulder member 130 presses the second surface S2 provided by the second plate member P2, and the hemispherical surface 110a, the abutment surface 134, and the plate assembly P are conductive, the current of the power source 150 can be transmitted between the anvil 110 and the shoulder member 130 and flow through the plate assembly P, thereby energizing the plate assembly P to engage the plate assembly P in the subsequent steps. However, the present invention does not limit the specific structure and connection method of the power supply 150 and the control component 160, which can be adjusted according to needs.

[0057] It can be seen that in this embodiment, if Figure 1 and Figure 2 As shown, in the process of joining the plate assembly P using the joining device 100, the plate assembly P is placed between the anvil 110 and the shoulder member 130, so that the anvil 110 supports the first surface S1 of the first plate member P1 and the shoulder member 130 presses the second surface S2 of the second plate member P2 with the abutting surface 134. As an example, the plate assembly P can be placed on the anvil 110 with the first surface S1 facing downward, and the shoulder member 130 presses the second surface S2 with the abutting surface 134. In this way, the anvil 110 presses the first surface S1 of the plate assembly P from below, and the shoulder member 130 presses the second surface S2 of the plate assembly P from above. Among them, the hemispherical surface 110a of the anvil 110 and the receiving surface 110b are approximately at the same level, so that they can simultaneously contact the first surface S1 of the plate assembly P provided by the first plate member P1. In addition, the hemispherical surface 110a of the anvil 110 is at least partially conductive and can be used to energize the plate assembly P. Accordingly, the receiving surface 110 b of the anvil 110 is at least partially insulated and can be used to bear the load applied to the plate assembly P from the shoulder member 130 (not electrically conductive with the plate assembly P and does not affect the bonding).

[0058] Next, when the plate assembly P is pressed between the anvil 110 and the shoulder member 130, the probe 120 rotates around the central axis C and advances toward the second surface S2 (i.e., moves downward). The end of the probe 120 is inserted into the second plate P2 and deforms the second plate P2. At this time, due to the friction heat generated by the rotating probe 120, the portion of the second plate P2 surrounding the probe 120 becomes a plastic fluid, and an annular plastic fluid region is generated around the probe 120. Once the end of the probe 120 reaches the middle plate P3, the control component 160 causes the current provided by the power supply 150 to flow between the anvil 110 and the shoulder member 130. When the current flows between the anvil 110 and the shoulder member 130, the probe 120 keeps rotating and moves further downward (advances), and the end of the probe 120 is inserted into the middle plate P3. As a result, the resistance heat generated in the first plate P1 and the middle plate P3 and the friction heat generated by the rotation of the probe 120 cause a melting area (such as a molten area) to be generated between the first plate P1 and the middle plate P3. Figure 2 At the same time, a portion of the material of the second plate P2 and the middle plate P3 near the probe 120 flows plastically. As a result, a portion of the middle plate P3 penetrates into the second plate P2 via plastic flow (e.g., Figure 2 Region R2 shown).

[0059] After the power-on operation is completed, the control unit 160 controls the power supply 150 to stop supplying current between the anvil 110 and the shoulder member 130, and controls the drive mechanism 140 to make the probe 120 retreat (i.e., move upward) along the central axis C while rotating. When the current stops and the probe 120 moves away, the melting area (such as the melting area between the first plate P1 and the middle plate P3) between the first plate P1 and the middle plate P3 is Figure 2 The first plate P1 and the intermediate plate P3 are firmly joined to each other via the molten region R1. In addition, a portion of the intermediate plate P3 penetrates into the second plate P2 via plastic flow (e.g., Figure 2 The region R2 of the joining device 100 is formed so that the second plate member P2 and the middle plate member P3 are also firmly joined to each other through the penetration portion. Subsequently, the anvil 110 and the shoulder member 130 move away from the plate assembly P, so that the joined plate assembly P can be taken out. However, the above description is only one of the operation procedures of the joining device 100 of this embodiment. The operation procedure of the joining device 100 can be appropriately adjusted according to the specific structure of the joining device 100 and the number and material of the plates of the plate assembly P to be joined, and the present invention is not limited thereto.

[0060] It can be seen that in this embodiment, the anvil 110 has a semi-spherical surface 110a that faces the first surface S1 of the first plate member P1 and is at least partially conductive, and a receiving surface 110b that is arranged at a position corresponding to the abutting surface 134 of the shoulder member 130 and is at least partially insulated, and the anvil 110 contacts the first surface S1 with the semi-spherical surface 110a and the receiving surface 110b. That is, the anvil 110 contacts the first surface S1 with the semi-spherical surface 110a that is at least partially conductive to energize the plate assembly P, and contacts the first surface S1 with the receiving surface 110b that is at least partially insulated to bear the load applied to the plate assembly P by the abutting surface 134 of the shoulder member 130. In this way, the anvil 110 in the bonding device 100 reduces the conductive contact area with the first plate member P1 via the hemispherical surface 110a, and receives the load from the shoulder member 130 during the bonding process via the receiving surface 110b, thereby preventing the conductive contact area between the plate assembly P and the anvil 110 from increasing due to the bending deformation of the plate assembly P (i.e., preventing the current path from expanding), and can fully generate a molten core for bonding by energizing. Accordingly, the bonding device 100 can prevent the bending deformation of the plate assembly P and suppress the increase of the conductive contact area, thereby improving the bonding effect.

[0061] Furthermore, in this embodiment, if Figure 3 As shown, the anvil 110 includes a handle member 112, a top member 114, and a receiving member 116. That is, the anvil 110 is composed of at least three parts, namely, the handle member 112, the top member 114, and the receiving member 116. Among them, the handle member 112 has a flow path 112a inside, and has a tapered portion 112b at the front end (i.e., the upper end). The top member 114 has the aforementioned hemispherical surface 110a at the front end (i.e., the upper end), and has a snap-fitting portion 114a that snaps with the tapered portion 112b on the inner surface of the base end (i.e., the lower end). The receiving member 116 surrounds the outer surface of the top member 114 and overlaps with the tapered portion 112b in the width direction (i.e., the left-right direction), and has the aforementioned receiving surface 110b at the front end (i.e., the upper end).

[0062] It can be seen that in this embodiment, the handle member 112 is used as the base of the anvil 110, so that a flow path 112a for cooling water to flow is provided inside as a cooling structure, and the tapered portion 112b at the front end thereof gradually tilts outward from top to bottom. Correspondingly, the top member 114 is mounted on the handle member 112 to provide a semi-spherical surface 110a that is at least partially conductive at its front end. Therefore, the top member 114 can be made of a conductive material (i.e., used as an electrode), or can only be partially conductive (e.g., the semi-spherical surface 110a), and the present invention is not limited thereto. Furthermore, the engaging portion 114a provided at the base end of the top member 114 is, for example, the edge portion of an opening that gradually expands outward from top to bottom. In this way, the engaging portion 114a of the top member 114 can be fixed on the handle member 112 by sliding along the tapered portion 112b during the installation process, thereby helping to make the top member 114 easier to install on the handle member 112. Furthermore, the receiving member 116 is formed in a cylindrical shape and is installed on the outer periphery of the handle member 112 and the top member 114 to provide a receiving surface 110b that is at least partially insulated at its front end. Therefore, the receiving member 116 can be formed of an insulating material, or can only be partially insulated (for example, an insulating material is provided on the receiving surface 110b), and the present invention is not limited thereto. Furthermore, the receiving member 116 surrounds the outer surface of the top member 114 (the gap between the two is small), and the range of the receiving member 116 surrounding the outer surface of the top member 114 includes the tapered portion 112b, thereby limiting the installation position of the top member 114 (that is, limiting the displacement of the engaging portion 114a engaged on the tapered portion 112b).

[0063] Through the above arrangement, when the plate assembly P is pressed between the anvil 110 and the shoulder member 130, and the probe 120 penetrates the plate assembly P, the load applied to the plate assembly P by the probe 120 and the shoulder member 130 is transmitted toward the hemispherical surface 110a (for example, provided by the top member 114) and the receiving surface 110b (for example, provided by the receiving member 116) of the anvil 110. At this time, since the receiving member 116 surrounds the outer surface of the top member 114, the outer periphery of the top member 114 is restricted, so that the engaging portion 114a of the top member 114 will not further move downward along the tapered portion 112b of the handle member 112 and expand outward. In addition, the receiving surface 110b of the receiving member 116 can be used to receive most of the load from above (i.e., the shoulder member 130 and the probe 120). It can be seen that the conductive part (i.e., the hemispherical surface 110a) and the insulating part (i.e., the receiving surface 110b) in the anvil 110 can be appropriately separated and easily assembled. In addition, the anvil 110 suppresses the displacement deformation of the top part 114 relative to the handle part 112 in the pressurizing direction (i.e., downward) via the receiving part 116 (i.e., suppresses the change in the processing position of the hemispherical surface 110a), so that the molten core for joining can be fully generated by energizing. However, the present invention is not limited to this, and it can be adjusted according to needs.

[0064] Furthermore, in this embodiment, if Figure 3As shown, the handle member 112 has an edge 112c located below the tapered portion 112b, and the top member 114 is mounted on the handle member 112, and the lower end 114b of the top member 114 abuts against the edge 112c of the handle member 112. That is, in addition to using the cylindrical receiving member 116 to restrict the installation position of the top member 114 from the outside, the edge 112c can be provided below the tapered portion 112b of the handle member 112 to restrict the installation position of the top member 114. Among them, since the edge 112c is located below the tapered portion 112b and extends outward compared to the tapered portion 112b, the edge 112c can serve as the moving end point of the engaging portion 114a of the top member 114 moving downward along the tapered portion 112b, and the lower end 114b of the top member 114 abuts against the edge 112c. In this way, when the load applied by the probe 120 and the shoulder member 130 to the plate assembly P is transmitted toward the anvil 110, since the lower end 114b of the top member 114 abuts against the edge 112c of the handle member 112, the engaging portion 114a of the top member 114 will not further move downward along the tapered portion 112b of the handle member 112 and expand outward. In this way, the displacement deformation of the top member 114 relative to the handle member 112 in the pressurizing direction (i.e., downward) can be suppressed (i.e., the change in the processing position of the hemispherical surface 110a is suppressed), so that the molten core for joining can be fully generated by energizing. However, the present invention is not limited to this, and it can be adjusted according to needs.

[0065] In addition, in this embodiment, Figure 3 As shown, the receiving part 116 includes a receiving part 116a and a retaining part 116b, the receiving part 116a has the receiving surface 110b in contact with the first plate P1, the retaining part 116b surrounds the receiving part 116a and engages with the handle part 112, and the receiving part 116a and the retaining part 116b are separate components respectively provided. In other words, the receiving part 116 is at least composed of the receiving part 116a and the retaining part 116b. Among them, the receiving part 116a is configured as a cylinder and surrounds the outer surface of the top part 114 (the gap between the two is small). In addition, the receiving part 116a provides a receiving surface 110b on the periphery of the hemispherical surface 110a. Therefore, the receiving part 116a can be composed of an insulating material, or only partially insulated (for example, an insulating material is provided on the receiving surface 110b), and the present invention is not limited to this. Correspondingly, the retaining part 116b is configured as a cylinder and surrounds the periphery of the receiving part 116a. Furthermore, the lower side of the holding portion 116b surrounds and contacts the engaging portion 114a of the top member 114 to hold the power source 150 (eg Figure 1The current (as shown) is transmitted to the hemispherical surface 110a of the top member 114, and the lower side of the holding portion 116b is further engaged (for example, screwed) with the handle member 112 for fixing. Thus, the holding portion 116b can be made of a conductive material, or only partially conductive, and the present invention is not limited thereto.

[0066] As can be seen from the above, in this embodiment, the insulating part (i.e., the receiving part 116a) and the conductive part (i.e., the holding part 116b) in the receiving part 116 can be appropriately separated and easily assembled. Furthermore, in the case where the receiving part 116a is worn due to contact with the first plate member P1 of the plate assembly P, etc., the receiving part 116a can be easily replaced. That is, it is not necessary to replace the entire receiving part 116, but only to remove the receiving part 116a from the holding part 116b and replace it with a new receiving part 116a, so that the size of the parts to be replaced is greatly reduced, and the cost of consumables can be suppressed. However, the above description is only one example of the anvil 110. The present invention does not limit the anvil 110 to be composed of the handle component 112, the top component 114, and the receiving component 116, nor does it limit the receiving component 116 to be composed of the receiving portion 116a and the retaining portion 116b, and does not limit the provision of the flow path 112a, the tapered portion 112b, the engaging portion 114a, and the edge portion 112c. As long as the anvil 110 in the bonding device 100 has at least a partially conductive hemispherical surface 110a to reduce the conductive contact area with the first plate P1, and has at least a partially insulating receiving surface 110b to receive the load from the shoulder component 130 during the bonding process, the present invention does not limit the specific structural composition of the anvil 110, which can be adjusted according to needs.

[0067] In summary, in the joining device of the present invention, the anvil has a first surface facing the first plate and at least partially conductive hemispherical surface, and a receiving surface arranged at a position corresponding to the abutment surface of the shoulder component and at least partially insulated, and the anvil contacts the first surface with the hemispherical surface and the receiving surface. In this way, the anvil in the joining device reduces the conductive contact area with the first plate through the hemispherical surface, and at the same time receives the load from the shoulder component during the joining process through the receiving surface, thereby preventing the conductive contact area between the plate assembly and the anvil from increasing due to the bending deformation of the plate assembly (that is, preventing the current path from expanding), and can fully generate a molten core for joining by energizing. Preferably, the anvil includes a handle component, a top component, and a receiving component, the handle component has a tapered portion at the front end, the top component has a snap-fitting portion that snaps with the tapered portion on the inner surface of the base end, and the receiving component surrounds the outer surface of the top component and overlaps with the tapered portion in the width direction. In this way, the anvil suppresses the displacement deformation of the top member relative to the handle member in the pressurizing direction (i.e., suppresses the change of the processing position of the hemispherical surface) via the receiving member, so that the molten core for joining can be fully generated by energizing. Accordingly, the joining device of the present invention can prevent the bending deformation of the plate assembly and suppress the increase of the conductive contact area, thereby improving the joining effect.

[0068] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A joining device for joining a panel assembly comprising a first panel and a second panel configured to abut against the first panel, wherein: include: an anvil configured to support a first surface of the plate assembly provided by the first plate member; a probe, arranged at a position corresponding to the anvil and facing the second surface of the plate assembly provided by the second plate member; a shoulder member, arranged around the probe and having a through hole for the probe to pass through, and an abutment surface for pressing the second surface; a driving mechanism configured to rotate the probe about a central axis intersecting the second surface and to advance or retreat along the central axis toward the second plate; a power source electrically connecting the anvil and the shoulder member so that an electric current flows through the plate assembly between the anvil and the shoulder member; as well as A control component controls the operation of the drive mechanism and the power supply, wherein The anvil has a semi-spherical surface facing the first surface and at least partially conductive, and a receiving surface arranged at a position corresponding to the abutting surface of the shoulder member and at least partially insulated, and The anvil contacts the first surface with the hemispherical surface and the receiving surface.

2. The joining device according to claim 1, characterized in that: The anvil comprises a handle component, a top component, and a receiving component. The handle member has a tapered portion at the front end. The top member has the hemispherical surface at the front end portion and has an engaging portion engaged with the tapered portion on the inner surface of the base end portion. The receiving member surrounds the outer surface of the top member, overlaps with the tapered portion in the width direction, and has the receiving surface at a front end portion.

3. The joining device according to claim 2, characterized in that: The handle member has an edge portion located below the tapered portion, The top member is mounted on the handle member, and a lower end portion of the top member abuts against the edge portion of the handle member.

4. The joining device according to claim 2, characterized in that: The receiving component includes a receiving portion and a holding portion. The receiving portion has the receiving surface that contacts the first plate member, the holding portion surrounds the receiving portion and engages with the handle member, and the receiving portion and the holding portion are separate components that are provided separately.

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