A laser processing method for rotating body surface

Abstract

The present invention discloses a method for laser processing of a rotating body surface. The method comprises installing a galvanometer on a three-dimensional motion mechanism, and setting a rotating body to be processed on the rotating mechanism; configuring laser processing parameters, and importing a model of the rotating body to be processed; calibrating the spatial position relationship between the three-dimensional motion mechanism, the galvanometer and the rotating body to be processed, and correcting the galvanometer; planning the laser processing trajectory of the galvanometer and the motion trajectory of the three-dimensional motion mechanism; starting the rotating mechanism to make the rotating body to be processed in a rotating state, and collecting the rotation speed and position of the rotating body to be processed, and moving the center of the galvanometer to the starting position of the laser processing by controlling the three-dimensional motion mechanism, and then performing laser processing. The present invention ensures that the laser beam can accurately follow the surface of the rotating body to be processed for processing by real-time monitoring of the position of the laser beam and the rotation speed of the rotating body workpiece, thereby improving the processing accuracy and processing efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of laser processing, and in particular to a method for laser processing the surface of a rotating body. Background Art

[0002] In industrial manufacturing, many roller mechanical equipment are used, such as the printing plate roller in the ink printer in the printing industry, and the coating roller in the battery electrode coating machine in the battery industry. These rollers need regular cleaning and maintenance to remove dirt and attachments on the roller surface. Traditional cleaning methods mostly use handheld dry ice, sandblasting equipment or handheld laser cleaning equipment to manually clean the plate roller. The working distance of these processing heads is generally fixed, and manual cleaning actions cannot guarantee long-term fixed working distance operations. In addition, since the length of the roller is far beyond the processing range, it is necessary to move the processing head back and forth to extend the processing range. Therefore, the cleaning process is prone to repeated or missed cleaning surfaces, uneven cleaning effects, poor cleaning accuracy, low operating efficiency, and inability to operate automatically on a regular basis. In addition, dry ice cleaning equipment requires consumables and has a high comprehensive use cost. These problems are particularly prominent. Therefore, it is particularly important to develop an economical, efficient, and accurate laser processing method for the surface of rotating bodies such as rollers. Summary of the invention

[0003] The purpose of the present invention is to provide a laser processing method for the surface of a rotating body in view of the shortcomings of the prior art.

[0004] To achieve the above object, the present invention provides a method for laser processing the surface of a rotating body, comprising:

[0005] The galvanometer is mounted on a three-dimensional motion mechanism, the three-dimensional motion mechanism is used to adjust the position of the galvanometer, and the galvanometer is arranged on one side of the rotating body to be processed, the rotating body to be processed is arranged on the rotating mechanism, the rotating mechanism is used to drive the rotating body to be processed to rotate, and the galvanometer is arranged toward the rotating body to be processed;

[0006] Configure laser processing parameters and import the model of the rotating body to be processed;

[0007] Calibrate the spatial position relationship between the three-dimensional motion mechanism, the galvanometer and the rotating body to be processed, and calibrate the galvanometer;

[0008] Plan the laser processing trajectory of the galvanometer and the motion trajectory of the three-dimensional motion mechanism according to the imported rotating body model to be processed and the laser processing process requirements;

[0009] The rotating mechanism is started to put the rotating body to be processed into a rotating state, and the rotation speed and position of the rotating body to be processed are collected. The center of the galvanometer is moved to the starting position of the laser processing by controlling the three-dimensional motion mechanism, and then laser processing is performed according to the rotation speed and position of the rotating body to be processed, the laser processing trajectory of the galvanometer and the motion trajectory of the three-dimensional motion mechanism.

[0010] Furthermore, the rotating body to be processed is divided into a first section, a middle section and a last section in sequence along the length direction, and the laser processing trajectory of the galvanometer correspondingly includes a first section trajectory, a middle section trajectory and a last section trajectory, the lengths of the first section trajectory and the last section trajectory are both half of the maximum processing width of the galvanometer, and the middle section trajectory is rounded and divided into equal parts according to the length of the rotating body to be processed and the maximum processing width of the galvanometer; during laser processing, the three-dimensional motion mechanism drives the galvanometer to move at a uniform speed from the first section to the direction of the last section.

[0011] Furthermore, the rotation speed and position of the rotating body to be processed are collected based on an encoder arranged on the rotating mechanism.

[0012] Furthermore, the first segment trajectory is represented by an arithmetic progression Indicates that the first line segment in the first trajectory , the tolerance of the first trajectory , the nth line segment in the first trajectory , L is the maximum processing width of the galvanometer, r is the radius of the rotating body to be processed, i is the laser scanning line spacing, π is the circumference, , Is the rounding operator.

[0013] Furthermore, when the first section is laser processed, the laser is turned on according to the identification index signal of each circle of the encoder, so that the galvanometer processes the rotating body to be processed according to the first line segment in the first section of the track. During this period, when the encoder feedback signal is detected to detect that the rotating body to be processed rotates a line spacing i, the center of the galvanometer is controlled to move toward the middle direction. ; After the first line segment in the first track is processed, extend the first line segment in the first track in the direction of the galvanometer movement , and move in the opposite direction of the galvanometer , and then generate the second line segment in the first trajectory, so that the galvanometer processes the rotating body to be processed according to the second line segment in the first trajectory, and this cycle is repeated until the first laser processing is completed after the rotating body to be processed rotates one circle.

[0014] Furthermore, the middle segment trajectory is represented by a sequence It indicates that, , each line segment in the intermediate segment trajectory , m is the length of the rotating workpiece, .

[0015] Furthermore, when the workpiece rotates to the starting point of the second circle, the galvanometer processes the workpiece according to the first line segment in the middle segment trajectory. When the encoder feedback signal is detected to detect that the workpiece rotates a line spacing i, the center of the galvanometer is controlled to move Then, the rotating body to be processed is processed according to the second line segment in the middle segment trajectory, and this cycle continues until the rotating body to be processed completes the first rotation. The middle section is processed while turning.

[0016] Furthermore, the final trajectory is represented by an arithmetic progression Indicates that the first laser track in the final track , the tolerance of the final trajectory , the nth laser track in the final track .

[0017] Furthermore, at the end of the processing, when the rotating body to be processed rotates to the first At the starting point of the circle, the galvanometer processes the rotating body to be processed according to the first line segment in the last segment of the trajectory. During this period, the encoder feedback signal is detected to detect that the rotating body to be processed rotates a line spacing i, and at the same time, the center of the galvanometer is controlled to move to the direction of the middle. ; After the first line segment in the final trajectory is processed, the first line segment in the final trajectory is reduced in the direction of the galvanometer movement. , and move in the opposite direction of the galvanometer , and then generate the second line segment in the final trajectory, so that the galvanometer processes the rotating body to be processed according to the second line segment in the final trajectory, and repeats this cycle until the rotating body to be processed completes the first rotation. The final laser processing is completed when the circle is completed.

[0018] Furthermore, the galvanometer moves a set distance before and after emitting light, so that laser processing can be performed when the galvanometer moves at a constant speed.

[0019] Beneficial effects: The present invention uses a galvanometer system as a processing head and fixes the galvanometer on a three-dimensional motion mechanism. The entire mechanism can be set up on existing equipment, and the rotating body to be processed is fixed on the rotating mechanism of the equipment. According to the model of the rotating body to be processed and the processing technology requirements, the model of the rotating body to be processed is analyzed and processed to generate the motion trajectory of the three-dimensional motion mechanism and the laser processing trajectory of the galvanometer; the three-dimensional motion mechanism and the galvanometer are controlled to be linked, and the rotation speed and position of the rotating body to be processed are obtained through the encoder, and the laser processing is completed during the rotation of the rotating body to be processed; by real-time monitoring of the position of the laser beam and the rotation speed of the rotating workpiece, it is ensured that the laser beam can accurately follow the surface of the rotating body to be processed for processing, thereby improving the processing accuracy and processing efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 1 is a schematic flow chart of a method for laser processing a rotating body surface according to an embodiment of the present invention;

[0021] Figure 2 It is a schematic diagram of the structure of the equipment for laser processing the surface of a rotating body. DETAILED DESCRIPTION

[0022] The present invention is further explained below in conjunction with the accompanying drawings and specific embodiments. The embodiments are implemented based on the technical solution of the present invention. It should be understood that these embodiments are only used to illustrate the present invention and are not used to limit the scope of the present invention.

[0023] like Figure 1 and Figure 2 As shown, an embodiment of the present invention provides a method for laser processing a rotating body surface, comprising:

[0024] The galvanometer 4 is mounted on a three-dimensional motion mechanism, which is used to adjust the position of the galvanometer 4 and is arranged on one side of the rotating body 2 to be processed. The rotating body 2 to be processed is arranged on a rotating mechanism 8, which is used to drive the rotating body 2 to be processed to rotate, and the galvanometer 4 is arranged toward the rotating body 2 to be processed. For details, see Figure 2 , Figure 2The above-mentioned three-dimensional motion mechanism and rotation mechanism 8 are schematically shown, wherein the three-dimensional motion mechanism includes an X-axis 5, a Y-axis 7 and a Z-axis 6, and the X-axis 5 is mounted on the equipment support 3 where the rotating body 2 to be processed is located. The Z-axis 6 is mounted on the X-axis 5, the galvanometer 4 is mounted on the Y-axis 7, and the Y-axis 7 is mounted on the Z-axis 6, so that the three-dimensional motion mechanism can drive the galvanometer 4 to move forward, backward, left, right, up and down, and realize the position adjustment of the galvanometer 4. After the debugging is completed, the position of the galvanometer 4 in the direction of the Y-axis 7 and the Z-axis 6 remains unchanged, and the position in the direction of the X-axis 5 is adjusted during the processing. The galvanometer 4 is preferably a 3D galvanometer, which is a structure including a laser scanning head, a zoom third axis, a focusing lens (field lens), etc., which can realize three-dimensional curved surface processing. The above-mentioned galvanometer 4, the three-dimensional motion mechanism, and the rotation mechanism 8 are all connected to the control device 9, and the work is controlled by the control device 9.

[0025] Configure laser processing parameters and import the model of the rotating body 2 to be processed. The above laser processing parameters include three-dimensional motion mechanism parameters, such as the number of pulses per revolution, the movement distance per revolution, the maximum speed, the minimum speed, the acceleration and the zero return parameters, etc., as well as the galvanometer speed, the jump speed, the delay parameters, etc., as well as the laser power, frequency, pulse width, etc., to ensure the normal operation of the various actuators of the laser processing system. The above parameters are all existing technologies and will not be repeated here. After importing the model of the rotating body 2 to be processed, the parameters such as the length and radius of the rotating body 2 to be processed can be obtained.

[0026] The spatial position relationship between the three-dimensional motion mechanism, the galvanometer 4 and the rotating body 2 to be processed is calibrated, and the galvanometer 4 is corrected. The calibration is to facilitate the next step of generating the laser processing trajectory of the galvanometer 4 and the motion trajectory coordinates of the three-dimensional motion mechanism in the same coordinate system; the method of calibrating the spatial position of each mechanism and the correction method of the galvanometer 4 are both existing technologies and will not be repeated here.

[0027] The laser processing trajectory of the galvanometer 4 and the motion trajectory of the three-dimensional motion mechanism are planned according to the imported model of the rotating body 2 to be processed and the laser processing process requirements. Specifically, since the length of the rotating body 2 to be processed is greater than the maximum processing width of the galvanometer 4, the galvanometer 4 cannot complete the surface processing of the rotating body 2 to be processed at one time. The present application preferably divides the rotating body 2 to be processed into a first section, a middle section and a last section in the length direction, and the laser processing trajectory of the galvanometer 4 correspondingly includes a first section trajectory, a middle section trajectory and a last section trajectory, wherein the lengths of the first section trajectory and the last section trajectory are both half of the maximum processing width of the galvanometer 4, and the middle section trajectory is divided into integers according to the length of the rotating body 2 to be processed and the maximum processing width of the galvanometer 4.

[0028] The rotating mechanism 8 is started to work so that the rotating body 2 to be processed is in a rotating state, and the rotation speed and position of the rotating body 2 to be processed are collected, and the center of the galvanometer 4 is moved to the starting position of the laser processing by controlling the operation of the three-dimensional motion mechanism, and then the laser processing is performed according to the rotation speed and position of the rotating body 2 to be processed, the laser processing trajectory of the galvanometer 4 and the motion trajectory of the three-dimensional motion mechanism. In addition, during the laser processing, the above-mentioned three-dimensional motion mechanism preferably drives the galvanometer 4 to move at a uniform speed from the first section to the direction where the last section is located.

[0029] The rotation speed and position of the rotating body 2 to be processed are preferably collected based on the encoder 1 set on the rotating mechanism 8. The encoder 1 is preferably an incremental encoder, which converts the displacement into a periodic electrical signal, and then converts the electrical signal into a counting pulse, and uses the number of pulses to represent the size of the displacement. It directly uses the principle of photoelectric conversion to output three groups of square wave pulses A, B and Z phases. The phase difference between the A and B groups of pulses is 90 degrees, so that the rotation direction can be easily determined. The Z phase has one pulse per rotation, which is used for reference point positioning.

[0030] In the specific implementation, it is preferred to use an arithmetic progression to represent the first segment of the trajectory. Indicates that the first line segment in the first trajectory , tolerance of the first trajectory , the nth line segment in the first trajectory , L is the maximum processing width of the galvanometer 4, r is the radius of the rotating body 2 to be processed, i is the laser scanning line spacing, π is the circumference, , Is the rounding operator.

[0031] When the first section is laser processed, the laser is turned on according to the identification index signal of each circle of the encoder 1, so that the galvanometer 4 processes the rotating body 2 to be processed according to the first line segment in the first section track. During this period, the feedback signal of the encoder 1 is detected to detect that the rotating body 2 to be processed rotates a line spacing i, and at the same time, the center of the galvanometer 4 is controlled to move in the direction of the middle. ; After the first line segment in the first track is processed, extend the first line segment in the first track in the moving direction of the galvanometer 4 , and move in the opposite direction of the movement of the galvanometer 4 , and then generate the second line segment in the first track, so that the galvanometer 4 processes the rotating body 2 to be processed according to the second line segment in the first track. After the processing is completed according to the second line segment in the first track, the third line segment in the first track is generated by the above extension and reverse movement. This cycle is repeated until the rotating body 2 to be processed rotates one circle and the first laser processing is completed. In addition, since the first line segment in the first track is The length is set to 0, so the actual laser processing is actually the second line segment from the first trajectory. Starting from one end.

[0032] The above middle segment trajectory is represented by the sequence It indicates that, , each line segment in the middle segment trajectory , m is the length of the rotating workpiece, . The middle segment trajectory is divided into Each copy includes Line segments of equal length.

[0033] When the workpiece 2 rotates to the starting point of the second circle, the galvanometer 4 processes the workpiece 2 according to the first line segment in the middle segment trajectory. When the feedback signal of the encoder 1 is detected and the workpiece rotates a line spacing i, the center of the galvanometer 4 is controlled to move Then, the rotating body 2 to be processed is processed according to the second line segment in the middle segment trajectory, and this cycle is repeated until the rotating body 2 to be processed completes the first rotation. The middle section is processed while turning.

[0034] The above-mentioned final trajectory is expressed by an arithmetic progression Indicates that the first laser track in the final track , the tolerance of the final trajectory , the nth laser track in the final track .

[0035] At the end of the processing, when the rotating body 2 to be processed rotates to the first At the starting point of the circle, the galvanometer 4 processes the rotating body 2 to be processed according to the first line segment in the last segment of the trajectory. During this period, the feedback signal of the encoder 1 is detected to detect that the rotating body 2 to be processed rotates a line spacing i, and at the same time, the center of the galvanometer 4 is controlled to move to the middle direction. ; After the first line segment in the final trajectory is processed, the first line segment in the final trajectory is reduced in the moving direction of the galvanometer 4 , and move in the opposite direction of the movement of the galvanometer 4 , and then generate the second line segment in the final trajectory, so that the galvanometer 4 processes the rotating body 2 to be processed according to the second line segment in the final trajectory. After completing the processing according to the second line segment in the final trajectory, the third line segment in the final trajectory is generated by the above-mentioned reduction and reverse movement, and this cycle is repeated until the rotating body 2 to be processed completes the first rotation. The final laser processing is completed when the circle is completed.

[0036] In addition, in order to ensure the quality of laser processing and avoid the problem of the beginning and end of the laser processing trajectory, the galvanometer 4 will travel a set distance before and after the light is emitted to ensure that the laser processing is performed when the galvanometer 4 moves at a uniform speed.

[0037] The above is only a preferred embodiment of the present invention. It should be noted that for ordinary technicians in this technical field, other parts not specifically described belong to the prior art or common knowledge. Several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered as the protection scope of the present invention.

Claims

1. A method for laser processing of a rotating body surface, characterized in that: include: The galvanometer is mounted on a three-dimensional motion mechanism, the three-dimensional motion mechanism is used to adjust the position of the galvanometer, and the galvanometer is arranged on one side of the rotating body to be processed, the rotating body to be processed is arranged on the rotating mechanism, the rotating mechanism is used to drive the rotating body to be processed to rotate, and the galvanometer is arranged toward the rotating body to be processed; Configure laser processing parameters and import the model of the rotating body to be processed; Calibrate the spatial position relationship between the three-dimensional motion mechanism, the galvanometer and the rotating body to be processed, and calibrate the galvanometer; Plan the laser processing trajectory of the galvanometer and the motion trajectory of the three-dimensional motion mechanism according to the imported rotating body model to be processed and the laser processing process requirements; The rotating mechanism is started to work so that the rotating body to be processed is in a rotating state, and the rotation speed and position of the rotating body to be processed are collected, and the center of the galvanometer is moved to the starting position of the laser processing by controlling the operation of the three-dimensional motion mechanism, and then the laser processing is performed according to the rotation speed and position of the rotating body to be processed, the laser processing trajectory of the galvanometer and the motion trajectory of the three-dimensional motion mechanism; The rotating body to be processed is divided into a first section, a middle section and a last section in sequence along the length direction. The laser processing trajectory of the galvanometer includes a first section trajectory, a middle section trajectory and a last section trajectory. The lengths of the first section trajectory and the last section trajectory are both half of the maximum processing width of the galvanometer. The middle section trajectory is divided into integers according to the length of the rotating body to be processed and the maximum processing width of the galvanometer. During the laser processing, the three-dimensional motion mechanism drives the galvanometer to move at a uniform speed from the first section to the direction of the last section.

2. The method for laser processing the surface of a rotating body according to claim 1, characterized in that: The rotation speed and position of the rotating body to be processed are collected based on an encoder arranged on the rotating mechanism.

3. The method for laser processing the surface of a rotating body according to claim 2, characterized in that: The first segment trajectory is represented by an arithmetic progression {a1, a2, ..., a n } indicates that the first line segment a1 in the first segment of the trajectory is 0, and the tolerance of the first segment of the trajectory is The nth line segment in the first trajectory L is the maximum processing width of the galvanometer, r is the radius of the rotating body to be processed, i is the laser scanning line spacing, π is the circumference, [.] is the rounding operator.

4. The method for laser processing the surface of a rotating body according to claim 3, characterized in that: When the first section is laser processed, the laser is turned on according to the identification index signal of each circle of the encoder, so that the galvanometer processes the rotating body to be processed according to the first line segment in the first section of the track. During this period, the encoder feedback signal is detected to detect that the rotating body to be processed rotates a laser scanning line spacing i, and the center of the galvanometer is controlled to move to the middle direction. After the processing is completed according to the first line segment in the first trajectory, the first line segment in the first trajectory is extended in the direction of the galvanometer movement. At the same time, move in the opposite direction of the galvanometer movement Then, the second line segment in the first trajectory is generated, so that the galvanometer processes the rotating body to be processed according to the second line segment in the first trajectory, and this cycle is repeated until the first laser processing is completed after the rotating body to be processed rotates one circle.

5. The method for laser processing the surface of a rotating body according to claim 3, characterized in that: The intermediate segment trajectory is represented by the sequence {c1, c2, ..., c h } indicates that, Each line segment in the intermediate segment trajectory m is the length of the rotating body to be processed, and j=1, 2, ..., h.

6. The method for laser processing the surface of a rotating body according to claim 5, characterized in that: When the rotating body to be processed rotates to the starting point of the second circle, the galvanometer processes the rotating body to be processed according to the first line segment in the middle segment trajectory. By detecting the encoder feedback signal, it is detected that when the rotating body to be processed rotates a laser scanning line spacing i, the center of the galvanometer is controlled to move at the same time. Then the rotating body to be processed is processed according to the second line segment in the middle track, and this cycle continues until the rotating body to be processed completes the first rotation. The middle section is processed while turning.

7. The method for laser processing the surface of a rotating body according to claim 3, characterized in that: The final trajectory is represented by an arithmetic progression {b1, b2, ..., b n } indicates that the first laser track in the final track The tolerance of the final trajectory The nth laser track b in the final track n =0.

8. The method for laser processing the surface of a rotating body according to claim 7, characterized in that: At the end of the processing, when the rotating body to be processed rotates to the first At the starting point of the circle, the galvanometer processes the rotating body to be processed according to the first line segment in the last segment of the trajectory. During this period, the encoder feedback signal is detected to detect that the rotating body to be processed rotates a laser scanning line spacing i, and at the same time, the center of the galvanometer is controlled to move to the middle direction. After the processing is completed according to the first line segment in the final trajectory, the first line segment in the final trajectory is reduced in the direction of the galvanometer movement. At the same time, move in the opposite direction of the galvanometer movement Then the second line segment in the final trajectory is generated, so that the galvanometer processes the rotating body to be processed according to the second line segment in the final trajectory, and this cycle continues until the rotating body to be processed completes the first rotation. The final laser processing is completed when the circle is completed.

9. The method for laser processing the surface of a rotating body according to claim 1, characterized in that: The galvanometer moves a set distance before and after emitting light, so that laser processing can be performed when the galvanometer moves at a constant speed.

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