Semiconductor refrigeration device and method of operating the same

Abstract

The application relates to the technical field of semiconductor air conditioners, in particular to a semiconductor refrigeration device and a running method thereof. The semiconductor refrigeration device comprises a semiconductor assembly which comprises a single-stage semiconductor and a multi-stage semiconductor, the single-stage semiconductor and the multi-stage semiconductor are arranged in parallel; a cold storage assembly which is used for accommodating a cold storage element, and the cold end of the semiconductor assembly is connected with the cold storage assembly; when the user end does not need cold, the semiconductor assembly is operated to store the cold quantity generated by the cold end of the semiconductor assembly in the cold storage assembly; when the user end needs cold, the cold storage assembly is used for outputting the cold quantity to the user end to reduce the temperature of the user end. During the cold storage of the semiconductor refrigeration device, firstly, the single-stage semiconductor is operated, and when the refrigeration effect of the single-stage semiconductor is weakened, the multi-stage semiconductor starts to work to compensate for the insufficient refrigeration capacity of the single-stage semiconductor, so that the refrigeration capacity of the semiconductor assembly in a certain period of time can be improved, and the cold quantity stored in the cold storage assembly in a certain period of time can be increased.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor air conditioning, in particular to a semiconductor refrigeration device and a running method thereof. BACKGROUND

[0002] The semiconductor refrigeration device is a device for obtaining cold energy by using the thermoelectric effect of semiconductor, also known as thermoelectric refrigeration device. When a conductor is connected between two different metals and a direct current is connected, the temperature at one junction is reduced and the temperature at the other junction is increased.

[0003] After the semiconductor thermoelectric element is connected to the power supply, electron-hole pairs are generated near the upper junction, the internal energy is reduced, the temperature is reduced, and heat is absorbed from the outside, which is called the cold end. The other end increases the internal energy due to the recombination of electron-hole pairs, the temperature rises, and heat is released to the environment, which is called the hot end. The temperature difference and the cold energy generated by a pair of semiconductor thermoelectric elements are very small, so the semiconductor refrigeration technology in the prior art is mainly used for cooling some components in electronic equipment and radio communication equipment.

[0004] In the prior art, in order to apply the semiconductor refrigeration technology to household products for refrigerating a room, a plurality of pairs of semiconductor thermoelectric elements are combined in parallel and in series to form a semiconductor refrigeration device, also known as a semiconductor thermoelectric stack, to increase the temperature difference between the cold end and the hot end. However, due to the small refrigeration coefficient of the semiconductor, the power consumption is relatively large, and when the number of semiconductor thermoelectric elements increases, the energy consumption of the refrigeration device will increase rapidly, resulting in a high energy consumption of the household product related to the semiconductor refrigeration technology, and a high operating cost, which is difficult to promote and apply in the market. SUMMARY

[0005] Therefore, the technical problem to be solved by the present application is to overcome the defect that the household product related to the semiconductor refrigeration technology in the prior art has a high energy consumption, so as to provide a semiconductor refrigeration device and a running method thereof.

[0006] In order to solve the above technical problem, the present application provides a semiconductor refrigeration device, comprising:

[0007] A semiconductor assembly comprising a single-stage semiconductor and a multi-stage semiconductor, the single-stage semiconductor and the multi-stage semiconductor being connected in parallel;

[0008] A cold storage assembly for accommodating a cold storage element, the cold end of the semiconductor assembly being connected to the cold storage assembly;

[0009] When the user end does not need to use cold, the semiconductor assembly operates to store the cold energy generated by the cold end of the semiconductor assembly in the cold storage assembly; when the user end needs to use cold, the cold storage assembly is used to output cold energy to the user end to cool the user end.

[0010] Optionally, a temperature detection element is installed in the cold storage assembly.

[0011] Optionally, a cold conducting member is installed in the cold storage assembly, one end of the cold conducting member is fixedly connected with the cold end of the semiconductor assembly, and the other end extends into the inner cavity of the cold storage assembly.

[0012] Optionally, the cold conducting member comprises a fixed part and a plurality of temperature transmission parts, the fixed part is fixedly installed on the cold storage assembly, and the plurality of temperature transmission parts are arranged at intervals on the fixed part and extend into the inner cavity of the cold storage assembly.

[0013] Optionally, a heat dissipation assembly is installed on the hot end of the semiconductor assembly.

[0014] The application further provides a running method of the semiconductor refrigeration device, which applies the semiconductor refrigeration device.

[0015] Start the single-stage semiconductor to make the temperature of the cold storage member in the cold storage assembly decrease;

[0016] Judge whether the temperature of the cold storage member reaches a first preset value, if yes, start the multi-stage semiconductor to make the temperature of the cold storage member in the cold storage assembly continue to decrease.

[0017] Optionally, the step of judging whether the temperature of the cold storage member reaches the first preset value comprises:

[0018] The temperature detection member detects a first temperature value of the cold storage member;

[0019] After a predetermined time interval, the temperature detection member detects a second temperature value of the cold storage member;

[0020] Judge whether the difference between the first temperature value and the second temperature value is less than a preset temperature difference value.

[0021] Optionally, the step of judging whether the temperature of the cold storage member reaches the first preset value comprises:

[0022] The temperature detection member detects a first temperature difference value of the cold storage member after the single-stage semiconductor starts to work to a first predetermined time interval;

[0023] The temperature detection member detects a second temperature difference value of the cold storage member after a subsequent arbitrary predetermined time interval;

[0024] Judge whether the ratio of the first temperature difference value to the second temperature difference value is greater than a preset ratio value.

[0025] Optionally, the method further comprises judging whether the temperature of the cold storage member reaches a second preset value, if yes, the single-stage semiconductor is closed and the multi-stage semiconductor works alone.

[0026] Optionally, determining whether the temperature of the cold storage reaches the second preset value comprises: determining whether the temperature difference between the cold end and the hot end of the single-stage semiconductor is greater than a preset temperature span value.

[0027] The technical scheme has the following advantages:

[0028] 1. The semiconductor refrigeration device provided by the application comprises: a semiconductor assembly comprising a single-stage semiconductor and a multi-stage semiconductor, the single-stage semiconductor and the multi-stage semiconductor being arranged in parallel; a cold storage assembly for accommodating a cold storage, the cold end of the semiconductor assembly being connected to the cold storage assembly; when the user end does not need to use cold, the semiconductor assembly operates to store the cold generated by the cold end of the semiconductor assembly in the cold storage assembly; and when the user end needs to use cold, the cold storage assembly is used to output cold to the user end to cool the user end.

[0029] When the semiconductor refrigeration device is working, the semiconductor assembly is used to store cold in the cold storage assembly during the idle time, and the cold is stored and kept warm in the cold storage assembly. When the user end needs to use cold, the semiconductor assembly does not work, and the cold storage assembly takes out the cold from the cold storage assembly to supply cold to the user end. By using the long idle time of the refrigeration device to store cold, the power requirement of the cold storage process can be reduced, and the energy consumption of the semiconductor refrigeration device can be greatly reduced. During the cold storage of the semiconductor refrigeration device, the single-stage semiconductor is first made to work. At the beginning of work, the temperature difference between the cold side and the hot side of the single-stage semiconductor is small. As the single-stage semiconductor continues to work, the temperature difference between the cold side and the hot side gradually increases, and the working efficiency of the single-stage semiconductor gradually decreases, and the refrigeration effect becomes weaker. At this time, the multi-stage semiconductor starts to work. Since the refrigeration capacity of the multi-stage semiconductor decreases at a slower rate as the temperature difference increases, the multi-stage semiconductor can still work at a high efficiency under the current temperature difference to make up for the insufficient refrigeration capacity of the single-stage semiconductor. By using the single-stage semiconductor and the multi-stage semiconductor to work in stages, the refrigeration capacity of the semiconductor assembly can be improved within a certain time, and the amount of cold stored in the cold storage assembly within a certain time can be increased. In the cold use stage, the cold storage assembly can meet higher refrigeration requirements, so that the semiconductor refrigeration device can meet the use requirements of kitchen, bathroom and other household rooms.

[0030] 2. The semiconductor refrigeration device operation method provided by the present application, which applies the semiconductor refrigeration device provided by the present application, comprises the following steps: starting single-stage semiconductor operation to make the temperature of the cold storage component in the cold storage assembly decrease; judging whether the temperature of the cold storage component reaches a first preset value, if yes, starting multi-stage semiconductor operation to make the temperature of the cold storage component in the cold storage assembly continue to decrease. By using single-stage semiconductor and multi-stage semiconductor to work together, the time for the semiconductor assembly to reach the maximum temperature difference and stop refrigeration is prolonged, so that the semiconductor refrigeration device can store more cold energy during the cold storage period, and more cold energy can be provided when the user needs cold, so that the semiconductor refrigeration device can meet more refrigeration use requirements.

[0031] 3. The semiconductor refrigeration device operation method provided by the present application, the step of judging whether the temperature of the cold storage component reaches a first preset value comprises: obtaining a first temperature value of the cold storage component by a temperature detection component; obtaining a second temperature value of the cold storage component by the temperature detection component after a predetermined time interval; judging whether the difference between the first temperature value and the second temperature value is less than a preset temperature difference. By detecting the temperature change of the cold storage component to control the intervention time of the multi-stage semiconductor, the cold storage component can maintain a high cooling rate during the cold storage period, and the cold storage capacity of the cold storage component in a certain period of time is improved.

[0032] 4. The semiconductor refrigeration device operation method provided by the present application further comprises judging whether the temperature of the cold storage component reaches a second preset value, if yes, closing the single-stage semiconductor and making the multi-stage semiconductor work alone. When the temperature of the cold storage component decreases to the second preset value, the temperature difference between the cold end and the hot end of the single-stage semiconductor is large, which will cause low refrigeration capacity of the single-stage semiconductor, so the single-stage semiconductor is stopped to work, which can reduce the functional energy consumption of the semiconductor assembly. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or prior art description. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0034] Figure 1 The structure diagram of the semiconductor refrigeration device provided in the embodiments of the present application.

[0035] Explanation of reference numerals: 1, cold storage assembly; 2, single-stage semiconductor; 3, multi-stage semiconductor; 4, fixed part; 5, temperature transmission part; 6, heat dissipation assembly. DETAILED DESCRIPTION

[0036] The technical solutions of the present application will be described clearly and completely below in conjunction with the drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0037] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0038] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0039] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0040] Embodiment 1

[0041] Figure 1 A semiconductor refrigeration device provided by the present embodiment is shown, which comprises a cold storage assembly 1 and a semiconductor assembly.

[0042] In the present embodiment, the cold storage assembly 1 is a sealed cold storage insulation box, which contains water as a cold storage element inside during operation. In other embodiments, the cold storage assembly 1 can also be a sealed insulation cylinder, an insulation box or the like structure. The cold storage element can also be a mixture of water and blue ice coolant or water and other coolants, which is used to reduce the difficulty of phase change freezing during the cooling process of the cold storage element and to speed up the freezing speed of the cold storage element.

[0043] The semiconductor assembly comprises a single-stage semiconductor 2 and a multi-stage semiconductor 3, the single-stage semiconductor 2 and the multi-stage semiconductor 3 are arranged in parallel, and the cold end of the semiconductor assembly is connected with the cold storage assembly 1. The single-stage semiconductor 2 is a semiconductor comprising one PN junction, and the multi-stage semiconductor 3 is a semiconductor comprising multiple PN junctions arranged in series. In this embodiment, the single-stage semiconductor 2 is a single-layer semiconductor refrigeration sheet, and the multi-stage semiconductor 3 is a stacked double-layer semiconductor refrigeration sheet. In other embodiments, the number of stages of the multi-stage semiconductor 3 can be adjusted according to actual needs.

[0044] When the user end does not need to use cold, the semiconductor assembly operates to store the cold generated by the cold end of the semiconductor assembly in the cold storage assembly 1; when the user end needs to use cold, the cold storage assembly 1 is used to output cold to the user end for cooling. When taking cold from the cold storage assembly 1, a liquid cooling heat exchanger or an air cooling heat exchanger is used to take cold from the cold storage assembly 1 by circulating heat transfer agent or to transfer the cold in the cold storage assembly 1 to air by blowing and blowing out the cold air to cool the user end.

[0045] A temperature sensor as a temperature detection member is installed in the inner cavity of the cold storage insulation box as the cold storage assembly 1. A cold guide fin as a cold guide member is also installed in the cold storage assembly 1, one end of the cold guide member is fixedly connected with the cold end of the semiconductor assembly, and the other end extends into the inner cavity of the cold storage assembly 1. Specifically, the cold guide fin comprises a fixed mounting plate as a fixed part 4 and a fin body as a temperature transmission part 5, the fixed mounting plate is fixedly mounted on the cold storage assembly 1, the fin body is vertically arranged on the bottom surface of the fixed mounting plate, and multiple fin bodies are arranged at intervals, and the multiple fin bodies all extend into the inner cavity of the cold storage assembly 1.

[0046] In order to dissipate heat from the hot end of the semiconductor assembly and avoid the heat generated by the hot end of the semiconductor assembly from affecting the cold storage assembly 1 when the semiconductor assembly is working, a water cooling head as a heat dissipation assembly 6 is installed on the hot end of the semiconductor assembly to dissipate heat from the hot end of the semiconductor assembly. In other embodiments, the heat dissipation assembly 6 can also be a heat dissipation fan to dissipate heat from the hot end of the semiconductor assembly by blowing air.

[0047] Since the single-layer semiconductor refrigeration sheet has the characteristics of high efficiency and small temperature span, and the double-layer semiconductor refrigeration sheet has the characteristics of low efficiency and high temperature span, in this embodiment, the single-layer semiconductor refrigeration sheet and the double-layer semiconductor refrigeration sheet are combined to supply cold water in the cold storage insulation box. Since the thicknesses of the single-layer semiconductor refrigeration sheet and the double-layer semiconductor refrigeration sheet are different, the structure shape of the contact between the upper water cooling head or the lower aluminum heat dissipation sheet as the fixed mounting plate needs to be changed accordingly. In this embodiment, the shape of the lower aluminum heat dissipation sheet remains unchanged, the shape of the upper water cooling head is changed to adapt to the shape of the two refrigeration sheets, the water cooling head is thickened at the single-layer semiconductor refrigeration sheet, and the water cooling flow channel is inclined downward to approach the single-layer semiconductor refrigeration sheet.

[0048] The semiconductor refrigeration device is used for refrigeration in the idle time to store cold energy in the cold storage assembly 1. When the user needs cold energy, the semiconductor refrigeration device stops working, and the cold storage assembly 1 releases the cold energy to the user. The semiconductor refrigeration device can store cold energy in the idle time, and the power requirement of the cold storage process can be reduced. During the cold storage process, the single-stage semiconductor 2 is first started to work. When the single-stage semiconductor 2 is initially started to work, the temperature difference between the cold side and the hot side of the single-stage semiconductor 2 is small. As the single-stage semiconductor 2 continues to work, the temperature difference between the cold side and the hot side of the single-stage semiconductor 2 gradually increases, and the working efficiency of the single-stage semiconductor 2 gradually decreases. At this time, the multi-stage semiconductor 3 starts to work. Since the refrigeration capacity of the multi-stage semiconductor 3 decreases slowly with the increase of the temperature difference, the multi-stage semiconductor 3 can still work at a high efficiency under the current temperature difference to make up for the insufficient refrigeration capacity of the single-stage semiconductor 2. Through the stage-by-stage refrigeration of the single-stage semiconductor 2 and the multi-stage semiconductor 3, the refrigeration capacity of the semiconductor assembly in a certain time can be improved, and the cold energy stored in the cold storage assembly 1 in a certain time can be increased. In the cold energy use stage, the cold energy in the cold storage assembly 1 can meet higher refrigeration requirements, so that the semiconductor refrigeration device can meet the use requirements of kitchen, bathroom and other rooms in the family.

[0049] Embodiment 2

[0050] The embodiment provides a running method of a semiconductor refrigeration device. The running method comprises the following steps:

[0051] The single-stage semiconductor is started to work to reduce the temperature of the cold storage component in the cold storage assembly. It is judged whether the temperature of the cold storage component reaches a first preset value. If yes, the multi-stage semiconductor is started to work to continue to reduce the temperature of the cold storage component in the cold storage assembly.

[0052] The step of judging whether the temperature of the cold storage component reaches the first preset value comprises: a temperature detection component detects a first temperature value of the cold storage component. After a predetermined time interval, the temperature detection component detects a second temperature value of the cold storage component. It is judged whether the difference between the first temperature value and the second temperature value is less than a preset temperature difference value.

[0053] In other embodiments, the step of judging whether the temperature of the cold storage component reaches the first preset value comprises: a temperature detection component detects a first temperature difference value of the cold storage component from the time when the single-stage semiconductor starts to work to the first predetermined time interval. The temperature detection component detects a second temperature difference value of the cold storage component in any subsequent predetermined time interval. It is judged whether the ratio of the first temperature difference value to the second temperature difference value is greater than a preset ratio value.

[0054] The multi-stage semiconductor is started, including judging whether the temperature of the cold storage reaches a second preset value, if yes, the single-stage semiconductor is closed and the multi-stage semiconductor works alone. The judging whether the temperature of the cold storage reaches the second preset value includes judging whether the temperature difference between the cold end and the hot end of the single-stage semiconductor is greater than a preset temperature span value.

[0055] Specifically, when the water temperature in the cold storage is normal temperature, in order to reduce the temperature, the single-stage semiconductor refrigerating sheet starts to work, at this time, the temperature difference between the cold end and the hot end of the single-stage semiconductor refrigerating sheet is small, the single-stage semiconductor refrigerating sheet works to achieve high refrigeration efficiency and fast refrigeration. When the temperature drops to a certain temperature, it is detected that the temperature difference of the water temperature under a certain time difference is less than a preset temperature difference value, or the temperature difference under a certain time is compared with the temperature difference under a certain time difference at the beginning, and a preset proportion value is reached, that is, the work of the double-stage semiconductor starts.

[0056] After the double-stage semiconductor works, the single-stage semiconductor can be closed and stopped working. In order to realize the frequency conversion of the semiconductor sheet, the total power of the semiconductor refrigerating sheet changes under different voltages, but the refrigeration efficiency of the semiconductor refrigerating sheet is not much related to the working voltage, but is more related to the temperature difference between the cold end and the hot end of the semiconductor refrigerating sheet. When the semiconductor refrigerating device just starts to work and store cold, the single-stage semiconductor refrigerating sheet operates at rated power, the water temperature in the cold storage gradually decreases, and the temperature difference between the two ends of the single-stage semiconductor refrigerating sheet gradually increases. When the double-stage semiconductor refrigerating sheet starts to work at the critical point, the single-stage semiconductor sheet does not stop working. At this time, the double-stage semiconductor refrigerating sheet starts from the minimum power, and as the temperature difference between the two ends of the double-stage semiconductor refrigerating sheet increases, the power of the double-stage semiconductor refrigerating sheet gradually increases, while the power of the single-stage semiconductor gradually decreases. With the continuous increase of the temperature span, the power of the single-stage semiconductor gradually decreases to zero, while the power of the double-stage semiconductor gradually increases to the rated power. The input power is basically unchanged during the whole process, and although the efficiency decreases, the decrease is relatively slow, so the efficiency and speed can be better balanced.

[0057] Obviously, the above embodiments are only examples for clearly illustrating, but not limiting the embodiments. For ordinary skilled in the art, other different forms of changes or variations can be made on the basis of the above description. Here, all the embodiments need not and cannot be exhausted. The obvious changes or variations derived therefrom are still within the protection scope of the present application.

Claims

1. A method of operating a semiconductor refrigeration device, characterized by, The semiconductor refrigerating device comprises: a semiconductor assembly comprising a single-stage semiconductor (2) and a multi-stage semiconductor (3), the single-stage semiconductor (2) and the multi-stage semiconductor (3) being connected in parallel; a cold storage assembly (1) for accommodating a cold storage element, a cold end of the semiconductor assembly being connected to the cold storage assembly (1), and a temperature detecting element being installed in the cold storage assembly (1); when the user end does not need cold, the semiconductor assembly operates to store the cold generated by the cold end of the semiconductor assembly in the cold storage assembly (1); when the user end needs cold, the cold storage assembly (1) is used to output cold to the user end. The operation method comprises the following steps: starting the single-stage semiconductor (2) to operate, so as to reduce the temperature of the cold storage element in the cold storage assembly (1); judging whether the temperature of the cold storage element reaches a first preset value, if yes, starting the multi-stage semiconductor (3) to operate, so as to continue to reduce the temperature of the cold storage element in the cold storage assembly (1).

2. The method of operating a semiconductor refrigerator according to claim 1, wherein The cold storage assembly (1) is provided with a cold conducting element, one end of the cold conducting element is fixedly connected to the cold end of the semiconductor assembly, and the other end extends into the inner cavity of the cold storage assembly (1).

3. The method of operating a semiconductor refrigerator according to claim 2, wherein The cold conducting element comprises a fixed part (4) and a temperature transmitting part (5), the fixed part (4) is fixedly installed on the cold storage assembly (1), and a plurality of temperature transmitting parts (5) are arranged at intervals on the fixed part (4), and the plurality of temperature transmitting parts (5) all extend into the inner cavity of the cold storage assembly (1).

4. The method of operating a semiconductor refrigerator according to claim 1, wherein The hot end of the semiconductor assembly is provided with a heat dissipation assembly (6).

5. The method of operating a semiconductor refrigerator of claim 1, wherein The step of judging whether the temperature of the cold storage element reaches the first preset value comprises: the temperature detecting element detects a first temperature value of the cold storage element; after a predetermined time interval, the temperature detecting element detects a second temperature value of the cold storage element; judging whether the difference between the first temperature value and the second temperature value is less than a preset temperature difference value.

6. The method of operating a semiconductor refrigerator of claim 1, wherein The step of judging whether the temperature of the cold storage element reaches the first preset value comprises: the temperature detecting element detects a first temperature difference value of the cold storage element from the start of the single-stage semiconductor (2) to the first predetermined time interval; the temperature detecting element detects a second temperature difference value of the cold storage element at any subsequent predetermined time interval; judging whether the ratio of the first temperature difference value to the second temperature difference value is greater than a preset ratio value.

7. The method of operating a semiconductor refrigerator according to any one of claims 1 to 6, wherein It also comprises judging whether the temperature of the cold storage element reaches a second preset value, if yes, closing the single-stage semiconductor (2) and operating the multi-stage semiconductor (3) alone.

8. The method of operating a semiconductor refrigerator of claim 7, wherein The step of judging whether the temperature of the cold storage element reaches the second preset value comprises: judging whether the temperature difference between the cold end and the hot end of the single-stage semiconductor (2) is greater than a preset temperature difference value.

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