CD driver integrated packaging device, lamp panel and display device

Abstract

The invention provides a CD-ROM integrated packaging device, a lamp panel and a display device.The packaging device comprises a packaging substrate, a light-emitting element and a driving element, the packaging substrate is provided with a first surface and a second surface which are opposite, and the light-emitting element is electrically connected with the packaging substrate; the driving element is electrically connected with the packaging substrate; wherein the light-emitting element and the driving element are arranged on the side, deviating from the first surface, of the second surface, the orthographic projection of the driving element on the second surface and the orthographic projection of the light-emitting element on the second surface are not overlapped, and the distance between the surface, deviating from the packaging substrate, of the light-emitting element and the first surface is smaller than the distance between the driving element and the first surface. According to the packaging substrate and the display device, under the condition that the production and manufacturing cost is considered, the yield can be improved, the influence of the driving element on side face light emitting of the light-emitting chip is reduced, the optical uniformity of the lamp panel is improved, and the display quality is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor technology, and in particular to an optical drive-integrated packaging device, a light board, and a display device. Background Art

[0002] Light Emitting Diode (LED) is an electroluminescent semiconductor light-emitting device. It has been widely used in lighting, display, medical treatment, optical communication and other fields because of its advantages of low energy consumption, small size, long life, good stability, fast response and stable luminous wavelength.

[0003] Taking the display field as an example, the current display industry is developing towards high resolution, ultra-thinness, high dynamic range imaging, high contrast and wide color gamut. The light board in the display device adopts smaller and more Mini LEDs and local dimming technology, which enables each partition in the light board, and even each light-emitting element in each partition, to achieve independent switching or brightness adjustment through driving elements, thereby making the light and dark levels of the display clearer and improving the user's visual experience. However, with the sharp increase in the number of light-emitting elements and the active site selection driving method used in combination, the demand for the number of driving elements in the light board has also increased simultaneously.

[0004] In this context, in order to reduce the production and manufacturing costs, a printed circuit board with fewer circuit layers is usually used, that is, a single-sided mounting method is used to mount the light-emitting element and the driving element on the same side of the printed circuit board. First, since the light-emitting element and the driving element are both independently packaged, the independently packaged light-emitting element and the driving element need to be mounted on the printed circuit board separately during mounting, and there are differences in the mounting equipment and processes adapted to the light-emitting element and the driving element, which will cause the problem of reduced mounting yield, especially when the number of light-emitting elements and driving elements increases sharply; secondly, since the light board is a surface light source, the light-emitting element needs to emit light from the side to meet the large-angle light emission requirements, and the driving element will block the side light emission of the light-emitting element, thereby causing a dark area on the light board and reducing the optical uniformity, especially when the number of light-emitting elements and driving elements increases sharply.

[0005] Therefore, how to improve the yield, reduce the impact of the driving components on the side light emission of the light-emitting chip, and improve the optical uniformity of the light board while taking into account the production and manufacturing costs is a technical problem that technical personnel in this field urgently need to solve. Summary of the invention

[0006] The present application provides an optical drive integrated packaging device, a light board, and a display device, which can effectively solve the problems existing in the related art, that is, it is difficult to improve the yield while taking into account the production and manufacturing costs, reduce the impact of the driving elements on the side light emission of the light-emitting chip, and improve the optical uniformity of the light board.

[0007] In a first aspect, the present application provides a package device integrated with an optical drive, the package device comprising: A packaging substrate having a first surface and a second surface opposite to each other; A light emitting element electrically connected to the packaging substrate; A driving element, electrically connected to the packaging substrate; The light-emitting element and the driving element are both arranged on the side of the second surface away from the first surface, the orthographic projection of the driving element on the second surface and the orthographic projection of the light-emitting element on the second surface do not overlap, and the distance between the surface of the light-emitting element away from the packaging substrate and the first surface is greater than the distance between the surface of the driving element away from the packaging substrate and the first surface.

[0008] Optionally, the light emitting element includes an LED chip, and in a direction parallel to the first surface, the LED chip does not overlap with the driving element.

[0009] Optionally, the packaging device further includes a pad layer, and the LED chip is electrically connected to the packaging substrate via the pad layer, wherein the pad layer is disposed between the LED chip and the packaging substrate.

[0010] Optionally, the thickness of the packaging substrate is greater than the thickness of the driving element, and a groove is provided on a side of the second surface of the packaging substrate facing away from the first surface, and the driving element is accommodated in the groove.

[0011] Optionally, the light-emitting element includes a carrier board, an LED chip and a packaging adhesive, the carrier board is fixed to the packaging substrate by welding, the LED chip is arranged on a side of the carrier board away from the packaging substrate, and the packaging adhesive covers the LED chip.

[0012] Optionally, the light-emitting element includes an LED chip, and in a direction parallel to the first surface, the LED chip at least partially overlaps with the driving element, wherein the driving element includes a driving chip and reflective glue, the reflective glue covers the driving chip, and the reflective glue includes at least one inclined side wall, and in the direction in which the second surface departs from the first surface, the distance between the inclined side wall and the adjacent light-emitting element gradually increases.

[0013] Optionally, the packaging device further includes transparent glue, and the transparent glue covers the light emitting element and the driving element.

[0014] Optionally, the packaging device further comprises transparent glue, the transparent glue covers the light emitting element, the orthographic projection of the transparent glue on the packaging substrate does not overlap with the orthographic projection of the driving element on the packaging substrate, wherein the light emitting surface of the transparent glue is a curved surface.

[0015] In a second aspect, the present application provides a light board, comprising a substrate, a plurality of packaging structures, and a plurality of packaging devices described above, wherein the plurality of packaging structures and the plurality of packaging devices are arranged on the same side of the substrate; wherein the packaging structure comprises a light-emitting element, the light-emitting element in the packaging structure and the light-emitting element in the packaging device have the same light-emitting color, and the light-emitting element in the packaging structure is electrically connected to a driving element in the packaging device.

[0016] In a third aspect, the present application provides a display device, comprising the light board described above.

[0017] The present application provides a packaged device, a light board, and a display device integrated with an optical drive, wherein the packaged device includes a package substrate, a light-emitting element, and a driving element, wherein the package substrate has a first surface and a second surface opposite to each other, the light-emitting element is electrically connected to the package substrate; the driving element is electrically connected to the package substrate; wherein the light-emitting element and the driving element are both arranged on the side of the second surface away from the first surface, the orthographic projection of the driving element on the second surface and the orthographic projection of the light-emitting element on the second surface do not overlap, and the distance between the surface of the light-emitting element away from the package substrate and the first surface is greater than the distance between the surface of the driving element away from the package substrate and the first surface. The present application can improve the yield while taking into account the production and manufacturing costs, reduce the influence of the driving element on the side light emission of the light-emitting chip, improve the optical uniformity of the light board, and improve the display quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The technical solution and other beneficial effects of the present application will be made apparent by describing in detail the specific implementation methods of the present application in conjunction with the accompanying drawings.

[0019] Figure 1 A schematic diagram of the film layer structure of a packaging device provided in the first embodiment of the present application.

[0020] Figure 2 A schematic diagram of the film layer structure of a packaging device provided in the second embodiment of the present application.

[0021] Figure 3A schematic diagram of the film layer structure of a packaging device provided in the third embodiment of the present application.

[0022] Figure 4 A schematic diagram of the film layer structure of a packaging device provided in the fourth embodiment of the present application.

[0023] Figure 5 A schematic diagram of the film layer structure of a packaging device provided in the fifth embodiment of the present application.

[0024] Figure 6 A schematic diagram of the film layer structure of a packaging device provided in the sixth embodiment of the present application.

[0025] Figure 7 A schematic diagram of the film layer structure of a packaging device provided in the seventh embodiment of the present application.

[0026] Figure 8 A schematic diagram of the film layer structure of a packaging device provided in the eighth embodiment of the present application.

[0027] Fig. 9 A schematic diagram of the film layer structure of a packaging device provided in the ninth embodiment of the present application.

[0028] Fig.10 A schematic diagram of the film layer structure of a packaging device provided in the tenth embodiment of the present application.

[0029] Fig.11 A schematic diagram of the film layer structure of a packaging device provided in the eleventh embodiment of the present application.

[0030] Fig.12 A schematic diagram of the film layer structure of a packaging device provided in the twelfth embodiment of the present application.

[0031] Fig.13 A schematic diagram of the film layer structure of a packaging device provided in the thirteenth embodiment of the present application.

[0032] Fig.14 A schematic top view of a first light panel provided for some embodiments of the present application.

[0033] Fig.15 A schematic top view of a second light panel provided in some embodiments of the present application.

[0034] Fig.16 A schematic top view of a third type of light panel provided for some embodiments of the present application.

[0035] Fig.17 A schematic top view of a fourth type of light panel provided for some embodiments of the present application.

[0036] Fig.18A schematic top view of a fifth light panel provided for some embodiments of the present application.

[0037] Fig.19 A schematic top view of a sixth type of light panel provided for some embodiments of the present application.

[0038] Fig. 20 For along Fig.15 The schematic diagram of the film structure of the lamp panel cut along line AB is shown.

[0039] Fig.21 For along Fig.16 The schematic diagram of the film structure of the lamp panel cut along the CD line is shown.

[0040] Fig. 22 For along Fig.17 Schematic diagram of the film structure of the lamp panel cut along line EF shown.

[0041] Description of reference numerals: Package device 01; package substrate 10; first surface 101; second surface 102; groove 103; first protrusion 11; light-emitting element 20; LED chip 21; packaging glue 22; second protrusion 23; carrier 24; driving element 30; driving chip 31; reflective glue 32; inclined side wall 321; transparent glue 40; cushion layer 50; package structure 02; package substrate 10`; light-emitting element 20`; LED chip 21`; packaging glue 22`; carrier 24`; transparent glue 40`; substrate 03; lamp board 100; lamp group 101. DETAILED DESCRIPTION

[0042] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0043] The terms "first" and "second" in this document are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0044] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0045] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0046] In a first aspect, the present application embodiment provides a packaging device 01. Figures 1 to 13 As shown, multiple embodiments of the present application respectively show multiple packaging devices 01 with different structures, and the packaging device 01 includes a packaging substrate 10, a light-emitting element 20 and a driving element 30, the packaging substrate 10 has a first surface 101 and a second surface 102 relative to each other, the light-emitting element 20 is electrically connected to the packaging substrate 10; the driving element 30 is electrically connected to the packaging substrate 10; wherein the light-emitting element 20 and the driving element 30 are both arranged on the side of the second surface 102 away from the first surface 101, the orthographic projection of the driving element 30 on the second surface 102 and the orthographic projection of the light-emitting element 20 on the second surface 102 do not overlap, and the distance between the surface of the light-emitting element 20 on the side away from the packaging substrate 10 and the first surface 101 is greater than the distance between the surface of the driving element 30 on the side away from the packaging substrate 10 and the first surface 101.

[0047] In the package device 01 provided in the embodiment of the present application, since the light-emitting element 20 and the driving element 30 are both arranged on the second surface 102 and are both electrically connected to the package substrate 10, the package substrate 10 can be used as an adapter board to uniformly transfer the electrical signal transfer ports of the light-emitting element 20 and the driving element 30 to a single circuit layer of the package substrate 10 and expose them through the first surface 101. Furthermore, the first surface 101 of the package substrate 10 can be welded and fixed to the printed circuit board in the lamp board by single-sided mounting, so as to realize the electrical connection between the light-emitting element 20, the driving element 30 and the printed circuit board without increasing the film layer structure of the printed circuit board, thereby effectively reducing the production cost.

[0048] Secondly, since the light-emitting element 20 and the driving element 30 are uniformly arranged on the packaging substrate 10, the light-emitting element 20 and the driving element 30 can be integrally mounted on the printed circuit board in the lamp board using the packaging substrate 10 in the subsequent mounting process, thereby improving the problem of low yield caused by independent mounting of the light-emitting element 20 and the driving element 30.

[0049] More importantly, since the distance between the surface of the light-emitting element 20 on the side away from the packaging substrate 10 and the first surface 101 is greater than the distance between the surface of the driving element 30 on the side away from the packaging substrate 10 and the first surface 101, the light emitted from the part of the light-emitting element 20 that is higher than the driving element 30 will not be affected by the driving element 30, which is beneficial to meet the light board's demand for large-angle light emission from the light-emitting element 20, reduce the problem of dark areas on the light board, and help improve optical uniformity.

[0050] At the same time, secondly, since the light-emitting element 20 and the driving element 30 are both arranged on the second surface 102, that is, the first surface 101 of the packaging substrate 10 may not be provided with electrical elements, thereby ensuring the flatness of the first surface 101, improving the bonding quality, and avoiding structural interference during assembly.

[0051] In addition, since the light-emitting element 20 and the driving element 30 are both arranged on the second surface 102, it is possible to achieve electrical connection between the light-emitting element 20, the driving element 30 and the printed circuit board by using the front circuit layer of the first surface 101 + the back circuit layer of the second surface 102 + the film layer structure of the connecting through holes in the packaging substrate 10 when only two circuit layers are arranged in the packaging substrate 10, which is beneficial to simplifying the film layer structure of the packaging substrate 10 and reducing the cost of the packaging device 01.

[0052] Continue to refer to Figures 1 to 13As shown, in some embodiments of the present application, the driving element 30 includes a driving chip 31 , and the light emitting element 20 includes an LED chip 21 , wherein the thickness of the driving chip 31 is smaller than the thickness of the LED chip 21 .

[0053] In the package device 01 provided in the embodiment of the present application, the driver chip 31 is the main component of the driver element 30, that is, the thickness of the driver chip 31 will directly affect the distance between the surface of the driver element 30 on the side away from the package substrate 10 and the first surface 101. Similarly, the LED chip 21 is the only component or main component of the light-emitting element 20, that is, the thickness of the LED chip 21 will directly affect the distance between the surface of the light-emitting element 20 on the side away from the package substrate 10 and the first surface 101. Therefore, the present application controls the specifications of the driver chip 31 and the LED chip 21 so that the thickness of the driver chip 31 is smaller than the thickness of the LED chip 21, so as to minimize the influence of the driver element 30 on the side light emission of the light-emitting element 20, thereby improving the dark area problem and enhancing the optical uniformity.

[0054] Reference Figure 1 and Figure 2 As shown, Figure 1 In the packaged device 01 shown, the light emitting element 20 is an LED chip 21, which can be a blue LED chip; Figure 2 In the packaged device 01 shown, the light-emitting element 20 is a chip-scale package (full name in English: Chip Scale Package, abbreviated as: CSP), and the light-emitting element 20 includes an LED chip 21 and a packaging glue 22, wherein the LED chip 21 can be a blue light LED chip, and the packaging glue 22 can be a color conversion glue layer, and the color conversion glue layer includes a color conversion material and silica gel, and the color conversion material can be a fluorescent powder or a quantum dot material.

[0055] It should be noted that Figure 1 The advantages of the packaged device 01 shown include that the structure of the light emitting element 20 is simpler, the light emitting element 20 does not need to be packaged in advance, and the preparation process steps of the packaged device 01 are simpler; Figure 2 The advantage of the packaged device 01 shown is that the light-emitting element 20 is a chip-level package. After the light-emitting element 20 is mounted, the light-emitting element 20 can be sorted and tested to screen out defective products in advance, thereby avoiding the waste of the driving element 30 and the increase in the rework cost due to the defective light-emitting element 20 after the subsequent mounting of the driving element 30 is completed.

[0056] Continue to refer to 3 to Fig. 9 , Fig.12 , Fig.13As shown, in some embodiments of the present application, the light emitting element 20 includes an LED chip 21 , and in a direction parallel to the first surface 101 , the LED chip 21 does not overlap with the driving element 30 .

[0057] The applicant further discovered in internal research that since the light-emitting element 20 and the driving chip 31 are uniformly packaged in the package device 01, and the size of the package device 01 needs to be as small as possible, the spacing between the light-emitting element 20 and the driving element 30 is small, thereby enhancing the influence of the driving element 30 on the light-emitting angle of the light-emitting element 20 in the same package device 01. The LED chip 21 is the basic light-emitting body in the light-emitting element 20. The present application prevents the driving element 30 from blocking the side light of the light-emitting element 20 by making the LED chip 21 and the driving element 30 not overlap in the direction parallel to the first surface 101, thereby greatly improving the light-emitting angle and light type of the package device 01, thereby improving the optical uniformity of the light board using the package device 01 and eliminating the dark area problem.

[0058] Reference Figures 3 to 6 As shown, in some embodiments of the present application, the packaging device 01 also includes a pad layer 50, and the LED chip 21 is electrically connected to the packaging substrate 10 through the pad layer 50, wherein the pad layer 50 is arranged between the LED chip 21 and the packaging substrate 10.

[0059] In the packaging device 01 provided in the embodiment of the present application, a cushion layer 50 of a certain thickness is set between the LED chip 21 and the packaging substrate 10 to utilize the cushion layer 50 to raise the height of the LED chip 21, so as to prevent the LED chip 21 from overlapping with the driving element 30 in the direction parallel to the first surface 101, so as to avoid the driving element 30 blocking the side light of the light-emitting element 20, thereby greatly improving the light output angle and light type of the packaging device 01, and thus improving the optical uniformity of the light board using the packaging device 01, eliminating the dark area problem.

[0060] In addition, since the LED chip 21 is electrically connected to the packaging substrate 10 through the pad layer 50, that is, the setting of the pad layer 50 does not affect the electrical connection between the light-emitting element 20 and the packaging substrate 10, it is possible to take into account the electrical connection stability between the light-emitting element 20 and the driving element 30 and the printed circuit board in the lamp board.

[0061] Reference Figure 3 and Figure 4In some embodiments of the present application, the pad layer 50 is a part of the packaging substrate 10 , for example, the pad layer 50 is the first protrusion 11 in the packaging substrate 10 .

[0062] In the package device 01 provided in the embodiment of the present application, the pad layer 50 is a part of the package substrate 10, that is, after the package substrate 10 is prepared, the package substrate 10 is provided with the first protruding portion 11 on its second surface 102. Since the pad layer 50 is integrated in the package substrate 10, the types of materials can be reduced and the assembly efficiency can be improved.

[0063] In some embodiments of the present application, the packaging substrate 10 includes a first metal layer, the first metal layer includes the first protrusion 11 and a driving terminal, and the driving terminal is electrically connected to the driving chip 31 in the driving element 30 .

[0064] Continue to refer to Figure 3 and Figure 4 In some embodiments of the present application, the packaged device 01 further includes a first pad, which is disposed between the pad layer 50 and the light emitting element 20 , and a thickness of the pad layer 50 is less than a thickness of the driving element 30 .

[0065] In the packaging device 01 provided in the embodiment of the present application, the thickness of the first solder pad of the light-emitting element 20 and the welding fixing pad layer 50 are utilized to jointly achieve the function of raising the LED chip 21, so as to reduce the thickness of the pad layer 50 and reduce the cost when the LED chip 21 does not overlap with the driving element 30 in the direction parallel to the first surface 101.

[0066] Continue to refer to Figure 3 and Figure 4 , Figure 3 In the packaged device 01 shown, the light emitting element 20 is an LED chip 21, which can be a blue LED chip; Figure 4 In the packaged device 01 shown, the light-emitting element 20 is a chip-level package, and the light-emitting element 20 includes an LED chip 21 and a packaging glue 22, wherein the LED chip 21 can be a blue light LED chip, and the packaging glue 22 can be a color conversion glue layer, and the color conversion glue layer includes a color conversion material and silica gel, and the color conversion material can be a fluorescent powder or a quantum dot material.

[0067] It should be noted that, in other embodiments of the present application, the first pad may be omitted, and / or the thickness of the first protrusion 11 may be greater than or equal to the thickness of the driving element 30 .

[0068] Reference Figure 5 and Figure 6 In some embodiments of the present application, the pad layer 50 is a part of the light emitting element 20 , for example, the pad layer 50 is the second protrusion 23 in the light emitting element 20 .

[0069] In the package device 01 provided in the embodiment of the present application, the pad layer 50 is a part of the light emitting element 20, that is, after the light emitting element 20 is prepared, the light emitting element 20 is provided with the second protruding portion 23 on the surface of the backlight side thereof. Since the pad layer 50 is integrated into the light emitting element 20, the types of materials can be reduced and the assembly efficiency can be improved.

[0070] In some embodiments of the present application, the LED chip 21 in the light-emitting element 20 includes an electrode metal layer, and the electrode metal layer includes the second protrusion 23 .

[0071] Continue to refer to Figure 5 and Figure 6 In some embodiments of the present application, the packaging device 01 also includes a second pad, which is arranged between the pad layer 50 and the packaging substrate 10, and the thickness of the pad layer 50 is less than the thickness of the driving element 30.

[0072] In the packaging device 01 provided in the embodiment of the present application, the thickness of the second solder pad of the packaging substrate 10 and the welding fixed pad layer 50 are utilized to jointly achieve the function of raising the LED chip 21, so as to reduce the thickness of the pad layer 50 and reduce the cost when the LED chip 21 does not overlap with the driving element 30 in the direction parallel to the first surface 101.

[0073] It should be noted that, in other embodiments of the present application, the second pad may be omitted, and / or the thickness of the second protrusion 23 may be greater than or equal to the thickness of the driving element 30 .

[0074] Continue to refer to Figure 5 and Figure 6 , Figure 5 In the packaged device 01 shown, the light emitting element 20 is an LED chip 21, which can be a blue LED chip; Figure 6 In the packaged device 01 shown, the light-emitting element 20 is a chip-level package, and the light-emitting element 20 includes an LED chip 21 and a packaging glue 22, wherein the LED chip 21 can be a blue light LED chip, and the packaging glue 22 can be a color conversion glue layer, and the color conversion glue layer includes a color conversion material and silica gel, and the color conversion material can be a fluorescent powder or a quantum dot material.

[0075] Of course, except Figures 3 to 6 Except for the case shown, the pad layer 50 can be independent of the packaging substrate 10 and the light-emitting element 20. For example, the pad layer 50 is a metal pad, and the side of the metal pad facing the packaging substrate 10 and the side facing the light-emitting element 20 are respectively provided with a welding material layer.

[0076] Reference Figure 7 and Figure 8 As shown, in some embodiments of the present application, the thickness of the packaging substrate 10 is greater than the thickness of the driving element 30 , and the packaging substrate 10 is provided with a groove 103 on the side of the second surface 102 facing away from the first surface 101 , and the driving element 30 is accommodated in the groove 103 .

[0077] In the package device 01 provided in the embodiment of the present application, since the thickness of the package substrate 10 is greater than the thickness of the driving element 30, a groove 103 capable of completely accommodating the driving element 30 can be formed on the side of the second surface 102 away from the first surface 101 by grooving a local area of ​​the package substrate 10, that is, the depth of the groove 103 is greater than or equal to the thickness of the driving element 30. Furthermore, when the driving element 30 is subsequently set, the driving element 30 can be set in the groove 103, and then in the direction parallel to the first surface 101, the LED chip 21 and the driving element 30 are not overlapped, so as to avoid the driving element 30 blocking the side light of the light-emitting element 20, greatly improving the light output angle and light type of the package device 01, and then improving the optical uniformity of the light board using the package device 01, eliminating the dark area problem.

[0078] In some embodiments of the present application, a heat dissipation through hole is provided at the bottom of the groove 103 .

[0079] In the packaged device 01 provided in the embodiment of the present application, since the driving element 30 is accommodated in the groove 103, when the driving element 30 generates heat due to long-term operation, the groove 103 with a relatively deep depth and strong coverage of the driving element 30 will seriously limit the heat removal of the driving element 30. The present application provides the heat dissipation through hole at the bottom of the groove 103, thereby improving the heat dissipation efficiency of the driving element 30, improving the working stability of the driving element 30, and extending its service life.

[0080] Continue to refer to Figure 7 and Figure 8 , Figure 7 In the packaged device 01 shown, the light emitting element 20 is an LED chip 21, which can be a blue LED chip; Figure 8In the packaged device 01 shown, the light-emitting element 20 is a chip-level package, and the light-emitting element 20 includes an LED chip 21 and a packaging glue 22, wherein the LED chip 21 can be a blue light LED chip, and the packaging glue 22 can be a color conversion glue layer, and the color conversion glue layer includes a color conversion material and silica gel, and the color conversion material can be a fluorescent powder or a quantum dot material.

[0081] In other embodiments of the present application, the depth of the groove 103 is less than the thickness of the driving element 30, that is, at least part of the driving element 30 is exposed from the groove 103. The advantage of this structural setting is that, on the one hand, it can reduce the shielding of the side light of the light emitting element 20 by the driving element 30, and on the other hand, it can also make at least part of the driving element 30 exposed, thereby improving the heat dissipation efficiency of the driving element 30, improving the working stability of the driving element 30, and extending its service life.

[0082] Optionally, the thickness of the welding material layer between the LED chip 21 and the packaging carrier 24 is a first thickness, and the thickness of the driving element 30 protruding from the groove 103 is a second thickness, wherein the first thickness is equal to the second thickness.

[0083] In the packaging device 01 provided in the embodiment of the present application, since a welding material layer with a first thickness is arranged between the LED chip 21 and the packaging carrier 24, that is, the welding material layer has raised the LED chip 21 by the height of the first thickness. Therefore, when the thickness of the driving element 30 protruding from the groove 103 is equal to the first thickness, it can not only effectively improve the heat dissipation efficiency of the driving element 30, but also achieve non-overlapping of the LED chip 21 and the driving element 30 in a direction parallel to the first surface 101, thereby greatly improving the light output angle and light type of the packaging device 01, and then improving the optical uniformity of the lamp board using the packaging device 01, eliminating the dark area problem.

[0084] Reference Fig. 9 As shown, in some embodiments of the present application, the light-emitting element 20 includes a carrier board 24, an LED chip 21 and a packaging glue 22. The carrier board 24 is welded and fixed to the packaging substrate 10. The LED chip 21 is arranged on a side of the carrier board 24 away from the packaging substrate 10, and the packaging glue 22 covers the LED chip 21.

[0085] In the package device 01 provided in the embodiment of the present application, the light-emitting element 20 includes a carrier 24, an LED chip 21 and a packaging glue 22, that is, the light-emitting element 20 is a near chip scale package (English full name: Near ChipScale Package, abbreviated as: NCSP) including a carrier 24, the LED chip 21 is fixed by welding and electrically connected to the packaging substrate 10 through the carrier 24, and the packaging glue 22 is used to seal the LED chip 21. Since the carrier 24 is arranged between the LED chip 21 and the packaging substrate 10, the carrier 24 itself can play the role of raising the height of the LED chip 21, so that the LED chip 21 and the driving element 30 do not overlap in the direction parallel to the first surface 101, thereby greatly improving the light output angle and light type of the package device 01, and then improving the optical uniformity of the light board using the package device 01, eliminating the dark area problem.

[0086] In some embodiments of the present application, a welding material layer is provided on a side of the carrier 24 facing the packaging substrate 10 and a side facing the LED chip 21 , respectively, wherein the thickness of the carrier 24 is smaller than the thickness of the driving element 30 .

[0087] In the packaging device 01 provided in the embodiment of the present application, since the welding material layer on the side of the carrier 24 facing the packaging substrate 10 and the welding material layer on the side of the carrier 24 facing the LED chip 21 both have a certain thickness, even if the thickness of the carrier 24 is less than the thickness of the driving element 30, it is still possible to achieve that the sum of the thicknesses of the carrier 24 and the two layers of welding material layers is greater than the thickness of the driving element 30, so that the LED chip 21 and the driving element 30 do not overlap in the direction parallel to the first surface 101, thereby greatly improving the light output angle and light type of the packaging device 01, and further improving the optical uniformity of the lamp board using the packaging device 01, eliminating the dark area problem.

[0088] Of course, in other embodiments of the present application, the side of the carrier 24 facing the packaging substrate 10 may not be provided with a welding material layer, the side of the carrier 24 facing the LED chip 21 may not be provided with a welding material layer, and the thickness of the carrier 24 may be greater than or equal to the thickness of the driving element 30.

[0089] Continue to refer to Figure 1 , Fig.10 and Fig.11As shown, in some embodiments of the present application, the light-emitting element 20 includes an LED chip 21, and in a direction parallel to the first surface 101, the LED chip 21 overlaps at least partially with the driving element 30, wherein the driving element 30 includes a driving chip 31 and a reflective adhesive 32, and the reflective adhesive 32 covers the driving chip 31.

[0090] In the packaged device 01 provided in the embodiment of the present application, since the LED chip 21 and the driving element 30 at least partially overlap in the direction parallel to the first surface 101, the driving element 30 will cause a certain shielding of the side-emitting light of the LED chip 21. The present application can reduce the absorption of the side-emitting light of the LED chip 21 by the driving chip 31 by the reflecting glue 32 on the periphery of the driving chip 31, thereby improving the light extraction efficiency, and can also use the reflecting glue 32 arranged on the top surface of the driving chip 31 to make the top surface of the driving element 30 have a certain amount of reflected light emitted, thereby reducing the dark area effect.

[0091] In some embodiments of the present application, the reflective adhesive 32 includes at least one inclined side wall 321 , and in the direction in which the second surface 102 departs from the first surface 101 , the distance between the inclined side wall 321 and the adjacent light emitting element 20 gradually increases.

[0092] In the packaging device 01 provided in the embodiment of the present application, since the distance between the inclined side wall 321 and the adjacent light-emitting element 20 gradually increases in the direction in which the second surface 102 departs from the first surface 101, the inclined side wall 321 can be used to adjust the reflection angle of the side-emitting light of the LED chip 21, adjust the side-emitting light to a large-angle emitting light, and emit it from the packaging device 01, thereby further weakening the dark area effect and improving the optical uniformity of the light board using the packaging device 01.

[0093] Continue to refer to Fig.10 and Fig.11 , Fig.10 In the packaged device 01 shown, the light emitting element 20 is an LED chip 21, which can be a blue LED chip; Fig.11 In the packaged device 01 shown, the light-emitting element 20 is a chip-level package, and the light-emitting element 20 includes an LED chip 21 and a packaging glue 22, wherein the LED chip 21 can be a blue light LED chip, and the packaging glue 22 can be a color conversion glue layer, and the color conversion glue layer includes a color conversion material and silica gel, and the color conversion material can be a fluorescent powder or a quantum dot material.

[0094] Continue to refer to Figures 1 to 11In some embodiments of the present application, the packaging device 01 further includes a transparent glue 40 , and the transparent glue 40 covers the light emitting element 20 and the driving element 30 .

[0095] In the packaged device 01 provided in the embodiment of the present application, the transparent adhesive 40 is used to seal the light emitting element 20 and the driving element 30 to protect the light emitting element 20 and the driving element 30 and improve the reliability of the packaged device 01 .

[0096] Reference Fig.12 and Fig.13 As shown, in some embodiments of the present application, the packaging device 01 also includes a transparent glue 40, the transparent glue 40 covers the light-emitting element 20, the orthographic projection of the transparent glue 40 on the packaging substrate 10 does not overlap with the orthographic projection of the driving element 30 on the packaging substrate 10, wherein the light-emitting surface of the transparent glue 40 is a curved surface.

[0097] In the package device 01 provided in the embodiment of the present application, since the transparent glue 40 covers the light emitting element 20, and the orthographic projection of the transparent glue 40 on the package substrate 10 does not overlap with the orthographic projection of the driving element 30 on the package substrate 10, that is, the transparent glue 40 only covers the light emitting element 20, but does not cover the driving element 30. Since the transparent glue 40 does not cover the driving element 30, it is possible to avoid the transparent glue 40 hindering the heat dissipation of the driving element 30, thereby reducing the risk of failure of the driving element 30 with a small size and poor heat dissipation capacity due to overheating.

[0098] On this basis, since the transparent glue 40 only covers the light-emitting element 20, the transparent glue 40 can be designed with the light-emitting element 20 as the center, and by making the light-emitting surface of the transparent glue 40 a curved surface, a curved lens is formed to adjust the emitting angle of the side light emitted from the light-emitting element 20, thereby improving the dark area problem and enhancing the optical uniformity of the light board using the packaging device 01.

[0099] In addition, more importantly, refer to Fig.12 As shown, since the driving chip 31 is not covered by the transparent adhesive 40, even if the light-emitting element 20 is an LED chip 21, the transparent adhesive 40 can still be used to cover and package the LED chip 21, and then the sorting operation can be performed to screen out defective products in advance, thereby avoiding the problem of increased production costs caused by scrapping the LED chip 21 and the driving element 30 together.

[0100] Continue to refer to Fig.12 and Fig.13In some embodiments of the present application, in a direction parallel to the first surface 101, the LED chip 21 and the driving element 30 do not overlap, wherein the thickness of the packaging substrate 10 is greater than the thickness of the driving element 30, and the packaging substrate 10 is provided with a groove 103 on the side of the second surface 102 away from the first surface 101, and the driving element 30 is accommodated in the groove 103, and the thickness of the driving element 30 is the same as the depth of the groove 103, and the light emitting surface of the transparent glue 40 is a curved surface.

[0101] In the packaging device 01 provided in the embodiment of the present application, since the LED chip 21 and the driving element 30 do not overlap, the driving element 30 is accommodated in the groove 103, and the thickness of the driving element 30 is the same as the depth of the groove 103. Therefore, the driving element 30 and the packaging substrate 10 can jointly form a flat bearing surface, and the driving element 30 will not affect the molding of the transparent glue 40, which is conducive to forming a higher quality transparent glue 40 with a curved light-emitting surface, thereby improving the optical effect of the packaging device 01.

[0102] Continue to refer to Fig.12 and Fig.13 , Fig.12 In the packaged device 01 shown, the light emitting element 20 is an LED chip 21, which can be a blue LED chip; Fig.13 In the packaged device 01 shown, the light-emitting element 20 is a chip-level package, and the light-emitting element 20 includes an LED chip 21 and a packaging glue 22, wherein the LED chip 21 can be a blue light LED chip, and the packaging glue 22 can be a color conversion glue layer, and the color conversion glue layer includes a color conversion material and silica gel, and the color conversion material can be a fluorescent powder or a quantum dot material.

[0103] In some embodiments of the present application, the number of the light emitting element 20 in each of the packaged devices 01 is one.

[0104] In some embodiments of the present application, the packaging substrate 10 may be a glass-based packaging substrate 10, a ceramic-based packaging substrate 10 or a printed circuit board. When the packaging substrate 10 includes the groove 103, the packaging substrate 10 is preferably a ceramic-based packaging substrate 10.

[0105] In a second aspect, the present application embodiment provides a light board 100. Figures 14 to 19 , multiple embodiments of the present application respectively show multiple lamp boards 100 with different structures, and the lamp board 100 includes a substrate 03 and multiple packaging devices 01 as described above, and the multiple packaging devices 01 are arranged on the same side of the substrate 03 and are electrically connected to the substrate 03.

[0106] In the lamp board 100 provided in the embodiment of the present application, the substrate 03 includes a circuit film layer. Since the plurality of packaging structures 02 are arranged on the same side of the substrate 03, the substrate 03 can adopt a printed circuit board with fewer circuit film layers, and the light-emitting element 20 and the driving element 30 in each of the packaged devices 01 can be mounted on the substrate 03 at one time by single-sided mounting, thereby improving assembly efficiency and reducing the production cost of the substrate 03.

[0107] Reference Fig.14 As shown, in some embodiments of the present application, in the light board 100 , a plurality of the packaged devices 01 are arrayed on the substrate 03 , and the driving element 30 in each of the packaged devices 01 only drives the corresponding light-emitting element 20 in the packaged device 01 .

[0108] Reference Figures 15 to 19 As shown, in some embodiments of the present application, the light board 100 includes a substrate 03, a plurality of packaging structures 02 and a plurality of the above-mentioned packaging devices 01, and the plurality of the packaging structures 02 and the plurality of the packaging devices 01 are arranged on the same side of the substrate 03; wherein the packaging structure 02 includes a light-emitting element 20, and the light-emitting element 20' in the packaging structure 02 and the light-emitting element 20 in the packaging device 01 have the same light-emitting color, and the light-emitting element 20' in the packaging structure 02 is electrically connected to a driving element 30 in the packaging device 01.

[0109] In the lamp board 100 provided in the embodiment of the present application, since the light-emitting elements 20 in the packaging structure 02 and the light-emitting elements 20' in the packaging device 01 have the same light-emitting color, the light-emitting elements 20' in the packaging structure 02 can be electrically connected to a driving element 30 in the packaging device 01 to enable one driving element 30 to simultaneously drive the light-emitting elements 20 in the packaging device 01 and at least one light-emitting element 20' in the packaging structure 02, thereby reducing the number of the driving elements 30, reducing costs, further improving the dark area problem, and enhancing the optical uniformity of the lamp board 100.

[0110] Reference Fig.15 As shown, the light board 100 can be evenly divided into a plurality of light groups 101, each light group 101 includes a package device 01 and three package structures 02, and the light-emitting elements 20' in all the package structures 02 in the light group 101 are electrically connected to the driving element 30 in the package device 01 in the light group 101. Correspondingly, the driving chip 31 in the driving element 30 has four driving channels to control the package device 01 and the package structure 02 to emit light separately.

[0111] Reference Fig.16 As shown, the light board 100 can be evenly divided into a plurality of light groups 101, each light group 101 includes a package device 01 and seven package structures 02, and the light-emitting elements 20' in all the package structures 02 in the light group 101 are electrically connected to the driving element 30 in the package device 01 in the light group 101. Correspondingly, the driving chip 31 in the driving element 30 has eight driving channels to control the package device 01 and the package structure 02 to emit light separately.

[0112] Reference Fig.17 As shown, the light board 100 can be evenly divided into a plurality of light groups 101, each light group 101 includes a package device 01 and eleven package structures 02, and the light-emitting elements 20' in all the package structures 02 in the light group 101 are electrically connected to the driving element 30 in the package device 01 in the light group 101. Correspondingly, the driving chip 31 in the driving element 30 has twelve driving channels to control the package device 01 and the package structure 02 to emit light separately.

[0113] Reference Fig.18 As shown, the lamp panel 100 can be evenly divided into a plurality of lamp groups 101, each lamp group 101 includes a package device 01 and three package structures 02, and the light-emitting elements 20 in all the package structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the package device 01 in the lamp group 101. Among them, in any two adjacent lamp groups 101, the driving element 30 in one of the package devices 01 is arranged on the first side of the corresponding light-emitting element 20, and the driving element 30 in the other package device 01 is arranged on the second side (the second side is different from the first side) of the corresponding light-emitting element 20, so that the driving elements 30 in the plurality of package devices 01 are arranged non-linearly, thereby improving the dark line problem caused by the linear distribution of the dark area due to the relatively dark area where the driving elements 30 are located.

[0114] Reference Fig.19 As shown, the lamp panel 100 can be evenly divided into a plurality of lamp groups 101, each lamp group 101 includes a package device 01 and three package structures 02, and the light-emitting elements 20' in all the package structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the package devices 01 in the lamp group 101. Among them, in any two adjacent lamp groups 101, the relative position of one of the package devices 01 in the lamp group 101 is different from the relative position of another package device 01 in the lamp group 101, so that the driving elements 30 in the plurality of package devices 01 are arranged nonlinearly, thereby improving the dark line problem caused by the linear distribution of the dark area due to the relatively dark area where the driving elements 30 are located.

[0115] Fig. 20 For along Fig.15 The schematic diagram of the film structure of the light board cut through the AB line is shown. Fig.15 and Fig. 20 As shown, the package device 01 and the package structure 02 are arranged on the substrate 03, wherein the package device 01 includes a package substrate 10, a light emitting element 20, a driving element 30 and a transparent glue 40, the transparent glue 40 covers the light emitting element 20, the orthographic projection of the transparent glue 40 on the package substrate 10 does not overlap with the orthographic projection of the driving element 30 on the package substrate 10, the light emitting surface of the transparent glue 40 is a curved surface, and in a direction parallel to the first surface 101, the LED chip 21 and the driving element 30 are aligned with each other. 0 do not overlap, the thickness of the packaging substrate 10 is greater than the thickness of the driving element 30, the packaging substrate 10 is provided with a groove 103 on the side of the second surface 102 away from the first surface 101, the driving element 30 is accommodated in the groove 103, and the thickness of the driving element 30 is the same as the depth of the groove 103; wherein, the packaging structure 02 includes a packaging substrate 10', a light-emitting element 20' and a transparent glue 40', the transparent glue 40' covers the light-emitting element 20', and the light-emitting surface of the transparent glue 40' is a curved surface. Moreover, the light-emitting element 20 in the packaging device 01 is an unpackaged LED chip, and the light-emitting element 20' in the packaging structure 02 is an unpackaged LED chip.

[0116] In the lamp board 100 provided in the embodiment of the present application, the packaging substrate 10 in the packaging device 01 can have a consistent structure with the packaging substrate 10' in the packaging structure 02, the light-emitting element 20 in the packaging device 01 can have a consistent structure with the light-emitting element 20' in the packaging structure 02, the structure of the transparent glue 40 in the packaging device 01 can have a consistent structure with the transparent glue 40' in the packaging structure 02, and the light-emitting element 20 in the packaging device 01 will not be affected by the driving element 30, and the light-emitting height of the packaging device 01 and the light-emitting height of the packaging structure 02 are consistent. Therefore, the light-emitting effect of the packaging device 01 and the light-emitting effect of the packaging structure 02 can be made consistent, which is beneficial to the improvement of the optical effect of the lamp board 100. On this basis, since the transparent glue 40 in the packaging device 01 does not cover the driving element 30, and the light-emitting element 20 in the packaging device 01 and the light-emitting element 20' in the packaging structure 02 are both unpackaged LED chips, the transparent glue dispensing process can be used as the packaging process for packaging the LED chip. Furthermore, the packaging device 01 and the packaging structure 02 can complete the packaging process corresponding to the transparent glue dispensing together, and then perform sorting operations together to screen out defective products. After that, the driving element 30 of the packaging device 01 can be mounted, which can greatly improve production efficiency, avoid waste of driving elements 30, and reduce production costs.

[0117] Fig.21 For along Fig.16 The schematic diagram of the film structure of the light board cut through the CD line is shown. Fig.16 and Fig.21 As shown, the packaging device 01 and the packaging structure 02 are arranged on the substrate 03, wherein the packaging device 01 includes a packaging substrate 10, a light-emitting element 20, a driving element 30 and a transparent glue 40, the light-emitting element 20 includes a carrier 24, an LED chip 21 and a packaging glue 22, the carrier 24 is welded and fixed to the packaging substrate 10, the LED chip 21 is arranged on the side of the carrier 24 away from the packaging substrate 10, and the packaging glue 22 covers the LED chip 21; wherein the packaging structure 02 is a light-emitting element 20', the light-emitting element 20' includes a carrier 24', an LED chip 21' and a packaging glue 22', the carrier 24' is welded and fixed to the substrate 03, the LED chip 21' is arranged on the side of the carrier 24' away from the substrate 03, and the packaging glue 22' covers the LED chip 21'.

[0118] In the lamp board 100 provided in the embodiment of the present application, the carrier board 24 can raise the height of the LED chip 21, so that the packaged device 01 is parallel to the first surface 101, and the LED chip 21 does not overlap with the driving element 30, so that the light-emitting element 20 in the packaged device 01 will not be affected by the driving element 30, thereby improving the dark area problem and making the lamp board 100 have a more uniform optical effect. On this basis, since the light-emitting element 20 in the packaged device 01 and the package structure 02 are both near-chip-level packages including the carrier board 24, independent sorting can be completed to ensure their light-emitting quality; in addition, the light-emitting element 20 in the packaged device 01 can be consistent with the structure of the package structure 02, that is, corresponding to the same material, thereby reducing material costs, simplifying process steps, and improving production efficiency.

[0119] Fig. 22 For along Fig.17 The schematic diagram of the film structure of the lamp panel cut through by line EF is shown. Fig.17 and Fig. 22 As shown, in some embodiments of the present application, the packaged device 01 includes a package substrate 10, a light-emitting element 20, a driving element 30 and a transparent glue 40, the light-emitting element 20 includes an LED chip 21 and a packaging glue 22, the LED chip 21 can be a blue light LED chip, the packaging glue 22 can be a color conversion glue layer, the color conversion glue layer includes a color conversion material and silica gel, the color conversion material can be a fluorescent powder or a quantum dot material, the driving element 30 includes a driving chip 31 and a reflective glue 32, the reflective glue 32 covers the driving chip 31, and the reflective glue 32 covers the driving chip 31. The glue 32 includes at least one inclined side wall 321, and in the direction in which the second surface 102 departs from the first surface 101, the distance between the inclined side wall 321 and the adjacent light-emitting element 20 gradually increases; the packaging structure 02 is a light-emitting element 20', and the light-emitting element 20' includes an LED chip 21' and a packaging glue 22', the LED chip 21' can be a blue light LED chip, and the packaging glue 22' can be a color conversion glue layer, and the color conversion glue layer includes a color conversion material and silica gel, and the color conversion material can be a fluorescent powder or a quantum dot material.

[0120] In the lamp board 100 provided in the embodiment of the present application, since the distance between the inclined side wall 321 and the adjacent light-emitting element 20 gradually increases in the direction in which the second surface 102 departs from the first surface 101, the inclined side wall 321 can be used to adjust the reflection angle of the side-emitting light of the LED chip 21, adjust the side-emitting light to a large-angle emitting light, and emit it from the package device 01, thereby further reducing the dark area effect and improving the optical uniformity of the lamp board 100. On this basis, since the light-emitting element 20 in the package device 01 and the package structure 02 are both chip-level packages, the light-emitting element 20 in the package device 01 and the package structure 02 can also be independently sorted to ensure their light-emitting quality; in addition, the light-emitting element 20 in the package device 01 can be consistent with the structure of the package structure 02, that is, corresponding to the same material, thereby reducing material costs, simplifying process steps, and improving production efficiency.

[0121] In a third aspect, an embodiment of the present application provides a display device, which includes the light board 100 described above.

[0122] In some embodiments of the present application, the display device may be a liquid crystal display device, the liquid crystal display device includes a backlight module and a liquid crystal display panel, and the backlight module includes the light board 100 .

[0123] In some embodiments of the present application, the display device may be an LED direct display device, and the packaged device 01 in the light board 100 may be used as a display pixel to directly perform a display function.

[0124] In summary, the present application provides a packaged device, a light board, and a display device integrated with an optical drive, wherein the packaged device includes a package substrate, a light-emitting element, and a driving element, wherein the package substrate has a first surface and a second surface opposite to each other, the light-emitting element is electrically connected to the package substrate; the driving element is electrically connected to the package substrate; wherein the light-emitting element and the driving element are both arranged on the side of the second surface away from the first surface, the orthographic projection of the driving element on the second surface and the orthographic projection of the light-emitting element on the second surface do not overlap, and the distance between the surface of the light-emitting element away from the package substrate and the first surface is greater than the distance between the surface of the driving element away from the package substrate and the first surface. The present application can improve the yield while taking into account the production and manufacturing costs, reduce the influence of the driving element on the side light emission of the light-emitting chip, improve the optical uniformity of the light board, and improve the display quality.

[0125] The above is a detailed introduction to an optical drive-integrated packaging device, a light board, and a display device provided in an embodiment of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for technical personnel in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A packaging device, characterized in that: The packaging device comprises: A packaging substrate having a first surface and a second surface opposite to each other; A light emitting element electrically connected to the packaging substrate; A driving element, electrically connected to the packaging substrate; The light-emitting element and the driving element are both arranged on the side of the second surface away from the first surface, the orthographic projection of the driving element on the second surface and the orthographic projection of the light-emitting element on the second surface do not overlap, and the distance between the surface of the light-emitting element away from the packaging substrate and the first surface is greater than the distance between the surface of the driving element away from the packaging substrate and the first surface.

2. The packaged device according to claim 1, characterized in that: The light emitting element includes an LED chip, and in a direction parallel to the first surface, the LED chip does not overlap with the driving element.

3. The packaged device according to claim 2, characterized in that: The packaging device further includes a pad layer, and the LED chip is electrically connected to the packaging substrate through the pad layer, wherein the pad layer is arranged between the LED chip and the packaging substrate.

4. The packaged device according to claim 2, characterized in that: The thickness of the packaging substrate is greater than the thickness of the driving element. The packaging substrate is provided with a groove on a side of the second surface facing away from the first surface, and the driving element is accommodated in the groove.

5. The packaged device according to claim 2, characterized in that: The light emitting element comprises a carrier, an LED chip and a packaging adhesive. The carrier is fixed to the packaging substrate by welding. The LED chip is arranged on a side of the carrier away from the packaging substrate. The packaging adhesive covers the LED chip.

6. The packaged device according to claim 1, characterized in that: The light-emitting element includes an LED chip, and in a direction parallel to the first surface, the LED chip overlaps with at least a portion of the driving element, wherein the driving element includes a driving chip and a reflective adhesive, the reflective adhesive covers the driving chip, and the reflective adhesive includes at least one inclined side wall, and in a direction in which the second surface departs from the first surface, a distance between the inclined side wall and the adjacent light-emitting element gradually increases.

7. The packaged device according to any one of claims 1 to 6, characterized in that: The packaging device further comprises a transparent adhesive, and the transparent adhesive covers the light emitting element and the driving element.

8. The packaged device according to any one of claims 1 to 6, characterized in that: The packaging device also includes transparent glue, which covers the light-emitting element. The orthographic projection of the transparent glue on the packaging substrate does not overlap with the orthographic projection of the driving element on the packaging substrate, wherein the light-emitting surface of the transparent glue is a curved surface.

9. A light board, characterized in that: The light board includes a substrate, a plurality of packaging structures, and a plurality of packaging devices as described in any one of claims 1 to 8, wherein the plurality of packaging structures and the plurality of packaging devices are arranged on the same side of the substrate; wherein the packaging structure includes a light-emitting element, the light-emitting element in the packaging structure and the light-emitting element in the packaging device have the same light-emitting color, and the light-emitting element in the packaging structure is electrically connected to a driving element in the packaging device.

10. A display device, characterized in that: The display device comprises the light panel as claimed in claim 9.

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