Plating device and plating method

Abstract

The transfer of the shape and movement of components disposed between a substrate and an anode to a plated film is suppressed or prevented. The plating apparatus comprises: a plating tank for holding a plating solution; a substrate holder for holding the substrate with the plated surface facing downward; an anode disposed opposite the substrate; a diaphragm disposed between the substrate and the anode; and a diaphragm support portion for pressing the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape disposed outside the plurality of openings of the first shape, wherein the center of a circumscribed circle including the plurality of openings of the first shape is eccentric from the rotation center of the substrate holder.

Description

Technical Field

[0001] The present invention relates to a plating apparatus and a plating method. Background Art

[0002] As a plating apparatus capable of plating a substrate, a so-called face-down or cup-type plating apparatus is known, as described in International Publication No. 2003 / 079684 (Patent Document 1). This plating apparatus comprises a plating tank that stores the plating solution and contains an anode, and a substrate holder (also called a plating head) positioned above the anode to hold the substrate, which serves as a cathode.

[0003] In such a face-down plating apparatus, the anode is structurally located at the bottom of the plating tank. Therefore, maintenance operations such as anode replacement require the removal of all components above the anode. This series of operations results in poor workability, time consumption, and reduced operating efficiency of the plating apparatus. To address this issue, International Publication No. 2003 / 079684 (Patent Document 1) employs a structure in which a pull-out unit is provided for pulling the anode out of the plating tank, and the anode is disposed within the pull-out unit.

[0004] Patent Document 1: International Publication No. 2003 / 079684

[0005] However, in addition to the anode, a membrane (diaphragm) is sometimes also provided in the plating tank, which is arranged above the anode and divides the anode chamber on the anode side and the cathode chamber on the substrate side. The diaphragm seals the plating solutions of the anode chamber and the cathode chamber from each other, and allows the metal ions in the plating solution to pass from the anode chamber to the cathode chamber, while preventing the additives in the plating solution from passing from the cathode chamber to the anode chamber. Such a diaphragm is a consumable part that needs to be replaced regularly, but since it is arranged below the components on the substrate holder side such as the resistor and the paddle, and is installed in the plating tank via a closed structure so that the chambers are separated and sealed from each other, there is a problem of troublesome removal and installation during replacement. In addition, since the diaphragm and the anode are separated, there is a concern that the height dimension of the integrated unit will become larger.

[0006] In addition, from the perspective of improving the quality of the plated film formed on the substrate, it is necessary to suppress or prevent the shape and movement of the components arranged between the substrate and the anode from being transferred to the plated film. In addition, from the perspective of improving the quality of the plated film, it is also necessary to pay attention to reducing the residual bubbles in the cathode chamber. Summary of the Invention

[0007] The present invention aims to solve at least part of the above-mentioned problems. One of the objects of the present invention is to facilitate the maintenance of a diaphragm and the like arranged in a face-down plating device. In addition, one of the objects of the present invention is to facilitate the installation of a diaphragm in a plating tank in a face-down plating device. In addition, one of the objects of the present invention is to easily and reliably seal each chamber in a plating tank by a diaphragm in a face-down plating device. One of the objects of the present invention is to suppress or prevent the shape, movement, etc. of each component arranged between a substrate and an anode from being transferred to a plating film. One of the objects of the present invention is to reduce the residual bubbles in the cathode chamber.

[0008] According to one aspect of the present invention, a plating device is provided, which comprises: a plating tank for holding a plating liquid; a substrate holder for holding a substrate with a plated surface facing downward; an anode arranged opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape arranged outside the plurality of openings of the first shape, the center of a circumscribed circle including the plurality of openings of the first shape being eccentric from the rotation center of the substrate holder.

[0009] In addition, according to one aspect of the present invention, a plating device is provided, which comprises: a plating tank for holding a plating liquid; a substrate holder for holding a substrate; an anode arranged opposite to the above-mentioned substrate; a diaphragm arranged between the above-mentioned substrate and the above-mentioned anode; and a diaphragm support portion for pressing the above-mentioned diaphragm, the diaphragm support portion having a surface and a back surface, and having a plurality of beams for defining a plurality of openings passing through the above-mentioned surface and the above-mentioned back surface, and at least a portion of the above-mentioned beams are chamfered on the above-mentioned back surface side in contact with the above-mentioned diaphragm.

[0010] According to one aspect of the present invention, a plating method is provided, which is a plating method for plating a substrate with the plated surface facing downward, wherein a plating tank is prepared, the plating tank comprising: an anode opposite to the above-mentioned substrate; a diaphragm arranged between the above-mentioned substrate and the above-mentioned anode; and a diaphragm support portion pressing the upper surface of the above-mentioned diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape arranged on the outside of the plurality of openings of the first shape, and the above-mentioned substrate is plated while being rotated in a state in which the rotation center of the above-mentioned substrate is eccentric from the center of the circumscribed circle of the above-mentioned plurality of openings of the first shape including the above-mentioned diaphragm support portion.

[0011] In addition, according to one aspect of the present invention, a plating method is provided, which is a plating method for plating a substrate, wherein a plating tank is prepared, the plating tank having: an anode opposite to the above-mentioned substrate; a diaphragm arranged between the above-mentioned substrate and the above-mentioned anode; and a diaphragm support portion for pressing the above-mentioned diaphragm, the diaphragm support portion having a plurality of beams with predetermined plurality of openings, at least a portion of the above-mentioned beams being chamfered on the side in contact with the above-mentioned diaphragm, and the above-mentioned substrate is plated using the above-mentioned plating tank. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a perspective view showing the overall structure of a plating apparatus according to one embodiment.

[0013] Figure 2 It is a plan view showing the overall structure of a plating apparatus according to one embodiment.

[0014] Figure 3 This is a perspective view of the plating module viewed from the front and bottom.

[0015] Figure 4 It is a perspective view of a longitudinal section of a plating module.

[0016] Figure 5 is a perspective view of a cross section of a plating module.

[0017] Figure 6A This is an enlarged perspective view showing a portion of the anode holder assembly.

[0018] Figure 6B It is an explanatory diagram for explaining the mounting structure of the separator and the anode.

[0019] Figure 7 It is a perspective view of a longitudinal section of the plating module at the cathode liquid inlet.

[0020] Figure 8 is a top view of the anode holder assembly.

[0021] Figure 9 This is a perspective view of the anode holder assembly as viewed from above.

[0022] Figure 10 This is a perspective view of the anode holder assembly as viewed from below.

[0023] Figure 11 This is a perspective view of the anode holder assembly viewed from below with the anode fixing plate made transparent.

[0024] Figure 12 It is a bottom view of the diaphragm support portion.

[0025] Figure 13A This is a perspective view showing an enlarged portion of the diaphragm support portion.

[0026] Figure 13B This is a perspective view showing a further enlarged portion of the diaphragm support portion. DETAILED DESCRIPTION

[0027] The following describes a plating apparatus 1000 according to an embodiment of the present invention with reference to the accompanying drawings. The accompanying drawings are schematic illustrations for easier understanding of the features of the objects, and the dimensional ratios of the various components may differ from actual dimensions. In some drawings, X-Y-Z orthogonal coordinates are shown for reference purposes. In these orthogonal coordinates, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts).

[0028] Figure 1 It is a perspective view showing the overall structure of the plating apparatus 1000 according to the present embodiment. Figure 2 1 is a top view showing the overall structure of the plating apparatus 1000 of this embodiment. Figure 1 as well as Figure 2 As shown, the plating apparatus 1000 includes a loading port 100 , a transfer robot 110 , an aligner 120 , a pre-wet module 200 , a pre-preg module 300 , a plating module 400 , a cleaning module 500 , a spin cleaning and drying device 600 , a transfer device 700 , and a control module 800 .

[0029] The loading port 100 is a module for loading wafers (substrates) housed in a box such as a FOUP (not shown) into the plating device 1000, or for unloading substrates from the plating device 1000 to a box. In the present embodiment, four loading ports 100 are arranged in a horizontal direction, but the number and configuration of the loading ports 100 are arbitrary. The transport robot 110 is a robot for transporting substrates, and is configured to transfer substrates between the loading port 100, the aligner 120, the pre-wetting module 200, and the spin cleaning dryer 600. When the transport robot 110 and the transport device 700 transfer substrates between the transport robot 110 and the transport device 700, the substrates can be transferred via a temporary placement table (not shown).

[0030] The aligner 120 is a module used to align the orientation plane, recess, and other positions of the substrate in a specified direction. In this embodiment, two aligners 120 are arranged in a horizontal direction, but the number and configuration of the aligners 120 are arbitrary. The pre-wet module 200 wets the plated surface of the substrate before plating with a treatment liquid such as pure water or degassed water, thereby replacing the air inside the pattern formed on the surface of the substrate with the treatment liquid. The pre-wet module 200 is configured to replace the treatment liquid inside the pattern with the plating liquid during plating, thereby implementing a pre-wet treatment that facilitates the supply of plating liquid to the interior of the pattern. In this embodiment, two pre-wet modules 200 are arranged in a vertical direction, but the number and configuration of the pre-wet modules 200 are arbitrary.

[0031] The prepreg module 300 is configured to perform a prepreg treatment, which uses a treatment solution such as sulfuric acid or hydrochloric acid to etch away a highly resistive oxide film formed on the surface of the seed layer on the plated surface of the substrate before the plating treatment, thereby cleaning or activating the surface of the plated base. In this embodiment, two prepreg modules 300 are arranged in a vertical direction, but the number and arrangement of the prepreg modules 300 are arbitrary. The plating module 400 performs a plating treatment on the substrate. In this embodiment, there are two groups of 12 plating modules 400, each of which is arranged in a vertical direction with three modules and in a horizontal direction with four modules, for a total of 24 plating modules 400, but the number and arrangement of the plating modules 400 are arbitrary.

[0032] The cleaning module 500 is configured to perform a cleaning process on the substrate in order to remove the plating liquid and the like remaining on the substrate after the plating process. In the present embodiment, two cleaning modules 500 are arranged in an up-down direction, but the number and configuration of the cleaning modules 500 are arbitrary. The spin cleaning dryer 600 is a module for rotating the substrate after the cleaning process at high speed to dry the substrate. In the present embodiment, two spin cleaning dryers 600 are arranged in an up-down direction, but the number and configuration of the spin cleaning dryers 600 are arbitrary. The transport device 700 is a device for transporting substrates between multiple modules in the plating device 1000. The control module 800 is configured to control multiple modules of the plating device 1000, and can be composed of, for example, a conventional computer or a dedicated computer having an input / output interface for input / output with an operator.

[0033] An example of a series of plating processes performed by plating apparatus 1000 will be described. First, a substrate stored in a cassette is loaded into loading port 100. Next, transport robot 110 removes the substrate from the cassette in loading port 100 and transports it to aligner 120. Aligner 120 aligns the substrate's orientation flats, notches, and other positions in a predetermined direction. Transport robot 110 delivers the substrate, aligned by aligner 120, to pre-wetting module 200.

[0034] The pre-wet module 200 performs a pre-wet treatment on the substrate. The transport device 700 transports the pre-wet treated substrate to the prepreg module 300. The prepreg module 300 performs a pre-preg treatment on the substrate. The transport device 700 transports the pre-preg treated substrate to the plating module 400. The plating module 400 performs a plating treatment on the substrate.

[0035] The transport device 700 transports the plated substrate to the cleaning module 500. The cleaning module 500 cleans the substrate. The transport device 700 transports the cleaned substrate to the spin-clean-dryer 600. The spin-clean-dryer 600 dries the substrate. The transport robot 110 receives the substrate from the spin-clean-dryer 600 and transports the dried substrate to the cassette at the load port 100. Finally, the cassette containing the substrate is unloaded from the load port 100.

[0036] also, Figure 1 、 Figure 2 The structure of the plating apparatus 1000 described in the embodiment is only an example, and the structure of the plating apparatus 1000 is not limited to Figure 1 、 Figure 2 structure.

[0037] [Plating Module]

[0038] Next, the plating module 400 will be described. In addition, since the plurality of plating modules 400 included in the plating apparatus 1000 according to the present embodiment have the same structure, one plating module 400 will be described.

[0039] Figure 3 This is a perspective view of the plating module viewed from the front and bottom. Figure 4 It is a perspective view of a longitudinal section of a plating module. Figure 5 is a perspective view of a cross section of a plating module. Figure 6A This is an enlarged perspective view showing a portion of the anode holder assembly. Figure 6B It is an explanatory diagram for explaining the mounting structure of the separator and the anode. Figure 7 It is a perspective view of a longitudinal section of the plating module at the cathode liquid inlet. Figure 8 is a top view of the anode holder assembly. Figure 9 This is a perspective view of the anode holder assembly as viewed from above. Figure 10 This is a perspective view of the anode holder assembly as viewed from below. Figure 3 The direction indicated by the arrow Y in represents the front-rear direction of the plating module 400 , with the front plate (cover) 640 side of the anode holder 610 being the front side and the opposite side being the rear side.

[0040] like Figure 4As shown, the plating apparatus 1000 according to this embodiment is a face-down type or cup type plating apparatus, which holds the substrate Wf horizontally for plating. The plating module 400 of the plating apparatus 1000 according to this embodiment mainly includes: a plating tank 10; a substrate holder 20, also known as a plating head, which holds the substrate Wf; a rotation mechanism, a tilting mechanism, and a lifting mechanism (not shown) for rotating, tilting, and lifting the substrate holder 20; a diaphragm 50 for dividing the interior of the plating tank 10 into a cathode chamber Cc and an anode chamber Ca; and an anode 60, which is arranged below the substrate Wf and opposite to the substrate Wf. The tilting mechanism can also be omitted.

[0041] The plating tank 10 according to this embodiment comprises a bottomed container with an upper opening. The plating tank 10 according to this embodiment includes an upper tank 11 and a lower tank 12. The upper tank 11 and the lower tank 12 form a generally cylindrical interior space for storing the plating solution. The plating solution may be a solution containing ions of the metal element that forms the plated film, and the specific example is not particularly limited. In this embodiment, copper plating is used as an example of a plating process, and a copper sulfate solution is used as an example of a plating solution. Furthermore, in this embodiment, the plating solution contains predetermined additives. However, this configuration is not limiting, and the plating solution may also be configured to not contain additives.

[0042] Inside the plating tank 10, a paddle 30 is positioned near the substrate Wf. The paddle 30 reciprocates approximately parallel to the surface of the substrate Wf being plated, generating a strong flow of the plating solution on the surface of the substrate Wf. This homogenizes the ions in the plating solution near the surface of the substrate Wf, improving the in-plane uniformity of the plated film formed on the surface of the substrate Wf.

[0043] Inside the plating tank 10, a porous resistor 40 is arranged below the paddle 30. Specifically, the resistor 40 is composed of a porous plate component having a plurality of holes (pores). The plating liquid on the lower side of the resistor 40 can pass through the resistor 40 and flow on the upper side of the resistor 40. The resistor 40 is a component provided to achieve uniformity of the electric field formed between the anode 60 and the substrate Wf. By arranging such a resistor 40 in the plating tank 10, it is possible to easily achieve uniformity of the film thickness of the plating film (plating layer) formed on the substrate Wf. In addition, the resistor 40 is not a necessary structure in this embodiment, and the present embodiment can also be configured to not have the resistor 40.

[0044] In this embodiment, the anode holder assembly 6 is arranged in the lower tank 12 of the plating tank 10. The anode holder assembly 6 includes a diaphragm 50, an anode 60, and a variable anode mask 650. That is, by inserting and mounting the anode holder assembly 6 in the plating tank 10, the diaphragm 50, the anode 60, and the variable anode mask 650 are arranged in the plating tank 10.

[0045] In this embodiment, the diaphragm 50 and the anode 60 are arranged below the variable anode mask 650 in the plating tank 10 ( Figure 5 、 Figure 6A ). In the present embodiment, a structure is adopted in which the anode 60 is closely arranged below the diaphragm 50. The diaphragm 50 divides the interior of the plating tank 10 into an anode chamber Ca (a chamber on the lower side of the diaphragm 50) and a cathode chamber Cc (a chamber on the upper side of the diaphragm 50) in the upper and lower parts. The diaphragm 50 is composed of, for example, overlapping neutral membranes and ion exchange membranes. The structure of the diaphragm 50 is an example, and other structures can be adopted. The diaphragm 50 is fixed to the holder body 620 (the outer periphery of the diaphragm 50) from below by means of a sealing pressure ring 51 in a state in which the seal 704 is sandwiched between the outer periphery of the diaphragm 50 and the outer periphery of the holder body 620 / anode holder 610 (the annular portion 621). Figure 6A 、 Figure 6B ). A sealing surface 704A is formed between the lower surface of the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 and the upper surface of the outer periphery of the diaphragm 50. The seal 704 can be arranged, for example, in a sealing groove that is provided in an annular shape over the entire circumference of the lower surface of the annular portion 621 of the holder body 620 / anode holder 610. In this way, in the present embodiment, it is possible to configure a structure in which the plating tank 10 in the anode holder assembly 6 can be divided into an upper and lower part by the diaphragm 50. Therefore, if the outer periphery (annular portion 621) of the seal holder body 620 / anode holder 610 is sealed and the plating tank 10, the plating tank 10 becomes a structure divided into an anode chamber Ca and a cathode chamber Cc with the diaphragm 50 as the boundary.

[0046] Anolyte (plating solution) is supplied to the anode chamber Ca from an anolyte inlet 12C provided on the bottom wall of the plating tank 10 and discharged, for example, from an anolyte outlet (not shown) provided on the side wall of the plating tank 10. Catholyte (plating solution) is supplied to the cathode chamber Cc from a catholyte inlet 680 and discharged from a catholyte outlet (not shown). Plating solution (catholyte) containing additives such as accelerators is supplied to the cathode chamber Cc, while plating solution (catholyte) containing no additives or a low additive concentration is introduced into the anode chamber Ca. The diaphragm 50 allows metal ions in the plating solution to pass from the anode chamber Ca to the cathode chamber Cc, while preventing additives in the plating solution from passing from the cathode chamber Cc to the anode chamber Ca.

[0047] The anode 60 is disposed in close contact with the lower surface of the separator 50. The specific type of the anode 60 is not particularly limited, and a soluble anode or an insoluble anode can be used. In this embodiment, an insoluble anode is used as the anode 60. The specific type of the insoluble anode is not particularly limited, and platinum, iridium oxide, etc. can be used.

[0048] In this embodiment, a variable anode mask 650 is provided on the upper surface side (substrate Wf side) of the anode 60 and the diaphragm 50. The variable anode mask 650 has an opening portion that exposes the anode 60 inside the blade 651, and is an electric field adjustment component that adjusts the electric field from the anode 60 toward the substrate Wf by adjusting the exposed range of the anode 60 using the blade 651. Figure 5 As shown, the variable anode mask 650 of this embodiment includes a plurality of blades 651 and adjusts the size of the opening that exposes the anode 60 using a mechanism similar to the aperture of a camera.

[0049] <Anode Holder Assembly>

[0050] The following describes the details of the anode holder assembly (also referred to as a pull-out unit) 6. In this embodiment, the diaphragm 50, the anode 60, and the variable anode mask 650 are mounted on the anode holder 610, and these are integrally formed as the anode holder assembly 6 ( Figure 3 、 Figure 4 In other embodiments, the variable anode mask 650 may be omitted or provided separately from the anode holder assembly 6. The anode holder assembly 6 is installed in the plating tank 10 (lower tank 12) in a removable manner. Figure 3 as well as Figure 4 As shown, the anode holder assembly 6 is inserted into the plating tank 10 from an opening 12B provided on the front side of the plating tank 10, thereby being mounted on the plating tank 10. The opening 12B of the plating tank 10 is blocked by the front plate (cover) 640 of the anode holder 610 and is sealed liquid-tightly by seals 702 and 703 (described later).

[0051] The anode holder assembly 6 includes an anode holder 610, a diaphragm 50 attached to the anode holder 610, an anode 60, and a variable anode mask 650. In other embodiments, the variable anode mask 650 may be omitted or provided separately from the anode holder assembly 6.

[0052] (Anode Holder)

[0053] The anode holder 610 includes a holder body 620 and a front plate 640. The holder body 620 holds the diaphragm 50, the anode 60, and the variable anode mask 650. The front plate 640 blocks the opening 12B of the plating tank 10 and seals the interior of the plating tank 10 liquid-tightly from the outside. The holder body 620 is the main part of the anode holder 610. Therefore, the outer periphery of the anode holder 610 refers to the outer periphery of the holder body 620, and the outer periphery of the holder body 620 refers to the outer periphery of the anode holder 610.

[0054] Retainer body

[0055] The holder body 620 includes an annular portion 621, a diaphragm support portion 622 integrally provided inside the annular portion 621, and a flange 623 provided on the upper surface of the annular portion 621. The annular portion 621 and the flange 623 constitute the outer periphery of the holder body 620 / anode holder 610. The annular portion 621 and the flange 623 may be collectively referred to as the outer periphery of the holder body 620 / anode holder 610, or individually as the outer periphery of the holder body 620 / anode holder 610.

[0056] like Figure 4 As shown, the annular portion 621 is formed as the lower portion of the outer periphery of the holder body 620 / anode holder 610, and a diaphragm support portion 622 is arranged inside the annular portion. The diaphragm support portion 622 has a plurality of openings that expose the diaphragm 50 (the region corresponding to the anode 60). In other embodiments, the diaphragm support portion 622 may be omitted, and the diaphragm support portion 622 may be a single opening.

[0057] like Figure 8 as well as Figure 9 As shown, the diaphragm support portion 622 is a mesh portion including a plurality of openings, such as Figure 4 as well as Figure 5 As shown in FIG, it contacts the upper surface of the diaphragm 50 and supports the diaphragm 50 from above. Figure 4 as well as Figure 5 As shown, the diaphragm support portion 622 comprises: a honeycomb structure (inside the circumscribed circle Rm), in which beams 622A arranged in a hexagonal shape are arranged in a honeycomb shape and have a plurality of honeycomb-shaped openings; and a plurality of beams 622B extending radially, connected from the outermost vertex of the honeycomb structure to the annular portion 621 of the retainer body 620 / anode retainer 610. Figure 8 The Rm in the figure represents the circumscribed circle of the honeycomb structure, and the inner side of the circumscribed circle Rm represents the roughly honeycomb structure. The circumscribed circle Rm corresponds to the roughly outer shape (projected shape) of the substrate Wf. Figure 8As shown, the center of the honeycomb structure, i.e., the center Cm of the circumscribed circle Rm, is offset from the rotation center / rotation axis Cw of the substrate holder 20 (substrate Wf). This structure prevents the plated film formed on substrate Wf from picking up the pattern of the diaphragm support portion 622, thereby suppressing or preventing a decrease in the uniformity of the plated film thickness. If the center Cm of the honeycomb structure is not offset (offset) from the rotation center Cw of substrate Wf, even if substrate Wf is rotated, there is a high probability that a region with a high degree of electric field shielding by beams 622A will form.

[0058] The flange 623 constitutes the upper portion of the outer periphery of the holder body 620 / anode holder 610 and constitutes an installation portion for installation into the plating tank 10. Figure 8 as well as Figure 9 As shown, the flange 623 is an annular component having an opening in the center portion that exposes the diaphragm 50 (the area corresponding to the anode 60). The flange 623 is firmly and liquid-tightly fixed to the annular portion 621 of the holder body 620 / anode holder 610 by using a fixing method using a fastening component, welding, joining, etc. A seal may be arranged between the flange 623 and the annular portion 621 to fix the two liquid-tightly. In this embodiment, although the flange 623 and the annular portion 621 are provided independently, in the case where the variable anode mask 650 is not mounted on the anode holder 610, the flange 623 and the annular portion 621 may be provided integrally. An annular sealing groove is formed on the upper surface of the flange 623 over the entire circumference, and an annular seal 701 is arranged in the sealing groove. In this embodiment, as Figure 4 As shown in FIG. 1 and FIG. 2 , an annular protrusion slightly higher than other portions is provided on the inner portion of the upper surface of the flange 623 , and a seal 701 is arranged on the annular protrusion.

[0059] ·Front panel

[0060] like Figure 3 as well as Figure 4 As shown, the front panel 640 includes a front panel body 641 and a frame member 642. The frame member 642 is fitted to the outer peripheral surface of the front panel body 641 so as to be movable in the front-back direction relative to the front panel body 641. The front panel body 641 and the frame member 642 are fitted together with a strength that does not fall off from each other. Figure 4As shown, an annular seal 703 is disposed on the outer circumference of the front plate body 641, for example, extending throughout the entire circumference. The seal 703 provides a liquid-tight seal between the front plate body 641 and the frame member 642. The seal 703 is, for example, disposed within an annular seal groove extending throughout the entire circumference of the outer circumference of the front plate body 641. The seal 703 may also be disposed within an annular seal groove extending throughout the entire circumference of the inner circumference of the frame member 642. A flange 12A protruding downward and laterally is disposed around the opening 12B of the lower tank 12 of the plating tank 10. An annular seal 702 is disposed around the opening 12B on the front surface of the flange 12A, extending throughout the entire circumference. The seal 702 is, for example, disposed within an annular seal groove extending throughout the entire circumference of the opening 12B on the front surface of the flange 12A. The flange 12A constitutes a portion of the lower tank 12, but may be integrally provided with the lower tank 12, or may be provided independently of the other portions of the lower tank 12 and fixed fluid-tightly to the other portions by means of fastening members, welding, bonding, or the like. Furthermore, the seal 702 may be disposed within an annular seal groove formed over the entire circumference of the rear surface of the frame member 642.

[0061] In addition, the flange 12A may be omitted on the side wall (front surface) of the lower groove 12 as long as a sufficient area for the frame member 642 of the front plate 640 to abut against is ensured.

[0062] like Figure 3 as well as Figure 4 As shown in FIG. 1 , front plate 640 is fixed to the flange 12A of lower groove 12 by a plurality of fastening components 802 that run through frame member 642. Fastening component 802 can be bolt, screw, other arbitrarily fastening components. But, from the viewpoint of safeguarding anode holder assembly 6 (anode holder 610), be preferably parts that are easily disassembled. The frame member 642 of front plate 640 is fixed to the flange 12A of plating tank 10 by fastening component 802, is sealed by sealant 702 between frame member 642 and the flange 12A. At this moment, frame member 642 moves in the front-back direction relative to front plate main body 641, can make sealant 702 suitably elastically deformed, can give play to the sealing performance of sealant 702 fully. As a result, when the anode holder 610 (anode holder assembly 6 ) is mounted in the plating tank 10 , the interior of the plating tank 10 is sealed liquid-tightly from the outside by the seal 702 between the front plate 640 of the anode holder 610 and the flange 12A of the plating tank 10 .

[0063] (diaphragm)

[0064] On the lower surface of the outer periphery (annular portion 621) of the holder body 620 / anode holder 610, as shown in FIG. Figure 4 、 Figure 6A As shown, the outer periphery of the diaphragm 50 is mounted via a seal 704. Figure 6A As shown, a plurality of fastening members 803 pass through the sealing ring 51, the diaphragm 50, and the seal 704 and are screwed into the annular portion 621. As a result, the outer periphery of the diaphragm 50 is attached to the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 while being sealed by the seal 704. The seal 704 can be arranged, for example, in a sealing groove ( Figure 6A The plurality of fastening members 803 may be bolts, screws, or any other fastening members, and may be evenly distributed over the entire circumference of the sealing ring 51. The diaphragm support portion 622 and the annular portion 621 may also be collectively referred to as a diaphragm support portion.

[0065] (anode)

[0066] like Figure 6B As shown, the anode 60 is mounted on the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 in such a manner that the anode fixing plate 62 and the diaphragm pressing piece 810 are in close contact with the lower surface of the diaphragm 50. The anode 60 is supported from below and held in a predetermined position by a plurality of diaphragm pressing pieces 810 that penetrate the anode fixing plate 62 and abut against the lower surface of the anode 60 and press the anode 60 against the diaphragm 50. At this time, although Figure 6A as well as Figure 6B 5. However, since the upper surface of the diaphragm 50 is supported by the diaphragm support portion 622 ( Figure 5 The anode fixing plate 62 is pressed from above, so that the diaphragm 50 and the anode 60 are sandwiched and held by the upper diaphragm support portion 622 and the lower diaphragm pressing piece 810. The anode fixing plate 62 is also called a back plate.

[0067] The diaphragm pressing member 810 can be a bolt, a spacer, or any other supporting member. Figure 6B In order to emphasize the gap between the anode 60 and the anode fixing plate 62 formed by the plurality of diaphragm pressing members 810 , a schematic diagram is shown.

[0068] like Figure 6A As shown, the anode fixing plate 62 is outside the sealing pressure ring 51 through a plurality of spacers 804A ( Figure 6AThe anode fixing plate 62 is secured to the outer periphery (annular portion 621) of the holder body 620 / anode holder 610 by a plurality of fastening members 804 that penetrate the anode fixing plate 62 and the spacer 804A and are screwed into the annular portion 621. As a result, gaps are formed between the outer periphery of the holder body 620 / anode holder 610 and the anode fixing plate 62 (between the sealing ring 51 and the anode fixing plate 62, and between the annular member 621 and the anode fixing plate 62). These gaps allow gas (e.g., oxygen) generated at the anode 60 to migrate to the outside of the holder body 620 / anode holder 610.

[0069] The plurality of fastening members 804 may be bolts, screws, or any other fastening members, and may be evenly arranged around the entire circumference of the outer side of the sealing ring 51 .

[0070] like Figure 6B As shown, a predetermined gap is formed between the lower surface of the anode 60 and the anode fixing plate 62 by the front end of the diaphragm pressure piece 810. Furthermore, gaps are provided at one or more circumferential locations on the outer periphery of the anode 60, between the sealing pressure ring 51 and the anode fixing plate 62, and between the annular member 621 and the anode fixing plate 62. These gaps allow gas accumulated between the lower surface of the anode 60 and the anode fixing plate 62 to be discharged to the outside. The anode fixing plate (back plate) 62 has the function of regulating the amount of gas accumulated on the lower surface of the anode 60 to a predetermined amount, thereby preventing a large amount of gas from simultaneously escaping from the lower surface of the anode, which would cause a voltage fluctuation at the anode. This can prevent a decrease in the uniformity of the plating film thickness.

[0071] In the present embodiment, the anode 60 is a plate-like component having a plurality of through holes (not shown). The anode 60 can be a lath (metal mesh) structure, or a plate-like component provided with a plurality of through holes (see International Publication No. 2023 / 188371). Since the anode 60 has a plurality of through holes, the upper surface of the anode 60 is always kept wet even during the electrode reaction due to the plating solution (anode solution) supplied through the through holes. Since the diaphragm 50 is an ion-permeable membrane that can be permeated and wetted by the plating solution, the surface of the anode 60 on the substrate side (the portion to which the diaphragm 50 is in close contact or its vicinity) reacts with the plating solution, and cations (such as hydrogen ions H +) is transferred to the cathode chamber Cc, that is, the substrate side, through the diaphragm 50. Therefore, an ion conduction path (current path) is formed from the substrate-side surface of the anode 60 (the portion to which the diaphragm 50 is in close contact or its vicinity) through the interior of the diaphragm 50 to the substrate Wf. On the other hand, the gas bubbles generated on the surface of the anode 60 cannot pass through the diaphragm 50 and move to the back side (lower surface) of the anode 60 through the multiple through holes of the anode 60. After accumulating on the lower surface of the anode 60 (between the anode 60 and the back plate 62), the bubbles move to the outside of the sealing pressure ring 51 and are discharged to the outside of the plating tank 10 through the exhaust passage (not shown).

[0072] Since the upper surface of the anode 60 is in close contact with the lower surface of the diaphragm 50, the gas generated from the anode 60 is suppressed or prevented from accumulating between the anode 60 and the diaphragm 50, and the gas generated from the anode 60 is suppressed or prevented from moving to the cathode chamber, affecting the electric field between the anode 60 and the substrate Wf, and can suppress or prevent the uniformity of the thickness of the plating film formed on the substrate Wf from decreasing.

[0073] (Variable Anode Mask)

[0074] like Figure 4 As shown, the variable anode mask 650 is mounted on the annular portion 621 of the holder body 620 / anode holder 610, which is larger than the diaphragm support portion 622 ( Figure 5 The variable anode mask 650 comprises: a plurality of blades 651; and an annular driving component 652, which is equipped with a plurality of blades 651 and adjusts the aperture (opening diameter) formed by these blades 651. Figure 3 、 Figure 5 The drive shaft 670 shown is moved in the front-to-back direction by an actuator (not shown), thereby rotating the drive component 652 and adjusting the aperture (opening diameter) formed by the plurality of blades 651. In one example, an actuator (not shown) is arranged on the side of the lower groove 12 of the plating tank 10 adjacent to the front plate 640 (opening 12B of the lower groove 12) of the anode holder 610. The axis of the actuator extends parallel to the drive shaft 670, and the axis of the actuator and the drive shaft 670 can be configured to be connected at their front ends via a connecting component 671 (see International Publication No. 2003 / 079684 (Patent Document 1)). The drive shaft 670 and the front plate 640 (front plate body 641) are sealed by an appropriate seal (not shown, for example, see Patent Document 1). The actuator can be composed of a well-known linear actuator (e.g., a motor and a ball screw).

[0075] (1st sealing surface)

[0076] like Figure 9As shown, the flange 623 of the holder body 620 / anode holder 610 is an annular member having an opening in the center for exposing the diaphragm 50 (the area corresponding to the anode 60). Figure 4 、 Figure 5 、 Figure 8 as well as Figure 9 As shown, the seal 701 is arranged over the entire circumference. The seal 701 seals between the outer periphery (flange 623) of the retainer body 620 / anode retainer 610 and the lower surface of the flange 12D of the plating tank 10. A sealing surface 701A is formed between the upper surface of the outer periphery (flange 623) of the retainer body 620 / anode retainer 610 and the lower surface of the flange 12D of the plating tank 10, which are opposite to each other with the seal 701 sandwiched therebetween (see FIG. 1 ). Figure 4 ).like Figure 4 、 Figure 5 As shown, multiple fastening members 801 penetrate the flange 11A of the upper tank 11 and the flange 12D of the lower tank 12 of the plating tank 10 and are fastened to the flange 623 of the holder body 620 / anode holder 610. When the outer periphery (flange 623) of the holder body 620 / anode holder 610 is fixed to the flange 12D of the plating tank 10, the seal 701 is configured to elastically deform under appropriate pressure to achieve sealing performance. The multiple fastening members 801 are evenly distributed around the entire circumference, for example. The fastening members 801 can be bolts, screws, or any other fastening member.

[0077] (Second sealing surface)

[0078] On the front surface of the flange 12A of the lower tank 12 of the plating tank 10, as shown in FIG. Figure 4 As shown, an annular seal 702 is arranged around the entire circumference of the opening 12B. The seal 702 seals between the flange 12A of the plating tank 10 and the frame member 642 of the front plate 640. In other words, the opening 12B of the plating tank 10 is sealed liquid-tight. A sealing surface 702A is formed between the front surface of the flange 12A of the plating tank 10 and the back surface of the frame member 642 of the front plate 640, which are opposed to each other with the seal 702 sandwiched therebetween (see FIG. 1 ). Figure 4 ).like Figure 3 、 Figure 4As shown, when the front plate 640 of the anode holder 610 is fixed to the flange 12A of the plating tank 10 by a plurality of fastening members 802, the seal 702 is configured to elastically deform under appropriate pressure to exert sealing properties. At this time, since the frame member 642 of the front plate 640 can move in the front-to-back direction relative to the front plate body 641, the frame member 642 can be moved relative to the front plate body 641. Depending on the degree of fastening of the plurality of fastening members 802, the frame member 642 causes the seal 702 to elastically deform under appropriate pressure. Figure 4 As shown in FIG. 1 and FIG. 2 , the plurality of fastening members 802 can be evenly arranged over the entire circumference, for example.

[0079] Here, when the flange 623 of the holder body 620 / anode holder 610 is secured to the flange 12D of the plating tank 10 by the fastening member 801, that is, when the seal 701 is elastically deformed, the flange 12D of the plating tank 10 is subjected to vertical forces by the fastening member 801. Consequently, the seal 702 disposed on the flange 12A of the plating tank 10 is subjected to vertical forces, potentially causing it to fail to properly seal the flange 12A with the frame member 642. Therefore, in this embodiment, the frame member 642 of the front plate 640 is movable in the front-to-back direction relative to the front plate body 641. The fastening of the fastening member 802 presses the frame member 642 against the flange 12A independently of the front plate body 641, thereby appropriately compressing and elastically deforming the seal 702, achieving a properly sealed state. For example, by changing the degree of tightening of the upper and lower tightening members 802 , the seal 702 can be elastically deformed with appropriate pressing forces at the upper and lower portions.

[0080] (3rd sealing surface)

[0081] In addition, in the front plate 640, the front plate body 641 and the frame member 642 are sealed by an annular seal 703. A sealing surface 703A is formed between the outer peripheral surface of the front plate body 641 and the inner peripheral surface of the frame member 642, which are opposed to each other with the seal 703 interposed therebetween (see FIG. Figure 4 ). As a result, the interior of the plating tank 10 is properly sealed from the outside. The frame member 642 is fitted to the front plate body 641 with such strength that it does not fall off. The seal 703 is, for example, arranged in an annular sealing groove provided over the entire outer circumference of the front plate body 641. Alternatively, the seal 703 may be arranged in an annular sealing groove provided over the entire inner circumference of the frame member 642.

[0082] (Cathode liquid path)

[0083] like Figure 7 as well as Figure 10As shown, in the anode holder 610, a cathode liquid passage 681 is provided at the lower portion of the holder body 620 / anode holder 610, which is connected to the cathode liquid inlet 680 of the front plate 640. The cathode liquid passage 681 is formed by removing a portion of the wall thickness at the lower portion of the outer periphery (annular portion 621) of the holder body 620 / anode holder 610, and is divided by the lower surface of the thin-walled portion of the annular portion 621 of the holder body 620 / anode holder 610, the front plate body 641, the bottom wall 613, and the side walls 614 to 617. The side wall 614 is provided in a shape that follows the outer periphery of the diaphragm support portion 622 ( Figure 7 、 Figure 10 ), one or more cutouts 614a are provided on the upper portion of the side wall 614 ( Figure 7 The cutout 614a forms the outlet of the cathode liquid passage 681. That is, the cathode liquid passage 681 has an inlet connected to the cathode liquid inlet 680 and an outlet (cutout 614a) opening above the diaphragm 50. The cathode liquid flowing in from the cathode liquid inlet 680 passes through the cathode liquid passage 681 and is supplied from the cutout 614a to the top of the diaphragm support portion 622 (that is, the cathode chamber Cc above the diaphragm 50).

[0084] like Figure 7 As shown, the catholyte inlet 680 is located at the bottom of the holder body 620 / anode holder 610, at the lowest part of the cathode chamber Cc, thereby minimizing the amount of residual catholyte remaining in the cathode chamber Cc. The bottom surface (bottom wall 613) of the catholyte passage 681 is also located below the anode fixing plate 62, at the lowest part of the cathode chamber Cc.

[0085] (Bus Bar)

[0086] A bus bar 660 ( Figure 3 、 Figure 5 ).like Figure 10 As shown, bus bar 660 extends rearward from front plate 640 (front plate body 641) to near the center of the lower surface of anode 60. It is electrically and mechanically connected to anode 60 near the center of the lower surface of anode 60, for example, by fastening member 805 to a downwardly protruding boss 60A (terminal portion). The bus bar 660 and front plate 640 (front plate body 641) are sealed by an appropriate seal (not shown; see, for example, Patent Document 1). Fastening member 805 may be a bolt, screw, or any other fastening member.

[0087] Figure 11 This is a bottom perspective view of the anode holder assembly 6 with the anode fixing plate 62 made transparent. Figure 12 It is a bottom view of the diaphragm support portion 622 . Figure 13AIt is a perspective view showing a part of the diaphragm support portion 622 in an enlarged manner. Figure 13B It is a perspective view showing a further enlarged portion of the diaphragm support portion 622 .

[0088] When the anode holder assembly 6 is viewed from below, the diaphragm support portion 622 is arranged deep between the anode 60 and the diaphragm 50 ( Figure 4 、 Figure 5 ), but in Figure 11 In the figure, for the sake of convenience, the diaphragm support portion 622 is shown to be visible through the position of the anode 60. Figure 11 In the figure, the fastening member 803 for fastening the sealing ring 51 and the diaphragm 50 can also be seen ( Figure 6A ), the fastening member 804 for fastening the anode fixing plate 62 ( Figure 6A ), the diaphragm pressing member 810 pressing the diaphragm 50 from below via the anode 60 ( Figure 6B ) configuration example.

[0089] like Figure 12 、 Figure 13A as well as Figure 13B As shown, the lower surface side of the beam 622A of the diaphragm support portion 622, that is, the side in contact with the diaphragm 50, is chamfered to form a chamfered portion 624A. In addition, the upper surface and the lower surface of the diaphragm support portion 622 are sometimes referred to as the front surface and the back surface, respectively. In this example, the chamfered portion 624A is shown as a C-chamfered structure. In addition, as shown in FIG. Figure 12 As shown, the outermost beam 622A of the honeycomb structure may be chamfered only on the side facing the honeycomb structure. In other words, the chamfered portion 624A provided on the outermost beam 622A of the honeycomb structure may be provided only on the side facing the honeycomb structure. In other words, the chamfered portion 624A may be provided on the diaphragm contact side of the beam 622A of the diaphragm support portion 622 and on the side facing the honeycomb opening. In other embodiments, the chamfered portion 624A provided on the outermost beam 622A of the honeycomb structure may be provided on both the side facing the honeycomb structure and the side not facing the honeycomb structure.

[0090] The chamfered portion 624A is provided to improve the problem that, when liquid enters the cathode chamber Cc, bubbles are trapped in the portion of the beam in contact with the diaphragm 50 (between the diaphragm and the beam), which may cause bubbles to remain. Such bubbles may adhere to the substrate, resulting in poor plating quality, such as localized uneven plating.

[0091] As described above, by providing the chamfered portion 624A on the lower surface of the beam 622A disposed on the cathode chamber Cc side of the diaphragm 50, the contact area between the beam 622A and the diaphragm 50 can be reduced, thereby reducing residual bubbles in the cathode chamber Cc. This can prevent bubbles from adhering to the substrate and causing poor plating quality, such as localized uneven plating. Furthermore, by providing the chamfered portion 624A only on the lower surface of the beam 622A, both beam strength and residual bubble reduction can be achieved.

[0092] because Figure 8 The circumscribed circle Rm shown corresponds roughly to the projection of the substrate Wf. Therefore, if a chamfered portion 624A is provided on the honeycomb structure beam 622A inside the circumscribed circle Rm, it is expected to prevent bubbles from adhering to the substrate Wf, local uneven plating, and other poor plating quality effects. However, the same chamfered portion can also be provided on the beam 622B. In addition, regardless of whether the center Cm of the honeycomb structure is eccentric to the rotation center / rotation center axis Cw of the substrate holder 20 (substrate Wf), the above-mentioned chamfered portion can reduce bubble residue. The above-mentioned chamfered portion can also be applied to the diaphragm support portion of the vertical plating device. In addition, the above-mentioned chamfer is not limited to the C chamfer, and can be a chamfer of any shape as long as it can achieve the effect of reducing bubble adhesion.

[0093] According to the above-described embodiment, the following effects are achieved.

[0094] (1) In the anode holder 610 , the seal 704 can appropriately seal the outer peripheral portion of the diaphragm 50 and the outer peripheral portion of the holder body 620 / anode holder 610 .

[0095] (2) The seal 701 can appropriately seal the outer periphery of the anode holder 610 and the interior of the plating tank 10 so as to partition the interior of the plating tank 10 into upper and lower chambers (anode chamber and cathode chamber).

[0096] (3) According to the above configurations (1) and (2), by attaching the anode holder 610 to the plating tank 10 , the interior of the plating tank 10 can be divided and sealed into a cathode chamber and an anode chamber above and below the diaphragm 50 .

[0097] (4) The seal 702 can appropriately seal the area around the front plate 640 of the anode holder 610 and the opening 12B of the plating tank 10. In this case, the seal 702 can be appropriately elastically deformed by moving the frame member 642 of the front plate 640 in the front-rear direction.

[0098] (5) The seal 703 can appropriately seal the space between the frame member 642 of the front panel 640 and the front panel main body 641 .

[0099] (6) According to the configurations of (4) and (5) above, by attaching the anode holder 610 to the plating tank 10 , the inside of the plating tank 10 can be appropriately sealed from the outside.

[0100] (Other embodiments)

[0101] (1) In a case where the inside of the plating tank 10 can be sealed liquid-tightly relative to the outside by the seal 704 by designing the structure of the seal 704 between the front plate 640 and the plating tank 10, the front plate body 641 and the frame member 642 can also be provided as an integrated front plate 640, and the seal 703 can be omitted.

[0102] (2) In the above embodiment, a back plate 62 for adjusting the amount of gas accumulation is provided on the lower surface side of the anode 60, but a bubble buffer ring may be provided instead of the back plate 62. The bubble buffer ring is provided to surround the anode 60, and the amount of bubbles generated from the anode and accumulated on the lower surface is adjusted by the height of the bubble buffer ring (International Publication No. 2023 / 188371).

[0103] At least the following aspects can be grasped from the above-mentioned embodiments.

[0104] [1] According to one embodiment, a plating device is provided, comprising: a plating tank for holding a plating solution; a substrate holder for holding a substrate with a surface to be plated facing downward; an anode holder assembly mounted in the plating tank via an opening in a side wall of the plating tank so as to be freely withdrawn in a horizontal direction, the anode holder assembly comprising: an anode holder having one or more openings in a central portion; an anode mounted in the anode holder; and a diaphragm mounted in the anode holder above the anode, wherein the anode holder assembly comprises one or more sealing surfaces for sealing the interior of the plating tank relative to the outside, and one or more sealing surfaces for dividing the interior of the plating tank into upper and lower chambers. For ease of explanation, the one or more sealing surfaces for sealing the interior of the plating tank relative to the outside are sometimes referred to as sealing surfaces for sealing the plating tank, and the one or more sealing surfaces for dividing the interior of the plating tank into upper and lower chambers are sometimes referred to as sealing surfaces for dividing the interior of the plating tank into upper and lower chambers.

[0105] According to this method, in a face-down plating apparatus, the diaphragm and anode, which require regular maintenance, can be integrated with a removable anode holder, making maintenance of the diaphragm and anode easy. Specifically, the anode holder assembly, which holds the anode and diaphragm located at the bottom of the plating tank, can be removed from the plating tank, and the anode and diaphragm can be replaced outside the plating tank (including replacing the entire anode holder assembly).

[0106] According to this method, by installing the anode holder assembly (anode holder) in the plating tank, the interior of the plating tank can be sealed from the outside and the interior of the plating tank can be divided into upper and lower chambers (anode chamber and cathode chamber). In other words, the interior of the plating tank can be sealed from the outside by one or more sealing surfaces for closing the plating tank, and the interior of the plating tank can be divided into upper and lower chambers (anode chamber and cathode chamber) by another one or more sealing surfaces for dividing the interior of the plating tank.

[0107] Furthermore, by attaching the anode holder to the plating tank, the diaphragm is also attached to the plating tank, and thus the diaphragm can be easily attached to the plating tank.

[0108] [2] According to one embodiment, one or more sealing surfaces that divide the interior of the plating tank into upper and lower chambers include: a first sealing surface that seals between the diaphragm and the anode holder, and a second sealing surface that seals between the outer periphery of the anode holder and the plating tank.

[0109] According to this method, since the diaphragm is installed in a sealed state on the anode holder before the anode holder assembly is installed in the plating tank, when the anode holder assembly is installed in the plating tank, if the outer periphery of the anode holder and the plating tank are sealed, the inside of the plating tank can be divided into upper and lower chambers.

[0110] [3] According to one embodiment, the diaphragm is attached to the outer periphery of the anode holder via a first sealing member at the outer periphery of the diaphragm, and the first sealing surface is formed between the outer periphery of the diaphragm and the outer periphery of the anode holder.

[0111] According to this aspect, the space between the diaphragm and the anode holder can be sealed with a simple structure.

[0112] [4] According to one embodiment, the plating tank has a first flange having a lower surface exposed in the space within the plating tank, the anode holder has a second flange provided on the upper portion of the outer periphery of the anode holder, the anode holder is mounted on the upper surface of the second flange to the lower surface of the first flange of the plating tank via an annular second sealing component, and the second sealing surface is formed between the upper surface of the second flange of the anode holder and the lower surface of the first flange of the plating tank.

[0113] According to this method, the anode holder and the plating tank can be reliably sealed over the entire circumference via the vertically opposed surfaces of the anode holder and the plating tank. Thus, the anode holder and the plating tank can be reliably sealed over the entire circumference without being affected by the sealing surface blocking the opening of the plating tank side wall.

[0114] [5] According to one embodiment, the second flange of the anode holder is mounted to the first flange of the plating tank via one or more fastening members, and the second sealing member is elastically deformed between the first flange and the second flange by fastening the fastening members.

[0115] According to this embodiment, the outer periphery of the anode holder can be fixed at a predetermined position in the plating bath by one or more fastening members, and the second sealing member can be elastically deformed to reliably seal between the outer periphery of the anode holder and the plating bath.

[0116] [6] According to one embodiment, one or more sealing surfaces for sealing the inside of the plating tank relative to the outside include a third sealing surface, and the third sealing surface seals the anode holder and the periphery of the opening of the plating tank.

[0117] According to this aspect, the interior of the plating tank can be sealed from the outside around the opening of the side wall of the plating tank into which the anode holder assembly is inserted.

[0118] [7] According to one embodiment, the anode holder includes a front plate disposed on one end of the anode holder and blocking the opening of the plating tank. The front plate includes: a front plate body; and a frame member slidably engaged with the front plate body around the periphery of the front plate body. The frame member is attached to the side wall around the opening of the plating tank, or to a third flange provided around the opening of the plating tank, via a third sealing member. A third sealing surface is formed between the frame member and the side wall around the opening of the plating tank, or between the frame member and the third flange provided around the opening of the plating tank. The frame member is engaged with the front plate body via a fourth sealing member, and a fourth sealing surface is formed between the inner peripheral surface of the frame member and the outer peripheral surface of the front plate body. When the third flange is provided, the third flange is part of the plating tank.

[0119] According to this method, even if the third sealing member is displaced by vertical forces, the frame member can be pressed against the plating tank sidewall / third flange in the front-to-back direction, and the third sealing member can be reliably elastically deformed appropriately between the plating tank and the frame member to achieve sealing performance. Thus, the third sealing member can reliably seal the plating tank and the frame member. Furthermore, the fourth sealing member can seal the front plate body and the frame member. As a result, the interior of the plating tank can be reliably sealed from the outside.

[0120] [8] According to one embodiment, the frame member is mounted to the side wall around the opening of the plating tank, or to the third flange provided around the opening of the plating tank, through one or more fastening members, and the third sealing member is elastically deformed between the frame member and the side wall or the third flange by fastening the fastening members.

[0121] According to this aspect, the front plate can be attached to the side wall of the plating tank by one or more fastening members, and the third sealing member can be deformed to reliably seal between the opening of the plating tank and the front plate.

[0122] [9] According to one embodiment, the frame member is fitted into the front panel body, whereby the fourth sealing member is elastically deformed between the frame member and the front panel body.

[0123] According to this aspect, by fitting the frame member to the front plate main body, the fourth sealing member can be elastically deformed so as to reliably seal between the frame member and the front plate main body.

[0124]

[10] According to one embodiment, the anode holder includes: an outer peripheral portion; and a diaphragm support portion having a plurality of openings inside the outer peripheral portion and supporting the upper surface of the diaphragm.

[0125] According to this aspect, the upper surface of the diaphragm can be appropriately pressed by the diaphragm support portion of the anode holder, and upward deflection of the diaphragm can be suppressed.

[0126]

[11] According to one embodiment, the plurality of openings of the diaphragm support portion include: a plurality of openings of the first shape; and a plurality of openings of the second shape, which are arranged outside the plurality of openings of the first shape, and the center of the circumscribed circle including the plurality of openings of the first shape is eccentric from the rotation center of the substrate holder.

[0127] According to this aspect, since the center of the diaphragm support portion pattern is eccentric from the rotation center / rotation center axis of the substrate, the plating film can be prevented from transferring the shape of the diaphragm support portion pattern, thereby improving the uniformity of the plating film thickness.

[0128]

[12] According to one embodiment, the structure formed by the plurality of openings of the first shape is a honeycomb structure.

[0129] According to this aspect, the diaphragm support portion can support the central portion of the diaphragm, which is likely to bend significantly, with sufficient strength while ensuring a large opening area.

[0130]

[13] According to one embodiment, the plurality of openings of the second shape are formed between a plurality of beams extending radially from the apex of the outermost periphery of the honeycomb structure to the outer periphery.

[0131] According to this aspect, it is possible to ensure a large opening area while ensuring necessary support strength in the region near the outer peripheral portion of the diaphragm where the possibility of significant deflection is low.

[0132]

[14] According to one method, the anode is a plate-like component having a plurality of through holes, which is arranged in close contact with the lower surface of the diaphragm, and further comprises a back plate which is separated from the anode by a predetermined distance, and the amount of gas generated from the anode retained on the lower surface of the anode is adjusted by the back plate.

[0133] According to this aspect, since the anode and the separator are in close contact with each other, the height dimension of the anode holder assembly in which the anode and the separator are integrated can be suppressed, and the anode holder assembly can be compactly configured.

[0134] According to this method, since the anode is in close contact with the diaphragm, it is possible to suppress or prevent the accumulation of gas generated at the anode between the diaphragm and the anode. This also suppresses or prevents the electric field between the anode and the substrate from being affected by the gas and affecting the uniformity of the plated film thickness. In addition, the back plate is used to adjust the amount of gas retained on the lower surface through the multiple through-holes of the anode. This can suppress or prevent a large amount of gas from escaping from the lower surface of the anode at the same time, thereby suppressing or preventing the anode voltage from fluctuating. As a result, it is possible to suppress or prevent the film thickness uniformity of the plated film from being reduced.

[0135]

[15] According to one embodiment, the anode holder has a cathode liquid inlet for supplying a plating liquid serving as a cathode liquid to the cathode chamber.

[0136] According to this aspect, since the cathode liquid inlet is provided in the anode holder, the structure of the plating tank can be made more compact.

[0137]

[16] According to one embodiment, the cathode liquid inlet is arranged at a position lower than the diaphragm, and a cathode liquid passage is provided in the anode holder, wherein the cathode liquid passage has: an inlet connected to the cathode liquid inlet below the diaphragm; and an outlet opening above the diaphragm.

[0138] According to this method, the cathode liquid inlet is located below the diaphragm and at the lowest part of the cathode chamber, thereby minimizing the amount of residual cathode liquid remaining in the cathode chamber. Furthermore, since the cathode liquid is introduced from the lower portion of the anode holder and supplied to the upper portion of the diaphragm (cathode chamber), it is easier to form a sealing surface on the upper portion of the anode holder's outer periphery to seal the plating tank. This structure makes it easy to form a sealing surface between the outer periphery of the anode holder and the plating tank with a simple structure, making it easier to ensure a sufficiently large volume for the anode chamber.

[0139]

[17] According to one embodiment, a variable anode mask is further provided above the diaphragm.

[0140] According to this aspect, the variable anode mask can also be integrated with the removable anode holder, making it easy to maintain the variable anode mask.

[0141]

[18] According to one embodiment, a method for dividing a plating tank into an anode chamber and a cathode chamber is provided, comprising: preparing an anode holder, wherein the anode holder is equipped with an anode and a diaphragm, and has one or more sealing surfaces for sealing the inside of the plating tank relative to the outside, and one or more sealing surfaces for dividing the inside of the plating tank into upper and lower chambers; and installing the anode holder in the plating tank through an opening of the side wall of the plating tank, wherein the anode holder blocks the opening of the plating tank to seal the inside of the plating tank relative to the outside, and divides the inside of the plating tank into the anode chamber and the cathode chamber above and below the diaphragm.

[0142] [A1] According to one embodiment, a plating device is provided, comprising: a plating tank for holding a plating liquid; a substrate holder for holding a substrate with a plated surface facing downward; an anode arranged opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape arranged outside the plurality of openings of the first shape, the center of a circumscribed circle including the plurality of openings of the first shape being eccentric from the rotation center of the substrate holder.

[0143] According to this aspect, since the center of the diaphragm support portion pattern is eccentric from the rotation center / rotation center axis of the substrate, the plating film can be prevented from transferring the shape of the diaphragm support portion pattern, thereby improving the uniformity of the plating film thickness.

[0144] [A2] According to one embodiment, the structure formed by the plurality of openings of the first shape is a honeycomb structure.

[0145] According to this aspect, the diaphragm support portion can support the central portion of the diaphragm, which is likely to bend significantly, with sufficient strength while ensuring a large opening area.

[0146] [A3] According to one embodiment, the plurality of openings of the second shape are formed between a plurality of beams extending radially from vertices of the outermost periphery of the honeycomb structure to the outer periphery of the diaphragm support portion.

[0147] According to this aspect, it is possible to ensure a large opening area while ensuring necessary support strength in the region near the outer peripheral portion of the diaphragm where the possibility of significant deflection is low.

[0148] [A4] According to one method, the anode is a plate-like component having a plurality of through holes, which is arranged in close contact with the lower surface of the diaphragm, and further comprises a back plate which is separated from the anode by a predetermined distance, and the amount of gas generated from the anode retained on the lower surface of the anode is adjusted by the back plate.

[0149] According to this aspect, since the anode and the separator are in close contact with each other, the height dimension of the anode holder assembly in which the anode and the separator are integrated can be suppressed, and the anode holder assembly can be compactly configured.

[0150] According to this method, since the anode is in close contact with the diaphragm, it is possible to suppress or prevent the accumulation of gas generated at the anode between the diaphragm and the anode. This also suppresses or prevents the electric field between the anode and the substrate from being affected by the gas and affecting the uniformity of the plated film thickness. In addition, the back plate is used to adjust the amount of gas retained on the lower surface through the multiple through-holes of the anode. This can suppress or prevent a large amount of gas from escaping from the lower surface of the anode at the same time, thereby suppressing or preventing the anode voltage from fluctuating. As a result, it is possible to suppress or prevent the film thickness uniformity of the plated film from being reduced.

[0151] [A5] According to one embodiment, a variable anode mask is further provided, and the variable anode mask is arranged above the diaphragm.

[0152] According to this aspect, the exposed area of ​​the anode is adjusted by the variable anode mask, thereby improving the uniformity of the plated film thickness.

[0153] [A6] According to one embodiment, the plurality of openings of the first shape and the plurality of openings of the second shape are defined by a plurality of beams, and at least a portion of the beams are chamfered on a side in contact with the diaphragm.

[0154] According to this method, by chamfering the beam disposed on the cathode chamber side of the diaphragm, the contact area between the beam and the diaphragm can be reduced, thereby reducing residual bubbles in the cathode chamber. This prevents bubbles from adhering to the substrate and causing poor plating quality, such as localized uneven plating. Furthermore, by chamfering only the lower surface of the beam, both beam strength and residual bubble reduction can be achieved.

[0155] [A7] According to one embodiment, the beam defining the plurality of openings of the first shape is chamfered.

[0156] In the region of the plurality of openings of the first shape that roughly corresponds to the projection of the substrate, residual bubbles can be effectively reduced, thereby preventing poor plating quality such as bubbles adhering to the substrate and local uneven plating.

[0157] [A8] According to one embodiment, a plating device is provided, comprising: a plating tank for holding a plating liquid; a substrate holder for holding a substrate; an anode arranged opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing the diaphragm, the diaphragm support portion having a surface and a back surface, and having a plurality of beams for defining a plurality of openings passing through the surface and the back surface, and at least a portion of the beams being chamfered on the back surface side in contact with the diaphragm.

[0158] The diaphragm support portion can be arranged on the substrate side and / or the anode side with respect to the diaphragm.

[0159] According to this method, by providing a chamfer on the contact side of the diaphragm-supporting beam, the contact area between the beam and the diaphragm can be reduced, thereby reducing residual bubbles in the plating solution. This prevents bubbles from adhering to the substrate, resulting in poor plating quality and uneven localized plating. Furthermore, by providing the chamfer only on the contact side of the beam, both beam strength and residual bubble reduction can be achieved.

[0160] [A9] A plating method is provided, which is a plating method for plating a substrate with the plated surface facing downward, wherein a plating tank is prepared, the plating tank comprising: an anode opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape arranged outside the plurality of openings of the first shape, and the substrate is plated while being rotated in a state where the rotation center of the substrate is eccentric from the center of the circumscribed circle of the plurality of openings of the first shape including the diaphragm support portion.

[0161] According to this aspect, since the center of the diaphragm support portion pattern is eccentric from the rotation center / rotation center axis of the substrate, the plating film can be prevented from transferring the shape of the diaphragm support portion pattern, thereby improving the uniformity of the plating film thickness.

[0162] [A10] According to one embodiment, a plating method is provided, which is a plating method for plating a substrate, wherein a plating tank is prepared, the plating tank comprising: an anode opposite to the substrate; a diaphragm arranged between the substrate and the anode; and a diaphragm support portion for pressing the diaphragm, the diaphragm support portion having a plurality of beams with predetermined plurality of openings, at least a portion of the beams being chamfered on a side in contact with the diaphragm, and the substrate is plated using the plating tank.

[0163] The diaphragm support portion can be arranged on the substrate side and / or the anode side with respect to the diaphragm.

[0164] According to this method, by providing a chamfer on the contact side of the diaphragm-supporting beam, the contact area between the beam and the diaphragm can be reduced, thereby reducing residual bubbles in the plating solution. This prevents bubbles from adhering to the substrate, resulting in poor plating quality and uneven localized plating. Furthermore, by providing the chamfer only on the contact side of the beam, both beam strength and residual bubble reduction can be achieved.

[0165] The embodiments of the present invention have been described above, but the embodiments of the invention described above are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention can be changed and improved without departing from its main purpose, and it is self-evident that the present invention includes its equivalents. In addition, within the scope of being able to solve at least part of the above-mentioned problems or within the scope of achieving at least part of the effect, the embodiments and modifications can be arbitrarily combined, and the various constituent elements described in the claims and the specification can be arbitrarily combined or omitted.

[0166] The entire disclosure of International Publication No. 2003 / 079684 (Patent Document 1) and International Publication No. 2023 / 188371 including the specification, claims, drawings, and abstract are incorporated herein by reference in their entirety.

[0167] Description of Reference Numerals

[0168] 6...anode holder assembly; 10...plating tank; 11...upper tank; 12...lower tank; 12A...flange; 12B...opening; 12C...anolyte inlet; 12D...flange; 20...substrate holder; 30...paddle; 40...resistor; 50...diaphragm; 51...seal ring; 60...anode; 60A...boss; 62...anode fixing plate; 400...plating module; 610...anode holder; 613...bottom wall; 614-617...side walls; 614a...cutout; 620...holder body; 621...ring; 622...diaphragm support; 622A...beam; 622B... ..beam; 623...flange; 640...front plate; 641...front plate body; 642...frame member; 650...variable anode mask; 651...blade; 652...driving member; 660...bus bar; 670...driving shaft; 671...connecting member; 680...cathodic liquid inlet; 681...cathodic liquid passage; 701~704...seal; 701A~704A...sealing surface; 801~805...fastening member; 804A...spacer; 810...diaphragm pressing member; 1000...plating device; Rm...circumscribed circle; Cm...center of circumscribed circle; Cw...rotation center (rotation center axis); Wf...substrate.

Claims

1. A plating device, wherein: The plating device comprises: a plating tank for holding a plating solution; a substrate holder for holding the substrate with the plated surface facing downward; an anode, disposed opposite to the substrate; a diaphragm disposed between the substrate and the anode; as well as a diaphragm support portion that presses the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape disposed outside the plurality of openings of the first shape; The center of a circumscribed circle including the plurality of openings of the first shape is eccentric from the rotation center of the substrate holder.

2. The plating device according to claim 1, wherein The structure formed by the plurality of openings of the first shape is a honeycomb structure.

3. The plating device according to claim 2, wherein The plurality of openings of the second shape are formed between a plurality of beams extending radially from the apex of the outermost periphery of the honeycomb structure to the outer periphery of the diaphragm support portion.

4. The plating apparatus according to claim 1, wherein The anode is a plate-shaped member having a plurality of through holes and is arranged in close contact with the lower surface of the diaphragm. It also includes a back plate, which is separated from the anode by a predetermined distance below the anode. The amount of gas generated from the anode and retained on the lower surface of the anode is adjusted by the rear plate.

5. The plating apparatus according to any one of claims 1 to 4, wherein A variable anode mask is further provided. The variable anode mask is arranged above the diaphragm. The plating apparatus according to claim 1 , wherein: The plurality of openings of the first shape and the plurality of openings of the second shape are defined by a plurality of beams, At least a portion of the beam is chamfered on a side in contact with the diaphragm.

7. The plating apparatus according to claim 6, wherein: The beam defining the plurality of openings of the first shape is chamfered.

8. The plating apparatus according to claim 1, wherein The diaphragm support portion has a front surface and a back surface, and includes a plurality of beams defining a plurality of openings penetrating between the front surface and the back surface, wherein at least a portion of the beams is chamfered on the back surface side in contact with the diaphragm.

9. A plating method for plating a substrate with the surface to be plated facing downward, wherein: A plating tank is prepared, the plating tank comprising: an anode facing the substrate; a diaphragm disposed between the substrate and the anode; and a diaphragm support portion that presses the upper surface of the diaphragm, the diaphragm support portion having a plurality of openings of a first shape and a plurality of openings of a second shape disposed outside the plurality of openings of the first shape, The substrate is plated while being rotated in a state in which the rotation center of the substrate is eccentric from the center of a circumscribed circle including the plurality of openings of the first shape of the diaphragm support portion.

10. The plating method according to claim 9, wherein The diaphragm support portion includes a plurality of beams defining a plurality of openings, and at least a portion of the beams is chamfered on a side in contact with the diaphragm.

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