A Low-Temperature Co-fired Ceramic Three-Dimensional Packaging Structure

Abstract

This invention discloses a low-temperature co-fired ceramic three-dimensional packaging structure, belonging to the field of semiconductor technology. The invention includes a metal base plate, a ceramic base plate disposed at the top center of the metal base plate, a grouting port disposed on the outer periphery of the ceramic base plate, a ceramic middle clamp plate disposed at the top of the ceramic base plate, a middle bracket disposed at the top center of the ceramic middle clamp plate, and an embedded plate frame disposed at one end of the middle bracket. This invention utilizes the interconnected use of the ceramic base plate, ceramic middle clamp plate, and ceramic top plate. A grouting trough and an overflow trough guide the ceramic slurry to be pressurized and injected into the spaces between multiple sets of spliced ​​plates during static pressure. This fills and reinforces vulnerable and void-prone areas between the multiple sets of spliced ​​plates. The static pressure process, combined with the ceramic slurry, tightly bonds and fixes the multiple sets of plates together, effectively avoiding voids between the plates and increasing the connection strength between the plates. This prevents cracks and internal damage caused by the operating environment, temperature, and other pressures.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, specifically to a low-temperature co-fired ceramic three-dimensional packaging structure. Background Technology

[0002] Low-temperature co-fired ceramics are made by forming low-temperature sintered ceramic powder into a green ceramic tape with precise thickness and density. The required circuit pattern is made on the green ceramic tape using processes such as laser drilling, micro-hole injection, and precision conductor paste printing. Multiple passive components are embedded in it and stacked. Finally, it is sintered. ICs and active devices can be mounted on its surface to form a functional module of LTCC passive / active integration.

[0003] With the development of technology, the requirements for the performance and function of electronic components and assemblies are getting higher and higher, while the size of products is required to be smaller and smaller. LTCC technology can meet both of these requirements, so it has been widely used in the field of microelectronics; LTCC technology is the mainstream technology of passive integration.

[0004] In light of the above, it should be noted that in the production process of traditional low-temperature co-fired ceramics, multiple substrates need to be connected by a static pressing process. Due to the tolerance between the substrates, voids may exist in the assembled low-temperature co-fired ceramics after encapsulation. This can lead to cracks around the voids during subsequent use under the influence of the substrate's operating environment, temperature, and other pressures, thus reducing the lifespan of the substrate.

[0005] To address the aforementioned technical shortcomings, a solution is proposed. Summary of the Invention

[0006] The purpose of this invention is to provide a low-temperature co-fired ceramic three-dimensional encapsulation structure. This structure utilizes a ceramic base plate in conjunction with a ceramic interlocking plate and a ceramic top plate, employing a slurry-filling and overflow trough to guide the ceramic slurry under pressure during static pressing, injecting it between multiple sets of spliced ​​plates. This fills and reinforces vulnerable and void-prone areas between the spliced ​​plates. The static pressing process, combined with the ceramic slurry, tightly bonds and fixes the multiple sets of plates together, effectively preventing voids between the plates and increasing the connection strength between them. This avoids cracking and internal damage caused by environmental factors, temperature, and other pressures, thus solving the aforementioned problems.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a low-temperature co-fired ceramic three-dimensional packaging structure, comprising a metal base plate, a ceramic base plate disposed at the top center of the metal base plate, a grouting port disposed on the outer periphery of the ceramic base plate, a ceramic middle clamping plate disposed at the top of the ceramic base plate, a middle bracket disposed at the top center of the ceramic middle clamping plate, an embedded plate frame disposed at one end of the middle bracket, a ceramic top plate disposed at the top of the middle bracket, and a voltage transformer guide post disposed at the top of the metal base plate penetrating the ceramic base plate, the ceramic middle clamping plate, and the ceramic top plate;

[0008] A chip assembly is located at the center of the top of the ceramic top plate. Long-side locking frames are symmetrically arranged on the outer walls of both sides of the ceramic top plate. Short-side locking frames are arranged at the top of both ends of the ceramic top plate. A sealing cover is provided above the ceramic top plate.

[0009] Furthermore, the grouting port extends to the surface of the ceramic base plate, and the ceramic base plate surface is provided with bursting grooves connected to the grouting port on both sides. The ceramic base plate surface is provided with multiple sets of overflow grooves connecting the bursting grooves and the grouting port.

[0010] Furthermore, the bottom of the ceramic middle plate is provided with a wiring substrate that contacts the ceramic base plate, the surface of the embedded board frame is provided with multiple sets of printed lines, the side of the printed lines is provided with mounting parts, one side of the middle bracket is provided with a middle card plate connected to the embedded board frame, and the end of the middle bracket away from the embedded board frame is provided with a side plate.

[0011] Furthermore, a central column is provided inside the transformer guide column, a top pressure sleeve is slidably sleeved on the top of the central column, a column ring is provided on the top of the top pressure sleeve, a locking ball is provided on the bottom edge of the column ring, and a connecting rod is provided on the bottom inner side of the top pressure sleeve that slides against the outer periphery of the central column.

[0012] Furthermore, multiple sets of rotating outer blocks are hinged to the inner wall of the middle part of the voltage transformer guide post. A rotating inner block is provided above the rotating outer block and is hinged to the inner wall of the voltage transformer guide post. A ball groove is provided in the top of the rotating inner block, and a traction wire connected to the connecting rod is provided at the bottom of the rotating inner block.

[0013] Furthermore, the ceramic top plate has symmetrically arranged side grooves on both sides of the top, a central limiting plate in the middle of the ceramic top plate, long side strips on both sides of the bottom of the sealing cover, and short side strips at both ends of the sealing cover.

[0014] The beneficial effects of this invention are:

[0015] 1. This invention uses a ceramic base plate in conjunction with a ceramic middle plate and a ceramic top plate for coordinated use. The ceramic slurry is guided by a bursting slurry tank and an overflow slurry tank to be injected into the spaces between multiple sets of spliced ​​plates during static pressing. This fills and reinforces the vulnerable and void-prone areas between the multiple sets of spliced ​​plates. The static pressing process, combined with the ceramic slurry, tightly bonds and fixes the multiple sets of plates together, effectively avoiding holes between the plates and increasing the connection strength between the plates. This prevents cracks and internal damage caused by the use environment, temperature, and other pressures.

[0016] 2. This invention uses pressure transformer guide posts to assist the use of ceramic top plates, ceramic middle plates and ceramic bottom plates. The staggered connection between the components on the plates and the pressure matching of the static pressing process cause the pressure transformer guide posts to deform during the bonding of multiple sets of plates, locking the multiple sets of plates together. Combined with the static pressing process, it increases the connection precision and plate strength between the multiple sets of plates. Attached Figure Description

[0017] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings;

[0018] Figure 1 This is a perspective view of the overall structure of the present invention;

[0019] Figure 2 This is a partial three-dimensional exploded structure diagram of the present invention;

[0020] Figure 3 This is a schematic diagram of the structure of the clamping plate in the ceramic of the present invention;

[0021] Figure 4 This is a schematic diagram of the structure of the ceramic base plate of the present invention;

[0022] Figure 5 This is a schematic diagram of the structure of the voltage transformer guide post of the present invention;

[0023] Figure 6 This is a schematic diagram of the structure of the ceramic top plate of the present invention;

[0024] Figure 7 This is a schematic diagram of the sealing cover plate of the present invention.

[0025] Reference numerals: 1. Metal base plate; 2. Long side lock frame; 3. Ceramic top plate; 301. Center limiting plate; 302. Side groove; 4. Chipset; 5. Sealing cover plate; 501. Long side strip; 502. Short side strip; 6. Voltage transformer guide post; 601. Center post; 602. Top pressure sleeve; 603. Column ring; 604. Locking ball; 605. Rotating inner block; 606. Traction wire; 607. Rotating outer block; 608. Connecting rod; 7. Ceramic middle clamp plate; 701. Side plate; 702. Middle clamp plate; 703. Embedded board frame; 704. Printed circuit board; 705. Mounting component; 706. Middle bracket; 707. Wiring substrate; 8. Short side lock frame; 9. Ceramic base plate; 901. Bursting slurry groove; 902. Injection port; 903. Overflow slurry groove. Detailed Implementation

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Example 1: This example addresses the problem that when multiple substrates are connected using a hydrostatic pressing process, the tolerances between the substrates cause voids in the assembled low-temperature co-fired ceramic after encapsulation. This voids lead to cracks around the ceramic during subsequent use due to environmental factors, temperature, and pressure, thus reducing the lifespan of the substrate.

[0028] Please see Figure 1 - Figure 5 As shown, this embodiment is a low-temperature co-fired ceramic three-dimensional packaging structure, including a metal base plate 1, a ceramic base plate 9 is provided at the top center of the metal base plate 1, a grouting port 902 is provided on the outer periphery of the ceramic base plate 9, a ceramic middle clamp plate 7 is provided at the top of the ceramic base plate 9, a middle bracket 706 is provided at the top center of the ceramic middle clamp plate 7, an embedded plate frame 703 is provided at one end of the middle bracket 706, a ceramic top plate 3 is provided at the top of the middle bracket 706, and a voltage transformer guide post 6 is provided at the top of the metal base plate 1, penetrating the ceramic base plate 9, the ceramic middle clamp plate 7 and the ceramic top plate 3. After aligning the holes on the surface of the ceramic base plate 9 with the edge guide post, they are arranged on the metal base plate 1. The wiring substrate 707 and the ceramic middle clamp plate 7 are stacked on the ceramic base plate 9 in sequence. The side length plate 701, the middle clamp plate 702 and the embedded plate frame 703 are attached to the top of the ceramic middle clamp plate 7 in sequence around the middle bracket 706.

[0029] The grouting port 902 extends to the surface of the ceramic base plate 9, and the ceramic base plate 9 has a bursting groove 901 connected to the grouting port 902 on both sides of the surface. The ceramic base plate 9 has multiple sets of overflow grooves 903 connecting the bursting grooves 901 and the grouting port 902. After the center limiting plate 301 is aligned with the middle support plate, the ceramic top plate 3 is stacked on top of the ceramic middle clamping plate 7. The long side locking frame 2 and the short side locking frame 8 are sequentially snapped onto the sides and ends of the ceramic top plate 3 from top to bottom. The bottom of the inner wall of the long side locking frame 2 is provided with a protrusion that snaps onto the side groove 302, and the bottom of the short side locking frame 8 is provided with a protrusion that snaps onto the outer walls of both ends of the ceramic top plate 3.

[0030] The bottom of the ceramic interlayer plate 7 is provided with a wiring substrate 707 that contacts the ceramic base plate 9. The surface of the embedded plate frame 703 is provided with multiple sets of printed lines 704. The side of the printed lines 704 is provided with mounting parts 705. The side of the middle bracket 706 is provided with a middle clamping plate 702 that is connected to the embedded plate frame 703. The end of the middle bracket 706 away from the embedded plate frame 703 is provided with a side length plate 701. The sealing cover plate 5 is snapped onto the long side locking frame 2 and the short side locking frame 8. The long side strip 501 and the short side strip 502 are aligned so that they can be inserted into the top of the long side locking frame 2 and the short side locking frame 8 respectively, thus forming a low-temperature co-fired ceramic three-dimensional component.

[0031] Example 2: Please refer to Figure 1 , Figure 5 - Figure 7 As shown, this embodiment is a low-temperature co-fired ceramic three-dimensional packaging structure, including a chip group 4 set at the top center of a ceramic top plate 3, long side locking frames 2 symmetrically arranged on the outer walls of both sides of the ceramic top plate 3, short side locking frames 8 set at the top of both ends of the ceramic top plate 3, and a sealing cover plate 5 set above the ceramic top plate 3. The preliminarily assembled low-temperature co-fired ceramic three-dimensional component is transferred to the device of the static pressing process. The device fixes the metal base plate 1 and connects the ceramic slurry guide with the slurry injection port 902. The device of the static pressing process continuously presses down the sealing cover plate 5 from top to bottom, causing the sealing cover plate 5, the ceramic top plate 3, and the ceramic middle clamping plate 7 to slide down.

[0032] A central column 601 is provided inside the transformer guide column 6. A top pressure sleeve 602 is slidably sleeved on the top of the central column 601. A column ring 603 is provided on the top of the top pressure sleeve 602. A locking ball 604 is provided on the bottom edge of the column ring 603. A connecting rod 608 is provided on the bottom inner side of the top pressure sleeve 602 and slides on the outer periphery of the central column 601.

[0033] The top pressure sleeve 602 at the top of the pressure guide post slides down under force. The top pressure sleeve 602 drives the locking ball 604 and the connecting rod 608 to slide down synchronously. The connecting rod 608 drives multiple sets of column rings 603 to move down synchronously. The connecting rod 608 slides down and drags the traction wire 606. The traction wire 606 drags the rotating inner block 605 to rotate. The rotating inner block 605 rotates and pushes the top of the rotating outer block 607, causing the rotating outer block 607 to deflect and bulge outward. This presses and locks the adjacent ceramic top plate 3, ceramic middle clamp plate 7 and ceramic bottom plate 9 into the adjacent area. As the connecting rod 608 continues to slide down, the locking ball 604 is inserted into the ball groove of the rotating inner block 605, causing the rotating inner block 605 and the rotating outer block 607 to lock. Combined with the continuous downward pressure of the sealing cover plate 5, the long side strip 501 and the short side strip 502 are respectively locked in the long side lock frame 2 and the short side lock frame 8.

[0034] Multiple sets of rotating outer blocks 607 are hinged to the inner wall of the middle part of the voltage transformer guide post 6. A rotating inner block 605 is provided above the rotating outer block 607 and is hinged to the inner wall of the voltage transformer guide post 6. A ball groove is provided at the top of the rotating inner block 605, and a traction wire 606 connected to the connecting rod 608 is provided at the bottom of the rotating inner block 605.

[0035] The ceramic top plate 3 has symmetrical side grooves 302 on both sides of the top, a central limiting plate 301 in the middle of the ceramic top plate 3, and long side strips 501 on both sides of the bottom of the sealing cover plate 5, and short side strips 502 on both ends of the bottom of the sealing cover plate 5.

[0036] With the continuous pressurization of the hydrostatic pressing process, the guide leads the ceramic slurry into the ceramic base plate 9 through the grouting port 902. The grouting port 902 is provided with micropores connected to the bursting groove 901. The top of the grouting port 902 and the bursting groove 901 are guided by the overflow slurry groove, which guides the ceramic slurry to be evenly distributed to the bottom of the wiring substrate 707. Multiple sets of through grooves are provided in the wiring substrate 707 and the ceramic middle plate 7. The ceramic slurry permeates and distributes along the grooves to the upper and lower surfaces of the ceramic middle plate 7, which promotes the filling of the gaps between the ceramic middle plate 7 and the ceramic base plate 9 and the ceramic top plate 3. Under the continuous hydrostatic pressing process, the internal plates of the low-temperature co-fired ceramic three-dimensional packaging component are precisely bonded to each other into a whole.

[0037] Combining Embodiment 1 and Embodiment 2, the ceramic base plate 9 can be used in conjunction with the ceramic middle plate 7 and the ceramic top plate 3 for coordinated operation. The ceramic slurry is guided by the bursting slurry tank 901 and the overflow slurry tank to be pressurized and injected into the spaces between multiple sets of spliced ​​plates during static pressure. This fills and reinforces the vulnerable and void-prone areas between the multiple sets of spliced ​​plates. The static pressure process, combined with the ceramic slurry, tightly bonds and fixes the multiple sets of plates together, effectively avoiding holes between the plates and increasing the connection strength between the plates. This prevents cracks and internal damage caused by the use environment, temperature, and other pressures.

[0038] The above description is merely an example and illustration of the structure of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described, or use similar methods to replace them, as long as they do not deviate from the structure of the invention or exceed the scope defined in the claims, all of which should fall within the protection scope of the present invention.

[0039] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0040] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A low-temperature co-fired ceramic three-dimensional encapsulation structure, comprising a metal base plate (1), characterized in that, A ceramic base plate (9) is provided at the top center of the metal base plate (1). A grouting port (902) is provided on the outer periphery of the ceramic base plate (9). A ceramic middle clamp plate (7) is provided at the top of the ceramic base plate (9). A middle bracket (706) is provided at the top center of the ceramic middle clamp plate (7). An embedded plate frame (703) is provided at one end of the middle bracket (706). A ceramic top plate (3) is provided at the top of the middle bracket (706). A pressure transformer guide post (6) is provided at the top of the metal base plate (1) that penetrates the ceramic base plate (9), the ceramic middle clamp plate (7) and the ceramic top plate (3). A chip group (4) is provided at the top center of the ceramic top plate (3), long side lock frames (2) are symmetrically provided on the outer walls of both sides of the ceramic top plate (3), short side lock frames (8) are provided at the top of both ends of the ceramic top plate (3), and a sealing cover plate (5) is provided above the ceramic top plate (3). The grouting port (902) extends to the surface of the ceramic base plate (9), and the ceramic base plate (9) has a bursting groove (901) connected to the grouting port (902) on both sides of the surface. The ceramic base plate (9) has multiple sets of overflow grooves (903) connecting the bursting groove (901) and the grouting port (902).

2. The low-temperature co-fired ceramic three-dimensional encapsulation structure according to claim 1, characterized in that, The bottom of the ceramic middle plate (7) is provided with a wiring substrate (707) that contacts the ceramic base plate (9). The surface of the embedded board frame (703) is provided with multiple sets of printed lines (704). The side of the printed lines (704) is provided with mounting parts (705). The side of the middle bracket (706) is provided with a middle card plate (702) that is connected to the embedded board frame (703). The end of the middle bracket (706) away from the embedded board frame (703) is provided with a side plate (701).

3. The low-temperature co-fired ceramic three-dimensional encapsulation structure according to claim 1, characterized in that, The voltage transformer guide post (6) has a central post (601) at its center. A top pressure sleeve (602) is slidably sleeved on the top of the central post (601). A column ring (603) is provided on the top of the top pressure sleeve (602). A locking ball (604) is provided on the bottom edge of the column ring (603). A connecting rod (608) is provided on the bottom inner side of the top pressure sleeve (602) and slides on the outer periphery of the central post (601).

4. The low-temperature co-fired ceramic three-dimensional packaging structure according to claim 3, characterized in that, Multiple sets of rotating outer blocks (607) are hinged to the inner wall of the middle part of the voltage transformer guide post (6). A rotating inner block (605) is provided above the rotating outer block (607) and is hinged to the inner wall of the voltage transformer guide post (6). A ball groove is provided at the top of the rotating inner block (605), and a traction wire (606) connected to the connecting rod (608) is provided at the bottom of the rotating inner block (605).

5. The low-temperature co-fired ceramic three-dimensional packaging structure according to claim 1, characterized in that, The ceramic top plate (3) has symmetrically arranged side grooves (302) on both sides of the top, a central limiting plate (301) is arranged in the middle of the ceramic top plate (3), long side strips (501) are arranged at the bottom of both sides of the sealing cover plate (5), and short side strips (502) are arranged at the bottom of both ends of the sealing cover plate (5).

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