Magnetic sensor device

Abstract

A magnetic sensor device (1) having a wiring substrate (2), a plurality of magnetic detection elements (4) mounted on the wiring substrate (2), and a rectangular integrated circuit (3) electrically connected to the plurality of magnetic detection elements (4), the plurality of magnetic detection elements (4) being disposed outside the integrated circuit (3) when viewed from the normal direction of the wiring substrate (2), and the plurality of magnetic detection elements (4) being disposed outside the integrated circuit (3) when viewed from the normal direction of the wiring substrate (2). Magnetic detection elements (4), the magnetic induction directions of which are parallel to each other, are disposed at least at positions along two sides (31a), (31b), (31c), (31d) facing each other in an integrated circuit (3).

Description

Technical Field

[0001] The present invention relates to a magnetic sensor device. Background Art

[0002] As a magnetic sensor device, there is a magnetic sensor device disclosed in Patent Document 1, for example. Below, use Fig.13 The magnetic sensor device of the prior art disclosed in Patent Document 1 is described below. Fig.13 As shown in (a), the magnetic sensor device 9 comprises: a Hall element 91 having a cross-shaped magnetic sensing portion, the cross-shaped magnetic sensing portion being composed of a semiconductor layer formed on or in a substrate; and an integrated circuit 92 to which a signal is input from the Hall element 91, and the Hall element 91 and the integrated circuit 92 are arranged in a rectangular resin package 93. Fig.13 As shown in (b), the Hall element 91 and the integrated circuit 92 are connected by bonding wires, and the integrated circuit 92 and an external pad electrically connected to the outside are connected by bonding wires. In this way, the magnetic sensor device 9 is configured by Sip (System in package).

[0003] In addition, in the above-mentioned magnetic sensor device 9, if Fig.13 As shown in (a), when looking down at the device body, the magnetically sensitive portion is arranged at a position where the distance L1 from the center position of the device body to the center of the magnetically sensitive portion is greater than 10% and less than 32% of the axial length L2 of the magnetic sensor device 9 of the straight line connecting the center of the cross of the magnetically sensitive portion from the center of the device body.

[0004] In the magnetic sensor device 9 , when the device body is viewed from above, the axes formed by the two cross-shaped sides constituting the magnetic sensitive portion are perpendicular or parallel to the long sides of the rectangular resin package 93 .

[0005] In recent years, the development of systems based on magnetic sensor devices that utilize multiple magnetic detection elements has been active. For example, the above-mentioned system is applied in the industrial field of food foreign matter detection devices, the field of conveying equipment for automatic driving devices, and the medical field of measuring the brain and heart. The common point of the above three fields is that multiple magnetic detection elements are set to detect the position of the object with higher accuracy. Therefore, the information obtained from the magnetic sensor device has become one of the very important items. Not limited to the above three fields, in recent years, there has been a demand for magnetic sensor devices equipped with multiple magnetic detection elements, and their detection accuracy has also been required to be higher. Prior Art Literature Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2014-163702 Summary of the invention Problems to be solved by the invention

[0007] However, originally, in the magnetic sensor device disclosed in Patent Document 1, only one Hall element is mounted on a substrate, and Patent Document 1 does not describe a structure in which a plurality of magnetic detection elements are arranged on a substrate. On the other hand, as described above, it is desirable to perform magnetic detection using a plurality of magnetic detection elements whose magnetic induction directions are parallel to each other.

[0008] In such a magnetic sensor device, the positional relationship between the integrated circuit and the plurality of magnetic detection elements can be an important factor in facilitating high-precision magnetic detection and miniaturizing the device. However, in the above-mentioned patent document 1, as described above, since only a magnetic sensor device equipped with one Hall element (magnetic detection element) is shown, no consideration is given to the positional relationship between the integrated circuit and the plurality of magnetic detection elements.

[0009] In view of the above problems, an object of the present invention is to provide a magnetic sensor device that facilitates high-precision magnetic detection and can be easily miniaturized. Technical solutions to solve problems

[0010] In order to solve the above-mentioned problems, a magnetic sensor device according to one embodiment of the present invention includes: Wiring substrate; a plurality of magnetic detection elements mounted on the wiring substrate; and a rectangular integrated circuit mounted on the wiring substrate and electrically connected to the magnetic detection element, When viewed from the normal direction of the wiring substrate, the plurality of magnetic detection elements are arranged outside the integrated circuit. The magnetic detection elements are arranged at least along two sides of the integrated circuit that are opposed to each other, with their magnetic induction directions being parallel to each other. Effects of the Invention

[0011] In the above-mentioned magnetic sensor device, the magnetic detection elements whose magnetic induction directions are parallel to each other are arranged at least along the two opposite sides of the integrated circuit. Therefore, it is easy to shorten the distance between the multiple magnetic detection elements and the integrated circuit and suppress the deviation of the distance, and it is easy to achieve the miniaturization of the magnetic sensor device as a whole. That is, by shortening the distance between the multiple magnetic detection elements and the integrated circuit and suppressing the deviation of the distance, the superposition of noise on the electrical signal is suppressed, and high-precision detection can be performed. In addition, by setting the configuration relationship between the integrated circuit and the multiple magnetic detection elements as described above, it is easy to make the mounting space of these elements on the wiring substrate compact, and it is easy to achieve the miniaturization of the magnetic sensor device.

[0012] As described above, according to the above aspect, it is possible to provide a magnetic sensor device that facilitates high-precision magnetic detection and that can be easily miniaturized. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 This is a plan view of the magnetic sensor device according to Embodiment 1. Figure 2 This is a plan view of the magnetic sensor device for explaining the arrangement of relay pads and assembly alignment marks in the first embodiment. Figure 3 This is a plan view of the magnetic sensor device in the first embodiment in a state where the integrated circuit and the magnetic detection element are removed. Figure 4 yes Figure 1 Cross-sectional view taken along line IV-IV. Figure 5 yes Figure 1 Sectional view taken along line VV. Figure 6 This is a top view of the MI element in the first embodiment. Figure 7 This is a block diagram of the integrated circuit in the first embodiment. exist Figure 8 middle, Figure 8 (a) is a diagram for explaining an example of a method for detecting a target magnetic field in Embodiment 1 assuming that the target magnetic field is strong. Figure 8 (b) is a diagram for explaining an example of a method for detecting a target magnetic field in the first embodiment assuming that the target magnetic field is weak. Fig. 9 This is a diagram showing an example of means for detecting the position of an object in the first embodiment. Fig.10 This is a top view of the magnetic sensor device in the second embodiment. Fig.11 This is a plan view of the magnetic sensor device according to the third embodiment. Fig.12 This is a top view of the magnetic sensor device according to the fourth embodiment. exist Fig.13 middle, Fig.13 (a) is a top view showing the structure of a conventional magnetic sensor device. Fig.13 (b) is Fig.13 Cross-sectional view taken along the line XIIIb-XIIIb in (a). Fig.14 This is a top view of the magnetic sensor device in Embodiment 5. Fig.15 This is a top view of the integrated circuit in the fifth embodiment. Fig.16 This is a top view of the analog circuit portion in the fifth embodiment. Fig.17 This is a top view of the back surface of the integrated circuit in the fifth embodiment. Fig.18 This is a cross-sectional view of the magnetic sensor device in the fifth embodiment. Fig.19 This is a top view of the magnetic sensor device in Embodiment 6. Fig. 20 This is a circuit diagram of a part of the magnetic sensor device in the sixth embodiment. Fig.21 This is a top view of the magnetic sensor device in the seventh embodiment. DETAILED DESCRIPTION

[0014] Hereinafter, each embodiment will be described in detail with reference to the drawings.

[0015] It should be noted that each of the embodiments described below represents a general or specific example, and the numerical values, shapes, structural elements, configuration positions of the structural elements, and connection methods shown in the embodiments are examples and are not intended to limit the present invention. In addition, the structural elements in the following embodiments that are not recorded in the independent patent claims showing the highest concept are described as arbitrary structural elements.

[0016] In addition, the magnetic sensor device of the present invention has been described based on the embodiments, but the magnetic sensor device involved in the present invention is not limited to the following embodiments. The following embodiments, modified examples obtained by implementing various modifications that a person skilled in the art can conceive of to the following embodiments without departing from the gist of the present invention, and various devices in which the magnetic sensor device involved in the present invention is built-in are also included in the present invention.

[0017] (Implementation Method 1) Figure 1 It is a plan view showing a configuration example of the magnetic sensor device 1 according to the first embodiment.

[0018] In the figure, the magnetic sensor device 1 includes a rectangular integrated circuit 3 mounted on a wiring substrate 2, a plurality of magnetic detection elements 4, and relay pads 61 and 62 for electrically connecting the integrated circuit 3 and the magnetic detection elements 4. In addition, an assembly alignment mark 5 for positioning the integrated circuit 3 and the magnetic detection elements 4 is formed on the wiring substrate 2. As will be explained later, the relay pads 61 and 62 are connected to the integrated circuit 3 via wiring mounted on the wiring substrate 2, and the magnetic detection elements 4 are connected to the relay pads 61 and 62 via bonding wires 8. Although not shown in the figure, on the back side of the wiring substrate 2 ( Figure 1The connection terminal portion (which is the surface) realizes connection with the outside, and the connection terminal portion is connected to the integrated circuit 3 via the wiring mounted on the wiring substrate 2.

[0019] The integrated circuit 3 is arranged in the center of the wiring substrate 2 and is smaller than the wiring substrate 2 .

[0020] Magnetic detection elements 4 having magnetic induction directions parallel to each other are arranged at least along two mutually opposing sides of the integrated circuit 3. The magnetic sensor device 1 has four or more magnetic detection elements 4. The magnetic detection elements 4 are arranged along four sides of the integrated circuit 3 as viewed from the normal direction of the wiring substrate 2. In this embodiment, four magnetic detection elements 4 are arranged in the magnetic sensor device 1.

[0021] The magnetic detection elements 4a, 4b, 4c, and 4d are respectively located outside the four sides 31a, 31b, 31c, and 31d of the integrated circuit 3 and inside the four sides 21a, 21b, 21c, and 21d of the wiring substrate 2. The magnetic detection elements 4 arranged on the two opposing sides are arranged in a manner that "the magnetic induction directions are parallel to each other". The distance between the magnetic detection element 4a and the side 31a of the integrated circuit 3 and the distance between the magnetic detection element 4b and the side 31b of the integrated circuit 3 are equal distances, and the distance between the magnetic detection element 4c and the side 31c of the integrated circuit 3 and the distance between the magnetic detection element 4d and the side 31d of the integrated circuit 3 are equal distances. The magnetic detection elements 4a, 4b, 4c, and 4d do not interfere with each other and have a long strip shape. In addition, the long side direction of the magnetic detection element 4 is parallel to the side of the adjacent integrated circuit 3. By arranging the two magnetic detection elements 4 parallel to each other on the opposite sides of the integrated circuit 3, the magnetic interference between the two magnetic detection elements 4 is suppressed.

[0022] It should be noted that the magnetic sensing direction of the magnetic detection element 4 indicates the direction of the magnetism with the highest detection sensitivity, and “the magnetic sensing directions are parallel to each other” means that the magnetic sensing directions are substantially parallel to each other, and does not exclude slight non-parallelism to an extent that does not cause problems in actual use.

[0023] In addition, a direction parallel to a pair of mutually parallel sides 31a and 31b in the integrated circuit 3 is defined as an X direction. A direction parallel to another pair of mutually parallel sides 31c and 31d in the integrated circuit 3 is defined as a Y direction. The magnetic sensing direction of the magnetic detection elements 4a and 4b arranged with their long sides facing the X direction is defined as the X direction, and the magnetic sensing direction of the magnetic detection elements 4c and 4d arranged with their long sides facing the Y direction is defined as the Y direction.

[0024] Figure 2 This is a top view of the magnetic sensor device 1 for explaining the arrangement of the relay pads 61 and 62 and the assembly alignment mark 5 in the first embodiment. Figure 1The details of the magnetic detection element 4 are shown.

[0025] As shown in the figure, three relay pads 61 and 62 are formed near the four corners of the wiring substrate 2, respectively, and are printed on the upper surface of the wiring substrate 2. It should be noted that for convenience, in the normal direction of the wiring substrate 2, the side of the wiring substrate 2 on which the integrated circuit 3 is mounted ( Figure 1 , Figure 2 The surface in the figure is referred to as the upper side, and the opposite side is referred to as the lower side.

[0026] When viewed from the normal direction of the wiring substrate 2 , the relay pads 61 , 62 are formed at positions farther from the integrated circuit 3 than an imaginary straight line VL1 obtained by extending the four sides 31 a , 31 b , 31 c , and 31 d of the integrated circuit 3 .

[0027] When viewed from the normal direction of the wiring substrate 2 , the relay pads 61 , 62 are located between virtual straight lines VL2 , VL3 respectively extending the contour lines on both sides of the width direction of the magnetic detection element 4 , and are formed at adjacent positions in the long side direction of the magnetic detection element 4 .

[0028] The relay pads 61 and 62 are connected to the magnetic detection element 4 via the bonding wires 8. Thus, the space on the wiring substrate 2 is effectively utilized, and the magnetic sensor device 1 is miniaturized. In addition, in this embodiment, since the integrated circuit 3 is not connected to the bonding wires 8, the influence of the inductance caused by the bonding wires 8 on the integrated circuit 3 is reduced.

[0029] The assembly alignment mark 5 is printed and formed at the four corners of the wiring substrate 2, and has, for example, a substantially L-shape. The distance between the alignment mark 5 and the corner of the wiring substrate 2 is shorter than the distance between the relay pads 61 and 62 and the corner of the wiring substrate 2. It should be noted that the shape of the alignment mark 5 is not particularly limited to a substantially L-shape, and may be other shapes.

[0030] Figure 3 This is a plan view of the magnetic sensor device 1 in the first embodiment in a state where the integrated circuit 3 and the magnetic detection element 4 are removed.

[0031] As shown in the figure, connection wiring 12 connecting relay pads 61, 62 and integrated circuit 3 is printed and formed on the inner layer of wiring substrate 2. Connection wiring 12 is connected to relay pads 61, 62, and the opposite end is connected to chip connection pads 22a, 22b for connecting integrated circuit 3 (IC chip).

[0032] The chip connection pads 22a, 22b, and 22c are formed on the upper surface of the wiring substrate 2 and are arranged at a position overlapping with the integrated circuit 3. It should be noted that the chip connection pad 22a is connected to the connection wiring 12. The chip connection pad 22c is connected to the connection wiring (not shown), and the connection wiring is connected to a terminal electrically connected to the outside.

[0033] Figure 4 yes Figure 1 Cross-sectional view taken along line IV-IV.

[0034] As shown in the figure, the integrated circuit 3 is arranged in the center of the left-right direction of the figure with respect to the wiring substrate 2, and the magnetic detection element 4 is arranged at a certain distance from the left and right ends of the integrated circuit 3. The left and right magnetic detection elements 4 are arranged on the inner side of the peripheral end of the wiring substrate 2. The integrated circuit 3 and the magnetic detection element 4 are sealed by the sealing resin 11. The sealing resin 11 is formed on the wiring substrate 2.

[0035] Figure 5 yes Figure 1 That is, this figure is a cross-sectional view obtained by cutting the magnetic sensor device 1 along a plane that passes through the magnetic detection element 4b arranged along the side 31b of the integrated circuit 3 and is orthogonal to the Y direction.

[0036] As shown in the figure, the magnetic detection element 4b is arranged in the center of the left-right direction of the figure relative to the wiring substrate 2. In addition, the relay pads 62 and the assembly alignment marks 5 are arranged at a certain distance from the left and right ends of the magnetic detection element 4b. The relay pads 62 are printed on the wiring substrate 2 and the assembly alignment marks 5 are printed on the wiring substrate 2 in order from the left and right ends of the magnetic detection element 4b toward the end of the wiring substrate 2.

[0037] The other magnetic detection elements 4a, 4b, and 4c are also printed with relay pads 61, 62 and alignment marks 5 (see Figure 1 , Figure 2 ). The assembly alignment mark 5 is located inside the peripheral end of the wiring substrate 2. The magnetic detection element 4 is connected to the relay pads 61 and 62 by bonding wires 8. The integrated circuit 3, the magnetic detection element 4, the bonding wires 8, and the alignment mark 5 are sealed by a sealing resin 11. The sealing resin 11 is formed on the wiring substrate 2.

[0038] Figure 6 This is a plan view of the MI element serving as the magnetic detection element 4 in the first embodiment.

[0039] As the magnetic detection element 4, for example, a magneto-impedance element (also referred to as "MI element 4" in the following description) can be used. Here, the MI element 4 is described as an example. The MI element 4 has a magnetically sensitive body 41 composed of amorphous wire, a detection coil 42 wound around the magnetically sensitive body 41 through an insulating layer, a wire pad 43 electrically connected to the outside, and a coil pad 44. It should be noted that as long as it is an element that can detect magnetism, it is also possible to use other than the MI element as the magnetic detection element 4.

[0040] When manufacturing the above-mentioned MI element 4, on the element substrate 40 composed of an insulator, in order, first the lower half of the detection coil 42 is formed, an insulating film is formed thereon, a magnetically sensitive body 41 is arranged thereon, an insulating film is formed thereon again, and an upper half of the detection coil 42 is formed thereon. The lower half of the detection coil 42 is electrically and physically connected to the upper half. That is, the upper half and the lower half of the detection coil 42 are combined to form one detection coil 42. The long side direction of the magnetically sensitive body 41 is consistent with the long side direction of the MI element 4. In the case Figure 1 When the MI element 4 is arranged in this manner, the longitudinal direction of the magnetically sensitive body 41 is parallel to the sides 31 a , 31 b , 31 c , and 31 d of the adjacent integrated circuit 3 .

[0041] Here, a pair of wire pads 43 electrically connected to both ends of the magnetically sensitive body 41 and a pair of coil pads 44 electrically connected to both ends of the detection coil 42 are printed on the element substrate 40. The wire pads 43 and the coil pads 44 are respectively formed near both ends of the MI element 4 in the long side direction.

[0042] Figure 7 This is a block diagram of the integrated circuit 3 in the first embodiment.

[0043] As shown in the figure, the integrated circuit 3 has a control circuit 301, multiple pulse power circuits 302, multiple sample and hold circuits 303, multiple AD (Analog Digital) conversion circuits 304, multiple memories 305, an operation processing circuit 306, an output circuit 307, and multiple power supply circuits 308. The control circuit 301 receives communication (so-called control signal) from the outside and controls each circuit. The pulse current circuit 302 is connected to the chip connection pad 22a, and the chip connection pad 22a is connected to the magnetic inductor 41 of the MI element 4. The pulse current circuit 302 can control the flow and stop of the pulse current to the magnetic inductor 41. Through this control, a voltage (induced electromotive force) is generated at both ends of the detection coil 42 of the MI element 4. The sampling and holding circuit 303 is connected to the chip connection pad 22b connected to both ends of the detection coil 42, and the voltage (signal) generated at both ends of the above-mentioned detection coil 42 is input. Here, the above-mentioned input signal is temporarily stored by the sampling and holding circuit. Then, the temporarily stored signal is converted from an analog signal to a digital signal by the AD conversion circuit 304. The signal converted into a digital signal is temporarily stored in the memory 305. The signal stored in the memory 305 is sent to the calculation processing circuit 306. In the calculation processing circuit 306, for example, calculations for suppressing individual deviations and calculations for detecting the position of the object are performed. The output circuit 307 outputs the result of the operation processing circuit 306 to the outside of the integrated circuit 3. The power supply circuit 308 supplies the desired power supply voltage to the pulse power supply circuit 302, the AD conversion circuit 304, and the amplifier circuit (amplifier circuit) not shown. It should be noted that the AD conversion circuit 304 has a gain amplifier (amplifier circuit) function that can flexibly amplify the above-mentioned analog signal.

[0044] It should be noted that, among the communication methods for exchanging information from the outside, there are, for example, 2-wire synchronous serial interface I2C (Inter-Integrated Circuit) and 3-wire synchronous serial communication, but in the present invention, no particular interface restriction is set and any communication method can be applied.

[0045] Figure 8 This is a diagram for explaining an example of means for detecting a magnetic field to be measured with high accuracy according to the magnetic sensor device 1 according to the first embodiment.

[0046] First, the detection of the magnetic field will be described in detail. When a pulse current is input to the magnetically sensitive body 41, the MI element 4 detects the induced electromotive force generated in the detection coil 42, thereby detecting the intensity of the magnetic field in the magnetic induction direction acting on the MI element 4. That is, the MI element 4a and the MI element 4b whose magnetic induction directions are in the X direction detect the magnetic field component in the X direction, and the MI element 4c and the MI element 4d whose magnetic induction directions are in the Y direction detect the magnetic field component in the Y direction. Therefore, by combining the detection signals of the four MI elements 4a, 4b, 4c, and 4d, the direction and intensity of the magnetic field along the XY plane can be detected.

[0047] Figure 8(a) is an illustration of a case where the magnetic field of the target is strong. Figure 8 (b) is an explanatory diagram assuming that the target magnetic field is weak.

[0048] When the magnetic field of the object being measured is strong, such as Figure 8 As shown in (a) of FIG. 1 , a pulse current Ip is input from the right to the left to the magnetically sensitive body 41 of only one of the two MI elements 4a and 4b, and an induced electromotive force generated in the detection coil 42 is detected.

[0049] When the magnetic field of the object being measured is weak, such as Figure 8 As shown in (b), the pulse current Ip is made to flow in the same direction in both the magnetic inductor 41 of the MI element 4a and the magnetic inductor 41 of the MI element 4b. At this time, the detection coil 42 of the MI element 4a and the detection coil 42 of the MI element 4b are electrically connected via the relay pad 62α, the integrated circuit 3 and the relay pad 62β. As a result, the two MI elements 4a and 4b are functionally integrated, the number of turns of their detection coils is increased to 2 times, and the detection accuracy is improved. That is, compared with the case where detection is performed only by one MI element 4, the induced electromotive force V generated at both ends of the detection coil 42 is ideally doubled, which is important in improving its measurement accuracy, especially when the magnetic field of the measured object is weak. It should be noted that the formula of the induced electromotive force V can be expressed by Lenz's law. Indicates. N is the number of turns of the coil, is the flux change and dt is the time change.

[0050] Here, if the magnetic field of the object to be measured is strong, Figure 8 If the two MI elements 4 are functionally integrated as in (b), the induced electromotive force V may exceed the measurement range and cannot be measured. Figure 8 The method shown in (a) and Figure 8 By combining the methods shown in (b), that is, using them separately, it is possible to detect with high accuracy the case where the magnetic field of the measurement object is strong and the case where the magnetic field of the measurement object is weak. That is, a wide dynamic range can be ensured.

[0051] In the above description, the magnetic field measurement of the X direction component using the MI elements 4a and 4b is described, but the dynamic range can be widened by the same method also for the magnetic field measurement of the Y direction component using the MI elements 4c and 4d.

[0052] In addition to the above, as a means for improving the detection accuracy, there is, for example, the following means: the detection value A of the MI element 4a and the detection value B of the MI element 4b are added by the AD conversion circuit 304 of the integrated circuit 3, that is, A+B is used as the value of the detection result. In addition, there is also the following means: with respect to the detection sensitivity of the MI element 4a and the MI element 4b, for example, the signal of the MI element 4a is multiplied by a gain of 0 dB (1 times) for detection, and the signal of the MI element 4b is multiplied by a gain of 60 dB (1000 times) for detection, and the strength of the magnetic field of the object is calculated based on the above two detection results.

[0053] Next, an example of a means for reducing the influence of individual variations of the MI elements 4 in the magnetic sensor device 1 according to the first embodiment will be described below.

[0054] There may be individual deviations in sensitivity between the plurality of MI elements 4. Therefore, by averaging the outputs of two MI elements 4, the influence of the individual deviation of the MI elements 4 on the measurement using the magnetic sensor device 1 can be reduced. For example, with respect to the MI elements 4a and MI elements 4b in the X direction, the respective detection values ​​are averaged by the integrated circuit 3 on the basis of making the magnetic induction directions of each other the same. The detection values ​​of the MI element 4c in the Y direction and the detection values ​​of the MI element 4d are averaged in the same manner. In this way, by averaging the detection values ​​in the X direction and the detection values ​​in the Y direction, the sensitivity deviation between the MI elements 4 is reduced. That is, the detection accuracy of the magnetic field in the X direction and the Y direction is improved.

[0055] Next, refer to Fig. 9 The means for detecting the position of an object (magnetic field generating source) using the magnetic sensor device 1 of this embodiment will be described. For example, the MI element 4a and the MI element 4b in the X direction are set to have opposite magnetic induction directions, and the MI element 4c and the MI element 4d in the Y direction are set to have opposite magnetic induction directions. For example, pulse currents Ip in opposite directions are made to flow in the magnetosensitive body 41 of the MI element 4a and the magnetosensitive body 41 of the MI element 4b, and pulse currents Ip in opposite directions are made to flow in the magnetosensitive body 41 of the MI element 4c and the magnetosensitive body 41 of the MI element 4d. On this basis, magnetic detection is performed to detect the position of the object. However, in this example, the MI elements 4a and 4b can perform detection at the same time (detection 1), but the detection of the MI elements 4c and 4d (detection 2) is not performed during the detection of the MI elements 4a and 4b. It is set that detection 2 starts after detection 1 ends. Conversely, it is also possible to start detection 1 after detection 2 ends. It should be noted that the time difference between the detection 1 and the detection 2 has little influence on the detection result of the position of the object based on the magnetic field detection by the MI elements 4a, 4b, 4c, and 4d.

[0056] Here, for example, it is conceivable to roughly divide the region of the detection object into four parts. That is, if the X direction and the Y direction are respectively divided by an imaginary straight line VL4 in the Y direction and an imaginary straight line VL5 in the X direction intersecting at a position C in the center of the magnetic sensor device 1, the region can be divided into four parts.

[0057] Assume that the object is located at the center of the magnetic sensor device 1 ( Fig. 9 In the case of the position of point C in the magnetic sensor device 1, that is, the center between the MI element 4a and the MI element 4b, and the center between the MI element 4c and the MI element 4d), it is ideal that the output values ​​of the MI element 4a and the MI element 4b having magnetic induction directions in the X direction are equal in magnitude and opposite in sign. Therefore, it is ideal that the value obtained by synthesizing the output value of the MI element 4a and the output value of the MI element 4b is 0. Similarly, the output values ​​of the MI element 4c and the MI element 4d having magnetic induction directions in the Y direction are equal in magnitude and opposite in sign. Therefore, it is ideal that the value obtained by synthesizing the output value of the MI element 4a and the output value of the MI element 4b is 0. Here, when the object is located at the center of the magnetic sensor device 1, Fig. 9 In the upper left region (region further to the left of the imaginary straight line VL4 and further up than the imaginary straight line VL5), the detection value of the MI element 4a becomes larger than that of the MI element 4b, and the detection value of the MI element 4c becomes larger than that of the MI element 4d. Fig. 9 In the case of the lower right region in FIG. 1 , the detection value of the MI element 4b is larger than that of the MI element 4a, and the detection value of the MI element 4d is larger than that of the MI element 4c.

[0058] In this way, the output value of each of the MI elements 4a, 4b, 4c, and 4d varies according to the position of the object relative to the magnetic sensor device 1. By utilizing this, the position of the object can be detected. It should be noted that the magnetic induction direction of the MI element 4 can be easily switched by the integrated circuit 3 .

[0059] As described above, according to the magnetic sensor device 1 involved in embodiment 1 described using the drawings, for example, a wide dynamic range that can receive a strong signal from a weak signal, low noise that suppresses the influence of individual variations by averaging a plurality of MI elements, and high-precision detection of the position of an object can be achieved.

[0060] It should be noted that the method of using the magnetic sensor device 1 of this embodiment is not limited to the above. The magnetic sensor device 1 can be used by making various changes to the method of supplying pulse current to the plurality of MI elements 4 through the integrated circuit 3, the method of connecting the detection coils 42 of the plurality of MI elements 4, etc. according to the method of use (purpose of use).

[0061] In the magnetic sensor device 1, magnetic detection elements 4 having magnetic induction directions parallel to each other are arranged at least along two mutually opposing sides of the integrated circuit 3. Therefore, it is easy to shorten the distance between the plurality of magnetic detection elements 4 and the integrated circuit 3 and suppress the deviation of the distance, and it is easy to achieve the miniaturization of the magnetic sensor device 1 as a whole. That is, by shortening the distance between the plurality of magnetic detection elements 4 and the integrated circuit 3 and suppressing the deviation of the distance, the superposition of noise to the electrical signal is suppressed, and high-precision detection can be performed. In addition, by setting the configuration relationship between the integrated circuit 3 and the plurality of magnetic detection elements 4 as described above, it is easy to make the mounting space of these elements on the wiring substrate 2 compact, and it is easy to achieve the miniaturization of the magnetic sensor device 1.

[0062] Furthermore, by arranging the two magnetic detection elements 4 parallel to each other on opposite sides of the integrated circuit 3 , it is easy to suppress magnetic interference between the two magnetic detection elements 4 .

[0063] The longitudinal direction of the magnetic detection element 4 is parallel to the sides 31a, 31b, 31c, and 31d of the adjacent integrated circuit 3. Therefore, the wiring board 2 can be more easily miniaturized.

[0064] The magnetic detection elements 4 are arranged along the four sides 31a, 31b, 31c, and 31d of the integrated circuit 3 when viewed from the normal direction of the wiring substrate 2. As a result, the four magnetic detection elements 4 can be compactly arranged on the wiring substrate 2. As a result, the magnetic sensor device 1 having the four magnetic detection elements 4 can be easily miniaturized, and the detection accuracy can be effectively improved.

[0065] When viewed from the normal direction of the wiring substrate 2, the bonding wire 8 is arranged at a position that does not overlap with the integrated circuit 3. This can suppress the magnetic field caused by the current flowing through the bonding wire 8 from affecting the integrated circuit 3. As a result, noise can be effectively reduced, making high-precision magnetic detection easy.

[0066] Furthermore, the relay pads 61 and 62 are arranged at positions farther from the integrated circuit 3 than the virtual straight line VL1 when viewed in the normal direction of the wiring substrate 2. Thus, the space on the wiring substrate 2 can be effectively utilized, and the magnetic sensor device 1 can be further miniaturized.

[0067] Since the magnetic detection element 4 is an MI element, it is possible to easily further improve the detection accuracy and further reduce the size of the device.

[0068] In the magnetic sensor device 1 of this embodiment, Figure 1 As shown, the distance between the integrated circuit 3 and the plurality of magnetic detection elements 4 is short and is approximately the same distance. Therefore, if the individual deviations of the magnetic detection elements 4 are removed, the signals obtained from the plurality of magnetic detection elements 4 will ideally become the same value. In addition, since the distance between the integrated circuit 3 and the plurality of magnetic detection elements 4 is short, it is not easily affected by interference noise. That is, magnetic detection can be performed with high precision. It should be noted that the configuration relationship between the integrated circuit 3 and the plurality of magnetic detection elements 4 as described above increases the integration degree on the wiring substrate 2, and it is easy to realize the miniaturization of the magnetic sensor device 1.

[0069] As described above, according to this aspect, it is possible to provide a magnetic sensor device that facilitates high-precision magnetic detection and that can be easily miniaturized.

[0070] (Implementation Method 2) Fig.10 is a top view of a magnetic sensor device according to Embodiment 2. Fig.10 ) and implementation mode 1 ( Figure 1 ) is different in that four relay pads 61, 62 are formed at each of the four corners of the wiring substrate 2. The following description will focus on the difference.

[0071] In this figure, four relay pads 61 and 62 are formed near each of the four corners of the wiring substrate 2 and are printed on the upper surface of the wiring substrate 2 .

[0072] When observed from the normal direction of the wiring substrate 2, the relay pads 61, 62 are formed at the following position: between the imaginary straight line VL1 obtained by extending the four sides 31a, 31b, 31c, and 31d in the integrated circuit 3 and the imaginary straight line VL3 obtained by extending the contour line of the side of the MI element 4 close to the sides 21a, 21b, 21c, and 21d of the wiring substrate 2 in the width direction.

[0073] The relay pads 61 and 62 are connected to the wire pad 43 of the MI element 4 via the bonding wire 8. That is, the MI elements 4 are independent and can be controlled individually.

[0074] As described above, according to the magnetic sensor device 1 involved in the second embodiment described using the drawings, in the magnetic sensor device 1, the relay pads 61 and the wire pads 43 of the MI element 4 are connected one-to-one by the bonding wires 8. As a result, the MI elements 4a, 4b, 4c, and 4d arranged on the four sides can be more easily controlled independently. This means that the range of control of the MI element 4 is widened. In addition, the size of the magnetic sensor device 1 can be miniaturized while installing the above-mentioned functions. In addition, the present invention has the same structure and effects as those of the first embodiment.

[0075] (Implementation method 3) Fig.11 is a top view of a magnetic sensor device according to Embodiment 3. Fig.11 ) and implementation mode 2 ( Fig.10 ) is different in that the MI elements 4c and 4d having a magnetic induction direction in the Y direction are not mounted. The following description will focus on the difference.

[0076] In this figure, there are two MI elements 4 mounted on the wiring substrate 2. The magnetic sensor device 1 arranges MI elements 4a and 4b at positions along two sides 31a and 31b facing each other in the integrated circuit 3. The two MI elements 4 have their magnetic induction directions oriented in the X direction. A total of eight relay pads 61 and 62 are formed on the wiring substrate 2. It should be noted that the above structure is described in the X direction, but it can also be in the Y direction where the physical position is rotated 90 degrees.

[0077] As described above, the magnetic sensor device 1 according to the third embodiment described with reference to the drawings omits the MI element 4 whose magnetic sensitivity direction is in the Y direction, compared with the magnetic sensor devices 1 of the first and second embodiments. Therefore, compared with the first and second embodiments, the size in the X direction can be reduced, and the device can be further miniaturized. In addition, the present invention has the same structure and effects as those of the first embodiment.

[0078] (Implementation 4) Fig.12 is a top view of the magnetic sensor device 1 according to Embodiment 4. As shown in this figure, the magnetic sensor device 1 of this embodiment is different from the magnetic sensor device 1 of Embodiment 3 ( Fig.11 ) compared to the MI elements 4a and 4b, the lengths of the long sides of the MI elements 4a and 4b are reduced. The following description will focus on the differences.

[0079] In this figure, the relay pads 61 and 62 are arranged inside the virtual straight line VL1 in the X direction. Here, the virtual straight line VL1 is a straight line obtained by extending the sides 3c and 3d on both sides of the integrated circuit 3 in the X direction in the Y direction.

[0080] As described above, according to the magnetic sensor device 1 according to the fourth embodiment described with reference to the drawings, the dimension of the magnetic sensor device 1 in the X direction is reduced compared to the first, second, and third embodiments, and can be further miniaturized accordingly. In addition, the present invention has the same structure and effects as those of the first embodiment.

[0081] (Implementation 5) Fig.14 FIG. 1 is a top view of a magnetic sensor device 1 according to Embodiment 5. In this embodiment, a plurality of magnetic detection elements 4 and an integrated circuit 3 are formed on a wiring substrate 2. Figure 1 and Figure 3 As described in the previous section, the integrated circuit 3 is connected via the relay pads 61 and 62, the connection wiring 12, and the connection pads 22 located on the wiring substrate 2. Here, the structure of the integrated circuit 3 is described in detail. The back of the integrated circuit 3 is a silicon substrate. The surface of the integrated circuit 3 is provided with solder balls formed on each connection pad, and the solder balls are used to connect to the wiring substrate 2 (refer to the later described). Fig.17 , Fig.18 In order to connect such an integrated circuit 3 to the wiring substrate 2, the integrated circuit 3 is turned over and the solder balls are bonded (flip chip mounting) to the wiring substrate 2. That is, Fig.14 The integrated circuit 3 shown represents the Fig.15 The integrated circuit 3 is shown in a state where the back side faces upward.

[0082] Fig.15 3 is a top view of the integrated circuit 3 involved in this embodiment. The integrated circuit 3 has a plurality of analog circuit units 32 respectively connected to a plurality of magnetic detection elements 4. In this embodiment, the integrated circuit 3 is composed of an analog circuit unit 32, a digital circuit unit 331, and an output circuit 332. In this embodiment, the integrated circuit 3 has four analog circuit units 32a, 32b, 32c, and 32d respectively electrically connected to four magnetic detection elements 4a, 4b, 4c, and 4d.

[0083] The analog circuit unit 32 has at least a current application circuit 302, a sampling and holding circuit 303, and an AD conversion circuit 304. The current application circuit 302 is a circuit for applying a current to the magnetic detection element 4. In the present embodiment, the current application circuit 302 is a pulse current circuit for applying a pulse current to the magnetic detection element 4 (more specifically, the magnetic inductor 41 of the MI element 4). Hereinafter, it is also referred to as the pulse current circuit 302. It should be noted that the current application circuit 302 is not limited to a pulse current circuit, and for example, it can also be a circuit for applying a high-frequency current to the magnetic detection element 4. The output signal of the magnetic detection element 4 is input to the sampling and holding circuit 303. The AD conversion circuit 304 converts the analog signal temporarily stored in the sampling and holding circuit 303 into a digital signal.

[0084] The analog circuit section 32 and the magnetic detection element 4 connected to each other are adjacent to each other across the sides 31a, 31b, 31c, and 31d of the integrated circuit 3. Fig.14 As shown, the analog circuit portion 32a is adjacent to the magnetic detection element 4a across the edge 31a of the integrated circuit 3, the analog circuit portion 32b is adjacent to the magnetic detection element 4b across the edge 31b of the integrated circuit 3, the analog circuit portion 32c is adjacent to the magnetic detection element 4c across the edge 31c of the integrated circuit 3, and the analog circuit portion 32d is adjacent to the magnetic detection element 4d across the edge 31d of the integrated circuit 3.

[0085] The analog circuit portion 32 has an elongated shape, and the longitudinal direction of the analog circuit portion 32 is parallel to the sides 31 a , 31 b , 31 c , and 31 d of the adjacent integrated circuit 3 .

[0086] like Fig.14 , Fig.15 As shown, when viewed from the normal direction of the wiring substrate 2, four analog circuit sections 32a, 32b, 32c, and 32d are arranged at positions along four sides 31a, 31b, 31c, and 31d of the integrated circuit 3. When viewed from the normal direction of the wiring substrate 2, an output circuit 332 for outputting a signal from the integrated circuit 3 to the outside is arranged between the plurality of analog circuit sections 32.

[0087] In this embodiment, when viewed from the normal direction of the wiring substrate 2, an output circuit 332 is arranged between a plurality of analog circuit portions 32a and 32b arranged along two opposing sides 31a and 31b of the integrated circuit 3, and between a plurality of analog circuit portions 32c and 32d arranged along the other two opposing sides 31c and 31d of the integrated circuit 3.

[0088] The output circuit 332 is formed in a region of the digital circuit portion 331 provided in the central region of the integrated circuit 3. The digital circuit portion 331 is arranged between the four analog circuit portions 32a, 32b, 32c, and 32d. The alignment marks 341 are formed near the four corners of the integrated circuit 3. It should be noted that the alignment marks 341 are formed in a substantially L-shape, but the shape is not particularly limited.

[0089] A plurality of communication pads 334 for connecting the output circuit 332 to the outside are also provided in the digital circuit section 331. An IO protection circuit 333 is provided between the output circuit 332 and the pads 334 to protect the circuit from ESD (Elector Static Discharge) surges applied to the input terminals.

[0090] Fig.16 It is a top view of the analog circuit unit 32 according to the fifth embodiment. The analog circuit unit 32 includes the pulse current supply circuit 302 , the sample-and-hold circuit 303 , and the AD conversion circuit 304 described above, and also includes an amplifier circuit 327 , a plurality of IO protection circuits 323 , and a plurality of pads 322 . The plurality of pads 322 are arranged along the long side direction of the analog circuit portion 32. Fig.15 , Fig.16 As shown in FIG. 1 , the plurality of pads 322 are arranged along the edge of the analog circuit portion 32 on the opposite side of the side adjacent to the digital circuit portion 331. That is, the plurality of pads 322 are arranged along the respective sides 31a, 31b, 31c, and 31d of the integrated circuit 3. Fig.15 , Fig.16 , the plurality of pads 322 are arranged in a row, but the present invention is not limited thereto. The plurality of pads 322 may be arranged in a staggered manner, for example, so that the distances from the sides 31a, 31b, 31c, and 31d are staggered.

[0091] Each of the plurality of IO protection circuits 323 is paired with each of the plurality of pads 322. The IO protection circuit 323 is provided adjacent to one of the plurality of pads 322 on the inner side of the integrated circuit 3. It should be noted that the positional relationship between the pads 322 and the IO protection circuit 323 is not particularly limited. For example, the pads 322 may be stacked on the IO protection circuit 323 in the thickness direction of the integrated circuit 3, or the pads 322 and the IO protection circuit 323 may be arranged in a direction along the surface of the integrated circuit 3 without being stacked.

[0092] The analog circuit unit 32 receives the analog signal of the magnetic detection element 4 through the pad 322, the IO protection circuit 323 and the sample-and-hold circuit 303. The sample-and-hold circuit 303 temporarily stores the analog signal of the magnetic detection element 4. The amplifier circuit 327 amplifies the signal of the sample-and-hold circuit 303. The AD conversion circuit 304 converts the analog signal amplified by the amplifier circuit 327 into a digital signal. It should be noted that a wiring area 324 for connecting the two is provided between the IO protection circuit 323 and the sample-and-hold circuit 303.

[0093] Here, an example of the arrangement of the plurality of elements in the analog circuit section 32 will be described in detail. As described above, the plurality of pads 322 are arranged along the edge of one side of the analog circuit section 32. The edge to which the plurality of pads 322 are adjacent is referred to as the first edge 32z. A plurality of IO protection circuits 323 are arranged adjacent to the first edge 32z with respect to the plurality of pads 322. Moreover, a wiring region 324 is formed adjacent to the opposite side of the plurality of pads 322 with respect to the plurality of IO protection circuits 323. The wiring region 324 is formed as a strip in the arrangement direction of the plurality of IO protection circuits 323, that is, is formed as a strip in the long side direction of the analog circuit section 32. The sampling and holding circuit 303 is arranged adjacent to the opposite side of the plurality of IO protection circuits 323 with respect to the wiring region 324. The sampling and holding circuit 303 is also formed as a strip in the long side direction of the analog circuit section 32. However, the length of the sampling and holding circuit 303 in the long side direction is shorter than the length of the wiring region 324 in the long side direction. An amplifier circuit 327 is arranged at a position adjacent to the opposite side of the wiring area 324 with respect to the sample and hold circuit 303. In addition, an AD conversion circuit 304 is arranged at a position adjacent to the sample and hold circuit 303 with respect to the amplifier circuit 327. The amplifier circuit 327 and the AD conversion circuit 304 also have a long strip shape in the long-side direction of the analog circuit section 32. The length of the amplifier circuit 327 and the AD conversion circuit 304 in the long-side direction is substantially equal to the length of the sample and hold circuit 303 in the long-side direction. In addition, the pulse energization circuit 302 is arranged at positions adjacent to both sides of the sample and hold circuit 303, the amplifier circuit 327, and the AD conversion circuit 304 in the long-side direction.

[0094] The four analog circuit sections 32a, 32b, 32c, and 32d have the same structure. The four analog circuit sections 32a, 32b, 32c, and 32d in the integrated circuit 3 are arranged in different directions. As described above, all of them are arranged in a manner such that the pad 322 is on the outside (see Fig.15 ).

[0095] Some of the plurality of pads 322 in each analog circuit portion 32 are electrically connected to the magnetic detection element 4 .

[0096] Here, connection of the plurality of pads 322 will be described in detail. More specifically, the plurality of pads 322 are connected, for example, in the following manner: pads 322x and 322y are electrically connected to both ends of the magnetically sensitive body 41 of the MI element 4, and pads 322v and 322w are electrically connected to both ends of the detection coil 42 of the MI element 4. Pads 322a, 322b, 322c, and 322d are electrically connected to a power source or a ground line.

[0097] Fig.17 It is a top view of the back surface of the integrated circuit 3 involved in the fifth embodiment. A plurality of solder balls 351 are evenly arranged on the back side of the integrated circuit 3. Although not shown in the figure, Fig.15 , Fig.16 The pads 322 and 334 in the integrated circuit 3 shown are connected to a part of the solder balls 351 via the wiring in the wiring substrate 2. It should be noted that, regarding the uniformly arranged plurality of solder balls 351, in order to make the shapes and gaps of the solder balls uniform in terms of assembly, unnecessary dummy solder balls 351 are also arranged. In addition, the material of the solder balls 351 is preferably a non-magnetic body, but may also be a magnetic body.

[0098] Fig.18 It is a cross-sectional view of the magnetic sensor device 1 according to the fifth embodiment. The magnetic detection element 4 is mounted on the wiring substrate 2 by wire bonding, and the integrated circuit 3 is mounted by ball bonding with the back side having the solder balls 351 facing the wiring substrate 2 (flip chip mounting). The magnetic detection element 4 mounted by wire bonding (bonding wire 8) is connected to the relay pads 61 and 62 of the wiring substrate 2 (see Figure 3 ) is connected to the integrated circuit 3 mounted by ball bonding (solder ball 351) and the chip connection pad 22 of the wiring substrate 2 (refer to Figure 3 ) is connected. The magnetic detection element 4 and the integrated circuit 3 are connected via the wiring layer 231 of the wiring substrate 2. Thus, the pads 322 in the analog circuit portion 32 and the pads 334 in the digital circuit portion 331 are connected to the wiring substrate 2, and can be connected to the outside of the integrated circuit 3 such as the magnetic detection element 4, or the outside of the magnetic sensor device 1.

[0099] In addition, if Fig.18 As shown, the wiring substrate 2 includes a conductor layer 232 having an electromagnetic shielding function such as a ground layer between the wiring layer 231 connected to the pad 334 and the magnetic detection element 4 and the integrated circuit 3 . An example of the circuit configuration of the magnetic sensor device 1 of this embodiment will be described later. Fig. 20 The following shall prevail.

[0100] As described above, in this embodiment, the integrated circuit 3 has a plurality of analog circuit units 32 electrically connected to the plurality of magnetic detection elements 4, respectively, so that the plurality of analog circuit units 32 can be independently controlled. For example, when four magnetic detection elements 4 are provided, the following functions can be provided: a high-speed mode for simultaneously (at a time) detecting four magnetic signals and outputting them to the outside, a phase mode for detecting the phases of the four magnetic signals and outputting them to the outside in sequence, a low power consumption mode for outputting only two magnetic signals to the outside because four magnetic signals are not required, and the like. That is, the magnetic sensor device 1 can be multifunctional.

[0101] In addition, the analog circuit units 32 and magnetic detection elements 4 connected to each other are adjacent to each other across the sides 31a, 31b, 31c, and 31d of the integrated circuit 3. Therefore, the distances between the plurality of magnetic detection elements 4 and the analog circuit units 32 of the integrated circuit 3 can be made equal. Thus, the deviation of the detection signal caused by the physical configuration can be suppressed, and the deviation caused by the time of signal transmission and reception between the analog circuit unit 32 and the magnetic detection element 4 can also be reduced.

[0102] Furthermore, by shortening the distance between the analog circuit unit 32 and the magnetic detection element 4 , which are connected to each other, it is also possible to reduce noise superimposed on the detection signal.

[0103] In addition, when viewed from the normal direction of the wiring substrate 2, an output circuit 332 is arranged between the plurality of analog circuit sections 32. Thus, it is easy to shorten the wiring distance between the output circuit 332 and each of the plurality of analog circuit sections 32. Thus, it is easy to increase the processing speed of the detection signal of the magnetic detection element 4, and it is possible to reduce the overlap of noise. In addition, it is easy to reduce the deviation of the wiring distance between the output circuit 332 and each of the plurality of analog circuit sections 32. In addition, since the distance between the output circuit 332 and the magnetic detection element 4 can be ensured, it is possible to suppress the situation where the communication signal between the output circuit 332 and the outside affects the magnetic detection element 4. In particular, by configuring the output circuit 332 in the central area of ​​the integrated circuit 3, the physical distances to each of the multiple analog circuit units 32 become equal, so that the effects of thermal noise, power supply, and ground caused by the operating current generated by the output circuit 332 can be made roughly equal relative to each magnetic detection element 4.

[0104] The analog circuit portions 32a, 32b, 32c, and 32d have their longitudinal directions parallel to the sides 31a, 31b, 31c, and 31d of the adjacent integrated circuit 3. This can shorten the distance between the analog circuit portion 32 and the magnetic detection element 4.

[0105] In addition, the integrated circuit 3 is flip-chip mounted on the wiring substrate 2. As a result, the output circuit 332 can be arranged in the central area of ​​the integrated circuit 3, and the signal can be easily output to the outside through the pad 334. In addition, since the integrated circuit 3 is flip-chip mounted on the wiring substrate 2, it is not necessary to use a bonding wire for the connection between the integrated circuit 3 and the wiring substrate 2. Therefore, the influence of the magnetic field caused by the current flowing through the bonding wire on the integrated circuit 3, which is a concern in the case of wire bonding mounting, can be eliminated. In addition, it has the same structure and effect as the second embodiment.

[0106] (Implementation method 6) Fig.19 1 is a top view of the magnetic sensor device 1 according to the sixth embodiment. Fig.15 ) are described in detail.

[0107] The integrated circuit 3 has a PLL circuit 335, a BGR circuit 336, an internal power supply generation circuit 337, a fuse circuit 338, and a decoupling circuit 339 formed in a region where the digital circuit section 31 and the four analog circuit sections 32 are not formed. These circuits are formed in a space adjacent to both sides of the analog circuit sections 32a and 32b in the X direction and also adjacent to both sides of the analog circuit sections 32c and 32d in the Y direction.

[0108] The PLL circuit 335 generates a clock required for the integrated circuit 3 based on a clock signal input from the outside through a circuit composed of a frequency divider, a multiplier, a phase comparator, and a VCO (Voltage Controlled Oscillator). The BGR circuit 336 generates an absolute reference voltage (or current) that does not depend on the power supply voltage, temperature, process, etc. The internal power supply generation circuit 337 is a circuit that generates an internal power supply required for the integrated circuit 3. The fuse circuit 338 is a circuit that turns off the MOSFET and cuts off the load (resistance) when an overcurrent is detected. The fuse circuit 338 outputs a signal of "1" when the load (resistance) is cut off, and outputs a signal of "0" when the load (resistance) is not cut off. It should be noted that a plurality of fuses are configured in the fuse circuit 338. Here, the digital circuit unit 31 combines the signals of a plurality of fuses to set the register setting and the product code. The decoupling circuit 339 is a circuit that suppresses noise and the like of the power supply and ground line of the analog circuit unit 32 and the digital circuit unit 331.

[0109] In addition, in the digital circuit section 331 in the integrated circuit 3, in addition to the control circuit and the output circuit 332 for controlling the analog circuit section 32, an SRAM 340 is also formed. The SRAM 340 mainly temporarily stores the digital signal generated by the AD conversion circuit 304. In addition, the SRAM 340 is also effectively used in the operation processing circuit. It should be noted that although not shown in the figure, the operation processing circuit is a part of the digital circuit section 331. In the operation processing circuit, a plurality of signals (information) are required. As an example, a plurality of digital signals generated by the AD conversion circuit 328 are used for average addition (processing), etc., and then the data of the operation processing is temporarily stored according to the situation.

[0110] Fig. 20 An example of a part of the circuit structure of the magnetic sensor device 1 of this embodiment is shown. The figure shows one of the multiple MI elements 4 provided in the magnetic sensor device 1 and an analog circuit unit 32 connected thereto. The pulse current circuit 302 can control the magnetic inductor 41 of the MI element 4 to flow and stop the pulse current. Through this control, a voltage (induced electromotive force) is generated at both ends of the detection coil 42 of the MI element 4. The sampling and holding circuit 303 is input with the voltage (signal) 1001 and 1002 generated at both ends of the detection coil 42. The input signals 1001 and 1002 are temporarily stored in the sampling and holding circuit 303. Here, the sampling and holding circuit 303 is composed of a switch 51 and a capacitor 52. Then, the temporarily stored analog signals 1003 and 1004 are amplified by the amplifier circuit 327. The analog signals 1005 and 1006 amplified by the amplifier circuit 327 are converted from analog signals to digital signals 1007 by the AD conversion circuit 304. It should be noted that the analog signals 1001 and 1002 are precharged to a given potential by the precharge circuit 50 for a certain period of time.

[0111] In this embodiment, by efficiently arranging each circuit in the integrated circuit 3, it is possible to increase the number of functions without increasing the occupied area. In addition, it has the same structure and effect as the fifth embodiment.

[0112] (Implementation 7) Fig.21 is a top view of the magnetic sensor device 1 according to Embodiment 7. Fig.14 The changes are described in detail. Fig.14 ), the difference is that the magnetic detection elements 4c and 4d having magnetic induction directions in the Y direction are not mounted. In addition, along with this, the analog circuit unit 32 is not provided at a position adjacent to the two sides 31c and 31d along the Y direction in the integrated circuit 3, which is also different from the fifth embodiment.

[0113] The magnetic sensor device 1 of this embodiment is different from the magnetic sensor device 1 of the embodiment 3 ( Fig.11 ) Similarly, there are two magnetic detection elements 4a and 4b having magnetic induction directions in the X direction. In addition, the integrated circuit 3 is provided with two analog circuit units 32a and 32b respectively connected to these magnetic detection elements 4a and 4b. The rest of the structure and effects are the same as those of the fifth embodiment.

[0114] As described above, the magnetic sensor device according to the present invention can provide a magnetic sensor device that facilitates high-precision magnetic detection and can be easily miniaturized.

[0115] It should be noted that the magnetic sensor device involved in the present invention can be used for a variety of purposes, such as: being mounted and used in a foreign matter detection device for detecting foreign matter (magnetic body) mixed in food, etc., a magnetic detection device used in an automatic driving system in a conveying equipment, a medical magnetic detection device for detecting biological magnetism, etc.

[0116] The present invention is not limited to the above-described embodiment, and can be applied to various embodiments without departing from the gist of the invention.

[0117] The features of the present invention are as follows. [1] A magnetic sensor device comprising: Wiring substrate; a plurality of magnetic detection elements mounted on the wiring substrate; and a rectangular integrated circuit mounted on the wiring substrate and electrically connected to the magnetic detection element, When viewed from the normal direction of the wiring substrate, the plurality of magnetic detection elements are arranged outside the integrated circuit. The magnetic detection elements are arranged at least along two sides of the integrated circuit that are opposed to each other, with their magnetic induction directions being parallel to each other. [2] The magnetic sensor device according to [1], wherein the magnetic detection element has a long strip shape, and the long side direction of the magnetic detection element is parallel to the side of the adjacent integrated circuit. [3] A magnetic sensor device according to [1] or [2], wherein the magnetic sensor device has four or more magnetic detection elements, and the magnetic detection elements are arranged at positions along four sides of the integrated circuit when viewed from the normal direction of the wiring substrate. [4] A magnetic sensor device according to any one of [1] to [3], wherein a relay pad and a connecting wiring are formed on the wiring substrate, the relay pad constitutes a part of the electrical path between the integrated circuit and the magnetic detection element, the connecting wiring electrically connects the relay pad to the integrated circuit, and the relay pad and the magnetic detection element are connected by a bonding wire, and when viewed from the normal direction of the wiring substrate, the bonding wire is arranged at a position that does not overlap with the integrated circuit. [5] The magnetic sensor device according to [4], wherein the relay pad is arranged at a position farther from the integrated circuit than an imaginary straight line obtained by extending each of the four sides of the integrated circuit when viewed from the normal direction of the wiring substrate. [6] The magnetic sensor device according to any one of [1] to [5], wherein the magnetic detection element is a magneto-impedance element. [7] A magnetic sensor device according to any one of [1] to [6], wherein the integrated circuit has a plurality of analog circuit units respectively connected to the plurality of magnetic detection elements, the analog circuit units having at least: a current application circuit that applies current to the magnetic detection elements; a sampling and holding circuit that receives an output signal of the magnetic detection elements; and an AD conversion circuit that converts the analog signal temporarily stored in the sampling and holding circuit into a digital signal, the analog circuit units connected to each other being adjacent to the magnetic detection elements across each side of the integrated circuit. [8] The magnetic sensor device according to [7], wherein an output circuit for outputting a signal from the integrated circuit to the outside is arranged between the plurality of analog circuit units when viewed in a normal direction to the wiring substrate. [9] A magnetic sensor device according to [7] or [8], wherein the magnetic detection element has a long strip shape, the long side direction of the magnetic detection element is parallel to the side of the adjacent integrated circuit, and the analog circuit unit has a long strip shape, the long side direction of the analog circuit unit is parallel to the side of the adjacent integrated circuit.

[10] A magnetic sensor device according to any one of [7] to [9], wherein the magnetic sensor device has four or more magnetic detection elements, and the magnetic detection elements are arranged at positions along four sides of the integrated circuit when viewed from the normal direction of the wiring substrate, and the integrated circuit has four or more analog circuit parts, and the analog circuit parts are arranged at positions along four sides of the integrated circuit when viewed from the normal direction of the wiring substrate.

[11] A magnetic sensor device according to

[10] , wherein, when viewed from the normal direction of the wiring substrate, an output circuit for outputting a signal from the integrated circuit to the outside is arranged between the multiple analog circuit parts arranged along two opposite sides of the integrated circuit, and between the multiple analog circuit parts arranged along the other two opposite sides of the integrated circuit.

[12] The magnetic sensor device according to any one of [7] to

[11] , wherein the integrated circuit is flip-chip mounted on the wiring substrate.

[13] The magnetic sensor device according to any one of [7] to

[12] , wherein the magnetic detection element is a magneto-impedance element, and the current application circuit is configured to apply a pulse current or a high-frequency current to the magnetic detection element.

Claims

1. A magnetic sensor device comprising: Wiring substrate; a plurality of magnetic detection elements mounted on the wiring substrate; and a rectangular integrated circuit mounted on the wiring substrate and electrically connected to the magnetic detection element, When viewed from the normal direction of the wiring substrate, the plurality of magnetic detection elements are arranged outside the integrated circuit. The magnetic detection elements are arranged at least along two sides of the integrated circuit that are opposed to each other, with their magnetic induction directions being parallel to each other.

2. The magnetic sensor device according to claim 1, wherein The magnetic detection element has a long strip shape, and a long side direction of the magnetic detection element is parallel to a side of the adjacent integrated circuit.

3. The magnetic sensor device according to claim 1 or 2, wherein: The magnetic sensor device includes four or more magnetic detection elements, and the magnetic detection elements are arranged at positions along four sides of the integrated circuit, respectively, when viewed in the normal direction of the wiring substrate.

4. The magnetic sensor device according to claim 1 or 2, wherein: A relay pad and a connection wiring are formed on the wiring substrate, the relay pad constituting a part of an electrical path between the integrated circuit and the magnetic detection element, and the connection wiring electrically connecting the relay pad and the integrated circuit. The relay pad is connected to the magnetic detection element via a bonding wire. The bonding wire is arranged at a position not overlapping with the integrated circuit when viewed from the normal direction of the wiring substrate.

5. The magnetic sensor device according to claim 4, wherein: When viewed in the normal direction of the wiring substrate, the relay pad is arranged at a position farther from the integrated circuit than an imaginary straight line obtained by extending each of four sides of the integrated circuit.

6. The magnetic sensor device according to claim 1 or 2, wherein: The magnetic detection element is a magneto-impedance element.

7. The magnetic sensor device according to claim 1, wherein: The integrated circuit includes a plurality of analog circuit sections connected to the plurality of magnetic detection elements, respectively. The analog circuit unit at least includes: a current applying circuit that applies a current to the magnetic detection element; a sampling and holding circuit that receives an output signal of the magnetic detection element; and an AD conversion circuit that converts the analog signal temporarily stored in the sampling and holding circuit into a digital signal. The analog circuit section and the magnetic detection element connected to each other are adjacent to each side of the integrated circuit.

8. The magnetic sensor device according to claim 7, wherein: When viewed from the normal direction of the wiring substrate, an output circuit for outputting a signal from the integrated circuit to the outside is arranged between the plurality of analog circuit portions.

9. The magnetic sensor device according to claim 7 or 8, wherein: The magnetic detection element has a long strip shape, and the long side of the magnetic detection element is parallel to the side of the adjacent integrated circuit. The analog circuit portion has a strip shape, and a long side direction of the analog circuit portion is parallel to a side of the adjacent integrated circuit.

10. The magnetic sensor device according to claim 7 or 8, wherein: The magnetic sensor device has four or more magnetic detection elements, and the magnetic detection elements are arranged at positions along four sides of the integrated circuit, respectively, when viewed in the normal direction of the wiring substrate. The integrated circuit has four or more analog circuit portions, and the analog circuit portions are arranged at positions along four sides of the integrated circuit, respectively, when viewed in the normal direction of the wiring substrate.

11. The magnetic sensor device according to claim 10, wherein: When observed from the normal direction of the wiring substrate, an output circuit for outputting a signal from the integrated circuit to the outside is arranged between the multiple analog circuit parts arranged along two opposite sides of the integrated circuit, and between the multiple analog circuit parts arranged along the other two opposite sides of the integrated circuit.

12. The magnetic sensor device according to claim 11, wherein The integrated circuit is flip-chip mounted on the wiring substrate.

13. The magnetic sensor device according to claim 7 or 8, wherein: The magnetic detection element is a magneto-impedance element, and the current application circuit is configured to apply a pulse current or a high-frequency current to the magnetic detection element.

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