Screen printing device for stack type high-voltage piezoelectric ceramic bonding process

Abstract

The invention relates to the technical field of piezoelectric device preparation, and discloses a silk-screen printing device for a stack type high-voltage piezoelectric ceramic bonding process, which sequentially comprises an operation table, a ceramic fixing device and a base from top to bottom. The operation table comprises a master control device, a pressure rod, a sliding support, a sliding rod, a retainer and a silk screen. The two sides of the master control device are fixedly connected with the sliding supports, the two sides of the holder are fixedly connected with the sliding rods, and the sliding supports are slidably arranged on the peripheries of the sliding rods in a sleeving mode and used for enabling the master control device to move above the holder. The silk screen is arranged on the inner side of the holder. And a glue discharging plate and a glue extruding plate are arranged on the master control device opposite to the silk screen. And a controller of the master control device controls the ascending and descending of the glue discharging plate and the glue extruding plate. The glue layer coated on the surface of the piezoelectric ceramic is uniform and flat, the thickness of the glue layer is easy to control, and the glue can be recycled. And each layer of piezoelectric ceramics is good in thickness consistency, tidy in stacking and firm in bonding. The device is simple and reasonable in overall structure, easy to operate and high in production efficiency.

Description

Technical Field

[0001] The present invention belongs to the technical field of piezoelectric device preparation, and in particular, relates to a screen printing device for a stacked high-voltage piezoelectric ceramic bonding process. Background Art

[0002] The process of manufacturing high-voltage piezoelectric ceramic stacks requires the appearance and parameter testing of piezoelectric ceramics. After passing the test, the surface of the piezoelectric ceramics needs to be processed. The glue used for piezoelectric ceramic bonding is applied to the surface of the processed piezoelectric ceramics, and then a series of processing processes such as debonding, alignment, and curing are performed to finally obtain qualified high-voltage piezoelectric ceramics.

[0003] In the glue coating step, the glue needs to be evenly applied to the surface of the piezoelectric ceramics, and there are high requirements for the thickness of the glue coating. If the glue layer is too thick, the amount of excess glue squeezed out during the subsequent glue discharge process will be too large, causing waste; if the glue layer is too thin, it will easily lead to poor bonding effect and weak bonding of the piezoelectric ceramics. Therefore, it is very important to ensure the thickness of the glue layer and the uniformity of the coating in the glue coating step.

[0004] Based on the above, the present invention provides a screen printing device for stacked high-voltage piezoelectric ceramic bonding process, which has uniform and smooth glue coating, good thickness consistency, firm piezoelectric ceramic bonding, recyclable glue, and simple operation. Summary of the invention

[0005] The purpose of the present invention is to provide a screen printing device for stacked high-voltage piezoelectric ceramic bonding process, aiming to solve the problems in the prior art of poor uniformity and flatness of piezoelectric ceramic glue coating, poor thickness consistency, weak piezoelectric ceramic bonding, non-recyclable glue, and complicated operation.

[0006] The present invention is implemented as follows: a screen printing device for stacked high-voltage piezoelectric ceramic bonding process, which includes an operating table, a ceramic fixing device and a base from top to bottom;

[0007] The operating table includes a master control device, a pressure rod, a sliding support, a slide bar, a retaining frame and a screen; the two sides of the master control device are respectively fixedly connected to the sliding support, the two sides of the retaining frame are respectively fixedly connected to the slide bar, the sliding support is slidably sleeved on the outer periphery of the slide bar, and is used for the master control device to move above the retaining frame; the screen is arranged on the inner side of the retaining frame; the master control device is provided with a glue removal plate for applying glue on the screen and a glue squeezing plate for squeezing glue through the screen at a position directly opposite to the screen, the two sides of the master control device are rotatably connected to the two ends of the pressure rod, and the pressure rod is used to position the glue removal plate and the glue squeezing plate above the screen; a controller is arranged inside the master control device, and the controller controls the lifting and lowering of the glue removal plate and the glue squeezing plate;

[0008] The base comprises a bottom plate, and the operating table is movably connected to the bottom plate;

[0009] The ceramic fixing device is arranged on the bottom plate and below the wire mesh, and is used for placing the piezoelectric ceramic.

[0010] Furthermore, the ceramic fixing device includes, from top to bottom, a multi-layer sleeve plate, a bottom sleeve plate and a glue-bearing plate;

[0011] The bottom sleeve is provided with a plurality of grooves for placing the first layer of piezoelectric ceramics, and the edges of the grooves are provided with glue leakage holes; the multilayer sleeve is provided with through holes of the same shape and size corresponding to the grooves, and the through holes are used to place the second layer of piezoelectric ceramics glued to the first layer of piezoelectric ceramics;

[0012] The glue receiving plate is provided with glue receiving grooves below the plurality of grooves corresponding to the plurality of grooves, and the glue receiving grooves are used to receive the excess glue flowing out of the glue leakage holes.

[0013] Furthermore, telescopic positioning pins are provided at the four corners of the adhesive support plate, and pin holes are provided on the multi-layer sleeve plate and the bottom sleeve plate corresponding to the telescopic positioning pins. The telescopic positioning pins pass through the pin holes, and the multi-layer sleeve plate and the bottom sleeve plate are aligned and stacked on the adhesive support plate in sequence.

[0014] Furthermore, a pull rod is provided on the master control device, and the pull rod is used to pull the operating platform to move forward and backward above the retaining frame.

[0015] Furthermore, the master control device is provided with a pressure gauge and a locking button, the controller is electrically connected to a pressure sensor, the pressure gauge is used to display the pressure value of the rubber extrusion plate extruding the wire mesh measured by the pressure sensor; the locking button is used to lock the descending height of the rubber extrusion plate corresponding to the required extrusion pressure.

[0016] Furthermore, a table adjustment screw for adjusting the height is provided on one side of the retaining frame; a base adjustment screw is provided between the other side of the retaining frame and the bottom plate; the table adjustment screw is used in conjunction with the seat adjustment screw to jointly adjust the distance between the screen and the base.

[0017] Furthermore, the silk screen is provided with a mark for positioning the silk screen and the ceramic fixing device.

[0018] Furthermore, the bottom plate is also provided with an adjustment micrometer that abuts against the four sides of the ceramic fixing device for adjusting the position.

[0019] Furthermore, two rotating shaft supports are provided on the bottom plate, and a rotating shaft is provided between the two rotating shaft supports; and the retaining frame is rotatably connected to the rotating shaft.

[0020] Furthermore, a foot pad for support is provided at the bottom of the base plate.

[0021] The glue coating of the invention is uniform and smooth, the glue quantity and thickness are accurately controlled, and the thickness is consistent; the glue can be recycled and reused, and the operation is simple and efficient.

[0022] The beneficial effects of the present invention are as follows:

[0023] 1. The movable and lifting glue removal plate, glue squeezing plate and the screen with adjustable mesh opening are matched. After the glue removal and squeezing processes, the glue layer applied on the piezoelectric ceramics is even and flat, with precise thickness control and good consistency.

[0024] 2. The structural design of the ceramic fixture ensures the neat and firm bonding of the stacked high-voltage piezoelectric ceramics. The number of multi-layer plates can be set as needed to meet personalized needs. The setting of the glue leakage hole and the glue receiving groove can recycle the excess glue for reuse, which is green and energy-saving. By adjusting the micrometer to adjust the alignment relationship between the ceramic fixture and the screen or the screen mark, it is further guaranteed that the glue layer is applied accurately, evenly and flatly.

[0025] 3. The pressure gauge and the lock button are set to ensure that the thickness of the glue layer applied to each layer of piezoelectric ceramics is consistent and uniform. The operating table adjustment screw and the seat adjustment screw jointly adjust the distance between the screen and the base, making the entire operation more precise and the equipment running more stable.

[0026] 4. The screen printing device of the present invention has a simple and reasonable overall structure, is easy and reliable to operate, and has high production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a schematic diagram of the three-dimensional structure of a screen printing device for a stacked high-voltage piezoelectric ceramic bonding process provided by the present invention;

[0028] Figure 2 A schematic diagram of the three-dimensional structure of the operating table provided by the present invention;

[0029] Figure 3 A right side view of the operating table provided by the present invention;

[0030] Figure 4 The ceramic fixing device and base combination provided by the present invention Figure 3 Schematic diagram of the three-dimensional structure;

[0031] Figure 5 is an exploded view of the ceramic fixture provided by the present invention;

[0032] In the figure: 1-operating table; 101-master control device; 102-pressure gauge; 103-pressure rod; 104-sliding support; 105-sliding rod; 106-cage; 107-wire screen; 108-pull rod; 109-locking button; 110-operating table adjusting screw; 111-cage chamfer; 112-glue squeezing plate; 113-glue discharge plate; 2-ceramic fixing device; 201-multi-layer sleeve; 202-bottom sleeve; 203-glue bearing plate; 204-piezoelectric ceramic; 205-telescopic positioning pin; 206-pin hole; 207-glue leakage hole; 208-glue bearing groove; 3-base; 301-rotating shaft; 302-rotating shaft support; 303-bottom plate; 304-foot pad; 305-base adjusting screw; 306-adjusting micrometer. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0034] The implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0035] The same or similar numbers in the drawings of this embodiment correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limitations on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0036] Reference Figure 1-5 The figure shows a preferred embodiment of the present invention.

[0037] A screen printing device for stacked high-voltage piezoelectric ceramic bonding process, comprising, from top to bottom, an operating table 1, a ceramic fixing device 2 and a base 3, referring to Figure 1 The operating table 1 includes a master control device 101, a pressure gauge 102, a pressure rod 103, a sliding support 104, a sliding rod 105, a retaining frame 106, a screen 107, a pull rod 108, a locking button 109, an operating table adjustment screw 110, a retaining frame chamfer 111, a glue squeezing plate 112 and a glue removal plate 113, refer to Figure 2 , Figure 3 .

[0038] The left and right sides of the master control device 101 are respectively fixedly connected to a sliding support 104, and the left and right sides of the holder 106 are respectively fixedly connected to a sliding rod 105. The sliding support 104 can be slidably sleeved on the outer periphery of the sliding rod 105. Through the sliding support 104 and the sliding rod 105 being slidably connected, the master control device 101 moves back and forth above the holder 106. The wire mesh 107 is arranged on the inner side of the holder 106. The wire mesh 107 can be provided with a semi-permeable net with adjustable mesh opening size, and the corresponding mesh opening can be designed according to the shape and size of the piezoelectric ceramic 204 to be coated. The connection between the wire mesh 107 and the holder 106 can be set to a detachable connection, and a strip groove is provided on the inner side of the holder 106. The frame size of the surrounding of the wire mesh 107 matches the strip groove. When in use, the wire mesh 107 is inserted into the strip groove and can be pulled out from the strip groove when replaced. A mark is processed on the wire mesh 107, which can be used for positioning between the wire mesh 107 and the ceramic fixing device 2.

[0039] The master control device 101 is provided with glue removal plates 113 and glue squeezing plates 112 at intervals toward the screen 107. The glue removal plates 113 are used to spread the glue applied on the screen 107 all over the screen 107. The glue squeezing plates 112 are used to squeeze the glue that has spread all over the screen 107 through the screen 107 and apply it on the piezoelectric ceramic 204. The two sides of the master control device 101 are rotatably connected to the two ends of the pressure rod 103, and the connection between the two ends of the pressure rod 103 and the two sides of the master control device 101 forms a closed loop for the pressure rod 103. The pressure rod 103 is used to position the glue removal plates 113 and the glue squeezing plates 112 above the screen 107. The master control device 101 is provided with a controller, and the controller adjusts the rise and fall of the glue removal plates 113 and the glue squeezing plates 112. The front side of the master control device 101 is provided with a pull rod 108, and pulling the pull rod 108 can move the movable operating table 1 forward and backward on the retaining frame 106. The pressure rod 103 can be manually pressed down and automatically reset. When it is pressed down to the same level as the pull rod 108, the master control device 101 can be pulled to slide forward and backward.

[0040] The master control device 101 is provided with a pressure gauge 102 and a locking button 109. The master control device 101 is provided with a pressure sensor, which is used to measure the pressure of the glue squeezing plate 112 squeezing the screen 107. The pressure sensor is electrically connected to the controller. The pressure gauge 102 is used to display the pressure value of the glue squeezing plate 112 squeezing the screen 107 measured by the pressure sensor. The locking button 109 is used to lock the descending height of the glue squeezing plate 112 corresponding to the required squeezing pressure. The locking button 109 is a downward locking control, and the locking button 109 is used to lock the descending height of the glue squeezing plate 112 corresponding to the required squeezing pressure, which can ensure that the subsequent downward pressure is the same.

[0041] The ceramic fixture 2 is used to place the piezoelectric ceramic 204, which is arranged on the bottom plate 303 and below the screen 107. The ceramic fixture 2 includes a multilayer plate 201, a bottom plate 202 and a rubber plate 203 from top to bottom. The layer plate 201, the bottom plate 202 and the rubber plate 203 are preferably rectangular plates of comparable size. Figure 5 . The bottom sleeve 202 is provided with a plurality of grooves for placing the first layer of piezoelectric ceramics 204. The shape and size of the recesses are set according to the shape and size of the piezoelectric ceramics 204, for example, they can be set to be rectangular, circular, rectangular ring, or circular ring. The edge of the groove is provided with a glue leakage hole 207. When the groove is rectangular, the glue leakage hole 207 can be set at the four corners to allow excess glue applied to the first layer of piezoelectric ceramics 204 to flow downward to the glue receiving plate 203. The multilayer sleeve 201 is provided with a plurality of through holes of the same shape and size as the grooves. The through holes are used to place the second layer of piezoelectric ceramics 204 glued to the first layer of piezoelectric ceramics 204, that is, the bottom of the second layer of piezoelectric ceramics 204 placed in the through holes is directly in contact with the glue on the top of the first layer of piezoelectric ceramics 204. N multilayer sleeves 201 are set on the bottom sleeve 202 as needed, and N≥1.

[0042] The bottom of the adhesive plate 203 contacts the bottom plate 303. Figure 4 At least one glue receiving groove 208 is provided below the glue receiving plate 203 corresponding to the plurality of grooves. The glue receiving groove 208 can receive the excess glue flowing out of the glue leakage hole 207. Telescopic positioning pins 205 are provided at the four corners of the glue receiving plate 203. Pin holes 206 are provided in the multi-layer sleeve 201 and the bottom sleeve 202 corresponding to the positions of the telescopic positioning pins 205. The telescopic positioning pin 205 penetrates the pin hole 206, and the telescopic positioning pin 205 and the through-pin hole 206 cooperate to ensure that the multi-layer sleeve 201 and the bottom sleeve 202 are aligned and stacked on the glue receiving plate 203, that is, the through holes correspond to the grooves one by one.

[0043] The bottom plate 303 is also provided with an adjustment micrometer 306 that abuts against the four sides of the ceramic fixture 2. The fine adjustment micrometer 306 can push the ceramic fixture 2 connected thereto, adjust the position of the ceramic fixture 2, and thus ensure that the relative positions of the piezoelectric ceramic 204 and the screen 107 placed thereon are correct.

[0044] The base 3 is movably connected to the operating table 1. Figure 4The base 3 includes a bottom plate 303, two rotating shaft supports 302 are provided on one side of the bottom plate 303, and a rotating shaft 301 is provided between the two rotating shaft supports 302. The bottom of one side of the retainer 106 is rotatably connected to the rotating shaft 301. The retainer 106 is provided with a retainer chamfer 111 for facilitating the rotation of the retainer 106. The rotating shaft 301 cooperates with the rotating shaft support 302 to connect the base 3 and the operating table 1 together, and ensure that the operating table 1 can rotate along the rotating shaft 301. The operating table 1 can rotate in a direction close to or away from the base 3, so as to facilitate the placement or removal of the ceramic fixture 2.

[0045] In order to adjust the distance between the screen 107 and the base 3, the holder 106 is provided with a height-adjusting operating table adjusting screw 110 on one side of the rotating shaft 301, and the operating table adjusting screw 110 can adjust the height of one side of the holder 106. A base adjusting screw 305 is provided between the other side of the holder 106 and the bottom plate 303. The base adjusting screw 305 is rotatably arranged on the bottom plate 303, and the top of the base adjusting screw 305 abuts against the bottom of the holder 106. Two base adjusting screws 305 are symmetrically arranged. The base adjusting screw 305 can adjust the distance between the base 3 and the other side of the holder 106. The operating table adjusting screw 110 and the seat adjusting screw 305 are used in conjunction to adjust the distance between the screen 107 and the base 3 together, and the distance can be locked after the adjustment is completed. A foot pad 304 for support is also provided at the bottom of the bottom plate 303.

[0046] Working principle:

[0047] When performing the stacked high-voltage piezoelectric ceramic bonding process, after the piezoelectric ceramic 204 is processed, the first layer of piezoelectric ceramic 204 is placed in the groove on the bottom sleeve 202. The distance between the holder 106 and the first layer of piezoelectric ceramic 204 is changed by adjusting the base adjustment screw 305 and the operating table adjustment screw 110, so that the screen 107 is in contact with the first layer of piezoelectric ceramic 204. The fine adjustment micrometer 306 is adjusted so that the ceramic fixture 2 corresponds to the marked position of the screen 107.

[0048] Squeeze glue onto the screen 107, press down the pressure rod 103 to the horizontal position with the pull rod 108, and then pull the master control device 101 to slide forward and backward. Before pulling forward, the glue removal plate 113 drops to contact the screen 107. During the forward pulling process, the glue removal plate 113 squeezes the glue to each mesh opening on the screen 107. Before the master control device 101 slides backward, the glue removal plate 113 rises and the glue squeezing plate 112 drops to a state where a certain degree of compression is formed with the screen 107. During the backward sliding process, the glue squeezing plate 112 squeezes the glue onto the first layer of piezoelectric ceramics 204.

[0049] During the whole process of glue coating, the pressure gauge 102 can display the pressure at each glue coating. The amount of glue on the piezoelectric ceramic 204 corresponds to the pressure of the pressure gauge 102, and the pressure corresponds to the amount of compression of the screen 107 by the glue squeezing plate 112. By adjusting the amount of compression of the screen 107 by the glue squeezing plate 112, the amount of glue applied each time is controlled, and the pressure value corresponding to the appropriate amount of glue is displayed in real time by the pressure gauge 102. When the appropriate pressure is found, the locking button 109 can be adjusted, that is, the descending height of the glue squeezing plate 112 can be locked, and the pressure is controlled to be the same each time thereafter, thereby ensuring that the thickness of the glue layer applied to the piezoelectric ceramic 204 is consistent and uniform each time.

[0050] After the first layer of piezoelectric ceramics 204 is coated with glue, a multilayer sleeve 201 can be installed on the bottom sleeve 202. The second layer of the first layer of piezoelectric ceramics 204 is placed in the through hole, and the second layer of the first layer of piezoelectric ceramics 204 is directly in contact with the glue layer of the first layer of piezoelectric ceramics 204, and glue is applied according to the above steps. Due to the extrusion of the glue squeezing plate 112, the glue between the two layers of piezoelectric ceramics 204 can be squeezed out and flow into the glue receiving groove 208 through the glue leakage hole 207, thereby completing the glue coating and glue removal process at the same time. The multilayer sleeve 201 can be installed according to the number of piezoelectric ceramics 204 to be bonded. Each time a layer is added, a new piezoelectric ceramic 204 is placed in the through hole, and glue is applied according to the above steps.

[0051] The present invention is not limited thereto; any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A screen printing device for stacked high-voltage piezoelectric ceramic bonding process, characterized in that: It includes, from top to bottom, an operating table (1), a ceramic fixing device (2) and a base (3); The operating table (1) comprises a master control device (101), a pressure rod (103), a sliding support (104), a slide bar (105), a retaining frame (106) and a screen (107); two sides of the master control device (101) are respectively fixedly connected to the sliding support (104); two sides of the retaining frame (106) are respectively fixedly connected to the slide bar (105); the sliding support (104) is slidably sleeved on the outer periphery of the slide bar (105) for the master control device (101) to move above the retaining frame (106); the screen (107) is arranged on the inner side of the retaining frame (106). ; The master control device (101) is provided with a glue removal plate (113) for applying glue to the wire mesh (107) and a glue squeezing plate (112) for squeezing glue through the wire mesh (107) at a position opposite to the wire mesh (107); both sides of the master control device (101) are rotatably connected to the two ends of the pressure rod (103); the pressure rod (103) is used to position the glue removal plate (113) and the glue squeezing plate (112) above the wire mesh (107); the master control device (101) is provided with a controller, and the controller controls the lifting and lowering of the glue removal plate (113) and the glue squeezing plate (112); The base (3) comprises a bottom plate (303), and the operating table (1) is movably connected to the bottom plate (303); The ceramic fixing device (2) is arranged on the bottom plate (303) and below the wire mesh (107), and is used to place the piezoelectric ceramic (204).

2. The screen printing device for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that: The ceramic fixing device (2) comprises, from top to bottom, a multi-layer sleeve plate (201), a bottom sleeve plate (202) and a glue-bearing plate (203); The bottom sleeve (202) is provided with a plurality of grooves for accommodating the first layer of piezoelectric ceramics (204), and the edges of the grooves are provided with glue leakage holes (207); the multilayer sleeve (201) is provided with through holes of a shape and size corresponding to the grooves, and the through holes are used to place the second layer of piezoelectric ceramics (204) glued to the first layer of piezoelectric ceramics (204); The glue receiving plate (203) is provided with glue receiving grooves (208) below the plurality of grooves corresponding to the plurality of grooves, and the glue receiving grooves (208) are used to receive excess glue flowing out of the glue leakage holes (207).

3. The screen printing device for stacked high-voltage piezoelectric ceramic bonding process according to claim 2, characterized in that: The four corners of the adhesive support plate (203) are provided with telescopic positioning pins (205); the multi-layer sleeve plate (201) and the bottom sleeve plate (202) are provided with pin holes (206) corresponding to the telescopic positioning pins (205); the telescopic positioning pins (205) pass through the pin holes (206); the multi-layer sleeve plate (201) and the bottom sleeve plate (202) are aligned and stacked on the adhesive support plate (203) in sequence.

4. The screen printing device for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that: The master control device (101) is provided with a pull rod (108), and the pull rod (108) is used to pull the operating platform (1) to move forward and backward above the retaining frame (106).

5. The screen printing device for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that: The master control device (101) is provided with a pressure gauge (102) and a locking button (109); the controller is electrically connected to a pressure sensor; the pressure gauge (102) is used to display the pressure value of the glue squeezing plate (112) squeezing the screen (107) measured by the pressure sensor; and the locking button (109) is used to lock the descending height of the glue squeezing plate (112) corresponding to the required squeezing pressure.

6. The screen printing device for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that: An operating table adjusting screw (110) for adjusting the height is provided on one side of the retaining frame (106); a base adjusting screw (305) is provided between the other side of the retaining frame (106) and the bottom plate (303); the operating table adjusting screw (110) and the base adjusting screw (305) are used in conjunction with each other to jointly adjust the distance between the screen (107) and the base (3).

7. The screen printing device for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that: The wire mesh (107) is provided with a mark used for positioning the wire mesh (107) and the ceramic fixing device (2).

8. The screen printing device for stacked high-voltage piezoelectric ceramic bonding process according to claim 7, characterized in that: The bottom plate (303) is also provided with an adjustment micrometer (306) abutting against the four sides of the ceramic fixing device (2) for adjusting the position.

9. The screen printing device for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that: Two rotating shaft supports (302) are provided on the bottom plate (303), and a rotating shaft (301) is provided between the two rotating shaft supports (302); the retaining frame (106) is rotatably connected to the rotating shaft (301).

10. The screen printing device for stacked high-voltage piezoelectric ceramic bonding process according to claim 1, characterized in that: A foot pad (304) for support is provided at the bottom of the base plate (303).

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