Damage detection method, device and equipment

Abstract

The invention relates to a damage detection method, device and equipment. According to the method, the temperatures of a plurality of temperature detection points of the same part in to-be-detected equipment can be obtained. Under the normal working condition, the temperature of the same component should be the same everywhere. Therefore, if the temperatures of the multiple temperature detection points are the same, it shows that the to-be-detected equipment is not damaged, and if the temperature of at least one temperature detection point in the multiple temperature detection points is different from the temperatures of the other temperature detection points, it shows that liquid enters the to-be-detected equipment, and the temperature of the part area of the part is affected. Therefore, whether the to-be-detected equipment is damaged or not can be determined according to the temperature relation of the multiple temperature detection points in the to-be-detected equipment, and the purpose of monitoring the damage condition of the to-be-detected equipment in the liquid pipeline is achieved.

Description

Technical Field

[0001] The present invention relates to the field of damage detection technology, and in particular to a damage detection method, device and equipment. Background Art

[0002] Liquid pipelines are generally equipped with various electronic devices to detect parameters such as liquid temperature, flow rate, and pressure to ensure that the parameters of the liquid in the pipeline meet the requirements. For example, temperature sensors and pressure sensors are installed in liquid cooling pipelines to detect the temperature and pressure of the heat exchange medium to ensure that the temperature and pressure of the heat exchange medium meet the requirements and the heat dissipation process can be performed normally.

[0003] However, electronic devices are arranged in liquid pipelines. Once the electronic devices are damaged, liquid will enter the electronic devices, affecting the normal use of the electronic devices. Therefore, how to monitor the damage of electronic devices in liquid pipelines has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the invention

[0004] In view of this, an object of the present invention is to provide a damage detection method, device and equipment to overcome the problem of being unable to monitor the damage of electronic components in liquid pipelines.

[0005] To achieve the above objectives, the present invention adopts the following technical solutions:

[0006] In a first aspect, the present application provides a damage detection method, comprising:

[0007] Acquiring temperatures of a plurality of temperature detection points inside the device to be detected; the plurality of temperature detection points are located on the same component inside the device to be detected;

[0008] If the temperatures of the multiple temperature detection points are the same, it means that the device to be detected is not damaged;

[0009] If the temperature of at least one temperature detection point among the multiple temperature detection points is different from the temperatures of the other temperature detection points, it means that the device to be detected is damaged.

[0010] Furthermore, in the method described above, the device to be detected includes a first main conductor; and the plurality of temperature detection points are arranged on the main conductor along the length direction of the first main conductor.

[0011] Furthermore, the above method further includes:

[0012] In the case that the device to be detected is damaged, the damage status of the device to be detected is determined according to the temperatures of the multiple temperature detection points.

[0013] Furthermore, in the above method, determining the damage of the device to be detected according to the temperatures of the multiple temperature detection points includes:

[0014] Detecting the number of abnormal temperature detection points at which the temperatures are abnormal among the multiple temperature detection points;

[0015] If the number of the abnormal temperature detection points is less than a preset number threshold, it indicates that the damage of the device to be detected includes primary damage;

[0016] If the number of the abnormal temperature detection points is greater than or equal to the number threshold, it indicates that the damage of the device to be detected includes advanced damage, wherein the severity of the advanced damage is higher than that of the primary damage.

[0017] Further, in the method described above, the device to be detected includes a temperature sensor, and the temperature sensor includes a sensor probe and a second main conductor; the multiple temperature detection points include a first detection point, a second detection point, and a third detection point arranged in sequence along the length direction of the second main conductor, and the first detection point is located at an end of the second main conductor close to the sensor probe;

[0018] When the device to be detected is damaged, determining the damage of the device to be detected according to the temperatures of the multiple temperature detection points includes:

[0019] If the temperature of the first detection point is detected to be abnormal, it means that the damage of the device to be detected includes primary damage;

[0020] If the temperatures of the first detection point and the second detection point are detected to be abnormal, it means that the damage of the device to be detected includes advanced damage; wherein the severity of the advanced damage is higher than that of the primary damage.

[0021] Furthermore, in the above method, the temperature abnormality includes temperature reduction.

[0022] In a second aspect, the present application provides a damage detection device, comprising:

[0023] An acquisition module, used to acquire the temperatures of a plurality of temperature detection points inside the device to be detected; the plurality of temperature detection points are located on the same component inside the device to be detected;

[0024] The determination module is used to indicate that if the temperatures of the multiple temperature detection points are the same, it indicates that the device to be detected is not damaged; if among the multiple temperature detection points, at least one temperature detection point has a temperature different from the temperatures of the other temperature detection points, it indicates that the device to be detected is damaged.

[0025] In a third aspect, the present application provides a damage detection device, comprising:

[0026] Controller and multiple temperature detection heads;

[0027] The multiple temperature detection heads are used to be arranged inside the device to be detected, and detect the temperatures of multiple temperature detection points on the same detection component in the device to be detected, wherein each temperature detection head detects the temperature of one temperature detection point correspondingly;

[0028] The controller is used to obtain the temperatures of the multiple temperature detection points; if the temperatures of the multiple temperature detection points are the same, it means that the device to be detected is not damaged; if among the multiple temperature detection points, at least one temperature detection point has a temperature that is different from the temperatures of other temperature detection points, it means that the device to be detected is damaged.

[0029] In a fourth aspect, the present application provides a device with a damage detection function, comprising:

[0030] Controller, housing and multiple temperature detection heads;

[0031] The multiple temperature detection heads are arranged inside the shell to detect the temperatures of multiple temperature detection points on the same component inside the shell, wherein each temperature detection head detects the temperature of one temperature detection point correspondingly;

[0032] The controller is used to obtain the temperatures of the multiple temperature detection points; if the temperatures of the multiple temperature detection points are the same, it means that the device is not damaged; if among the multiple temperature detection points, at least one temperature detection point has a temperature that is different from the temperatures of the other temperature detection points, it means that the device is damaged.

[0033] In a fifth aspect, the present application provides an electronic device, including:

[0034] A processor and a memory, wherein the processor is connected to the memory:

[0035] Wherein, the processor is used to call and execute the program stored in the memory;

[0036] The memory is used to store the program, and the program is at least used to execute any one of the methods described above.

[0037] The damage detection method of the present invention can obtain the temperatures of multiple temperature detection points of the same component inside the device to be detected. Under normal working conditions, the temperature of the same component should be the same everywhere. Therefore, if the temperatures of multiple temperature detection points are the same, it means that the device to be detected is not damaged. If the temperature of at least one temperature detection point among the multiple temperature detection points is different from the temperature of other temperature detection points, it means that liquid has entered the device to be detected and the temperature of some areas of the component has been affected. In this way, the temperature relationship of multiple temperature detection points inside the device to be detected can be used to determine whether the device to be detected is damaged, thereby achieving the purpose of monitoring the damage of the device to be detected in the liquid pipeline. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 is a flow chart provided by an embodiment of the damage detection method of the present invention;

[0040] Figure 2 It is a schematic diagram of the layout of temperature detection points provided by the present invention;

[0041] Figure 3 It is a structural schematic diagram of a temperature sensor provided by the present invention;

[0042] Figure 4 It is a structural schematic diagram provided by an embodiment of the damage detection device of the present invention;

[0043] Figure 5 It is a structural schematic diagram provided by an embodiment of the electronic device of the present invention;

[0044] Figure 6 It is a structural schematic diagram provided by an embodiment of the damage detection device of the present invention. DETAILED DESCRIPTION

[0045] To make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be described in detail below. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other implementation methods obtained by ordinary technicians in this field without creative work belong to the scope of protection of the present invention.

[0046] Generally, various electronic devices are installed in liquid pipelines to detect parameters such as temperature, flow rate and pressure of the liquid, so as to ensure that various parameters of the liquid in the pipeline meet the requirements.

[0047] For example, as computing power requirements increase, requirements for heat dissipation technology continue to increase. Common heat dissipation methods are divided into air cooling and liquid cooling. Compared with traditional air cooling, liquid cooling uses liquid as a medium for heat dissipation, and absorbs a large amount of heat energy through the liquid to adjust the target temperature. It has higher heat dissipation efficiency and is more energy-efficient than traditional air cooling. Temperature sensors and pressure sensors are usually installed in the liquid cooling pipeline to detect the liquid temperature and pressure to ensure that the liquid and pressure meet the requirements and the heat dissipation process can be executed normally.

[0048] However, electronic devices are placed in liquid pipelines and are immersed in the liquid in the pipelines. Once the electronic devices are damaged, liquid will enter the electronic devices, affecting the normal use of the electronic devices. Therefore, how to monitor the damage of electronic devices in liquid pipelines has become a technical problem that needs to be solved urgently by those skilled in the art.

[0049] Based on this, the present application proposes a damage detection method, device and equipment. This technical solution determines whether the equipment to be detected is damaged by utilizing the temperature relationship of multiple temperature detection points inside the equipment to be detected, thereby achieving the purpose of monitoring the damage condition of the equipment to be detected in the liquid pipeline.

[0050] Specifically, an exemplary embodiment of the present specification provides a damage detection method, which is described by taking the method applied to an electronic device as an example. The electronic device can be any device with communication and computing functions. Figure 1 As shown, this embodiment may include the following steps:

[0051] S101, obtaining the temperatures of a plurality of temperature detection points inside a device to be detected.

[0052] The device to be detected in this embodiment is set in the liquid pipeline and is immersed in the liquid in the pipeline. In order to avoid the damage of the device to be detected and the impact of liquid intrusion on the use of the device to be detected, it is necessary to monitor the damage of the device to be detected. The type of device to be detected is not limited in this embodiment, and it can be any device that works in the liquid pipeline and has the risk of liquid intrusion, such as a liquid temperature sensor, a liquid pressure sensor, etc.

[0053] A plurality of temperature detection points are set inside the device to be detected, and the plurality of temperature detection points are located on the same component inside the device to be detected. The same component inside the device to be detected has a single working content, and under normal working conditions, the temperature of the component should be the same everywhere.

[0054] In some embodiments, the component for setting the temperature detection points should occupy as much space as possible in the device to be detected, and the temperature detection points should be evenly set on the component, so as to enable comprehensive damage monitoring of the device to be detected to avoid missed detection. For example, if the device to be detected is a temperature sensor, the component for setting the temperature detection points can be the main wire inside the temperature sensor.

[0055] The number of temperature detection points can be set according to actual conditions, and this embodiment does not limit it. It should be noted that the temperature detection points are not real points inside the device to be detected, but virtual points used to indicate the temperature detection positions, that is, temperature detection is performed at the positions corresponding to the temperature detection points.

[0056] A temperature detection head may be provided at each temperature detection point to detect the temperature at each temperature detection point. In some embodiments, a thermocouple is selected as the temperature detection head, that is, a thermocouple is provided at each temperature detection point to detect the temperature at each temperature detection point.

[0057] In an embodiment of the present application, the temperatures of multiple temperature detection points inside the device to be detected are obtained.

[0058] S102, detecting whether the temperatures of multiple temperature detection points are the same; if the temperatures of multiple temperature detection points are the same, executing S103; if among the multiple temperature detection points, there is at least one temperature detection point whose temperature is different from the temperatures of other temperature detection points, executing S104.

[0059] After the temperatures of the multiple temperature detection points are acquired, the temperatures of the multiple temperature detection points are analyzed so as to determine whether the device to be detected is damaged according to the temperatures of the multiple temperature detection points.

[0060] More specifically, it may be detected whether the temperatures of a plurality of temperature detection points are the same.

[0061] It should be noted that the same here does not mean that the temperature values ​​of multiple temperature detection points are exactly the same, but means that the difference between the temperature values ​​of any two temperature detection points among the multiple temperature detection points is less than the set value. In other words, when the difference between the temperature values ​​of any two temperature detection points among the multiple temperature detection points is less than the set value, it means that the temperatures of the multiple temperature detection points are the same; when the difference between the temperature values ​​of at least one pair of temperature detection points among the multiple temperature detection points is greater than or equal to the set value, it means that the temperature of at least one temperature detection point is different from the temperatures of the other temperature detection points.

[0062] The above setting values ​​can be set according to actual conditions and are not limited in this embodiment.

[0063] For example, if the set value is 1°C, the temperatures of the multiple temperature detection points are 26°C, 26.5°C, 25.9°C, 26.3°C and 26.1°C, and the difference between the temperature values ​​of any two of the multiple temperature detection points is less than 1°C, indicating that the temperatures of the multiple temperature detection points are the same. For another example, if the set value is 0.6°C, the temperatures of the multiple temperature detection points are 26.2°C, 26.7°C, 25.9°C and 26.3°C, and the difference between 26.7°C and 25.9°C is 0.8°C, which is greater than the above set value, indicating that the temperature of at least one temperature detection point is different from the temperatures of the other temperature detection points.

[0064] If the detected temperatures of the multiple temperature detection points are the same, S103 may be executed; if the detected temperatures of at least one of the multiple temperature detection points are different from the temperatures of the other temperature detection points, S104 may be executed.

[0065] S103. The equipment to be tested is not damaged.

[0066] If the temperatures detected at multiple temperature detection points are the same, it means that the device to be detected is not damaged.

[0067] Specifically, when the device to be tested is working normally and is not damaged or liquid intruded, the temperature of the components at the temperature detection points is uniform and constant, and there will not be too large a temperature difference between the detection points. Therefore, when the temperatures of multiple temperature detection points are detected to be the same, it can be determined that the device to be tested is not damaged.

[0068] S104. The equipment to be tested is damaged.

[0069] If the temperature of at least one of the multiple temperature detection points is different from the temperatures of the other temperature detection points, it means that the device to be detected is damaged.

[0070] Specifically, the heat capacity of solids and liquids is quite different. After the device to be tested is filled with liquid, since the heat capacity of the liquid is quite different from that of the components where the temperature detection points are set, the liquid will significantly change the heat conduction of the components where the temperature detection points are set, causing the temperature of the temperature detection points located in the liquid immersion area to change. Therefore, if it is detected that among multiple temperature detection points, at least one temperature detection point has a temperature that is different from that of the other temperature detection points, it means that the temperature detection point that is different from the temperature of the other temperature detection points is soaked in liquid, and the device to be tested is damaged.

[0071] In the above embodiment, the temperatures of multiple temperature detection points of the same component inside the device to be detected can be obtained. Under normal working conditions, the temperature of the same component should be the same everywhere. Therefore, if the temperatures of multiple temperature detection points are the same, it means that the device to be detected is not damaged. If the temperature of at least one temperature detection point among the multiple temperature detection points is different from the temperature of other temperature detection points, it means that liquid has entered the device to be detected, and the temperature of some areas of the component is affected. In this way, the temperature relationship of multiple temperature detection points inside the device to be detected can be used to determine whether the device to be detected is damaged, thereby achieving the purpose of monitoring the damage of the device to be detected in the liquid pipeline.

[0072] As an optional implementation, another embodiment of the present application discloses that the device to be detected in the above embodiment includes a first main conductor; and a plurality of temperature detection points are arranged on the main conductor along the length direction of the first main conductor.

[0073] The device to be detected generally includes many wires, and the longest wire can be selected as the first main wire of the device to be detected, and then the above-mentioned multiple temperature detection points can be arranged along the length direction of the first main wire. More specifically, the above-mentioned multiple temperature detection points can be evenly arranged along the length direction of the first main wire, so as to enable comprehensive damage monitoring of the device to be detected to avoid missed detection. For example Figure 2 In the embodiment shown, L is a first main conductor, and five temperature detection points are evenly arranged on the first main conductor.

[0074] As an optional implementation method, another embodiment of the present application discloses that the method of the above embodiment further includes determining the damage condition of the device to be detected based on the temperatures of multiple temperature detection points when the device to be detected is damaged.

[0075] In the case that the equipment to be detected has been damaged, it is possible to further determine whether the damage of the equipment to be detected is serious. If the damage of the equipment to be detected is not serious, the equipment to be detected may not be replaced temporarily. If the damage of the equipment to be detected is serious, the equipment to be detected needs to be replaced immediately.

[0076] Specifically, the damage of the device to be detected can be determined based on the temperature of each temperature detection point. For example, if there are a large number of temperature detection points with abnormal temperatures, it means that liquid has entered the device to be detected and most of the internal area of ​​the device to be detected has been soaked. At this time, the damage of the device to be detected is relatively serious and the device to be detected needs to be replaced immediately. If there are a small number of temperature detection points with abnormal temperatures, it means that liquid has entered the device to be detected, but the area of ​​the device to be detected that has been soaked is small, and the damage of the device to be detected is not serious, so the device to be detected can be temporarily replaced.

[0077] In the above embodiment, the severity of damage of the device to be detected can be determined according to the temperatures of multiple temperature detection points in the device to be detected, so as to reflect the timing of replacing the device to be detected and facilitate the operation of the staff.

[0078] As an optional implementation, another embodiment of the present application discloses that the above embodiment determines the damage of the device to be detected according to the temperatures of multiple temperature detection points, which specifically includes the following steps:

[0079] Detect the number of abnormal temperature detection points with abnormal temperatures among multiple temperature detection points; if the number of abnormal temperature detection points is less than a preset number threshold, it indicates that the damage of the equipment to be detected includes primary damage; if the number of abnormal temperature detection points is greater than or equal to the number threshold, it indicates that the damage of the equipment to be detected includes advanced damage; wherein, the severity of advanced damage is higher than that of primary damage.

[0080] Specifically, a quantity threshold can be set. When the number of abnormal temperature detection points where the temperature is abnormal is less than the quantity threshold, it means that the area inside the device to be detected that is soaked is not large, and the damage to the device to be detected is primary damage, that is, the damage is not too serious; when the number of abnormal temperature detection points is greater than or equal to the quantity threshold, it means that the area inside the device to be detected that is soaked is large, and the damage to the device to be detected is advanced damage, that is, the damage is relatively serious.

[0081] The above quantity threshold can be set according to actual conditions, and this embodiment does not limit it. In a specific embodiment, the quantity threshold is set to one-third of the total number of temperature detection points, that is, if there are 6 temperature detection points, the quantity threshold is 2. When the number of abnormal temperature detection points is less than 2, it means that the damage of the device to be detected includes primary damage; when the number of abnormal temperature detection points is greater than or equal to 2, it means that the damage of the device to be detected includes advanced damage.

[0082] The severity of the damage of the advanced damage is higher than that of the primary damage. In this embodiment, when it is only the primary damage, the staff can be reminded to replace the device in time, and when it is the advanced damage, the staff can be reminded to replace the device immediately.

[0083] In the above embodiment, the damage of the device to be detected can be determined according to the number of abnormal temperature detection points, so as to reflect the timing of replacing the device to be detected and facilitate the operation of the staff.

[0084] As an optional implementation, another embodiment of the present application discloses that the device to be detected in the above embodiment includes a temperature sensor, the temperature sensor includes a sensor probe and a second main conductor; the multiple temperature detection points include a first detection point, a second detection point and a third detection point arranged in sequence along the length direction of the second main conductor, and the first detection point is located at an end of the second main conductor close to the sensor probe;

[0085] The above embodiment determines the damage of the device to be detected according to the temperatures of multiple temperature detection points, and specifically includes the following steps:

[0086] If the temperature of the first detection point is detected to be abnormal, it means that the damage of the equipment to be detected includes primary damage; if the temperature of the first detection point and the second detection point is detected to be abnormal, it means that the damage of the equipment to be detected includes advanced damage; among which, the severity of advanced damage is higher than that of primary damage.

[0087] The device to be detected in this embodiment is a temperature sensor, such as Figure 3 As shown, the temperature sensor includes an outer metal shell 1 of a sensor probe, a sensor probe 2, a fixing thread 3, a fixing pressing block 4, a wire outlet sheath 5, a sensor internal wire 6, and a second main wire 7.

[0088] The plurality of temperature detection points include a first detection point 9, a second detection point 10 and a third detection point 11 which are sequentially arranged along the length direction of the second main conductor 7, and Figure 3 As shown, the first detection point 9 is located at one end of the second main conductor 7 close to the sensor probe 2 .

[0089] In order to ensure the accuracy of the data, the temperature detection head is placed on the insulating outer skin of the second main conductor 7. The second main conductor 7 is generally a metal core, such as a copper core. In the case of conduction, the metal core will generate heat, and the temperature will be generated on the insulating outer skin of the second main conductor 7 due to heat conduction. When the temperature sensor is damaged and liquid enters, since the heat capacity of the liquid is greater than that of most conductive materials, once the temperature sensor is damaged and liquid enters, the presence of the liquid will significantly change the heat conduction of the second main conductor 7, resulting in a difference in the temperature of the outer skin of the conductor in the area with liquid leakage and the area without liquid leakage.

[0090] The second main conductor 7 is sealed from the sensor probe 2 to the controller. In this sealed environment, the side where the sensor probe 2 is located is usually easy to be damaged. Figure 3 The position 8 in the middle is damaged. Once damaged, the liquid will stably infiltrate along the damaged position due to hydraulic pressure until it passes through the entire second main conductor 7.

[0091] When the temperature at the first detection point 9 is abnormal, it indicates that the liquid has not yet penetrated into the area where the second detection point 10 is located, and the damage condition of the temperature sensor is primary damage, which can remind the staff to replace the device in time. When the temperatures at the first detection point 9 and the second detection point 10 are abnormal, it indicates that the liquid has spread to the position where the second detection point 10 is located, and the damage condition of the temperature sensor is advanced damage, which can remind the staff to replace the device immediately.

[0092] In a specific embodiment, the temperature abnormality includes a temperature decrease. That is, if the temperature of a certain temperature detection point is significantly lower than the temperatures of other temperature detection points, it indicates that the temperature of this temperature detection point is abnormal, and this temperature detection point is an abnormal temperature detection point.

[0093] As Figure 3 In the illustrated embodiment, the temperature of the first detection point 9 is Ta, the temperature of the second detection point 10 is Tb, and the temperature of the third detection point 11 is Tc. When Ta < Tb = Tc, it is determined that the temperature sensor is damaged at this time, and the staff is reminded to replace the device in time. When Ta = Tb < Tc, it means that the liquid has spread from the bottom to the middle of the wire, and there is a serious safety risk. It is reminded that the temperature sensor is damaged and needs to be replaced immediately.

[0094] The present invention also provides a damage detection device for implementing the above method embodiments. Figure 4 It is a schematic structural diagram of the damage detection device of the present invention. As Figure 4 shown, the device includes:

[0095] An acquisition module 100 for acquiring the temperatures of a plurality of temperature detection points inside the device to be detected; the plurality of temperature detection points are located on the same component inside the device to be detected;

[0096] A determination module 110 for indicating that the device to be detected is not damaged if the temperatures of the plurality of temperature detection points are the same; if at least one of the plurality of temperature detection points has a temperature different from the temperatures of other temperature detection points, it indicates that the device to be detected is damaged.

[0097] Further, the device to be detected in the above embodiment includes a first main wire; the plurality of temperature detection points are arranged along the length direction of the first main wire on the main wire.

[0098] Further, the determination module 110 in the above embodiment is further configured to determine the damage condition of the device to be detected according to the temperatures of the plurality of temperature detection points in the case where the device to be detected is damaged.

[0099] Furthermore, the determination module 110 of the above embodiment is specifically used to detect the number of abnormal temperature detection points with abnormal temperatures among multiple temperature detection points; if the number of abnormal temperature detection points is less than a preset number threshold, it indicates that the damage condition of the equipment to be detected includes primary damage; if the number of abnormal temperature detection points is greater than or equal to the number threshold, it indicates that the damage condition of the equipment to be detected includes advanced damage; wherein, the severity of advanced damage is higher than that of primary damage.

[0100] Further, the device to be detected in the above embodiment includes a temperature sensor, the temperature sensor includes a sensor probe and a second main conductor; the multiple temperature detection points include a first detection point, a second detection point and a third detection point arranged in sequence along the length direction of the second main conductor, and the first detection point is located at an end of the second main conductor close to the sensor probe;

[0101] The determination module 110 of the above embodiment is specifically used for, if it is detected that the temperature of the first detection point is abnormal, it means that the damage condition of the device to be detected includes primary damage; if it is detected that the temperature of the first detection point and the second detection point is abnormal, it means that the damage condition of the device to be detected includes advanced damage; wherein, the severity of advanced damage is higher than that of primary damage.

[0102] Furthermore, the temperature abnormality in the above embodiment includes temperature reduction.

[0103] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0104] Corresponding to the above damage detection method, the present application embodiment also discloses an electronic device, see Figure 5 As shown, the electronic device includes:

[0105] Memory 200 and processor 210;

[0106] The memory 200 is connected to the processor 210 and is used to store programs;

[0107] The processor 210 is used to implement the damage detection method disclosed in any of the above embodiments by running the program stored in the memory 200.

[0108] Specifically, the electronic device may further include: a bus, a communication interface 220 , an input device 230 and an output device 240 .

[0109] The processor 210, the memory 200, the communication interface 220, the input device 230 and the output device 240 are connected to each other via a bus.

[0110] A bus may include a pathway that transfers information between components of a computer system.

[0111] The processor 210 may be a general-purpose processor, such as a general-purpose central processing unit (CPU), a microprocessor, etc., or an application-specific integrated circuit (ASIC), or one or more integrated circuits for controlling the execution of the program of the present application. It may also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components.

[0112] The processor 210 may include a main processor, and may also include a baseband chip, a modem, and the like.

[0113] The memory 200 stores a program for executing the technical solution of the present application, and may also store an operating system and other key services. Specifically, the program may include a program code, and the program code includes computer operation instructions. More specifically, the memory 200 may include a read-only memory (ROM), other types of static storage devices that can store static information and instructions, a random access memory (RAM), other types of dynamic storage devices that can store information and instructions, a disk storage, a flash, and the like.

[0114] The input device 230 may include a device for receiving data and information input by a user, such as a keyboard, a mouse, a camera, a scanner, a light pen, a voice input device, a touch screen, a pedometer, or a gravity sensor.

[0115] Output device 240 may include devices that allow information to be output to a user, such as a display screen, printer, speaker, etc.

[0116] The communication interface 220 may include any transceiver or the like to communicate with other devices or communication networks, such as Ethernet, Radio Access Network (RAN), Wireless Local Area Network (WLAN), etc.

[0117] The processor 210 executes the program stored in the memory 200 and calls other devices, which can be used to implement the various steps of the damage detection method provided in the above embodiments of the present application.

[0118] Furthermore, an embodiment of the present application provides a damage detection device, such as Figure 6 As shown, the damage detection device includes a controller 300 and a plurality of temperature detection heads 310. It should be noted that: Figure 6In the illustrated embodiment, three temperature detection heads are provided for the sake of convenience of explanation, but the number of temperature detection heads is not limited to three. The number of temperature detection heads can be set according to actual conditions, and this embodiment does not impose any limitation.

[0119] The multiple temperature detection heads 310 are used to be arranged inside the device to be detected to detect the temperatures of multiple temperature detection points on the same detection component in the device to be detected, wherein each temperature detection head detects the temperature of one temperature detection point.

[0120] The controller 300 is used to obtain the temperatures of multiple temperature detection points; if the temperatures of multiple temperature detection points are the same, it means that the device to be detected is not damaged; if among the multiple temperature detection points, at least one temperature detection point has a temperature that is different from the temperatures of other temperature detection points, it means that the device to be detected is damaged.

[0121] The damage detection device provided in this embodiment belongs to the same application concept as the damage detection method provided in the above embodiments of this application, can execute the damage detection method provided in any of the above embodiments of this application, and has functional modules and beneficial effects corresponding to executing the above damage detection method. For technical details not fully described in this embodiment, please refer to the specific processing content of the damage detection method provided in the above embodiments of this application, which will not be repeated here.

[0122] Furthermore, an embodiment of the present application provides a device with a damage detection function, including: a controller, a housing, and multiple temperature detection heads.

[0123] Multiple temperature detection heads are arranged inside the shell to detect the temperatures of multiple temperature detection points on the same component in the shell, wherein each temperature detection head detects the temperature of one temperature detection point; the controller is used to obtain the temperatures of multiple temperature detection points; if the temperatures of multiple temperature detection points are the same, it indicates that the device is not damaged; if among the multiple temperature detection points, at least one temperature detection point has a temperature that is different from the temperatures of other temperature detection points, it indicates that the device is damaged.

[0124] The device with damage detection function provided in this embodiment belongs to the same application concept as the damage detection method provided in the above embodiments of this application, can execute the damage detection method provided in any of the above embodiments of this application, and has functional modules and beneficial effects corresponding to executing the above damage detection method. For technical details not fully described in this embodiment, please refer to the specific processing content of the damage detection method provided in the above embodiments of this application, which will not be repeated here.

[0125] It can be understood that the same or similar parts of the above embodiments can be referenced to each other, and the contents not described in detail in some embodiments can refer to the same or similar contents in other embodiments.

[0126] It should be noted that, in the description of the present invention, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, in the description of the present invention, unless otherwise specified, the meaning of "plurality" refers to at least two.

[0127] Any process or method description in a flowchart or otherwise described herein may be understood to represent a module, segment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by those skilled in the art to which the embodiments of the present invention belong.

[0128] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0129] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A damage detection method, characterized in that: include: Acquiring temperatures of a plurality of temperature detection points inside the device to be detected; the plurality of temperature detection points are located on the same component inside the device to be detected; If the temperatures of the multiple temperature detection points are the same, it means that the device to be detected is not damaged; If the temperature of at least one temperature detection point among the multiple temperature detection points is different from the temperatures of the other temperature detection points, it means that the device to be detected is damaged.

2. The method according to claim 1, characterized in that The device to be detected includes a first main conductor; the plurality of temperature detection points are arranged on the main conductor along the length direction of the first main conductor.

3. The method according to claim 1, characterized in that Also includes: In the case that the device to be detected is damaged, the damage status of the device to be detected is determined according to the temperatures of the multiple temperature detection points.

4. The method according to claim 3, characterized in that Determining the damage of the device to be detected according to the temperatures of the multiple temperature detection points includes: Detecting the number of abnormal temperature detection points at which the temperatures are abnormal among the multiple temperature detection points; If the number of the abnormal temperature detection points is less than a preset number threshold, it indicates that the damage of the device to be detected includes primary damage; If the number of the abnormal temperature detection points is greater than or equal to the number threshold, it indicates that the damage of the device to be detected includes advanced damage, wherein the severity of the advanced damage is higher than that of the primary damage.

5. The method according to claim 3, characterized in that: The device to be detected includes a temperature sensor, and the temperature sensor includes a sensor probe and a second main conductor; the multiple temperature detection points include a first detection point, a second detection point, and a third detection point arranged in sequence along the length direction of the second main conductor, and the first detection point is located at an end of the second main conductor close to the sensor probe; When the device to be detected is damaged, determining the damage of the device to be detected according to the temperatures of the multiple temperature detection points includes: If the temperature of the first detection point is detected to be abnormal, it means that the damage of the device to be detected includes primary damage; If the temperatures of the first detection point and the second detection point are detected to be abnormal, it means that the damage of the device to be detected includes advanced damage; wherein the severity of the advanced damage is higher than that of the primary damage.

6. The method according to claim 4 or 5, characterized in that: The temperature anomaly includes a temperature drop.

7. A damage detection device, characterized in that: include: An acquisition module, used to acquire the temperatures of a plurality of temperature detection points inside the device to be detected; the plurality of temperature detection points are located on the same component inside the device to be detected; The determination module is used to indicate that if the temperatures of the multiple temperature detection points are the same, it indicates that the device to be detected is not damaged; if among the multiple temperature detection points, at least one temperature detection point has a temperature different from the temperatures of the other temperature detection points, it indicates that the device to be detected is damaged.

8. A damage detection device, characterized in that: include: Controller and multiple temperature detection heads; The multiple temperature detection heads are used to be arranged inside the device to be detected, and detect the temperatures of multiple temperature detection points on the same detection component in the device to be detected, wherein each temperature detection head detects the temperature of one temperature detection point correspondingly; The controller is used to obtain the temperatures of the multiple temperature detection points; if the temperatures of the multiple temperature detection points are the same, it means that the device to be detected is not damaged; if among the multiple temperature detection points, at least one temperature detection point has a temperature that is different from the temperatures of other temperature detection points, it means that the device to be detected is damaged.

9. A device with a damage detection function, characterized in that: include: Controller, housing and multiple temperature detection heads; The multiple temperature detection heads are arranged inside the shell to detect the temperatures of multiple temperature detection points on the same component inside the shell, wherein each temperature detection head detects the temperature of one temperature detection point correspondingly; The controller is used to obtain the temperatures of the multiple temperature detection points; if the temperatures of the multiple temperature detection points are the same, it means that the device is not damaged; if among the multiple temperature detection points, at least one temperature detection point has a temperature that is different from the temperatures of the other temperature detection points, it means that the device is damaged.

10. An electronic device, characterized in that: include: A processor and a memory, wherein the processor is connected to the memory: Wherein, the processor is used to call and execute the program stored in the memory; The memory is used to store the program, and the program is at least used to execute the method according to any one of claims 1 to 6.

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