Display panel and display device

By setting up temperature control components in the display panel and using the Peltier effect to achieve temperature regulation, the problem of heat management of the display panel is solved and the performance and reliability of the display panel is improved.

CN119600884APending Publication Date: 2025-03-11KUNSHAN GO VISIONOX OPTO ELECTRONICS CO LTD
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Patent Information

Application Number
CN202411708131.5
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-26
Publication Date
2025-03-11

AI Technical Summary

Technical Problem

The display panel generates heat during operation, and how to effectively control the operating temperature of the display panel to improve its performance is an important issue.

Method used

The temperature control component is provided in the display panel, including spaced and insulated sub-electrodes, bipolar semiconductor blocks and electrodes. By applying a voltage, the temperature control component produces a Peltier effect, thereby realizing the temperature regulation of the display panel.

Benefits of technology

By setting the temperature control component inside the display panel, the self-heating function of the display panel is realized, which can work under DC and AC, and has a wide application range, improving the performance and reliability of the display panel.

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Abstract

The invention discloses a display panel and a display device. The display panel comprises a first substrate; the temperature control assembly is arranged on one side of the first substrate and comprises a first electrode which comprises a first sub-electrode and a second sub-electrode which are arranged at an interval and are insulated; the first semiconductor block and the second semiconductor block are arranged on the same side of the first electrode, the first semiconductor block is electrically connected with the first sub-electrode, and the second semiconductor block is electrically connected with the second sub-electrode; a second electrode electrically connecting the first semiconductor block and the second semiconductor block; wherein the first semiconductor block and the second semiconductor block are bipolar semiconductor blocks, and after voltage is applied to the first sub-electrode and the second sub-electrode, the polarity of the end, connected with the second electrode, of the first semiconductor block and the polarity of the end, connected with the second electrode, of the second semiconductor block are different. The temperature control assembly is arranged in the display panel, so that self heat dissipation of the display panel can be realized.
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Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a display device. Background Art

[0002] The display panel will inevitably generate heat during operation, and being able to effectively control the operating temperature of the display panel is an important issue in improving the performance of the display panel. Therefore, how to achieve self-heating of the display panel is an urgent problem to be solved. Summary of the invention

[0003] The main technical problem solved by the present application is to provide a display panel and a display device, in which a temperature control component is arranged in the display panel to achieve a self-heating effect of the display panel.

[0004] In order to solve the above technical problems, a technical solution adopted in the present application is: to provide a display panel, the display panel comprising: a first substrate; a temperature control component, arranged on one side of the first substrate, comprising: a first electrode, comprising a first sub-electrode and a second sub-electrode, which are arranged at intervals and insulated; a first semiconductor block and a second semiconductor block, which are arranged on the same side of the first electrode, the first semiconductor block is electrically connected to the first sub-electrode, and the second semiconductor block is electrically connected to the second sub-electrode; a second electrode, which electrically connects the first semiconductor block and the second semiconductor block; wherein the first semiconductor block and the second semiconductor block are both bipolar semiconductor blocks, and when a voltage is applied to the first sub-electrode and the second sub-electrode, the polarity of one end of the first semiconductor block connected to the second electrode and the polarity of one end of the second semiconductor block connected to the second electrode are different.

[0005] In order to solve the above technical problems, another technical solution adopted by the present application is: to provide a display device, comprising a display panel as described in any one of the above items.

[0006] The beneficial effect is: different from the prior art, the present application sets the temperature control component inside the display panel, which can achieve self-heating of the display panel. Furthermore, the present application also sets the first semiconductor block and the second semiconductor block in the temperature control component as bipolar semiconductor blocks, so that the temperature control component can work under both direct current and alternating current, and has a wide range of applications. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work, among which:

[0008] Figure 1 It is a schematic structural diagram of an embodiment of a display panel of the present application;

[0009] Figure 2 is a schematic structural diagram of another embodiment of the display panel of the present application;

[0010] Figure 3 It is a schematic structural diagram of another embodiment of the display panel of the present application.

[0011] Figure 4 is a schematic structural diagram of another embodiment of the display panel of the present application;

[0012] Figure 5 is a schematic structural diagram of another embodiment of the display panel of the present application;

[0013] Figure 6 is a schematic diagram of a top view of a display panel according to an embodiment of the present application;

[0014] Figure 7 It is a schematic diagram of a circuit structure in which multiple temperature control components are electrically connected;

[0015] Figure 8 is a schematic diagram of the relative positions of the first electrode and the second electrode in a plurality of temperature control components;

[0016] Fig. 9 It is a schematic structural diagram of an embodiment of a display device of the present application. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0018] It should be noted that the terms "first" and "second" in this application are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined as "first" and "second" can explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions. For example, a process, method, system, product or device that includes a series of steps or units is not limited to the listed steps or units, but optionally also includes steps or units that are not listed, or optionally also includes other steps or units inherent to these processes, methods, products or devices.

[0019] See also Figure 1 In one embodiment of the present application, the display panel 100 includes a first substrate 10 and a temperature control component 20 .

[0020] The first substrate 10 plays a supporting role in the display panel 100, and can be a flexible substrate or a rigid substrate. When the first substrate 10 is a flexible substrate, its material can be polyimide (PI), and when the first substrate 10 is a rigid substrate, its material can be glass or metal. The present application does not limit the structure of the first substrate 10.

[0021] The temperature control component 20 is disposed on one side of the first substrate 10, and is used to adjust the temperature of the display panel 100, for example, to dissipate heat from the display panel 100, or to heat the display panel 100. The temperature control component 20 includes a first electrode 21, a first semiconductor block 22, a second semiconductor block 23, and a second electrode 24.

[0022] The first electrode 21 includes a first sub-electrode 211 and a second sub-electrode 212 which are spaced apart and insulated from each other. That is, the first sub-electrode 211 and the second sub-electrode 212 are independent of each other.

[0023] The first semiconductor block 22 and the second semiconductor block 23 are arranged on the same side of the first electrode 21, the first semiconductor block 22 is electrically connected to the first sub-electrode 211, the second semiconductor block 23 is electrically connected to the second sub-electrode 212, and the second electrode 24 is electrically connected to the first semiconductor block 22 and the second semiconductor block 23, so that a current path can be formed between the first semiconductor 22 and the second semiconductor 23.

[0024] In this embodiment, the first semiconductor block 22 and the second semiconductor block 23 are both bipolar semiconductor blocks, and when voltage is applied to the first sub-electrode 211 and the second sub-electrode 212, the polarity of the end of the first semiconductor block 22 connected to the second electrode 24 and the polarity of the end of the second semiconductor block 23 connected to the second electrode 24 are different.

[0025] Specifically, an electrical connection is formed between the first semiconductor block 22 and the second semiconductor block 23 through the second electrode 24. After a voltage is applied to the first sub-electrode 211 and the second sub-electrode 212, the end of the first semiconductor block 22 connected to the second electrode 24 is P-type, and the end of the second semiconductor block 23 connected to the second electrode 24 is N-type, or, the end of the first semiconductor block 22 connected to the second electrode 24 is N-type, and the end of the second semiconductor block 23 connected to the second electrode 24 is P-type.

[0026] Since the polarities of one end of the first semiconductor block 22 connected to the second electrode 24 and one end of the second semiconductor block 23 connected to the second electrode 24 are different, the temperature control component 20 can produce a Peltier effect: when a voltage is applied to the first sub-electrode 211 and the second sub-electrode 212, heat absorption is generated at the second electrode 24 and heat release is generated at the first electrode 21, or heat absorption is generated at the first electrode 21 and heat release is generated at the second electrode 24, so that the temperature control component 20 can dissipate heat for the display panel 100 or heat the display panel 100, thereby achieving temperature regulation of the display panel 100.

[0027] In the present embodiment, the first semiconductor block 22 and the second semiconductor block 23 are both bipolar semiconductor blocks with one end being P-type and the other end being N-type. Unlike unipolar semiconductor blocks, when the direction of the current passing through the bipolar semiconductor block changes, the polarities at both ends of the bipolar semiconductor block will be interchanged. That is to say, in the present embodiment, when the direction of the current passing through the first semiconductor block 22 changes, the polarities at both ends of the first semiconductor block 22 will change (one end changes from P-type to N-type, and the other end changes from N-type to P-type). When the direction of the current passing through the second semiconductor block 23 changes, the polarities at both ends of the second semiconductor block 23 will also change. Therefore, the temperature control component 20 of the present embodiment can work under both direct current and alternating current.

[0028] It can be seen from the above content that the present application sets the temperature control component 20 inside the display panel 100, which can realize self-temperature regulation of the display panel 100. Furthermore, the present application also sets the first semiconductor block 22 and the second semiconductor block 23 in the temperature control component 20 as bipolar semiconductor blocks, so that the temperature control component 20 can work under both direct current and alternating current. Therefore, in different scenarios, it can be selected according to needs whether to power the temperature control component 20 with direct current or with alternating current, and the application range is wide.

[0029] What is special is that when AC power is needed to power the temperature control component 20, the clk interface on the driver chip can be used to power the temperature control component 20. Specifically, the driver chip includes multiple clk interfaces, some of which are used to transmit the clock signal of the GIP circuit, while some of the clk interfaces are in an idle state. In this embodiment, the clk interface that was originally in an idle state can be used to provide AC power to the temperature control component 20.

[0030] In one embodiment, the material of the first semiconductor block 22 / the second semiconductor block 23 includes silicon-based materials. Silicon-based materials are the most commonly used semiconductor materials and are abundant in the earth's crust. Using silicon-based materials as semiconductor materials can reduce production costs and also ensure the stable performance of the temperature control component 20.

[0031] In one embodiment, the material of the first semiconductor block 22 / the second semiconductor block 23 includes at least one of silicon nitride and silicon oxide. Both silicon nitride and silicon oxide have high hardness and high stability. Using silicon nitride and silicon oxide as the material of the first semiconductor block 22 / the second semiconductor block 23 can increase the life of the temperature control component 20.

[0032] See also Figure 2In one embodiment of the present application, the display panel 100 further includes a driving circuit layer 30 and a light-emitting layer 40, which are stacked in sequence on one side of the first substrate 10. Specifically, the light-emitting layer 40 includes a light-emitting element 42, and the driving circuit layer 30 includes a pixel driving circuit 32 electrically connected to the light-emitting element 42, and the pixel driving circuit 32 includes a transistor 321 and a capacitor 322. The transistor 321 includes a semiconductor portion, a gate, a source and a drain. The capacitor 322 includes a first electrode plate and a second electrode plate. Among them, the gate and the first electrode plate can be located in the first metal layer 301, the second electrode plate can be located in the second metal layer 302, and the source and the drain can be located in the third metal layer 303. An interlayer insulating layer is provided between the first metal layer 301 and the second metal layer 302, and between the second metal layer 302 and the third metal layer 303. At the same time, the driving circuit layer 30 may also include a fourth metal layer 304 and a planarization layer 305. The fourth metal layer 304 is provided with a signal line, which electrically connects the pixel driving circuit 32 and the light-emitting element 42 in the light-emitting layer 40. The planarization layer 305 is used for planarization to ensure the flatness of the display panel 100. Among them, the pixel driving circuit 32 can be a circuit with a structure such as 7T1C, and the present application does not limit its specific structure. The light-emitting element 42 includes an anode 401, a light-emitting material layer 402, and a cathode 403 stacked in sequence in a direction away from the first substrate 10.

[0033] exist Figure 2 In the implementation, in order to reduce the difficulty of preparation, the temperature control component 20 and the driving circuit layer 30 and the light-emitting layer 40 are all arranged in different layers, that is, the temperature control component 20 and the driving circuit layer 30 are not in the same layer, and the temperature control component 20 and the light-emitting layer 40 are not in the same layer. That is, the driving circuit layer 30 and the light-emitting layer 40 can be the same as the existing structure, and in this case, there is no need to change the structure of the driving circuit layer 30 and the light-emitting layer 40.

[0034] In one embodiment, continue to refer to Figure 2 , the temperature control component 20 is disposed between the first substrate 10 and the driving circuit layer 30, and the first electrode 21 is disposed between the first substrate 10 and the second electrode 24. That is, compared with the second electrode 24, the first electrode 21 is closer to the first substrate 10. Specifically, considering the complex structure in the driving circuit layer 30, the arrangement in this embodiment can timely and accurately adjust the temperature of the driving circuit layer 30 to ensure the display quality of the display panel 100.

[0035] Continue reading Figure 2, the display panel 100 also includes a second substrate 50, and the second substrate 50 is arranged between the temperature control component 20 and the driving circuit layer 30. That is to say, the temperature control component 20 is arranged between the first substrate 10 and the second substrate 50, and the driving circuit layer 30 and the light-emitting layer 40 are stacked in sequence on the side of the second substrate 50 away from the first substrate 10. On the one hand, this embodiment sets the display panel 100 to also include a second substrate 50, which can be used to further protect and support the driving circuit layer 30 and the light-emitting layer 40. At the same time, the temperature control component 20 is also arranged between the first substrate 10 and the second substrate 50. The temperature control component 20 can increase the connection strength between the first substrate 10 and the second substrate 50, increase the adhesion between the first substrate 10 and the second substrate 50, further ensure the strong support of the first substrate 10 and the second substrate 50, and avoid the separation of the film layer in the display panel 100.

[0036] The materials of the first substrate 10 and the second substrate 50 may be the same or different. For example, in one application scenario, the materials of the first substrate 10 and the second substrate 50 both include polyimide (PI).

[0037] Continue reading Figure 2 , the display panel 100 further includes a first insulating layer 60 and a second insulating layer 70 .

[0038] The first insulating layer 60 is disposed between the first substrate 10 and the temperature control component 20, and the second insulating layer 70 is disposed between the temperature control component 20 and the second substrate 50. The provision of the first insulating layer 60 and the second insulating layer 70 can improve the thermal conductivity of the temperature control component 20.

[0039] The materials of the first insulating layer 60 and the second insulating layer 70 may be the same or different. In one embodiment, considering that silicon oxide and silicon nitride have good stability, electrical insulation performance, mechanical strength and chemical stability, the first insulating layer 60 is configured to include at least one of silicon oxide and silicon nitride, and the second insulating layer 70 is configured to include at least one of silicon oxide and silicon nitride.

[0040] It should be noted that, in other embodiments, only one of the first insulating layer 60 and the second insulating layer 70 may be provided, or both the first insulating layer 60 and the second insulating layer 70 may not be provided.

[0041] See also Figure 3 ,and Figure 2 The difference in the implementation mode is that at this time, the temperature control component 20 is at least partially formed in the driving circuit layer 30 and / or the light-emitting layer 40 so as to better regulate the temperature of the driving circuit layer 30 and the light-emitting layer 40, and the first electrode 21 is arranged between the first substrate 10 and the second electrode 24, that is, the first electrode 21 is closer to the first substrate 10.

[0042] Continue reading Figure 3 In one embodiment, the second electrode 24 is disposed in the driving circuit layer 30 , and the first electrode 21 is located in the light shielding layer 80 , wherein the light shielding layer 80 is disposed between the first substrate 10 and the driving circuit layer 30 .

[0043] Specifically, the shading layer 80 is usually provided with a shading member 82 for shading, and the shading member 82 at least partially overlaps with the positive projection of the pixel driving circuit 32 in the driving circuit layer 30 on the first substrate 10. In order to avoid adding a film layer, this embodiment directly uses the shading layer 80 to set the first electrode 21.

[0044] In one application scenario, the second electrode 24 is insulated from the signal lines in the driving circuit layer 30, that is, the second electrode 24 is arranged in the driving circuit layer 30, but the second electrode 24 and the signal lines in the driving circuit layer 30 do not affect each other. On the one hand, this can avoid increasing the thickness of the display panel 100, which is conducive to the thinness of the display panel 100. On the other hand, since the second electrode 24 will not affect the signal lines in the driving circuit layer 30, there is no need to improve the driving method of the display panel 100.

[0045] In another application scenario, the second electrode 24 is reused as a signal line in the driving circuit layer 30, that is, the second electrode 24 is also a signal line in the driving circuit layer 30. In this way, the signal line in the driving circuit layer 30 can be directly used as the second electrode 24 in the temperature control component 20, eliminating the step of preparing the second electrode 24, thereby improving the preparation efficiency.

[0046] In a specific example, if Figure 3 As shown, the second electrode 24 is arranged in the third metal layer 303, and the third metal layer 303 is also provided with an ELVDD power line (not shown). That is to say, at this time, the second electrode 24 can be arranged in the same layer as the ELVDD power line, or it can be reused as the ELVDD power line. It can be understood that when the second electrode 24 is reused as the ELVDD power line, two vias are formed between the ELVDD power line and the light shielding layer 80, and the first semiconductor block 22 is arranged in one via, and the second semiconductor block 23 is arranged in the other via.

[0047] Of course, in other embodiments, the first electrode 21 and the second electrode 24 may be both disposed in the driving circuit layer 30 . Alternatively, the second electrode 24 may be disposed in the light shielding layer 80 , while the first electrode 21 may be disposed in the driving circuit layer 30 .

[0048] See also Figure 4In another embodiment, the second electrode 24 is disposed in the light emitting layer 40, and the first electrode 21 is disposed in the driving circuit layer 30. The first electrode 21 can be disposed in any one of the first metal layer 301, the second metal layer 302, the third metal layer 303, and the fourth metal layer 304.

[0049] In one application scenario, the second electrode 24 and the cathode 403 in the light-emitting layer 40 are in the same layer and are arranged at intervals. That is, the second electrode 24 and the cathode 403 are arranged in the same layer, but the second electrode 24 and the cathode 403 do not affect each other. On the one hand, this can avoid increasing the thickness of the display panel 100, which is conducive to the thinness of the display panel 100. On the other hand, since the second electrode 24 will not affect the cathode 403, there is no need to improve the driving method of the display panel 100.

[0050] In another application scenario, the second electrode 24 is reused as the cathode 403 in the light-emitting layer 40, that is, the second electrode 24 is also the cathode 403 in the light-emitting layer 40. In this way, the cathode 403 in the light-emitting layer 40 can be directly used as the second electrode 24 in the temperature control component 20, eliminating the step of preparing the second electrode 24, thereby improving the preparation efficiency.

[0051] In a specific example, if Figure 4 As shown, the first electrode 21 is arranged in the fourth metal layer 304, and the fourth metal layer 304 is also provided with an ELVSS power line (not shown). That is to say, at this time, the first electrode 21 can be arranged in the same layer as the ELVSS power line, or it can be reused as the ELVSS power line. It can be understood that when the first electrode 21 is reused as the ELVSS power line, two vias are formed between the ELVSS power line and the cathode 403, and the first semiconductor block 22 is arranged in one via, and the second semiconductor block 23 is arranged in the other via.

[0052] It should be noted that the present application does not limit the positions of the first electrode 21 and the second electrode 24. For example, in other embodiments, the second electrode 24 may be arranged in the same layer as the cathode 403 in the light-emitting layer 40, and the first electrode 21 may be arranged in the light-shielding layer 80, or both the first electrode 21 and the second electrode 24 may be arranged in the light-emitting layer 40.

[0053] The number of the temperature control components 20 may be one or more. When the number of the temperature control components 20 is more than one, the specific positions of the temperature control components 20 may be different. For example, see Figure 5 At this time, there are multiple temperature control components 20. For the sake of convenience, two of the temperature control components 20 are defined as a first temperature control component 20A and a second temperature control component 20B.

[0054] In one embodiment, the second electrode 24 of the first temperature control component 20A is disposed in the driving circuit layer 30, and the second electrode 24 of the second temperature control component 20B is disposed in the light-emitting layer 40. This arrangement can increase the distance between the second electrode 24 of the first temperature control component 20A and the second electrode 24 of the second temperature control component 20B, reduce the difficulty of process preparation, and avoid mutual influence between the first temperature control component 20A and the second temperature control component 20B.

[0055] In one embodiment, the second electrode 24 in the first temperature control component 20A is insulated from the signal line in the driving circuit layer 30 , or the second electrode 24 in the first temperature control component 20A is reused as the signal line in the driving circuit layer 30 .

[0056] In one embodiment, the second electrode 24 in the second temperature control component 20B is in the same layer as the cathode 403 in the light-emitting layer 40 and is arranged at an interval, or the second electrode 24 in the second temperature control component 20B is reused as the cathode 403 in the light-emitting layer 40 .

[0057] Continue reading Figure 5 In one embodiment, the first electrode 21 in the first temperature control component 20A is disposed in the light shielding layer 80 to avoid increasing the thickness of the display panel 100 .

[0058] Continue reading Figure 5 In one embodiment, the first electrode 21 in the second temperature control component 20B is arranged in the driving circuit layer 30, wherein the first electrode 21 in the second temperature control component 20B is spaced and insulated from the signal line in the driving circuit layer 30, or the first electrode 21 in the second temperature control component 20B is reused as the signal line in the driving circuit layer 30.

[0059] In one specific example, see Figure 5 , the first electrode 21 of the first temperature control component 20A is arranged in the light shielding layer 80, the second electrode 24 of the first temperature control component 20 is arranged in the driving circuit layer 30, and is specifically located in the third metal layer 303, the first electrode 21 of the second temperature control component 20B is arranged in the driving circuit layer 30, and is specifically located in the fourth metal layer 304, and the second electrode 24 of the second temperature control component 20 is arranged in the light emitting layer 40, and is specifically arranged in the same layer as the cathode 403 in the light emitting layer 40. At this time, the first temperature control component 20A and the second temperature control component 20B can be independent and do not affect each other.

[0060] See also Figure 6 The display panel 100 includes a display area AA and a non-display area NA located outside the display area. The display area AA is used to display images and is provided with the above-mentioned pixel driving circuit 32 and light-emitting element 42 and other structures. The non-display area NA does not emit light and is usually provided with peripheral circuits and other structures.

[0061] In one embodiment, considering that there are many structures in the display area AA, the temperature control component 20 is set in the display area AA to better adjust the temperature in the display area AA; in another embodiment, considering that there are many structures in the display area AA, in order to reduce the difficulty of preparation, the temperature control component 20 is set in the non-display area NA. Among them, when the number of temperature control components 20 is multiple, some temperature control components 20 can also be located in the display area, and some temperature control components 20 can be located in the non-display area. In short, the present application does not make specific restrictions on the position of the temperature control component 20.

[0062] Among them, see Figure 6 as well as Figure 7 In order to facilitate signal transmission to the first sub-electrode 211 and the second sub-electrode 212, the present embodiment further provides a first signal line 101 and a second signal line 102 in the non-display area NA. The first signal line 101 is electrically connected to the first sub-electrode 211, and the second signal line 102 is electrically connected to the second sub-electrode 212.

[0063] In one embodiment, continue to refer to Figure 7 The display panel 100 further includes a third signal line 103, which is electrically connected to the second electrode 24. Specifically, when the temperature control component 20 is not working, a voltage can be applied to the second electrode 24 through the third signal line 103 to prevent the second electrode 24 from interfering with the signals on both sides thereof. When the temperature control component 20 is working, a voltage can also be applied to the second electrode 24 through the third signal line 103, as long as the voltage difference between the signal lines meets the requirements.

[0064] The third signal line 103 and the second electrode 24 may be disposed in the same layer and prepared by the same patterning process, or the third signal line 103 and the second electrode 24 may be located in different film layers and electrically connected through vias.

[0065] When there are multiple temperature control components 20, the multiple temperature control components 20 can be arranged as follows: Figure 7 way of electrical connection.

[0066] In one implementation, in order to facilitate wiring, the first electrodes 21 of a plurality of temperature control components 20 may be arranged in the same layer.

[0067] When the first electrodes 21 of the plurality of temperature control components 20 are arranged in the same layer, the first electrodes 21 of the plurality of temperature control components 20 can be arranged in the same layer. Figure 8The first sub-electrodes 211 of the temperature control components 20 are arranged in at least one row, and the second sub-electrodes 212 of the temperature control components 20 are arranged in at least one row, and along the column direction Y, the first sub-electrodes 211 and the second sub-electrodes 212 are arranged alternately. The first sub-electrodes 211 in the same row are electrically connected, and the second sub-electrodes 212 in the same row are electrically connected. Figure 8 In the embodiment, the second electrodes 24 of the plurality of temperature control components 20 may be shared, that is, the second electrode 24 may be a whole-surface film layer. Figure 8 In the implementation, the plurality of temperature control components 20 are arranged in an array, and the temperature regulation performance is better.

[0068] And in Figure 8 In an implementation, a pad 201 may be provided for each row of first sub-electrodes 211 and each row of second sub-electrodes 212, through which a voltage may be applied to the first sub-electrodes 211 and the second sub-electrodes 212 in the corresponding row, and a structure such as a flexible circuit board or a chip may be bonded to the pad 201.

[0069] See also Fig. 9 The present application further provides a display device 200, which includes a display panel 210. The display panel 210 has the same structure as the display panel 100 in any of the above embodiments. For details, please refer to the above related content and will not be repeated here.

[0070] The display device 200 can be any device with a display function, such as a notebook, a desktop computer, a tablet computer, a mobile phone, a smart watch, etc., and is not limited here.

[0071] The above are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

[0072] The above descriptions are merely embodiments of the present application and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display panel, characterized in that: The display panel comprises: a first substrate; A temperature control component, disposed on one side of the first substrate, comprises: A first electrode, comprising a first sub-electrode and a second sub-electrode which are spaced apart and insulated; A first semiconductor block and a second semiconductor block are arranged on the same side of the first electrode, the first semiconductor block is electrically connected to the first sub-electrode, and the second semiconductor block is electrically connected to the second sub-electrode; a second electrode electrically connecting the first semiconductor block and the second semiconductor block; Among them, the first semiconductor block and the second semiconductor block are both bipolar semiconductor blocks. When voltage is applied to the first sub-electrode and the second sub-electrode, the polarity of one end of the first semiconductor block connected to the second electrode and the polarity of one end of the second semiconductor block connected to the second electrode are different.

2. The display panel according to claim 1, characterized in that: The material of the first semiconductor block / the second semiconductor block includes silicon-based material; Preferably, the material of the first semiconductor block / the second semiconductor block includes at least one of silicon nitride and silicon oxide.

3. The display panel according to claim 1, characterized in that: The display panel further includes: The driving circuit layer and the light-emitting layer are stacked in sequence on one side of the first substrate, wherein the temperature control component and the driving circuit layer and the light-emitting layer are all arranged in different layers.

4. The display panel according to claim 3, characterized in that: The temperature control component is arranged between the first substrate and the driving circuit layer, and the first electrode is arranged between the first substrate and the second electrode; Preferably, the display panel further includes: A second substrate, disposed between the temperature control component and the driving circuit layer; Preferably, the material of the first substrate / the second substrate comprises polyimide; Preferably, the display panel further includes: A first insulating layer, disposed between the first substrate and the temperature control component; and / or, a second insulating layer, disposed between the temperature control component and the second substrate; Preferably, the first insulating layer / the second insulating layer includes at least one of silicon oxide and silicon nitride.

5. The display panel according to claim 1, characterized in that: The display panel further includes: The driving circuit layer and the light-emitting layer are stacked in sequence on one side of the first substrate, wherein the temperature control component is at least partially formed on the driving circuit layer and / or the light-emitting layer, and the first electrode is arranged between the first substrate and the second electrode.

6. The display panel according to claim 5, characterized in that: The second electrode is arranged in the driving circuit layer, wherein the second electrode is insulated from the signal line in the driving circuit layer, or the second electrode is multiplexed as the signal line in the driving circuit layer; Preferably, the display panel further comprises a light shielding layer disposed between the first substrate and the driving circuit layer, wherein the first electrode is disposed in the light shielding layer; Preferably, the light shielding layer further comprises a light shielding member, and the light shielding member at least partially overlaps with the orthographic projection of the pixel driving circuit in the driving circuit layer on the first substrate.

7. The display panel according to claim 5, characterized in that: The second electrode is disposed in the light-emitting layer; Preferably, the second electrode is in the same layer as the cathode in the light-emitting layer and is arranged at an interval, or the second electrode is reused as the cathode in the light-emitting layer; Preferably, the first electrode is arranged in the driving circuit layer, wherein the first electrode is spaced apart and insulated from a signal line in the driving circuit layer, or the first electrode is multiplexed as a signal line in the driving circuit layer.

8. The display panel according to claim 5, characterized in that: There are multiple temperature control components, and the multiple temperature control components include a first temperature control component and a second temperature control component. The second electrode of the first temperature control component is arranged in the driving circuit layer, and the second electrode of the second temperature control component is arranged in the light-emitting layer. Preferably, the second electrode in the first temperature control component is insulated from the signal line in the driving circuit layer, or the second electrode in the first temperature control component is multiplexed as the signal line in the driving circuit layer; Preferably, the driving circuit layer includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer stacked in sequence in a direction away from the first substrate, and the second electrode in the first temperature control component is located in the third metal layer; Preferably, the second electrode in the second temperature control component is in the same layer as the cathode in the light-emitting layer and is arranged at an interval, or the second electrode in the second temperature control component is reused as the cathode in the light-emitting layer; Preferably, the display panel further comprises a light shielding layer disposed between the first substrate and the driving circuit layer, wherein the first electrode in the first temperature control component is disposed in the light shielding layer; Preferably, the first electrode in the second temperature control component is arranged in the driving circuit layer, wherein the first electrode in the second temperature control component is spaced and insulated from the signal line in the driving circuit layer, or the first electrode in the second temperature control component is multiplexed as the signal line in the driving circuit layer; Preferably, the driving circuit layer includes a first metal layer, a second metal layer, a third metal layer and a fourth metal layer which are stacked in sequence in a direction away from the first substrate, and the first electrode in the second temperature control component is arranged in the fourth metal layer.

9. The display panel according to claim 1, characterized in that: There are multiple temperature control components, and the first electrodes of the multiple temperature control components are arranged in the same layer; Preferably, the first electrodes of the plurality of temperature control components are arranged in a matrix, and the plurality of the first sub-electrodes in the plurality of temperature control components are arranged in at least one row, and the plurality of the second sub-electrodes in the plurality of temperature control components are arranged in at least one row, and along the column direction, the first sub-electrodes and the second sub-electrodes are arranged alternately, and the first sub-electrodes in the same row are electrically connected, and the second sub-electrodes in the same row are electrically connected; Preferably, the display panel includes a display area and a non-display area located outside the display area, the temperature control component is located in the display area or the non-display area, and the display panel further includes: A first signal line, disposed in the non-display area and electrically connected to the first sub-electrode; A second signal line, disposed in the non-display area and electrically connected to the second sub-electrode; Preferably, the display panel further includes: A third signal wiring electrically connected to the second electrode; Preferably, the third signal wiring is provided in the same layer as the second electrode and is made of the same material.

10. A display device, characterized in that: Comprising the display panel as claimed in any one of claims 1 to 9.

Citation Information

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