A device for baking a semiconductor material piece after it is manufactured

Abstract

The application discloses a kind of semiconductor material piece after baking device, belong to semiconductor baking equipment technical field, vacuum box inside is provided with the third horizontal track of vertical direction movement, semiconductor finished product assembly is arranged on the third horizontal track, limiting clamping mechanism is equipped on the third horizontal track, laser heating module is equipped in vacuum box top, two bottom plates are arranged in the opening of vacuum box bottom, drive mechanism is equipped on support, feeding mechanism is equipped on first horizontal track, discharging structure is equipped on second horizontal track.The semiconductor finished product assembly of the application is automatically fed to the third horizontal track and enters the inside of vacuum box, the multiple semiconductor finished product of semiconductor finished product assembly is dried by laser heating module, semiconductor finished product piece on rotating plate is turned over, can uniformly dry multiple surfaces of semiconductor finished product piece, after drying, semiconductor finished product assembly is automatically discharged, the application has the advantages of high drying efficiency, high degree of automation.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor drying equipment, and in particular relates to a device for drying semiconductor material parts after they are manufactured. Background Art

[0002] After semiconductor finished products are manufactured, various liquids often remain on their surface. The residual liquids can cause oxidation and corrosion on the surface of the semiconductor material, thereby affecting its electrical performance and reliability. If the residual chemical reagents cannot be thoroughly dried, they will react chemically with the semiconductor material, changing the physical and chemical properties of the material and destroying the structural integrity of the semiconductor device.

[0003] Existing drying equipment uses a simple hot air circulation method, which makes it difficult to ensure uniform drying and can easily lead to localized overheating or insufficient drying of semiconductor materials, thus affecting product quality. To improve the quality and production efficiency of semiconductor materials, it is necessary to develop a post-production drying device for semiconductor materials that can achieve uniform drying. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the above-mentioned prior art and provide a semiconductor material post-production drying device that has automatic feeding and discharging, uniform drying of multiple surfaces of finished semiconductor parts, and high drying efficiency for finished semiconductor parts.

[0005] The technical solution adopted to solve the above technical problems is: a vacuum box is provided on the support, a vacuum generator is provided on the vacuum box, a third horizontal track moving in the vertical direction is provided inside the vacuum box, a semiconductor finished product component is provided on the third horizontal track, a limiting clamping mechanism for clamping and positioning the semiconductor finished product component is provided on the third horizontal track, a laser heating module for drying the semiconductor finished product component on the third horizontal track is provided on the top of the vacuum box, two bottom plates are provided at the bottom opening of the vacuum box, a driving mechanism for driving the two bottom plates to move horizontally at the bottom of the vacuum box is provided on the support, and the horizontal movement directions of the two bottom plates are opposite, a third fixed plate located at the bottom of the vacuum box is provided on the support, a first horizontal track located on one side of the bottom of the vacuum box is provided on one side of the third fixed plate, a feeding mechanism for driving the semiconductor finished product component to move horizontally on the first horizontal track for feeding is provided on the first horizontal track, and a feeding mechanism for feeding the semiconductor finished product component to the first horizontal track is provided on the third fixed plate The cam is secured to the chassis and has a second locking mechanism, wherein the second locking mechanism is secured to the chassis and has a second locking mechanism, wherein the cam is secured to the chassis and has a second locking mechanism.

[0006] Furthermore, a second electric cylinder is provided on the support, the output end of the second electric cylinder is fixedly connected to the second support frame, a guide rod is provided at the bottom of the second support frame which moves in a vertical direction with the support, and the second support frame is fixedly installed at the bottom of the third horizontal track.

[0007] Furthermore, a first support frame is provided on the inner side wall of the vacuum box, a third motor is provided on the first support frame, an output shaft of the third motor is fixedly connected to the push plate, and the push plate is located above the first contact plate and contacts the first contact plate.

[0008] Furthermore, the driving mechanism is as follows: two first fixed plates located on both sides of the vacuum box are respectively provided on the support, and the two first fixed plates on the same side are slidably connected in a vertical direction by the first sliding plate, each first fixed plate is respectively processed with a first slide groove which is slidably connected to the first sliding plate in a vertical direction, each first sliding plate is respectively rotatably connected to one end of the second connecting rod, and the other end of each second connecting rod is respectively rotatably connected to one end of the first connecting rod, and the other end of each first connecting rod is respectively fixedly connected to one end of the transmission shaft, a first motor is provided on the top of the vacuum box, the output shaft of the first motor is fixedly connected to the first transmission wheel, and the first transmission wheel is connected to the transmission shaft through the first conveyor belt; each two sides of the bottom plate are respectively fixedly connected to one end of the third connecting rod, and each other end of the third connecting rod is respectively provided with a first slider, and each first sliding plate is respectively processed with a first horizontal sliding hole which has two first sliders slidably connected.

[0009] Furthermore, each of the first horizontal sliding holes includes a first vertical sliding hole, an inclined sliding hole and a second vertical sliding hole. The top end of the inclined sliding hole is processed with a first vertical sliding hole interconnected with it, and the bottom end of the inclined sliding hole is processed with a second vertical sliding hole interconnected with it.

[0010] Furthermore, the structure of the feeding mechanism is the same as that of the discharging structure, and the feeding mechanism is as follows: second slide grooves are processed on both side plates of the first horizontal track, which are slidably connected to the semiconductor finished components in the horizontal direction; a second motor is provided at the bottom of the first horizontal track; the output shaft of the second motor is fixedly connected to the first gear; a fourth transmission wheel is fixedly installed on the top of the first gear; a second gear meshing with the first gear is provided at the bottom of the first horizontal track; a fifth transmission wheel is provided on the top of the second gear; a plurality of first transport wheels are arranged at intervals along the horizontal direction on one side of the first horizontal track; an eighth transmission wheel and a ninth transmission wheel are fixedly connected on the top of each first transport wheel; the eighth transmission wheel is connected to the eighth transmission wheel on the top of the first transport wheel on the adjacent side through a sixth conveyor belt, and the ninth transmission wheel is fixedly installed on the top of the first transport wheel The transmission wheel is connected to the ninth transmission wheel on the top of the first transport wheel on the other adjacent side through the third conveyor belt, and a seventh transmission wheel is provided at the bottom of each first transport wheel. A plurality of second transport wheels are arranged at intervals in the horizontal direction on the other side of the first horizontal track, and a fixedly connected second transmission wheel and a third transmission wheel are provided on the top of each second transport wheel. The second transmission wheel is connected to the second transmission wheel on the top of the second transport wheel on the adjacent side through the seventh conveyor belt, and the third transmission wheel is connected to the third transmission wheel on the top of the second transport wheel on the other adjacent side through the fourth conveyor belt. A sixth transmission wheel is provided at the bottom of each second transport wheel, and the fourth transmission wheel is connected to one of the sixth transmission wheels through the second conveyor belt, and the fifth transmission wheel is connected to one of the seventh transmission wheels through the fifth conveyor belt.

[0011] Furthermore, a first fixing rod is fixedly mounted on one side of the third fixing plate, the first fixing rod is slidably connected to a second sliding plate in a vertical direction, the second sliding plate is located on the discharge side of the first horizontal track, the second sliding plate abuts against the third horizontal track, a fourth spring is provided on the first fixing rod, one end of the fourth spring is fixedly connected to the second sliding plate, and the other end of the fourth spring is fixedly connected to the third fixing plate. A second fixing rod is fixedly mounted on the other side of the third fixing plate, the second fixing rod is slidably connected to a third sliding plate in a vertical direction, the third sliding plate is located on the feed side of the second horizontal track, the third sliding plate abuts against the third horizontal track, a fifth spring is provided on the second fixing rod, one end of the fifth spring is fixedly connected to the third sliding plate, and the other end of the fifth spring is fixedly connected to the third fixing plate.

[0012] Furthermore, the limit clamping mechanism is as follows: a first electric cylinder is respectively provided on both sides of the second support frame, the output end of each first electric cylinder is respectively fixedly connected to the push plate, the two push plates are fixedly connected by a second connecting plate, both ends of each push plate are respectively rotatably connected to one end of the fourth connecting rod, the other end of each fourth connecting rod is respectively rotatably connected to one end of the fifth connecting rod, the other end of each fifth connecting rod is respectively fixedly connected to the second contact plate, and fourth sliding grooves are respectively processed on both sides of the third horizontal rail and are horizontally slidably connected to the two second contact plates, and a second slider is respectively provided on the other end of each fourth connecting rod, and the second support frame is respectively processed on both sides and is horizontally slidably connected to the second slider The two guide wheels are connected to each other by a sixth connecting rod and a seventh connecting rod respectively. The two guide wheels are connected to each other in a horizontal direction and a horizontal direction, respectively. The two guide wheels are fixed to the first connecting plate through the positioning plate. The two guide wheels are located at the end face of the second fixing plate and contact with the second fixing plate to limit the second fixing plate. A third spring is provided on each sliding rod, one end of each third spring is fixedly connected to the positioning plate. Each fourth fixing plate is respectively processed with a third horizontal sliding hole connected to the first connecting plate in a horizontal direction. Each first connecting plate is rotatably installed with a contact wheel that contacts the second contact plate.

[0013] Furthermore, one side of the second contact plate is processed with an inclined surface and an arc surface that contacts the contact wheel.

[0014] Furthermore, third slide grooves are processed on both side plates of the third horizontal track and move horizontally with the semiconductor finished product components.

[0015] The beneficial effects of the present application are as follows: (1) the semiconductor finished product assembly of the present application is automatically fed to the third horizontal rail and into the vacuum box, the laser heating module dries the plurality of semiconductor finished products of the semiconductor finished product assembly, the semiconductor finished product on the rotating plate is turned over, the plurality of surfaces of the semiconductor finished product can be uniformly dried, and after drying, the semiconductor finished product assembly is automatically discharged, the present application has the advantages of high drying efficiency and high automation degree.

[0016] (2) the two ends of each push plate of the present application are sequentially driven by the fourth connecting rod and the fifth connecting rod to drive the second abutting plate to move in the horizontal direction on the fourth sliding groove, when the inclined surface of the second abutting plate abuts against the abutting wheel on the first connecting plate, the first connecting plate slides in the third horizontal sliding hole of the fourth fixed plate in the horizontal direction, the first connecting plate drives the positioning plate and the slide rod to move, the positioning plate moves to abut against the end surface of the second fixed plate, and the four positioning plates respectively limit and clamp the two ends of the second fixed plate, having the advantage of stable clamping.

[0017] (3) the two ends of the transmission shaft of the present application are sequentially driven by the first connecting rod and the second connecting rod to drive the first sliding plate to move in the vertical direction in the two first sliding grooves on the same side, the first sliding blocks at one end of the two third connecting rods at the bottom plate slide on the first horizontal sliding hole of the first sliding plate, which can automatically drive the two bottom plates to close or open, when the two bottom plates are closed, the laser heating module dries the plurality of semiconductor finished products of the semiconductor finished product assembly, and when the two bottom plates are opened, the horizontal plane of the third horizontal rail moves to the same horizontal plane as the horizontal plane of the first horizontal rail and the horizontal plane of the second horizontal rail. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a structural schematic view of an embodiment of the semiconductor material piece drying device.

[0019] Figure 2 is Figure 1 is a structural schematic view of the semiconductor material piece drying device without the vacuum box.

[0020] Figure 3 is a structural schematic view of the driving mechanism.

[0021] Figure 4 is a structural schematic view of the two bottom plates.

[0022] Figure 5 is a structural schematic view of the first sliding plate.

[0023] Figure 6 is a structural schematic view of the semiconductor finished product assembly.

[0024] Figure 7 is a structural schematic view of the second fixed plate and the rotating plate.

[0025] Figure 8 It is a structural schematic diagram of a semiconductor finished product, a second spring and a clamping plate.

[0026] Figure 9 It is a structural diagram of the card board.

[0027] Figure 10 It is a structural diagram of the feeding mechanism, the limit clamping mechanism and the discharging structure.

[0028] Figure 11 It is a structural schematic diagram of the third fixed plate, the fourth spring, the first fixed rod and the second sliding plate.

[0029] Figure 12 It is a schematic diagram of the structure of the first horizontal track and the semiconductor finished product assembly.

[0030] Figure 13 It is a structural diagram of the feeding mechanism.

[0031] Figure 14 It is a structural diagram of the limit clamping mechanism.

[0032] Figure 15 yes Figure 14 Structural schematic diagram from the first angle.

[0033] Figure 16 yes Figure 14 Structural schematic diagram from the second angle.

[0034] Figure 17 yes Figure 16 The schematic diagram of the structure without the third horizontal track and the second support frame.

[0035] Figure 18 yes Figure 17 The structural diagram of the fourth fixing plate is removed.

[0036] Figure 19 It is a schematic diagram of the parts structure on the fourth fixed plate.

[0037] Figure 20 Schematic diagram of the structure of the second contact plate.

[0038] Figure 21 This is a schematic diagram of the structure of the third motor, the push plate and the semiconductor finished product assembly.

[0039] Figure numerals: 1, vacuum box; 2, vacuum generator; 3, driving mechanism; 301, transmission shaft; 302, first conveyor belt; 303, first motor; 304, first connecting rod; 305, second connecting rod; 306, first fixed plate; 307, first slide groove; 308, first sliding plate; 309, first horizontal sliding hole; 3091, first vertical sliding hole; 3092, inclined sliding hole; 3093, second vertical sliding hole; 310, third connecting rod; 311, first slider; 312, first transmission wheel; 4, semiconductor finished product assembly; 401, semiconductor finished product component; 402, second fixed plate; 403, partition ; 404, outer ring; 405, snap-fit ​​hole; 406, inner ring disk; 407, first contact plate; 408, first spring; 409, snap-fit ​​rod; 410, second spring; 411, snap-fit ​​plate; 412, rotating plate; 413, snap-fit ​​groove; 5, feeding mechanism; 501, second motor; 502, first transport wheel; 503, second slide; 504, second transmission wheel; 505, third transmission wheel; 506, second transport wheel; 507, second conveyor belt; 508, third conveyor belt; 509, fourth conveyor belt; 510, fourth transmission wheel; 511, first gear; 512, second gear; 513, fifth transmission Wheel; 514, fifth conveyor belt; 515, sixth transmission wheel; 516, seventh transmission wheel; 517, eighth transmission wheel; 518, ninth transmission wheel; 519, sixth conveyor belt; 520, seventh conveyor belt; 6, first horizontal track; 7, support; 8, position limiting clamping mechanism; 801, first electric cylinder; 802, third spring; 803, contact wheel; 804, fourth connecting rod; 805, fifth connecting rod; 806, second contact plate; 807, push plate; 808, positioning plate; 809, fourth slide groove; 810, first connecting plate; 811, second horizontal slide hole; 812, second slider; 813, third horizontal slide hole ;814, fourth fixed plate;815, sixth connecting rod;816, second connecting plate;817, sliding rod;818, first support frame;819, inclined surface;820, curved surface;9, discharge structure;10, second horizontal track;11, laser heating module;12, third horizontal track;13, bottom plate;14, second electric cylinder;15, guide rod;16, third fixed plate;17, fourth spring;18, first fixed rod;19, second sliding plate;20, third slide groove;21, third motor;22, push plate;23, second support frame;24, third sliding plate;25, fifth spring;26, second fixed rod. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0041] like Figures 1 to 2 、 Figure 10 、 Figure 21 As shown, the post-drying device for semiconductor material parts of this embodiment is composed of a vacuum box 1, a vacuum generator 2, a driving mechanism 3, a semiconductor finished product assembly 4, a feeding mechanism 5, a first horizontal rail 6, a support 7, a limit clamping mechanism 8, a discharge structure 9, a second horizontal rail 10, a laser heating module 11, a third horizontal rail 12, a base plate 13, a second electric cylinder 14, a guide rod 15, a third fixed plate 16, a fourth spring 17, a first fixed rod 18, a second sliding plate 19, a third slide 20, a third motor 21, a push plate 22, a second support frame 23, a third sliding plate 24, a fifth spring 25, and a second fixed rod 26.

[0042] A vacuum box 1 is provided on the support 7, a vacuum generator 2 is provided on the vacuum box 1, a third horizontal track 12 for moving in the vertical direction is provided inside the vacuum box 1, a second electric cylinder 14 is provided on the support 7, the output end of the second electric cylinder 14 is fixedly connected to the second support frame 23, a guide rod 15 for moving in the vertical direction with the support 7 is provided at the bottom of the second support frame 23, the second support frame 23 is fixedly installed at the bottom of the third horizontal track 12, a semiconductor finished product assembly 4 is provided on the third horizontal track 12, and third slide grooves 20 for moving in the horizontal direction with the semiconductor finished product assembly 4 are respectively processed on both side plates of the third horizontal track 12, a limiting clamping mechanism 8 for clamping and positioning the semiconductor finished product assembly 4 is provided on the third horizontal track 12, and a positioning mechanism for positioning the semiconductor finished product assembly 4 is provided on the top of the vacuum box 1. A laser heating module 11 is provided for drying the component 4, two bottom plates 13 are provided at the bottom opening of the vacuum box 1, and a driving mechanism 3 is provided on the support 7 for driving the two bottom plates 13 to move horizontally at the bottom of the vacuum box 1. The horizontal movement directions of the two bottom plates 13 are opposite, and a third fixed plate 16 is provided on the support 7 and is located at the bottom of the vacuum box 1. A first horizontal track 6 is provided on one side of the bottom of the vacuum box 1, and a feeding mechanism 5 is provided on the first horizontal track 6 for driving the semiconductor finished component 4 to move horizontally on the first horizontal track 6 for feeding, and a second horizontal track 10 is provided on the third fixed plate 16 and is located on the other side of the bottom of the vacuum box 1, and a discharging structure 9 is provided on the second horizontal track 10 for driving the semiconductor finished component 4 to discharge horizontally on the second horizontal track 10.

[0043] A first fixing rod 18 is fixedly mounted on one side of the third fixing plate 16. The first fixing rod 18 is connected to a second sliding plate 19 in a vertical sliding manner. The second sliding plate 19 is located on the discharge side of the first horizontal rail 6. The second sliding plate 19 abuts against the third horizontal rail 12. A fourth spring 17 is provided on the first fixing rod 18. One end of the fourth spring 17 is fixedly connected to the second sliding plate 19, and the other end of the fourth spring 17 is fixedly connected to the third fixing plate 16. A second fixing rod 26 is fixedly mounted on the other side of the third fixing plate 16. The second fixing rod 26 is connected to a third sliding plate 24 in a vertical sliding manner. The third sliding plate 24 is located on the feed side of the second horizontal rail 10. The third sliding plate 24 abuts against the third horizontal rail 12. A fifth spring 25 is provided on the second fixing rod 26. One end of the fifth spring 25 is fixedly connected to the third sliding plate 24, and the other end of the fifth spring 25 is fixedly connected to the third fixing plate 16.

[0044] like Figures 3 to 5 As shown, the driving mechanism 3 is composed of a transmission shaft 301, a first conveyor belt 302, a first motor 303, a first connecting rod 304, a second connecting rod 305, a first fixed plate 306, a first slide groove 307, a first sliding plate 308, a first horizontal slide hole 309, a first vertical slide hole 3091, an inclined slide hole 3092, a second vertical slide hole 3093, a third connecting rod 310, a first slider 311, and a first transmission wheel 312.

[0045] The driving mechanism 3 is as follows: two first fixed plates 306 located on both sides of the vacuum box 1 are respectively provided on the support 7, and a first sliding plate 308 is slidably connected between the two first fixed plates 306 on the same side in a vertical direction, and each first fixed plate 306 is respectively processed with a first sliding groove 307 slidably connected to the first sliding plate 308 in a vertical direction, each first sliding plate 308 is rotatably connected to one end of the second connecting rod 305, and the other end of each second connecting rod 305 is rotatably connected to one end of the first connecting rod 304, and the other end of each first connecting rod 304 is fixedly connected to one end of the transmission shaft 301, and a first motor 303 is provided at the top of the vacuum box 1, and the output shaft of the first motor 303 is fixedly connected to the first transmission wheel 312, and the first transmission wheel 312 is transmission-connected to the transmission shaft 301 through the first conveyor belt 302, and the transmission shaft 301 is rotatably connected to the top of the vacuum box 1.

[0046] Each base plate 13 is fixedly connected to one end of a third connecting rod 310 on both sides. A first slider 311 is provided at the other end of each third connecting rod 310. Each first sliding plate 308 is provided with two first horizontal sliding holes 309, which are slidably connected to the first sliders 311. The first horizontal sliding holes 309 include a first vertical sliding hole 3091, an inclined sliding hole 3092, and a second vertical sliding hole 3093. The inclined sliding hole 3092 has a first vertical sliding hole 3091 formed at the top end thereof, which communicates with it. The inclined sliding hole 3092 has a second vertical sliding hole 3093 formed at the bottom end thereof, which communicates with it.

[0047] like Figures 6 to 9 、 Figure 21 As shown, the semiconductor finished product assembly 4 is composed of a semiconductor finished product part 401, a second fixed plate 402, a partition 403, an outer ring 404, a snap-in hole 405, an inner ring disk 406, a first contact plate 407, a first spring 408, a snap-in rod 409, a second spring 410, a snap-in plate 411, a rotating plate 412, and a snap-in groove 413.

[0048] The semiconductor finished component 4 is as follows: a rotating plate 412 is rotatably mounted on the second fixed plate 402, an outer ring 404 is respectively provided at both ends of the second fixed plate 402, an inner ring disk 406 is respectively provided at both ends of the rotating plate 412, each inner ring disk 406 is respectively located inside each outer ring 404, each inner ring disk 406 is respectively provided with a first contact plate 407, each inner ring disk 406 is respectively slidably connected to a clamping rod 409, each clamping rod 409 is respectively provided with a first spring 408, the first spring One end of the spring 408 is fixedly connected to the first contact plate 407, and the other end of the first spring 408 is fixedly connected to one end of the clamping rod 409. The outer ring 404 is symmetrically processed in the circumferential direction with two clamping holes 405 that are clamped to the clamping rod 409. A plurality of partitions 403 are arranged at intervals in the horizontal direction on the rotating plate 412. Each partition 403 is connected to the clamping plate 411 through the second spring 410. Each clamping plate 411 is processed with a clamping groove 413 that is clamped to one end of the semiconductor finished product 401.

[0049] The structure of the feeding mechanism 5 is the same as that of the discharging mechanism 9. Figures 10 to 13 As shown, the feeding mechanism 5 is composed of a second motor 501, a first transport wheel 502, a second slide 503, a second transmission wheel 504, a third transmission wheel 505, a second transport wheel 506, a second conveyor belt 507, a third conveyor belt 508, a fourth conveyor belt 509, a fourth transmission wheel 510, a first gear 511, a second gear 512, a fifth transmission wheel 513, a fifth conveyor belt 514, a sixth transmission wheel 515, a seventh transmission wheel 516, an eighth transmission wheel 517, a ninth transmission wheel 518, a sixth conveyor belt 519, and a seventh conveyor belt 520.

[0050] The feeding mechanism 5 is as follows: second slide grooves 503 are processed on both side plates of the first horizontal track 6 and are slidably connected to the semiconductor finished component 4 in the horizontal direction, a second motor 501 is provided at the bottom of the first horizontal track 6, the output shaft of the second motor 501 is fixedly connected to the first gear 511, and a fourth transmission wheel 510 is fixedly installed on the top of the first gear 511, a second gear 512 is provided at the bottom of the first horizontal track 6 to mesh with the first gear 511 for transmission, and a fifth transmission wheel 513 is provided on the top of the second gear 512, and a plurality of first transport wheels 502 are arranged at intervals along the horizontal direction on one side of the first horizontal track 6, and an eighth transmission wheel 517 and a ninth transmission wheel 518 are fixedly connected on the top of each first transport wheel 502, the eighth transmission wheel 517 is transmission-connected to the eighth transmission wheel 517 on the top of the first transport wheel 502 on the adjacent side through the sixth conveyor belt 519, and the ninth transmission wheel 518 is transmission-connected to the ninth transmission wheel 518 on the adjacent side through the third conveyor belt 508. The ninth transmission wheel 518 on the top of a transport wheel 502 is connected for transmission, and a seventh transmission wheel 516 is provided at the bottom of each first transport wheel 502. A plurality of second transport wheels 506 are arranged at intervals in the horizontal direction on the other side of the first horizontal track 6. A fixedly connected second transmission wheel 504 and a third transmission wheel 505 are provided on the top of each second transport wheel 506. The second transmission wheel 504 is connected for transmission to the second transmission wheel 504 on the top of the second transport wheel 506 on the adjacent side through the seventh conveyor belt 520. The third transmission wheel 505 is connected for transmission to the third transmission wheel 505 on the top of the second transport wheel 506 on the other adjacent side through the fourth conveyor belt 509. A sixth transmission wheel 515 is provided at the bottom of each second transport wheel 506. The fourth transmission wheel 510 is connected for transmission to one of the sixth transmission wheels 515 through the second conveyor belt 507. The fifth transmission wheel 513 is connected for transmission to one of the seventh transmission wheels 516 through the fifth conveyor belt 514.

[0051] like Figures 14 to 20 As shown, the limiting clamping mechanism 8 is composed of a first electric cylinder 801, a third spring 802, a resistance wheel 803, a fourth connecting rod 804, a fifth connecting rod 805, a second resistance plate 806, a push plate 807, a positioning plate 808, a fourth sliding groove 809, a first connecting plate 810, a second horizontal sliding hole 811, a second slider 812, a third horizontal sliding hole 813, a fourth fixed plate 814, a sixth connecting rod 815, a second connecting plate 816, a sliding rod 817, a first support frame 818, an inclined surface 819, and an arcuate surface 820.

[0052] The limiting clamping mechanism 8 is as follows: a first electric cylinder 801 is respectively provided on both sides of the second support frame 23, and the output end of each first electric cylinder 801 is fixedly connected to the push plate 807, and the two push plates 807 are fixedly connected by a second connecting plate 816. Both ends of each push plate 807 are rotatably connected to one end of the fourth connecting rod 804, and the other end of each fourth connecting rod 804 is rotatably connected to one end of the fifth connecting rod 805, and the other end of each fifth connecting rod 805 is fixedly connected to the second contact plate 806. Fourth sliding grooves 809 are respectively processed on both sides of the third horizontal rail 12 to slide horizontally with the two second contact plates 806, and a second slider 812 is respectively provided on the other end of each fourth connecting rod 804. Second horizontal sliding holes 811 are respectively processed on both sides of the second support frame 23 to slide horizontally with the second slider 812, and the two second sliders 812 on both sides are connected by a sixth connecting rod 815.

[0053] The two ends of the third horizontal rail 12 are respectively provided with a fourth fixed plate 814, each fourth fixed plate 814 is respectively connected to a sliding rod 817 for sliding in the horizontal direction, and each sliding rod 817 is respectively fixedly connected to the first connecting plate 810 through a positioning plate 808. Each positioning plate 808 is respectively located at the end surface of the second fixed plate 402 and contacts and limits the second fixed plate 402. Each sliding rod 817 is respectively provided with a third spring 802, and one end of each third spring 802 is respectively fixedly connected to the positioning plate 808. Each fourth fixed plate 814 is respectively processed with a third horizontal sliding hole 813 that is slidably connected to the first connecting plate 810 in the horizontal direction, and each first connecting plate 810 is respectively rotatably mounted with a contact wheel 803 that contacts the second contact plate 806. One side of the second contact plate 806 is processed with an inclined surface 819 and an arc surface 820 that contacts the contact wheel 803.

[0054] A first support frame 818 is provided on the inner side wall of the vacuum box 1 , and a third motor 21 is provided on the first support frame 818 . The output shaft of the third motor 21 is fixedly connected to the push plate 22 . The push plate 22 is located above the first contact plate 407 and contacts the first contact plate 407 .

[0055] The working principle of this embodiment is as follows: a plurality of semiconductor finished products 401 are placed on the rotating plate 412, and the plurality of semiconductor finished products 401 are respectively engaged with the corresponding engaging grooves 413 of the engaging plate 411, and the driving mechanism 3 drives the two bottom plates 13 to slide horizontally at the bottom of the vacuum box 1, and the driving mechanism 3 opens the two bottom plates 13 at the bottom of the vacuum box 1, and the output end of the second electric cylinder 14 drives the second support frame 23, the third horizontal rail 12, and the position limiting clamping mechanism 8 to move downward in the vertical direction, while the guide rod 15 at the bottom of the second support frame 23 moves vertically on the third fixed plate 16 and the support 7, and one end of the bottom of the third horizontal rail 12 moves to the top of the second sliding plate 19 and contacts the top of the second sliding plate 19 , the second sliding plate 19 moves in the vertical direction on the first fixed rod 18, the second sliding plate 19 moves to separate from the discharge port of the first horizontal rail 6, the other end of the bottom of the third horizontal rail 12 moves to the top of the third sliding plate 24 and conflicts with the top of the third sliding plate 24, the third sliding plate 24 moves in the vertical direction on the second fixed rod 26, the third sliding plate 24 moves to separate from the feed port of the second horizontal rail 10, the feed port of the third horizontal rail 12 moves to be connected with the feed port of the first horizontal rail 6, the discharge port of the third horizontal rail 12 moves to be connected with the feed port of the second horizontal rail 10, the horizontal plane of the third horizontal rail 12 is respectively aligned with the horizontal plane of the first horizontal rail 6 and the horizontal plane of the second horizontal rail 10 The semiconductor finished product component 4 is placed between the second chutes 503 on both side plates of the first horizontal track 6. The feeding mechanism 5 drives the semiconductor finished product component 4 to move horizontally on the second chutes 503 on both sides of the first horizontal track 6. The semiconductor finished product component 4 moves on the third chutes 20 on both sides of the third horizontal track 12. The semiconductor finished product component 4 stops moving. The limit clamping mechanism 8 limits and clamps the semiconductor finished product component 4 on the third horizontal track 12. The output end of the second electric cylinder 14 drives the second support frame 23, the third horizontal track 12, the semiconductor finished product component 4 and the limit clamping mechanism 8 to move upward in the vertical direction. The semiconductor finished product component 4 moves to below the laser heating module 11 inside the vacuum box 1. The first contact plates 407 at both ends of the rotating plate 412 move to the bottom of the pushing plate 22 and contact with the bottom of the pushing plate 22, the driving mechanism 3 closes the two bottom plates 13 at the bottom of the vacuum box 1, the vacuum generator 2 evacuates the vacuum box 1, and the laser heating module 11 dries multiple semiconductor finished products 401 of the semiconductor finished product assembly 4. The output shaft of the third motor 21 drives the pushing plate 22 to rotate, and the pushing plate 22 drives the first contact plate 407 to rotate. The first contact plate 407 drives the rotating plate 412 to rotate on the second fixed plate 402, and the clamping rod 409 is clamped with the clamping hole 405 on the outer ring 404. The semiconductor finished product 401 on the rotating plate 412 is flipped to facilitate drying of multiple sides of the semiconductor finished product 401.

[0056] After the semiconductor product assembly 401 is dried, the driving mechanism 3 opens the two bottom plates 13 at the bottom of the vacuum box 1, the output end of the second electric cylinder 14 drives the second support frame 23, the third horizontal rail 12, the semiconductor product assembly 4, and the limiting and clamping mechanism 8 to move downward in the vertical direction, while the guide rod 15 at the bottom of the second support frame 23 moves in the vertical direction on the third fixed plate 16 and the support 7, the discharge port of the third horizontal rail 12 moves to be in communication with the feeding port of the second horizontal rail 10, the horizontal plane of the third horizontal rail 12 is respectively in communication with the horizontal plane of the first horizontal rail 6 and the second horizontal rail 10 for feeding, the semiconductor product assembly 4 after drying is pushed to the second horizontal rail 10, the semiconductor product assembly 4 on the second horizontal rail 10 is discharged by the discharge structure 9, and the next semiconductor product assembly 4 is pushed to the third horizontal rail 12 for drying.

[0057] The driving mechanism 3 drives the two bottom plates 13 to slide in the horizontal direction at the bottom of the vacuum box 1, and the working principle of the driving mechanism 3 for opening the two bottom plates 13 at the bottom of the vacuum box 1 is that the output shaft of the first motor 303 drives the first transmission wheel 312 to rotate, the first transmission wheel 312 drives the transmission shaft 301 to rotate through the first transmission belt 302, the transmission shaft 301 drives the first sliding plate 308 to move in the vertical direction in the same side two first sliding grooves 307 through the first connecting rod 304 and the second connecting rod 305 at both ends, respectively, one end of the two third connecting rods 310 at both ends of the bottom plate 13 drives the first sliding block 311 to slide on the first horizontal sliding hole 309 of the first sliding plate 308, respectively, when the first sliding block 311 is located in the second vertical sliding hole 3093 of the first sliding plate 308, the two bottom plates 13 are closed, and when the first sliding block 311 is located in the first vertical sliding hole 3091 of the first sliding plate 308, the two bottom plates 13 are opened.

[0058] Among them, the working principle of the feeding mechanism 5 driving the semiconductor finished component 4 to move horizontally on the second slide trough 503 on both sides is as follows: the output shaft of the second motor 501 drives the first gear 511 to rotate, the first gear 511 drives the fourth transmission wheel 510 to rotate, the fourth transmission wheel 510 drives the sixth transmission wheel 515 to rotate through the second conveyor belt 507, the sixth transmission wheel 515 drives the second transport wheel 506 to rotate, the second transmission wheel 504 on the top of the second transport wheel 506 drives the second transport wheel 506 on the adjacent side to rotate through the seventh conveyor belt 520, the second transport wheel 506 drives the second transport wheel 506 on the other side to rotate through the fourth conveyor belt 509, and multiple The second transport wheel 506 rotates, the first gear 511 engages with the second gear 512 for transmission, the second gear 512 drives the fifth transmission wheel 513 to rotate, the fifth transmission wheel 513 drives the seventh transmission wheel 516 to rotate through the fifth conveyor belt 514, the seventh transmission wheel 516 drives the first transport wheel 502 to rotate, the eighth transmission wheel 517 on the top of the first transport wheel 502 drives the first transport wheel 502 on the adjacent side to rotate through the sixth conveyor belt 519, the ninth transmission wheel 518 drives the first transport wheel 502 on the other adjacent side to rotate through the third conveyor belt 508, multiple second transport wheels 506 and multiple first transport wheels 502 rotate to transport and feed the semiconductor finished product components 4.

[0059] Among them, the working principle of the position limiting clamping mechanism 8 for limiting and clamping the semiconductor finished component 4 on the third horizontal rail 12 is as follows: the output ends of the first electric cylinder 801 on both sides of the second support frame 23 respectively drive the push plate 807 to move in the vertical direction on the second support frame 23, and the two ends of each push plate 807 respectively drive the second contact plate 806 to move in the horizontal direction on the fourth slide groove 809 of the second support frame 23 through the fourth connecting rod 804 and the fifth connecting rod 805, and each fourth connecting rod 804 respectively drives the second slider 812 to move in the second horizontal slide hole 811, the inclined surface 819 of the second contact plate 806 contacts the contact wheel 803 on the first connecting plate 810. The first connecting plate 810 slides horizontally in the third horizontal sliding hole 813 of the fourth fixing plate 814. The first connecting plate 810 drives the positioning plate 808 and the sliding rod 817 to move. The sliding rod 817 moves horizontally on the fourth fixing plate 814. The positioning plate 808 moves until it contacts the end surface of the second fixing plate 402. The four positioning plates 808 respectively limit and clamp the two ends of the second fixing plate 402. When the curved surface 820 of the second contact plate 806 contacts the contact wheel 803 on the first connecting plate 810, the four positioning plates 808 respectively separate from the two ends of the second fixing plate 402.

[0060] The working principle of the driving mechanism 3 closing the two bottom plates 13 at the bottom of the vacuum box 1 is the same as the working principle of the driving mechanism 3 opening the two bottom plates 13 at the bottom of the vacuum box 1 .

[0061] The work principle of the discharging structure 9 discharging the semiconductor product assembly 4 on the second horizontal track 10 is the same as the work principle of the feeding mechanism 5 driving the semiconductor product assembly 4 to move in the horizontal direction on the second chute 503 at both sides.

[0062] The above merely describes the preferred embodiments of the present application, but not for limiting the protection scope of the present application.

Claims

1. A drying device for semiconductor material parts after they are manufactured, characterized in that: A vacuum box (1) is provided on the support (7), a vacuum generator (2) is provided on the vacuum box (1), a third horizontal track (12) is provided inside the vacuum box (1) and moves in a vertical direction, a semiconductor finished product component (4) is provided on the third horizontal track (12), a position limiting clamping mechanism (8) is provided on the third horizontal track (12) for clamping and positioning the semiconductor finished product component (4), a laser heating module (11) is provided on the top of the vacuum box (1) for drying the semiconductor finished product component (4) on the third horizontal track (12), two bottom plates (13) are provided at the bottom opening of the vacuum box (1), and a mechanism for driving the two bottom plates (13) to move in a horizontal direction at the bottom of the vacuum box (1) is provided on the support (7). A driving mechanism (3), wherein the horizontal movement directions of the two bottom plates (13) are opposite, a third fixed plate (16) located at the bottom of the vacuum box (1) is provided on the support (7), a first horizontal track (6) located at one side of the bottom of the vacuum box (1) is provided on one side of the third fixed plate (16), a feeding mechanism (5) for driving the semiconductor finished component (4) to move horizontally on the first horizontal track (6) for feeding, a second horizontal track (10) located at the other side of the bottom of the vacuum box (1) is provided on the third fixed plate (16), and a discharge structure (9) for driving the semiconductor finished component (4) to discharge horizontally on the second horizontal track (10); A first fixing rod (18) is fixedly installed on one side of the third fixing plate (16), and the first fixing rod (18) is slidably connected to a second sliding plate (19) in a vertical direction. The second sliding plate (19) is located on the discharge port side of the first horizontal track (6). The second sliding plate (19) is in contact with the third horizontal track (12). A fourth spring (17) is provided on the first fixing rod (18), and one end of the fourth spring (17) is fixedly connected to the second sliding plate (19), and the other end of the fourth spring (17) is fixedly connected to the third fixing plate (16). A second fixed rod (26) is fixedly installed on the other side of the third fixed plate (16), and the second fixed rod (26) is slidably connected to the third sliding plate (24) in the vertical direction. The third sliding plate (24) is located on the feed port side of the second horizontal track (10). The third sliding plate (24) is in conflict with the third horizontal track (12). A fifth spring (25) is provided on the second fixed rod (26), and one end of the fifth spring (25) is fixedly connected to the third sliding plate (24), and the other end of the fifth spring (25) is fixedly connected to the third fixed plate (16); The semiconductor finished product assembly (4) is as follows: a rotating plate (412) is rotatably mounted on a second fixed plate (402), outer rings (404) are respectively provided at both ends of the second fixed plate (402), inner ring disks (406) are respectively provided at both ends of the rotating plate (412), each inner ring disk (406) is respectively located inside each outer ring (404), each inner ring disk (406) is respectively provided with a first contact plate (407), each inner ring disk (406) is respectively slidably connected to a clamping rod (409), each clamping rod (409) is respectively provided with a first spring (408), and the first One end of a spring (408) is fixedly connected to the first contact plate (407), and the other end of the first spring (408) is fixedly connected to one end of the clamping rod (409). Two clamping holes (405) for clamping with the clamping rod (409) are symmetrically processed in the circumferential direction of the outer ring (404). A plurality of partitions (403) are arranged on the rotating plate (412) at intervals in the horizontal direction. Each partition (403) is connected to the clamping plate (411) via a second spring (410). Each clamping plate (411) is processed with a clamping groove (413) for clamping one end of the semiconductor finished product (401). The position limiting clamping mechanism (8) is as follows: a first electric cylinder (801) is respectively provided on both sides of the second support frame (23); the output end of each first electric cylinder (801) is respectively fixedly connected to a push plate (807); the two push plates (807) are fixedly connected via a second connecting plate (816); both ends of each push plate (807) are respectively rotatably connected to one end of a fourth connecting rod (804); the other end of each fourth connecting rod (804) is respectively rotatably connected to one end of a fifth connecting rod (805); the other end of each fifth connecting rod (805) is respectively rotatably connected to one end of a fifth connecting rod (805); They are fixedly connected to the second contact plates (806), and fourth sliding grooves (809) are respectively processed on both sides of the third horizontal track (12) and are connected to the two second contact plates (806) in a horizontal sliding direction. A second slider (812) is respectively provided at the other end of each fourth connecting rod (804). Second horizontal sliding holes (811) are respectively processed on both sides of the second support frame (23) and are connected to the second slider (812) in a horizontal sliding direction. The two second sliders (812) on both sides are connected by a sixth connecting rod (815). A fourth fixed plate (814) is provided at each end of both sides of the third horizontal track (12), each fourth fixed plate (814) is connected to a sliding rod (817) in a sliding manner in the horizontal direction, each sliding rod (817) is fixedly connected to the first connecting plate (810) through a positioning plate (808), each positioning plate (808) is located on the end surface of the second fixed plate (402) and contacts and limits the second fixed plate (402), each sliding rod (817) is provided with a third spring (802), one end of each third spring (802) is fixedly connected to the positioning plate (808), each fourth fixed plate (814) is processed with a third horizontal sliding hole (813) connected to the first connecting plate (810) in a sliding manner in the horizontal direction, and each first connecting plate (810) is rotatably installed with a contact wheel (803) that contacts the second contact plate (806); The structure of the feeding mechanism (5) is the same as that of the discharging structure (9). The feeding mechanism (5) is as follows: the second slide grooves (503) connected to the semiconductor finished component (4) in a horizontal direction are respectively processed on the two side plates of the first horizontal track (6); the second motor (501) is provided at the bottom of the first horizontal track (6); the output shaft of the second motor (501) is fixedly connected to the first gear (511); the top of the first gear (511) is fixedly mounted with a fourth transmission wheel (510); the bottom of the first horizontal track (6) is provided with a second transmission wheel connected to the first gear (511); ) is meshed with a second gear (512) for transmission, a fifth transmission wheel (513) is arranged on the top of the second gear (512), a plurality of first transport wheels (502) are arranged at intervals in the horizontal direction on one side of the first horizontal track (6), and an eighth transmission wheel (517) and a ninth transmission wheel (518) are respectively arranged on the top of each first transport wheel (502) for fixed connection, the eighth transmission wheel (517) is transmission-connected to the eighth transmission wheel (517) on the top of the first transport wheel (502) on the adjacent side through a sixth conveyor belt (519), and the ninth transmission wheel (518) is transmission-connected to the eighth transmission wheel (517) on the top of the first transport wheel (502) on the adjacent side through a third conveyor belt (519). The conveyor belt (508) is connected to the ninth transmission wheel (518) on the top of the first transport wheel (502) on the other side of the adjacent transport wheel. The bottom of each first transport wheel (502) is respectively provided with a seventh transmission wheel (516). A plurality of second transport wheels (506) are arranged at intervals in the horizontal direction on the other side of the first horizontal track (6). The top of each second transport wheel (506) is respectively provided with a second transmission wheel (504) and a third transmission wheel (505) that are fixedly connected. The second transmission wheel (504) is connected to the second transport wheel (501) on the adjacent side through the seventh conveyor belt (520). 6) The second transmission wheel (504) at the top is transmission-connected, the third transmission wheel (505) is transmission-connected to the third transmission wheel (505) at the top of the second transport wheel (506) on the other side via a fourth conveyor belt (509), a sixth transmission wheel (515) is respectively provided at the bottom of each second transport wheel (506), the fourth transmission wheel (510) is transmission-connected to one of the sixth transmission wheels (515) via a second conveyor belt (507), and the fifth transmission wheel (513) is transmission-connected to one of the seventh transmission wheels (516) via a fifth conveyor belt (514).

2. The device for drying semiconductor material after fabrication according to claim 1, characterized in that: A second electric cylinder (14) is provided on the support (7), an output end of the second electric cylinder (14) is fixedly connected to the second support frame (23), a guide rod (15) is provided at the bottom of the second support frame (23) and moves in a vertical direction with the support (7), and the second support frame (23) is fixedly installed at the bottom of the third horizontal track (12).

3. The device for drying semiconductor material after fabrication according to claim 1, characterized in that: A first support frame (818) is provided on the inner side wall of the vacuum box (1), a third motor (21) is provided on the first support frame (818), an output shaft of the third motor (21) is fixedly connected to the push plate (22), and the push plate (22) is located above the first contact plate (407) and contacts the first contact plate (407).

4. The device for drying semiconductor material after fabrication according to claim 1, characterized in that: The driving mechanism (3) is as follows: two first fixed plates (306) located on both sides of the vacuum box (1) are respectively provided on the support (7); a first sliding plate (308) is slidably connected between the two first fixed plates (306) on the same side in a vertical direction; each first fixed plate (306) is respectively processed with a first sliding groove (307) slidably connected to the first sliding plate (308) in a vertical direction; each first sliding plate (308) is rotatably connected to one end of the second connecting rod (305); the other end of each second connecting rod (305) is rotatably connected to one end of the first connecting rod (304); the other end of each first connecting rod (304) is respectively fixedly connected to one end of the transmission shaft (301); a first motor (303) is provided on the top of the vacuum box (1); the output shaft of the first motor (303) is fixedly connected to the first transmission wheel (312); the first transmission wheel (312) is transmission-connected to the transmission shaft (301) through the first conveyor belt (302); Both sides of each base plate (13) are fixedly connected to one end of a third connecting rod (310), and the other end of each third connecting rod (310) is provided with a first sliding block (311). Each first sliding plate (308) is processed with two first horizontal sliding holes (309) for sliding connection with the first sliding blocks (311).

5. The device for drying semiconductor material after fabrication according to claim 4, characterized in that: Each of the first horizontal sliding holes (309) includes a first vertical sliding hole (3091), an inclined sliding hole (3092) and a second vertical sliding hole (3093), wherein the top end of the inclined sliding hole (3092) is processed with the first vertical sliding hole (3091) interconnected therewith, and the bottom end of the inclined sliding hole (3092) is processed with the second vertical sliding hole (3093) interconnected therewith.

6. The device for drying semiconductor material after fabrication according to claim 1, characterized in that: One side of the second contact plate (806) is machined with an inclined surface (819) and an arcuate surface (820) for contacting the contact wheel (803).

7. The device for drying semiconductor material after fabrication according to claim 1, characterized in that: The two side plates of the third horizontal track (12) are respectively processed with third slide grooves (20) that move horizontally with the semiconductor finished product assembly (4).

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