Chip appearance detection equipment

Abstract

The invention discloses chip appearance detection equipment which comprises a marble carrying table, a chip carrier supply device, a chip visual detection device, a chip carrier output line and a chip carrier turnover device, wherein the chip carrier supply device, the chip visual detection device, the chip carrier output line and the chip carrier turnover device are arranged on the marble carrying table; the chip carrier supply device comprises a chip carrier bearing mechanism; the chip visual detection device comprises a detection bearing mechanism and an image acquisition mechanism, the detection bearing mechanism comprises a horizontal carrying table and a reset detection part, the image acquisition mechanism comprises an image carrying seat and a position degree monitoring sensor, and the image carrying seat is provided with a macro camera shooting end; the macro camera shooting end is connected with a correction module which is in communication connection with the location degree monitoring sensor; the chip carrier turnover device comprises a turnover mechanical arm. The micro-chip appearance micro-distance detection requirement is met, the detection image quality is ensured through correction of the relative position degree of the machine position and the platform, defect detection and recognition are accurate and comprehensive, the detection precision maintaining period is long, and frequent manual calibration is not needed. And automatic operation is efficient and smooth.

Description

Technical Field

[0001] The invention relates to chip appearance detection equipment, belonging to the technical field of chip surface detection. Background Art

[0002] After the chip is formed, it needs to undergo surface inspection, that is, appearance inspection, to check whether there are scratches, dents, contamination, oxidation and other problems on the surface. Generally, visual inspection equipment is required for automated inspection.

[0003] Chip appearance inspection includes six-sided inspection, single-sided inspection, etc. There is currently a demand for single-sided inspection of smaller chips. The top side length of the chip is less than 2.5mm. When performing surface inspection, macro distance is required. Therefore, the accuracy requirements for visual inspection equipment are very high, and the inspection efficiency also needs to be guaranteed.

[0004] In general chip inspection equipment or inspection lines, a fixed image acquisition mechanism is used, that is, the chip is carried by a rotating tray, a conveyor line, a switching position stage, etc. through the image acquisition mechanism for visual inspection. This motion layout method can greatly ensure the inspection efficiency and meet the needs of high-speed inspection. However, due to the small size of the chip, the macro focusing method causes the position change during operation, which will cause focusing failure, and cannot meet the batch inspection needs of specific chips.

[0005] Currently, the equipment that can realize macro detection generally adopts a combination of a carrier platform and a fixed visual mechanism. That is, high-precision debugging is performed before detection, and the position of the carrier platform is accurately adjusted to meet the needs of precise focus image acquisition. However, there will be cumulative relative position errors as the detection runs, resulting in manual intervention and adjustment after a period of operation. The effective operation cycle is short, and frequent accuracy adjustments are labor-intensive and time-consuming.

[0006] In addition, traditional appearance inspection equipment is designed as a single-station visual inspection system, which cannot meet the needs of batch automated inspection. At the same time, its versatility is poor, making it difficult to meet the needs of model changes, and the equipment utilization rate is low. Summary of the invention

[0007] The purpose of the present invention is to solve the deficiencies of the above-mentioned prior art, and to propose a chip appearance inspection device to address the problem that traditional visual inspection equipment has low image acquisition accuracy and cannot realize automated operation during the process of macro inspection of smaller chips.

[0008] In order to achieve the above object, the technical solution adopted by the present invention is: A chip appearance inspection device, comprising a marble carrier, a chip carrier supply device arranged on the marble carrier, a chip visual inspection device, a chip carrier output line, and a chip carrier turnover device; The chip carrier supply device comprises a chip carrier supporting mechanism for supporting a chip carrier, and the chip carrier is provided with a plurality of chips distributed in a matrix; The chip visual inspection device comprises a detection support mechanism and an image acquisition mechanism, wherein the detection support mechanism comprises a horizontal stage for carrying the chip carrier and a reset detection unit for reset detection of the horizontal stage, wherein the horizontal stage has X-direction displacement and Y-direction displacement, and the image acquisition mechanism comprises an image carrier with X-direction displacement, Y-direction displacement and Z-direction displacement, and a position monitoring sensor for monitoring the position of the image carrier, wherein a macro camera end with a focus adjustment stroke facing the horizontal stage is provided on the image carrier, and the macro camera end is connected to a correction module for correcting the position of the image carrier according to the collected image and is communicatively connected to the position monitoring sensor; The chip carrier turnover device includes a turnover robot arm for performing turnover of the chip carrier between the chip carrier supporting mechanism and the horizontal stage, and between the horizontal stage and the chip carrier output line.

[0009] Preferably, the chip carrier supply device comprises a carrier compartment supply mechanism, a chip carrier transfer mechanism, and a chip carrier detection mechanism; The carrier cabin supply mechanism includes a carrier cabin with a plurality of chip carriers arranged vertically at intervals, and a lifting and switching part for carrying the carrier cabin for lifting and displacement and switching the material alignment with the chip carrier transfer mechanism; The chip carrier transfer mechanism includes a carrier clamp with linear displacement and lifting displacement, the chip carrier supporting mechanism is arranged on the displacement path of the carrier clamp, and the chip carrier supporting mechanism is provided with a centering positioning part for centering the chip carrier; The chip carrier detection mechanism is arranged on the top of the chip carrier supporting mechanism, and the chip carrier detection mechanism at least includes a missing detection unit for detecting missing chips on the chip carrier and a code scanning detection unit for scanning codes on the chip carrier.

[0010] Preferably, the chip carrier supporting mechanism comprises two supporting rails arranged at intervals, a gap is formed between the two supporting rails for the carrier clamp and the turnover robot arm to pass through, the center positioning portion comprises two positioning correction ends with relative linear displacement respectively arranged on the two supporting rails, and the chip carrier is provided with notches corresponding to the positioning correction ends one by one; The carrier compartment supply mechanism has a discharge end opposite to the carrier clamping claw.

[0011] Preferably, the chip carrier detection mechanism comprises a picking vision guide for being communicatively connected with the carrier gripper; The chip carrier supporting mechanism is provided with a detection station and a material unloading and docking station which are arranged at intervals, and the detection station and the material unloading and docking station are respectively provided with the center positioning part.

[0012] Preferably, the detection support mechanism includes a displacement driving source transmission-connected to the horizontal carrier, the displacement driving source is provided with a switching alignment adjustment module for controlling the X-axis displacement step amount and the Y-axis displacement step amount of the horizontal carrier, and the correction module is communicatively connected to the switching alignment adjustment module.

[0013] Preferably, the detection support mechanism includes a radio frequency protection sensor for detecting the port position of the macro camera end.

[0014] Preferably, the chip carrier output line comprises an output line body, and a material picking and placing mechanism disposed on an output path of the output line body, and the material picking and placing mechanism comprises a supporting loading platform with lifting and lowering displacement.

[0015] Preferably, the output line body comprises two conveying tracks with relative gap adjustment displacement.

[0016] Preferably, the turnover robot arm is provided with a picking mechanism, the picking mechanism comprises two oppositely arranged material picking tooth ends, the material picking tooth end comprises two parallel and spaced tooth ends; The chip carrier supporting mechanism and the horizontal platform are respectively provided with avoidance parts for avoiding the inserting teeth.

[0017] Preferably, a plurality of positioning bodies are provided at the bottom of the chip carrier, and a relative limiting portion corresponding to the positioning bodies is provided on the horizontal carrier.

[0018] The beneficial effects of the present invention are mainly reflected in: 1. It meets the needs of micro-chip appearance macro inspection, ensures the quality of inspection image through relative position correction between machine position and platform, accurately and comprehensively identifies defects, maintains inspection accuracy for a long period of time, and does not require frequent manual calibration.

[0019] 2. It can realize the automatic operation of the chip carrier, and use the supporting rail to realize the alternating and continuous operation of the carrier gripper and the turnover robot arm, and the automatic operation is efficient and smooth.

[0020] 3. The chip carrier is transferred by visually guided clamping and the material picking slot end support method, which significantly eliminates the vibration during the turnover process, reduces the offset of the mounted chips, and makes the back-end visual inspection accurate, efficient and stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings: Figure 1 It is a structural schematic diagram of the chip appearance detection equipment of the present invention.

[0022] Figure 2 It is a schematic structural diagram of the chip appearance inspection device of the present invention from another viewing angle.

[0023] Figure 3 It is a structural schematic diagram of the chip visual inspection device in the present invention.

[0024] Figure 4 It is a schematic diagram of the structure of the chip visual inspection device in the present invention from another viewing angle.

[0025] Figure 5 It is a schematic structural diagram of the chip carrier supply device in the present invention.

[0026] Figure 6 It is a schematic structural diagram of the chip carrier supply device in the present invention from another perspective.

[0027] Figure 7 It is a side structural schematic diagram of the chip carrier supply device in the present invention.

[0028] Figure 8 It is a structural schematic diagram of the vehicle cabin in the present invention.

[0029] Fig. 9 It is a schematic diagram of the structure of the chip carrier turnover device in the present invention.

[0030] Fig.10 It is a schematic diagram of the structure of the chip carrier output line in the present invention. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant inventions, rather than to limit the inventions. It should also be noted that, for ease of description, only the parts related to the relevant inventions are shown in the accompanying drawings. It should be noted that, in the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other.

[0033] The present invention provides a chip appearance detection device, such as Figures 1 to 10 As shown, it includes a marble carrier 1, a chip carrier supply device 2 arranged on the marble carrier 1, a chip visual inspection device 3, a chip carrier output line 4, and a chip carrier turnover device 5.

[0034] The chip carrier supply device 2 includes a chip carrier supporting mechanism 21 for supporting a chip carrier 200 , on which a plurality of chips distributed in a matrix are disposed.

[0035] The chip carrier 200 is explained. The chip involved in this case is a microchip. The side length specification of the chip is 0.5mm~2.5mm. Therefore, it is difficult to realize the transportation and detection of a single chip. Therefore, the design of the chip carrier 200 is adopted. After the chip production is completed, it is mounted on the chip carrier 200 in a matrix manner. The chip carrier 200 meets the recycling requirements. It can cooperate with the chip visual inspection device 3 at the back end to facilitate batch detection.

[0036] The chip visual inspection device 3 includes a detection supporting mechanism 31 and an image acquisition mechanism 32. The detection supporting mechanism 31 includes a horizontal stage 311 for carrying a chip carrier and a reset detection unit 312 for horizontal stage reset detection. The horizontal stage 311 has X-direction displacement and Y-direction displacement. The image acquisition mechanism 32 includes an image carrier 321 with X-direction displacement, Y-direction displacement and Z-direction displacement, and a position monitoring sensor 322 for image carrier position monitoring. The image carrier 321 is provided with a macro camera end 3210 with a focus adjustment stroke facing the horizontal stage 311. The macro camera end 3210 is connected to a correction module that is communicated with the position monitoring sensor and is used to correct the image carrier position according to the collected image.

[0037] The chip carrier turnover device 5 includes a turnover robot arm 50 for performing chip carrier turnover between the chip carrier supporting mechanism 21 and the horizontal stage 311 , and between the horizontal stage 311 and the chip carrier output line 4 .

[0038] Specific implementation process and principle description: The chip carrier supply device 2 supplies the chip carrier 200 , and the chip carrier 200 is supported and fed by the chip carrier supporting mechanism 21 . The turnover robot 50 picks up the chip carrier 200 and transfers it to the horizontal stage 311 . At this time, the chip appearance inspection operation after the chip carrier 200 is loaded is performed.

[0039] First, the reset detection unit 312 ensures the initial position of the horizontal stage 311, thereby realizing the relative position verification between the zero point position and the image carrier 321, and the macro camera end 3210 performs image acquisition of the alignment chip, and then the correction module generates correction data to confirm the correction of the X-direction displacement, Y-direction displacement and Z-direction displacement of the image carrier 321.

[0040] After the correction is completed, the X-axis displacement and Y-axis displacement of the horizontal stage 311 are linked to perform detection switching drive for the matrix-distributed chips and the macro camera end 3210 to align one by one, meeting the needs of efficient appearance inspection of batch chips on the same platform.

[0041] After all the chips on the chip carrier 200 have been inspected, the chip carrier 200 is picked up by the turnover robot 50 and transferred to the chip carrier output line 4 for automatic output.

[0042] It should be noted that the marble carrier 1 has better stability. The chip carrier supply device 2, chip visual inspection device 3, chip carrier output line 4, and chip carrier turnover device 5 are mounted on the reference plane of the marble carrier 1 to meet the relative position accuracy between the devices.

[0043] The chip visual inspection device 3 realizes the integrated mounting of the inspection support mechanism 31 and the image acquisition mechanism 32 through the base frame 30, so that the relative accuracy of the inspection support mechanism 31 and the image acquisition mechanism 32 is relatively high.

[0044] When performing reset detection of the horizontal stage 311, the reset detection unit 312 uses a right-angle detection sensor to meet its vertical position accuracy, and its own X-direction displacement and Y-direction displacement ensure its horizontality. The position monitoring sensor 322 uses photoelectric and other methods that can meet the precise distance detection, and can realize the high-precision position information collection of the image carrier 321. The correction module uses the image data collected by the macro camera end 3210 to realize the deviation calculation, and performs correction drive on the image carrier 321 to ensure the relative position accuracy of the macro camera end 3210 and the chip.

[0045] Since the relative position is ensured, during the detection process, the single image acquisition CT time is ≤2s, and the automatic focus response is efficient, which ensures the quality of the acquired image. It should be noted that the lens magnification of the macro camera end 3210 meets the inspection requirements of 50X~500X. With the equipment in this case, the missed detection rate is almost zero, and the overkill rate is less than 10%. Since the relative position between the macro camera end 3210 and the chip is guaranteed, the equipment detection and recognition accuracy is ≤1μm. The operation is efficient, smooth and stable, and the effective operation cycle is guaranteed, without the need for frequent equipment calibration.

[0046] In a specific embodiment, Figures 5 to 8 As shown, the chip carrier supply device 2 includes a carrier compartment supply mechanism 22 , a chip carrier transfer mechanism 23 , and a chip carrier detection mechanism 24 .

[0047] The carrier cabin supply mechanism 22 includes a carrier cabin 221 having a plurality of chip carriers spaced apart vertically, and a lifting switching portion 222 for lifting and displacing the carrier cabin and switching the material alignment with the chip carrier transfer mechanism.

[0048] The chip carrier transfer mechanism 23 includes a carrier clamp 230 with linear displacement and lifting displacement, and the chip carrier supporting mechanism 21 is arranged on the displacement path of the carrier clamp 230. In addition, a centering portion for centering the chip carrier is provided on the chip carrier supporting mechanism.

[0049] The chip carrier detection mechanism 24 is disposed on the top of the chip carrier supporting mechanism 21 , and the chip carrier detection mechanism 24 at least includes a missing detection unit for detecting missing chips on the chip carrier and a code scanning detection unit for scanning the chip carrier.

[0050] Specific implementation process and principle description: The chip carrier 200 carries a large number of chips, and the general specification is to carry 120 chips. In order to facilitate the correspondence between defects and chip information, the chip carrier 200 filing method is adopted, that is, the chip carrier 200 has an identification code, and the current chip carrier 200 information can be obtained through the identification code. By establishing information construction after scanning the code with the chip carrier 200, the back-end identification items and results can be entered, and defect records can be realized. In addition, the chip carrier has the problem of missing chips. The missing detection unit can realize the summary of the actual number of detected chips, and at the same time, it can realize the missing material position detection. The back-end appearance inspection skips the missing material position, thereby improving the efficiency of appearance inspection.

[0051] During the specific operation, a plurality of chip carriers are loaded and fed through the carrier cabin 221 , and the lifting and lowering switching unit 222 is used to realize lifting and lowering control of the carrier cabin 221 to switch the position of the carrier clamp 230 for feeding, thus meeting the continuous automatic supply requirements.

[0052] After the carrier clamp 230 clamps the chip carrier, it moves to the chip carrier supporting mechanism 21, and the chip carrier thereon is scanned and detected for missing chips by the chip carrier detection mechanism 24. After picking up the chip carrier and placing it on the chip carrier supporting mechanism 21, the carrier clamp 230 is reset to continue picking up materials. After the chip carrier on the chip carrier supporting mechanism 21 is detected, it is picked up by the turnover robot arm 50 and transferred to the chip visual detection device 3.

[0053] In this way, the chip carrier can be operated alternately and the operating efficiency can be significantly improved.

[0054] It should be noted that since the chip carrier carries a large number of microchips, in order to meet the accuracy of missing material identification, a center positioning part design is adopted. That is, when the carrier clamp 230 picks up the chip carrier and transfers it to the chip carrier supporting mechanism 21, the center positioning part adjusts the position of the chip carrier to meet the detection accuracy requirements of the missing detection part.

[0055] In a specific embodiment, the chip carrier supporting mechanism 21 includes two supporting rails 211 spaced apart from each other, and a gap 212 is formed between the two supporting rails 211 for the carrier gripper and the turnover robot arm to pass through.

[0056] The center positioning part includes two positioning correction ends with relative linear displacement which are arranged on two supporting rails, and the chip carrier is provided with notches which correspond to the positioning correction ends one by one.

[0057] The carrier bay supply mechanism 22 has a discharge end opposite to the carrier clamping claws.

[0058] Specific operation process description: The discharging end of the carrier cabin supply mechanism 22 discharges the material, and the carrier clamping claw picks up and retreats after linear displacement relative to the chip carrier. After retreating, the chip carrier is placed on the bridge between the two supporting rails 211 and initially positioned with the positioning correction end. At this time, the two positioning correction ends are relatively displaced to center the chip carrier. The carrier clamping claw drops to avoid, providing space for the robot arm to pass. After the robot arm transfers the chip carrier, the carrier clamping claw continues to operate, and the operation is continuously cyclical. The turnover coordination structure is ingenious, and the operation is reliable and efficient.

[0059] In one embodiment, the chip carrier detection mechanism 24 includes a pick-up vision guide 240 for communicating with the carrier gripper.

[0060] That is, the visual guidance of the carrier gripper is met, so that the position accuracy when picking up the chip carrier is guaranteed, and vibration caused by deviation will not occur, so that the picking and turnover stability is guaranteed.

[0061] In a specific embodiment, the chip carrier supporting mechanism 21 is provided with a detection station and a material unloading and docking station which are spaced apart from each other, and a center positioning portion is provided on the detection station and the material unloading and docking station respectively.

[0062] Specific operating principle and process description: The carrier gripper picks up the chip carrier to the inspection station for centering and inspection. After the inspection is completed, the carrier gripper picks up the chip carrier to the unloading docking station, that is, linear displacement switching is performed on the two supporting rails 211, which can provide material picking space for the robot arm and improve the position accuracy of the docked chip carrier.

[0063] In a specific embodiment, the detection support mechanism 31 includes a displacement driving source 310 that is transmission-connected to a horizontal carrier 311. The displacement driving source is provided with a switching alignment adjustment module for controlling the X-axis displacement step amount and the Y-axis displacement step amount of the horizontal carrier. The correction module is communicatively connected to the switching alignment adjustment module.

[0064] Specific implementation instructions: The chip carrier 200 has chip slots distributed in a matrix, through which chips are loaded. The chip carrier 200 is a customized design, so the relative positions of the chip slots thereon are fixed.

[0065] The displacement drive source 310 performs displacement control of chip slot switching by switching the alignment adjustment module, thereby realizing the switching alignment drive of each chip and the camera end. During the long-term operation of the alignment adjustment module, there will be an accumulated deviation in the driving amount. At this time, the position information is recorded after image acquisition by the correction module. The corresponding mean, threshold and other limits can be set. When the correction is triggered, the step amount is corrected and adjusted according to the position deviation information, thereby ensuring the operating efficiency of appearance inspection and the accuracy of image acquisition.

[0066] In a specific embodiment, the detection support mechanism 31 includes a radio frequency protection sensor 313 for detecting the port position of the macro camera end.

[0067] Specifically, the price of the macro camera end is very expensive, and in order to ensure the magnification and image quality, it needs to have a small relative position with the chip. In order to prevent hard contact with the macro camera end, an RF protection sensor design is adopted to ensure its operational safety and shut down immediately when the protection is triggered.

[0068] In a specific embodiment, the chip carrier output line 4 includes an output line body 41, a material picking and placing mechanism 42 disposed on the output path of the output line body, and the material picking and placing mechanism includes a supporting loading platform 420 with lifting displacement. The output line body includes two conveying tracks with relative gap adjustment displacement.

[0069] Specifically, the turnover robot 50 needs to rotate the chip carrier 200 at three workstations, and the chip carrier 200 is loaded with chips, which need to be horizontal during the transfer process. Therefore, a supporting loading platform 420 is used to carry out the unloading of the turnover robot 50. After it receives the chip carrier 200, it descends so that the chip carrier 200 is supported on the output line body 41 to realize linear output operation. This operation is efficient and smooth, and the control requirements for the robot arm are reduced.

[0070] In a specific embodiment, a picking mechanism 6 is provided on the rotary robot arm 50, and the picking mechanism 6 includes two oppositely arranged material picking tooth ends 60, and the material picking tooth ends 60 include two parallel and spaced tooth ends 61; the chip carrier supporting mechanism and the horizontal carrier are respectively provided with avoidance parts for avoiding the tooth ends.

[0071] Specific implementation process and principle description: There are densely distributed microchips on the chip carrier. The current traditional picking methods include clamping, negative pressure and other methods. When picking up the chip carrier, the picking force will act on the chip carrier, which can easily cause vibration and other conditions, causing the chip on it to bounce, etc., which will cause changes in the chip position and affect the appearance inspection.

[0072] Generally, for single linear travel docking, such as the carrier jaws 230, the relative position of the docking can be ensured by visual guidance, which can greatly eliminate vibration.

[0073] However, the turnover robot 50 has displacement in three-dimensional space, and a small position deviation can easily cause docking vibration. To address this problem, a material picking tooth end 60 is designed, which supports the bottom wall of the chip carrier through two teeth 61. In this way, only the horizontal accuracy needs to be met to meet the stability requirements of transfer docking, which greatly reduces the risk of offset during chip transfer.

[0074] In addition, a rotating axis position of the turnover robot 50 can satisfy the switching position of the two material picking tooth ends 60, that is, the chip carrier can be cached and the switching position can be transferred. In this way, the operating gaps of each workstation can be used for flexible picking and turnover of the carrier, eliminating waiting time and significantly improving turnover efficiency.

[0075] In a specific embodiment, a plurality of positioning bodies are disposed at the bottom of the chip carrier, and relative limiting parts corresponding to the positioning bodies are disposed on the horizontal stage 311. In this way, the relative position accuracy and mounting stability of the chip carrier after mounting are met.

[0076] From the above description, it can be found that it meets the needs of micro-chip appearance macro inspection, ensures the quality of the inspection image through the relative position correction between the machine position and the platform, accurately and comprehensively identifies defects, maintains the inspection accuracy for a long period of time, and does not require frequent manual calibration. It can realize the automatic operation of the chip carrier, and use the supporting rail to realize the alternating and continuous operation of the carrier clamp and the turnover robot arm, and the automatic operation is efficient and smooth. The chip carrier is transferred by visually guided clamping and the material picking slot end support method, which significantly eliminates the vibration during the turnover process and reduces the offset phenomenon of the mounted chip, making the back-end visual inspection accurate, efficient and stable.

[0077] The term "comprise" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that includes a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus / device.

[0078] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. Chip appearance inspection equipment, characterized by: It includes a marble carrier, a chip carrier supply device arranged on the marble carrier, a chip visual inspection device, a chip carrier output line, and a chip carrier turnover device; The chip carrier supply device comprises a chip carrier supporting mechanism for supporting a chip carrier, and the chip carrier is provided with a plurality of chips distributed in a matrix; The chip visual inspection device comprises a detection support mechanism and an image acquisition mechanism, wherein the detection support mechanism comprises a horizontal stage for carrying the chip carrier and a reset detection unit for reset detection of the horizontal stage, wherein the horizontal stage has X-direction displacement and Y-direction displacement, and the image acquisition mechanism comprises an image carrier with X-direction displacement, Y-direction displacement and Z-direction displacement, and a position monitoring sensor for monitoring the position of the image carrier, wherein a macro camera end with a focus adjustment stroke facing the horizontal stage is provided on the image carrier, and the macro camera end is connected to a correction module which is communicatively connected to the position monitoring sensor and is used for correcting the position of the image carrier according to the collected image; The chip carrier turnover device includes a turnover robot arm for performing turnover of the chip carrier between the chip carrier supporting mechanism and the horizontal stage, and between the horizontal stage and the chip carrier output line.

2. The chip appearance inspection device according to claim 1, characterized in that: The chip carrier supply device includes a carrier compartment supply mechanism, a chip carrier transfer mechanism, and a chip carrier detection mechanism; The carrier cabin supply mechanism includes a carrier cabin with a plurality of chip carriers arranged vertically at intervals, and a lifting and switching part for carrying the carrier cabin for lifting and displacement and switching the material alignment with the chip carrier transfer mechanism; The chip carrier transfer mechanism includes a carrier clamp with linear displacement and lifting displacement, the chip carrier supporting mechanism is arranged on the displacement path of the carrier clamp, and the chip carrier supporting mechanism is provided with a centering positioning part for centering the chip carrier; The chip carrier detection mechanism is arranged on the top of the chip carrier supporting mechanism, and the chip carrier detection mechanism at least includes a missing detection unit for detecting missing chips on the chip carrier and a code scanning detection unit for scanning codes on the chip carrier.

3. The chip appearance inspection device according to claim 2, characterized in that: The chip carrier supporting mechanism comprises two supporting rails arranged at intervals, a gap is formed between the two supporting rails for the carrier clamp and the turnover robot arm to pass through, the center positioning portion comprises two positioning correction ends with relative linear displacement respectively arranged on the two supporting rails, and the chip carrier is provided with notches corresponding to the positioning correction ends one by one; The carrier compartment supply mechanism has a discharge end opposite to the carrier clamping claw.

4. The chip appearance inspection device according to claim 2, characterized in that: The chip carrier detection mechanism includes a picking vision guide for communicating with the carrier gripper; The chip carrier supporting mechanism is provided with a detection station and a material unloading and docking station which are arranged at intervals, and the detection station and the material unloading and docking station are respectively provided with the center positioning part.

5. The chip appearance inspection device according to claim 1, characterized in that: The detection support mechanism includes a displacement driving source that is transmission-connected to the horizontal platform. The displacement driving source is provided with a switching alignment adjustment module for controlling the X-direction displacement step amount and the Y-direction displacement step amount of the horizontal platform. The correction module is communicatively connected to the switching alignment adjustment module.

6. The chip appearance inspection device according to claim 1, characterized in that: The detection support mechanism includes a radio frequency protection sensor for detecting the port position of the macro camera end.

7. The chip appearance inspection device according to claim 1, characterized in that: The chip carrier output line includes an output line body and a material picking and placing mechanism arranged on an output path of the output line body. The material picking and placing mechanism includes a supporting loading platform with lifting and lowering displacement.

8. The chip appearance inspection device according to claim 7, characterized in that: The output line body comprises two conveying tracks with relative gap adjustment displacement.

9. The chip appearance inspection device according to claim 1, characterized in that: The rotary robot arm is provided with a picking mechanism, the picking mechanism comprises two oppositely arranged material picking tooth ends, the material picking tooth end comprises two parallel and spaced tooth ends; The chip carrier supporting mechanism and the horizontal platform are respectively provided with avoidance parts for avoiding the inserting teeth.

10. The chip appearance inspection device according to any one of claims 1 to 9, characterized in that: A plurality of positioning bodies are arranged at the bottom of the chip carrier, and a relative limiting portion corresponding to the positioning bodies is arranged on the horizontal carrier.

Images