Test system, method, apparatus and storage medium for infrared focal plane detector

Abstract

The present disclosure provides a test system, method, device and storage medium of an infrared focal plane detector. The system comprises: a to-be-tested infrared focal plane detector, an interface board and a data acquisition module; the interface board is electrically connected with the to-be-tested infrared focal plane detector and the data acquisition module respectively; the interface board is configured to: acquire an output signal of the to-be-tested infrared focal plane detector, pre-process the output signal to obtain an acquisition signal, and send the acquisition signal to the data acquisition module; the data acquisition module is configured to: determine a test parameter of the to-be-tested infrared focal plane detector according to the acquisition signal. The interface board comprises: an input module and an output module; the input module is electrically connected with the to-be-tested infrared focal plane detector and is configured to provide an input signal for the to-be-tested infrared focal plane detector; the output module is electrically connected with the data acquisition module and is configured to acquire the output signal generated by the to-be-tested infrared focal plane detector under the input signal.

Description

Technical Field

[0001] This disclosure relates to the field of device testing technology, and in particular to a testing system, method, equipment and storage medium for an infrared focal plane detector. Background Technology

[0002] There are many types of optoelectronic devices used in current missile-borne and ground weapon systems, including infrared focal plane array detectors used in infrared guidance. The focal plane of an infrared focal plane array detector has tens of thousands of pixels and is equipped with readout circuitry, giving it the dual functions of signal acquisition and signal readout. However, it is currently not possible to accurately and comprehensively test the parameters of infrared focal plane array detectors.

[0003] Therefore, how to accurately and comprehensively test the parameters of infrared focal plane detectors has become an urgent technical problem to be solved. Summary of the Invention

[0004] In view of this, the purpose of this disclosure is to provide a test system, method, device and storage medium for an infrared focal plane detector to solve or partially solve the above-mentioned technical problems.

[0005] To achieve the above objectives, the first aspect of this disclosure provides a testing system for an infrared focal plane detector, the system comprising: an infrared focal plane detector under test, an interface board, and a data acquisition module; the interface board is electrically connected to the infrared focal plane detector under test and the data acquisition module, respectively.

[0006] The interface board is configured as follows:

[0007] The first output signal of the infrared focal plane detector under test at a high-temperature blackbody temperature is acquired, the first output signal is preprocessed to obtain a first acquisition signal, and the first acquisition signal is sent to the data acquisition module.

[0008] The second output signal of the infrared focal plane detector under test at a low-temperature blackbody temperature is acquired, the second output signal is preprocessed to obtain a second acquisition signal, and the second acquisition signal is sent to the data acquisition module.

[0009] The data acquisition module is configured as follows:

[0010] A first average voltage value is determined from the first acquired signal, and a second average voltage value is determined from the second acquired signal;

[0011] The first response voltage, the first noise voltage, and the first radiated power at the high-temperature blackbody temperature are determined based on the first average voltage value, and the second response voltage, the second noise voltage, and the second radiated power at the low-temperature blackbody temperature are determined based on the second average voltage value.

[0012] A first response rate is determined at a high-temperature blackbody temperature based on the first response voltage and the first radiated power; a second response rate is determined at a low-temperature blackbody temperature based on the second response voltage and the second radiated power; and a response rate from the high-temperature blackbody temperature to the low-temperature blackbody temperature is determined based on the first response rate and the second response rate.

[0013] The first pixel equivalent temperature difference at the high temperature blackbody temperature is determined based on the first response voltage and the first noise voltage. The second pixel equivalent temperature difference at the high temperature blackbody temperature is determined based on the second response voltage and the second noise voltage. The pixel equivalent temperature difference from the high temperature blackbody temperature to the low temperature blackbody temperature is determined based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference.

[0014] An invalid pixel matrix is ​​determined from the first acquisition signal and the second acquisition signal, and an invalid pixel rate is determined based on the invalid pixel matrix;

[0015] The response rate, the equivalent temperature difference of the pixel, and the invalid pixel rate are used as the test parameters for the infrared focal plane detector under test.

[0016] Based on the same inventive concept, a second aspect of this disclosure proposes a testing method for an infrared focal plane detector. This method is applied to the testing system for the infrared focal plane detector described in the first aspect. The system includes: an infrared focal plane detector under test, an interface board, and a data acquisition module. The method includes:

[0017] The interface board acquires the output signal of the infrared focal plane detector under test, preprocesses the output signal to obtain the acquisition signal, and sends the acquisition signal to the data acquisition module;

[0018] The data acquisition module determines the test parameters of the infrared focal plane detector under test based on the acquired signals.

[0019] Based on the same inventive concept, a third aspect of this disclosure proposes an electronic device including a memory, a processor, and a computer program stored in the memory and executable by the processor, wherein the processor implements the method described above when executing the computer program.

[0020] Based on the same inventive concept, a fourth aspect of this disclosure provides a non-transitory computer-readable storage medium that stores computer instructions for causing a computer to perform the methods described above.

[0021] As described above, this disclosure provides a test system, method, equipment, and storage medium for infrared focal plane detectors. The interface board can acquire the output signals of the infrared focal plane detector under test at different blackbody temperatures, and after preprocessing the output signals, send them to the data acquisition module. The data acquisition module then analyzes the acquired signals at different blackbody temperatures to obtain the test parameters of the infrared focal plane detector under test. By analyzing the acquired signals at different blackbody temperatures, the data acquisition module can obtain the responsivity, pixel equivalent temperature difference, and invalid pixel rate as test parameters of the infrared focal plane detector under test, thereby enabling accurate and comprehensive testing of the detector's parameters. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in this disclosure or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a first structural schematic diagram of a test system for an infrared focal plane detector according to an embodiment of this disclosure;

[0024] Figure 2 This is a second structural schematic diagram of a test system for an infrared focal plane detector according to an embodiment of this disclosure;

[0025] Figure 3 This is a third structural schematic diagram of a test system for an infrared focal plane detector according to an embodiment of this disclosure;

[0026] Figure 4 This is a schematic diagram of the infrared focal plane detector according to an embodiment of the present disclosure;

[0027] Figure 5 This is a flowchart of a test method for an infrared focal plane detector according to an embodiment of the present disclosure;

[0028] Figure 6 This is a schematic diagram of the structure of an electronic device according to an embodiment of the present disclosure.

[0029] Explanation of reference numerals in the attached figures:

[0030] 100. Test system for infrared focal plane detector; 110. Infrared focal plane detector under test; 120. Interface board; 121. Input module; 1211. Power input module; 1212. Bias input module; 1213. Timing input module; 122. Output module; 130. Data acquisition module; 131. Storage module. Detailed Implementation

[0031] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0032] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure should have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0033] Based on the background description, there are many types of optoelectronic devices used in current missile-borne and ground weapon systems, including infrared focal plane arrays (FLAS) used in infrared guidance. A focal plane array has tens of thousands of pixels and a readout circuit, possessing both signal acquisition and readout functions. Compared to infrared unit detectors, it is a completely new type of optoelectronic device. The focal plane characteristics of FLAS detectors provide more test and evaluation parameters. Considering current needs, the importance of the device to the system, and the planning of project implementation, infrared detectors are currently included in the scope of research on optoelectronic device testing technology. Researching and studying the testing technology of infrared FLAS detectors can provide support for building the testing capabilities of optoelectronic devices. However, there are still gaps in the types of test devices, the accuracy of test parameters, and the number of testing institutions. The research direction is mainly focused on infrared detector testing technology. Infrared focal plane arrays are core components of next-generation infrared systems such as infrared staring imaging and imaging spectrometers. Currently, research on infrared focal plane array testing methods and technologies is relatively limited; therefore, in-depth research on infrared focal plane array testing methods and technologies is needed.

[0034] As mentioned above, how to accurately and comprehensively test the parameters of infrared focal plane detectors has become an important research problem.

[0035] Based on the above description, such as Figure 1As shown, the infrared focal plane detector test system 100 proposed in this embodiment includes: an infrared focal plane detector 110 under test, an interface board 120, and a data acquisition module 130; the interface board 120 is electrically connected to the infrared focal plane detector 110 under test and the data acquisition module 130 respectively.

[0036] The interface board 120 is configured as follows:

[0037] The first output signal of the infrared focal plane detector 110 under test at a high temperature blackbody temperature is acquired, the first output signal is preprocessed to obtain a first acquisition signal, and the first acquisition signal is sent to the data acquisition module 130.

[0038] The second output signal of the infrared focal plane detector 110 under test at the low temperature blackbody temperature is acquired, the second output signal is preprocessed to obtain the second acquisition signal, and the second acquisition signal is sent to the data acquisition module 130.

[0039] The data acquisition module 130 is configured as follows:

[0040] A first average voltage value is determined from the first acquired signal, and a second average voltage value is determined from the second acquired signal;

[0041] The first response voltage, the first noise voltage, and the first radiated power at the high-temperature blackbody temperature are determined based on the first average voltage value, and the second response voltage, the second noise voltage, and the second radiated power at the low-temperature blackbody temperature are determined based on the second average voltage value.

[0042] A first response rate is determined at a high-temperature blackbody temperature based on the first response voltage and the first radiated power; a second response rate is determined at a low-temperature blackbody temperature based on the second response voltage and the second radiated power; and a response rate from the high-temperature blackbody temperature to the low-temperature blackbody temperature is determined based on the first response rate and the second response rate.

[0043] The first pixel equivalent temperature difference at the high temperature blackbody temperature is determined based on the first response voltage and the first noise voltage. The second pixel equivalent temperature difference at the high temperature blackbody temperature is determined based on the second response voltage and the second noise voltage. The pixel equivalent temperature difference from the high temperature blackbody temperature to the low temperature blackbody temperature is determined based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference.

[0044] An invalid pixel matrix is ​​determined from the first acquisition signal and the second acquisition signal, and an invalid pixel rate is determined based on the invalid pixel matrix;

[0045] The response rate, the equivalent temperature difference of the pixel, and the invalid pixel rate are used as the test parameters of the infrared focal plane detector 110 under test.

[0046] In practice, the infrared focal plane detector 110 under test is electrically connected to the interface board 120, and the interface board 120 is electrically connected to the data acquisition module 130.

[0047] Interface board 120 is used to acquire the output signal of the infrared focal plane detector 110 under test and preprocess the output signal to obtain the acquired signal. Data acquisition module 130 is used to analyze the acquired signal to obtain the test parameters of the infrared focal plane detector 110 under test.

[0048] The first output signal is F frames of continuous output data from the infrared focal plane detector 110 under test at a high-temperature blackbody temperature. The second output signal is F frames of continuous output data from the infrared focal plane detector 110 under test at a low-temperature blackbody temperature. Preferably, F ≥ 100.

[0049] The data acquisition module 130 obtains a first response voltage and a first radiated power based on the first average voltage value; based on the first response voltage and the first radiated power, it obtains a first responsivity of the infrared focal plane detector 110 under test at a high-temperature blackbody temperature. The data acquisition module 130 obtains a second response voltage and a second radiated power based on the second average voltage value; based on the second response voltage and the second radiated power, it obtains a second responsivity of the infrared focal plane detector 110 under test at a low-temperature blackbody temperature. Based on the first and second responsivity, it determines the responsivity from the high-temperature blackbody temperature to the low-temperature blackbody temperature.

[0050] The data acquisition module 130 obtains a first response voltage and a first noise voltage based on the first average voltage value; based on the first response voltage and the first noise voltage, it obtains the first pixel equivalent temperature difference of the infrared focal plane detector 110 under test at a high-temperature blackbody temperature. The data acquisition module 130 obtains a second response voltage and a second noise voltage based on the second average voltage value; based on the second response voltage and the second noise voltage, it obtains the second pixel equivalent temperature difference of the infrared focal plane detector 110 under test at a low-temperature blackbody temperature. Based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference, it determines the pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature.

[0051] The data acquisition module 130 determines the invalid pixel rate based on the invalid pixel matrix. Simultaneously, the valid pixel matrix can also be determined based on the invalid pixel matrix. After excluding invalid pixels, the average noise voltage, average responsivity, average NETD, and responsivity non-uniformity (UR) of the infrared focal plane detector 110 under test are calculated.

[0052] This disclosure takes the DLD650 uncooled infrared focal plane detector as a starting point, studies the photoelectric parameter testing and verification methods and technologies of related infrared focal plane detectors, addresses the urgent need for comprehensive performance evaluation of infrared focal plane detectors in equipment engineering applications, and promotes the overall performance development and quality control of devices.

[0053] Through the above embodiments, the interface board can acquire the output signals of the infrared focal plane detector under test at different blackbody temperatures, and send the preprocessed output signals to the data acquisition module. The data acquisition module then analyzes the acquired signals at different blackbody temperatures to obtain the test parameters of the infrared focal plane detector under test. By analyzing the acquired signals at different blackbody temperatures, the data acquisition module can obtain the responsivity, pixel equivalent temperature difference, and invalid pixel rate as test parameters of the infrared focal plane detector under test, thereby enabling accurate and comprehensive testing of the detector's parameters.

[0054] In some embodiments, such as Figure 2 As shown, the interface board 120 includes: an input module 121 and an output module 122;

[0055] The input module 121 is electrically connected to the infrared focal plane detector 110 under test and is configured to provide an input signal to the infrared focal plane detector 110 under test.

[0056] The output module 122 is electrically connected to the data acquisition module 130 and is configured to acquire the output signal generated by the infrared focal plane detector 110 under the input signal, preprocess the output signal to obtain the acquisition signal, and send the acquisition signal to the data acquisition module 130.

[0057] In practice, input module 121 provides input signals to the infrared focal plane detector 110 under test. Output module 122 preprocesses the output signals of the infrared focal plane detector 110 under test.

[0058] By preprocessing the output signal of the infrared focal plane detector 110 under test, the data acquisition module 130 can perform a comprehensive and accurate test on the infrared focal plane detector 110 under test based on the acquired signal.

[0059] In some embodiments, such as Figure 3 As shown, the input module 121 includes: a power input module 1211, a bias input module 1212, and a timing input module 1213;

[0060] The power input module 1211 is configured to provide analog voltage or analog current to the infrared focal plane detector 110 under test;

[0061] The bias input module 1212 is configured to provide an analog bias voltage to the infrared focal plane detector 110 under test;

[0062] The timing input module 1213 is configured to provide timing signals to the infrared focal plane detector 110 under test; wherein the timing signals include: a master clock signal, an integration signal, a frame reset signal, and a serial control signal.

[0063] In specific implementation, the power input module 1211 (clock drive module) is used to provide analog voltage or analog current to the infrared focal plane detector 110 under test. The bias input module 1212 (DC offset module) is used to provide analog bias voltage to the infrared focal plane detector 110 under test. The timing input module 1213 is used to provide timing signals to the infrared focal plane detector 110 under test.

[0064] The timing signals include: master clock signal (MCLK signal), integration signal (INT signal), frame reset signal (RST signal), and serial control signal.

[0065] The MCLK signal is the master clock signal of the infrared focal plane detector 110 under test, and it is a continuous signal with a duty cycle of 50%.

[0066] The RST signal is the frame reset signal, which appears as a high-level signal once per frame, and the high-level time is one MCLK cycle. The rising and falling edges of the RST signal are aligned with the rising edge of the MCLK signal.

[0067] The INT signal is the integration signal, T3 is the line time, and the high-level time T2 is the integration time. T1 + 1TMCLK + T5 + T2 = T3. The integration time can only be changed by altering the position of the rising edge of T2. The rising and falling edges of the INT signal are aligned with the rising edge of the MCLK signal. After the integration signal in the last line (520 lines) of each frame, the T10 part of the INT signal is a periodically repeated INT signal, T10 = k × T3 (k is an integer less than or equal to 20); T9 is low, 0 ≤ T9 ≤ T3; the T8 part is high, T8 = 16TMCLK. The durations of T9 and T10 can be adjusted, and preprocessing or rounding to integer frames can be performed within the T9 and T10 periods. The detector's driving array size is 660 × 520, and the effective array size is 640 × 512. The first 10 columns and the last 10 columns, the first 4 rows and the last 4 rows are redundant data and must be discarded. The circuit uses a line-by-line readout mode. While the Nth line is being integrated, the data of the (N-1)th line is read out. The analog signal voltage of the effective pixel is output 18.5 TMCLKs after the falling edge of the INT signal. The rise and fall times of each timing signal are less than or equal to 10ns.

[0068] The SERDAT signal is a serial control signal. It operates at TTL level, with a high level similar to DVD-D and a period similar to the MCLK signal. Its value must change on the rising edge of the MCLK signal. The SERDAT signal is 77 bits long. It is effective only when the first bit (START) is high and the 8-bit Passwd encoding is 10101100. The rising edge of the START signal must be at least one TMCLK signal length from the falling edge of the RST signal, and the last bit of the SERDAT signal must be at least one TMCLK signal length from the rising edge of the next RST signal. In other words, the SERDAT and RST signals cannot overlap. The SERDAT signal can be sent once per frame or only once. After the SERDAT signal is sent, it takes effect until the falling edge of the next RST signal.

[0069] Through the above scheme, the power input module 1211 can provide analog voltage or analog current to the infrared focal plane detector 110 under test, the bias input module 1212 can provide analog bias voltage to the infrared focal plane detector 110 under test, and the timing input module 1213 can provide timing signals to the infrared focal plane detector 110 under test. Thus, by utilizing the power input module 1211, the bias input module 1212, and the timing input module 1213, input signals can be provided to the infrared focal plane detector 110 under test.

[0070] In some embodiments, the data acquisition module 130 includes: a storage module 131;

[0071] The storage module 131 is configured to convert the first acquired signal into a first average voltage value for storage, convert the second acquired signal into a second average voltage value for storage, and convert the first acquired signal and the second acquired signal into an invalid pixel matrix for storage.

[0072] In specific implementation, the first acquisition signal is converted into the first average voltage value and stored in the storage module 131, and the second acquisition signal is converted into the second average voltage value and stored in the storage module 131. When the data acquisition module 130 calculates the response rate from the high temperature blackbody temperature to the low temperature blackbody temperature and the pixel equivalent temperature difference from the high temperature blackbody temperature to the low temperature blackbody temperature, the first average voltage value and the second average voltage value are retrieved.

[0073] The first and second acquisition signals are converted into an invalid pixel matrix and stored in the storage module 131. When the data acquisition module 130 calculates the invalid pixel rate, the invalid pixel matrix is ​​retrieved.

[0074] By converting the first and second acquisition signals and storing them in the storage module 131, the data acquisition module 130 can easily retrieve the converted data from the storage module 131 and analyze the converted data to obtain the test parameters of the infrared focal plane detector 110 under test. This enables the infrared focal plane detector 110 under test to be tested and analyzed quickly and accurately.

[0075] Through the above embodiments, the interface board can acquire the output signals of the infrared focal plane detector under test at different blackbody temperatures, and send the preprocessed output signals to the data acquisition module. The data acquisition module then analyzes the acquired signals at different blackbody temperatures to obtain the test parameters of the infrared focal plane detector under test. By analyzing the acquired signals at different blackbody temperatures, the data acquisition module can obtain the responsivity, pixel equivalent temperature difference, and invalid pixel rate as test parameters of the infrared focal plane detector under test, thereby enabling accurate and comprehensive testing of the detector's parameters.

[0076] It should be noted that the embodiments of this disclosure can also be further described in the following ways:

[0077] This disclosure focuses on the DLD650 uncooled infrared focal plane detector as the research object, and conducts research on photoelectric parameter testing and verification technology. This disclosure focuses on analyzing and studying the testing methods for important parameters of the infrared focal plane detector, including responsivity, signal voltage, fixed image noise, noise equivalent temperature difference, dead pixels, and invalid pixel rate.

[0078] Figure 4 This is a schematic diagram of the infrared focal plane detector according to an embodiment of this disclosure. Figure 4 As shown, the structure of infrared focal plane detector includes: infrared focal plane detector under test, clock driver (power input module), DC bias (bias input module), infrared light source, vector generator, system controller, sensor monitor, preamplifier, analog-to-digital conversion timing and control, AD module, multiplexer and data acquisition module.

[0079] First, according to Figure 2 First, connect the test system and preset the system. Second, adjust the test system and apply the specified voltage to the device under test to bring the device into normal operating condition. Third, utilize... Figure 2 The test system shown continuously acquires F frames of data (F≥100 is recommended) at both low-temperature blackbody temperature T0 and high-temperature blackbody temperature T, respectively, to obtain two sets of two-dimensional arrays of F frames. Finally, after obtaining the two sets of two-dimensional arrays of F frames, each photoelectric parameter can be calculated according to the definition.

[0080] An infrared focal plane detector test platform was built, with a focus on the design and fabrication of the interface board. The interface board serves as the interaction module between the infrared detector component and other hardware devices. It connects the infrared focal plane detector under test (UDT) to other devices, provides power, bias, and timing control for the UDT, and also performs preprocessing of the UDT's output signal. Finally, it sends the preprocessed output signal to the acquisition module for data acquisition. Its main interface modules are as follows:

[0081] (1) Power input module

[0082] The power input module primarily provides analog voltage or analog current.

[0083] (2) Bias input module

[0084] The bias input module can be connected to the PXIe-4143 board via an interface, providing the required bias voltage which is then connected to the pins of the infrared focal plane detector under test via a busbar.

[0085] (3) Timing input module

[0086] The timing input module consists of one HDRA-EC68 interface and two timing output BNCs. Its main functions are to provide the required timing signals to the infrared focal plane detector under test, and to provide the CLK_IN and Trigger signals to the acquisition card. Note: In the interface board design, the PXIe-6544 board has 32 channels, of which 9 channels can provide the Trigger signal to the acquisition card, and 10 channels can provide the CLK_IN signal.

[0087] (4) Detector Vo output module

[0088] The output module introduces the analog output Vo of the infrared focal plane detector under test into the adapter board circuit, and finally outputs it to the data acquisition card. The output module mainly consists of 4 BNC circuits and corresponding circuits.

[0089] The timing vector design for testing an infrared focal plane detector was carried out, focusing on the research and design of the testing timing vector for the TTL pulse signals required for detector operation. These mainly include the detector's master clock signal, integration signal, and frame reset signal. The TTL pulse signals required for the operation of the infrared focal plane detector under test mainly include the MCLK signal, INT signal, and RST signal. The MCLK signal is the master clock signal of the infrared focal plane detector 110 under test, a continuous signal with a 50% duty cycle. The RST signal is the frame reset signal, appearing as a high-level signal once per frame, with a high-level duration of one MCLK cycle. The rising and falling edges of the RST signal are aligned with the rising edge of the MCLK signal. The INT signal is the integration signal; T3 is the line time, and the high-level duration T2 is the integration time. T1 + 1TMCLK + T5 + T2 = T3. The integration time can only be changed by altering the position of the rising edge of T2. The rising and falling edges of the INT signal are aligned with the rising edge of the MCLK signal. After the last line (520 lines) of the integrated signal in each frame, the T10 part of the INT signal is a periodically repeating INT signal, T10 = k × T3 (k is an integer less than or equal to 20); T9 is low level, 0 ≤ T9 ≤ T3; the T8 part is high level, T8 = 16 TMCLK. The duration of T9 and T10 can be adjusted to perform preprocessing or round up frames within the T9 and T10 periods. The detector's driving array size is 660 × 520, and the effective array size is 640 × 512. The first 10 columns and the last 10 columns, the first 4 rows and the last 4 rows are redundant data and need to be discarded. The circuit adopts a line-by-line readout mode. While the Nth line is being integrated, the data of the (N-1)th line is read out. The analog signal voltage of the effective pixel is output 18.5 TMCLKs after the falling edge of the INT signal. The rise time and fall time of each timing signal are less than or equal to 10 ns.

[0090] Research was conducted on serial control technology for infrared focal plane array detectors, focusing on the study and design of the test timing vector for the serial control signals required for detector operation. Multiple functions of the detector can be implemented through serial control signals, with the SERDAT signal being the primary serial control signal. The SERDAT signal is TTL level, with a high level similar to DVDD and a period similar to the MCLK signal; its value must change on the rising edge of the MCLK signal. The SERDAT signal is 77 bits long. It is effective only when the first bit (START) is high and the 8-bit Passwd encoding is 10101100. The rising edge of the START signal must be at least one TMCLK signal length from the falling edge of the RST signal, and the last bit of the SERDAT signal must be at least one TMCLK signal length from the rising edge of the next RST signal. That is, the SERDAT signal and the RST signal cannot overlap. The SERDAT signal can be sent once per frame or only once. After the SERDAT signal is sent, it takes effect until the falling edge of the next RST signal.

[0091] Research was conducted on the testing techniques for the electrical parameters and response characteristics of infrared focal plane array detectors, mainly including parameters such as responsivity, signal voltage, fixed image noise, noise equivalent temperature difference, dead pixels, and invalid pixel rate. The entire calculation process is as follows:

[0092] Step 1: Read the collected high and low temperature data and convert it into an average voltage value, then read it into memory;

[0093] Step 2: Calculate the response voltage using the read high and low temperature data;

[0094] Step 3: Read in the high temperature and low temperature data again, and combine the data with the response voltage to calculate the noise voltage.

[0095] Step 4: Calculate the radiative power of the blackbody at high and low temperatures;

[0096] Step 5: Combine the response voltage calculated in Step 2 with the radiant power in Step 4 to calculate the response rate from high temperature to low temperature.

[0097] Step 6: Using the pixel response voltage and pixel noise obtained in Step 2 and Step 3, calculate the pixel equivalent temperature difference (NETD) from high temperature to low temperature.

[0098] Step 7: According to the eight types selected in the "Parameter Calculation Enable" column, calculate the level blind element, noise blind element, response rate blind element, NETD blind element, etc. respectively, and store them in the response blind element type matrix;

[0099] Step 8: Based on the four types of blind cell matrices obtained in Step 7, calculate and count the matrix of invalid pixels and record their corresponding coordinates (for subsequent blind cell replacement) and calculate the invalid pixel rate.

[0100] Step 9: For the invalid cell matrix calculated in Step 8, directly calculate the valid cell matrix;

[0101] Step 10: After obtaining the data of invalid and valid pixels, after excluding invalid pixels, calculate the average noise voltage, average response rate, average NETD, and response rate non-uniformity (UR).

[0102] Step 11, calculate the fixed noise of the graph (FPN);

[0103] Step 12: Based on the above data, generate the image with blind pixels, noise histogram, response rate histogram, and level histogram, and store them as "BadPixel.png", "NoiseHist.png", "ResponsivityHist.png", and "VoltageHist.png" respectively.

[0104] In the above embodiments, an infrared focal plane detector test platform was built, and an interface board was designed and fabricated. The timing vector design for the infrared focal plane detector test was carried out, and the test timing vectors for the TTL pulse signals required for the operation of the infrared focal plane detector were studied and designed, mainly including the master clock signal, integration signal, and frame reset signal of the infrared focal plane detector. Research was conducted on the serial control technology of the infrared focal plane detector, and the test timing vectors for the serial control signals required for the detector's operation were studied and designed. Research was also conducted on the testing technology for the electrical parameters and response characteristics of the infrared focal plane detector, mainly including parameters such as responsivity, signal voltage, fixed image noise, noise equivalent temperature difference, dead pixels, and invalid pixel rate.

[0105] The embodiments disclosed herein are not limited to infrared focal plane detector testing systems. Other testing systems can also be used to implement the above testing methods, and the above testing methods can be applied to other similar chips.

[0106] Through the above embodiments, an infrared focal plane detector test platform was built, with a focus on the design and fabrication of the interface board. The interface board serves as the interaction module between the infrared focal plane detector under test (IRD) and other hardware devices. It connects the IRD to other devices, provides power, bias, and timing control for the IRD, and also performs preprocessing of the IRD's output signal. Finally, it sends the preprocessed output signal to the acquisition module for data acquisition.

[0107] For ease of description, the above system is described by dividing it into various modules based on their functions. Of course, in implementing this disclosure, the functions of each module can be implemented in one or more software and / or hardware.

[0108] The system described above is used to implement the testing method of the corresponding infrared focal plane detector in any of the following embodiments, and has the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0109] Based on the same inventive concept, corresponding to any of the above embodiments, this disclosure also provides a testing method for an infrared focal plane detector.

[0110] refer to Figure 5 The test method for the infrared focal plane detector, wherein the method is applied to the test system for the infrared focal plane detector described in the above embodiment, the system comprising: an infrared focal plane detector under test, an interface board, and a data acquisition module; the method comprising:

[0111] Step 201: The interface board acquires the output signal of the infrared focal plane detector under test, preprocesses the output signal to obtain the acquisition signal, and sends the acquisition signal to the data acquisition module.

[0112] Step 202: The data acquisition module determines the test parameters of the infrared focal plane detector under test based on the acquired signal.

[0113] In practice, the interface board acquires the output signal of the infrared focal plane detector under test and preprocesses the output signal to obtain the acquired signal. The data acquisition module analyzes the acquired signal to obtain the test parameters of the infrared focal plane detector under test.

[0114] Through the above embodiments, the interface board can acquire the output signal of the infrared focal plane detector under test, and send the preprocessed output signal to the data acquisition module so that the data acquisition module can analyze the acquired signal to obtain the test parameters of the infrared focal plane detector under test.

[0115] In some embodiments, the interface board includes: an input module and an output module; step 201 includes:

[0116] Step 2011: The input module provides an input signal to the infrared focal plane detector under test.

[0117] Step 2012: The output module acquires the output signal generated by the infrared focal plane detector under test under the input signal, preprocesses the output signal to obtain the acquisition signal, and sends the acquisition signal to the data acquisition module.

[0118] In practice, the input module provides the input signal to the infrared focal plane detector under test. The output module preprocesses the output signal from the infrared focal plane detector under test.

[0119] The above scheme preprocesses the output signal of the infrared focal plane detector under test to obtain the acquisition signal, enabling the data acquisition module to perform a comprehensive and accurate test on the infrared focal plane detector under test based on the acquisition signal.

[0120] In some embodiments, the input module includes: a power input module, a bias input module, and a timing input module; step 2011 includes:

[0121] Step 2011A: The power input module provides analog voltage or analog current to the infrared focal plane detector under test;

[0122] Step 2011B: The bias input module provides an analog bias voltage to the infrared focal plane detector under test;

[0123] Step 2011C: The timing input module provides timing signals to the infrared focal plane detector under test; wherein, the timing signals include: a master clock signal, an integration signal, and a frame reset signal.

[0124] In practical implementation, the power input module (clock drive module) provides analog voltage or analog current to the infrared focal plane detector under test. The bias input module (DC offset module) provides analog bias voltage to the infrared focal plane detector under test. The timing input module provides timing signals to the infrared focal plane detector under test.

[0125] The timing signals include: master clock signal (MCLK signal), integration signal (INT signal), frame reset signal (RST signal), and serial control signal.

[0126] The MCLK signal is the master clock signal of the infrared focal plane detector under test, and it is a continuous signal with a duty cycle of 50%.

[0127] The RST signal is the frame reset signal, which appears as a high-level signal once per frame, and the high-level time is one MCLK cycle. The rising and falling edges of the RST signal are aligned with the rising edge of the MCLK signal.

[0128] The INT signal is the integration signal, T3 is the line time, and the high-level time T2 is the integration time. T1 + 1TMCLK + T5 + T2 = T3. The integration time can only be changed by altering the position of the rising edge of T2. The rising and falling edges of the INT signal are aligned with the rising edge of the MCLK signal. After the integration signal in the last line (520 lines) of each frame, the T10 part of the INT signal is a periodically repeated INT signal, T10 = k × T3 (k is an integer less than or equal to 20); T9 is low, 0 ≤ T9 ≤ T3; the T8 part is high, T8 = 16TMCLK. The durations of T9 and T10 can be adjusted, and preprocessing or rounding to integer frames can be performed within the T9 and T10 periods. The detector's driving array size is 660 × 520, and the effective array size is 640 × 512. The first 10 columns and the last 10 columns, the first 4 rows and the last 4 rows are redundant data and must be discarded. The circuit uses a line-by-line readout mode. While the Nth line is being integrated, the data of the (N-1)th line is read out. The analog signal voltage of the effective pixel is output 18.5 TMCLKs after the falling edge of the INT signal. The rise and fall times of each timing signal are less than or equal to 10ns.

[0129] The SERDAT signal is a serial control signal. It operates at TTL level, with a high level similar to DVD-D and a period similar to the MCLK signal. Its value must change on the rising edge of the MCLK signal. The SERDAT signal is 77 bits long. It is effective only when the first bit (START) is high and the 8-bit Passwd encoding is 10101100. The rising edge of the START signal must be at least one TMCLK signal length from the falling edge of the RST signal, and the last bit of the SERDAT signal must be at least one TMCLK signal length from the rising edge of the next RST signal. In other words, the SERDAT and RST signals cannot overlap. The SERDAT signal can be sent once per frame or only once. After the SERDAT signal is sent, it takes effect until the falling edge of the next RST signal.

[0130] Through the above scheme, the power input module can provide analog voltage or analog current to the infrared focal plane detector under test, the bias input module can provide analog bias voltage to the infrared focal plane detector under test, and the timing input module can provide timing signals to the infrared focal plane detector under test. Thus, by utilizing the power input module, bias input module, and timing input module, input signals can be provided to the infrared focal plane detector under test.

[0131] In some embodiments, step 201 includes:

[0132] Step 201A: The interface board acquires the first output signal of the infrared focal plane detector under test at a high-temperature blackbody temperature, preprocesses the first output signal to obtain a first acquisition signal, and sends the first acquisition signal to the data acquisition module.

[0133] Step 201B: The interface board acquires the second output signal of the infrared focal plane detector under test at a low-temperature blackbody temperature, preprocesses the second output signal to obtain a second acquisition signal, and sends the second acquisition signal to the data acquisition module.

[0134] In specific implementation, the first output signal is the continuous F-frame output data of the infrared focal plane detector under test at a high-temperature blackbody temperature. The second output signal is the continuous F-frame output data of the infrared focal plane detector under test at a low-temperature blackbody temperature. Preferably, F ≥ 100.

[0135] Through the above scheme, the interface board can acquire the output signals of the infrared focal plane detector under test at different blackbody temperatures, and send the preprocessed output signals to the data acquisition module so that the data acquisition module can analyze the acquired signals at different blackbody temperatures to obtain the test parameters of the infrared focal plane detector under test.

[0136] In some embodiments, step 202 includes:

[0137] Step 2021: The data acquisition module converts the first acquired signal into a first average voltage value and the second acquired signal into a second average voltage value.

[0138] Step 2022: The data acquisition module determines the first response voltage, the first noise voltage, and the first radiated power at the high-temperature blackbody temperature based on the first average voltage value, and determines the second response voltage, the second noise voltage, and the second radiated power at the low-temperature blackbody temperature based on the second average voltage value.

[0139] Step 2023: The data acquisition module determines a first response rate at a high-temperature blackbody temperature based on the first response voltage and the first radiation power, determines a second response rate at a low-temperature blackbody temperature based on the second response voltage and the second radiation power, and determines a response rate from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first response rate and the second response rate.

[0140] Step 2024: The data acquisition module determines the first pixel equivalent temperature difference at the high-temperature blackbody temperature based on the first response voltage and the first noise voltage, determines the second pixel equivalent temperature difference at the high-temperature blackbody temperature based on the second response voltage and the second noise voltage, and determines the pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference.

[0141] Step 2025: The data acquisition module determines the invalid pixel matrix and determines the invalid pixel rate based on the invalid pixel matrix.

[0142] Step 2026: The data acquisition module uses the response rate, the equivalent temperature difference of the pixel, and the invalid pixel rate as test parameters for the infrared focal plane detector under test.

[0143] In specific implementation, the data acquisition module obtains the first response voltage and the first radiated power based on the average value of the first voltage; based on the first response voltage and the first radiated power, it obtains the first responsivity of the infrared focal plane detector under test at the high-temperature blackbody temperature. The data acquisition module obtains the second response voltage and the second radiated power based on the average value of the second voltage; based on the second response voltage and the second radiated power, it obtains the second responsivity of the infrared focal plane detector under test at the low-temperature blackbody temperature. The responsivity from the high-temperature blackbody temperature to the low-temperature blackbody temperature is determined based on the first and second responsivity.

[0144] The data acquisition module obtains a first response voltage and a first noise voltage based on the average value of a first voltage; based on the first response voltage and the first noise voltage, it obtains the first pixel equivalent temperature difference of the infrared focal plane detector under test at a high-temperature blackbody temperature. The data acquisition module obtains a second response voltage and a second noise voltage based on the average value of a second voltage; based on the second response voltage and the second noise voltage, it obtains the second pixel equivalent temperature difference of the infrared focal plane detector under test at a low-temperature blackbody temperature. Based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference, the pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature is determined.

[0145] The data acquisition module determines the invalid pixel rate based on the invalid pixel matrix. Simultaneously, the valid pixel matrix can also be determined based on the invalid pixel matrix. After excluding invalid pixels, the average noise voltage, average responsivity, average NETD, and responsivity non-uniformity (UR) of the infrared focal plane detector under test are calculated.

[0146] Through the above scheme, the data acquisition module analyzes the acquired signals at different blackbody temperatures and obtains the response rate, pixel equivalent temperature difference, and invalid pixel rate as test parameters of the infrared focal plane detector under test, thereby enabling accurate and comprehensive testing of the parameters of the infrared focal plane detector under test.

[0147] It should be noted that the method of this disclosure embodiment can be executed by a single device, such as a computer or server. The method of this embodiment can also be applied to a distributed scenario, where multiple devices cooperate to complete the task. In such a distributed scenario, one of these devices may execute only one or more steps of the method of this disclosure embodiment, and the multiple devices will interact with each other to complete the method described.

[0148] It should be noted that the above description describes some embodiments of this disclosure. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in a different order than that shown in the above embodiments and still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require a specific or sequential order to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0149] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this disclosure also provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the program to implement the testing method of the infrared focal plane detector described in any of the above embodiments.

[0150] Figure 6This embodiment illustrates a more specific hardware structure of an electronic device, which may include a processor 1010, a memory 1020, an input / output interface 1030, a communication interface 1040, and a bus 1050. The processor 1010, memory 1020, input / output interface 1030, and communication interface 1040 are interconnected internally via the bus 1050.

[0151] The processor 1010 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this specification.

[0152] The memory 1020 can be implemented in the form of ROM (Read Only Memory), RAM (Random Access Memory), static storage device, dynamic storage device, etc. The memory 1020 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program code is stored in the memory 1020 and is called and executed by the processor 1010.

[0153] The input / output interface 1030 is used to connect input / output modules to realize information input and output. Input / output modules can be configured as components within the device (not shown in the figure) or externally connected to the device to provide corresponding functions. Input devices may include keyboards, mice, touchscreens, microphones, various sensors, etc., while output devices may include displays, speakers, vibrators, indicator lights, etc.

[0154] The communication interface 1040 is used to connect a communication module (not shown in the figure) to enable communication between this device and other devices. The communication module can communicate via wired means (such as USB (Universal Serial Bus), network cable, etc.) or wireless means (such as mobile network, WIFI (Wireless Fidelity), Bluetooth, etc.).

[0155] Bus 1050 includes a pathway for transmitting information between various components of the device, such as processor 1010, memory 1020, input / output interface 1030, and communication interface 1040.

[0156] It should be noted that although the above-described device only shows the processor 1010, memory 1020, input / output interface 1030, communication interface 1040, and bus 1050, in specific implementations, the device may also include other components necessary for normal operation. Furthermore, those skilled in the art will understand that the above-described device may only include the components necessary for implementing the embodiments of this specification, and not necessarily all the components shown in the figures.

[0157] The electronic devices described above are used to implement the testing methods for the corresponding infrared focal plane detectors in any of the foregoing embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0158] Based on the same inventive concept, corresponding to the methods of any of the above embodiments, this disclosure also provides a non-transitory computer-readable storage medium storing computer instructions for causing the computer to execute the test method of the infrared focal plane detector as described in any of the above embodiments.

[0159] The computer-readable medium of this embodiment includes permanent and non-permanent, removable and non-removable media, and information storage can be implemented by any method or technology. Information can be computer-readable instructions, data structures, program modules, or other data. Examples of computer storage media include, but are not limited to, phase-change memory (PRAM), static random access memory (SRAM), dynamic random access memory (DRAM), other types of random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technologies, CD-ROM, digital versatile optical disc (DVD) or other optical storage, magnetic tape, magnetic magnetic disk storage or other magnetic storage devices, or any other non-transfer medium that can be used to store information accessible by a computing device.

[0160] The computer instructions stored in the storage medium of the above embodiments are used to cause the computer to execute the test method of the infrared focal plane detector as described in any of the above embodiments, and have the beneficial effects of the corresponding method embodiments, which will not be repeated here.

[0161] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this disclosure is limited to these examples; within the framework of this disclosure, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this disclosure as described above, which are not provided in detail for the sake of brevity.

[0162] Additionally, to simplify the description and discussion, and to avoid obscuring the embodiments of this disclosure, the well-known power / ground connections to the integrated circuit (IC) chip and other components may or may not be shown in the provided drawings. Furthermore, the apparatus may be shown in block diagram form to avoid obscuring the embodiments of this disclosure, and this also takes into account the fact that the details of implementation of these block diagram apparatuses are highly dependent on the platform on which the embodiments of this disclosure will be implemented (i.e., these details should be fully understood by those skilled in the art). While specific details (e.g., circuits) have been set forth to describe exemplary embodiments of this disclosure, it will be apparent to those skilled in the art that the embodiments of this disclosure may be implemented without these specific details or with variations thereof. Therefore, these descriptions should be considered illustrative rather than restrictive.

[0163] Although this disclosure has been described in conjunction with specific embodiments thereof, many substitutions, modifications, and variations of these embodiments will be apparent to those skilled in the art from the foregoing description. For example, other memory architectures (e.g., dynamic RAM (DRAM)) may be used with the embodiments discussed.

[0164] This disclosure is intended to cover all such substitutions, modifications, and variations that fall within the broad scope of this disclosure. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the protection scope of this disclosure.

Claims

1. A testing system for an infrared focal plane detector, characterized in that, The system includes: an infrared focal plane detector under test, an interface board, and a data acquisition module; the interface board is electrically connected to the infrared focal plane detector under test and the data acquisition module, respectively. The interface board is configured as follows: The first output signal of the infrared focal plane detector under test at a high-temperature blackbody temperature is acquired, the first output signal is preprocessed to obtain a first acquisition signal, and the first acquisition signal is sent to the data acquisition module. The second output signal of the infrared focal plane detector under test at a low-temperature blackbody temperature is acquired, the second output signal is preprocessed to obtain a second acquisition signal, and the second acquisition signal is sent to the data acquisition module. The data acquisition module is configured as follows: A first average voltage value is determined from the first acquired signal, and a second average voltage value is determined from the second acquired signal; The first response voltage, the first noise voltage, and the first radiated power at the high-temperature blackbody temperature are determined based on the first average voltage value, and the second response voltage, the second noise voltage, and the second radiated power at the low-temperature blackbody temperature are determined based on the second average voltage value. A first response rate is determined at a high-temperature blackbody temperature based on the first response voltage and the first radiated power; a second response rate is determined at a low-temperature blackbody temperature based on the second response voltage and the second radiated power; and a response rate from the high-temperature blackbody temperature to the low-temperature blackbody temperature is determined based on the first response rate and the second response rate. The first pixel equivalent temperature difference at the high temperature blackbody temperature is determined based on the first response voltage and the first noise voltage. The second pixel equivalent temperature difference at the high temperature blackbody temperature is determined based on the second response voltage and the second noise voltage. The pixel equivalent temperature difference from the high temperature blackbody temperature to the low temperature blackbody temperature is determined based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference. An invalid pixel matrix is ​​determined from the first acquisition signal and the second acquisition signal, and an invalid pixel rate is determined based on the invalid pixel matrix; The response rate, the equivalent temperature difference of the pixel, and the invalid pixel rate are used as the test parameters of the infrared focal plane detector under test. The interface board includes: an input module and an output module; The input module is electrically connected to the infrared focal plane detector under test and is configured to provide an input signal to the infrared focal plane detector under test. The output module is electrically connected to the data acquisition module and is configured to acquire the output signal generated by the infrared focal plane detector under the input signal, preprocess the output signal to obtain the acquisition signal, and send the acquisition signal to the data acquisition module. The input module includes: a power input module, a bias input module, and a timing input module; The power input module is configured to provide analog voltage or analog current to the infrared focal plane detector under test; The bias input module is configured to provide an analog bias voltage to the infrared focal plane detector under test; The timing input module is configured to provide timing signals to the infrared focal plane detector under test; wherein the timing signals include: a master clock signal, an integration signal, a frame reset signal, and a serial control signal.

2. The system according to claim 1, characterized in that, The data acquisition module includes: a storage module; The storage module is configured to convert the first acquired signal into a first average voltage value for storage, convert the second acquired signal into a second average voltage value for storage, and convert the first acquired signal and the second acquired signal into an invalid pixel matrix for storage.

3. A test method for an infrared focal plane detector, characterized in that, The method is applied to the test system of the infrared focal plane detector according to claims 1 to 2, the system comprising: an infrared focal plane detector under test, an interface board, and a data acquisition module; the method comprises: The interface board acquires the output signal of the infrared focal plane detector under test, preprocesses the output signal to obtain the acquisition signal, and sends the acquisition signal to the data acquisition module; The data acquisition module determines the test parameters of the infrared focal plane detector under test based on the acquired signals.

4. The method according to claim 3, characterized in that, The interface board includes: an input module and an output module; The interface board acquires the output signal of the infrared focal plane detector under test, preprocesses the output signal to obtain a collected signal, and sends the collected signal to the data acquisition module, including: The input module provides an input signal to the infrared focal plane detector under test. The output module acquires the output signal generated by the infrared focal plane detector under test under the input signal, preprocesses the output signal to obtain the acquisition signal, and sends the acquisition signal to the data acquisition module.

5. The method according to claim 3, characterized in that, The interface board acquires the output signal of the infrared focal plane detector under test, preprocesses the output signal to obtain a collected signal, and sends the collected signal to the data acquisition module, including: The interface board acquires the first output signal of the infrared focal plane detector under test at a high-temperature blackbody temperature, preprocesses the first output signal to obtain a first acquisition signal, and sends the first acquisition signal to the data acquisition module. The interface board acquires the second output signal of the infrared focal plane detector under test at a low-temperature blackbody temperature, preprocesses the second output signal to obtain a second acquisition signal, and sends the second acquisition signal to the data acquisition module.

6. The method according to claim 5, characterized in that, The data acquisition module determines the test parameters of the infrared focal plane detector under test based on the acquired signal, including: The data acquisition module converts the first acquired signal into a first average voltage value and the second acquired signal into a second average voltage value. The data acquisition module determines the first response voltage, the first noise voltage, and the first radiated power at a high-temperature blackbody temperature based on the first average voltage value, and determines the second response voltage, the second noise voltage, and the second radiated power at a low-temperature blackbody temperature based on the second average voltage value. The data acquisition module determines a first response rate at a high-temperature blackbody temperature based on the first response voltage and the first radiant power, determines a second response rate at a low-temperature blackbody temperature based on the second response voltage and the second radiant power, and determines a response rate from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first response rate and the second response rate. The data acquisition module determines the first pixel equivalent temperature difference at the high-temperature blackbody temperature based on the first response voltage and the first noise voltage, determines the second pixel equivalent temperature difference at the high-temperature blackbody temperature based on the second response voltage and the second noise voltage, and determines the pixel equivalent temperature difference from the high-temperature blackbody temperature to the low-temperature blackbody temperature based on the first pixel equivalent temperature difference and the second pixel equivalent temperature difference. The data acquisition module determines the invalid pixel matrix and determines the invalid pixel rate based on the invalid pixel matrix. The data acquisition module uses the response rate, the equivalent temperature difference of the pixel, and the invalid pixel rate as test parameters for the infrared focal plane detector under test.

7. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and running on the processor, wherein the processor, when executing the program, implements the method as described in any one of claims 3 to 6.

8. A non-transitory computer-readable storage medium, characterized in that, The non-transitory computer-readable storage medium stores computer instructions for causing a computer to perform the method according to any one of claims 3 to 6.

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