A cold plate assembly and a heat dissipation system

Abstract

The present invention relates to the technical field of aircraft thermal management, and more specifically, to a cold plate assembly and a heat dissipation system. The cold plate assembly includes a first assembly unit, a second assembly unit, and a heat exchange unit. The two sides of the heat exchange unit are detachably connected to the first assembly unit and the second assembly unit respectively; the heat exchange unit is provided with an inlet end and an outlet end; the heat exchange unit includes at least one first flow channel and at least one second flow channel; the inlet end, the first flow channel, the second flow channel, and the outlet end are connected in sequence; the spacing distance between the first flow channel and the second flow channel is within a set range; the sum of the cross-sectional areas of all the first flow channels is smaller than the sum of the cross-sectional areas of all the second flow channels. In this way, the problem of how to improve the heat exchange effect of the cold plate on electronic devices is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of aircraft thermal management, and more particularly, to a cold plate assembly and a heat dissipation system. Background Art

[0002] At present, the aircraft environmental control system needs to solve three major thermal management problems of "high heat flux density cooling, high power heat dissipation, and high uniformity temperature control" on the hot surface of electronic devices. The traditional electronic device heat dissipation systems mainly include air-cooled heat dissipation systems and liquid-cooled heat dissipation systems. Among them, the air-cooled heat dissipation system can no longer meet the high-power heat dissipation requirements of electronic devices due to its low heat dissipation power. At the present stage, the liquid-cooled heat dissipation system is mostly used as the main body in the electronic device thermal management system.

[0003] However, with the further improvement of the power level of electronic devices, on the one hand, the liquid-cooled heat dissipation system needs to further increase the circulation flow rate of the liquid coolant to improve its own heat dissipation power, which brings the disadvantages of thick liquid-cooled pipelines, large total system weight, and high power consumption of the liquid pump. Among them, the thick liquid-cooled pipelines will cause difficulties in the equipment layout of the aircraft in a limited space. On the other hand, the liquid-cooled heat dissipation system relies on the liquid-cooled plate to absorb the heat on the surface of the electronic device. Since the heat exchange process of the liquid coolant in the cold plate is a single-phase heat exchange process, that is, the absorbed heat is only converted into the sensible heat of the liquid itself, therefore, under the high-power heat dissipation condition, the liquid temperature difference between the inlet and outlet of the liquid-cooled plate is large, and then the phenomenon of low local heat flux density, poor temperature uniformity, and local overheating on the surface of the electronic device occurs, which endangers the use safety of the electronic device. Summary of the Invention

[0004] To solve the problem of how to improve the heat exchange effect of the cold plate on the electronic device, the present invention provides a cold plate assembly and a heat dissipation system.

[0005] In a first aspect, the present invention provides a cold plate assembly, the cold plate assembly comprising:

[0006] A first assembly unit;

[0007] A second assembly unit;

[0008] A heat exchange unit, both sides of the heat exchange unit are detachably connected to the first assembly unit and the second assembly unit respectively; the heat exchange unit is provided with an inlet end and an outlet end; the heat exchange unit includes at least one first flow channel and at least one second flow channel; the inlet end, the first flow channel, the second flow channel, and the outlet end are connected in sequence; the interval distance between the first flow channel and the second flow channel is within a set range; the sum of the cross-sectional areas of all the first flow channels is smaller than the sum of the cross-sectional areas of all the second flow channels.

[0009] In some embodiments, the first flow channel includes a plurality of first pipelines and a plurality of first connecting parts; the plurality of first pipelines and the plurality of first connecting parts are fixedly connected at intervals in sequence; two adjacent first pipelines are communicated through the first connecting part; the first pipeline at one end of the first flow channel is communicated with the inlet end, and the first pipeline at the other end is communicated with the second flow channel.

[0010] In some embodiments, the first pipeline includes a plurality of first straight sections, a plurality of second straight sections, and a plurality of first vertical sections; one end of the first vertical section is fixedly connected to the first straight section, and the other end is fixedly connected to the second straight section; the included angle between the first straight section and the first vertical section is within a first set included angle range; the included angle between the second straight section and the first vertical section is within a second set included angle range; one end of a first connecting part is communicated with any one of the first straight section, the second straight section, and the first vertical section.

[0011] In some embodiments, the included angle between the first connecting part and the first pipeline is within a third set included angle range.

[0012] In some embodiments, the second flow channel includes a plurality of second pipelines, a second connecting part, a third connecting part, and a fourth connecting part; the third connecting part is communicated with one end of the first flow channel far from the outlet end through the second connecting part; the third connecting part and the fourth connecting part are arranged at intervals; the second pipelines are respectively communicated with the third connecting part and the fourth connecting part; the plurality of second pipelines are arranged at intervals; the second pipeline at one end of the second flow channel far from the second connecting part is communicated with the outlet end.

[0013] In some embodiments, the cross-sectional area of the second connecting part is smaller than the cross-sectional area of the third connecting part.

[0014] In some embodiments, the cross-sectional areas of the plurality of second pipelines increase in sequence along the flow direction of the cooling medium in the third connecting part.

[0015] In some embodiments, the connection position of the second pipeline and the third connecting part is a first position; the connection position of the second pipeline and the fourth connecting part is a second position;

[0016] The first positions are arranged at intervals along the length direction of the third communication part; among two adjacent first positions, one of the first positions is arranged adjacent to one side in the width direction of the third communication part, and the other first position is arranged adjacent to the other side in the width direction of the third communication part; the second positions are arranged at intervals along the length direction of the fourth communication part; among two adjacent second positions, one of the second positions is arranged adjacent to one side in the width direction of the fourth communication part, and the other second position is arranged adjacent to the other side in the width direction of the fourth communication part; the projection of the first position on the fourth communication part is arranged at intervals from the second position along the width direction of the fourth communication part.

[0017] In some embodiments, the second pipeline includes a plurality of third straight segments, a plurality of fourth straight segments, and a plurality of second vertical segments; one end of the second vertical segment is fixedly connected to the third straight segment, and the other end is fixedly connected to the fourth straight segment; the included angle between the third straight segment and the second vertical segment is within the first set included angle range; the included angle between the fourth straight segment and the second vertical segment is within the second set included angle range.

[0018] In some embodiments, partial side walls of the first flow channel are in contact with partial side walls of the second flow channel.

[0019] In some embodiments, one side of the first communication part is in contact with one side of the second pipeline; one side of the second communication part is in contact with one side of the second pipeline; one side of the third communication part is in contact with one side of the first pipeline; one side of the fourth communication part is in contact with one side of the first pipeline;

[0020] Two adjacent first straight segments along the length direction of the first pipeline are respectively in contact with both sides of the second pipeline; the first straight segment and the second straight segment along the width direction of the first pipeline are respectively in contact with partial side walls of the second pipeline.

[0021] In some embodiments, the cold plate assembly further includes a support unit; the support unit is arranged between the first flow channel and the second flow channel; the support unit is respectively in contact with the side walls of the first flow channel and the second flow channel.

[0022] In a second aspect, the present invention discloses a heat dissipation system, the heat dissipation system includes a cold plate assembly according to any one of the above embodiments, and the heat dissipation system further includes:

[0023] A heat dissipation component, the heat dissipation component includes a cooling unit, a pressurizing unit, a storage unit, a pressure reducing unit, a filling unit, and a discharging unit; an outlet end of the heat exchange unit, the filling unit, the pressurizing unit, the discharging unit, the cooling unit, the pressure reducing unit, and an inlet end of the heat exchange unit are sequentially communicated;

[0024] A cooling medium, at least part of the cooling medium is converted from a liquid state to a gaseous state when flowing through the heat dissipation component and the cold plate component;

[0025] A heat generating component, the heat generating component transfers heat to the heat exchange unit.

[0026] To solve the problem of how the cold plate improves the heat exchange effect on the electronic device, the present invention has the following advantages:

[0027] The cooling medium in a gas-liquid two-phase saturated state is used for heat exchange through the first flow channel and the second flow channel, so as to take away the heat of the heat generating component (i.e., the electronic device). Heat can be transferred between the first flow channel and the second flow channel to ensure the uniformity of the heat absorption amount on the surface of the cold plate component. At the same time, it is set that the sum of the cross-sectional areas of all the first flow channels is smaller than the sum of the cross-sectional areas of all the second flow channels, so that the cooling medium in the first flow channel can be depressurized and vaporized when flowing into the second flow channel after heat exchange phase change to reduce the flow resistance and improve the phase change effect, thereby improving the heat exchange effect of the cold plate component. Brief Description of the Drawings

[0028] Figure 1 A schematic diagram of a cold plate component showing an embodiment;

[0029] Figure 2 Shows Figure 1 A plan view of the cold plate component in the embodiment;

[0030] Figure 3 A schematic diagram of a first flow channel showing an embodiment;

[0031] Figure 4 Shows Figure 3 A plan view of the first flow channel in the embodiment;

[0032] Figure 5 A schematic diagram of a first pipeline showing an embodiment;

[0033] Figure 6 A schematic diagram of a second flow channel showing an embodiment;

[0034] Figure 7 Shows Figure 6 A plan view of the second flow channel in the embodiment;

[0035] Figure 8 A schematic diagram of a third communication part showing an embodiment;

[0036] Figure 9 Schematic diagram of the fourth communication part of an embodiment is shown;

[0037] Figure 10 Schematic diagram of the second pipeline of an embodiment is shown;

[0038] Figure 11 Schematic diagram of the second flow channel of another embodiment is shown;

[0039] Figure 12 Schematic diagram of the heat dissipation system of the first embodiment is shown;

[0040] Figure 13 Schematic diagram of the heat dissipation system of the second embodiment is shown;

[0041] Figure 14 Schematic diagram of the heat dissipation system of the third embodiment is shown.

[0042] Reference numerals: 01 cold plate assembly; 11 first assembly unit; 12 second assembly unit; 13 heat exchange unit; 131 first flow channel; 1311 first pipeline; 13111 first straight section; 13112 second straight section; 13113 first vertical section; 1312 first communication part; 132 second flow channel; 1321 second pipeline; 13211 third straight section; 13212 fourth straight section; 13213 second vertical section; 1322 second communication part; 1323 third communication part; 1324 fourth communication part; 15 support unit; 02 heat dissipation assembly; 21 cooling unit; 211 condenser; 212 pressure relief valve; 22 boosting unit; 221 compressor; 222 regenerator; 223 separator; 224 two-phase pump; 225 check valve; 23 storage unit; 24 pressure reducing unit; 241 filter; 242 expansion valve; 243 three-way valve; 25 filling unit; 26 discharge unit; 03 heating component. Detailed implementation manners

[0043] Now, the present disclosure will be described with reference to several exemplary embodiments. It should be understood that these embodiments are described only to enable those of ordinary skill in the art to better understand and thus implement the present disclosure, rather than implying any limitation on the scope of the present disclosure.

[0044] As used herein, the term "comprising" and its variants are to be construed as open-ended terms meaning "including but not limited to". The term "based on" is to be construed as "at least partially based on". The terms "one embodiment" and "an embodiment" are to be construed as "at least one embodiment". The term "another embodiment" is to be construed as "at least one other embodiment". The orientation or positional relationships indicated by the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "vertical", "horizontal", "lateral", "longitudinal", etc. are based on the orientation or positional relationships shown in the drawings. These terms are mainly used to better describe the present application and its embodiments, and are not used to limit that the indicated devices, elements or components must have a specific orientation, or be constructed and operated in a specific orientation. Also, in addition to being able to represent orientation or positional relationships, some of the above terms may also be used to represent other meanings. For example, the term "upper" may also be used to represent a certain attachment relationship or connection relationship in some cases. For those of ordinary skill in the art, the specific meanings of these terms in the present application can be understood according to specific circumstances. In addition, the terms "mounted", "arranged", "provided with", "connected", "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral structure; it may be a mechanical connection or an electrical connection; it may be directly connected, or indirectly connected through an intermediate medium, or there may be internal communication between two devices, elements or components. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific circumstances. In addition, the terms "first", "second", etc. are mainly used to distinguish different devices, elements or components (the specific types and structures may be the same or different), and are not used to indicate or imply the relative importance and quantity of the indicated devices, elements or components. Unless otherwise specified, the meaning of "a plurality of" is two or more.

[0045] In this embodiment, as the power of the electronic device increases, the traditional air-cooling and liquid-cooling heat dissipation systems cannot meet the thermal management requirements of high heat flux density cooling, high-power heat dissipation, and high-uniformity temperature control of the electronic device. The liquid-cooling heat dissipation system relies on a liquid-cooling plate to absorb the heat on the surface of the electronic device. Since the heat exchange process of the liquid coolant in the cooling plate is generally a single-phase heat exchange process, that is, the absorbed heat is only converted into the sensible heat of the liquid itself, and the pipe path of the coolant flowing in the cooling plate is relatively short. If a large amount of heat is absorbed in a short time, it will cause a large temperature difference between the inlet and outlet of the cooling plate, and uneven heat exchange with each area on the surface of the electronic device, affecting the cooling effect and service life of the electronic device. For this reason, this embodiment discloses a cold plate assembly 01. As Figure 1As shown in the figure, the cold plate assembly 01 may include a first assembly unit 11, a second assembly unit 12, and a heat exchange unit 13. The two sides of the heat exchange unit 13 are detachably connected to the first assembly unit 11 and the second assembly unit 12 respectively, so that the cold plate assembly 01 can be installed on an external component through the first assembly unit 11 and the second assembly unit 12, enabling the heat exchange unit 13 to exchange heat with a component (i.e., an electronic device) with heat dissipation requirements. The heat exchange unit 13 is provided with an inlet end and an outlet end. Among them, the cooling medium can flow in from the inlet end and flow out from the outlet end. As Figure 2 shown, the heat exchange unit 13 includes at least one first flow channel 131 and at least one second flow channel 132. The inlet end, the first flow channel 131, the second flow channel 132, and the outlet end are connected in sequence. The spacing distance between the first flow channel 131 and the second flow channel 132 is within a set range, enabling heat transfer between the first flow channel 131 and the second flow channel 132. The sum of the cross-sectional areas of all the first flow channels 131 is smaller than the sum of the cross-sectional areas of all the second flow channels 132. When the cooling medium is a fluid in a gas-liquid two-phase saturated state, the principle that the saturation temperature of the cooling medium remains basically unchanged during heat exchange phase change can be utilized to make the absolute value of the temperature difference between the inlet end and the outlet end less than a set threshold. At the same time, after the cooling medium undergoes a phase change during heat exchange in the first flow channel 131, the flow resistance increases. By setting the second flow channel 132 to have a larger cross-sectional area, the flow resistance of the cooling medium can be reduced. Entering from a small space into a large space can achieve the effect of pressure relief and vaporization, and it is convenient for the cooling medium to increase the phase change rate during heat exchange in the second flow channel 132.

[0046] In this embodiment, as Figure 3 , Figure 4 shown, the first flow channel 131 includes a plurality of first pipelines 1311 and a plurality of first connecting parts 1312. The plurality of first pipelines 1311 and the plurality of first connecting parts 1312 are fixedly connected at intervals in sequence. Adjacent two first pipelines 1311 are connected through the first connecting part 1312. The first pipeline 1311 at one end of the first flow channel 131 is connected to the inlet end, and the first pipeline 1311 at the other end is connected to the second flow channel 132. Through the above settings, the plurality of first pipelines 1311 are connected in series, facilitating the extension of the flow path of the cooling medium in the first flow channel 131, and the first flow channel 131 can be distributed in a snake shape as a whole in the horizontal direction, enabling the cooling medium to flow back and forth left and right in the first flow channel 131, facilitating uniform heat exchange and phase change to improve the heat exchange effect.

[0047] In this embodiment, as Figure 3 , Figure 5As shown, the first pipeline 1311 includes a plurality of first straight sections 13111, a plurality of second straight sections 13112, and a plurality of first vertical sections 13113. One end of the first vertical section 13113 is fixedly connected to the first straight section 13111, and the other end is fixedly connected to the second straight section 13112. The included angle between the first straight section 13111 and the first vertical section 13113 is within a first set included angle range. The included angle between the second straight section 13112 and the first vertical section 13113 is within a second set included angle range. One end of a first communication part 1312 is communicated with any one of the first straight section 13111, the second straight section 13112, and the first vertical section 13113. Since there is a temperature difference between one side of the first pipeline 1311 close to the heat - generating surface of the electronic device and the other side after the cooling medium exchanges heat and undergoes a phase change in the first pipeline 1311, and the gaseous cooling medium is mainly concentrated on the side of the first pipeline 1311 close to the heat - generating surface of the electronic device, through the above - mentioned setting, the first pipeline 1311 is serpentinely distributed in the vertical direction, so that the cooling medium flowing through the first pipeline 1311 can flow up and down in the vertical direction, disturbing the flow paths of the gaseous and liquid - phase cooling media, avoiding the gaseous cooling medium concentrating on one side of the first pipeline 1311 and affecting the heat - exchange phase change of the liquid - phase cooling medium, thereby reducing the temperature difference in the vertical direction, facilitating the phase change of the cooling medium, and improving the heat - exchange effect.

[0048] In this embodiment, as Figure 3 shown, the included angle between the first communication part 1312 and the first pipeline 1311 is within a third set included angle range. Thereby, the heights of two adjacent first communication parts 1312 in the vertical direction can be made inconsistent, further disturbing the flow path of the cooling medium and improving the heat - exchange effect.

[0049] In this embodiment, as Figure 6 、 Figure 7As shown in the figure, the second flow channel 132 includes a plurality of second pipelines 1321, a second communication part 1322, a third communication part 1323, and a fourth communication part 1324. The third communication part 1323 is communicated with one end of the first flow channel 131 far from the outlet end through the second communication part 1322. The third communication part 1323 and the fourth communication part 1324 are arranged at intervals. The second pipelines 1321 are respectively communicated with the third communication part 1323 and the fourth communication part 1324. The plurality of second pipelines 1321 are arranged at intervals. The second pipeline 1321 at one end of the second flow channel 132 far from the second communication part 1322 is communicated with the outlet end. Through the above settings, the plurality of second pipelines 1321 are in parallel. The flow resistance of the cooling medium flowing through the first flow channel 131 is relatively large. When the cooling medium flows into the third communication part 1323 of the second flow channel 132, it can relieve pressure in the third communication part 1323 and be divided into multiple second pipelines 1321, and finally converge at the fourth communication part 1324, so that the flow resistance of the cooling medium can be effectively reduced, and the accumulation of the cooling medium caused by too large flow resistance of the cooling medium in the first flow channel 131 can be avoided.

[0050] In this embodiment, as Figure 8 shown, the cross-sectional area of the second communication part 1322 is smaller than the cross-sectional area of the third communication part 1323. Thus, the cooling medium when flowing through the second communication part 1322 from the first flow channel 131 into the third communication part 1323 can relieve pressure and vaporize, which is convenient for phase change and improves the heat exchange effect.

[0051] In this embodiment, as Figure 11 shown, the cross-sectional areas of the plurality of second pipelines 1321 increase in sequence along the flow direction of the cooling medium in the third communication part 1323. Thus, the flow rate of the cooling medium shunted from the third communication part 1323 into the plurality of second pipelines 1321 is uniform, ensuring that the heat exchange effects among the plurality of second pipelines 1321 tend to be balanced and avoiding low local heat flux density on the surface of the electronic device.

[0052] In this embodiment, as Figure 8 、 Figure 9 shown, the connection position of the second pipeline 1321 and the third communication part 1323 is the first position. The connection position of the second pipeline 1321 and the fourth communication part 1324 is the second position.

[0053] The first positions are arranged at intervals along the length direction of the third communication part 1323. Among two adjacent first positions, one first position is arranged adjacent to one side in the width direction of the third communication part 1323, and the other first position is arranged adjacent to the other side in the width direction of the third communication part 1323. The second positions are arranged at intervals along the length direction of the fourth communication part 1324. Among two adjacent second positions, one second position is arranged adjacent to one side in the width direction of the fourth communication part 1324, and the other second position is arranged adjacent to the other side in the width direction of the fourth communication part 1324. The projections of the first positions on the fourth communication part 1324 are arranged at intervals along the width direction of the fourth communication part 1324. Through the above arrangements, the inlet and outlet of the second pipeline 1321 are at different positions in the height direction, causing the flow of the cooling medium in the third communication part 1323 and the fourth communication part 1324 to be disordered during diversion and collection, and avoiding the concentration of the gaseous cooling medium on one side, which affects the phase change heat transfer effect.

[0054] In this embodiment, as Figure 10 shown, the second pipeline 1321 includes a plurality of third straight sections 13211, a plurality of fourth straight sections 13212, and a plurality of second vertical sections 13213. One end of the second vertical section 13213 is fixedly connected to the third straight section 13211, and the other end is fixedly connected to the fourth straight section 13212. The included angle between the third straight section 13211 and the second vertical section 13213 is within the first set included angle range. The included angle between the fourth straight section 13212 and the second vertical section 13213 is within the second set included angle range. Through the above arrangements, the second pipeline 1321 is distributed in a serpentine shape in the vertical direction, causing the cooling medium in the second pipeline 1321 to flow up and down in the vertical direction, avoiding the concentration of the gaseous cooling medium on the side of the second pipeline 1321 close to the electronic device, and improving the heat transfer and phase change effect of the cooling medium.

[0055] In this embodiment, as Figure 1 shown, part of the side wall of the first flow channel 131 abuts against part of the side wall of the second flow channel 132. Thus, the first flow channel 131 and the second flow channel 132 can be mutually fitted, and heat can be better transferred between the first flow channel 131 and the second flow channel 132, balancing the heat absorption of the first flow channel 131 and the second flow channel 132, avoiding local overheating of the electronic device, and ensuring heat transfer uniformity.

[0056] In this embodiment, as Figure 1 、 Figure 2 shown, one side of the first communication part 1312 abuts against one side of the second pipeline 1321. One side of the second communication part 1322 abuts against one side of the second pipeline 1321. One side of the third communication part 1323 abuts against one side of the first pipeline 1311. One side of the fourth communication part 1324 abuts against one side of the first pipeline 1311. As Figure 3And Figure 6 As shown, two adjacent first straight sections 13111 along the length direction of the first pipeline 1311 are respectively abutted against both sides of the second pipeline 1321. The first straight section 13111 and the second straight section 13112 along the width direction of the first pipeline 1311 are respectively abutted against partial side walls of the second pipeline 1321.

[0057] Through the above settings, the first flow channel 131 and the second flow channel 132 are presented in a reticular staggered distribution, forming a spatial structure like a "Chinese knot", enabling heat transfer between the first flow channel 131 and the second flow channel 132. At the same time, the flow path of the cooling medium reciprocates horizontally left and right, front and back, and vertically up and down in space, realizing uniform heat exchange at each point in the contact area between the cold plate assembly 01 and the heat - generating surface of the electronic device, and avoiding local over - temperature of the electronic device.

[0058] In this embodiment, as Figure 1 、 Figure 2 shown, the cold plate assembly 01 further includes a support unit 15. The support unit 15 is arranged between the first flow channel 131 and the second flow channel 132. The support unit 15 is respectively abutted against the side walls of the first flow channel 131 and the side walls of the second flow channel 132. The support unit 15 can offset stress when the cold plate assembly 01 is fastened, making one side of the heat - exchange unit 13 fit more closely to the heat source. Moreover, the support unit 15 can transfer heat to the heat - exchange unit 13, increasing the heat - exchange area between the cold plate assembly 01 and the heat source and improving the heat - exchange effect. At the same time, it can bear the metal deformation caused by the thermal stress generated during the heat exchange of the heat - exchange unit 13. In addition, it can cooperate with the positioning pin inserted from one side of the cold plate assembly 01 for positioning and reinforcement.

[0059] In this embodiment, this embodiment discloses a heat - dissipation system. The heat - dissipation system includes a cold plate assembly 01 according to any one of the above - mentioned embodiments. As Figure 12 shown, the heat - dissipation system may further include a heat - dissipation component 02, a heat - generating component 03, and a cooling medium. The heat - dissipation component 02 includes a cooling unit 21, a pressurizing unit 22, a storage unit 23, a pressure - reducing unit 24, a filling unit 25, and a discharging unit 26. The outlet end of the heat - exchange unit 13 of the cold plate assembly 01, the filling unit 25, the pressurizing unit 22, the discharging unit 26, the cooling unit 21, the pressure - reducing unit 24, and the inlet end of the heat - exchange unit 13 of the cold plate assembly 01 are connected in sequence. When the cooling medium flows through the heat - dissipation component 02 and the cold plate assembly 01, at least part of it is converted from liquid to gas. The heat - generating component 03 transfers heat to the heat - exchange unit 13. Thus, the heat - exchange unit 13 absorbs heat through the cooling medium and undergoes a phase change, quickly taking away the heat of the heat - generating component 03. The cooling medium can be selected from two - phase fluids such as aviation fuel, aviation antifreeze, air, deionized water, liquid nitrogen, liquid hydrogen, etc.

[0060] In some other embodiments, as Figure 12As shown, the cooling unit 21 may include a condenser 211 and a pressure relief valve 212. The pressure reducing unit 24 may include a filter 241 and an expansion valve 242. The cold plate assembly 01, the filling unit 25, the pressurizing unit 22, the discharging unit 26, the condenser 211, the storage unit 23, the filter 241, and the expansion valve 242 are sequentially connected through pipelines to form a closed loop. Both the filling unit 25 and the discharging unit 26 may be of a direct-through structure and are equipped with plug caps for filling or discharging the cooling medium inside the heat dissipation system. One end of the pressure relief valve 212 is connected to the condenser 211. When the pressure of the cooling medium in the condenser 211 (the highest point of the internal pressure of the system) is higher than the set pressure threshold, the pressure relief valve 212 opens to relieve the pressure of the heat dissipation system to reduce the internal pressure of the heat dissipation system. The storage unit 23 can be used to store part of the cooling medium. The filter 241 is used to filter impurities and dry the cooling medium.

[0061] For example, when the heat generating component 03 is working, the low-quality cooling medium (quality lower than 0.3) at the inlet end of the heat exchange unit 13 of the cold plate assembly 01 absorbs the heat generated by the operation of the heat generating component 03 in the heat exchange unit 13 and turns into superheated gas (superheat degree is 3°C to 5°C) and then leaves the cold plate assembly 01. The gaseous cooling medium flowing out of the cold plate assembly 01 is heated and pressurized by the pressurizing unit 22, and the superheat degree is further increased to more than 15°C. Subsequently, it flows into the hot fluid channel of the condenser 211 and exchanges heat with the cold fluid in the cold fluid channel of the condenser 211. The cold and hot fluid channels inside the condenser 211 are of cross-flow distribution. The high-pressure superheated gaseous cooling medium is cooled into high-pressure subcooled liquid (subcooling degree is 5°C to 10°C) inside the condenser 211, and then is enriched and stabilized by the storage unit 23, dried and filtered of impurities by the filter 241 respectively. Finally, through the throttling of the expansion valve 242, it is cooled, depressurized into a low-pressure, low-temperature, low-quality gas-liquid two-phase cooling medium, and re-enters the cold plate assembly 01 to absorb heat.

[0062] In some other embodiments, such as Figure 13As shown, the boosting unit 22 may include a compressor 221 and a recuperator 222. The recuperator 222 may include a hot fluid channel and a cold fluid channel. The cooling medium discharged from the cold plate assembly 01 first flows into the cold fluid channel of the recuperator 222. After absorbing the heat transferred by the hot fluid channel of the recuperator 222, it enters the compressor 221 in a superheated gas state. After being compressed by the compressor 221, its temperature and pressure increase, and the degree of superheat is further increased to more than 15°C. The high-temperature and high-pressure gaseous cooling medium at the outlet of the compressor 221 then enters the hot fluid channel of the recuperator 222. After being cooled by the cooling medium in the cold fluid channel, its degree of superheat decreases, and it enters the condenser 211 for further cooling. Thus, it is possible to avoid the "liquid hammer" phenomenon on the internal mechanism of the compressor 221 caused by the high-speed suction of the cooling medium in the gas-liquid two-phase state, and avoid damage to the internal structure of the compressor 221 caused by the impact force of the cooling medium.

[0063] In some other embodiments, as Figure 14 shown, the boosting unit 22 may include a compressor 221, a separator 223, a two-phase pump 224, and a check valve 225. The pressure-reducing unit 24 further includes a three-way valve 243. The separator 223, the two-phase pump 224, and the check valve 225 are connected in sequence to form a first branch. One end of the check valve 225 away from the two-phase pump 224 is connected to the pipeline between the cold plate assembly 01 and the expansion valve 242 through the three-way valve 243. The check valve 225 can be a one-way valve to prevent the cooling medium from flowing from the pipeline between the cold plate assembly 01 and the expansion valve 242 to the two-phase pump 224. The outlet of the separator 223 is respectively connected to the compressor 221 and the two-phase pump 224. The inlet of the separator 223 is connected to the cold plate assembly 01. The separator 223 can separate the gas and liquid of the cooling medium discharged from the cold plate assembly 01, so that the gaseous cooling medium flows into the compressor 221 to avoid damage to the compressor 221 caused by the "liquid hammer" phenomenon. At the same time, the liquid cooling medium is stored. When the rotational speed of the compressor 221 has not increased to the rated operating speed or the amount of the cooling medium flowing into the cold plate assembly 01 is insufficient, the liquid cooling medium can be supplemented into the cold plate assembly 01 through the first branch to ensure the heat exchange effect of the cold plate assembly 01 on the heat-generating component 03.

[0064] Those of ordinary skill in the art can understand that the above embodiments are specific cases for implementing the present disclosure. In actual applications, various changes can be made in form and details without departing from the scope of the present disclosure.

Claims

1. A cold plate assembly, characterized in that, The cold plate assembly includes: A first assembly unit; A second assembly unit; A heat exchange unit, both sides of the heat exchange unit are detachably connected to the first assembly unit and the second assembly unit respectively; the heat exchange unit is provided with an inlet end and an outlet end; the heat exchange unit includes at least one first flow channel and at least one second flow channel; the inlet end, the first flow channel, the second flow channel, and the outlet end are connected in sequence; the distance between the first flow channel and the second flow channel is within a set range; the sum of the cross-sectional areas of all the first flow channels is smaller than the sum of the cross-sectional areas of all the second flow channels; The first flow channel includes a plurality of first pipelines and a plurality of first connecting parts; the plurality of first pipelines and the plurality of first connecting parts are fixedly connected at intervals in sequence; adjacent two of the first pipelines are connected through the first connecting parts; the first pipeline at one end of the first flow channel is connected to the inlet end, and the first pipeline at the other end is connected to the second flow channel; The first pipeline includes a plurality of first straight sections, a plurality of second straight sections, and a plurality of first vertical sections; one end of the first vertical section is fixedly connected to the first straight section, and the other end is fixedly connected to the second straight section; the included angle between the first straight section and the first vertical section is within a first set included angle range; the included angle between the second straight section and the first vertical section is within a second set included angle range; one end of a first connecting part is connected to any one of the first straight section, the second straight section, and the first vertical section.

2. The cold plate assembly according to claim 1, wherein The included angle between the first connecting part and the first pipeline is within a third set included angle range.

3. The cold plate assembly according to claim 2, wherein The second flow channel includes a plurality of second pipelines, a second connecting part, a third connecting part, and a fourth connecting part; the third connecting part is connected to one end of the first flow channel far from the outlet end through the second connecting part; the third connecting part and the fourth connecting part are arranged at intervals; the second pipelines are respectively connected to the third connecting part and the fourth connecting part; the plurality of second pipelines are arranged at intervals; the second pipeline at one end of the second flow channel far from the second connecting part is connected to the outlet end.

4. The cold plate assembly according to claim 3, wherein The cross-sectional area of the second connecting part is smaller than the cross-sectional area of the third connecting part.

5. The cold plate assembly according to claim 3, wherein The cross-sectional areas of the plurality of second pipelines increase in sequence along the flow direction of the cooling medium in the third connecting part.

6. The cold plate assembly according to claim 3, wherein The connection position of the second pipeline and the third connecting part is the first position; the connection position of the second pipeline and the fourth connecting part is the second position; The first positions are arranged at intervals along the length direction of the third communication part; among two adjacent first positions, one of the first positions is arranged adjacent to one side in the width direction of the third communication part, and the other first position is arranged adjacent to the other side in the width direction of the third communication part; the second positions are arranged at intervals along the length direction of the fourth communication part; among two adjacent second positions, one of the second positions is arranged adjacent to one side in the width direction of the fourth communication part, and the other second position is arranged adjacent to the other side in the width direction of the fourth communication part; the projection of the first position on the fourth communication part is arranged at intervals with the second position along the width direction of the fourth communication part.

7. A cold plate assembly according to claim 3, wherein The second pipeline includes a plurality of third straight sections, a plurality of fourth straight sections, and a plurality of second vertical sections; one end of the second vertical section is fixedly connected to the third straight section, and the other end is fixedly connected to the fourth straight section; the included angle between the third straight section and the second vertical section is within the first set included angle range; the included angle between the fourth straight section and the second vertical section is within the second set included angle range.

8. A cold plate assembly according to claim 7, wherein Partial side walls of the first flow channel are in contact with partial side walls of the second flow channel.

9. A cold plate assembly according to claim 8, wherein One side of the first communication part is in contact with one side of the second pipeline; one side of the second communication part is in contact with one side of the second pipeline; one side of the third communication part is in contact with one side of the first pipeline; one side of the fourth communication part is in contact with one side of the first pipeline; Two adjacent first straight sections along the length direction of the first pipeline are respectively in contact with two sides of the second pipeline; The first straight section and the second straight section along the width direction of the first pipeline are respectively in contact with partial side walls of the second pipeline.

10. A cold plate assembly according to claim 1, wherein The cold plate assembly further includes a support unit; the support unit is arranged between the first flow channel and the second flow channel; the support unit is respectively in contact with the side walls of the first flow channel and the second flow channel.

11. A heat dissipation system, characterized in that, The heat dissipation system includes a cold plate assembly according to any one of claims 1-10, and the heat dissipation system further includes: A heat dissipation assembly, the heat dissipation assembly includes a cooling unit, a pressurizing unit, a storage unit, a pressure reducing unit, a filling unit, and a discharging unit; the outlet end of the heat exchange unit, the filling unit, the pressurizing unit, the discharging unit, the cooling unit, the pressure reducing unit, and the inlet end of the heat exchange unit are sequentially communicated; A cooling medium, at least part of the cooling medium is converted from a liquid state to a gaseous state when flowing through the heat dissipation assembly and the cold plate assembly; A heat generating assembly, the heat generating assembly transfers heat to the heat exchange unit.

Images