High-precision circuit additive manufacturing method based on aerosol jet printing

Abstract

The invention discloses a high-precision circuit additive manufacturing method based on aerosol jet printing, and relates to the technical field of intelligent manufacturing, additive manufacturing, printing electronics or ink jet printing. The method is used for solving the problem that printed patterns with specific resolution are difficult to obtain in an existing ink-jet printing technology. According to the method, the aerosol particle size is counted and calculated by using the mass weighting method, accurate parameter input is provided for CFD simulation, and the simulation precision is greatly improved. Through CFD simulation, a process window of aerosol jet printing is efficiently and accurately determined with low cost, and a printing graph with a specific resolution is rapidly obtained through a printing speed iteration method. The method provided by the invention is suitable for aerosol ink of various materials, and supports precise additive manufacturing of patterns with the resolution within 10-300 microns, and the average pattern precision error after five iterations is less than 2.2%.

Description

Technical Field

[0001] The present invention relates to the field of intelligent manufacturing, additive manufacturing, printed electronics or inkjet printing technology, and in particular to a high-precision circuit additive manufacturing method based on aerosol printing. Background Art

[0002] Traditional circuit manufacturing technology provides nanometer-level resolution, but processes such as photolithography and etching rely on expensive equipment and complex process flows. In addition, this type of subtractive manufacturing method causes resource waste and increases manufacturing costs. In comparison, inkjet printing, as an additive manufacturing technology, has the advantages of low cost, environmental friendliness, and high resolution, and has broad development and application prospects in the field of circuit manufacturing. Aerosol jet printing technology, as an emerging inkjet printing technology, has the advantages of fast printing speed, high throughput, and wide material compatibility. In particular, due to the convergence of sheath gas, aerosol jet printing has a high working height and excellent conformality to complex surfaces; in addition, the solid content of the ink used for aerosol jet printing can reach 50-60%, ensuring good adhesion to the substrate. Therefore, aerosol jet printing technology can not only manufacture planar circuits, but also is suitable for preparing conformal electronic circuits on tiny complex structure surfaces. However, it is a common problem of inkjet printing technology that it is difficult to obtain printed graphics with a specific resolution. Unlike technologies such as lithography and screen printing that rely on masks, aerosol printing is affected by the nozzle diameter, printing speed, carrier gas flow rate, sheath gas flow rate and other parameters. It has a strong dependence on process parameters and a narrow process window. Therefore, it is very difficult to obtain circuit graphics of a specific size using aerosol printing. Uncertain printing resolution will not only affect the performance of printed electronic devices, but may even cause circuit failures such as bridging and short circuits, which greatly limits the development and application of aerosol printing technology in the field of circuit precision manufacturing. Summary of the invention

[0003] The present invention is used to solve the problem that it is difficult to obtain printed graphics with a specific resolution using existing inkjet printing technology, thereby proposing a high-precision circuit additive manufacturing method based on aerosol printing, which is used to achieve controllable precision printing of graphics with a specific resolution.

[0004] To achieve the above object, the present invention provides the following solutions:

[0005] The present invention provides a high-precision circuit additive manufacturing method based on aerosol printing, the method comprising the following steps:

[0006] Step S1: obtaining simulation parameters: average particle size of independent aerosol particles;

[0007] Step S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model according to the set nozzle inner diameter, and setting boundary conditions;

[0008] Step S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculation;

[0009] Step S4: Select the carrier gas flow rate and the sheath gas flow rate according to the resolution of the target pattern, calculate the velocity distribution cloud map of the discrete phase in combination with the average particle size of the aerosol particles under the grid of step S3, and continuously adjust the carrier gas flow rate and the sheath gas flow rate so that the predicted printing resolution meets the requirements, and obtain the final carrier gas flow rate and the sheath gas flow rate;

[0010] Step S5: Printing is performed using the final carrier gas flow rate and sheath gas flow rate, and a pattern with a specified resolution is obtained by performing speed iteration through a binary method.

[0011] Furthermore, there is another preferred embodiment, the above step S1 is specifically as follows:

[0012] After selecting the printing ink, independent aerosol particles are obtained on the printing substrate at a small gas flow rate and a high printing speed, and the average particle size of the independent aerosol particles is calculated.

[0013] Furthermore, in a preferred embodiment, the above-mentioned small gas flow rate is specifically: carrier gas flow rate <5sccm, sheath gas flow rate <10sccm, and sheath gas flow rate / carrier gas flow rate <3; and the above-mentioned printing speed is >20mm / s.

[0014] Furthermore, in a preferred embodiment, the calculation formula for calculating the average particle size of the aerosol particles is:

[0015]

[0016] Among them, d n is the particle size of independent aerosol particles.

[0017] Furthermore, in a preferred embodiment, the inner diameter of the nozzle is 1.5-15 times the target graphic resolution.

[0018] Furthermore, there is another preferred embodiment, the above step S3 is specifically as follows:

[0019] Step S31: freely divide the finite element model into quadrilateral meshes, and the side length of the initial quadrilateral mesh at the nozzle is 1 / 5 of the inner diameter of the nozzle;

[0020] Step S32: Grid adaptability analysis: Calculate the velocity field of the multiphase flow under the conditions of a carrier gas flow rate of 10 sccm and a sheath gas flow rate of 20 sccm, continuously increase the grid density and obtain the maximum velocity of the multiphase flow under different grid densities, until the calculated maximum velocity is within 5% of the maximum velocity before the last increase in grid density.

[0021] Furthermore, there is another preferred embodiment, the above step S4 is specifically as follows:

[0022] Step S41: selecting the carrier gas flow rate and the sheath gas flow rate according to the formula: sheath gas flow rate / carrier gas flow rate=0.5×nozzle inner diameter / target image resolution;

[0023] Step S42: Calculate the velocity distribution cloud diagram of the discrete phase according to the average particle size of the aerosol particles, and measure the aerosol beam width W1 at the nozzle outlet;

[0024] Step S43: define the simulation predicted printing resolution W2=1.25×W1;

[0025] Step S44: continuously adjusting the carrier gas flow rate and the sheath gas flow rate so that (W2-W) / W<5%, and obtaining the final carrier gas flow rate and the sheath gas flow rate.

[0026] The high-precision circuit additive manufacturing method based on aerosol printing described in the present invention can be fully implemented by computer software. Therefore, correspondingly, the present invention also provides a high-precision circuit additive manufacturing system based on aerosol printing, and the system includes:

[0027] A storage device for obtaining simulation parameters: an average particle size of independent aerosol particles;

[0028] A storage device for setting the inner diameter of the nozzle according to the resolution of the target graphic, establishing a finite element model according to the set inner diameter of the nozzle, and setting boundary conditions;

[0029] A storage device for performing mesh adaptability analysis on a finite element model after meshing, and performing calculations using the analyzed mesh;

[0030] A storage device for selecting a carrier gas flow rate and a sheath gas flow rate according to the resolution of the target graphics, calculating a velocity distribution cloud diagram of the discrete phase in combination with the average particle size of the aerosol particles under the above-mentioned grid, and continuously adjusting the carrier gas flow rate and the sheath gas flow rate so that the predicted printing resolution meets the requirements, thereby obtaining the final carrier gas flow rate and the sheath gas flow rate;

[0031] A storage device for printing using the final carrier gas flow rate and sheath gas flow rate and obtaining a pattern of a specified resolution by speed iteration through a binary method.

[0032] The present invention also provides a computer-readable storage medium having a computer program stored thereon. When the computer program is executed by a processor, the high-precision circuit additive manufacturing method based on aerosol printing as described in any one of the above preferred embodiments is executed.

[0033] The present invention also provides a computer device, which includes a memory and a processor, wherein the memory stores a computer program. When the processor runs the computer program stored in the memory, the processor executes a high-precision circuit additive manufacturing method based on aerosol printing as described in any one of the above preferred embodiments.

[0034] The beneficial effects of the present invention are:

[0035] 1. The present invention proposes a high-precision circuit additive manufacturing method based on aerosol printing. By using the mass weighted method to statistically calculate the aerosol particle size, accurate parameter input is provided for CFD simulation, greatly improving the simulation accuracy. The process window of aerosol printing is determined low-cost, efficiently and accurately through CFD simulation, and a printed graphic with a specific resolution is quickly obtained through the printing speed iteration method.

[0036] 2. The method proposed in the present invention is applicable to aerosol inks of various materials, supports precision additive manufacturing of graphics with a resolution within 10-300 μm, and the average graphics accuracy error after five iterations is less than 2.2%. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0038] Figure 1 It is a schematic flow chart of a high-precision circuit additive manufacturing method based on aerosol printing according to the present invention;

[0039] Figure 2 is a schematic diagram of a scanning electron microscope photograph of the independent aerosol particles of the present invention;

[0040] Figure 3 is a schematic diagram of a CFD simulation model of the aerosol printing system of the present invention;

[0041] Figure 4 It is a discrete phase velocity distribution cloud diagram obtained by CFD simulation according to the present invention;

[0042] Figure 5 The ultra-high-precision printed graphics are obtained by combining the aerosol jet printing technology described in the present invention with nano silver particle ink after four speed iterations.

[0043] Among them, 1 represents the carrier gas inlet; 2 represents the sheath gas inlet; 3 represents the gas mixing chamber; 4 represents the conical nozzle; 5 represents the nozzle outlet; 6 represents the gas outlet; 7 represents the substrate; and 8 represents the aerosol beam at the nozzle outlet. DETAILED DESCRIPTION

[0044] In the following description, specific details such as specific system structures and technologies are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present application. However, it should be clear to those skilled in the art that the present application may also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, devices, circuits, and methods are omitted to prevent unnecessary details from obstructing the description of the present application.

[0045] The specific embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings. The following embodiments will help those skilled in the art to further understand the present invention, but do not limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

[0046] Implementation method 1: This implementation method aims to solve the problem that existing inkjet printing technology is difficult to obtain printed graphics with a specific resolution, and thus proposes a high-precision circuit additive manufacturing method based on aerosol printing to achieve controllable precision printing of graphics with a specific resolution.

[0047] The method comprises the following steps:

[0048] Step S1: obtaining simulation parameters: average particle size of independent aerosol particles;

[0049] Step S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model according to the set nozzle inner diameter, and setting boundary conditions;

[0050] Step S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculation;

[0051] Step S4: Select the carrier gas flow rate and the sheath gas flow rate according to the resolution of the target pattern, calculate the velocity distribution cloud map of the discrete phase in combination with the average particle size of the aerosol particles under the grid of step S3, and continuously adjust the carrier gas flow rate and the sheath gas flow rate so that the predicted printing resolution meets the requirements, and obtain the final carrier gas flow rate and the sheath gas flow rate;

[0052] Step S5: Printing is performed using the final carrier gas flow rate and sheath gas flow rate, and a pattern with a specified resolution is obtained by performing speed iteration through a binary method.

[0053] Implementation Method 2: See Figures 1 to 4 This embodiment is described. This embodiment specifically describes the high-precision circuit additive manufacturing method based on aerosol printing described in the first embodiment.

[0054] like Figure 1 As shown:

[0055] Step S1: obtaining simulation parameters: average particle size of independent aerosol particles;

[0056] Specifically include:

[0057] Printing inks are selected according to needs. The ink materials can be metal materials such as nanosilver, nanocopper, and nanogold for conductivity, polymer materials such as polyimide and methacrylate for insulation, sensing materials such as graphene, MXene, and PDOT:PSS for pressure, temperature, and humidity sensing, quantum dot materials such as ZnO and ZnS for luminescence, thermoelectric materials such as Bi2Te3 and PbTe for energy conversion, photoelectric materials such as perovskite and GaP, and energy storage materials such as MnSe, MnS, and VSe2. Aerosol particle size d droplet It is a core parameter that affects the accuracy of the simulation. Here, this implementation develops a quality weighted algorithm to calculate d droplet :Use a very small gas flow rate (carrier gas flow rate <5sccm, sheath gas flow rate <10sccm, sheath gas flow rate / carrier gas flow rate <3) and a very large printing speed (>20mm / s) to obtain independent aerosol particles on the printed substrate, such as Figure 2 As shown. The particle size dn of independent aerosol particles is calculated. For spherical aerosol particles, the particle size is the diameter of the sphere. For hemispherical aerosol particles, the particle size is the diameter of an equivalent spherical particle with the same volume as the hemisphere. Statistics are taken for n independent aerosol particles (n>200). Since large-mass aerosol particles play a decisive role in the movement of the discrete phase, the mass-weighted method is used to calculate the average particle size d of the aerosol particles. droplet As shown in formula (1).

[0058]

[0059] Among them, d n is the particle size of independent aerosol particles.

[0060] Step S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model according to the set nozzle inner diameter, and setting boundary conditions;

[0061] Specifically: Establishment of finite element model and setting of boundary conditions:

[0062] Select the appropriate size of nozzle according to the resolution of the target graphics. The inner diameter of the nozzle is 1.5-15 times the resolution of the target graphics. Small size nozzles are preferred to obtain higher printing accuracy and stability. According to the structure of the aerosol printing system, a finite element model is established. Figure 3 As shown. The simulation is based on the discrete phase model in computational fluid dynamics (CFD), with aerosol particles as the discrete phase and carrier gas and sheath gas flows as the continuous phase. The inner walls of the model are all shear conditions without slip and have a reflective effect on the discrete phase. The substrate is set as a fixed wall to capture the discrete phase. The gas outlet is set to atmospheric pressure, and the discrete phase can escape. The gravity acceleration value is set according to the environment.

[0063] Step S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculation;

[0064] Specifically: Grid division and grid adaptability analysis:

[0065] The model was divided into quadrilateral grids freely, and a denser grid was used at the nozzle to improve the calculation accuracy. The initial quadrilateral grid side length at the nozzle was 1 / 5 of the nozzle inner diameter. The grid adaptability analysis was performed, and the velocity field of the multiphase flow was calculated under the conditions of a carrier gas flow rate of 10sccm and a sheath gas flow rate of 20sccm. The grid density was continuously increased and the maximum velocity of the multiphase flow under different grid densities was obtained until the calculated maximum velocity differed from the maximum velocity before the last increase in grid density by less than 5%. The grid at this time was used for subsequent calculations.

[0066] Step S4: Select the carrier gas flow rate and the sheath gas flow rate according to the resolution of the target pattern, calculate the velocity distribution cloud map of the discrete phase in combination with the average particle size of the aerosol particles under the grid of step S3, and continuously adjust the carrier gas flow rate and the sheath gas flow rate so that the predicted printing resolution meets the requirements, and obtain the final carrier gas flow rate and the sheath gas flow rate;

[0067] Specifically: Prediction of printing resolution and determination of process window:

[0068] According to the target image resolution W, the carrier gas flow rate and sheath gas flow rate (sheath gas flow rate / carrier gas flow rate = 0.5 × nozzle inner diameter / target image resolution) are selected for simulation calculation, and the velocity distribution cloud diagram of the discrete phase is calculated under the corresponding gas flow rate and aerosol particle size, such as Figure 4 As shown, the aerosol beam width W1 at the nozzle outlet is measured. Considering the wetting and spreading of the ink on the substrate, the simulation predicted printing resolution W2 = 1.25 × W1 is defined. The carrier gas flow rate and sheath gas flow rate are adjusted to make (W2-W) / W < 5%. The carrier gas flow rate at this time is a and the sheath gas flow rate is b.

[0069] Step S5: Perform printing using the final carrier gas flow rate and sheath gas flow rate, and obtain a pattern with a specified resolution through velocity iteration using the bisection method.

[0070] Specifically: Obtaining a pattern with a specified resolution using the velocity iteration method:

[0071] Perform printing with a carrier gas flow rate of a and a sheath gas flow rate of b. First, use a relatively large printing speed v1 (> 15 mm / s) such that the printing resolution W v1 < W. Use the bisection method for velocity iteration (when W vn < W, let v n+1 = v n / 2; when W vn > W, let v n+1 = v n / 2 + v n-1 / 2;), until (W vn - W) / W is less than the acceptable manufacturing error.

[0072] In summary, the high-precision circuit additive manufacturing method based on aerosol jet printing proposed in this embodiment provides accurate parameter inputs for CFD simulation by using the mass-weighted method to statistically calculate the aerosol particle size, greatly improving the simulation accuracy. The process window of aerosol jet printing is determined by CFD simulation at low cost, efficiently, and accurately, and a printed pattern with a specific resolution is quickly obtained through the printing speed iteration method.

[0073] Embodiment Three. Refer to Figure 5 To illustrate this embodiment, this embodiment uses silver nanoparticles to manufacture a circuit with a specific resolution with high precision to verify the high-precision circuit additive manufacturing method based on aerosol jet printing described in the above embodiment.

[0074] Specifically:

[0075] 1. Obtaining simulation parameters:

[0076] Select the most representative silver nanoparticle conductive ink as the printing material. Independent aerosol particles are obtained on the printing substrate under the conditions of a carrier gas flow rate = 2 sccm, a sheath gas flow rate = 5 sccm, and a printing speed = 40 mm / s. The particle sizes dn of 300 independent aerosol particles are statistically analyzed. For spherical aerosol particles, the particle size is the diameter of the sphere, and for hemispherical aerosol particles, the particle size is the diameter of the equivalent spherical particle with the same volume as the hemisphere. The average particle size ddroplet of the aerosol particles is calculated to be 1.7 μm using the mass-weighted method as shown in Equation (2).

[0077]

[0078] 2. Establishment of the finite element model and setting of boundary conditions:

[0079] Select 50μm and 15μm as the resolution of the target graphics, and select a nozzle with an inner diameter of 150μm. Establish a finite element model based on the structure of the aerosol printing system. The simulation is based on the discrete phase model in computational fluid dynamics (CFD), with aerosol particles as the discrete phase and carrier gas and sheath gas flows as the continuous phase. The inner walls of the model are all shear conditions without sliding and have a reflective effect on the discrete type. The substrate is set as a fixed wall to capture the discrete phase. The gas outlet is set to atmospheric pressure, and the discrete phase can escape. The gravity acceleration value is set to 9.8m / s 2 .

[0080] 3. Grid division and grid adaptability analysis:

[0081] The model was divided into quadrilateral grids freely, and a denser grid was used at the nozzle to improve the calculation accuracy. The initial quadrilateral grid side length at the nozzle was 30μm. The grid adaptability analysis was performed, and the velocity field of the multiphase flow was calculated under the conditions of a carrier gas flow rate of 10sccm and a sheath gas flow rate of 20sccm. The grid density was continuously improved and the maximum velocity of the multiphase flow under different grid densities was obtained. The maximum velocity calculated when the quadrilateral grid side length at the nozzle was 10μm differed by 3.8% from the maximum velocity before the last increase in grid density. The grid at this time was used for subsequent calculations.

[0082] 4. Prediction of printing resolution and determination of process window:

[0083] Since the methods for obtaining the two target graphic resolutions are the same, only the manufacturing method for the 50μm target graphic is described in detail here. According to the target graphic resolution, the carrier gas flow rate = 10sccm and the sheath gas flow rate = 15sccm are selected for simulation calculation, and the aerosol beam width W1 at the nozzle outlet obtained by simulation is measured. Considering the wetting and spreading of the ink on the substrate, the simulation predicted printing resolution W2 = 1.25×W1 is defined. Adjust the carrier gas flow rate and the sheath gas flow rate. When the carrier gas flow rate = 10sccm and the sheath gas flow rate = 18sccm, (W2-W) / W = 4.6%.

[0084] 5. Speed ​​iteration method to obtain graphics with specified resolution

[0085] The acceptable manufacturing error is defined as 1%, and the carrier gas flow rate is 10 sccm and the sheath gas flow rate is 18 sccm for printing. First, a larger printing speed v1 = 20 mm / s is used to make the printing resolution W v1 =42.4μm<50μm, use the binary method to iterate the speed v2=10mm / s, W v1 =54.1μm; v3=15mm / s, W v3 =47.2μm; v4=12.5mm / s. Wv4 =49.6μm. (W v4 -50) / 50=0.8%. Through the above method, a high-precision circuit with an error within 1% was obtained using only four iterations. The manufacturing method with a target pattern resolution of 15μm is the same, and the obtained high-precision printed circuit is as follows Figure 5 shown.

[0086] Embodiment 4: This embodiment compares and explains the existing method with the high-precision circuit additive manufacturing method based on aerosol printing proposed in the above embodiment;

[0087] Specifically:

[0088] Traditional method: Controlling the resolution of printed graphics by controlling the flow of carrier gas and sheath gas:

[0089] Traditionally, the resolution of printed graphics is usually adjusted by controlling the flow rates of carrier gas and sheath gas. Therefore, this comparative example uses silver nanoparticle ink, selects 50 μm as the target graphics resolution, adjusts the printed graphics resolution by controlling the gas flow rate, and compares it with the above-mentioned embodiment 3.

[0090] The initial carrier gas flow rate a1 = 10 sccm, the sheath gas flow rate b1 = 15 sccm, and the printing speed v1 = 20 mm / s were selected for the experiment. b1 =58.7μm, keep the carrier gas flow rate and printing speed unchanged, use the dichotomy method to adjust the sheath gas flow rate b2 = 30sccm, W b2 =15.1μm; b3=22.5sccm, W b3 =26.4μm; b4=19sccm, W b4 =39.1μm. (W b4 -50) / 50=21.8%.

[0091] The circuit resolution error obtained after four iterations is 21.8%, which is much larger than the manufacturing error of 0.8% obtained after four iterations of the high-precision circuit additive manufacturing method proposed in the above embodiment. Therefore, the high-precision circuit additive manufacturing method proposed in the above embodiment has obvious advantages over the traditional method.

[0092] Implementation method 5: This implementation method compares the simulation results obtained without using aerosol particle size input with the actual results, so as to illustrate that the mass weighted method proposed in the above implementation method for statistically calculating aerosol particle size can greatly improve the simulation accuracy.

[0093] Specifically:

[0094] To demonstrate the advancedness of the mass-weighted method used in the above embodiment for statistically calculating the aerosol particle size, this comparative example uses silver nanoparticle ink, selects 50 μm as the resolution of the target graphic, and uses 2 μm, which is commonly used in simulations, as the approximate particle size of the aerosol particles for calculation.

[0095] A nozzle with an inner diameter of 150 μm was selected. A finite element model was established according to the structure of the aerosol printing system. The simulation was based on the discrete phase model in computational fluid dynamics (CFD), where the aerosol particles were the discrete phase and the carrier gas and sheath gas flow were the continuous phase. The inner walls of the model were all in non-slip shear conditions and had a reflective effect on the discrete type. The substrate was set as a fixed wall to capture the discrete phase. The gas outlet was set to atmospheric pressure, and the discrete phase could escape. The gravity acceleration value was set to 9.8 m / s 2 .

[0096] The model was divided into quadrilateral grids freely, and a denser grid was used at the nozzle to improve the calculation accuracy. The initial quadrilateral grid side length at the nozzle was 30μm. The grid adaptability analysis was performed, and the velocity field of the multiphase flow was calculated under the conditions of a carrier gas flow rate of 10sccm and a sheath gas flow rate of 20sccm. The grid density was continuously increased and the maximum velocity of the multiphase flow under different grid densities was obtained. The maximum velocity calculated when the quadrilateral grid side length at the nozzle was 10μm differed by 3.5% from the maximum velocity before the last increase in grid density. The grid at this time was used for subsequent calculations.

[0097] According to the target graphic resolution, the carrier gas flow rate = 10sccm and the sheath gas flow rate = 15sccm are selected for simulation calculation, and the aerosol beam width W1 at the nozzle outlet obtained by simulation is measured. Considering the wetting and spreading of the ink on the substrate, the simulation predicted printing resolution W2 = 1.25 × W1 is defined. The carrier gas flow rate and the sheath gas flow rate are adjusted. When the carrier gas flow rate = 8sccm and the sheath gas flow rate = 18.5sccm, (W2-W) / W = 3.2%.

[0098] The printing was performed with a carrier gas flow rate of 8 sccm, a sheath gas flow rate of 18.5 sccm, and a printing speed of v = 20 mm / s. The initial printing resolution W v =33.9μm, (W v -50) / 50=32.2%, the initial printing resolution obtained by using the mass weighted method to statistically calculate the aerosol particle size as the simulation parameter input method is 42.4μm, (42.4-50) / 50=15.2%. Therefore, the mass weighted method proposed in the above embodiment to statistically calculate the aerosol particle size can greatly improve the simulation accuracy.

[0099] Embodiment 6: The high-precision circuit additive manufacturing method based on aerosol printing described in the above embodiment can be fully implemented by computer software. Therefore, correspondingly, this embodiment provides a high-precision circuit additive manufacturing system based on aerosol printing, and the system includes a storage device, which is used to perform the following steps:

[0100] Step S1: obtaining simulation parameters: average particle size of independent aerosol particles;

[0101] Step S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model according to the set nozzle inner diameter, and setting boundary conditions;

[0102] Step S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculation;

[0103] Step S4: Select the carrier gas flow rate and the sheath gas flow rate according to the resolution of the target pattern, calculate the velocity distribution cloud map of the discrete phase in combination with the average particle size of the aerosol particles under the grid of step S3, and continuously adjust the carrier gas flow rate and the sheath gas flow rate so that the predicted printing resolution meets the requirements, and obtain the final carrier gas flow rate and the sheath gas flow rate;

[0104] Step S5: Printing is performed using the final carrier gas flow rate and sheath gas flow rate, and a pattern with a specified resolution is obtained by performing speed iteration through a binary method.

[0105] Embodiment 7: This embodiment provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, a high-precision circuit additive manufacturing method based on aerosol printing as described in any one of the above embodiments is executed.

[0106] Embodiment 8. The present invention further provides a computer device, comprising a memory and a processor, wherein the memory stores a computer program, and when the processor runs the computer program stored in the memory, the processor executes a high-precision circuit additive manufacturing method based on aerosol printing as described in any one of the above embodiments.

[0107] A computer device provided in this embodiment, the hardware device of this part is a general model and is not shown in the form of a diagram. The system includes a processor and a memory, wherein the processor and the memory can be connected via a bus or other means. The memory is a non-transitory computer-readable storage medium that can be used to store non-transitory software programs, non-transitory computer executable programs and modules, and corresponding program instructions / modules. The processor executes various functional applications and data processing of the processor by running the non-transitory software programs, instructions and modules stored in the memory, so as to realize the high-precision circuit additive manufacturing method and steps based on aerosol printing in the above method implementation.

[0108] It should be understood that when used in this specification and the appended claims, the term "comprising" indicates the presence of described features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof.

[0109] The above description is only the implementation mode of the present invention and is not limited to the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention shall be included in the scope of the claims of the present invention.

Claims

1. A high-precision circuit additive manufacturing method based on aerosol printing, characterized in that: The method is: S1: Get simulation parameters: average particle size of independent aerosol particles; S2: setting the nozzle inner diameter according to the resolution of the target graphic, establishing a finite element model according to the set nozzle inner diameter, and setting boundary conditions; S3: After meshing the finite element model, perform mesh adaptability analysis and use the analyzed mesh for calculation; S4: Select the carrier gas flow rate and the sheath gas flow rate according to the resolution of the target pattern, calculate the velocity distribution cloud map of the discrete phase in combination with the average particle size of the aerosol particles under the grid of step S3, and continuously adjust the carrier gas flow rate and the sheath gas flow rate so that the predicted printing resolution meets the requirements, and obtain the final carrier gas flow rate and the sheath gas flow rate; S5: Print using the final carrier gas flow rate and sheath gas flow rate and perform speed iterations by bisection to obtain a pattern with a specified resolution.

2. A high-precision circuit additive manufacturing method based on aerosol printing according to claim 1, characterized in that: S1 specifically includes: after selecting printing ink, obtaining independent aerosol particles on the printing substrate at a small gas flow rate and a high printing speed and calculating the average particle size of the independent aerosol particles.

3. The high-precision circuit additive manufacturing method based on aerosol printing according to claim 2, characterized in that: The specific minimum gas flow rates are: carrier gas flow rate <5 sccm, sheath gas flow rate <10 sccm, sheath gas flow rate / carrier gas flow rate <3; printing speed >20 mm / s.

4. The high-precision circuit additive manufacturing method based on aerosol printing according to claim 2, characterized in that: The calculation formula for the average particle size of aerosol particles is: Among them, d n is the particle size of independent aerosol particles.

5. The high-precision circuit additive manufacturing method based on aerosol printing according to claim 1, characterized in that: The inner diameter of the nozzle is 1.5-15 times the target pattern resolution.

6. The high-precision circuit additive manufacturing method based on aerosol printing according to claim 1, characterized in that: S3 is specifically: S31: The finite element model is freely divided into quadrilateral meshes, and the side length of the initial quadrilateral mesh at the nozzle is 1 / 5 of the inner diameter of the nozzle; S32: Grid adaptability analysis: Calculate the velocity field of the multiphase flow under the conditions of a carrier gas flow rate of 10 sccm and a sheath gas flow rate of 20 sccm, continuously increase the grid density and obtain the maximum velocity of the multiphase flow under different grid densities until the calculated maximum velocity is within 5% of the maximum velocity before the last increase in grid density.

7. The high-precision circuit additive manufacturing method based on aerosol printing according to claim 1, characterized in that: S4 is specifically: S41: According to the formula: sheath gas flow rate / carrier gas flow rate=0.5×nozzle inner diameter / target image resolution W, select the carrier gas flow rate and the sheath gas flow rate; S42: Calculate the velocity distribution cloud diagram of the discrete phase according to the average particle size of the aerosol particles, and measure the aerosol beam width W1 at the nozzle outlet; S43: define the printing resolution W2=1.25×W1 predicted by simulation; S44: Continuously adjust the carrier gas flow rate and the sheath gas flow rate so that (W2-W) / W<5%, and obtain the final carrier gas flow rate and the sheath gas flow rate.

8. A high-precision circuit additive manufacturing system based on aerosol printing, characterized in that: The system comprises a storage device, and the storage device is used to execute the method of claim 1.

9. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the high-precision circuit additive manufacturing method based on aerosol printing as described in any one of claims 1 to 7 is executed.

10. A computer device, characterized in that: The device includes a memory and a processor, wherein a computer program is stored in the memory. When the processor runs the computer program stored in the memory, the processor executes a high-precision circuit additive manufacturing method based on aerosol printing as described in any one of claims 1 to 7.

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