A method and device for intelligently producing metal mineral optical slices

Abstract

The present invention relates to the technical field of abrasive disc processing equipment, and specifically to a method for intelligently producing metal mineral optical slices, comprising the following steps: S1: performing rough abrasive disc processing on the sample by adding water and sand, surface grinding, and plane processing operations; S2: performing advanced and fine abrasive disc processing on the sample using abrasive materials; S3: performing high-precision abrasive disc processing on the sample by regularly grinding with abrasive powder and finely detecting the thickness of the optical slice, and combining thickness and roughness sensors to ensure that the surface quality of the sample meets high standards; S4: When the thickness reaches the standard, the sample is polished, and the surface smoothness of the sample is detected using a roughness sensor. When the specified smoothness is reached, the polishing machine stops working, and a metal mineral optical slice that meets the requirements is obtained. The detailed parameters of the grinding and polishing process are monitored and adjusted in real time by a sensor system, ensuring the high consistency and high quality of the final product.

Description

Technical Field

[0001] The present invention relates to the technical field of grinding disc processing equipment, and in particular to a method and device for intelligently producing metal mineral optical discs. Background Art

[0002] In the field of process mineralogy, the production of optical sections of metallic minerals is a key step in observing, analyzing, and studying the microstructure and physical properties of minerals. This is crucial for fields such as mineralogical research, materials science, and geological exploration. However, existing optical section production techniques primarily rely on manual labor, a traditional process that presents numerous technical bottlenecks and operational challenges.

[0003] First, in the traditional manual production process, complex operations at each stage, including initial rough grinding, fine grinding, and final polishing of the sample, must be completed manually by workers. This cumbersome process makes the entire production chain lengthy and time-consuming. The essence of manual operation is that each process and step requires human judgment and execution, resulting in inefficient transitions between stages and reducing overall production efficiency. Furthermore, because each step requires manual intervention, the worker's condition and skill level directly affect the production speed and final product quality.

[0004] At the same time, the control of details in the manual preparation process, such as the judgment of sample thickness and surface smoothness, relies heavily on the operator's subjective experience rather than precise scientific measurements, which inevitably leads to large accuracy errors and inconsistencies. The measurement errors of key parameters such as thickness and surface features directly increase the difficulty of quality control, which in turn affects the standardization and reproducibility of the finished product. Traditional processes also face high labor costs, which are reflected not only in salary expenditures, but also in the low efficiency and high scrap rate caused by manual operations. In addition, long-term repetitive work is also a challenge for operators, which may lead to excessive labor intensity and may also affect the quality of operation due to factors such as fatigue.

[0005] In order to overcome the above problems, the present invention proposes an intelligent method for producing metal mineral optical slices, which applies single-chip microcomputer technology, PLC technology, detection sensors, and robotic arms to the production process of metal mineral optical slices, and then combines grinding equipment and polishing equipment to realize the intelligent production of metal mineral optical slices. The entire process does not require human participation. Summary of the Invention

[0006] The present invention aims to provide a method for intelligently producing metal and mineral optical sheets. Using a sensor system, detailed parameters during the grinding and polishing process are monitored and adjusted in real time, ensuring high consistency and quality standards in the final product. The combined use of thickness and roughness sensors enables real-time monitoring and adjustment of every critical point in the production process, significantly reducing errors caused by human judgment.

[0007] In order to achieve the above technical objectives and the above technical effects, the present invention is implemented through the following technical solutions:

[0008] A method for intelligently manufacturing a metal mineral optical sheet comprises the following steps:

[0009] S1: The sample is roughly ground by adding water and sand, surface grinding, and plane processing operations, so that the sample is processed to a state close to the target thickness;

[0010] S2: Perform advanced and detailed grinding of the sample using abrasive materials, using a thickness sensor to monitor in real time and modify the grinding pressure to adapt to different thicknesses;

[0011] S3: The sample is subjected to high-precision grinding through regular grinding with grinding powder and fine detection of optical thickness. The thickness and roughness sensors are used in combination to ensure that the surface quality of the sample meets high standards.

[0012] S4: When the thickness reaches the standard, the sample is polished and the surface smoothness of the sample is detected using a roughness sensor. When the specified smoothness is reached, the polishing machine stops working and a metal mineral slice that meets the requirements is obtained.

[0013] Furthermore, the step S1 specifically includes the following sub-steps:

[0014] S1.1: If the sample surface is dry when it comes into contact with the grinding disc, there may be damage and safety hazards, so it is essential to add a certain amount of water and abrasive during rough grinding. First, fully fit the sample on the grinding disc of the grinding machine, start the grinding machine to start working, and the single-chip computer system controls the addition of a certain amount of water and abrasive. Green silicon carbide is used as the abrasive, and the sand-water ratio is 3:1; a thickness sensor is used to measure the sample thickness T0 in real time, and the target thickness T is set to 3 cm. A nonlinear function is used to describe the relationship between grinding time and thickness to more accurately control the grinding process. The formula is:

[0015]

[0016] Where Δt is the time required for grinding, α represents the basic time constant during the grinding process, which depends on the grinding efficiency of the equipment and is determined by experiments to be in the range of 0.1 to 1.0; β is an exponential parameter that determines the sensitivity of the grinding time to the thickness difference and is between 1.2 and 2.0 to control the degree of response of the time to the thickness difference during the grinding process.

[0017] When the thickness T satisfies T ≤ 3 cm, the sensor signal S(T) triggers the microcontroller to stop the grinding disc; the amount of water and abrasive added is dynamically calculated based on time and real-time thickness, and the formula is:

[0018]

[0019]

[0020] K1 represents the initial amount of water added, which is the basic water requirement at the beginning of the grinding process; K2 represents the initial amount of abrasive added, which affects the cutting ability during the grinding process; λ represents the time attenuation factor of the water volume, which is used to control the water addition rate and has a value between 0.01 and 0.1; μ is the reaction coefficient of the abrasive addition to the thickness, which affects the addition of abrasive at different thicknesses and has a value between 0.1 and 0.5; when the thickness reaches the specified standard, the alarm set in the microcontroller system automatically sounds, and the microcontroller receives the signal and drives the motor to immediately stop the rotation of the grinding disc.

[0021] S1.2: Because ore samples absorb excessive moisture and become loose, to prevent moisture from affecting the integrity and hardness of the sample, the rough-ground metal mineral sample needs to be manually flattened. After step S1.1 is completed, the sample is grasped by a robot and placed in an oven. Glue is added to the sample surface and the temperature is raised to bake for 20 minutes. The sample is then inspected for dryness. If qualified, the next step can be carried out.

[0022] Furthermore, the step S2 specifically includes the following sub-steps:

[0023] S2.1: Select the working mode of the grinding machine and switch it to the fine grinding mode. After receiving the instruction to start the grinding machine, the single-chip computer adds a certain amount of water and abrasive to the grinding disc. The fine grinding stage continues to use green silicon carbide, and the sand-water ratio is maintained at the same 3:1 as the coarse grinding stage. Then the motor is driven to rotate the grinding disc. At the same time, the thickness gauge starts working and detects the thickness of the sample in real time. The target thickness is reduced to 2 cm. The system uses the thickness sensor to monitor in real time and adjusts the grinding pressure to adapt to different thicknesses. The grinding pressure P is adjusted using the quadratic function relationship:

[0024]

[0025] Where γ represents the sensitivity of the square term used to control pressure changes, and its value ranges from 0.01 to 0.05; δ is the linear term coefficient, which reflects the direct effect of thickness changes on pressure, and its value ranges from 0.5 to 2.0; ε is a constant term used to set the base pressure.

[0026] When the thickness T satisfies T > 2 cm, the grinding disc continues to operate. Through the sensor signal S(T), when T reaches the target, the microcontroller sends a stop signal.

[0027] S2.2: Use a robotic arm to grab the sample and send it into the oven for planar processing. Bake it for 20 minutes. The difference from step S1.2 is that no glue is needed to fix the sample during the planar processing because the sample will not be loose after processing in step S1.

[0028] Furthermore, the step S3 specifically includes: the grinding machine is converted to a high-precision grinding mode, and the single-chip computer system drives the motor to rotate the grinding disc at a fixed low speed. In order to make the smoothness and thickness of the sample meet high-precision standards, white corundum powder is used in the high-precision grinding stage. The material is added in three stages to gradually improve the surface smoothness of the sample. The grinding disc rotates forward and reverse for a fixed time during the interval of adding abrasive powder each time to perform grinding. While the grinding machine is working, the thickness detector detects the thickness of the metal mineral sample in real time, with the target sample thickness T between 0.9 and 1.2 cm and roughness H ≤ 0.5 mm. The measurement of thickness and roughness during the grinding process is carried out through the functional relationship:

[0029]

[0030]

[0031] Where η is the time attenuation coefficient of thickness change, which controls the thickness reduction rate; κ is the time function adjustment coefficient, which is used to control the processing rhythm; ζ is the factor that controls the roughness improvement rate; τ is the control parameter of the influence of time on roughness, which describes the thickness and roughness change trend with time t.

[0032] The system sets the logical judgment conditions as: (0.9 ≤ T ≤ 1.2) and H ≤ 0.5. When the conditions are met, the microcontroller stops the grinding operation.

[0033] Furthermore, step S4 specifically includes: using a robotic arm to grab the sample after high-precision grinding and placing it into the polishing machine, the single-chip computer system receives the signal and adds polishing lubricant to the polishing machine, and using a roughness sensor to detect the surface smoothness of the sample to ensure that the final roughness reaches or exceeds 0.5 mm.

[0034] The amount of polishing lubricant added at this stage, L, is calculated based on a nonlinear time function to ensure polishing uniformity and effectiveness:

[0035]

[0036] Where L0 is the initial addition amount, ν is the lubricant addition rate factor, which controls the initial addition rate and has a value between 0.1 and 0.3. ξ is the time exponential parameter, which regulates the addition rate curve and has a value between 1.0 and 1.5. The sensor measures the surface roughness H. When H = 0.5, the signal S(H) triggers the microcontroller system's alarm to automatically sound an alarm. The microcontroller receives the stop signal and drives the motor to stop the polishing machine. The staff uses a robotic arm to grab the sample and place it in a fixed position, obtaining a metal mineral optical section that meets the requirements of process mineralogy.

[0037] Furthermore, the specific working process of the manipulator includes:

[0038] The manipulator uses forward kinematics to analyze the position and posture of the manipulator end when the joint angle is given. It is represented by a homogeneous transformation matrix, which is obtained by multiplying the rotation matrix and displacement matrix of multiple joints. Assuming that the manipulator has n joints, the transformation of each joint includes a rotation matrix and a translation matrix. The end position P e The specific formula is:

[0039]

[0040] Where T k represents the translation matrix, R represents the rotation matrix, θ i is the angle of each joint.

[0041] Dynamic control ensures that the manipulator operates within physical constraints. The Lagrangian method is used to model the system. The Lagrangian function L is defined as the difference between kinetic energy K and potential energy V, that is, L = K - V;

[0042] Then the joint torque τ is obtained by the Lagrange equation k :

[0043]

[0044] θ' represents the angular velocity, τ k Represents the control torque of the joint.

[0045] Combined with force feedback control, the accuracy and safety of grasping can be improved. The force sensor is installed at the end of the manipulator to detect the actual force F during the grasping process. actual In order to maintain stable grasping, the control system needs to actual With the set gripping force F set For comparison, ΔF is used as the adjustment condition:

[0046]

[0047] If the allowable error ΔF is exceeded, the torque output is adjusted through PD or PID control:

[0048]

[0049] Make the control process have good dynamic response.

[0050] During the positioning and visual recognition phase, cameras and image processing technologies are combined to achieve real-time recognition and calibration of the sample's position and posture. The sample recognition process includes image acquisition, preprocessing, edge detection (using the Canny algorithm), and finding the precise location of the sample through template matching.

[0051] When performing grasping and placement tasks, the robot must precisely execute movements based on calculated paths and torques. During sample grasping, the robot first determines the grasping point through vision, calculates the grasping position using inverse kinematics, and approaches the sample at a low speed to ensure stability. During movement to the target device, such as an oven or polishing machine, the path must be continuously monitored and dynamically adjusted based on sensor feedback. During the final placement stage, the robot must slowly reduce its speed V to near zero to reduce impact and ensure that the sample is safely, securely, and precisely placed in place.

[0052] The entire process of these links is coordinated and monitored by an integrated PLC system. A state machine describes the control logic, sets different states and transition conditions, and adjusts the tasks and parameter settings of each submodule in real time. Through continuous sensor data feedback, the system can quickly respond to abnormal situations and make adjustments to speed, direction, and torque to ensure reliable and safe operation.

[0053] On the other hand, the present invention proposes an apparatus for implementing the above method, including a grinding device and a polishing device. The grinding device includes a grinding disc assembly, a drive motor, a grinding pressure regulating mechanism, and an automatic water and sand adding system. The grinding disc assembly specifically includes a grinding disc made of a high-strength alloy, and its surface is covered with a wear-resistant coating to extend its service life. The grinding disc is connected to the drive motor through a connecting shaft, and the drive motor controls its rotation speed to adapt to different grinding requirements. The grinding pressure regulating mechanism uses hydraulic or mechanical devices to apply precise downward pressure to the grinding disc through a mechanical connection between a lever and the grinding disc. The automatic water and sand adding system includes a stainless steel water tank, an aluminum frosting silo, a transmission pipe made of corrosion-resistant plastic material, and an electronic valve controlled by a single-chip microcomputer. These components are fixed to the frame of the grinding device through precision fittings and sealing connectors, and are connected to the central control system by a control cable to achieve precise distribution of grinding media.

[0054] The polishing equipment includes a polishing disc, a lubricant addition system and a polishing drive system; the polishing disc is connected to the brushless motor of the polishing drive system through a wear-resistant gear, and the brushless motor provides constant and stable torque; the lubricant addition system consists of a stainless steel liquid storage tank, a metering pump, a rubber pipe and a precision nozzle. The nozzle is installed in a matrix form above the polishing disc, and the flow rate and distribution of the lubricant are controlled by an electromagnetic valve to ensure uniformity during the polishing stage.

[0055] The single-chip microcomputer control system integrates a multi-layer circuit board, an ARM processor, a data acquisition module, and a communication interface module; the embedded software runs on the microcontroller of the single-chip microcomputer, which is responsible for processing sensor input, executing control algorithms, and forming closed-loop feedback to adjust mechanical operations.

[0056] Thickness measurement equipment uses a laser source and receiver. The laser emits a beam of light onto the sample surface, and the reflected light is captured by the receiver. The time difference between reflections is measured using an optical lens and a high-precision CCD sensor to calculate the sample's precise thickness. The thickness sensor's signal line is connected to the microcontroller control system via a shielded cable, ensuring that data transmission is immune to external electromagnetic interference. The roughness sensor, on the other hand, uses a surface contact pin and a highly sensitive position sensor to move along the sample surface. The roughness is calculated based on changes in micro-displacement. This change is converted to a digital signal by an analog signal converter and transmitted to the control system.

[0057] The robot consists of a multi-servo motor-driven arm with a high-precision force sensor and industrial camera at its end. The motor drivers and microcontrollers adjust the angles of each joint in real time, and the robot is connected to the PLC system via cables. The force sensor transmits the force signal to the control system via an analog-to-digital converter, ensuring stable and safe grasping. The camera uses a CMOS sensor and an image processor to analyze the real-time image to confirm the precise position of the sample.

[0058] Beneficial effects of the present invention:

[0059] This technical solution significantly improves production efficiency by introducing multiple automation technologies. First, a single-chip microcomputer and programmable logic controller (PLC) system automates the entire production process, reducing time-consuming manual operations. The microcontroller receives real-time sensor data (such as thickness and roughness sensors) to dynamically adjust grinding and polishing pressure, ensuring optimized timing and quality at every production step. The use of a robotic arm further shortens sample transfer time. Automated mechanical control not only speeds up operations but also ensures seamless integration between process steps. This system design allows each process step to be processed virtually in parallel, significantly reducing wait times between operations and improving overall production efficiency.

[0060] By integrating high-precision thickness and roughness sensors, the solution achieves precise control of the machining process. Real-time data feedback allows the system to dynamically adjust machining parameters, such as disc speed, pressure, and lubricant volume, based on the actual measured sample thickness and roughness. This type of control, down to the second, ensures that the thickness and surface quality of each optical sheet meet stringent standards, eliminating the subjective errors that can arise from traditional manual machining. Furthermore, the collaborative work of multi-layer sensor feedback and the PLC closed-loop control system can capture even the slightest quality deviations and enable immediate adjustments, improving product quality consistency.

[0061] The use of automated equipment significantly reduces the need for highly skilled labor and eliminates human error. The system employs precise mathematical models and functional relationships to control key parameters such as grinding time, pressure, and lubricant dosage. This system completely replaces the empirical judgment inherent in manual operations with programmed presets and real-time data adjustments. Furthermore, this automated operation reduces the need for direct labor and lowers training and personnel management costs. Combined with technologies such as force sensors, this further reduces fluctuations caused by manual operation, thereby improving equipment stability and operational efficiency.

[0062] Automation not only improves efficiency and quality but also significantly enhances operational safety. The use of robotic arms reduces the chances of direct human contact with equipment. By installing high-precision force sensors and industrial cameras on them, on-site conditions can be monitored in real time, avoiding safety accidents caused by misoperation. The PLC system uses state machine control logic to ensure the reliable operation of equipment under various operating conditions, and further ensures safety through anomaly detection and emergency stop functions. At the same time, intelligent parameter adjustment and closed-loop control enhance process reproducibility, enabling the production line to stably output products that meet industrial standards. By achieving controllable and monitorable dynamic adjustment of each link in the sheet processing, the standardization and reproducibility of the process have been significantly improved.

[0063] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0064] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0065] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0066] In the figure: 1. Grinding equipment, 101. Grinding disc assembly, 102. Drive motor, 103. Grinding pressure adjustment mechanism, 104. Automatic water and sand adding system, 2. Polishing equipment, 201. Polishing disc, 202. Lubricating fluid adding system, 203. Polishing drive system, 3. Robot, 4. Thickness sensor, 5. Roughness sensor. DETAILED DESCRIPTION

[0067] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0068] Example 1

[0069] The method for intelligently manufacturing a metal mineral optical sheet as described in this embodiment includes the following steps:

[0070] S1: The sample is roughly ground by adding water and sand, surface grinding, and plane processing operations, so that the sample is processed to a state close to the target thickness;

[0071] S2: Perform advanced and detailed grinding of the sample using abrasive materials, using a thickness sensor to monitor in real time and modify the grinding pressure to adapt to different thicknesses;

[0072] S3: The sample is subjected to high-precision grinding through regular grinding with grinding powder and fine detection of optical thickness. The thickness and roughness sensors are used in combination to ensure that the surface quality of the sample meets high standards.

[0073] S4: When the thickness reaches the standard, the sample is polished and the surface smoothness of the sample is detected using a roughness sensor. When the specified smoothness is reached, the polishing machine stops working and a metal mineral slice that meets the requirements is obtained.

[0074] In this embodiment, step S1 specifically includes the following sub-steps:

[0075] S1.1: If the sample surface is dry when it comes into contact with the grinding disc, there may be damage and safety hazards, so it is essential to add a certain amount of water and abrasive during rough grinding. First, fully fit the sample on the grinding disc of the grinding machine, start the grinding machine to start working, and the single-chip computer system controls the addition of a certain amount of water and abrasive. Green silicon carbide is used as the abrasive, and the sand-water ratio is 3:1; a thickness sensor is used to measure the sample thickness T0 in real time, and the target thickness T is set to 3 cm. A nonlinear function is used to describe the relationship between grinding time and thickness to more accurately control the grinding process. The formula is:

[0076]

[0077] Where Δt is the time required for grinding, α represents the basic time constant during the grinding process, which depends on the grinding efficiency of the equipment and is determined by experiments to be in the range of 0.1 to 1.0; β is an exponential parameter that determines the sensitivity of the grinding time to the thickness difference and is between 1.2 and 2.0 to control the degree of response of the time to the thickness difference during the grinding process.

[0078] When the thickness T satisfies T ≤ 3 cm, the sensor signal S(T) triggers the microcontroller to stop the grinding disc; the amount of water and abrasive added is dynamically calculated based on time and real-time thickness, and the formula is:

[0079]

[0080]

[0081] K1 represents the initial amount of water added, which is the basic water requirement at the beginning of the grinding process; K2 represents the initial amount of abrasive added, which affects the cutting ability during the grinding process; λ represents the time attenuation factor of the water volume, which is used to control the water addition rate and has a value between 0.01 and 0.1; μ is the reaction coefficient of the abrasive addition to the thickness, which affects the addition of abrasive at different thicknesses and has a value between 0.1 and 0.5; when the thickness reaches the specified standard, the alarm set in the microcontroller system automatically sounds, and the microcontroller receives the signal and drives the motor to immediately stop the rotation of the grinding disc.

[0082] S1.2: Because ore samples absorb excessive moisture and become loose, to prevent moisture from affecting the integrity and hardness of the sample, the rough-ground metal mineral sample needs to be manually flattened. After step S1.1 is completed, the sample is grasped by a robot and placed in an oven. Glue is added to the sample surface and the temperature is raised to bake for 20 minutes. The sample is then inspected for dryness. If qualified, the next step can be carried out.

[0083] In this embodiment, step S2 specifically includes the following sub-steps:

[0084] S2.1: Select the working mode of the grinding machine and switch it to the fine grinding mode. After receiving the instruction to start the grinding machine, the single-chip computer adds a certain amount of water and abrasive to the grinding disc. The fine grinding stage continues to use green silicon carbide, and the sand-water ratio is maintained at the same 3:1 as the coarse grinding stage. Then the motor is driven to rotate the grinding disc. At the same time, the thickness gauge starts working and detects the thickness of the sample in real time. The target thickness is reduced to 2 cm. The system uses the thickness sensor to monitor in real time and adjusts the grinding pressure to adapt to different thicknesses. The grinding pressure P is adjusted using the quadratic function relationship:

[0085]

[0086] Where γ represents the sensitivity of the square term used to control pressure changes, and its value ranges from 0.01 to 0.05; δ is the linear term coefficient, which reflects the direct effect of thickness changes on pressure, and its value ranges from 0.5 to 2.0; ε is a constant term used to set the base pressure.

[0087] When the thickness T satisfies T > 2 cm, the grinding disc continues to operate. Through the sensor signal S(T), when T reaches the target, the microcontroller sends a stop signal.

[0088] S2.2: Use a robotic arm to grab the sample and send it into the oven for planar processing. Bake it for 20 minutes. The difference from step S1.2 is that no glue is needed to fix the sample during the planar processing because the sample will not be loose after processing in step S1.

[0089] In this embodiment, step S3 specifically includes: the grinding machine is converted to high-precision grinding mode, and the single-chip microcomputer system drives the motor to rotate the grinding disc at a fixed low speed. In order to make the smoothness and thickness of the sample meet high-precision standards, white corundum powder is used in the high-precision grinding stage. The material is added in three stages to gradually improve the surface smoothness of the sample. The grinding disc rotates forward and reverse for a fixed time during the interval between each addition of grinding powder for grinding. While the grinding machine is working, the thickness detector detects the thickness of the metal mineral sample in real time, with the target sample thickness T between 0.9 and 1.2 cm and roughness H ≤ 0.5 mm. The measurement of thickness and roughness during the grinding process is carried out through the functional relationship:

[0090]

[0091]

[0092] Where η is the time attenuation coefficient of thickness change, which controls the thickness reduction rate; κ is the time function adjustment coefficient, which is used to control the processing rhythm; ζ is the factor that controls the roughness improvement rate; τ is the control parameter of the influence of time on roughness, which describes the thickness and roughness change trend with time t.

[0093] The system sets the logical judgment conditions as: (0.9 ≤ T ≤ 1.2) and H ≤ 0.5. When the conditions are met, the microcontroller stops the grinding operation.

[0094] In this embodiment, step S4 specifically includes: using a robotic arm to grab the sample after high-precision grinding and placing it into the polishing machine, the single-chip computer system receives the signal and adds polishing lubricant to the polishing machine, and uses a roughness sensor to detect the surface smoothness of the sample to ensure that the final roughness reaches or exceeds 0.5 mm.

[0095] The amount of polishing lubricant added at this stage, L, is calculated based on a nonlinear time function to ensure polishing uniformity and effectiveness:

[0096]

[0097] Where L0 is the initial addition amount, ν is the lubricant addition rate factor, which controls the initial addition rate and has a value between 0.1 and 0.3. ξ is the time exponential parameter, which regulates the addition rate curve and has a value between 1.0 and 1.5. The sensor measures the surface roughness H. When H = 0.5, the signal S(H) triggers the microcontroller system's alarm to automatically sound an alarm. The microcontroller receives the stop signal and drives the motor to stop the polishing machine. The staff uses a robotic arm to grab the sample and place it in a fixed position, obtaining a metal mineral optical section that meets the requirements of process mineralogy.

[0098] In this embodiment, the specific working process of the manipulator includes:

[0099] The manipulator uses forward kinematics to analyze the position and posture of the manipulator end when the joint angle is given. It is represented by a homogeneous transformation matrix, which is obtained by multiplying the rotation matrix and displacement matrix of multiple joints. Assuming that the manipulator has n joints, the transformation of each joint includes a rotation matrix and a translation matrix. The end position P e The specific formula is:

[0100]

[0101] Where T k represents the translation matrix, R represents the rotation matrix, θ i is the angle of each joint.

[0102] Dynamic control ensures that the manipulator operates within physical constraints. The Lagrangian method is used to model the system. The Lagrangian function L is defined as the difference between kinetic energy K and potential energy V, that is, L = K - V;

[0103] Then the joint torque τ is obtained by the Lagrange equation k :

[0104]

[0105] θ' represents the angular velocity, τ k Represents the control torque of the joint.

[0106] Combined with force feedback control, the accuracy and safety of grasping can be improved. The force sensor is installed at the end of the manipulator to detect the actual force F during the grasping process. actual In order to maintain stable grasping, the control system needs to actual With the set gripping force F setFor comparison, ΔF is used as the adjustment condition:

[0107]

[0108] If the allowable error ΔF is exceeded, the torque output is adjusted through PD or PID control:

[0109]

[0110] Make the control process have good dynamic response.

[0111] During the positioning and visual recognition phase, cameras and image processing technologies are combined to achieve real-time recognition and calibration of the sample's position and posture. The sample recognition process includes image acquisition, preprocessing, edge detection (using the Canny algorithm), and finding the precise location of the sample through template matching.

[0112] When performing grasping and placement tasks, the robot must precisely execute movements based on calculated paths and torques. During sample grasping, the robot first determines the grasping point through vision, calculates the grasping position using inverse kinematics, and approaches the sample at a low speed to ensure stability. During movement to the target device, such as an oven or polishing machine, the path must be continuously monitored and dynamically adjusted based on sensor feedback. During the final placement stage, the robot must slowly reduce its speed V to near zero to reduce impact and ensure that the sample is safely, securely, and precisely placed in place.

[0113] The entire process of these links is coordinated and monitored by an integrated PLC system. A state machine describes the control logic, sets different states and transition conditions, and adjusts the tasks and parameter settings of each submodule in real time. Through continuous sensor data feedback, the system can quickly respond to abnormal situations and make adjustments to speed, direction, and torque to ensure reliable and safe operation. The rigorous design and implementation of this system ensures that the robot operates with high precision and efficiency in complex environments.

[0114] Example 2

[0115] The apparatus for implementing the method described in Example 1 includes a grinding device 1 and a polishing device 2. The grinding device 1 includes a grinding disc assembly 101, a drive motor 102, a grinding pressure regulating mechanism 103, and an automatic water and sand adding system 104. The grinding disc assembly 101 specifically includes a grinding disc made of a high-strength alloy, the surface of which is covered with a wear-resistant coating to extend its service life. The grinding disc is connected to the drive motor 102 via a connecting shaft, and the drive motor 102 controls its rotation speed to adapt to different grinding requirements. The grinding pressure regulating mechanism 103 uses hydraulic or mechanical devices to apply precise downward pressure to the grinding disc through a mechanical connection with the grinding disc via a lever. The automatic water and sand adding system 104 includes a stainless steel water tank, an aluminum sand silo, a transmission pipe made of corrosion-resistant plastic material, and an electronic valve controlled by a single-chip microcomputer. These components are fixed to the frame of the grinding device 1 through precision fittings and sealing connectors, and are connected to the central control system by a control cable to achieve precise distribution of grinding media.

[0116] The polishing equipment 2 includes a polishing disc 201, a lubricating liquid addition system 202 and a polishing drive system 203; the polishing disc 201 is connected to the brushless motor provided in the polishing drive system 203 through a wear-resistant gear, and the brushless motor provides a constant and stable torque; the lubricating liquid addition system 202 consists of a stainless steel liquid storage tank, a metering pump, a rubber pipe and a precision nozzle. The nozzle is installed in a matrix form above the polishing disc 201, and the flow rate and distribution of the lubricating liquid are controlled by an electromagnetic valve to ensure uniformity during the polishing stage.

[0117] The single-chip microcomputer control system integrates a multi-layer circuit board, an ARM processor, a data acquisition module, and a communication interface module; the embedded software runs on the microcontroller of the single-chip microcomputer, which is responsible for processing sensor input, executing control algorithms, and forming closed-loop feedback to adjust mechanical operations.

[0118] The thickness measurement equipment uses a laser source and receiver. The laser emits a beam of light onto the sample surface, and the reflected light is captured by the receiver. The time difference between reflections is measured using an optical lens and a high-precision CCD sensor, allowing the precise thickness of the sample to be calculated. The signal line of thickness sensor 4 is connected to the microcontroller control system via a shielded cable, ensuring that data transmission is immune to external electromagnetic interference. Roughness sensor 5, on the other hand, uses a surface contact pin and a highly sensitive position sensor to move along the sample surface. The roughness is calculated based on changes in micro-displacement. This change is converted to a digital signal by an analog signal converter and transmitted to the control system.

[0119] Manipulator 3 consists of a robotic arm driven by multiple servo motors, with a high-precision force sensor and industrial camera at its end. Motor drivers and a microcontroller adjust the angles of each joint in real time, connecting it to a PLC system via cables. The force sensor transmits force signals to the control system via an analog-to-digital converter, ensuring stable and safe grasping. The camera, equipped with a CMOS sensor and an image processor, analyzes real-time images to confirm the precise position of the sample.

[0120] Example 3

[0121] The device described in Example 2 performs the following steps in the intelligent production process of metal and mineral optical sheets:

[0122] S1: Rough grinding

[0123] S1.1: Preparation:

[0124] Make sure the sample is prepared and in place.

[0125] Start the grinding device 1 and confirm that the grinding disc assembly 101, the drive motor 102, the grinding pressure adjustment mechanism 103 and the automatic water and sand adding system 104 are working properly.

[0126] S1.2: Initial grinding:

[0127] The microcontroller system maintains a 3:1 sand-water ratio, and a stainless steel water tank and aluminum abrasive silo precisely add water and green silicon carbide abrasive. The amount added is dynamically adjusted according to a pre-set formula.

[0128] S1.3: Grinding process:

[0129] The driving motor 102 is started to drive the grinding disc assembly 101 to start rotating.

[0130] The thickness T0 of the sample was monitored in real time using a thickness sensor, and the target thickness T was set to 3 cm.

[0131] The system adjusts the grinding time Δt and the grinding plate pressure according to the thickness difference.

[0132] S1.4: Termination of grinding:

[0133] When the thickness T ≤ 3 cm, the sensor signal S(T) triggers the microcontroller to stop the grinding disc.

[0134] Drying treatment: grab the sample with the robot 3 and put it into the oven to dry for 20 minutes to ensure that the sample is not loose.

[0135] S2: Advanced and detailed grinding

[0136] S2.1: Mode switch:

[0137] Switch the grinding machine to fine grinding mode and continue to use green silicon carbide.

[0138] S2.2: Fine grinding disc:

[0139] Reset the target thickness to 2 cm.

[0140] Adjust the grinding plate pressure P, use the quadratic function relationship to optimize the pressure, and adjust the power according to the real-time thickness information.

[0141] S2.3: Plane processing:

[0142] When the thickness reaches the target, the robot 3 grabs the sample and puts it into the oven for 20 minutes to dry without using glue.

[0143] S3: High-precision grinding disc processing

[0144] S3.1: High-precision grinding disc:

[0145] Switch the grinding machine to high-precision mode and use white corundum micropowder, adding it in three stages.

[0146] The target thickness is between 0.9 and 1.2 cm, and the roughness H ≤ 0.5 mm.

[0147] S3.2: Fine adjustment:

[0148] Through thickness and roughness sensors, the grinding strategy is adjusted in real time to ensure that the surface smoothness and thickness of the sample meet high-precision standards.

[0149] S4: Polishing

[0150] S4.1: Polishing preparation:

[0151] The robot 3 places the sample after high-precision grinding into the polishing machine.

[0152] S4.2: Polishing operation:

[0153] The lubricating liquid adding system 202 is used to control the flow rate and distribution of the lubricating liquid to ensure that the sample surface is smooth.

[0154] The roughness sensor detects the sample roughness H. When H = 0.5, the system is triggered to stop the polishing operation through the signal S(H).

[0155] S4.3: Finished product handling:

[0156] The robot 3 grabs the polished sample and places it in a fixed position.

[0157] In this embodiment, the operation process of the manipulator 3 includes:

[0158] Grasping: Use visual recognition technology to determine the position and posture of the sample.

[0159] Movement: Based on the calculated path, the robot 3 moves the sample to the target device (oven or polisher) at low speed and precision.

[0160] Placement: Robot 3 slowly decelerates near the target position to ensure safe placement of the sample.

[0161] Feedback and adjustment: Real-time feedback from force sensors and vision systems, and dynamic adjustment by the PLC system ensure accurate and effective operations.

[0162] In summary, this invention proposes a method for intelligently producing metal and mineral optical wafers. Using a sensor system, detailed parameters during the grinding and polishing process are monitored and adjusted in real time, ensuring high consistency and high quality standards in the final product. The combined use of thickness and roughness sensors enables real-time monitoring and adjustment of every critical point in the production process, significantly reducing errors caused by human judgment.

[0163] The preferred embodiments of the present invention disclosed above are intended only to help illustrate the present invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the present invention to the specific embodiments described. Obviously, many modifications and variations are possible based on the content of this specification. These embodiments are selected and described in detail in this specification to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better understand and utilize the present invention. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. A method for intelligent polishing of metal and mineral optical sheets, characterized in that: The following steps are involved: S1: The sample is roughly ground by adding water and sanding, surface grinding, and plane processing operations, so that the sample is processed to a state close to the target thickness; S2: Perform advanced and detailed grinding of the sample using abrasive materials, using a thickness sensor to monitor in real time and modify the grinding pressure to adapt to different thicknesses; S3: The sample is subjected to high-precision grinding through regular grinding with grinding powder and fine detection of optical thickness. The thickness and roughness sensors are used in combination to ensure that the surface quality of the sample meets high standards. S4: When the thickness reaches the standard, the sample is polished and the surface smoothness of the sample is detected using a roughness sensor. When the specified smoothness is reached, the polishing machine stops working and a metal mineral slice that meets the requirements is obtained; The step S1 specifically includes the following sub-steps: S1.1: If the sample surface is dry when in contact with the grinding disc, damage and safety hazards may occur. Therefore, adding a certain amount of water and abrasive during rough grinding is essential. First, fully adhere the sample to the grinding disc of the grinding machine, start the grinding machine, and control the addition of a certain amount of water and abrasive. Green silicon carbide is used as the abrasive, and the sand-to-water ratio is 3:

1. A thickness sensor is used to measure the sample thickness T0 in real time, and the target thickness T is set to 3 cm. A nonlinear function is used to describe the relationship between grinding time and thickness to more accurately control the grinding process. The formula is: ； Where Δt is the time required for grinding, α represents the basic time constant during the grinding process, which depends on the grinding efficiency of the equipment and is determined by experiments to be in the range of 0.1 to 1.0; β is an exponential parameter that determines the sensitivity of the grinding time to the thickness difference, and is between 1.2 and 2.0 to control the degree of response of the time during the grinding process to the thickness difference; When the thickness T satisfies T ≤ 3 cm, the sensor signal S(T) triggers the microcontroller to stop the grinding disc; the amount of water and abrasive added is dynamically calculated based on time and real-time thickness, and the formula is: ； ； K1 represents the initial amount of water added, which is the basic amount of water required at the beginning of the grinding process; K2 represents the initial amount of abrasive added, which affects the cutting ability during the grinding process; λ represents the time decay factor of the water amount, which is used to control the water addition rate and has a value between 0.01 and 0.1; μ is the reaction coefficient of abrasive addition to thickness, which affects the addition of abrasive at different thicknesses and has a value between 0.1 and 0.5; when the thickness reaches the specified standard, the alarm set in the single-chip microcomputer system automatically sounds, and the single-chip microcomputer receives the signal and drives the motor to immediately stop the rotation of the grinding disc; S1.2: Because ore samples will become loose if they absorb too much water, to prevent moisture from affecting the integrity and hardness of the sample, the rough-ground metal mineral sample needs to be manually flattened. After step S1.1 is completed, the sample is grabbed by a robot and placed in an oven. Glue is added to the sample surface and the temperature is increased to bake for 20 minutes. The sample is then checked for dryness. If qualified, the next step can be carried out. The step S2 specifically includes the following sub-steps: S2.1: Select the grinding machine's operating mode and switch it to fine grinding mode. After receiving the grinding machine's start command, the microcontroller adds a certain amount of water and abrasive to the grinding disc. Green silicon carbide is used in the fine grinding stage, and the sand-water ratio is maintained at the same 3:1 as in the coarse grinding stage. The motor is then driven to rotate the grinding disc, and the thickness gauge starts working and measures the sample thickness in real time. The target thickness is reduced to 2 cm. The system uses the thickness sensor to monitor the thickness in real time and adjusts the grinding disc pressure to adapt to different thicknesses. The grinding disc pressure P is adjusted using the quadratic function relationship: ； Where γ represents the sensitivity of the square term to control pressure changes, and its value ranges from 0.01 to 0.05; δ is the linear term coefficient, which reflects the direct effect of thickness changes on pressure, and its value ranges from 0.5 to 2.0; ε is the constant term used to set the base pressure; When the thickness T satisfies T > 2 cm, the grinding wheel continues to operate; through the sensor signal S(T), when T reaches the target, the microcontroller sends a stop signal; S2.2: Use the robot to grab the sample and put it into the oven for flat surface treatment. Bake it for 20 minutes. Unlike step S1.2, no glue is added to fix the sample during the flat surface treatment, because the sample will not be loose after the treatment in step S1. Step S3 specifically includes: the grinding machine is switched to a high-precision grinding mode, and the single-chip microcomputer system drives the motor to rotate the grinding disc at a fixed low speed; to ensure that the smoothness and thickness of the sample meet high-precision standards, white corundum powder is used in the high-precision grinding stage. This material is added in three stages to gradually improve the surface smoothness of the sample; the grinding disc rotates forward and reverse for a fixed time between each addition of abrasive powder to perform grinding; while the grinding machine is operating, a thickness detector measures the thickness of the metal mineral sample in real time, with the target sample thickness T being between 0.9 and 1.2 cm and roughness H ≤ 0.5 mm; the thickness and roughness during the grinding process are measured using the functional relationship: ； ； Where η is the time attenuation coefficient of thickness change, which controls the thickness reduction rate; κ is the time function adjustment coefficient, which is used to control the processing rhythm; ζ is the factor that controls the roughness improvement rate; τ is the control parameter of the influence of time on roughness, which describes the thickness and roughness change trend with time t. The system sets the logical judgment conditions as: (0.9 ≤ T ≤ 1.2) and H ≤ 0.

5. When the conditions are met, the microcontroller stops the grinding operation.

2. The method for intelligently polishing a metal or mineral optical sheet according to claim 1, characterized in that: The step S4 specifically includes: using a manipulator to grab the sample after high-precision grinding and place it into a polishing machine, the single-chip computer system receives a signal and adds polishing lubricant to the polishing machine, and using a roughness sensor to detect the surface smoothness of the sample to ensure that the final roughness reaches or exceeds 0.5 mm; The amount of polishing lubricant added at this stage, L, is calculated based on a nonlinear time function to ensure polishing uniformity and effectiveness: ； Where L0 is the initial addition amount, ν is the rate factor of change of lubricant addition, which controls the initial addition speed of the lubricant and takes a value between 0.1 and 0.3; ξ is the exponential parameter of time, which adjusts the change curve of the addition rate and takes a value between 1.0 and 1.5; the sensor measures the surface roughness H. When H = 0.5, the signal S(H) triggers the alarm of the microcontroller system to automatically sound an alarm. The microcontroller receives the stop signal and drives the motor to stop the polishing machine; the staff uses the robot arm to grab the sample and place it in a fixed position to obtain the metal mineral optical section that meets the requirements of process mineralogy.

3. The method for intelligently polishing a metal or mineral optical sheet according to claim 2, characterized in that: The specific working process of the robot includes: The manipulator uses forward kinematics to analyze the position and posture of the manipulator end when the joint angle is given. It is represented by a homogeneous transformation matrix, which is obtained by multiplying the rotation matrix and displacement matrix of multiple joints. Assuming that the manipulator has n joints, the transformation of each joint includes a rotation matrix and a translation matrix. The end position P e The specific formula is: ； Where T k represents the translation matrix, R represents the rotation matrix, θ i is the angle of each joint; Dynamic control ensures that the manipulator operates within physical constraints. The Lagrangian method is used to model the system. The Lagrangian function L is defined as the difference between kinetic energy K and potential energy V, that is, L = K - V; Then the joint torque τ is obtained by the Lagrange equation k : ； θ' represents the angular velocity, τ k represents the control torque of the joint; Combined with force feedback control, the accuracy and safety of grasping can be improved. The force sensor is installed at the end of the manipulator to detect the actual force F during the grasping process. actual ; In order to maintain stable grasping, the control system needs to actual With the set gripping force F set For comparison, ΔF is used as the adjustment condition: ； If the allowable error ΔF is exceeded, the torque output is adjusted through PD or PID control: ； Make the control process have good dynamic response; In the positioning and visual recognition stages, cameras and image processing technologies are combined to achieve real-time recognition and calibration of sample position and posture. The sample recognition steps include image acquisition, preprocessing, edge detection, and finding the precise location of the sample through template matching. When performing grasping and placing tasks, the robot must accurately execute actions according to the calculated path and torque; during the sample grasping process, the robot first determines the grasping point through vision, calculates the grasping posture using inverse kinematics, and approaches the sample at a low speed to ensure stability; when moving to the target equipment such as an oven or polishing machine, the path must be continuously monitored and dynamically adjusted based on sensor feedback; in the final placement stage, the robot needs to slowly reduce the speed V to near zero to reduce impact and ensure that the sample is placed safely, securely and accurately.

4. An apparatus for implementing the method according to any one of claims 1 to 3, characterized in that: The invention comprises a grinding device (1) and a polishing device (2), wherein the grinding device (1) comprises a grinding disc assembly (101), a driving motor (102), a grinding pressure regulating mechanism (103) and an automatic water and sand adding system (104); the grinding disc assembly (101) specifically comprises a grinding disc made of a high-strength alloy, the surface of which is covered with a wear-resistant coating to extend the service life; the grinding disc is connected to the driving motor (102) via a connecting shaft, and the driving motor (102) controls its rotation speed to adapt to different grinding requirements; the grinding pressure regulating mechanism (103) applies precise downward pressure to the grinding disc through a hydraulic or mechanical device and a mechanical connection between a lever and the grinding disc; the automatic water and sand adding system (104) comprises a stainless steel water tank, an aluminum grinding silo, a transmission pipe made of corrosion-resistant plastic material, and an electronic valve controlled by a single-chip microcomputer, and these components are fixed to the frame of the grinding device (1) through precision fittings and sealing connectors, and are connected to a central control system by a control cable to achieve precise distribution of grinding media.

5. The device according to claim 4, characterized in that: The polishing device (2) comprises a polishing disc (201), a lubricating liquid adding system (202) and a polishing drive system (203); the polishing disc (201) is connected to a brushless motor provided in the polishing drive system (203) via a wear-resistant gear, and the brushless motor provides a constant and stable torque; the lubricating liquid adding system (202) is composed of a stainless steel liquid storage tank, a metering pump, a rubber pipe and a precision nozzle, and the nozzle is installed in a matrix form above the polishing disc (201), and the flow rate and distribution of the lubricating liquid are controlled by an electromagnetic valve to ensure uniformity during the polishing stage.

Images