A lifting drying equipment suitable for multi-size wafer processing

Abstract

The present application relates to a lifting drying device suitable for processing wafers of multiple sizes, and belongs to the technical field of wafer production equipment. The lifting drying device suitable for processing wafers of multiple sizes of the present application is composed of a trough body, a cover body, a water and gas supply system and a wafer lifting mechanism, and a wafer basket support frame is provided on the wafer lifting mechanism. The wafer basket support frame utilizes three support blocks, namely the first support block, the second support block and the third support block, and two side plates to realize a support frame to support two first wafer baskets and second wafer baskets of different sizes, so that the wafer cleaning production equipment can directly adapt to wafers of different sizes, improve the adaptability of the equipment, and at the same time, the support for the wafer basket is stable and reliable.

Description

Technical Field

[0001] The present application belongs to the technical field of wafer production equipment, and in particular relates to a lifting drying device suitable for processing wafers of multiple sizes. Background Art

[0002] Semiconductor wafer cleaning requires a series of processes, including alkaline cleaning, pure water cleaning, hydrofluoric acid cleaning, ozone water cleaning, and drying. Wafer drying is typically the final step in wafer cleaning, removing residual cleaning solution from the wafer surface, preventing wafer oxidation, and controlling surface moisture and cleanliness. Whether drying or cleaning, a support frame is required to support the wafer basket. Chinese patent document CN115295441A discloses a wafer cleaning and drying apparatus comprising a trough, a lid, a water and air supply system, and a wafer lifting mechanism. The wafer lifting mechanism is equipped with a support frame for the wafer basket. Wafers are placed in the trough for cleaning. During drying, the wafer lifting mechanism raises the wafer basket and then individually transfers the wafers into the lid for drying. Currently, wafers come in a variety of sizes, including 6 inches, 8 inches, and even 12 inches. Sometimes, a single device needs to process wafers of varying sizes. In this case, existing wafer cleaning and drying equipment cannot accommodate wafer baskets and wafers of varying sizes. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a lifting drying device that can be used for processing wafers of multiple sizes in order to solve the deficiencies in the prior art.

[0004] The technical solution adopted by the present invention to solve its technical problem is:

[0005] A lifting drying device suitable for processing wafers of multiple sizes, comprising:

[0006] trough body;

[0007] The cover is arranged above the trough body and can reach or leave the opening of the trough body under the drive of the translation mechanism. The inner wall of the cover is provided with a wafer guide groove, which can cooperate with the wafer slot in the wafer basket;

[0008] A water and gas supply system is used to supply cleaning water to the tank or drying gas to the cover;

[0009] A wafer lifting mechanism is used to carry the wafer basket and bring the wafers into the tank body. When drying, the wafers are pushed into the cover body. The wafer lifting mechanism is provided with a wafer basket support frame for supporting the wafer basket.

[0010] The wafer basket support frame includes:

[0011] base;

[0012] There are two side panels, located at both ends of the base;

[0013] The first support block, the second support block and the third support block are all arranged on the base between the two side plates, and the third support block is located between the first support block and the second support block;

[0014] The first support block is provided with a first step tread and a second step tread, the second support block is provided with a third step tread, and the third support block is provided with a fourth step tread. The third step tread is provided at a lower height than the second step tread. The first step tread and the third step tread are of the same height, and the second step tread and the fourth step tread are of the same height.

[0015] The first step tread and the third step tread are used to support the bottom of the first wafer basket, and the side surface of the second support block and one of the side plates limit the side surface of the first wafer basket;

[0016] The second step tread and the fourth step tread are used to support the bottom of the second wafer basket, and the two side plates limit the side surfaces of the second wafer basket.

[0017] Preferably, in the lifting drying equipment suitable for multi-size wafer processing of the present invention, the orientation of the first step riser corresponding to the second step tread is opposite to the orientation of the second step riser corresponding to the third step tread.

[0018] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the first supporting block has a U-shaped groove, and the bottom of the U-shaped groove is the first step surface.

[0019] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the middle of the side plate is hollowed out, and the top plate is installed on the side plate.

[0020] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the top surfaces of the first step tread, the second step tread, the third step tread, and the fourth step tread are inclined surfaces.

[0021] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the third supporting block is located at the midpoint of the two side plates.

[0022] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the middle of the side plate is hollowed out, and a top block is installed between the two side plates.

[0023] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, rows of positioning grooves are formed on the top block.

[0024] Preferably, the lifting drying equipment suitable for multi-size wafer processing of the present invention has three mounting grooves formed on the base, and the first support block, the second support block and the third support block are installed in the mounting grooves, and the installation of the first support block, the second support block and the third support block can be positioned through the mounting grooves.

[0025] Preferably, in the lifting drying equipment applicable to multi-size wafer processing of the present invention, the first wafer basket is a 6-inch wafer basket for accommodating 6-inch wafers, and the second wafer basket is an 8-inch wafer basket for accommodating 8-inch wafers.

[0026] The beneficial effects of the present invention are:

[0027] The present application discloses a lifting drying device suitable for processing wafers of various sizes. The device comprises a trough, a cover, a water and gas supply system, and a wafer lifting mechanism. A wafer basket support frame is provided on the wafer lifting mechanism. The wafer lifting mechanism can push the wafers in the wafer basket on the wafer basket support frame into the cover body to complete drying within the cover body. At this time, the wafers are separated from the wafer basket, completely overcoming the obstruction of the wafer basket to the drying gas and achieving an efficient wafer drying effect. The wafer basket support frame utilizes three support blocks, namely the first support block, the second support block, and the third support block, and two side plates to realize a support frame supporting two first wafer baskets and second wafer baskets of different sizes. This allows the lifting drying device to directly adapt to wafers of different sizes, improves the adaptability of the device, and provides stable and reliable support for the wafer basket. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The technical solution of the present application is further described below with reference to the accompanying drawings and embodiments.

[0029] Figure 1 This is a three-dimensional diagram of a lifting drying device suitable for processing wafers of multiple sizes according to an embodiment of the present application;

[0030] Figure 2 is a three-dimensional diagram of a wafer lifting mechanism according to an embodiment of the present application;

[0031] Figure 3 2 is a schematic structural diagram of a wafer basket support frame according to an embodiment of the present application supporting a 6-inch wafer basket;

[0032] Figure 4 1 is a schematic structural diagram of a wafer basket support frame according to an embodiment of the present application supporting an 8-inch wafer basket;

[0033] Figure 5 2 is a schematic structural diagram of a wafer lifting mechanism according to an embodiment of the present application supporting a 6-inch wafer basket;

[0034] Figure 6 2 is a schematic structural diagram of a wafer lifting mechanism according to an embodiment of the present application supporting an 8-inch wafer basket;

[0035] The reference numerals in the figures are:

[0036] 1 Wafer basket support frame;

[0037] 2 tank body;

[0038] 3. Cover;

[0039] 4. Water and gas supply system;

[0040] 5. Wafer lifting mechanism;

[0041] 11 base;

[0042] 12 side panels;

[0043] 13 first support block;

[0044] 14 second supporting block;

[0045] 15 third support block;

[0046] 16 top block;

[0047] 51 Mounting Block;

[0048] 52 stand;

[0049] 54 guide block;

[0050] 55 connecting rod mechanism;

[0051] 56 rollers;

[0052] 57 Synchronous wheel;

[0053] 58 wafer basket support rods;

[0054] 59 ejector rod;

[0055] 91 first wafer basket;

[0056] 92 second wafer basket;

[0057] 111 mounting slot;

[0058] 131 First tread;

[0059] 132 Second stair tread;

[0060] 133 First step riser;

[0061] 141 Third stair tread;

[0062] 142 Second step riser;

[0063] 151 fourth stair tread;

[0064] 521 slide rail;

[0065] 522 ball screw transmission pair;

[0066] 531 first slider;

[0067] 532 Second slider. DETAILED DESCRIPTION

[0068] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0069] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0070] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0071] The technical solution of the present application will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0072] Example

[0073] This embodiment provides a lifting drying device suitable for processing wafers of multiple sizes, such as Figure 1 Shown, including:

[0074] Tank 2;

[0075] The cover 3 is arranged above the trough 2 and can reach or leave the opening of the trough 2 under the drive of the translation mechanism. The inner wall of the cover 3 is provided with a wafer guide groove, which can cooperate with the wafer slot in the wafer basket;

[0076] A water and gas supply system 4 is used to supply cleaning water to the tank body 2 or to supply drying gas to the tank body 2 and / or the cover body 3;

[0077] The wafer lifting mechanism 5 is used to carry the wafer basket and bring the wafers into the tank body 2. When drying, the wafers are pushed into the cover body 3. The wafer lifting mechanism 5 is provided with a wafer basket support frame 1 for supporting the wafer basket;

[0078] like Figure 2-6 As shown, the wafer basket support frame 1 includes:

[0079] Base 11;

[0080] There are two side panels 12, located at both ends of the base 11;

[0081] The first support block 13, the second support block 14 and the third support block 15 are all arranged on the base 11 between the two side plates 12, and the third support block 15 is located between the first support block 13 and the second support block 14;

[0082] The first support block 13 is provided with a first step tread 131 and a second step tread 132, the second support block 14 is provided with a third step tread 141, and the third support block 15 is provided with a fourth step tread 151. The third step tread 141 is provided at a lower height than the second step tread 132. The first step tread 131 and the third step tread 141 are at the same height, and the second step tread 132 and the fourth step tread 151 are at the same height.

[0083] The first step tread 131 and the third step tread 141 are used to support the bottom of the first wafer basket, and the side surface of the second support block 14 and one of the side plates 12 limit the side surface of the first wafer basket;

[0084] The second step 132 and the fourth step 151 are used to support the bottom of the second wafer basket, and the two side panels 12 limit the sides of the second wafer basket.

[0085] The present invention discloses a lifting drying apparatus suitable for processing wafers of various sizes. The apparatus comprises a trough 2, a cover 3, a water and gas supply system 4, and a wafer lifting mechanism 5, on which a wafer basket support frame 1 is mounted. The wafer basket support frame 1 utilizes three support blocks—a first support block 13, a second support block 14, and a third support block 15—and two side panels 12 to support two first and second wafer baskets of different sizes. This allows the wafer cleaning production equipment to directly accommodate wafers of varying sizes, improving the equipment's adaptability while providing stable and reliable support for the wafer baskets.

[0086] like Figure 2 As shown, the wafer lifting mechanism 5 includes a mounting seat 51, a stand 52 arranged on the mounting seat 51, a slide rail 521 and a ball screw transmission pair 522 are provided on the stand 52, a first slider 531 and a second slider 532 are slidably provided on the slide rail 521, the first slider 531 is connected to the ball screw transmission pair 522, and a connecting rod mechanism 55 and a guide block 54 are further provided on one side of the stand 52, the connecting rod mechanism 55 connects the first slider 531 and the second slider 532, so as to realize the coupling of the first slider 531 and the second slider 532. The guide block 54 has a guide surface that cooperates with the roller 56 on the connecting rod mechanism 55. When the ball screw transmission pair 522 rotates to drive the first slider 531 to move, the roller 56 moves on the guide surface and limits the relative movement of the first slider 531 and the second slider 532. The relative movement of the first slider 531 and the second slider 532 will make; the first slider 531 is respectively connected to the L-shaped wafer basket support rod 58, and the second slider 532 is connected to the L-shaped top rod 59; the wafer basket support frame 1 is installed on the two wafer basket support rods 58;

[0087] The mounting base 51 is equipped with a motor that drives the synchronous wheel 57, which is coaxially arranged with the screw of the ball screw transmission pair 522. The entire movement process is as follows (when the wafer basket mounting plate is gradually raised from its lowest point): the first and second sliders 531, 532 are connected and move vertically upward together. When they rise close to the cover 3, the first and second sliders 531, 532 separate. During this separation process, the lift pin 59 rises higher than the height of the wafer basket support rods 58. The lift pin 59 (with a push block directly contacting the wafer above it, which extends below the wafer basket) gradually lifts the wafer, separating it from the wafer basket and inserting it into the cover 3.

[0088] Furthermore, the orientation of the first step riser 133 corresponding to the second step tread 132 is opposite to the orientation of the second step riser 142 corresponding to the third step tread 141 , and the wafer basket is positioned laterally by the two risers.

[0089] Furthermore, the first support block 13 has a U-shaped groove, the bottom of which is the first step 131. The U-shaped groove is also used to clamp the bottom of the first wafer basket 91.

[0090] Furthermore, the side panels 12 are hollowed out in the middle. A top block 16 (mounted on the base 11) is mounted between the two side panels 12. This top block 16 is formed with rows of positioning grooves. When a wafer basket is placed on a support frame suitable for multiple wafer basket sizes, the top block 16 can elevate the wafers in the basket to a certain height. The positioning grooves secure the position of the wafers so that they align with the wafer slots in the cover 3. A space is created between the two top blocks 16 to prevent the lifting of the ejector pin 59.

[0091] Furthermore, the top surfaces of the first step 131 , the second step 132 , the third step 141 , and the fourth step 151 are inclined surfaces, forming pointed ends to reduce the contact area with the wafer basket.

[0092] Furthermore, the third support block 15 is located at the midpoint of the two side panels 12 .

[0093] Furthermore, the base 11 is formed with three mounting slots 111, into which the first support block 13, the second support block 14, and the third support block 15 are mounted. The mounting slots 111 allow for positioning of the first support block 13, the second support block 14, and the third support block 15. The first support block 13, the second support block 14, and the third support block 15 are mounted on the base 11 using screws, and elongated holes are provided on the first support block 13, the second support block 14, and the third support block 15 to facilitate position adjustment.

[0094] The applicable multi-size wafer basket support rack of the present application can be used for accommodating a 6-inch wafer basket (first wafer basket 91 ) for accommodating 6-inch wafers or an 8-inch wafer basket (second wafer basket 92 ) for accommodating 8-inch wafers.

[0095] Based on the above-mentioned ideal embodiments of this application, and in accordance with the above description, relevant personnel can make various changes and modifications without departing from the scope of the technical concept of this application. The technical scope of this application is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A lifting drying device suitable for processing wafers of multiple sizes, characterized in that: include: trough body; The cover is arranged above the trough body and can reach or leave the opening of the trough body under the drive of the translation mechanism. The inner wall of the cover is provided with a wafer guide groove, which can cooperate with the wafer slot in the wafer basket; A water and gas supply system for supplying cleaning water into the tank or drying gas into the cover; A wafer lifting mechanism is used to carry the wafer basket and bring the wafers into the tank body. When drying, the wafers are pushed into the cover body. The wafer lifting mechanism is provided with a wafer basket support frame for supporting the wafer basket. The wafer basket support frame includes: base; There are two side panels, located at both ends of the base; The first support block, the second support block and the third support block are all arranged on the base between the two side plates, and the third support block is located between the first support block and the second support block; The first support block is provided with a first step tread and a second step tread, the second support block is provided with a third step tread, and the third support block is provided with a fourth step tread. The third step tread is provided at a lower height than the second step tread. The first step tread and the third step tread are of the same height, and the second step tread and the fourth step tread are of the same height. The first step tread and the third step tread are used to support the bottom of the first wafer basket, and the side surface of the second support block and one of the side plates limit the side surface of the first wafer basket; The second step tread and the fourth step tread are used to support the bottom of the second wafer basket and the two side plates limit the sides of the second wafer basket; The orientation of the first step riser corresponding to the second step tread is opposite to the orientation of the second step riser corresponding to the third step tread; The first support block has a U-shaped groove, and the bottom of the U-shaped groove is the first step surface; Three mounting grooves are formed on the base, and the first support block, the second support block and the third support block are installed in the mounting grooves. The first support block, the second support block and the third support block can be positioned through the mounting grooves.

2. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The top surfaces of the first step tread, the second step tread, the third step tread and the fourth step tread are inclined surfaces.

3. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The third support block is located at the midpoint of the two side plates.

4. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The wafer lifting mechanism comprises a lifting rod capable of being lifted and lowered, and a lifting block is installed on the lifting rod.

5. The lifting drying equipment suitable for multi-size wafer processing according to claim 4 is characterized in that: The top block is formed with rows of positioning grooves.

6. The lifting drying equipment suitable for multi-size wafer processing according to claim 1 is characterized in that: The first wafer basket is a 6-inch wafer basket for accommodating 6-inch wafers, and the second wafer basket is an 8-inch wafer basket for accommodating 8-inch wafers.

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