Semiconductor conduit air supply type refrigeration helmet

Abstract

The semiconductor conduit air supply type refrigeration helmet is characterized by comprising a shell, a temperature control module is arranged on the rear portion of the shell, and the temperature control module comprises a control cabin, a power supply cabin, a ventilation cabin and an air supply cabin; the air supply cabin and the ventilation cabin are separated through a semiconductor chilling plate, a cold air fin is arranged on the side, located on the air supply cabin, of the semiconductor chilling plate, a cooling fin is arranged on the side, located on the ventilation cabin, of the semiconductor chilling plate, the air supply cabin is provided with a vortex fan, and the ventilation cabin is provided with an axial flow fan. An air duct is arranged at an outlet of the air supply cabin, an air supply guide pipe is matched with the air duct, and air subjected to heat exchange through the semiconductor chilling plate is evenly fed into the helmet through the air supply guide pipe. Air is supplied directionally, so that air supply is uniform and practical; the temperature of each point in the internal space of the helmet is effectively controlled and adjusted, so that a good refrigeration effect meeting the requirements of a user is achieved; the device can be applied to various helmets and is wide in application range; and no condensate water is separated out, so that a wearer feels comfortable.

Description

Technical Field

[0001] The invention relates to safety helmet technology, in particular to a semiconductor duct air supply type refrigeration helmet which utilizes semiconductor refrigeration principle and is combined with the helmet structure. Background Art

[0002] Helmets are widely used as necessary protective equipment for driving motorcycles, electric vehicles, bicycles and other life scenes, as well as necessary protective equipment for working scenes such as factories and construction sites. However, in summer or during high-intensity physical activities, helmets affect the heat dissipation of the human head. The head is the concentrated part of the human body's heat dissipation, and in this case, it will feel hot and stuffy. Therefore, there is a phenomenon that people are unwilling to wear helmets because they are not comfortable enough, which brings safety hazards.

[0003] In order to solve this problem, designs represented by the cooling helmet with patent publication number CN103120434A and the cooling helmet with patent publication number CN105559229A both use liquid cooling to cool the helmet. However, there are obvious problems with the use of liquid cooling in helmets, such as the complexity of the liquid cooling pipe process in the narrow space of the helmet, the risk of liquid leakage in the liquid cooling pipe, and a large amount of condensed water on the surface of the liquid cooling pipe that cannot be discharged.

[0004] Another example is a helmet with a refrigeration function represented by patent publication number CN114190641A and a refrigeration helmet with patent announcement number CN210043266U. Although semiconductor refrigeration is used to cool the helmet, the application method of semiconductor refrigeration only uses cold end radiation cooling. As a result, the cooling effect cannot be completely evenly distributed, resulting in uneven hot and cold inside the helmet. At the same time, the cold end of the semiconductor refrigeration plate is directly set in the helmet, which also has the problem of condensed water precipitation and inability to discharge.

[0005] In addition, there are usually two ways of cooling, one is radiation heat exchange and the other is convection heat exchange. The cooling methods used in the above-mentioned comparative documents are all radiation heat exchange, but for a small space like a helmet, the temperature difference needs to be strictly controlled considering the condensation problem, so a more reasonable cooling method is needed to complete the cooling function in the helmet. Summary of the invention

[0006] The purpose of the present invention is to solve the above-mentioned problems and to provide a semiconductor duct air supply type refrigeration helmet, which cools the fresh air through a semiconductor refrigeration device and evenly delivers it into the helmet through an air supply duct, thereby avoiding the phenomenon of condensation water precipitation caused by the cold end of the refrigeration device being directly arranged inside the helmet. The present invention has the characteristics of high heat exchange efficiency, convenient assembly operation, and temperature adjustment as needed.

[0007] The above technical problems of the present invention are mainly solved by the following technical solutions: a semiconductor duct air supply type refrigeration helmet, which is characterized in that it includes a shell, a temperature control module is provided at the rear part of the shell, and the temperature control module includes a control cabin, a power cabin, a ventilation cabin and an air supply cabin.

[0008] The air supply cabin and the ventilation cabin are separated by a semiconductor refrigeration sheet. The semiconductor refrigeration sheet is provided with cooling fins on one side of the air supply cabin, and the semiconductor refrigeration sheet is provided with heat dissipation fins on one side of the ventilation cabin. The air supply cabin is provided with a vortex fan, and the ventilation cabin is provided with an axial flow fan.

[0009] The outlet of the air supply cabin is provided with an air duct, and an air supply duct is provided in coordination with the air duct, and the air after heat exchange by the semiconductor refrigeration plate is evenly delivered into the helmet through the air supply duct.

[0010] In the aforementioned semiconductor duct air supply type refrigeration helmet, preferably, the air duct at the outlet of the air supply cabin is provided with an air distribution box, and the air supply duct is provided with a plurality of branch pipes, and the plurality of branch pipes are distributed by the air distribution box.

[0011] In the aforementioned semiconductor duct air supply type refrigeration helmet, preferably, the air supply duct includes a top air supply duct and a side air supply duct, and the air supply duct is provided with an air supply outlet.

[0012] In the aforementioned semiconductor duct air supply refrigeration helmet, preferably, a fresh air vent is provided at the bottom of the air supply cabin, an air inlet is provided at the bottom of the ventilation cabin, and a heat dissipation vent is arranged at the rear of the helmet in the ventilation cabin; the cold air fins are arranged vertically in the same direction as the air circulation direction.

[0013] In the aforementioned semiconductor duct air supply type refrigeration helmet, preferably, a controller is provided in the control cabin, and a plurality of sensors are provided in conjunction with the controller.

[0014] In the aforementioned semiconductor duct air supply refrigeration helmet, preferably, the sensor has temperature and humidity monitoring and data transmission functions, and the sensor includes an in-helmet sensor located in the helmet, an air supply sensor located in the air duct, and a cold end sensor and a hot end sensor arranged at both ends of the semiconductor refrigeration plate.

[0015] In the aforementioned semiconductor duct air supply type refrigeration helmet, preferably, the semiconductor refrigeration plate power supply is provided with a positive and negative pole switching switch.

[0016] In the aforementioned semiconductor duct air supply type refrigeration helmet, preferably, the temperature control module is assembled with the shell in a module-like manner, or is partially integrated with the shell.

[0017] In the aforementioned semiconductor duct air supply type refrigeration helmet, preferably, the air supply duct is a flat tube, and the direction and curvature of the air supply duct are adapted to the structure of the shell.

[0018] This technical solution utilizes semiconductor refrigeration to carry out air supply processing inside the helmet through an air supply duct. The air supply duct is designed according to the special structure of the helmet shell, and multiple air supply ducts are used to evenly supply air according to ergonomics. Air supply outlets are set on the inside of the air supply duct, thereby achieving the purpose of even air supply inside the helmet.

[0019] In this solution, a vortex fan is set for the air supply inside the helmet to change the air supply direction. The outdoor air exchanges heat with the cold air fins inside the semiconductor refrigeration plate through the air supply cabin. After the air temperature is reduced, it is sent into the air supply duct by the vortex fan and then into the helmet, ensuring comfortable and clean airflow for the helmet user.

[0020] On the other side of the semiconductor refrigeration chip, the heat of the heat dissipation fins is taken out by the axial flow fan, thus ensuring that the operating temperature of the hot end meets the use requirements. The hot and cold sides do not interfere with each other, allowing the semiconductor refrigeration chip to achieve the best heat exchange efficiency.

[0021] In order to ensure the cooling effect of the helmet and the effective operation of the semiconductor refrigeration system, this device is equipped with multiple sensors. All sensors have temperature and humidity monitoring and data transmission functions, and all kinds of data input are integrated into the controller. Through the setting of sensors, not only the cooling effect inside the helmet is guaranteed, but also the dew point temperature inside the helmet can be monitored to ensure that there is no condensation water precipitation, and the feedback control system adjusts the air supply temperature, the cooling power of the semiconductor refrigeration plate and other parameters. At the same time, the temperature at both ends of the semiconductor refrigeration plate is monitored to prevent damage to the refrigeration plate due to overcooling or overheating.

[0022] This solution is designed mainly for summer working conditions, but it also has the corresponding operating logic for winter working conditions. As long as the positive and negative poles of the semiconductor refrigeration power supply are switched, the cold end can be in a heating condition and the hot end can be in a cooling condition. In combination with the operation of the fan and the sensor, the heating effect inside the helmet can be achieved.

[0023] Compared with the prior art, the beneficial effects of the present invention are: utilizing the semiconductor refrigeration principle to process the air supply, and positioning the air supply in a direction through the air supply duct, so that the air supply maintains uniformity and practicality; and effectively controlling and adjusting the temperature of each point in the internal space of the helmet to achieve a good refrigeration effect that meets the requirements of the user; it can be applied to various types of helmets and has a wide range of adaptability; there is no condensation water precipitation phenomenon, so that the wearer feels comfortable. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a refrigeration principle diagram of the present invention.

[0025] Figure 2 It is a structural schematic diagram of a temperature control module of the present invention.

[0026] Figure 3It is a schematic structural diagram of an air supply duct embodiment of the present invention.

[0027] Figure 4 It is a schematic diagram of the structure of a wind box of the present invention.

[0028] Figure 5 The present invention is a schematic diagram of a helmet cross-section structure.

[0029] In the figure: 1-shell, 101-breathing hole, 2-temperature control module, 201-semiconductor refrigeration plate, 202-controller, 203-power supply, 204-vortex fan, 205-axial fan, 206-cold end sensor, 207-hot end sensor, 208-heat dissipation vent, 209-air supply sensor, 210-helmet sensor, 211-control cabin, 212-power cabin, 213-ventilation cabin, 214-air supply cabin, 215-cold air fin, 216-heat dissipation fin, 217-fresh air vent, 218-air inlet, 219-air duct, 3-air distribution box, 301-air supply interface, 302-top supply interface, 303-side supply interface, 4-air supply duct, 401-top supply duct, 402-side supply duct, 403-air supply vent. DETAILED DESCRIPTION

[0030] The technical solution of the present invention is further specifically described below through embodiments and in conjunction with the accompanying drawings.

[0031] This embodiment is a semiconductor duct air supply type refrigeration helmet, the appearance and basic structure are as follows Figure 5 As shown, it includes a helmet shell 1 with a full helmet structure. The shell 1 is made of materials such as carbon fiber or glass fiber. Goggles are provided at the front end of the helmet, and a windproof nose guard is provided below the goggles 3. A breathing hole 101 is provided at the windproof nose guard part. A temperature control module 2 is provided at the rear of the helmet. The temperature control module 2 is the cold and heat source for cooling and heating the helmet in this embodiment.

[0032] The temperature control module includes a control cabin 211, a power cabin 212, a ventilation cabin 213 and an air supply cabin 214. Figure 1 , Figure 2 As shown, the air supply cabin 214 and the ventilation cabin 213 are separated by the semiconductor cooling sheet 201 and the rib plate arranged inside the temperature control module, and the separation material between the air supply cabin 215 and the ventilation cabin 213 is made of heat-insulating material to strengthen the isolation and prevent the loss of heat and cold. The semiconductor cooling sheet 201 is provided with a cold air fin 215 on one side of the air supply cabin 214, and the cold air fin 215 is arranged vertically in the same direction as the air circulation direction; the semiconductor cooling sheet 201 is provided with a heat dissipation fin 216 on one side of the ventilation cabin 213. The number of semiconductor cooling sheets 205 can be set according to actual needs, for example, 1 sheet, 2 sheets, etc.

[0033] The air supply cabin 214 is provided with a vortex fan 204, and the ventilation cabin 213 is provided with an axial flow fan 205. The bottom of the air supply cabin 214 is provided with a fresh air vent 217, the bottom of the ventilation cabin 213 is provided with an air inlet 218, the ventilation cabin 213 is provided with a heat dissipation vent 208 arranged toward the rear of the helmet, and auxiliary air inlets are provided around the heat dissipation vent 208.

[0034] A controller 202 is provided in the control cabin 211, and a plurality of sensors are provided in conjunction with the controller 202. The sensors have the functions of temperature and humidity monitoring and data transmission. The sensors include at least an in-helmet sensor 210 located in the helmet, an air supply sensor 209 located in the air duct 219, and a cold end sensor 206 and a hot end sensor 207 arranged at both ends of the semiconductor refrigeration plate 201.

[0035] The power source compartment 212 is provided with a power source 203, which is a rechargeable lithium battery or other form. The battery can also be concealed as a whole, and a charging interface is reserved on the outside. The charging interface is convenient for long-term use of an external power source for continuous power supply. A cover is provided on the outside of the power source compartment 212 to facilitate battery replacement. When the battery is concealed as a whole and a charging interface is reserved, the cover may not be provided.

[0036] Thus, outdoor air enters from the fresh air vent 217, and is fully heat exchanged after passing through the cold air fins 215. The air that has completed the heat exchange is sent to the air supply duct 4 of the helmet through the vortex fan 204 and the air duct 209, thereby completing the preparation and delivery of the air supply. In actual application, the control cabin 211 and the controller 202 in the control cabin 211 are arranged in combination with the air supply cabin 214. The controller 202 is combined with sensors set in multiple places to realize the temperature control function of the refrigeration helmet.

[0037] A control cabin cover is provided inside the control cabin 211 to facilitate maintenance of the controller 202 .

[0038] The direction of the heat dissipation fins 216 of the semiconductor refrigeration plate 201 is not limited, because the direction in which outdoor air enters the ventilation cabin 213 is uncertain. For example, it enters through the air inlet 217 at the bottom, or enters from the air outlets around the heat dissipation vent 208 at the rear, and is blown out through the axial flow fan 205 after heat exchange through the heat dissipation fins 216, thereby completing the heat dissipation of the hot end of the semiconductor refrigeration plate 201.

[0039] Furthermore, an air duct 219 is provided at the outlet of the air supply cabin 214, and an air supply duct 4 is provided in cooperation with the air duct 219. The air supply duct 4 is prefabricated with PVC or other materials or laid with a flexible material that prevents collapse, and a flat tube structure is preferred. The direction and curvature of the air supply duct 4 are adapted to the structure of the shell 1. The air after heat exchange by the semiconductor cooling sheet 201 is evenly delivered into the helmet by the air supply duct 4.

[0040] Furthermore, an air distribution box 3 is provided in the air duct 219 at the outlet of the air supply cabin 214. The appearance of the air distribution box 3 matches the air duct 219. The air distribution box 3 includes an air supply interface 301 connected to the air supply cabin 214, a top supply interface 302 and a side supply interface 303 matched with the air supply duct 4. The air supply interface 301 is provided with a plurality of branch pipes, and the plurality of branch pipes are distributed by the air distribution box 3, such as Figure 3 As shown, the air supply duct 4 includes a top air supply duct 401 and a side air supply duct 402 which are matched with the air distribution box 3, and all the air supply ducts are provided with air supply vents 403.

[0041] Furthermore, when a cushion layer and an inner liner are installed in the shell 1, the cushion layer can be made of materials such as EPS, which can be squeezed and deformed when the helmet is impacted, absorb the impact force, and reduce the impact on the head. EPS materials are lightweight and easy to process. In order to meet the air supply requirements, combined with the air supply vent 403 on the inner side of the air supply duct 4, the cushion layer can be hollowed out to correspond to the air supply vent 403; the inner liner liner is mainly considered for wearing comfort, and velvet and other materials can be used. The inner liner liner is also hollowed out, and this hollowing is compatible with the air supply vent 403 and the cushion layer. The hollowing range of the inner liner liner can be more flexible, and the main principle is not to block the air supply.

[0042] In addition, the power supply of the semiconductor cooling plate 201 is provided with a positive and negative switch to realize other modes of operation. The temperature control module 2 and the housing 1 can be assembled in a modular manner, or can be partially combined with the housing.

[0043] The helmet in this embodiment can be a half helmet, a 3 / 4 helmet, an off-road helmet, etc., and its technical solutions can be inspired by the design principles of this embodiment.

[0044] The above embodiments are for explanation of the present invention, not for limitation of the present invention, and the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

Claims

1. A semiconductor duct air supply type refrigeration helmet, characterized in that It comprises a shell (1), a temperature control module (2) is provided at the rear portion of the shell, and the temperature control module comprises a control cabin (211), a power cabin (212), a ventilation cabin (213) and an air supply cabin (214); The air supply cabin and the ventilation cabin are separated by a semiconductor cooling plate (201), the semiconductor cooling plate is located on one side of the air supply cabin and is provided with a cooling fin (215), the semiconductor cooling plate is located on one side of the ventilation cabin and is provided with a heat dissipation fin (216), the air supply cabin is provided with a vortex fan (204), and the ventilation cabin is provided with an axial flow fan (205); The outlet of the air supply cabin is provided with an air duct (219), and an air supply conduit (4) is provided in coordination with the air duct, so that the air after heat exchange by the semiconductor refrigeration plate is evenly supplied into the helmet through the air supply conduit.

2. A semiconductor duct air supply type refrigeration helmet according to claim 1, characterized in that: The air duct (219) at the outlet of the air supply cabin (214) is provided with an air distribution box (3), and the air supply duct (4) is provided with a plurality of branch pipes, which are distributed by the air distribution box.

3. A semiconductor duct air supply type refrigeration helmet according to claim 1 or 2, characterized in that: The air supply duct (4) comprises a top air supply duct (401) and a side air supply duct (402), and an air supply vent (403) is provided on the air supply duct.

4. A semiconductor duct air supply type refrigeration helmet according to claim 1, characterized in that: The bottom of the air supply cabin (214) is provided with a fresh air outlet (217), the bottom of the ventilation cabin (213) is provided with an air inlet (218), and the ventilation cabin is provided with a heat dissipation outlet (208) toward the rear of the helmet; the cold air fins (215) are arranged vertically in the same direction as the air circulation direction.

5. The semiconductor duct air supply type refrigeration helmet according to claim 1, characterized in that: The control cabin (211) is provided with a controller (202), and a plurality of sensors are provided in conjunction with the controller.

6. A semiconductor duct air supply type refrigeration helmet according to claim 5, characterized in that: The sensor has the functions of temperature and humidity monitoring and data transmission, and comprises an in-helmet sensor (210) located in the helmet, an air supply sensor (209) located in the air duct (219), and a cold end sensor (206) and a hot end sensor (207) arranged at both ends of the semiconductor cooling plate (201).

7. The semiconductor duct air supply type refrigeration helmet according to claim 1, characterized in that: The power supply of the semiconductor refrigeration plate (201) is provided with a positive and negative pole switching switch.

8. The semiconductor duct air supply type refrigeration helmet according to claim 1, characterized in that: The temperature control module (2) and the housing (1) are matched in a module assembly manner, or are partially integrated with the housing.

9. The semiconductor duct air supply type refrigeration helmet according to claim 3, characterized in that: The air supply duct (4) is a flat tube, and the direction and curvature of the air supply duct are compatible with the structure of the shell (1).

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