SIP packaging method, SIP packaging structure and electronic equipment

Abstract

The invention discloses an SIP (Session Initiation Protocol) packaging method, an SIP packaging structure and electronic equipment. The SIP packaging method comprises the following steps: forming a separation groove in an SIP product to separate a plurality of functional modules; arranging a shielding film on the surface of the SIP product; the shielding film is heated and softened, so that the shielding film is attached to the surface of the SIP product, and the shielding film can cover the multiple functional modules respectively. The SIP product is provided with separation grooves, a plurality of functional modules are separated through the separation grooves, then a shielding film is arranged on the surface of the SIP product, and the shielding film is heated and softened, so that the shielding film can be attached to the surface of the SIP product, the shielding film can cover the plurality of functional modules respectively, and conformal shielding and separated-cavity shielding can be formed. The packaging efficiency is improved, and the production cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic device packaging, and more specifically, to a SIP packaging method, a SIP packaging structure and an electronic device. Background Art

[0002] In related technologies, hardware innovation and upgrading have increased the demand for "packaging and testing" of smart terminals, and promoted the development of integrated circuit packaging towards high density, high frequency, miniaturization, and high integration. High-frequency chips often generate strong electromagnetic waves when working, causing interference to the inside and outside of the package and the chip. With the continuous increase in the demand for miniaturization of consumer electronics, the integration of RF front-end modules is getting higher and higher, and the design and process of electromagnetic shielding have become extremely critical.

[0003] The current packaging structure mainly includes conformal shielding (CFS) and cavity shielding (CPS). Conformal shielding is mainly achieved through magnetron sputtering or metal shielding cover mounting. Cavity shielding can solve the electromagnetic interference problem between functional modules, and requires the combination of dispensing, metal fence mounting process and magnetron sputtering process. For SiP products (System In a Package) with complex structures, the realization of CPS and CFS requires a series of complex processes such as metal fence mounting, laser grooving, dispensing, magnetron sputtering, etc., resulting in reduced production efficiency and increased production costs.

[0004] Therefore, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the invention

[0005] An object of the present invention is to provide a new technical solution for a SIP packaging method.

[0006] According to a first aspect of the present invention, a SIP encapsulation method is provided. The SIP encapsulation method comprises:

[0007] Open partitions on the SIP product to separate multiple functional modules;

[0008] Arranging a shielding film on the surface of the SIP product;

[0009] The shielding film is heated and softened so as to be attached to the surface of the SIP product. The shielding film can cover the plurality of functional modules respectively.

[0010] Optionally, after the shielding film is heated and softened, the SIP product is subjected to vacuum compression molding.

[0011] Optionally, the method further comprises cutting the whole SIP plate to form a plurality of SIP products, placing the plurality of SIP products into a material tray and then sending them into a heating zone.

[0012] Optionally, before cutting the whole SIP plate to form a plurality of SIP products, the partition grooves are opened on the whole SIP plate.

[0013] Optionally, the shielding film is heated at a temperature of 180°C-350°C.

[0014] Optionally, the shielding film is pressed onto the surface of the SIP product by mechanical pressing.

[0015] Optionally, the shielding film is heated and softened so that the shielding film is bonded to the surface of the SIP product, and then the shielding film is cooled and solidified.

[0016] Optionally, after the shielding film is cooled and solidified, the shielding film adhered to the surface of the tray is cut so that the SIP product can be separated from the tray.

[0017] According to a second aspect of the present invention, a SIP packaging structure is provided, which includes a substrate, a plastic package and a shielding film, wherein the plastic package is arranged on the substrate, the plastic package is provided with a plurality of grooves to separate a plurality of functional modules, and the shielding film covers each of the functional modules respectively.

[0018] According to a third aspect of the present invention, an electronic device is provided, which includes the SIP packaging structure of the above embodiment.

[0019] One technical effect of the present application is that a partition groove is provided on the SIP product to separate multiple functional modules through the partition groove, and then a shielding film is arranged on the surface of the SIP product, and the shielding film is heated and softened so that the shielding film can be attached to the surface of the SIP product, and the shielding film can cover multiple functional modules respectively, so as to form conformal shielding and cavity shielding. The packaging method of the present application is simple, which is conducive to improving packaging efficiency and reducing production costs.

[0020] Further features and advantages of the present invention will become apparent from the following detailed description of exemplary embodiments of the present invention with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.

[0022] Figure 1 It is a partial structural cross-sectional view of a SIP product according to an embodiment of the present application.

[0023] Figure 2 It is a partial structural diagram of a SIP product according to an embodiment of the present application.

[0024] Figure 3 It is a structural diagram of a whole-board SIP according to an embodiment of the present application.

[0025] Figure 4 It is a structural schematic diagram of a SIP product placed on a material tray according to an embodiment of the present application.

[0026] Figure 5 It is a schematic diagram of the structure in which a shielding film cover is arranged on the surface of a material tray according to an embodiment of the present application.

[0027] Reference numerals:

[0028] 1. SIP product; 11. Partition; 12. Functional module; 13. Plastic package; 14. Shielding film; 15. Substrate; 3. Whole board SIP; 4. Material tray; 5. SIP packaging structure. DETAILED DESCRIPTION

[0029] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangement of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless otherwise specifically stated.

[0030] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses.

[0031] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered as part of the specification.

[0032] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0033] It should be noted that like reference numerals and letters refer to similar items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0034] According to an embodiment of the present application, a SIP packaging method is provided. Figures 1 to 5As shown, the SIP packaging method includes opening a partition groove 11 on the SIP product 1 to separate a plurality of functional modules 12; arranging a shielding film 14 on the surface of the SIP product 1; heating and softening the shielding film 14 so that the shielding film 14 fits with the surface of the SIP product 1, and the shielding film 14 can cover the plurality of functional modules 12 respectively.

[0035] like Figure 1 and Figure 2 As shown, in this example, a partition groove 11 is opened on the SIP product 1, and a plurality of functional modules 12 are separated by the partition groove 11, and then a shielding film 14 is arranged on the surface of the SIP product 1, and the shielding film 14 is heated and softened so that the shielding film 14 can be bonded to the surface of the SIP product 1. The shielding film 14 can cover the plurality of functional modules 12 respectively, so as to form conformal shielding and cavity shielding. The packaging method of the present application is simple, which is conducive to improving packaging efficiency and reducing production costs.

[0036] The SIP encapsulation method includes:

[0037] S1, a partition groove 11 is provided on the SIP product 1 to separate a plurality of functional modules 12. The SIP product 1 includes a substrate 15 and a plastic package 13 encapsulated on the surface of the substrate 15, and a plurality of functional modules 12 are encapsulated in the plastic package 13. The partition groove 11 is provided on the SIP product 1, that is, the partition groove 11 is provided on the plastic package 13 by laser, and the plurality of functional modules 12 can be separated by the partition groove 11, and each functional module 12 can be used to realize different functions. For example, a plurality of functional modules 12 such as two, three, four or five can be separated by a plurality of partition grooves 11, and those skilled in the art can determine according to the actual situation, and no specific limitation is made here. Among them, the functional module 12 can be composed of a plurality of electronic component assemblies, and the electronic components are electrically connected to the PCB board.

[0038] S2. Arrange a shielding film 14 on the surface of the SIP product 1. A shielding film 14 that can be used for electromagnetic shielding is laid on the surface of the SIP product 1. The shielding film 14 can cover multiple functional modules 12. The shielding film 14 forms a layer of material that can reflect and absorb electromagnetic waves by adding a metal grid or a conductive coating on the film material. This material can effectively prevent electromagnetic waves from passing through the shielding film 14, thereby protecting electronic equipment, circuits or systems from electromagnetic field interference.

[0039] S3. Heat and soften the shielding film 14 so that the shielding film 14 fits the surface of the SIP product 1. The shielding film 14 can cover the multiple functional modules 12 respectively. After the shielding film 14 is covered on the surface of the SIP product 1, the SIP product 1 is transported to the heater for heating, so that the shielding film 14 can be softened, so that the shielding film 14 can fit tightly to the surface of the SIP product 1. That is, the shielding film 14 can fit tightly to the outer surface of the plastic package 13 to form an electromagnetic compatibility technology in which the shielding film 14 and the plastic package 13 as a packaging structure are tightly combined, that is, conformal shielding is formed.

[0040] Furthermore, after the shielding film 14 is heated and softened, the shielding film 14 can enter the partition 11 and can fit with the inner wall of the partition 11. The shielding film 14 can fit with each surface of the functional module 12, so that the shielding film 14 can form multiple chambers to isolate multiple functional modules 12, that is, it can form a cavity shielding.

[0041] In this example, thermoplastic polymers may be added to the shielding film 14 as a base material, and then after being heated to a certain temperature, these polymers will soften and deform.

[0042] The heating temperature of the shielding film 14 is 180°C-350°C. When the heating temperature of the shielding film 14 is low, for example, the heating temperature is lower than 180°C, the shielding film 14 cannot be softened enough, and it is difficult to fit tightly with the surface of the SIP product 1. When the heating temperature of the shielding film 14 is high, for example, the heating temperature is higher than 350°C, the shielding film 14 will be damaged due to the high temperature. In this example, the heating temperature of the shielding film 14 can be 180°C, 200°C, 250°C, 300°C, 310°C, 320°C, 330°C, 340°C or 350°C, etc. The above value ranges can make the shielding film 14 softened enough to fit tightly with the surface of the SIP product 1, while preventing the shielding film 14 from being damaged by high temperature.

[0043] In this example, the SIP packaging method of the present application enables the shielding film 14 to form conformal shielding and cavity shielding for multiple functional modules 12. The method is simple, which is conducive to improving packaging efficiency and reducing production costs. In addition, the chip can achieve a shielding effect of 50dB-80dB from 100MHz to 3GHz.

[0044] In one example, after the shielding film 14 is heated and softened, the SIP product 1 is subjected to vacuum compression molding.

[0045] In this example, after the shielding film 14 is heated and softened in a heating machine, the SIP product 1 is transported to a vacuum laminating machine through a conveying track light conveying device, and a negative pressure is generated by a vacuum pump using the vacuum adsorption principle, so that the shielding film 14 can be closely attached to the surface of the SIP product 1, thereby achieving the purpose of laminating. By performing vacuum lamination on the softened shielding film 14, the shielding film 14 can be more closely combined with the surface of the SIP product 1.

[0046] In one example, the shielding film 14 is pressed onto the surface of the SIP product 1 by mechanical pressing. For example, the shielding film 14 can be rolled or pressed by a mechanical structure of a pressing roller or a pressing plate so that the shielding film 14 can be more closely attached to the surface of the SIP product 1.

[0047] In an example, Figure 3 and Figure 4 As shown, the method further includes cutting the whole plate SIP 3 to form a plurality of the SIP products 1, placing the plurality of SIPs into a material tray 4 and then sending them into a heating zone.

[0048] In this example, the SIP packaging method further includes cutting the whole SIP 3 to form a plurality of the SIP products 1, and then simultaneously placing the plurality of SIPs into a tray 4 and then sending them together into a heating zone, so that a plurality of SIP packaging structures 5 can be prepared simultaneously to improve production efficiency. The tray 4 can be made of ceramic material, plastic material, metal material or composite material, etc., and the shape of the tray 4 can be a rectangular structure, a circular structure or other irregular shapes, etc., which can be determined by those skilled in the art according to actual conditions and are not specifically limited here.

[0049] like Figure 3 and Figure 4 As shown, in this example, during processing and production, multiple SIP products 1 with an integrated structure can be processed simultaneously, that is, a whole plate SIP3. First, the whole plate SIP3 is cut into multiple single SIP products 1, and then the multiple SIP products 1 are transferred to the tray 4 through a transfer device, and then the shielding film 14 is covered on the surface of the multiple tray 4 SIP products 1, and finally the tray 4 is transported to the heating zone to heat the shielding film 14. After placing the tray 4 in the heater, the tray 4 is transported into the heating zone through the guide rail. In the heating zone, the shielding film 14 can be heated to a specific temperature to soften and fit the surface of the SIP product 1.

[0050] In this example, when transferring multiple single SIP products 1, the SIP products 1 can be placed on the tray 4 through a PnP device (i.e., a Plug-and-Play device, which refers to a hardware device that complies with the PnP standard). PnP can automatically detect and configure hardware devices. When a user connects a hardware device that complies with the PnP standard to a computer, the operating system will automatically detect the device and allocate necessary system resources (such as I / O address, IRQ, DMA channel, and memory segment, etc.) to it. This process does not require user intervention, which greatly simplifies the installation and configuration process of the hardware device.

[0051] In an example, Figure 3 As shown, before the whole plate SIP3 is cut to form a plurality of the SIP products 1, the partition grooves 11 are opened on the whole plate SIP3.

[0052] In this example, if Figure 3 As shown, the multiple individual SIP products 1 in the whole SIP3 can be arranged regularly, for example, in an array. It is convenient to fix the whole SIP3, and then the partition grooves 11 are opened on the whole SIP3 by laser, that is, the partition grooves 11 can be formed on the individual SIP products 1, which is conducive to improving the efficiency of opening the partition grooves 11. In addition, when the whole SIP3 is cut into multiple individual SIP products 1, the cutting can be carried out along the existing partition grooves 11, which is conducive to improving the cutting efficiency.

[0053] In one example, the shielding film 14 is heated and softened so as to be attached to the surface of the SIP product 1 , and then the shielding film 14 is cooled and solidified.

[0054] In this example, after the shielding film 14 is heated and softened, the shielding film 14 can be closely attached to the surface of the SIP product 1, and then the shielding film 14 is cooled and fixed, so that the shielding film 14 can be stably combined with the SIP product 1. When the shielding film 14 needs to be vacuum coated, it can be cooled and solidified after it comes out of the vacuum coating machine. For example, the shielding film 14 can be gradually cooled in a room temperature environment.

[0055] In one example, after the shielding film 14 is cooled and solidified, the shielding film 14 adhered to the surface of the tray 4 is cut, so that the SIP product 1 can be separated from the tray 4 .

[0056] In this example, if Figure 5As shown, after a plurality of SIP products 1 are placed on the tray 4 at intervals, the shielding film 14 is covered on the surface of the plurality of SIP products 1, and then the plurality of SIP products 1 are placed on the tray 4 for heating and vacuum molding, and the shielding film 14 is partially adhered to the surface of the tray 4. After the shielding film 14 is cooled and solidified, the shielding film 14 adhered to the surface of the tray 4 is cut so that the SIP product 1 can be separated from the tray 4. In addition, when the shielding film 14 adhered to the tray 4 is cut, the plurality of SIP products 1 can also be separated at the same time.

[0057] According to another embodiment of the present application, a SIP packaging structure 5 is provided. Figure 1 and Figure 2 As shown, the SIP packaging structure 5 includes a substrate 15, a plastic package 13 and a shielding film 14. The plastic package 13 is arranged on the substrate 15. The plastic package 13 is provided with a plurality of grooves to separate a plurality of functional modules 12. The shielding film 14 covers each of the functional modules 12 respectively.

[0058] In this example, the SIP packaging structure 5 of the present application can be packaged by the SIP packaging method of the above embodiment. That is, when packaging the SIP product 1, a partition groove 11 is opened on the SIP product 1, and multiple functional modules 12 are separated by the partition groove 11, and then a shielding film 14 is arranged on the surface of the SIP product 1, and the shielding film 14 is heated and softened, so that the shielding film 14 can be attached to the surface of the SIP product 1, and the shielding film 14 can cover the multiple functional modules 12 respectively, so as to form conformal shielding and cavity shielding. The packaging method of the present application is simple, which is conducive to improving packaging efficiency and reducing production costs.

[0059] In this example, the SIP packaging structure 5 includes a substrate 15, a plastic package 13 and a shielding film 14. The substrate 15 includes a PCB board and electronic components, and the electronic components are mounted on the PCB board and electrically connected to the PCB board. The plastic package 13 is sealed on the side of the substrate 15 having the electronic components. The plastic package 13 is arranged in the partition groove 11, so that the substrate 15 can be separated into a plurality of functional modules 12. The shielding film 14 can cover the surface of each functional module 12 respectively, that is, the shielding film 14 can be tightly combined with the surface of the plastic package 13. Among them, the surface of the plastic package 13 includes the inner wall of the partition groove 11, the side wall of the plastic package 13 and the surface of the side of the plastic package 13 facing away from the substrate 15.

[0060] In this example, the plastic package 13 can isolate the external environment and prevent impurities such as moisture and dust from entering the SIP packaging structure 5, thereby protecting the internal passive components from damage. And the plastic package 13 can form a stable structure after curing, fix the electronic components on the PCB board, and prevent them from displacement under the conditions of vibration or impact. Among them, the plastic package 13 can be made of resin polymer materials, which have good fluidity, thermal stability and electrical properties. The materials of the plastic package 13 also include epoxy resin, polyimide, etc. Those skilled in the art can determine according to actual conditions, and no specific limitation is made here.

[0061] According to another embodiment of the present application, an electronic device is provided. The electronic device includes the SIP packaging structure 5 of the above embodiment. The electronic device may be a smart phone, a tablet computer or a wearable device, etc. Those skilled in the art may determine the method according to the actual situation, and no specific limitation is made here.

[0062] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0063] Although some specific embodiments of the present invention have been described in detail by way of example, it will be appreciated by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present invention. It will be appreciated by those skilled in the art that the above embodiments may be modified without departing from the scope and spirit of the present invention. The scope of the present invention is defined by the appended claims.

Claims

1. A SIP packaging method, characterized in that: include: A partition groove (11) is provided on the SIP product (1) to separate a plurality of functional modules (12); Arranging a shielding film (14) on the surface of the SIP product (1); The shielding film (14) is heated and softened so that the shielding film (14) is bonded to the surface of the SIP product (1); the shielding film (14) can cover the plurality of functional modules (12) respectively.

2. The SIP packaging method according to claim 1, characterized in that: After the shielding film (14) is heated and softened, the SIP product (1) is subjected to vacuum compression molding.

3. The SIP packaging method according to claim 1, characterized in that: The SIP packaging method further comprises cutting the whole SIP plate (3) to form a plurality of SIP products (1), placing the plurality of SIP products (1) into a material tray (4) and then sending them into a heating zone.

4. The SIP packaging method according to claim 3, characterized in that: Before the whole SIP plate (3) is cut to form a plurality of the SIP products (1), the partition grooves (11) are opened on the whole SIP plate (3).

5. The SIP packaging method according to claim 1, characterized in that: The shielding film (14) is heated at a temperature of 180°C to 350°C.

6. The SIP packaging method according to claim 1, characterized in that: The shielding film is pressed onto the surface of the SIP product by mechanical pressing.

7. The SIP packaging method according to claim 3, characterized in that: The shielding film (14) is heated and softened so that the shielding film (14) is bonded to the surface of the SIP product (1), and then the shielding film (14) is cooled and solidified.

8. The SIP packaging method according to claim 7, characterized in that: After the shielding film (14) is cooled and solidified, the shielding film (14) adhered to the surface of the material tray (4) is cut, so that the SIP product (1) can be separated from the material tray (4).

9. A SIP packaging structure, characterized in that: The SIP packaging structure comprises a substrate (15), a plastic sealing component (13) and a shielding film (14); the plastic sealing component (13) is arranged on the substrate (15); the plastic sealing component (13) is provided with a plurality of grooves to separate a plurality of functional modules (12); and the shielding film (14) covers each of the functional modules (12) respectively.

10. An electronic device, characterized in that: Comprising the SIP packaging structure as claimed in claim 9.

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