Semiconductor metal cooling ring and processing method

Abstract

The invention discloses a semiconductor metal cooling ring and a processing method, and aims to overcome the defect that an existing semiconductor metal cooling ring is poor in cooling effect. The device comprises a main body and a thin-wall interface piece which are welded together, an inner cooling pipeline is arranged in the main body, and a circle of outer cooling pipeline is arranged on the thin-wall interface piece close to the end connected with the main body. The cooling effect of the main body of the cooling ring and the interface piece is good; the interface piece can be processed into any shape and is suitable for various internal designs and changes; the interface piece is of an ultra-thin structure and is low in cost; the welding quality of the main body and the connector is high.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor cooling rings, and more specifically, to a semiconductor metal cooling ring and a processing method thereof. Background Art

[0002] The semiconductor metal cooling ring mainly includes a main body, an interface part and a cooling water channel. The main body is processed as a whole. The interface part is usually a hole cut in the middle of the forging or welded into four plates. The interface part is welded to the main body after being formed. The cooling water channel is welded on the main body, and the cooling effect is achieved by circulating water inside. However, the cooling water channel is an external welded cooling structure. Due to the limitation of the main body structure, too many cooling water channels cannot be arranged, and the cooling effect is not good. The interface part is a welded or integrally processed structure with high cost. The interface part cannot be directly cooled due to structural limitations, which affects the overall cooling effect. Since the interface part is an integrally processed part or welded, its shape is single and can only be round or square, which reduces the scope of use and limits the internal design structure. Since the main body and the interface part are both thin, the welding quality is poor. Summary of the invention

[0003] In order to overcome the above-mentioned shortcomings, the present invention provides a semiconductor metal cooling ring and a processing method, wherein the cooling effect of the main body and the interface parts of the cooling ring is good; the interface parts can be processed into any shape and are suitable for various internal designs and changes; the interface parts are ultra-thin structures with low costs; and the welding quality of the main body and the interface parts is high.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solution: a semiconductor metal cooling ring, comprising a main body and a thin-walled interface part, the thin-walled interface part is welded together with the main body, an internal cooling pipe is arranged in the main body, and a circle of external cooling pipe is arranged on the thin-walled interface part near the connection end with the main body.

[0005] In this patent application, the inner cooling pipe is directly arranged in the main body, which is beneficial to improve the cooling effect of the main body. A circle of outer cooling pipes is arranged on the thin-walled interface part near the connection end with the main body. The medium is cooled through the outer cooling pipe before being discharged from the thin-walled interface part to ensure that the discharge temperature meets the requirements. The ultra-thin structure of the thin-walled interface part saves materials and helps to reduce costs. The cooling effect of the main body and the thin-walled interface part of the semiconductor metal cooling ring of this structure is good.

[0006] Preferably, a sunken groove is provided on the end face of the main body, the internal cooling pipe is arranged in the sunken groove, a flow opening connected to the sunken groove is provided on the side wall of the main body, and a thin-walled interface part is connected to the periphery of the flow opening on the side wall of the main body.

[0007] The inner cooling pipe is arranged in the sunken groove to directly cool the main body, with good cooling effect. The thin-wall interface is connected with the flow port to facilitate the discharge of the medium.

[0008] Preferably, an auxiliary cooling pipe which can be moved and adjusted in position is arranged on the periphery of the main body, the auxiliary cooling pipe has an arc-shaped structure and is close to the outer wall of the main body.

[0009] The auxiliary cooling pipe is close to the outer wall of the main body, which improves the cooling effect on the main body. Moreover, the auxiliary cooling pipe can be moved and adjusted. The auxiliary cooling pipe is installed at the corresponding position of the main body where the main body needs cooling, ensuring the cooling effect of the main body.

[0010] Preferably, a water inlet and a water outlet are respectively arranged at both ends of the auxiliary cooling pipe, and the water inlet end and the water outlet end of the internal cooling pipe are respectively connected to the water inlet and the water outlet.

[0011] This structural arrangement facilitates the entry and discharge of cooling water.

[0012] Preferably, the thin-walled interface part is a stamped part.

[0013] The thin-walled interface parts adopt a stamping process, and their shapes can be set arbitrarily according to needs. After setting, they are stamped and formed by a mold to process thin-walled interface parts of arbitrary shapes, which is convenient to process and low in cost.

[0014] Preferably, the thin-walled interface piece gradually converges from the end connected to the main body toward the other end.

[0015] This structural arrangement facilitates the discharge of the medium.

[0016] Preferably, the external cooling pipe includes a plurality of adjusting tubes, which are spliced ​​end to end to form a circle, a universal ball head is provided at one end of the adjusting tube, and a rotating groove matched with the universal ball head is provided at the other end of the adjusting tube. The two adjacent adjusting tubes are sealed and connected through the cooperation of the universal ball head and the rotating groove, and the end of the rotating groove is fastened to a limit ring, and the limit ring is matched with the universal ball head.

[0017] The external cooling pipe of this structural setting can be bent like a chain, so that the installation position of the external cooling pipe can be adjusted. The external cooling pipe can be moved to the position where cooling is needed, which is flexible and convenient. In particular, when the position of the external cooling pipe needs to be adjusted away from the main body, since the thin-walled interface part gradually converges from the end connected to the main body to the other end, the length of the external cooling pipe is too long relative to the thin-walled interface part. At this time, the external cooling pipe is bent and then connected to the outer wall of the thin-walled interface part by pressing the block or directly welded to the outer wall of the thin-walled interface part to achieve positioning. The versatility of the external cooling pipe is achieved through this structural setting, and the external cooling pipe itself can be bent, and there is no need to bend it to match the outer wall of the thin-walled interface part before installation, which reduces the difficulty of installation.

[0018] Preferably, a plurality of heat-conducting sleeves are mounted on the inner cooling pipe, and heat-conducting fins are hinged on both sides of the heat-conducting sleeves. The heat-conducting sleeves are slid along the inner cooling pipe to adjust their positions, and the heat-conducting fins are rotated to adjust their positions.

[0019] Installing heat-conducting fins on the heat-conducting sleeve is beneficial to improving the heat exchange effect, so that the heat can be quickly taken away by the coolant in the inner cooling pipe. The heat-conducting sleeve can slide along the inner cooling pipe to adjust its position, and the heat-conducting fins can rotate to adjust their position to prevent interference with other components installed on the main body.

[0020] A method for processing a semiconductor metal cooling ring is disclosed, which realizes the processing of the semiconductor metal cooling ring, and comprises the following steps: S1, completing the processing of a main body and a thin-walled interface part; S2, overlapping one end of the thin-walled interface part on the side wall of the main body, and welding the overlapping position by tungsten inert gas arc welding; S3, installing an external cooling pipe on the thin-walled interface part, installing an internal cooling pipe on the main body, and installing an auxiliary cooling pipe on the outer wall of the main body.

[0021] The processed main body and thin-walled interface parts are welded by tungsten inert gas welding. The external part is welded and the internal part is directly formed. The entire thickness of the thin-walled interface parts can be welded through, solving the internal gap problem and stress concentration problem, and extending the product life.

[0022] Preferably, the thin-walled interface part in S1 is formed by stamping.

[0023] The processing of thin-walled interface parts is realized by stamping. The thin-walled interface parts can be designed into any shape, which is suitable for various internal designs and changes.

[0024] Compared with the prior art, the beneficial effects of the present invention are: the cooling effect of the cooling ring body and the interface parts is good; the interface parts can be processed into any shape, suitable for various internal designs and changes; the interface parts are ultra-thin structures with low costs; the welding quality of the main body and the interface parts is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a schematic structural diagram of embodiment 1 of the present invention.

[0026] Figure 2 It is a top view of Example 1 of the present invention.

[0027] Figure 3 It is a schematic diagram of the regulating pipe connection structure of Example 2 of the present invention.

[0028] Figure 4 It is a structural diagram of the inner cooling pipe of Example 3 of the present invention.

[0029] In the figure: 1. main body, 2. thin-walled interface parts, 3. inner cooling pipe, 4. outer cooling pipe, 5. sinking groove, 6. flow port, 7. auxiliary cooling pipe, 8. adjusting pipe, 9. universal ball head, 10. rotating groove, 11. limiting ring, 12. heat conduction sleeve, 13. heat conduction fin. DETAILED DESCRIPTION

[0030] The technical solution of the present invention is further described in detail below through specific embodiments and in conjunction with the accompanying drawings: Embodiment 1: A semiconductor metal cooling ring (see attached Figure 1 , Attachment Figure 2 ), including a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is welded to the main body 1, the main body 1 is a circular ring structure, an inner cooling pipe 3 is arranged in the main body 1, and a circle of outer cooling pipe 4 is arranged on the thin-walled interface part 2 near the connection end with the main body 1.

[0031] A sinking groove 5 is arranged on the end surface of the main body 1, and the sinking groove 5 is a C-shaped structure. The internal cooling pipe 3 is arranged in the sinking groove 5. A flow port 6 connected to the sinking groove 5 is arranged on the side wall of the main body 1, and the thin-walled interface member 2 is connected to the periphery of the flow port 6 on the side wall of the main body 1. The internal cooling pipe 3 is arranged in the sinking groove 5, and the main body 1 is directly cooled, and the cooling effect is good. The thin-walled interface member 2 is connected to the flow port 6 to facilitate the discharge of the medium.

[0032] An auxiliary cooling pipe 7 that can be moved and adjusted in position is arranged on the periphery of the main body 1. The auxiliary cooling pipe 7 has an arc-shaped structure and is close to the outer wall of the main body 1. An arc-shaped flow channel is arranged in the auxiliary cooling flow channel, and a coolant is passed through the flow channel. The coolant flows away the heat to achieve cooling of the cooling ring. The auxiliary cooling pipe 7 is close to the outer wall of the main body 1, which improves the cooling effect of the main body 1. Moreover, the auxiliary cooling pipe 7 can be moved and adjusted in position. The auxiliary cooling pipe 7 can be installed at the corresponding position of the main body 1 where cooling is needed, thereby ensuring the cooling effect of the main body 1. A water inlet and a water outlet are respectively arranged at both ends of the auxiliary cooling pipe 7, and the water inlet end and the water outlet end of the internal cooling pipe 3 are respectively connected to the water inlet and the water outlet.

[0033] In this embodiment, two arc-shaped inner cooling pipes 3 are arranged in the sinking groove 5, and a transition channel is arranged on the auxiliary cooling pipe 7. Both ends of the transition channel are provided with insertion holes. The auxiliary cooling pipe 7 and the inner cooling channel are arranged correspondingly, and the water inlet end of one inner cooling channel and the water outlet end of the other inner cooling channel are sealed and plugged with the two insertion holes respectively. The cooling water is transported by a water pump, and the water inlet at one end of the auxiliary cooling pipe 7 is connected to the water outlet end of the water pump in parallel with the water inlet of one inner cooling channel through a pipe, and the water outlet at the other end of the auxiliary cooling pipe 7 is connected to the return pipe in parallel with the water outlet of the other inner cooling channel through a pipe, and the cooling water flows back to the water storage tank through the return pipe.

[0034] The thin-walled interface part 2 is a stamped part. The thin-walled interface part 2 gradually converges from the end connected to the main body 1 to the other end. The outer end of the thin-walled interface part 2 can be a variety of shapes such as circular, rectangular, and elliptical. In this embodiment, the outer end of the thin-walled interface part 2 can be circular. The thin-walled interface part 2 adopts a stamping process, and its shape can be arbitrarily set as needed. After setting, it is stamped and formed by a mold to process a thin-walled interface part 2 of any shape, which is convenient to process and low in cost.

[0035] A method for processing a semiconductor metal cooling ring, which realizes the processing of a semiconductor metal cooling ring, comprising the following steps: S1, completing the processing of a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is formed by stamping, and the main body 1 is formed by machining; S2, overlapping one end of the thin-walled interface part 2 on the side wall of the main body 1, and welding the overlapping position by tungsten inert gas arc welding; S3, installing an external cooling pipe 4 on the thin-walled interface part 2, directly welding the external cooling pipe 4 to the thin-walled interface part 2 to position it, and installing an internal cooling pipe 3 in a sunken groove 5 on the main body 1. In this embodiment, two internal cooling pipes 3 are installed, and an auxiliary cooling pipe 7 is installed on the outer wall of the main body 1. In this embodiment, the auxiliary cooling pipe 7 is installed corresponding to the internal cooling pipe 3.

[0036] In this patent application, the inner cooling pipe 3 is directly arranged in the main body 1, which is beneficial to improve the cooling effect of the main body 1. A circle of outer cooling pipes 4 is arranged on the thin-walled interface part 2 near the connection end with the main body 1. The medium is cooled through the outer cooling pipe 4 before being discharged from the thin-walled interface part 2 to ensure that the discharge temperature meets the requirements. The ultra-thin structure of the thin-walled interface part 2 saves materials and helps to reduce costs. The processed main body 1 and the thin-walled interface part 2 are welded by tungsten inert gas welding, with external welding and internal direct forming, which can penetrate the entire thickness of the thin-walled interface part 2, solve the internal gap problem and stress concentration problem, and extend the product life.

[0037] Embodiment 2: A semiconductor metal cooling ring (see attached Figure 3 ), including a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is welded to the main body 1, the main body 1 is a circular ring structure, an inner cooling pipe 3 is arranged in the main body 1, and a circle of outer cooling pipe 4 is arranged on the thin-walled interface part 2 near the connection end with the main body 1.

[0038] A sinking groove 5 is arranged on the end surface of the main body 1, and the sinking groove 5 is a C-shaped structure. The internal cooling pipe 3 is arranged in the sinking groove 5. A flow port 6 connected to the sinking groove 5 is arranged on the side wall of the main body 1, and the thin-walled interface member 2 is connected to the periphery of the flow port 6 on the side wall of the main body 1. The internal cooling pipe 3 is arranged in the sinking groove 5, and the main body 1 is directly cooled, and the cooling effect is good. The thin-walled interface member 2 is connected to the flow port 6 to facilitate the discharge of the medium.

[0039] An auxiliary cooling pipe 7 that can be moved and adjusted in position is arranged on the periphery of the main body 1. The auxiliary cooling pipe 7 has an arc-shaped structure and is close to the outer wall of the main body 1. An arc-shaped flow channel is arranged in the auxiliary cooling flow channel, and a coolant is passed through the flow channel. The coolant flows away the heat to achieve cooling of the cooling ring. The auxiliary cooling pipe 7 is close to the outer wall of the main body 1, which improves the cooling effect of the main body 1. Moreover, the auxiliary cooling pipe 7 can be moved and adjusted in position. The auxiliary cooling pipe 7 can be installed at the corresponding position of the main body 1 where cooling is needed, thereby ensuring the cooling effect of the main body 1. A water inlet and a water outlet are respectively arranged at both ends of the auxiliary cooling pipe 7, and the water inlet end and the water outlet end of the internal cooling pipe 3 are respectively connected to the water inlet and the water outlet.

[0040] In this embodiment, two arc-shaped inner cooling pipes 3 are arranged in the sinking groove 5, and a transition channel is arranged on the auxiliary cooling pipe 7. Both ends of the transition channel are provided with insertion holes. The auxiliary cooling pipe 7 and the inner cooling channel are arranged correspondingly, and the water inlet end of one inner cooling channel and the water outlet end of the other inner cooling channel are sealed and plugged with the two insertion holes respectively. The cooling water is transported by a water pump, and the water inlet at one end of the auxiliary cooling pipe 7 is connected to the water outlet end of the water pump in parallel with the water inlet of one inner cooling channel through a pipe, and the water outlet at the other end of the auxiliary cooling pipe 7 is connected to the return pipe in parallel with the water outlet of the other inner cooling channel through a pipe, and the cooling water flows back to the water storage tank through the return pipe.

[0041] The thin-walled interface part 2 is a stamped part. The thin-walled interface part 2 gradually converges from the end connected to the main body 1 to the other end. The outer end of the thin-walled interface part 2 can be a variety of shapes such as circular, rectangular, and elliptical. In this embodiment, the outer end of the thin-walled interface part 2 can be circular. The thin-walled interface part 2 adopts a stamping process, and its shape can be arbitrarily set as needed. After setting, it is stamped and formed by a mold to process a thin-walled interface part 2 of any shape, which is convenient to process and low in cost.

[0042] The external cooling pipe 4 includes a plurality of adjusting tubes 8, which are connected end to end to form a circle. A universal ball head 9 is provided at one end of the adjusting tube 8, and a rotating groove 10 adapted to the universal ball head 9 is provided at the other end of the adjusting tube 8. The two adjacent adjusting tubes 8 are sealed and connected through the cooperation of the universal ball head 9 and the rotating groove 10. The end of the rotating groove 10 is fastened to a limiting ring 11, and the limiting ring 11 is adapted to the universal ball head 9. The universal ball head 9 and the adjusting tube 8 are threadedly connected and fastened. The inner diameter of the small diameter end of the limiting ring 11 is smaller than the diameter of the universal ball head 9, and the inner diameter of the large diameter end of the limiting ring 11 and the inner diameter of the open end of the rotating groove 10 are both adapted to the diameter of the universal ball head 9. Two adjacent adjusting tubes 8 are selected as the water inlet section and the water outlet section, and the two adjusting tubes 8 are blocked. A water inlet is provided on the adjusting tube 8 as the water inlet section, and a water outlet is provided on the adjusting tube 8 as the water outlet section.

[0043] The external cooling pipe 4 of this structural setting can be bent like a chain, so that the installation position of the external cooling pipe 4 can be adjusted. The external cooling pipe 4 can be moved to the position where cooling is needed, which is flexible and convenient. In particular, when the position of the external cooling pipe 4 needs to be adjusted away from the main body 1, since the thin-walled interface part 2 gradually converges from the end connected to the main body 1 to the other end, the length of the external cooling pipe 4 is too long relative to the thin-walled interface part 2. At this time, the external cooling pipe 4 is bent and then connected to the outer wall of the thin-walled interface part 2 by pressing the block or directly welded to the outer wall of the thin-walled interface part 2 to achieve positioning. The versatility of the external cooling pipe 4 is achieved through this structural setting, and the external cooling pipe 4 can be bent by itself, and there is no need to bend it to match the outer wall of the thin-walled interface part 2 before installation, which reduces the difficulty of installation.

[0044] The inner cooling pipe 3 includes a plurality of adjusting tubes 8, which are spliced ​​head to tail in sequence. A universal ball head 9 is provided at one end of the adjusting tube 8, and a rotating groove 10 adapted to the universal ball head 9 is provided at the other end of the adjusting tube 8. The two adjacent adjusting tubes 8 are sealed and connected through the cooperation of the universal ball head 9 and the rotating groove 10. The end of the rotating groove 10 is fastened to a limit ring 11, and the limit ring 11 is adapted to the universal ball head 9. The universal ball head 9 and the adjusting tube 8 are threadedly connected and fastened. The inner diameter of the small diameter end of the limit ring 11 is smaller than the diameter of the universal ball head 9, and the inner diameter of the large diameter end of the limit ring 11 and the inner diameter of the open end of the rotating groove 10 are both adapted to the diameter of the universal ball head 9. The two adjusting tubes 8 at the head and tail are used as the water inlet and outlet, respectively.

[0045] The inner cooling pipe 3 of this structure can be bent like a chain, so that the inner cooling pipe 3 can adjust the installation position. When the inner cooling pipe 3 interferes with other parts, the inner cooling pipe 3 is bent to avoid interference. In addition, for areas with higher cooling requirements, the inner cooling pipe 3 can be bent and circuitous at this position to increase the heat exchange area, thereby improving the cooling effect.

[0046] A method for processing a semiconductor metal cooling ring, which realizes the processing of a semiconductor metal cooling ring, comprising the following steps: S1, completing the processing of a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is formed by stamping, and the main body 1 is formed by machining; S2, overlapping one end of the thin-walled interface part 2 on the side wall of the main body 1, and welding the overlapping position by tungsten inert gas arc welding; S3, installing an external cooling pipe 4 on the thin-walled interface part 2, directly welding the external cooling pipe 4 to the thin-walled interface part 2 to position it, and installing an internal cooling pipe 3 in a sunken groove 5 on the main body 1. In this embodiment, two internal cooling pipes 3 are installed, and an auxiliary cooling pipe 7 is installed on the outer wall of the main body 1. In this embodiment, the auxiliary cooling pipe 7 is installed corresponding to the internal cooling pipe 3.

[0047] In this patent application, the inner cooling pipe 3 is directly arranged in the main body 1, which is beneficial to improve the cooling effect of the main body 1. A circle of outer cooling pipes 4 is arranged on the thin-walled interface part 2 near the connection end with the main body 1. The medium is cooled through the outer cooling pipe 4 before being discharged from the thin-walled interface part 2 to ensure that the discharge temperature meets the requirements. The ultra-thin structure of the thin-walled interface part 2 saves materials and helps to reduce costs. The processed main body 1 and the thin-walled interface part 2 are welded by tungsten inert gas welding, with external welding and internal direct forming, which can penetrate the entire thickness of the thin-walled interface part 2, solve the internal gap problem and stress concentration problem, and extend the product life.

[0048] Embodiment 3: A semiconductor metal cooling ring (see attached Figure 4 ), including a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is welded to the main body 1, the main body 1 is a circular ring structure, an inner cooling pipe 3 is arranged in the main body 1, and a circle of outer cooling pipe 4 is arranged on the thin-walled interface part 2 near the connection end with the main body 1.

[0049] A sinking groove 5 is arranged on the end surface of the main body 1, and the sinking groove 5 is a C-shaped structure. The internal cooling pipe 3 is arranged in the sinking groove 5. A flow port 6 connected to the sinking groove 5 is arranged on the side wall of the main body 1, and the thin-walled interface member 2 is connected to the periphery of the flow port 6 on the side wall of the main body 1. The internal cooling pipe 3 is arranged in the sinking groove 5, and the main body 1 is directly cooled, and the cooling effect is good. The thin-walled interface member 2 is connected to the flow port 6 to facilitate the discharge of the medium.

[0050] An auxiliary cooling pipe 7 that can be moved and adjusted in position is arranged on the periphery of the main body 1. The auxiliary cooling pipe 7 has an arc-shaped structure and is close to the outer wall of the main body 1. An arc-shaped flow channel is arranged in the auxiliary cooling flow channel, and a coolant is passed through the flow channel. The coolant flows away the heat to achieve cooling of the cooling ring. The auxiliary cooling pipe 7 is close to the outer wall of the main body 1, which improves the cooling effect of the main body 1. Moreover, the auxiliary cooling pipe 7 can be moved and adjusted in position. The auxiliary cooling pipe 7 can be installed at the corresponding position of the main body 1 where cooling is needed, thereby ensuring the cooling effect of the main body 1. A water inlet and a water outlet are respectively arranged at both ends of the auxiliary cooling pipe 7, and the water inlet end and the water outlet end of the internal cooling pipe 3 are respectively connected to the water inlet and the water outlet.

[0051] In this embodiment, two arc-shaped inner cooling pipes 3 are arranged in the sinking groove 5, and a transition channel is arranged on the auxiliary cooling pipe 7. Both ends of the transition channel are provided with insertion holes. The auxiliary cooling pipe 7 and the inner cooling channel are arranged correspondingly, and the water inlet end of one inner cooling channel and the water outlet end of the other inner cooling channel are sealed and plugged with the two insertion holes respectively. The cooling water is transported by a water pump, and the water inlet at one end of the auxiliary cooling pipe 7 is connected to the water outlet end of the water pump in parallel with the water inlet of one inner cooling channel through a pipe, and the water outlet at the other end of the auxiliary cooling pipe 7 is connected to the return pipe in parallel with the water outlet of the other inner cooling channel through a pipe, and the cooling water flows back to the water storage tank through the return pipe.

[0052] The thin-walled interface part 2 is a stamped part. The thin-walled interface part 2 gradually converges from the end connected to the main body 1 to the other end. The outer end of the thin-walled interface part 2 can be a variety of shapes such as circular, rectangular, and elliptical. In this embodiment, the outer end of the thin-walled interface part 2 can be circular. The thin-walled interface part 2 adopts a stamping process, and its shape can be arbitrarily set as needed. After setting, it is stamped and formed by a mold to process a thin-walled interface part 2 of any shape, which is convenient to process and low in cost.

[0053] The external cooling pipe 4 includes a plurality of adjusting tubes 8, which are connected end to end to form a circle. A universal ball head 9 is provided at one end of the adjusting tube 8, and a rotating groove 10 adapted to the universal ball head 9 is provided at the other end of the adjusting tube 8. The two adjacent adjusting tubes 8 are sealed and connected through the cooperation of the universal ball head 9 and the rotating groove 10. The end of the rotating groove 10 is fastened to a limiting ring 11, and the limiting ring 11 is adapted to the universal ball head 9. The universal ball head 9 and the adjusting tube 8 are threadedly connected and fastened. The inner diameter of the small diameter end of the limiting ring 11 is smaller than the diameter of the universal ball head 9, and the inner diameter of the large diameter end of the limiting ring 11 and the inner diameter of the open end of the rotating groove 10 are both adapted to the diameter of the universal ball head 9. Two adjacent adjusting tubes 8 are selected as the water inlet section and the water outlet section, and the two adjusting tubes 8 are blocked. A water inlet is provided on the adjusting tube 8 as the water inlet section, and a water outlet is provided on the adjusting tube 8 as the water outlet section.

[0054] The external cooling pipe 4 of this structural setting can be bent like a chain, so that the installation position of the external cooling pipe 4 can be adjusted. The external cooling pipe 4 can be moved to the position where cooling is needed, which is flexible and convenient. In particular, when the position of the external cooling pipe 4 needs to be adjusted away from the main body 1, since the thin-walled interface part 2 gradually converges from the end connected to the main body 1 to the other end, the length of the external cooling pipe 4 is too long relative to the thin-walled interface part 2. At this time, the external cooling pipe 4 is bent and then connected to the outer wall of the thin-walled interface part 2 by pressing the block or directly welded to the outer wall of the thin-walled interface part 2 to achieve positioning. The versatility of the external cooling pipe 4 is achieved through this structural setting, and the external cooling pipe 4 can be bent by itself, and there is no need to bend it to match the outer wall of the thin-walled interface part 2 before installation, which reduces the difficulty of installation.

[0055] A plurality of heat-conducting sleeves 12 are mounted on the inner cooling pipe 3, and heat-conducting fins 13 are hinged on both sides of the heat-conducting sleeves 12. The heat-conducting sleeves 12 slide along the inner cooling pipe 3 to adjust their positions, and the heat-conducting fins 13 rotate to adjust their positions. The installation of the heat-conducting fins 13 on the heat-conducting sleeves 12 is conducive to improving the heat exchange effect, so that the heat can be quickly taken away by the coolant in the inner cooling pipe 3. The heat-conducting sleeves 12 can slide along the inner cooling pipe 3 to adjust their positions, and the heat-conducting fins 13 can rotate to adjust their positions, so as to prevent interference with other components installed on the main body 1.

[0056] A method for processing a semiconductor metal cooling ring, which realizes the processing of a semiconductor metal cooling ring, comprising the following steps: S1, completing the processing of a main body 1 and a thin-walled interface part 2, the thin-walled interface part 2 is formed by stamping, and the main body 1 is formed by machining; S2, overlapping one end of the thin-walled interface part 2 on the side wall of the main body 1, and welding the overlapping position by tungsten inert gas arc welding; S3, installing an external cooling pipe 4 on the thin-walled interface part 2, directly welding the external cooling pipe 4 to the thin-walled interface part 2 to position it, and installing an internal cooling pipe 3 in a sunken groove 5 on the main body 1. In this embodiment, two internal cooling pipes 3 are installed, and an auxiliary cooling pipe 7 is installed on the outer wall of the main body 1. In this embodiment, the auxiliary cooling pipe 7 is installed corresponding to the internal cooling pipe 3.

[0057] In this patent application, the inner cooling pipe 3 is directly arranged in the main body 1, which is beneficial to improve the cooling effect of the main body 1. A circle of outer cooling pipes 4 is arranged on the thin-walled interface part 2 near the connection end with the main body 1. The medium is cooled through the outer cooling pipe 4 before being discharged from the thin-walled interface part 2 to ensure that the discharge temperature meets the requirements. The ultra-thin structure of the thin-walled interface part 2 saves materials and helps to reduce costs. The processed main body 1 and the thin-walled interface part 2 are welded by tungsten inert gas welding, with external welding and internal direct forming, which can penetrate the entire thickness of the thin-walled interface part 2, solve the internal gap problem and stress concentration problem, and extend the product life.

[0058] The above-described embodiments are only preferred solutions of the present invention and are not intended to limit the present invention in any form. Other variations and modifications are possible without exceeding the technical solutions described in the claims.

Claims

1. A semiconductor metal cooling ring, characterized in that: It comprises a main body and a thin-wall interface part, wherein the thin-wall interface part is welded to the main body, an inner cooling pipeline is arranged in the main body, and a circle of outer cooling pipeline is arranged on the thin-wall interface part near the end connected with the main body.

2. A semiconductor metal cooling ring according to claim 1, characterized in that: A sinking groove is arranged on the end surface of the main body, an internal cooling pipeline is arranged in the sinking groove, a flow opening connected with the sinking groove is arranged on the side wall of the main body, and a thin-wall interface part is connected to the periphery of the flow opening on the side wall of the main body.

3. A semiconductor metal cooling ring according to claim 1, characterized in that: An auxiliary cooling pipe which can be moved and adjusted in position is arranged on the periphery of the main body. The auxiliary cooling pipe is in an arc-shaped structure and is close to the outer wall of the main body.

4. A semiconductor metal cooling ring according to claim 3, characterized in that: A water inlet and a water outlet are respectively arranged at both ends of the auxiliary cooling pipeline, and the water inlet end and the water outlet end of the inner cooling pipeline are respectively communicated with the water inlet and the water outlet.

5. A semiconductor metal cooling ring according to claim 1, characterized in that: The thin-walled interface parts are stamped parts.

6. A semiconductor metal cooling ring according to claim 1, characterized in that: The thin-wall interface piece gradually converges from the end connected with the main body to the other end.

7. A semiconductor metal cooling ring according to claim 1, characterized in that: The external cooling pipeline includes several adjusting tubes, which are spliced ​​end to end to form a circle, a universal ball head is arranged at one end of the adjusting tube, and a rotating groove matched with the universal ball head is arranged at the other end of the adjusting tube. The two adjacent adjusting tubes are sealed and connected through the cooperation of the universal ball head and the rotating groove, and the end of the rotating groove is fastened to a limit ring, and the limit ring is matched with the universal ball head.

8. A semiconductor metal cooling ring according to any one of claims 1 to 7, characterized in that: A plurality of heat-conducting sleeves are mounted on the inner cooling pipe, and heat-conducting fins are hinged on both sides of the heat-conducting sleeves. The heat-conducting sleeves are slid along the inner cooling pipe to adjust their positions, and the heat-conducting fins are rotated to adjust their positions.

9. A method for processing a semiconductor metal cooling ring, characterized in that: The processing of the semiconductor metal cooling ring described in any one of claims 1 to 8 comprises the following steps: S1, completing the processing of the main body and the thin-walled interface member; S2, overlapping one end of the thin-walled interface member on the side wall of the main body, and welding the overlapping position by tungsten inert gas welding; S3, installing the external cooling pipe on the thin-walled interface member, installing the internal cooling pipe on the main body, and installing the auxiliary cooling pipe on the outer wall of the main body.

10. A method for processing a semiconductor metal cooling ring according to claim 9, characterized in that: The thin-walled interface parts in S1 are made by stamping.

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