An optical drive integrated packaging device, a lamp panel and a display device

Abstract

The application provides a package device integrated with an optical drive, a lamp panel and a display device. The package device comprises a package substrate, a light emitting element and a driving element. The package substrate has opposite first and second surfaces. The light emitting element is electrically connected to the package substrate. The driving element is electrically connected to the package substrate. The light emitting element and the driving element are arranged on the side of the second surface away from the first surface. The orthographic projection of the driving element on the second surface and the orthographic projection of the light emitting element on the second surface do not overlap. The distance between the surface of the side of the light emitting element away from the package substrate and the first surface is greater than the distance between the surface of the side of the driving element away from the package substrate and the first surface. The application can improve the yield, reduce the influence of the driving element on the side light emission of the light emitting chip, improve the optical uniformity of the lamp panel and improve the display quality while considering the production cost.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a packaging device integrated with an optical drive, a lamp panel and a display device. BACKGROUND

[0002] A light emitting diode (Light Emitting Diode, LED for short) is a kind of electroluminescent semiconductor light emitting device. Because it has the advantages of low energy consumption, small size, long service life, good stability, fast response and stable light emitting wavelength, it has been widely used in lighting, display, medical treatment, optical communication and other fields.

[0003] Taking the display field as an example, at present, the display industry is developing towards high resolution, ultra-thin, high dynamic range imaging, high contrast and wide color gamut. Through the use of smaller size and more number of Mini LED and the Local Dimming technology, each sub-area in the lamp panel, and even each light emitting element in each sub-area, can be independently switched or brightness adjusted by the driving element, so as to make the display picture more distinct in light and shade, and improve the user's visual experience. However, with the sharp increase in the number of light emitting elements and the use of active site driving mode, the number of driving elements required by the lamp panel also increases synchronously.

[0004] Under this background, in order to reduce the production cost, a printed circuit board with fewer circuit layers is usually used, that is, a single-sided mounting method is used to mount the light emitting element and the driving element on the same side of the printed circuit board. First, since the light emitting element and the driving element are independently packaged, when mounting, the independently packaged light emitting element and the driving element need to be mounted on the printed circuit board respectively, and the mounting equipment and process suitable for the light emitting element and the driving element are different, which will cause the mounting yield to decrease, especially when the number of light emitting elements and driving elements increases sharply. Secondly, since the lamp panel is a surface light source, correspondingly, the light emitting element needs to be side lighted to meet the large-angle light emitting requirement, and the driving element will block the side light of the light emitting element, thereby causing dark areas in the lamp panel and reducing the optical uniformity, especially when the number of light emitting elements and driving elements increases sharply.

[0005] Therefore, how to improve the yield and reduce the influence of the driving element on the side light of the light emitting chip while considering the production cost, and improve the optical uniformity of the lamp panel, is a technical problem that needs to be solved by those skilled in the art. SUMMARY

[0006] The application provides a light drive integrated packaging device, a lamp panel and a display device, which can effectively solve the problem in the prior art that it is difficult to improve yield and reduce the influence of a driving element on side light emission of a light emitting chip and improve optical uniformity of a lamp panel while production manufacturing cost is taken into account.

[0007] In a first aspect, the application provides a light drive integrated packaging device, which comprises:

[0008] a packaging substrate having opposite first and second surfaces;

[0009] a light emitting element electrically connected to the packaging substrate;

[0010] a driving element electrically connected to the packaging substrate;

[0011] wherein the light emitting element and the driving element are arranged on a side of the second surface away from the first surface, the orthographic projection of the driving element on the second surface and the orthographic projection of the light emitting element on the second surface do not overlap, and the distance between the surface of the side of the light emitting element away from the packaging substrate and the first surface is greater than the distance between the surface of the side of the driving element away from the packaging substrate and the first surface.

[0012] Optionally, the light emitting element comprises an LED chip, and the LED chip and the driving element do not overlap in the direction parallel to the first surface.

[0013] Optionally, the packaging device further comprises a pad layer, and the LED chip is electrically connected to the packaging substrate through the pad layer, wherein the pad layer is arranged between the LED chip and the packaging substrate.

[0014] Optionally, the thickness of the packaging substrate is greater than the thickness of the driving element, the packaging substrate is provided with a groove on the side of the second surface away from the first surface, and the driving element is accommodated in the groove.

[0015] Optionally, the light emitting element comprises a carrier plate, an LED chip and a packaging glue, the carrier plate is welded and fixed to the packaging substrate, the LED chip is arranged on the side of the carrier plate away from the packaging substrate, and the packaging glue covers the LED chip.

[0016] Optionally, the light emitting element comprises an LED chip, the LED chip overlaps at least part of the driving element in a direction parallel to the first surface, wherein the driving element comprises a driving chip and a reflective glue, the reflective glue covers the driving chip, the reflective glue comprises at least one inclined side wall, and a distance between the inclined side wall and the light emitting element adjacent to the inclined side wall gradually increases in a direction in which the second surface is away from the first surface.

[0017] Optionally, the packaging device further comprises a transparent glue, and the transparent glue covers the light emitting element and the driving element.

[0018] Optionally, the packaging device further comprises a transparent glue, and the transparent glue covers the light emitting element, and a projection of the transparent glue on the packaging substrate does not overlap a projection of the driving element on the packaging substrate, wherein an outlight surface of the transparent glue is a curved surface.

[0019] In a second aspect, the application provides a lamp panel, comprising a substrate, a plurality of packaging structures, and a plurality of packaging devices as described above, the plurality of packaging structures and the plurality of packaging devices are arranged on the same side of the substrate; wherein the packaging structure comprises a light emitting element, the light emitting element in the packaging structure and the light emitting element in the packaging device have the same light emitting color, and the light emitting element in the packaging structure is electrically connected with the driving element in one of the packaging devices.

[0020] In a third aspect, the application provides a display device, comprising the lamp panel as described above.

[0021] The application provides a packaging device integrating a light driver, a lamp panel, and a display device, the packaging device comprises a packaging substrate, a light emitting element, and a driving element, the packaging substrate has opposite first and second surfaces, the light emitting element is electrically connected with the packaging substrate, and the driving element is electrically connected with the packaging substrate; wherein the light emitting element and the driving element are arranged on a side of the second surface away from the first surface, a projection of the driving element on the second surface and a projection of the light emitting element on the second surface do not overlap, and a distance between a surface of the light emitting element on a side away from the packaging substrate and the first surface is greater than a distance between a surface of the driving element on a side away from the packaging substrate and the first surface. The application can improve yield, reduce the influence of the driving element on side light emission of the light emitting chip, improve optical uniformity of the lamp panel, and improve display quality while taking into account production manufacturing cost. BRIEF DESCRIPTION OF DRAWINGS

[0022] The technical solutions and other beneficial effects of the present application will become apparent through the following detailed description of specific embodiments of the present application, in conjunction with the accompanying drawings.

[0023] Figure 1 A schematic diagram of a film layer structure of a packaged device according to a first embodiment of the present application.

[0024] Figure 2 A schematic diagram of a film layer structure of a packaged device according to a second embodiment of the present application.

[0025] Figure 3 A schematic diagram of a film layer structure of a packaged device according to a third embodiment of the present application.

[0026] Figure 4 A schematic diagram of a film layer structure of a packaged device according to a fourth embodiment of the present application.

[0027] Figure 5 A schematic diagram of a film layer structure of a packaged device according to a fifth embodiment of the present application.

[0028] Figure 6 A schematic diagram of a film layer structure of a packaged device according to a sixth embodiment of the present application.

[0029] Figure 7 A schematic diagram of a film layer structure of a packaged device according to a seventh embodiment of the present application.

[0030] Figure 8 A schematic diagram of a film layer structure of a packaged device according to an eighth embodiment of the present application.

[0031] Figure 9 A schematic diagram of a film layer structure of a packaged device according to a ninth embodiment of the present application.

[0032] Figure 10 A schematic diagram of a film layer structure of a packaged device according to a tenth embodiment of the present application.

[0033] Figure 11 A schematic diagram of a film layer structure of a packaged device according to an eleventh embodiment of the present application.

[0034] Figure 12 A schematic diagram of a film layer structure of a packaged device according to a twelfth embodiment of the present application.

[0035] Figure 13 A schematic diagram of a film layer structure of a packaged device according to a thirteenth embodiment of the present application.

[0036] Figure 14 A top view schematic diagram of a first light plate according to some embodiments of the present application.

[0037] Figure 15 A top view of a second lamp panel provided for some embodiments of the present application.

[0038] Figure 16 A top view of a third lamp panel provided for some embodiments of the present application.

[0039] Figure 17 A top view of a fourth lamp panel provided for some embodiments of the present application.

[0040] Figure 18 A top view of a fifth lamp panel provided for some embodiments of the present application.

[0041] Figure 19 A top view of a sixth lamp panel provided for some embodiments of the present application.

[0042] Figure 20 A film layer structure diagram of the lamp panel shown in the AB line section. Figure 15

[0043] A film layer structure diagram of the lamp panel shown in the CD line section. Figure 21 Figure 16 A film layer structure diagram of the lamp panel shown in the EF line section.

[0044] Figure 22 Figure 17

[0045] BRIEF DESCRIPTION OF DRAWINGS

[0046] Packaging device 01; packaging substrate 10; first surface 101; second surface 102; groove 103; first protruding part 11; light emitting element 20; LED chip 21; packaging glue 22; second protruding part 23; carrier board 24; driving element 30; driving chip 31; reflective glue 32; inclined side wall 321; transparent glue 40; cushion layer 50; packaging structure 02; packaging substrate 10'; light emitting element 20'; LED chip 21'; packaging glue 22'; carrier board 24'; transparent glue 40'; substrate 03; lamp panel 100; lamp group 101. DETAILED DESCRIPTION

[0047] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0048] ​​​The terms "first", "second", etc., are used only for the purpose of description and are not to be interpreted as indicating or implying relative importance or a required sequence of features. Thus, features defined with "first", "second" can include one or more of the features explicitly mentioned or implicitly suggested. In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be interpreted broadly, for example, can be fixed connection, can be detachable connection, or integral connection; can be mechanical connection, can be electrical connection or can communicate with each other; can be directly connected, can be indirectly connected through an intermediate medium, or can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0049] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be interpreted broadly, for example, can be fixed connection, can be detachable connection, or integral connection; can be mechanical connection, can be electrical connection or can communicate with each other; can be directly connected, can be indirectly connected through an intermediate medium, or can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0050] The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeatedly refer to numbers and / or letters in different examples. Such repetition is for the purpose of simplification and clarity, and in itself does not indicate the relationship between the various embodiments and / or settings discussed.

[0051] In a first aspect, embodiments of the present application provide a packaging device 01. Please refer to Figures 1 to 13 As shown, a plurality of embodiments of the present application respectively show a plurality of packaging devices 01 with different structures, which include a packaging substrate 10, a light emitting element 20 and a driving element 30, the packaging substrate 10 has opposite first and second surfaces 101 and 102, the light emitting element 20 is electrically connected with the packaging substrate 10; the driving element 30 is electrically connected with the packaging substrate 10; wherein the light emitting element 20 and the driving element 30 are both arranged on the side of the second surface 102 away from the first surface 101, the orthographic projection of the driving element 30 on the second surface 102 and the orthographic projection of the light emitting element 20 on the second surface 102 do not overlap, and the distance between the surface of the side of the light emitting element 20 away from the packaging substrate 10 and the first surface 101 is greater than the distance between the surface of the side of the driving element 30 away from the packaging substrate 10 and the first surface 101.

[0052] The packaging device 01 provided by the embodiment of the present application has the following advantages: the light emitting element 20 and the driving element 30 are arranged on the second surface 102 and electrically connected to the packaging substrate 10, so that the packaging substrate 10 can be used as a conversion board to convert the electrical signal conversion ports of the light emitting element 20 and the driving element 30 to a single circuit layer of the packaging substrate 10, and then exposed through the first surface 101, thereby achieving the electrical connection between the light emitting element 20, the driving element 30 and the printed circuit board without increasing the film layer structure of the printed circuit board, and effectively reducing the production cost.

[0053] Secondly, the light emitting element 20 and the driving element 30 are arranged on the packaging substrate 10, which can be integrally attached to the printed circuit board in the lamp panel through the packaging substrate 10 in the subsequent attachment process, thereby improving the problem of low yield caused by the independent attachment of the light emitting element 20 and the driving element 30.

[0054] More importantly, the distance between the surface of the side of the light emitting element 20 away from the packaging substrate 10 and the first surface 101 is greater than the distance between the surface of the side of the driving element 30 away from the packaging substrate 10 and the first surface 101, so that the light emitted by the part of the light emitting element 20 higher than the driving element 30 will not be affected by the driving element 30, thereby meeting the large-angle light emission requirement of the light emitting element 20 for the lamp panel, reducing the problem of dark area in the lamp panel, and improving the optical uniformity.

[0055] At the same time, secondly, the light emitting element 20 and the driving element 30 are arranged on the second surface 102, that is, the first surface 101 of the packaging substrate 10 can not be arranged with electrical elements, thereby ensuring the flatness of the first surface 101, improving the bonding quality, and avoiding the structural interference during assembly.

[0056] In addition, since the light emitting element 20 and the driving element 30 are arranged on the second surface 102, the film layer structure of the packaging substrate 10 can be realized by using the front circuit layer of the first surface 101 + the back circuit layer of the second surface 102 + the connection via in the packaging substrate 10, thereby achieving the electrical connection between the light emitting element 20, the driving element 30 and the printed circuit board, simplifying the film layer structure of the packaging substrate 10, and reducing the cost of the packaging device 01.

[0057] Continuing to refer to Figures 1 to 13As shown in some embodiments of the present application, the driving element 30 comprises a driving chip 31, and the light emitting element 20 comprises an LED chip 21, wherein the thickness of the driving chip 31 is less than the thickness of the LED chip 21.

[0058] In the packaging device 01 provided by the embodiments of the present application, the driving chip 31 is the main component of the driving element 30, that is, the thickness of the driving chip 31 directly affects the distance between the surface of the side of the driving element 30 away from the packaging substrate 10 and the first surface 101. Similarly, the LED chip 21 is the only component or the main component of the light emitting element 20, that is, the thickness of the LED chip 21 directly affects the distance between the surface of the side of the light emitting element 20 away from the packaging substrate 10 and the first surface 101. Therefore, the present application controls the specifications of the driving chip 31 and the LED chip 21, so that the thickness of the driving chip 31 is less than the thickness of the LED chip 21, so as to reduce the influence of the driving element 30 on the side light emission of the light emitting element 20 as much as possible, thereby improving the dark area problem and improving the optical uniformity.

[0059] Referring to Figure 1 and Figure 2 As shown, Figure 1 In the packaging device 01 shown, the light emitting element 20 is an LED chip 21, which can be a blue LED chip. Figure 2 In the packaging device 01 shown, the light emitting element 20 is a chip-scale package (Chip Scale Package, CSP for short), which comprises an LED chip 21 and a packaging glue 22. The LED chip 21 can be a blue LED chip, and the packaging glue 22 can be a color conversion glue layer, which comprises color conversion materials and silicone. The color conversion materials can be fluorescent powder or quantum dot materials.

[0060] It should be noted that, Figure 1 The advantages of the packaging device 01 shown include that the structure of the light emitting element 20 is simpler, and the light emitting element 20 does not need to be pre-packaged, so that the preparation process steps of the packaging device 01 are simpler. Figure 2 The advantage of the packaging device 01 shown is that the light emitting element 20 is a chip-scale package, so that the light emitting element 20 can be tested after being attached, and defective products can be screened in advance, so as to avoid the waste of the driving element 30 and the increase of the repair cost caused by the defective light emitting element 20 after the attachment of the driving element 30.

[0061] Continuing to refer to 3 to Figure 9 , Figure 12 , Figure 13As shown, in some embodiments of the present application, the light emitting element 20 comprises an LED chip 21, and the LED chip 21 does not overlap with the driving element 30 in the direction parallel to the first surface 101.

[0062] Applicants further found in internal research that, due to the light emitting element 20 and the driving chip 31 being unified packaged in the packaging device 01, and the size of the packaging device 01 needs to be as small as possible, which makes the spacing distance between the light emitting element 20 and the driving element 30 smaller, thereby enhancing the influence of the driving element 30 on the light emitting angle of the light emitting element 20 in the same packaging device 01. The LED chip 21 is the basic light emitter in the light emitting element 20, and the present application can avoid the driving element 30 from blocking the side light emission of the light emitting element 20 by making the LED chip 21 not overlap with the driving element 30 in the direction parallel to the first surface 101, thereby greatly improving the light emitting angle and light pattern of the packaging device 01, and further improving the optical uniformity of the lamp panel using the packaging device 01, and eliminating the dark area problem.

[0063] Referring to Figures 3 to 6 As shown, in some embodiments of the present application, the packaging device 01 further comprises a pad layer 50, and the LED chip 21 is electrically connected with the packaging substrate 10 through the pad layer 50, wherein the pad layer 50 is arranged between the LED chip 21 and the packaging substrate 10.

[0064] In the packaging device 01 provided by the embodiments of the present application, the height of the LED chip 21 is lifted by the pad layer 50 arranged between the LED chip 21 and the packaging substrate 10, so that the LED chip 21 does not overlap with the driving element 30 in the direction parallel to the first surface 101, thereby avoiding the driving element 30 from blocking the side light emission of the light emitting element 20, greatly improving the light emitting angle and light pattern of the packaging device 01, and further improving the optical uniformity of the lamp panel using the packaging device 01, and eliminating the dark area problem.

[0065] In addition, since the LED chip 21 is electrically connected with the packaging substrate 10 through the pad layer 50, that is, the arrangement of the pad layer 50 does not affect the electrical connection between the light emitting element 20 and the packaging substrate 10, so that the electrical connection stability of the light emitting element 20 and the driving element 30, and the printed circuit board in the lamp panel can be considered.

[0066] Referring to Figure 3 and Figure 4In some embodiments of the present application, the cushion layer 50 is a part of the packaging substrate 10, for example, the cushion layer 50 is a first protruding part 11 in the packaging substrate 10.

[0067] In the packaging device 01 provided by the embodiments of the present application, the cushion layer 50 is a part of the packaging substrate 10, that is, after the packaging substrate 10 is prepared, the packaging substrate 10 is provided with the first protruding part 11 protruding from the second surface 102. Since the cushion layer 50 is integrated in the packaging substrate 10, the material types can be reduced and the assembly efficiency can be improved.

[0068] In some embodiments of the present application, the packaging substrate 10 includes a first metal layer, the first metal layer includes the first protruding part 11 and a driving terminal, and the driving terminal is electrically connected with a driving chip 31 in the driving element 30.

[0069] Continuing to refer to Figure 3 and Figure 4 In some embodiments of the present application, the packaging device 01 further includes a first pad, the first pad is arranged between the cushion layer 50 and the light emitting element 20, and the thickness of the cushion layer 50 is less than the thickness of the driving element 30.

[0070] In the packaging device 01 provided by the embodiments of the present application, the thickness of the first pad itself for fixing the cushion layer 50 and the light emitting element 20 is used to realize the function of elevating the LED chip 21 together with the cushion layer 50, so as to thin the thickness of the cushion layer 50 and reduce the cost under the condition that the LED chip 21 does not overlap with the driving element 30 in the direction parallel to the first surface 101.

[0071] Continuing to refer to Figure 3 and Figure 4 , Figure 3 In the packaging device 01 shown in the figure, the light emitting element 20 is an LED chip 21, which can be a blue LED chip. Figure 4 In the packaging device 01 shown in the figure, the light emitting element 20 is a chip-level package, the light emitting element 20 includes an LED chip 21 and a packaging glue 22, wherein the LED chip 21 can be a blue LED chip, and the packaging glue 22 can be a color conversion glue layer, the color conversion glue layer includes color conversion material and silica gel, and the color conversion material can be fluorescent powder or quantum dot material.

[0072] It should be noted that in other embodiments of the present application, the first pad can be omitted, and / or the thickness of the first protruding part 11 can be greater than or equal to the thickness of the driving element 30.

[0073] Referring toFigure 5 And Figure 6 In some embodiments of the present application, the pad layer 50 is part of the light emitting element 20, for example, the pad layer 50 is a second protruding part 23 in the light emitting element 20.

[0074] In the packaging device 01 provided by the embodiments of the present application, the pad layer 50 is part of the light emitting element 20, that is, after the light emitting element 20 is prepared, the second protruding part 23 is arranged on the surface of the back light side of the light emitting element 20. Since the pad layer 50 is integrated in the light emitting element 20, the material types can be reduced and the assembly efficiency can be improved.

[0075] In some embodiments of the present application, the LED chip 21 in the light emitting element 20 includes an electrode metal layer, and the electrode metal layer includes the second protruding part 23.

[0076] Continuing to refer to Figure 5 And Figure 6 In some embodiments of the present application, the packaging device 01 further includes a second pad, the second pad is arranged between the pad layer 50 and the packaging substrate 10, and the thickness of the pad layer 50 is less than the thickness of the driving element 30.

[0077] In the packaging device 01 provided by the embodiments of the present application, the thickness of the second pad itself is used to fix the pad layer 50 and the packaging substrate 10, and the pad layer 50 is used to raise the LED chip 21, so as to reduce the thickness of the pad layer 50 and reduce the cost in the case that the LED chip 21 does not overlap with the driving element 30 in the direction parallel to the first surface 101.

[0078] It should be noted that in other embodiments of the present application, the second pad can be omitted, and / or the thickness of the second protruding part 23 can be greater than or equal to the thickness of the driving element 30.

[0079] Continuing to refer to Figure 5 And Figure 6 , Figure 5 In the packaging device 01 shown in the figure, the light emitting element 20 is an LED chip 21, which can be a blue light LED chip; Figure 6 In the packaging device 01 shown in the figure, the light emitting element 20 is a chip-level packaging body, the light emitting element 20 includes an LED chip 21 and a packaging glue 22, wherein the LED chip 21 can be a blue light LED chip, and the packaging glue 22 can be a color conversion glue layer, the color conversion glue layer includes color conversion material and silicone, and the color conversion material can be fluorescent powder or quantum dot material.

[0080] Of course, in addition toFigures 3 to 6 In addition to the cases shown, the gasket layer 50 can be independent of the packaging substrate 10 and the light-emitting element 20, for example, the gasket layer 50 is a metal gasket, and a solder material layer is arranged on the side of the metal gasket facing the packaging substrate 10 and the side of the metal gasket facing the light-emitting element 20, respectively.

[0081] Referring to Figure 7 and Figure 8 In some embodiments of the present application, the thickness of the packaging substrate 10 is greater than the thickness of the driving element 30, and the packaging substrate 10 is provided with a groove 103 on the side away from the first surface 101 of the second surface 102, and the driving element 30 is accommodated in the groove 103.

[0082] In the packaging device 01 provided by the embodiments of the present application, because the thickness of the packaging substrate 10 is greater than the thickness of the driving element 30, a groove 103 capable of completely accommodating the driving element 30 can be formed on the side away from the first surface 101 of the second surface 102 by slotting the local area of the packaging substrate 10, that is, the depth of the groove 103 is greater than or equal to the thickness of the driving element 30. Further, when the driving element 30 is subsequently arranged, the driving element 30 can be arranged in the groove 103, and the LED chip 21 and the driving element 30 are not overlapped in the direction parallel to the first surface 101, so as to avoid the driving element 30 from blocking the side light emission of the light-emitting element 20, greatly improve the light emission angle and light type of the packaging device 01, and further improve the optical uniformity of the lamp panel using the packaging device 01, and eliminate the dark area problem.

[0083] In some embodiments of the present application, the bottom of the groove 103 is provided with a heat dissipation through hole.

[0084] In the packaging device 01 provided by the embodiments of the present application, because the driving element 30 is accommodated in the groove 103, when the driving element 30 generates heat due to long-time work, the groove 103 with deep depth and strong covering property of the driving element 30 will seriously limit the heat dissipation of the driving element 30. The present application can improve the heat dissipation efficiency of the driving element 30, improve the working stability of the driving element 30, and prolong the service life of the driving element 30 by arranging the heat dissipation through hole at the bottom of the groove 103.

[0085] Continuing to refer to Figure 7 and Figure 8 , Figure 7 In the packaging device 01 shown in Figure 8The package device 01 shown in the figure is a chip-level package, and the light emitting element 20 includes an LED chip 21 and a package glue 22. The LED chip 21 can be a blue light LED chip, and the package glue 22 can be a color conversion glue layer including color conversion material and silica gel. The color conversion material can be fluorescent powder or quantum dot material.

[0086] In other embodiments of the present application, the depth of the groove 103 is less than the thickness of the driving element 30, that is, at least part of the driving element 30 is exposed from the groove 103. The advantage of this structure is that on the one hand, it can weaken the shielding of the driving element 30 to the side light of the light emitting element 20, and on the other hand, it can also expose at least part of the driving element 30, thereby improving the heat dissipation efficiency of the driving element 30, improving the working stability of the driving element 30, and prolonging its service life.

[0087] Optionally, the thickness of the solder material layer between the LED chip 21 and the package carrier plate 24 is a first thickness, and the thickness of the driving element 30 protruding from the groove 103 is a second thickness, wherein the first thickness is equal to the second thickness.

[0088] In the package device 01 provided by the embodiments of the present application, because the solder material layer with the first thickness is arranged between the LED chip 21 and the package carrier plate 24, that is, the solder material layer has raised the LED chip 21 by a height of the first thickness, when the thickness of the driving element 30 protruding from the groove 103 is equal to the first thickness, it can effectively improve the heat dissipation efficiency of the driving element 30, and also can make the LED chip 21 and the driving element 30 not overlap in the direction parallel to the first surface 101, thereby greatly improving the light emitting angle and light type of the package device 01, and further improving the optical uniformity of the lamp panel using the package device 01, and eliminating the dark area problem.

[0089] Reference Figure 9 As shown, in some embodiments of the present application, the light emitting element 20 includes a carrier plate 24, an LED chip 21 and a package glue 22. The carrier plate 24 is welded and fixed with the package substrate 10. The LED chip 21 is arranged on the side of the carrier plate 24 away from the package substrate 10. The package glue 22 covers the LED chip 21.

[0090] In the packaging device 01 provided by the embodiments of the present application, the light emitting element 20 comprises a carrier plate 24, an LED chip 21 and a packaging glue 22, that is, the light emitting element 20 is a near chip scale package (NCSP) comprising the carrier plate 24, the LED chip 21 is welded and fixed to the packaging substrate 10 and electrically connected to the packaging substrate 10 through the carrier plate 24, and the packaging glue 22 is used for sealing the LED chip 21. Since the carrier plate 24 is arranged between the LED chip 21 and the packaging substrate 10, the carrier plate 24 itself can play a role in raising the height of the LED chip 21, so that the LED chip 21 and the driving element 30 are not overlapped in the direction parallel to the first surface 101, thereby greatly improving the light emitting angle and light type of the packaging device 01, and further improving the optical uniformity of the lamp panel using the packaging device 01, and eliminating the dark area problem.

[0091] In some embodiments of the present application, the carrier plate 24 is provided with a welding material layer on the side facing the packaging substrate 10 and on the side facing the LED chip 21, and the thickness of the carrier plate 24 is less than the thickness of the driving element 30.

[0092] In the packaging device 01 provided by the embodiments of the present application, since the welding material layer on the side of the carrier plate 24 facing the packaging substrate 10 and the welding material layer on the side of the carrier plate 24 facing the LED chip 21 both have a certain thickness, even if the thickness of the carrier plate 24 is less than the thickness of the driving element 30, the sum of the thickness of the carrier plate 24 and the thickness of the two welding material layers is still greater than the thickness of the driving element 30, so that the LED chip 21 and the driving element 30 are not overlapped in the direction parallel to the first surface 101, thereby greatly improving the light emitting angle and light type of the packaging device 01, and further improving the optical uniformity of the lamp panel using the packaging device 01, and eliminating the dark area problem.

[0093] Of course, in other embodiments of the present application, the side of the carrier plate 24 facing the packaging substrate 10 can not be provided with a welding material layer, the side of the carrier plate 24 facing the LED chip 21 can not be provided with a welding material layer, and the thickness of the carrier plate 24 can be greater than or equal to the thickness of the driving element 30.

[0094] Continuing to refer to Figure 1 , Figure 10 and Figure 11As shown in the package device 01 provided in the embodiments of the present application, the light emitting element 20 includes the LED chip 21, and at least part of the LED chip 21 overlaps with the driving element 30 in the direction parallel to the first surface 101, wherein the driving element 30 includes the driving chip 31 and the reflective glue 32, and the reflective glue 32 covers the driving chip 31.

[0095] In the package device 01 provided in the embodiments of the present application, since at least part of the LED chip 21 overlaps with the driving element 30 in the direction parallel to the first surface 101, the driving element 30 will cause a certain shielding to the side-emitted light of the LED chip 21. The present application can reduce the absorption of the side-emitted light of the LED chip 21 by the driving chip 31 by covering the periphery of the driving chip 31 with the reflective glue 32, thereby improving the light-emitting efficiency, and the reflective glue 32 arranged on the top surface of the driving chip 31 can also make the top surface of the driving element 30 have a certain reflective light emission, thereby weakening the dark area effect.

[0096] In some embodiments of the present application, the reflective glue 32 includes at least one inclined side wall 321, and the distance between the inclined side wall 321 and the light emitting element 20 adjacent to the inclined side wall 321 gradually increases in the direction in which the second surface 102 deviates from the first surface 101.

[0097] In the package device 01 provided in the embodiments of the present application, since the distance between the inclined side wall 321 and the light emitting element 20 adjacent to the inclined side wall 321 gradually increases in the direction in which the second surface 102 deviates from the first surface 101, the inclined side wall 321 can be used to adjust the reflection angle of the side-emitted light of the LED chip 21, adjust the side-emitted light to large-angle emitted light, and make the large-angle emitted light emit from the package device 01, thereby further weakening the dark area effect and improving the optical uniformity of the lamp panel using the package device 01.

[0098] Continuing to refer to Figure 10 and Figure 11 , Figure 10 As shown in the package device 01, the light emitting element 20 is the LED chip 21, which can be a blue light LED chip. Figure 11 As shown in the package device 01, the light emitting element 20 is a chip-level package, and the light emitting element 20 includes the LED chip 21 and the encapsulation glue 22, wherein the LED chip 21 can be a blue light LED chip, and the encapsulation glue 22 can be a color conversion glue layer, the color conversion glue layer includes color conversion material and silica gel, and the color conversion material can be fluorescent powder or quantum dot material.

[0099] Continuing to refer to Figures 1 to 11In some embodiments of the present application, the packaging device 01 further comprises a transparent adhesive 40, and the transparent adhesive 40 covers the light emitting element 20 and the driving element 30.

[0100] In the packaging device 01 provided by the embodiments of the present application, the transparent adhesive 40 is used to seal the light emitting element 20 and the driving element 30, so as to protect the light emitting element 20 and the driving element 30, and improve the reliability of the packaging device 01.

[0101] Referring to FIGS. 1 and 2, Figure 12 and Figure 13 In some embodiments of the present application, the packaging device 01 further comprises a transparent adhesive 40, and the transparent adhesive 40 covers the light emitting element 20, and the orthogonal projection of the transparent adhesive 40 on the packaging substrate 10 does not overlap with the orthogonal projection of the driving element 30 on the packaging substrate 10, wherein the light-out surface of the transparent adhesive 40 is a curved surface.

[0102] In the packaging device 01 provided by the embodiments of the present application, since the transparent adhesive 40 covers the light emitting element 20, and the orthogonal projection of the transparent adhesive 40 on the packaging substrate 10 does not overlap with the orthogonal projection of the driving element 30 on the packaging substrate 10, that is, the transparent adhesive 40 only covers the light emitting element 20, but does not cover the driving element 30. Since the transparent adhesive 40 does not cover the driving element 30, the transparent adhesive 40 can avoid hindering the heat dissipation of the driving element 30, and reduce the risk of failure of the driving element 30 due to overheating because of small size and poor heat dissipation.

[0103] On this basis, since the transparent adhesive 40 only covers the light emitting element 20, the transparent adhesive 40 can be designed with the light emitting element 20 as the center, and by making the light-out surface of the transparent adhesive 40 a curved surface, a curved lens is formed to adjust the exit angle of the light rays emitted from the side surface of the light emitting element 20, thereby improving the dark area problem and improving the optical uniformity of the lamp panel using the packaging device 01.

[0104] In addition, more importantly, referring to FIGS. 1 and 2, Figure 12 Since the driving chip 31 is not covered by the transparent adhesive 40, even if the light emitting element 20 is an LED chip 21, the transparent adhesive 40 can still complete the encapsulation work of the LED chip 21, and then perform the sorting work, thereby screening out defective products in advance, and avoiding the problem of increasing production cost caused by scrapping the LED chip 21 and the driving element 30 together.

[0105] Continuing to refer to FIGS. 1 and 2, Figure 12 and Figure 13In some embodiments of the present application, the LED chip 21 and the driving element 30 do not overlap in a direction parallel to the first surface 101, wherein the thickness of the packaging substrate 10 is greater than the thickness of the driving element 30, the packaging substrate 10 is provided with a groove 103 on the side away from the first surface 101, the driving element 30 is accommodated in the groove 103, the thickness of the driving element 30 is the same as the depth of the groove 103, and the light-emitting surface of the transparent adhesive 40 is curved.

[0106] In the packaging device 01 provided by the embodiments of the present application, since the LED chip 21 and the driving element 30 do not overlap, the driving element 30 is accommodated in the groove 103, and the thickness of the driving element 30 is the same as the depth of the groove 103, the driving element 30 and the packaging substrate 10 can jointly form a flat bearing surface, the driving element 30 will not affect the molding of the transparent adhesive 40, thereby facilitating the formation of a higher-quality transparent adhesive 40 with a curved light-emitting surface, and further improving the optical effect of the packaging device 01.

[0107] Continuing to refer to the packaging device 01 shown in Figure 12 and Figure 13 , Figure 12 , the light-emitting element 20 is an LED chip 21, which can be a blue LED chip. Figure 13 In the packaging device 01 shown in , the light-emitting element 20 is a chip-level packaging body, which includes an LED chip 21 and a packaging adhesive 22, wherein the LED chip 21 can be a blue LED chip, and the packaging adhesive 22 can be a color conversion adhesive layer, which includes color conversion materials and silicone, and the color conversion materials can be fluorescent powder or quantum dot materials.

[0108] In some embodiments of the present application, the number of light-emitting elements 20 in each packaging device 01 is one.

[0109] In some embodiments of the present application, the packaging substrate 10 can be a glass-based packaging substrate 10, a ceramic-based packaging substrate 10, or a printed circuit board. When the packaging substrate 10 includes a groove 103, the packaging substrate 10 is preferably a ceramic-based packaging substrate 10.

[0110] In a second aspect, the embodiments of the present application provide a lamp panel 100. Please refer to Figures 14 to 19 , a plurality of embodiments of the present application respectively show a plurality of lamp panels 100 with different structures, which include a substrate 03 and a plurality of packaging devices 01 described above, and the plurality of packaging devices 01 are arranged on the same side of the substrate 03 and electrically connected to the substrate 03.

[0111] In the lamp panel 100 provided by the embodiment of the present application, the substrate 03 comprises a circuit film layer. Since the plurality of packaging structures 02 are arranged on the same side of the substrate 03, the substrate 03 can adopt a printed circuit board with a smaller number of circuit film layers, and the light emitting element 20 and the driving element 30 in each packaging device 01 can be mounted on the substrate 03 at one time by means of single-sided mounting, thereby improving the assembly efficiency and reducing the production cost of the substrate 03.

[0112] Referring to Figure 14 In some embodiments of the present application, the substrate 03 in the lamp panel 100 is arranged with a plurality of packaging devices 01, and the driving element 30 in each packaging device 01 only drives the light emitting element 20 in the corresponding packaging device 01.

[0113] Referring to Figures 15 to 19 In some embodiments of the present application, the lamp panel 100 comprises a substrate 03, a plurality of packaging structures 02 and a plurality of packaging devices 01 as described above, and the plurality of packaging structures 02 and the plurality of packaging devices 01 are arranged on the same side of the substrate 03. The packaging structure 02 comprises a light emitting element 20, the light emitting element 20 in the packaging structure 02 and the light emitting element 20 in the packaging device 01 have the same light emitting color, and the light emitting element 20 in the packaging structure 02 is electrically connected with the driving element 30 in one packaging device 01.

[0114] In the lamp panel 100 provided by the embodiment of the present application, since the light emitting element 20 in the packaging structure 02 and the light emitting element 20 in the packaging device 01 have the same light emitting color, one driving element 30 can be electrically connected with the light emitting element 20 in the packaging structure 02 and the light emitting element 20 in the packaging device 01, thereby realizing that one driving element 30 simultaneously drives the light emitting element 20 in the packaging device 01 and the light emitting element 20 in the packaging structure 02, reducing the number of driving elements 30, reducing the cost, further improving the dark area problem and improving the optical uniformity of the lamp panel 100.

[0115] Referring to Figure 15 As shown in the figure, the lamp panel 100 can be equally divided into a plurality of lamp groups 101, each lamp group 101 comprising one packaging device 01 and three packaging structures 02, and the light emitting element 20 in all the packaging structures 02 in the lamp group 101 is electrically connected with the driving element 30 in the packaging device 01 in the lamp group 101. Correspondingly, the driving chip 31 in the driving element 30 has four driving channels to control the packaging device 01 and the packaging structure 02 to emit light separately.

[0116] Referring toFigure 16 As shown in FIG. 1, the lamp panel 100 can be equally divided into a plurality of lamp groups 101, each of which includes one packaging device 01 and seven packaging structures 02. The light emitting elements 20' in all the packaging structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the packaging device 01 in the lamp group 101. Correspondingly, the driving chip 31 in the driving element 30 has eight driving channels to control the packaging device 01 and the packaging structure 02 to emit light individually.

[0117] Referring to Figure 17 As shown in FIG. 1, the lamp panel 100 can be equally divided into a plurality of lamp groups 101, each of which includes one packaging device 01 and seven packaging structures 02. The light emitting elements 20' in all the packaging structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the packaging device 01 in the lamp group 101. Correspondingly, the driving chip 31 in the driving element 30 has eight driving channels to control the packaging device 01 and the packaging structure 02 to emit light individually.

[0118] Referring to Figure 18 As shown in FIG. 1, the lamp panel 100 can be equally divided into a plurality of lamp groups 101, each of which includes one packaging device 01 and seven packaging structures 02. The light emitting elements 20' in all the packaging structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the packaging device 01 in the lamp group 101. Correspondingly, the driving chip 31 in the driving element 30 has eight driving channels to control the packaging device 01 and the packaging structure 02 to emit light individually.

[0119] Referring to Figure 19 As shown in FIG. 1, the lamp panel 100 can be equally divided into a plurality of lamp groups 101, each of which includes one packaging device 01 and seven packaging structures 02. The light emitting elements 20' in all the packaging structures 02 in the lamp group 101 are electrically connected to the driving elements 30 in the packaging device 01 in the lamp group 101. Correspondingly, the driving chip 31 in the driving element 30 has eight driving channels to control the packaging device 01 and the packaging structure 02 to emit light individually.

[0120] Figure 20 For the AB line profile of the lamp plate shown in Figure 15 The film layer structure schematic diagram of the lamp plate shown in the AB line profile. In combination with Figure 15 And Figure 20 As shown in the packaging device 01 and the packaging structure 02 are arranged on the substrate 03, wherein the packaging device 01 includes packaging substrate 10, light emitting element 20, driving element 30 and transparent glue 40, the transparent glue 40 covers the light emitting element 20, the transparent glue 40 on the packaging substrate 10 with the orthographic projection of the driving element 30 on the packaging substrate 10 does not overlap, the light exit surface of the transparent glue 40 is curved, in the direction parallel to the first surface 101, the LED chip 21 and the driving element 30 do not overlap, the thickness of the packaging substrate 10 is greater than the thickness of the driving element 30, the packaging substrate 10 is provided with groove 103 on the side of the second surface 102 away from the first surface 101, the driving element 30 is accommodated in the groove 103, the thickness of the driving element 30 is the same as the depth of the groove 103; wherein the packaging structure 02 includes packaging substrate 10`, light emitting element 20` and transparent glue 40`, the transparent glue 40` covers the light emitting element 20`, the light exit surface of the transparent glue 40` is curved. And, the light emitting element 20 in the packaging device 01 is an unpackaged LED chip, the light emitting element 20` in the packaging structure 02 is an unpackaged LED chip.

[0121] In the lamp board 100 provided in this application embodiment, the encapsulation substrate 10 in the encapsulation device 01 can maintain the same structure as the encapsulation substrate 10' in the encapsulation structure 02, the light-emitting element 20 in the encapsulation device 01 can maintain the same structure as the light-emitting element 20' in the encapsulation structure 02, the structure of the transparent adhesive 40 in the encapsulation device 01 can maintain the same structure as the transparent adhesive 40' in the encapsulation structure 02, and the light-emitting element 20 in the encapsulation device 01 is not affected by the driving element 30. The light emission height of the encapsulation device 01 and the light emission height of the encapsulation structure 02 are consistent. Therefore, the light emission effect of the encapsulation device 01 and the light emission effect of the encapsulation structure 02 can be made to be consistent, which is beneficial to improving the optical effect of the lamp board 100. Based on this, since the transparent adhesive 40 in the encapsulation device 01 does not cover the driving element 30, and the light-emitting element 20 in the encapsulation device 01 and the light-emitting element 20' in the encapsulation structure 02 are both unencapsulated LED chips, the dispensing process of the transparent adhesive can be used as the encapsulation process for the LED chips. Therefore, after the encapsulation device 01 and the encapsulation structure 02 complete the encapsulation process corresponding to the dispensing of transparent adhesive together, they can perform sorting operations together to screen out defective products. After that, the mounting of the driving element 30 in the encapsulation device 01 can be completed, which can greatly improve production efficiency, avoid waste of the driving element 30, and reduce production costs.

[0122] Figure 21 For along Figure 16 The diagram shows the film structure of the lamp panel cut along the CD line. (Combined with...) Figure 16 and Figure 21 As shown, the encapsulation device 01 and the encapsulation structure 02 are disposed on the substrate 03. The encapsulation device 01 includes an encapsulation substrate 10, a light-emitting element 20, a driving element 30, and a transparent adhesive 40. The light-emitting element 20 includes a carrier plate 24, an LED chip 21, and an encapsulating adhesive 22. The carrier plate 24 is welded and fixed to the encapsulation substrate 10. The LED chip 21 is disposed on the side of the carrier plate 24 away from the encapsulation substrate 10. The encapsulating adhesive 22 covers the LED chip 21. The encapsulation structure 02 is a light-emitting element 20'. The light-emitting element 20' includes a carrier plate 24', an LED chip 21', and an encapsulating adhesive 22'. The carrier plate 24' is welded and fixed to the substrate 03. The LED chip 21' is disposed on the side of the carrier plate 24' away from the substrate 03. The encapsulating adhesive 22' covers the LED chip 21'.

[0123] In the lamp panel 100 provided by the embodiments of the present application, the carrier plate 24 can raise the height of the LED chip 21, so that the packaging device 01 can realize that the LED chip 21 and the driving element 30 are not overlapped in the direction parallel to the first surface 101, so that the light emitting element 20 in the packaging device 01 is not affected by the driving element 30, thereby improving the dark area problem and making the lamp panel 100 have more uniform optical effect. On this basis, since the light emitting element 20 in the packaging device 01 and the packaging structure 02 are both near-chip-level packaging bodies including the carrier plate 24, independent sorting can be completed to ensure the light emitting quality thereof; in addition, the light emitting element 20 in the packaging device 01 can be consistent with the structure of the packaging structure 02, that is, corresponding to the same material, so that the material cost can be reduced, the process steps can be simplified, and the production efficiency can be improved.

[0124] Figure 22 To the left of the EF line profile shown in the figure Figure 17 The film layer structure diagram of the lamp panel profiled along the EF line shown in the figure. In combination with Figure 17 and Figure 22 In some embodiments of the present application, the packaging device 01 includes a packaging substrate 10, a light emitting element 20, a driving element 30 and a transparent adhesive 40, the light emitting element 20 includes an LED chip 21 and a packaging glue 22, the LED chip 21 can be a blue light LED chip, and the packaging glue 22 can be a color conversion glue layer, the color conversion glue layer includes color conversion material and silicone, the color conversion material can be fluorescent powder or quantum dot material, the driving element 30 includes a driving chip 31 and a reflective glue 32, the reflective glue 32 covers the driving chip 31, the reflective glue 32 includes at least one inclined side wall 321, in the direction that the second surface 102 deviates from the first surface 101, the distance between the inclined side wall 321 and the light emitting element 20 adjacent thereto gradually increases; the packaging structure 02 is a light emitting element 20', the light emitting element 20' includes an LED chip 21' and a packaging glue 22', the LED chip 21' can be a blue light LED chip, and the packaging glue 22' can be a color conversion glue layer, the color conversion glue layer includes color conversion material and silicone, and the color conversion material can be fluorescent powder or quantum dot material.

[0125] The lamp panel 100 provided by the embodiments of the present application can adjust the reflection angle of the side-emitted light of the LED chip 21 by the inclined side wall 321, adjust the side-emitted light to large-angle emitted light, and make the large-angle emitted light emit from the packaging device 01, thereby further weakening the dark area effect and improving the optical uniformity of the lamp panel 100. On this basis, the light emitting element 20 in the packaging device 01 and the packaging structure 02 are both chip-level packaging bodies, and the light emitting element 20 in the packaging device 01 and the packaging structure 02 can also be independently sorted to ensure the light emitting quality. In addition, the light emitting element 20 in the packaging device 01 can be consistent with the structure of the packaging structure 02, that is, corresponding to the same material, thereby reducing the material cost, simplifying the process steps, and improving the production efficiency.

[0126] In a third aspect, the embodiments of the present application provide a display device, which comprises the lamp panel 100.

[0127] In some embodiments of the present application, the display device can be a liquid crystal display device, which comprises a backlight module and a liquid crystal display panel, and the backlight module comprises the lamp panel 100.

[0128] In some embodiments of the present application, the display device can be an LED direct display display device, and the packaging device 01 in the lamp panel 100 can be used as a display pixel to directly perform the display function.

[0129] In summary, the present application provides a packaging device integrating light driving, a lamp panel, and a display device. The packaging device comprises a packaging substrate, a light emitting element, and a driving element. The packaging substrate has opposite first and second surfaces. The light emitting element is electrically connected to the packaging substrate. The driving element is electrically connected to the packaging substrate. The light emitting element and the driving element are arranged on the side of the second surface away from the first surface. The orthographic projection of the driving element on the second surface and the orthographic projection of the light emitting element on the second surface do not overlap. The distance between the surface of the side of the light emitting element away from the packaging substrate and the first surface is greater than the distance between the surface of the side of the driving element away from the packaging substrate and the first surface. The present application can improve the yield, reduce the influence of the driving element on the side light emission of the light emitting chip, improve the optical uniformity of the lamp panel, and improve the display quality while considering the production cost.

[0130] The above has carried on the detailed introduction to the light drive integrated packaging device, the lamp panel and the display device provided by the embodiment of the application, the principle and the implementation mode of the application are described in the text by applying specific examples; the above embodiment is only used for helping understanding the method of the application and its core idea; meanwhile, for the person skilled in the art, according to the idea of the application, the specific implementation mode and the application range will have the change; in view of the above, the content of the specification should not be understood as the limitation of the application.

Claims

1. A packaged device, comprising: The package device comprises: a package substrate having opposite first and second surfaces; a light emitting element electrically connected to the package substrate; a driving element electrically connected to the package substrate; wherein the first surface exposes an electrical signal adapter port of the light emitting element and the driving element, the light emitting element and the driving element are arranged on a side of the second surface away from the first surface, a projection of the driving element on the second surface and a projection of the light emitting element on the second surface do not overlap, and a distance between a surface of the light emitting element away from the package substrate and the first surface is greater than a distance between a surface of the driving element away from the package substrate and the first surface; wherein the light emitting element comprises an LED chip, and the LED chip and the driving element do not overlap in a direction parallel to the first surface.

2. The packaged device of claim 1, wherein, The package device further comprises a pad layer, and the LED chip is electrically connected to the package substrate through the pad layer, wherein the pad layer is arranged between the LED chip and the package substrate.

3. The packaged device of claim 1, wherein, The thickness of the package substrate is greater than the thickness of the driving element, and the package substrate is provided with a groove on a side of the second surface away from the first surface, and the driving element is accommodated in the groove.

4. The packaged device of claim 1, wherein, The light emitting element comprises a carrier plate, an LED chip and a package glue, the carrier plate is welded and fixed to the package substrate, the LED chip is arranged on a side of the carrier plate away from the package substrate, and the package glue covers the LED chip.

5. The packaging device according to any one of claims 1 to 4, wherein The package device further comprises transparent glue, and the transparent glue covers the light emitting element and the driving element.

6. The packaged device of any one of claims 1 to 4, wherein, The package device further comprises transparent glue, and the transparent glue covers the light emitting element, and a projection of the transparent glue on the package substrate and a projection of the driving element on the package substrate do not overlap, wherein an outlight surface of the transparent glue is a curved surface.

7. A light panel characterized in that, The lamp panel comprises a substrate, a plurality of package structures and a plurality of package devices as claimed in any one of claims 1 to 6, and the plurality of package structures and the plurality of package devices are arranged on the same side of the substrate; wherein the package structure comprises a light emitting element, the light emitting element in the package structure and the light emitting element in the package device have the same light emitting color, and the light emitting element in the package structure is electrically connected to the driving element in one of the package devices.

8. A display device, characterized by comprising: The display device comprises the lamp panel as claimed in claim 7.

Images