Metal shielding inductor, preparation method thereof and earphone

Abstract

The invention provides a metal shielding inductor and a preparation method thereof, and an earphone, and the preparation method of the metal shielding inductor mainly comprises the steps: S1, enabling an enameled wire to be wound on a T-core, and carrying out the hot-pressing treatment, and obtaining a preliminary inductor with the electrical property; s2, performing roll spraying on all the surfaces of the primary inductor to form a first insulating layer; s3, performing sputtering coating on the surface of the first insulating layer to form a metal layer; s4, performing laser on the metal layer on the first surface to form a grounding layer; s5, electroplating the other surfaces of the ground layer and the primary inductor to form a metal shielding layer; s6, performing roll spraying on the surface of the metal shielding layer to form a second insulating layer; s7, performing laser treatment on the second insulating layer of the first surface to form a shielding grounding layer, and performing laser treatment on the first insulating layer to expose an electrode; and S8, electroplating the shielding grounding layer and the electrode to obtain the metal shielding inductor. Compared with the prior art, electromagnetic interference can be reduced, noise can be lowered, the grounding effect is achieved, and efficiency is improved.

Description

Technical Field

[0001] The invention relates to a metal shielding inductor and a preparation method thereof, and earphones, belonging to the technical field of earphones. Background Art

[0002] In daily life, as people's living standards improve, their requirements for headphone experience are getting higher and higher. Headphone sound quality and headphone comfort are still the best purchasing drivers.

[0003] The headphones on the market are diversified in form, usage scenarios and applications, which can meet the diverse needs of consumers, while also experiencing accelerated innovation and introducing new features such as posture control and adaptive direction. However, it is inevitable that existing headphones have shortcomings such as loud noise, poor sound quality, high power consumption and slow charging, which are closely related to the inductor settings in the headphones.

[0004] In view of this, it is indeed necessary to improve the existing inductors and headphones to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a method for preparing a metal shielded inductor. The metal shielded inductor prepared by the preparation method not only has a metal magnetic shielding structure, which can reduce electromagnetic interference and reduce noise, but also has a grounding function, which can improve efficiency.

[0006] To achieve the above object, the present invention provides a method for preparing a metal shielded inductor, which mainly comprises the following steps:

[0007] Step S1, winding the enameled wire onto a preformed T-core and performing a heat pressing process to obtain a preliminary inductor with electrical properties, wherein a surface of the preliminary inductor with an electrode is defined as a first surface;

[0008] Step S2, performing roller spraying treatment on all surfaces of the preliminary inductor to form a first insulating layer;

[0009] Step S3, performing sputtering treatment on the surface of the first insulating layer to form a metal layer;

[0010] Step S4, performing laser processing on the metal layer on the first surface to form a ground layer on the first surface;

[0011] Step S5, electroplating the ground layer and the remaining surfaces of the preliminary inductor to form a metal shielding layer;

[0012] Step S6, performing roller spraying on the surface of the metal shielding layer to form a second insulating layer;

[0013] Step S7, performing laser treatment on the second insulating layer on the first surface to form a shielding ground layer with a metal shielding layer, and performing laser treatment on the first insulating layer on the first surface to expose the electrode;

[0014] Step S8, electroplating the shielding ground layer and the electrode to obtain a final metal shielding inductor.

[0015] As a further improvement of the present invention, in step S1, both ends of the enameled wire are exposed on the first surface of the preliminary inductor, and both ends of the enameled wire are configured as electrodes of the preliminary inductor.

[0016] As a further improvement of the present invention, in steps S2 and S3, the first insulating layer and the metal layer completely cover all surfaces of the preliminary inductor together with the electrodes, wherein the metal layer is a Ni layer or a Cu layer.

[0017] As a further improvement of the present invention, step S4 is specifically: laser blasting the metal layer at the electrode until the first insulating layer is exposed, and a grounding layer is formed on the first surface, and the two ends of the grounding layer are respectively connected to the metal layers on the two oppositely arranged second surfaces of the preliminary inductor.

[0018] As a further improvement of the present invention, in step S5, the metal shielding layer is composed of an electroplated Cu layer and an electroplated FeNi layer in sequence.

[0019] As a further improvement of the present invention, in step S7, the second insulating layer covering the grounding layer is laser-etched onto the metal shielding layer to form the shielding grounding layer.

[0020] As a further improvement of the present invention, in step S8, Cu, Ni and Sn are electroplated in sequence on the shielding ground layer and the electrode.

[0021] As a further improvement of the present invention, the method further comprises step S9 of testing and packaging the metal shielded inductor.

[0022] Another object of the present invention is to provide a metal shielded inductor prepared by the above-mentioned preparation method. The metal shielded inductor has a metal magnetic shielding structure and has a grounding function.

[0023] To achieve the above object, the present invention provides a metal shielded inductor, which is prepared by using the above preparation method.

[0024] Another object of the present invention is to provide an earphone comprising the metal shielding inductor, which has the advantages of low noise, good sound quality, low power consumption and fast charging.

[0025] To achieve the above object, the present invention provides an earphone, comprising the above metal shielding inductor.

[0026] The beneficial effects of the present invention are as follows: the present invention forms a grounding layer on the first surface by sputtering a metal layer on the surface of the first insulating layer on all surfaces of the preliminary inductor and laser processing the metal layer on the first surface of the preliminary inductor. In addition, the grounding layer and the remaining surfaces of the preliminary inductor are electroplated to form a metal shielding layer; and a second insulating layer is roll-sprayed on the surface of the metal shielding layer, and the second insulating layer on the first surface is laser processed to form a shielded grounding layer with a metal shielding layer, and the first insulating layer on the first surface is laser processed to expose the electrode on the preliminary inductor. Compared with the prior art, the metal shielded inductor prepared by the preparation method of the present invention not only has a metal magnetic shielding structure, which can reduce electromagnetic interference and reduce noise, but also has a grounding function, which can improve efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a flow chart of the method for preparing the metal shielded inductor of the present invention.

[0028] Figure 2 It is a flow chart of a specific embodiment of the method for preparing the metal shielded inductor of the present invention.

[0029] Figure 3 yes Figure 1 Schematic diagram of a specific embodiment of step S2, step S3 and step S4.

[0030] Figure 4 yes Figure 1 Schematic diagram of a specific implementation of step S5.

[0031] Figure 5 yes Figure 1 Schematic diagram of a specific implementation of step S6.

[0032] Figure 6 yes Figure 1 Schematic diagram of a specific implementation of step S7.

[0033] Figure 7 It is a three-dimensional schematic diagram of the metal shielded inductor in the present invention. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0035] See also Figure 1 and Figure 7As shown, the present invention discloses a method for preparing a metal shielded inductor. The metal shielded inductor 100 prepared by the preparation method has a metal magnetic shielding structure, which can reduce electromagnetic interference and noise. The metal shielded inductor 100 has a grounding function, which can improve efficiency.

[0036] Combination Figure 2-7 As shown, the preparation method of the metal shielded inductor of the present invention is described in detail. The preparation method of the metal shielded inductor comprises the following steps:

[0037] Step S1 , winding the enameled wire onto a preformed T-core and performing a heat pressing process to obtain a preliminary inductor (unnumbered) having electrical properties, wherein the surface of the preliminary inductor having the electrode 7 is defined as the first surface 1 .

[0038] Specifically, step S1 is cold pressing: pressing a specific loose powder material into a T-core with a certain shape and strength through a special mold, and baking the obtained T-core to enhance its strength, so as to facilitate subsequent processes and ensure that the T-core body will not be damaged when the T-core is combined with the enameled wire.

[0039] Winding: After the formed T-core is obtained, the enameled wire is wound on the T-core by a winding machine to initially form an inductor with electrical properties in preparation for subsequent processes. The enameled wire can be the existing technology and will not be described in detail.

[0040] Hot pressing: The T-core with the enameled wire is filled into a mold by a core filling machine, and powder material is then injected into the mold. The powder material is evenly filled by an oscillator. After the powder material completely wraps the enameled wire, a hot pressing process is performed by combining the pressure and temperature of an oil press to obtain a preliminary inductor with electrical properties. In short, the preliminary inductor consists of enameled wire and pressed powder material.

[0041] In this embodiment, the pressure and temperature of the hydraulic press are obtained through experiments, which can ensure the structural stability of the enameled wire, improve the quality of the preliminary inductor, and prevent the risk of interface cracks. The two ends of the enameled wire containing the conductive wire are exposed to the preliminary inductor and serve as electrodes of the preliminary inductor. In this embodiment, the specific loose powder material is preferably a magnetic powder material, and the specific material of the magnetic powder material is not limited.

[0042] The preliminary inductor is rectangular, including a first surface 1 and a third surface (not shown) disposed oppositely, two second surfaces 2 disposed oppositely connecting the first surface 1 and the third surface, and two fourth surfaces 3 disposed oppositely. Both ends of the enameled wire are exposed on the first surface 1 of the preliminary inductor. That is, the electrode 7 of the preliminary inductor is located on the first surface 1 thereof.

[0043] Step S2, performing roller spraying on all surfaces of the preliminary inductor to form a first insulating layer 4, such as Figure 3 shown.

[0044] The step S2 specifically includes spraying a protective adhesive material on the surface of the preliminary inductor in a rolling manner as the first insulating layer 4. It can be understood that the first insulating layer 4 completely covers all surfaces of the preliminary inductor together with the electrode 7, so that all surfaces of the preliminary inductor are insulated as a whole, and the first insulating layer 4 can also cover poor appearance, thereby improving the quality of the preliminary inductor.

[0045] Step S3, performing sputtering treatment on the surface of the first insulating layer 4 to form a metal layer 5. It can be understood that the metal layer 5 completely covers all surfaces of the preliminary inductor together with the electrode 7. The metal layer 5 is a Ni layer or a Cu layer. Since the metal layer 5 is located on the surface of the first insulating layer 4, the metal layer 5 is insulated from the preliminary inductor.

[0046] Step S4 , performing laser treatment on the metal layer 5 on the first surface 1 to form a ground layer 6 on the first surface.

[0047] Step S4 is specifically as follows: laser blasting the metal layer 5 at the electrode 7 on the first surface 1 until the first insulating layer 4 is exposed, and a grounding layer 6 is formed between the two electrodes 7 on the first surface 1. The two ends of the grounding layer 6 are respectively connected to the metal layers 5 on the two oppositely disposed second surfaces 2 of the preliminary inductor. It can be understood that the grounding layer 6 is also the metal layer 5, and the grounding layer 6 is conductive with the metal layers 5 on the two second surfaces 2, the third surface and the two fourth surfaces 3 of the preliminary inductor. The grounding of the preliminary inductor can be achieved by grounding the grounding layer 6.

[0048] Step S5, electroplating the ground layer 6 and the remaining surface of the preliminary inductor to form a metal shielding layer 8, such as Figure 4 shown.

[0049] Specifically, in step S5, a Cu layer and a FeNi layer are electroplated on the ground layer 6 and the metal layer 5 on the two second surfaces 2, the third surface and the two fourth surfaces 3 of the preliminary inductor in sequence, and the metal shielding layer 8 is composed of a Cu layer and a FeNi layer. The function of the metal shielding layer 8 is to form a metal protective shell on the outside of the preliminary inductor to reduce electromagnetic interference and reduce noise.

[0050] Step S6, performing roller spraying on the surface of the metal shielding layer 8 to form a second insulating layer 9, such as Figure 5 shown.

[0051] In step S6, a protective adhesive is sprayed on the surface of the metal shielding layer 8 in a rolling manner as the second insulating layer 9. The second insulating layer 9 is used to insulate and separate the electrode 7 from the metal shielding layer 8 in subsequent processes and to cover appearance defects.

[0052] Step S7, laser treatment is performed on the second insulating layer 9 on the first surface 1 to form a shielding grounding layer 10 with a metal shielding layer 8, and laser treatment is performed on the first insulating layer 4 on the first surface 1 to expose the electrode 7, such as Figure 6 shown.

[0053] Among them, the second insulating layer 9 covering the grounding layer 6 is lasered to the metal shielding layer 8 to form the shielding grounding layer 10. The grounding of the preliminary inductor can be achieved by connecting the shielding grounding layer 10 to the circuit board. In step S6, the second insulating layer 9 is sprayed on the surface of the metal shielding layer 8, and the electrode 7 only has the first insulating layer 4. In order to expose the electrode 7, it is only necessary to laser the first insulating layer 4. In other optional embodiments, the second insulating layer 9 can also be directly sprayed on all surfaces of the preliminary inductor to facilitate spraying. At this time, the electrode 7 has the first insulating layer 4 and the second insulating layer 9, and the first insulating layer 4 and the second insulating layer 9 can be lasered to expose the electrode 7. In step S7, the enameled wire and the pressed powder material are also lasered to increase the exposed area of ​​the electrode 7 and prepare for subsequent electroplating. The electrode 7 is separated from the shielding grounding layer 10 by the first insulating layer 4 or by the superposition of the first insulating layer 4 and the second insulating layer 9.

[0054] Step S8, electroplating the shielding grounding layer 10 and the electrode 7 to obtain the final metal shielding inductor 100. Wherein, Cu, Ni and Sn are electroplated in sequence at the shielding grounding layer 10 and the electrode 7. The solderability, solder resistance and adhesion of the shielding grounding layer 10 and the electrode 7 are increased. The electroplating layer 11 composed of Cu, Ni and Sn is separated from the metal shielding layer 8 under the action of the second insulating layer 9, and the second insulating layer 9 can prevent tin creeping during electroplating. On the first surface 1, the electroplating layer 11 covers the electrode 7 and the exposed pressed powder material, and the electroplating layer 11 located at the electrode 7 is separated from the electroplating layer 11 located on the shielding grounding layer 10 by the first insulating layer 4 or the superposition of the first insulating layer 4 and the second insulating layer 9 to ensure good insulation between the electrode 7 and the ground.

[0055] Step S9, testing and packaging the metal shielded inductor 100. The metal shielded inductor 100 is fully inspected, such as Ls, Rs, Dcr, and impedance detection of the electrode 7 and the ground, to remove defective products in terms of size and performance, and package good products.

[0056] Preferably, in step S1, grooves can be laser-blasted in advance on both sides of the grounding layer 6 to be formed, in preparation for laser blasting the enameled wire and the pressed powder material in step S7, the first insulating layer 4 or the superposition of the first insulating layer 4 and the second insulating layer 9 is sprayed in the groove, the electrode 7 is located outside the groove, and the shielding grounding layer 10 is not conductive with the electrode 7 through the groove. The groove enables the shielding grounding layer 10 and the electrode 7 to be in the same continuous plane, so that the shielding grounding layer 10, the electrode 7 and the circuit board are reliably connected.

[0057] The present invention also discloses an earphone (not shown), comprising the metal shielding inductor 100 and a circuit board, wherein the metal shielding inductor 100 is electrically connected to the circuit board. The shielding grounding layer 10 and the electrode 7 are welded to the circuit board after being electroplated with Cu, Ni and Sn in sequence, and the shielding grounding layer 10 is welded to the grounding terminal on the circuit board to achieve grounding of the metal shielding inductor 100. The metal shielding inductor 100 can reduce electromagnetic interference and noise, so that the earphone has the advantages of low noise, good sound quality, low power consumption and fast charging.

[0058] In summary, the preparation method of the metal shielded inductor of the present invention is to sputter the metal layer 5 on the surface of the first insulating layer 4 on all surfaces of the preliminary inductor; and perform laser treatment on the metal layer 5 on the first side 1 of the preliminary inductor, so as to form a grounding layer 6 on the first side 1. In addition, the grounding layer 6 and the remaining surfaces of the preliminary inductor are electroplated to form a metal shielding layer 8; and the second insulating layer 9 is roll-sprayed on the surface of the metal shielding layer 8, and then the second insulating layer 9 on the first side 1 is laser treated to form a shielded grounding layer 10 with a metal shielding layer 8, and at the same time, the first insulating layer 4 on the first side 1 is laser treated to expose the electrode 7 on the preliminary inductor. Compared with the prior art, the metal shielded inductor 100 prepared by the preparation method of the present invention not only has a metal magnetic shielding structure, which can reduce electromagnetic interference and reduce noise, but also the metal shielded inductor 100 has a grounding function, which can improve efficiency.

[0059] The above embodiments are only used to illustrate the technical solution of the present invention rather than to limit it. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solution of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the present invention.

Claims

1. A method for preparing a metal shielded inductor, characterized in that: The main steps include: Step S1, winding the enameled wire onto a preformed T-core and performing a heat pressing process to obtain a preliminary inductor with electrical properties, wherein a surface of the preliminary inductor with an electrode is defined as a first surface; Step S2, performing roller spraying treatment on all surfaces of the preliminary inductor to form a first insulating layer; Step S3, performing sputtering treatment on the surface of the first insulating layer to form a metal layer; Step S4, performing laser processing on the metal layer on the first surface to form a ground layer on the first surface; Step S5, electroplating the ground layer and the remaining surfaces of the preliminary inductor to form a metal shielding layer; Step S6, performing roller spraying on the surface of the metal shielding layer to form a second insulating layer; Step S7, performing laser treatment on the second insulating layer on the first surface to form a shielding ground layer with a metal shielding layer, and performing laser treatment on the first insulating layer on the first surface to expose the electrode; Step S8, electroplating the shielding ground layer and the electrode to obtain a final metal shielding inductor.

2. The preparation method according to claim 1, characterized in that: In step S1 , two ends of the enameled wire are exposed on a first surface of the preliminary inductor, and the two ends of the enameled wire are configured as electrodes of the preliminary inductor.

3. The preparation method according to claim 2, characterized in that: In steps S2 and S3, the first insulating layer and the metal layer completely cover all surfaces of the preliminary inductor together with the electrodes, wherein the metal layer is a Ni layer or a Cu layer.

4. The preparation method according to claim 3, characterized in that: Step S4 specifically includes: laser lithography the metal layer at the electrode until the first insulating layer is exposed, and a ground layer is formed on the first surface, and two ends of the ground layer are respectively connected to the metal layers on two oppositely disposed second surfaces of the preliminary inductor.

5. The preparation method according to claim 1, characterized in that: In step S5, the metal shielding layer is composed of an electroplated Cu layer and an electroplated FeNi layer in sequence.

6. The preparation method according to claim 1, characterized in that: In step S7, a second insulating layer covering the ground layer is laser-etched to the metal shielding layer to form the shielding grounding layer.

7. The preparation method according to claim 1, characterized in that: In step S8, Cu, Ni and Sn are electroplated in sequence on the shielding ground layer and the electrode.

8. The preparation method according to claim 1, characterized in that: The method further includes step S9 of testing and packaging the metal shielded inductor.

9. A metal shielded inductor, characterized in that: The preparation method is applied to obtain the product according to any one of claims 1 to 8.

10. A headset, characterized in that: The metal shielded inductor comprises the metal shielded inductor as claimed in claim 9.

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