Chip heat dissipation assembly and vehicle

Abstract

The embodiment of the invention provides a chip heat dissipation assembly and a vehicle, relates to the technical field of heat dissipation, and is used for reducing the stress borne by a chip while improving the heat dissipation capability of the chip heat dissipation assembly. The chip heat dissipation assembly comprises a circuit board, a chip, a heat dissipation structure and a heat-conducting medium. The chip is located on the circuit board. The heat dissipation structure covers the side, away from the circuit board, of the chip and is connected with the circuit board. The heat dissipation structure comprises a heat dissipation plate, a surrounding part and a boss part. The surrounding part and the boss part are located on the side, close to the chip, of the heat dissipation plate. The enclosure part and the boss part are both connected with the heat dissipation plate, and the enclosure part is arranged around the boss part; a closed space is defined by the heat dissipation plate, the enclosure part, the boss part and the chip, and a gap is formed between the boss part and the chip. The closed space is filled with the heat-conducting medium, the heat-conducting medium is in a solid state at a first temperature and is in a liquid state at a second temperature, and the second temperature is higher than the first temperature. The chip heat dissipation assembly is applied to a vehicle so as to improve the heat dissipation capacity of a chip in the vehicle.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a chip heat dissipation component and a vehicle. Background Art

[0002] As the level of vehicle automation continues to improve, the power consumption of chips used in vehicle internal modules has increased dramatically, and heat dissipation has become an important challenge to improving chip computing power. Whether the chip can dissipate heat well directly affects vehicle performance. However, the existing heat dissipation devices for chip heat dissipation have poor heat dissipation capacity, and the chip is also subjected to greater stress, resulting in low chip reliability. Summary of the invention

[0003] The embodiments of the present application provide a chip heat dissipation assembly and a vehicle, which are used to reduce the stress borne by the chip while improving the heat dissipation capacity of the chip heat dissipation assembly.

[0004] To achieve the above objectives, the embodiments of the present application adopt the following technical solutions:

[0005] In the first aspect, a chip heat dissipation component is provided, which includes a circuit board, a chip, a heat dissipation structure and a heat-conducting medium. The chip is located on the circuit board. The heat dissipation structure covers the side of the chip away from the circuit board and is connected to the circuit board. The heat dissipation structure includes a heat sink, an enclosure and a boss portion, and the enclosure and the boss portion are located on the side of the heat sink close to the chip. The enclosure and the boss portion are both connected to the heat sink, and the enclosure is arranged around the boss portion. A closed space is enclosed between the heat sink, the enclosure, the boss portion and the chip, and there is a gap between the boss portion and the chip. A heat-conducting medium is filled in the closed space, and the heat-conducting medium is solid at a first temperature and liquid at a second temperature, and the second temperature is higher than the first temperature.

[0006] In the chip heat dissipation assembly provided in the embodiment of the present application, the chip is located between the heat dissipation structure and the circuit board. The heat dissipation structure includes a heat sink, a baffle and a boss portion, the baffle and the boss portion are both located on the side of the heat sink close to the chip, and the baffle and the boss portion are both connected to the heat sink. The baffle is arranged around the boss portion. A closed space is enclosed between the heat sink, the baffle, the boss portion and the chip, thereby providing a space for accommodating the heat conducting medium.

[0007] The heat-conducting medium is solid at the first temperature. In the preparation process of the chip heat dissipation assembly provided in the embodiment of the present application, the heat-conducting medium can be assembled at the first temperature, so that the difficulty of assembling the heat-conducting medium can be lower, thereby reducing the difficulty of preparing the chip heat dissipation assembly and improving the preparation efficiency of the chip heat dissipation assembly.

[0008] The heat-conducting medium is in liquid state at the second temperature. After the solid heat-conducting medium is placed in the closed space, the assembled chip heat dissipation assembly can be placed in an environment with a temperature of the second temperature to change the heat-conducting medium from solid to liquid state, and the liquid heat-conducting medium fills the gap between the boss part and the chip. In this way, the liquid heat-conducting medium will not exert stress on the boss part and the chip, which is conducive to improving the working stability of the chip and improving the yield rate of the chip heat dissipation assembly.

[0009] It can be understood that even if the chip heat dissipation assembly is taken out of the environment with the second temperature, the thermal conductive medium changes from liquid to solid again. Since the size of the part of the thermal conductive medium located in the gap in the direction perpendicular to the circuit board is exactly the same as the size of the gap in the direction perpendicular to the circuit board, the thermal conductive medium will not exert stress on the boss part and the chip, and the working stability of the chip can still be good.

[0010] In some embodiments, the enclosure includes a first end surface facing away from the heat sink, the chip includes a second end surface facing away from the circuit board, and the first end surface is opposite to the second end surface. In this way, the connection between the enclosure and the chip is relatively simple, and the structure of the enclosure can be relatively simple, which is conducive to simplifying the structure of the heat dissipation structure.

[0011] In some embodiments, the enclosure is arranged along the edge of the second end surface. In this way, the contact area between the heat-conducting medium and the chip can be larger, so that the heat-conducting medium can better absorb the heat of the chip and transfer the heat of the chip to the heat sink, thereby facilitating the improvement of the heat dissipation capacity of the chip heat dissipation assembly.

[0012] In some embodiments, in a direction perpendicular to the circuit board, a size of the blocking portion is larger than a size of the boss portion.

[0013] In some embodiments, the boss portion includes a third end surface facing the chip, the third end surface includes a first microgroove, and an extension direction of the first microgroove is parallel to the third end surface.

[0014] The embodiment of the present application forms a first microgroove on the third end face of the boss portion facing the chip, thereby improving the wettability of the liquid heat-conducting medium on the third end face, reducing the contact thermal resistance between the heat-conducting medium and the boss portion, thereby improving the heat conduction efficiency between the liquid heat-conducting medium and the boss portion, and improving the heat dissipation capacity of the chip heat dissipation assembly.

[0015] In some embodiments, the chip includes a second end surface facing away from the circuit board, the second end surface includes a second microgroove, and an extension direction of the second microgroove is parallel to the second end surface.

[0016] The embodiment of the present application forms a second microgroove on the second end face of the chip, thereby improving the wettability of the liquid heat-conducting medium on the second end face, reducing the contact thermal resistance between the heat-conducting medium and the chip, thereby improving the heat conduction efficiency between the liquid heat-conducting medium and the chip, and improving the heat dissipation capacity of the chip heat dissipation component.

[0017] In some embodiments, the chip heat dissipation assembly further includes a sealing structure, and the sealing structure is located between the enclosure and the chip. By providing a sealing structure between the enclosure and the chip, on the one hand, when there is a deviation in the height of the enclosure and / or the height of the chip, the gap between the enclosure and the chip can be filled to ensure the closedness of the enclosed space. On the other hand, when the heat-conducting medium is in liquid form, the sealing structure can be used to prevent the heat-conducting medium from leaking from the enclosed space, causing a short circuit in the circuit board, thereby effectively improving the yield of the chip heat dissipation assembly.

[0018] In some embodiments, the sealing structure is a porous structure, and the diameter of the multiple holes in the sealing structure is larger than the diameter of air molecules. In this way, the gas in the closed space can be discharged through the sealing structure, so that bubbles are not likely to appear in the heat-conducting medium, which is conducive to ensuring the thermal conductivity of the heat-conducting medium and the heat dissipation capacity of the chip heat dissipation component.

[0019] In some embodiments, the heat-conducting medium includes liquid metal. In the embodiments of the present application, the heat-conducting medium is liquid metal, and compared with traditional thermal pads or other silicon-based thermal interface materials, the thermal conductivity of the heat-conducting medium can be higher, and the thermal resistance of the heat-conducting medium can be smaller at the same thickness, thereby significantly improving the heat dissipation capacity of the chip heat dissipation component.

[0020] In a second aspect, a method for preparing a chip heat dissipation assembly is provided, the method comprising: providing a heat dissipation structure. The heat dissipation structure comprises a heat sink, an enclosure and a boss, the enclosure and the boss are both connected to the heat sink, and the enclosure is arranged around the boss. A receiving groove is formed between the enclosure, the boss and the heat sink. A solid heat-conducting medium is placed in the receiving groove. A circuit board and a chip are provided, and the chip is arranged on the circuit board. The heat dissipation structure is connected to the circuit board. The heat sink covers the side of the chip away from the circuit board. The enclosure and the boss are located on the side of the heat sink close to the chip. A closed space is enclosed between the heat sink, the enclosure, the boss and the chip, and there is a gap between the boss and the chip. A heat-conducting medium is filled in the closed space, and the heat-conducting medium is solid at a first temperature and liquid at a second temperature, and the second temperature is higher than the first temperature.

[0021] In a third aspect, a vehicle is provided, comprising a vehicle body, and a chip heat dissipation assembly as described in any of the above embodiments, wherein the chip heat dissipation assembly is located inside the vehicle body.

[0022] Among them, the technical effects brought about by any design method in the second aspect to the third aspect can refer to the technical effects brought about by different design methods in the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the present application, the following is a brief introduction to the drawings required for use in some embodiments of the present application. Obviously, the drawings described below are only drawings of some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not intended to limit the actual size of the product involved in the embodiments of the present application, the actual process of the method, the actual timing of the signal, etc.

[0024] Figure 1 A schematic diagram of the structure of a heat dissipation component provided for related technology;

[0025] Figure 2 A schematic diagram of the structure of a chip heat dissipation assembly provided in an embodiment of the present application;

[0026] Figure 3 A schematic diagram of the structure of another chip heat dissipation assembly provided in an embodiment of the present application;

[0027] Figure 4 A schematic diagram of the structure of a blocking portion, a boss portion and a heat-conducting medium provided in an embodiment of the present application;

[0028] Figure 5 A schematic diagram of the structure of another chip heat dissipation assembly provided in an embodiment of the present application;

[0029] Figure 6 A schematic diagram of the structure of another chip heat dissipation assembly provided in an embodiment of the present application;

[0030] Figure 7 A schematic diagram of a second end surface provided in an embodiment of the present application;

[0031] Figure 8 A flow chart of a method for preparing a chip heat dissipation assembly provided in an embodiment of the present application;

[0032] Fig. 9 for Figure 8 The structural state diagram corresponding to step S100 in the flowchart shown;

[0033] Fig.10 for Figure 8The structural state diagram corresponding to step S200 in the flowchart shown;

[0034] Fig.11 A schematic diagram of the structure of a vehicle provided in an embodiment of the present application. DETAILED DESCRIPTION

[0035] The technical solution in the embodiment of the present application will be described below in conjunction with the accompanying drawings in the embodiment of the present application. In the description of the present application, unless otherwise specified, " / " indicates that the objects associated before and after are in an "or" relationship, for example, A / B can represent A or B.

[0036] The "and / or" in this application is only a way to describe the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can mean: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural.

[0037] In the description of this application, unless otherwise specified, "plurality" means two or more than two. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single items or plural items. For example, at least one of a, b, or c can mean: a, b, c, a and b, a and c, b and c, or a, b and c, where a, b, and c can be single or multiple.

[0038] In order to clearly describe the technical solutions of the embodiments of the present application, in the embodiments of the present application, words such as "first" and "second" are used to distinguish the same or similar items with substantially the same functions and effects. Those skilled in the art can understand that words such as "first" and "second" do not limit the quantity and execution order, and words such as "first" and "second" do not necessarily limit the difference.

[0039] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a concrete way for easy understanding.

[0040] Generally, the level of autonomous driving can be divided into 6 levels (that is, L0 to L5). Among them, Level L0: no autonomous driving, only provides early warning prompts, and does not intervene in vehicle control. Level L1: driving assistance, independent driving assistance system, lane keeping assistance, adaptive cruise control. Level L2: partial autonomous driving, multiple driving assistance systems, integrated control, need to monitor road conditions and intervene in emergencies. Level L3: conditional automation, basically realizes autonomous driving functions, needs to monitor road conditions and intervene in emergencies. Level L4: highly autonomous driving, sometimes requiring driver intervention. Level L5: fully autonomous driving stage, the vehicle completes all vehicle control operations.

[0041] With each level of autonomous driving, the computing power required by the system-on-chip (SOC) in the vehicle increases exponentially, resulting in a significant increase in the power consumption of the system-on-chip, a sharp increase in chip heat, and a significantly increased difficulty in chip heat dissipation.

[0042] At the same time, with the development of electric vehicles, the electrical / electronic architecture (EEA) of electric vehicles will move from the current distributed to the centralized domain, and finally to the centralized vehicle. Electronic control units (ECUs) with different functions will be concentrated on a central computing platform, resulting in very high power consumption of the chips in the central computing platform, and further increasing the difficulty of heat dissipation of system-level chips.

[0043] Figure 1 FIG. 1 is a schematic diagram of a heat dissipation assembly 100 provided in the related art. Figure 1 As shown, the heat dissipation assembly 100 includes a chip 1 , a circuit board 2 , a heat dissipation structure 3 and a thermal interface material (TIM) layer 4 .

[0044] The chip 1 is located on the circuit board 2, and the heat dissipation structure 3 covers the side of the chip 1 away from the circuit board 2, and the heat dissipation structure 3 is connected to the circuit board 2. The thermal interface material layer 4 is located between the chip 1 and the heat dissipation structure 3. Due to the height tolerance of the chip 1 and the height tolerance of the heat dissipation structure 3, the size of the gap between the chip 1 and the heat dissipation structure 3 in the direction perpendicular to the circuit board 2 reaches 1 mm to 2 mm. The thermal interface material layer 4 fills the gap between the chip 1 and the heat dissipation structure 3, and contacts the chip 1 and the heat dissipation structure 3 at the same time, so that the thickness of the thermal interface material layer 4 is relatively large, and the thermal resistance of the thermal interface material layer 4 is also relatively large, so that a large temperature difference (for example, more than 12 degrees Celsius) is generated on the thermal interface material layer 4, resulting in a sharp drop in the heat dissipation performance of the heat dissipation assembly 100 when the chip power consumption in the chip 1 increases.

[0045] In order to improve the heat dissipation performance of the heat dissipation assembly 100, the thermal interface material layer 4 can be made of a material with a higher thermal conductivity, but the material with a higher thermal conductivity usually has a higher hardness. When the thermal interface material layer is placed between the heat dissipation structure 3 and the chip 1, the stress applied by the thermal interface material layer to the chip is also relatively large, which seriously affects the working stability of the chip.

[0046] Based on this, the embodiment of the present application provides a chip heat dissipation component 200, such as Figure 2 As shown, the chip heat dissipation assembly 200 includes a circuit board 10, a chip 20, a heat dissipation structure 30 and a heat-conducting medium 40. The chip 20 is located on the circuit board 10. The heat dissipation structure 30 covers the side of the chip 20 that is away from the circuit board 10 and is connected to the circuit board 10. The heat dissipation structure 30 includes a heat sink 31, a baffle 32 and a boss 33, and the baffle 32 and the boss 33 are both located on the side of the heat sink 31 close to the chip 20. The baffle 32 and the boss 33 are both connected to the heat sink 31, and the baffle 32 is arranged around the boss 33. A closed space M is enclosed between the heat sink 31, the baffle 32, the boss 33 and the chip 20. There is a gap between the boss 33 and the chip 20. The heat-conducting medium 40 is filled in the closed space M, and the heat-conducting medium 40 is solid at a first temperature and liquid at a second temperature, and the second temperature is higher than the first temperature.

[0047] Exemplarily, the circuit board 10 may be a printed circuit board (PCB).

[0048] It is understandable that the chip 20 is located on the circuit board 10 , and the chip 20 should be electrically connected to the circuit board 10 .

[0049] In some examples, the chip heat dissipation assembly 200 may include one chip 20. In this case, the number of chips 20 in the chip heat dissipation assembly 200 is small, and the chip 20 occupies a small area on the circuit board 10, which is conducive to reducing the size of the circuit board 10 and improving the integration of the circuit board 10.

[0050] In other examples, such as Figure 2 As shown, the chip heat dissipation component 200 may include multiple chips 20. At this time, multiple chips 20 can share computing power, so that the power consumption of each chip 20 can be small, which is conducive to reducing the heat dissipation difficulty of the chip heat dissipation component 200 and improving the performance of the chip heat dissipation component 200. When there are multiple chips 20 in the chip heat dissipation component 200, the specific number of chips 20 in the embodiment of the present application is not limited, for example, the number of chips 20 can be 2, 4, 6 or more.

[0051] In the case where the chip heat dissipation assembly 200 includes a plurality of chips 20, as shown in FIG. Figure 2As shown, the heat dissipation structure 30 may include a plurality of enclosures 32 , and each chip 20 corresponds to one enclosure 32 .

[0052] It is understandable that, in addition to the above-mentioned chip 20 , other electronic devices may be disposed on the circuit board 10 , and the other electronic devices may be electrically connected to the chip 20 via wiring within the circuit board 10 .

[0053] For example, the heat sink 31 may be a thin copper plate with good thermal conductivity, a thin aluminum plate with a heat pipe welded thereon, a thin flat heat pipe, or a graphene sheet, etc. This application does not impose any special limitation on this.

[0054] In some examples, the enclosure 32 and the heat sink 31 can be an integral structure. In this case, the enclosure 32 and the heat sink 31 are made of the same material, and gaps are less likely to appear at the connection between the enclosure 32 and the heat sink 31, which is beneficial to improving the connection reliability between the enclosure 32 and the heat sink 31 and improving the sealing of the closed space M.

[0055] In other examples, the enclosure 32, the boss 33 and the heat sink 31 may be an integrated structure. In this case, the enclosure 32, the boss 33 and the heat sink 31 are made of the same material, and the connection stability between the enclosure 32 and the heat sink 31 and between the boss 33 and the heat sink 31 can be good, which is conducive to reducing the cost of the chip heat sink assembly 200 and improving the use stability of the chip heat sink assembly 200.

[0056] In some examples, such as Figure 2 As shown, the heat dissipation structure 30 further includes a connection portion 34, which is located on a side of the heat dissipation plate 31 close to the circuit board 10 and connected to the heat dissipation plate 31. The connection portion 34 is connected to the circuit board 10.

[0057] In the embodiment of the present application, the heat sink 31 is connected and fixed to the circuit board 10 by using the connecting portion 34, so that the connection between the enclosure portion 32, the chip 20 and the heat sink 31 can be stabilized, which helps to avoid the problem of misalignment between the enclosure portion 32 and the chip 20 due to misalignment between the heat dissipation structure and the circuit board, or misalignment between the heat sink and the circuit board, which in turn causes the enclosed space to be destroyed and the liquid heat-conducting medium 40 to leak out of the enclosed space, thereby ensuring the working stability of the chip heat dissipation assembly.

[0058] Exemplarily, the connection portion 34 may be fixedly connected to the circuit board 10 by means of screws.

[0059] In the chip heat dissipation assembly 200 provided in the embodiment of the present application, the chip 20 is located between the circuit board 10 and the heat dissipation structure 30, and the heat dissipation structure 30 includes a heat dissipation plate 31, a blocking portion 32 and a boss portion 33, and the blocking portion 32 and the boss portion 33 are both located on the side of the heat dissipation plate 31 close to the chip 20, and the blocking portion 32 and the boss portion 33 are both connected to the heat dissipation plate 31. The blocking portion 32 is arranged around the boss portion 33. A closed space M is enclosed between the heat dissipation plate 31, the blocking portion 32, the boss portion 33 and the chip 20, thereby providing a space for accommodating the heat conductive medium 40.

[0060] The heat-conducting medium 40 is in a solid state at the first temperature. During the preparation process of the chip heat dissipation assembly 200 provided in the embodiment of the present application, the heat-conducting medium 40 can be assembled at the first temperature, so that the difficulty of assembling the heat-conducting medium 40 can be relatively low, thereby reducing the difficulty of preparing the chip heat dissipation assembly 200 and improving the preparation efficiency of the chip heat dissipation assembly 200.

[0061] The heat-conducting medium 40 is in liquid state at the second temperature. After the solid heat-conducting medium 40 is placed in the closed space M, the assembled chip heat-dissipating assembly 200 can be placed in an environment with a temperature of the second temperature, so that the heat-conducting medium 40 changes from solid to liquid state, and the liquid heat-conducting medium 40 fills the gap between the boss portion 33 and the chip 20. In this way, the liquid heat-conducting medium 40 will not exert stress on the boss portion 33 and the chip 20, which is conducive to improving the working stability of the chip 20 and improving the yield of the chip heat-dissipating assembly 200.

[0062] It can be understood that even if the chip heat dissipation assembly 200 is taken out of the environment with the second temperature, the heat-conducting medium 40 changes from liquid to solid again. Since the size of the part of the heat-conducting medium 40 located in the gap L in the direction perpendicular to the circuit board 10 is exactly the same as the size of the gap L in the direction perpendicular to the circuit board 10, the heat-conducting medium 40 will not exert stress on the boss portion 33 and the chip 20, and the working stability of the chip 20 can still be good.

[0063] For some examples, see Figure 2 , the gap L is perpendicular to the direction of the circuit board 10 ( Figure 2 The dimension d1 in the Z direction (shown in FIG. 1 ) is greater than or equal to 0.1 mm (millimeter) and less than or equal to 1 mm. For example, the dimension d1 of the gap L in the direction perpendicular to the circuit board 10 is 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, 0.9 mm, 1 mm, etc.

[0064] In this way, on the one hand, the dimension d1 of the gap L in the direction Z perpendicular to the circuit board 10 will not be too large, so that the thickness of the heat-conducting medium 40 located between the boss portion 33 and the chip 20 can be small, which is conducive to reducing the thermal resistance value of the heat-conducting medium 40 and improving the heat conduction efficiency of the heat-conducting medium 40. On the other hand, the dimension d1 of the gap L in the direction perpendicular to the circuit board 10 will not be too small, which is conducive to reducing the preparation requirements of the heat dissipation structure 30 and the chip 20 and improving the preparation efficiency of the chip heat dissipation assembly 200.

[0065] In some examples, such as Figure 2 As shown, the heat-conducting medium 40 can occupy the entire enclosed space M, that is, the heat-conducting medium 40 fills the enclosed space M. In this way, the contact area between the heat-conducting medium 40 and the heat sink 31, the enclosure 32, the boss 33 and the chip 20 can be larger, so that the heat of the chip 20 can be better transferred to the heat sink 31, the enclosure 32 and the boss 33, so that the heat of the chip 20 can be dissipated to the environment faster through the heat sink 31, effectively ensuring the heat dissipation performance of the chip heat dissipation assembly 200.

[0066] In other examples, such as Figure 3 As shown, the heat-conducting medium 40 occupies part of the closed space M. That is, the heat-conducting medium 40 can only fill a part of the closed space M. In this way, when the heat-conducting medium 40 is in liquid state, the heat-conducting medium 40 can flow in the closed space M. When the heat-conducting medium 40 contacts the chip 20, the stress generated by the heat-conducting medium 40 on the chip 20 is small, which is conducive to ensuring the working stability of the chip 20 and improving the yield of the chip heat dissipation component 200.

[0067] In some examples, the heat conducting medium 40 may be liquid metal, where liquid metal refers to an amorphous metal, and liquid metal may be considered as a mixture of positive ion fluid and free electron gas.

[0068] In the embodiment of the present application, the heat-conducting medium 40 is liquid metal. Compared with traditional thermal pads or other silicon-based thermal interface materials, the thermal conductivity of the heat-conducting medium 40 can be higher, and the thermal resistance of the heat-conducting medium 40 can be smaller at the same thickness, thereby significantly improving the heat dissipation capacity of the chip heat dissipation assembly 200.

[0069] By adjusting the formula of the liquid metal, the melting point of the liquid metal can be adjusted. In some embodiments, the melting point of the liquid metal can be 35 degrees Celsius to 80 degrees Celsius. For example, the melting point of the liquid metal can be 35 degrees Celsius, 50 degrees Celsius, 60 degrees Celsius, 70 degrees Celsius, or 80 degrees Celsius.

[0070] In this way, the melting point of the liquid metal will not be too low, and the liquid metal can be solid at room temperature, so that it is easy to assemble the heat-conducting medium 40 into the closed space M, reduce the assembly environment requirements of the heat-conducting medium 40, reduce the assembly difficulty of the chip heat dissipation component 200, and improve the preparation efficiency of the chip heat dissipation component 200. At the same time, the melting point of the liquid metal will not be too high, so that when the chip in the chip 20 is in a working state, the heat-conducting medium 40 can be turned into liquid earlier, and the heat generated by the chip 20 can be transferred to the external environment more quickly through the heat dissipation plate 31, avoiding the situation where the temperature of the chip 20 is too high and affects the chip performance.

[0071] It is understandable that the functions of the chips are different, the corresponding power consumption is different, and the heat generated is also different accordingly. Therefore, the melting point of the liquid metal in the embodiments of the present application is not limited to the range provided in the above embodiments.

[0072] In some examples, the first temperature is less than the melting point of the liquid metal, and the second temperature is greater than or equal to the melting point of the liquid metal.

[0073] Next, combine Figure 2 and Figure 4 The structures of the enclosing portion 32 and the boss portion 33 in the heat dissipation structure 30 are described in detail.

[0074] In some embodiments, continue to refer to Figure 2 The enclosure 32 includes a first end surface S1 facing away from the heat sink 31, and the chip includes a second end surface S2 facing away from the circuit board 10, and the first end surface S1 is opposite to the second end surface S2. In this way, the connection between the enclosure 32 and the chip 20 is relatively simple, and the structure of the enclosure 32 can be relatively simple, which is conducive to simplifying the structure of the heat dissipation structure 30.

[0075] In some examples, the enclosure 32 may be provided along the edge of the second end surface S2. In this way, the contact area between the heat conducting medium 40 and the chip 20 may be larger, so that the heat conducting medium 40 may better absorb the heat of the chip 20 and transfer the heat of the chip 20 to the heat dissipation plate 31, thereby facilitating the improvement of the heat dissipation capacity of the chip heat dissipation assembly 200.

[0076] At this time, for example, the outer edge of the projection of the enclosure portion 32 on the circuit board 10 may completely overlap or partially overlap with the edge of the projection of the chip 20 on the circuit board 10 .

[0077] For example, the projection of the chip 20 on the circuit board 10 may be in the shape of a rectangle. The projection of the enclosure 32 on the circuit board 10 may be in the shape of a circular ring or a square ring.

[0078] like Figure 2As shown, in some embodiments, the enclosure 32 can be arranged around a boss portion 33. In this way, the closed space M enclosed by the heat sink 31, the enclosure 32, the boss portion 33 and the chip 20 can have a relatively simple shape, and the solid heat-conducting medium 40 can be more easily assembled into the closed space M, thereby further reducing the assembly difficulty of the chip heat dissipation assembly 200 and improving the preparation efficiency of the chip heat dissipation assembly 200. At the same time, such a setting is also conducive to simplifying the heat dissipation structure 30, reducing the preparation difficulty of the heat dissipation structure 30, and improving the preparation efficiency of the heat dissipation structure 30.

[0079] Based on this, in some examples, such as Figure 4 As shown, a groove 301 may be formed between the boss portion 33 and the enclosure portion 32, and the projection of the groove 301 on the circuit board 10 is in a circular shape. In this way, when the solid heat-conducting medium 40 is placed in the groove 301 between the boss portion 33 and the enclosure portion 32, even if the size of the solid heat-conducting medium 40 is different, the solid heat-conducting medium 40 can be placed in the groove 301 relatively easily.

[0080] Of course, in other embodiments, the blocking portion 32 may also be disposed around the plurality of boss portions 33 .

[0081] In some embodiments, continue to refer to Figure 2 In the direction Z perpendicular to the circuit board 10, the dimension d2 of the enclosure portion 32 is greater than the dimension d3 of the boss portion 33. In the embodiment of the present application, the specific values ​​of the dimension d2 of the enclosure portion 32 in the direction Z perpendicular to the circuit board 10 and the dimension d3 of the boss portion 33 in the direction Z perpendicular to the circuit board 10 are not limited and can be designed according to actual needs.

[0082] Of course, in other embodiments, in the direction Z perpendicular to the circuit board 10 , the dimension d2 of the blocking portion 32 may also be smaller than or equal to the dimension d3 of the boss portion 33 .

[0083] In some examples, such as Figure 2 and Figure 4 As shown, the boss portion 33 includes a third end surface S3 facing the chip 20. Figure 4 The third end surface S3 includes a first microgroove 331, and an extension direction X1 of the first microgroove 331 is parallel to the third end surface S3. In the first target direction Y1 perpendicular to the extension direction X1 of the first microgroove 331, a dimension d4 of the first microgroove 331 is less than 1 mm.

[0084] In some examples, the third end surface S3 may be circular, elliptical, or rectangular, etc.

[0085] In some examples, the third end surface S3 may include a plurality of first microgrooves 331. In this case, the specific number of the first microgrooves 331 is not limited in the embodiment of the present application, and can be designed according to actual needs. In the case where the third end surface S3 includes a plurality of first microgrooves 331, the extension directions X1 of the plurality of first microgrooves 331 may be the same or different.

[0086] In the embodiment of the present application, there is no limitation on the specific values ​​of the size of the first microgroove 331 in the extension direction X1, the size of the first microgroove 331 in the first target direction Y1, and the depth of the first microgroove 331, and they can be designed according to actual needs.

[0087] When the third end surface S3 includes a plurality of first microgrooves 331, the sizes of the plurality of first microgrooves 331 in the extension direction X1 thereof may be the same or different. Similarly, when the third end surface S3 includes a plurality of first microgrooves 331, the sizes of the plurality of first microgrooves 331 in the first target direction Y1 may be the same or different. When the third end surface S3 includes a plurality of first microgrooves 331, the depths of the plurality of first microgrooves 331 may be the same or different.

[0088] The embodiment of the present application forms a first microgroove 331 on the third end surface S3 of the boss portion 33 facing the chip 20, thereby improving the wettability of the liquid heat-conducting medium 40 on the third end surface S3, reducing the contact thermal resistance between the heat-conducting medium 40 and the boss portion 33, thereby improving the thermal conductivity between the liquid heat-conducting medium 40 and the boss portion 33, and improving the heat dissipation capacity of the chip heat dissipation assembly 200.

[0089] In some examples, such as Figure 5 As shown, along the gravity direction Q, the chip 20 is located above the circuit board 10, and the inclination angle α of the circuit board 10 relative to the horizontal plane W is less than or equal to the preset angle, and the thermal conductive medium 40 contacts the relative surface between the boss portion 33 and the chip 20 at the same time.

[0090] The specific value of the preset angle is not limited in the embodiment of the present application, and can be designed according to actual needs. For example, the preset angle can be 30 degrees, 40 degrees, 50 degrees or larger.

[0091] In this way, when the chip heat dissipation assembly 200 is tilted, the heat conducting medium 40 can always be in contact with the boss portion 33 and the chip 20 , thereby ensuring that the heat conducting medium 40 can continuously and efficiently transfer the heat generated by the chip 20 to the heat dissipation plate 31 .

[0092] In some embodiments, Figure 6 As shown, the chip heat dissipation assembly 200 may further include a sealing structure 50 , and the sealing structure 50 is located between the enclosure 32 and the chip 20 .

[0093] By providing a sealing structure 50 between the enclosure 32 and the chip 20, on the one hand, when there is a deviation in the height of the enclosure 32 and / or the height of the chip 20, the gap between the enclosure 32 and the chip 20 can be filled to ensure the closedness of the closed space M. On the other hand, when the heat-conducting medium 40 is in liquid state, the sealing structure 50 can be used to prevent the heat-conducting medium 40 from leaking from the closed space M, resulting in a short circuit of the circuit board 10, thereby effectively improving the yield of the chip heat dissipation assembly 200.

[0094] In some examples, the sealing structure 50 may be a porous structure, and the diameter of the multiple holes in the sealing structure 50 is larger than the diameter of the air molecule. In this way, the gas in the closed space M can be discharged through the sealing structure 50, so that bubbles are not easy to appear in the thermal conductive medium 40, which is conducive to ensuring the thermal conductivity of the thermal conductive medium 40 and the heat dissipation capacity of the chip heat dissipation component 200. It can be understood that due to the existence of surface tension, the particles (for example, ions, atoms or molecules, etc.) in the liquid thermal conductive medium are pulled together, so that the liquid thermal conductive medium will not pass through the sealing structure 50.

[0095] For example, the material of the sealing structure 50 may include rubber or foam.

[0096] In some embodiments, Figure 6 As shown, the chip 20 includes a wafer 21 and a protective cover 22. The wafer 21 is located on the circuit board 10. The protective cover 22 covers the side of the wafer 21 away from the circuit board 10. The protective cover 22 is used to protect the wafer 21 to prevent the wafer 21 from being damaged by external forces.

[0097] In some examples, the chip 20 may include one wafer 21 . In other examples, the chip 20 may include a plurality of wafers 21 .

[0098] In some examples, the chip 20 may further include a substrate (not shown), on which the wafer 21 is integrated. The protective cover 22 may be connected to the substrate. The wafer 21 may be electrically connected to the substrate via a first connection structure. A conductive layer may be formed in the substrate, and the conductive layer may include a wiring structure, through which the substrate may establish a signal path between wafers or between a wafer and other electronic devices.

[0099] When the wafer is set on the substrate, the flip-chip ball grid array (FCBGA) packaging technology can be used. In some other packaging structures, the wire bonding technology can also be used to set the wafer on the substrate. The substrate has a variety of structures that can be selected. For example, the substrate can be a packaging substrate (substrate), or it can be a redistribution layer (RDL) substrate made by a redistribution process, or it can be an interposer. Of course, other structures are also possible. Among them, the substrate can be electrically connected to the circuit board through a second connection structure. Exemplarily, the second connection structure can be a ball grid array (BGA), or it can be a plurality of copper pillar bumps arranged in an array, etc.

[0100] In some examples, such as Figure 6 As shown, the projection of the wafer 21 on the circuit board 10 is located inside the projection of the enclosure 32 on the circuit board 10. In this way, the projection of the wafer 21 on the circuit board 10 can be located inside the projection of the heat-conducting medium 40 on the circuit board 10, and the heat generated by the wafer 21 can be quickly transferred to the heat-conducting medium 40 through the protective cover 22, thereby effectively improving the heat dissipation efficiency of the chip heat dissipation assembly 200.

[0101] In other examples, continue to refer to Figure 6 The projection of the wafer 21 on the circuit board 10 can be located inside the projection of the boss portion 33 on the circuit board 10. In this way, the heat generated by the wafer 21 can be quickly transferred to the heat conducting medium 40 through the protective cover 22, and then quickly transferred to the boss portion 33 by the heat conducting medium 40, and then transferred to the heat dissipation plate 31 by the boss portion 33, which effectively shortens the heat transfer path and improves the heat dissipation efficiency of the chip heat dissipation assembly 200.

[0102] In some examples, such as Figure 6 As shown, the chip 20 further includes a heat-conducting layer 23, and the heat-conducting layer 23 is located between the protective cover 22 and the wafer 21. In this way, the heat generated by the wafer 21 can be transferred to the protective cover 22 through the heat-conducting layer 23, which effectively improves the heat transfer efficiency between the wafer 21 and the protective cover 22, and is conducive to further improving the heat dissipation capacity of the chip heat dissipation assembly 200.

[0103] In some other embodiments, the chip 20 may also include only a wafer. In this case, a closed space M may be formed between the enclosure portion 32 , the boss portion 33 , the heat sink 31 and the wafer.

[0104] In some embodiments, Figure 7As shown, the chip 20 may include a second end face S2 facing away from the circuit board 10, the second end face S2 includes a second microgroove 201, the extension direction X2 of the second microgroove 201 is parallel to the second end face S2, and along a second target direction Y2 perpendicular to the extension direction X2 of the second microgroove 201, the size d5 of the second microgroove 201 is less than 1 mm.

[0105] In some examples, the second end surface S2 may include a plurality of second microgrooves 201. At this time, the specific number of the second microgrooves 201 is not limited in the embodiment of the present application, and can be designed according to actual needs. When the second end surface S2 includes a plurality of second microgrooves 201, the extension directions X2 of the plurality of second microgrooves 201 may be the same or different.

[0106] In the embodiment of the present application, there is no limitation on the specific values ​​of the size of the second microgroove 201 in its extension direction X2, the size of the second microgroove 201 in the second target direction Y2, and the depth of the second microgroove 201, and they can be designed according to actual needs.

[0107] It can be understood that, in the case where the chip includes the protection cover 22 , the second end surface S2 of the chip 20 facing away from the circuit board 10 may be the surface of the protection cover 22 facing away from the circuit board 10 .

[0108] The embodiment of the present application forms a second microgroove 201 on the second end surface S2 of the chip 20, thereby improving the wettability of the liquid heat-conducting medium 40 on the second end surface S2, reducing the contact thermal resistance between the heat-conducting medium 40 and the chip 20, thereby improving the thermal conductivity between the liquid heat-conducting medium 40 and the chip 20, and improving the heat dissipation capacity of the chip heat dissipation assembly 200.

[0109] In some embodiments, Figure 6 As shown, the chip heat dissipation assembly 200 may further include a lower shell 60. The lower shell 60 is located on one side of the circuit board 10 and the chip 20. The lower shell 60 is connected to the heat dissipation plate 31 to form a chamber T, in which the circuit board 10 and the chip 20 are both located.

[0110] In the embodiment of the present application, the lower shell 60 is connected to the heat sink 31 to form a chamber T, and the circuit board 10 and the chip 20 are both located in the chamber T, so that the heat sink 31 and the lower shell 60 can be used to protect the circuit board 10 and the chip 20.

[0111] like Figure 8 As shown, the embodiment of the present application further provides a method for preparing a chip heat dissipation assembly 200 , and the method includes steps S100 to S400 .

[0112] S100, such as Fig. 9As shown, a heat dissipation structure 30 is provided, which includes a heat dissipation plate 31, a blocking portion 32 and a boss portion 33. The blocking portion 32 and the boss portion 33 are both connected to the heat dissipation plate 31, and the blocking portion 32 is arranged around the boss portion 33. An accommodating groove 302 is formed between the blocking portion 32, the boss portion 33 and the heat dissipation plate 31.

[0113] S200, such as Fig.10 As shown, a solid heat-conducting medium 40 is placed in the receiving groove 302 .

[0114] In some examples, such as Fig.10 As shown, the volume of the solid heat-conducting medium 40 may be smaller than the volume of the receiving groove 302. In other examples, the volume of the solid heat-conducting medium 40 may be equal to the volume of the receiving groove 302.

[0115] S300, see Figure 6 , provide a circuit board 10 and a chip 20 , and set the chip 20 on the circuit board 10 .

[0116] S400, see Figure 6 , connect the heat dissipation structure 30 to the circuit board 10. At this time, the heat dissipation structure 30 covers the side of the chip 20 away from the circuit board 10. The enclosure 32 and the boss 33 are located on the side of the heat dissipation plate 31 close to the chip 20. A closed space M is enclosed between the heat dissipation plate 31, the enclosure 32, the boss 33 and the chip 20, and there is a gap L between the boss 33 and the chip 20. The closed space M is filled with a heat conducting medium 40, which is solid at a first temperature and liquid at a second temperature, and the second temperature is higher than the first temperature.

[0117] For example, after the heat dissipation structure 30 is connected to the circuit board 10 , the chip heat dissipation assembly 200 may be placed in a high temperature oven and baked for a period of time, so that the heat conducting medium 40 changes from solid to liquid and contacts the chip 20 .

[0118] The beneficial effects that can be achieved by the method for preparing the chip heat dissipation assembly 200 provided in the embodiment of the present application are the same as the beneficial effects that can be achieved by the chip heat dissipation assembly 200 provided in any of the above embodiments, and will not be repeated here.

[0119] The present application also provides a vehicle, such as Fig.11 As shown, the vehicle 300 includes a vehicle body 310 and a chip heat dissipation assembly 200 as described in any of the above embodiments, and the chip heat dissipation assembly 200 is located inside the vehicle body 310 .

[0120] Understandably, Fig.11 The above diagram only illustrates the location of the car body 310 and the chip heat dissipation assembly 200. In fact, the structure of the car body 310 can be the same as that of the Fig.11The structure of the vehicle body 310 is different, and the chip heat dissipation assembly 200 can be set at a different position. Fig.11 The specific structure of the vehicle body 310 and the location of the chip heat dissipation assembly 200 in the embodiment of the present application are not limited, as long as the chip heat dissipation assembly 200 is located in the vehicle body 310 .

[0121] Among them, the vehicle can be but is not limited to a pure electric vehicle (pure electric vehicle / battery electric vehicle, PEV / BEV), a hybrid electric vehicle (hybrid electric vehicle, HEV), a range extended electric vehicle (range extended electric vehicle, REEV), a plug-in hybrid electric vehicle (plug-in hybrid electric vehicle, PHEV), a new energy vehicle (new energy vehicle), a fuel vehicle, etc.

[0122] Exemplarily, the chip heat dissipation assembly 200 can be applied to the vehicle's automatic driving module, braking system module, steering and braking system module, and other modules.

[0123] The beneficial effects that can be achieved by the vehicle provided in the embodiment of the present application are the same as the beneficial effects that can be achieved by the chip heat dissipation assembly 200 provided in any of the above embodiments, and will not be repeated here.

[0124] It can be understood that the chip heat dissipation component 200 provided in the embodiment of the present application can be applied not only to the vehicle 300 as described above, but also to any device that requires chip heat dissipation, such as mobile phones, tablet computers, laptops, smart bracelets, smart watches, and other smart consumer electronic devices, and can also be telecommunications room-type equipment such as metropolitan area routers and central routers, and can also be IT computer room-type equipment such as data center servers and data center switches, and can also be vehicle-mounted equipment such as mobile data centers (mobiledata center, MDC), and it can also be applied to industrial robots, rail transit (such as subways, high-speed railways) or special power supplies (such as ships, airplanes, vehicles), etc., and the embodiments of the present application do not limit this.

[0125] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0126] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A chip heat dissipation component, characterized in that: include: Circuit boards; A chip, located on the circuit board; A heat dissipation structure, covering the side of the chip away from the circuit board, and connected to the circuit board; the heat dissipation structure comprises a heat dissipation plate, a baffle and a boss portion, the baffle and the boss portion are located on the side of the heat dissipation plate close to the chip; the baffle and the boss portion are both connected to the heat dissipation plate, and the baffle is arranged around the boss portion; a closed space is enclosed between the heat dissipation plate, the baffle, the boss portion and the chip, and there is a gap between the boss portion and the chip; A heat-conducting medium is filled in the closed space, wherein the heat-conducting medium is solid at a first temperature and liquid at a second temperature, and the second temperature is higher than the first temperature.

2. The chip heat dissipation assembly according to claim 1, characterized in that: The enclosure portion includes a first end surface facing away from the heat sink, the chip includes a second end surface facing away from the circuit board, and the first end surface is opposite to the second end surface.

3. The chip heat dissipation assembly according to claim 2, characterized in that: The blocking portion is arranged along the edge of the second end surface.

4. The chip heat dissipation assembly according to any one of claims 1 to 3, characterized in that: In a direction perpendicular to the circuit board, a size of the blocking portion is larger than a size of the boss portion.

5. The chip heat dissipation assembly according to any one of claims 1 to 4, characterized in that: The boss portion includes a third end surface facing the chip, the third end surface includes a first micro groove, and an extending direction of the first micro groove is parallel to the third end surface.

6. The chip heat dissipation assembly according to any one of claims 1 to 5, characterized in that: The chip comprises a second end surface facing away from the circuit board, the second end surface comprises a second micro groove, and the extension direction of the second micro groove is parallel to the second end surface.

7. The chip heat dissipation assembly according to any one of claims 1 to 6, characterized in that: Also includes: The sealing structure is located between the enclosure and the chip.

8. The chip heat dissipation assembly according to claim 7, characterized in that: The sealing structure is a porous structure, and the diameters of the multiple holes in the sealing structure are larger than the diameters of air molecules.

9. The chip heat dissipation assembly according to any one of claims 1 to 8, characterized in that: The heat conducting medium is liquid metal.

10. A vehicle, characterized in that: include: Car body, The chip heat dissipation assembly according to any one of claims 1 to 9, wherein the chip heat dissipation assembly is located inside the vehicle body.

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