Sensor device having at least one sensor element and method for producing a sensor device

Abstract

The invention relates to a sensor device having at least one sensor element, at least one data-conducting interface, at least one power supply device and at least one carrier structure, the invention proposes that the carrier structure forms at least two sections and the sections are flexibly connected to one another. The invention further relates to a method for producing a sensor device according to the invention, in which a carrier structure is provided, the invention proposes that sections are produced from the carrier structure and a flexible connection is formed between the sections.

Description

Technical Field

[0001] The invention relates to a sensor device having at least one sensor element, at least one data-conducting interface, at least one power supply device and at least one carrier structure. Background Art

[0002] A sensor device of the type mentioned can be used, for example, in the field of motor vehicles. For example, such a sensor device can be a device for detecting moisture on a roadway. Such a sensor device is known, for example, from DE 10 2017 102 745 A1. It is proposed that a sensor device having a structure-borne sound sensor be arranged in a wheel arch of a vehicle in order to detect water spray raised by the tires. Summary of the invention

[0003] The invention is based on the object of specifying a sensor device of the type mentioned in the introduction, in which individual adaptability, in particular adaptability to a curved base, can be achieved in a simple manner.

[0004] This object is achieved by means of a sensor device having the features of patent claim 1 .

[0005] Developments and advantageous embodiments are described in the dependent claims.

[0006] In a sensor device having at least one sensor element, at least one data-conducting interface, at least one power supply device and at least one carrier structure, it is essential for the invention that the carrier structure is formed in at least two sections and that the sections are flexibly connected to one another.

[0007] Such a sensor device can be arranged for use in the field of motor vehicles in particular. The sensor element can be a plurality of sensor elements of different types. For example, the sensor element can be a structure-borne sound sensor, a humidity sensor, a light sensor, etc. The sensor device can also have a plurality of sensor elements of different types in particular. In order to supply energy to the sensor element, the sensor device can have, for example, a battery, a terminal to an onboard power supply of the vehicle, an energy collection device, etc. The components of the sensor device are arranged on a carrier structure, such as a circuit carrier. In particular, the circuit carrier can be flexibly formed, for example, in a foil-like manner. In order to ensure the adaptability of the sensor device to the local conditions of the installation area, for example, to the wheel arch of the vehicle, the windshield of the vehicle or other areas, the carrier structure is formed of at least two sections, preferably a plurality of sections. The section can be a substantially planar area for accommodating different components of the sensor device. The sections of the sensor device can be, for example, substantially rectangular or also trapezoidal and arranged longitudinally one after another, so that the sensor device is substantially elongated. A transition area is formed between the sections, and the sections are flexibly connected to each other through the transition area. In the case of a substantially rectangular planar section, the transition area can be formed at the short sides of two adjacent sections. The flexible connection between two adjacent segments is preferably formed by a flexible carrier material, in particular by a carrier structure of the sensor device itself. An articulated connection specially arranged for this purpose can also be provided. By means of the flexible connection of the two segments, the segments are connected to each other in a bendable manner so that the surfaces of the segments can be unfolded together at an angle. In particular, the segments can respectively unfold an imaginary plane, and the planes of the two segments can be arranged in a plane when the sensor device is not bent. The segments can be bent outward from this common plane by the flexible connection. By bending or pivoting the segments of the sensor device relative to each other, a separate adaptation of the sensor device to local conditions, in particular bending, is achieved. With an increase in the number of segments, the bending radius can also be increased, and thus the sensor device can be more flexibly adapted to the curvature of the base. The connection between the two segments can be formed by an exposed carrier structure, of course, the connection can also be preferably thinly coated with a protective material. The protective material can be, for example, a thermosetting plastic. Preferably, the protective coating is formed thinner at the connection area than in the area of ​​the segment occupied by the component. For example, the sensor device can be designed as a device for detecting moisture on the roadway and can therefore be easily adapted to the inside of the wheel arch by bending different sections relative to one another so that the sensor device is adapted to the radius or curvature of the wheel arch.

[0008] In a further development of the invention, the carrier structure is flexibly designed and the flexible connections between the segments are formed by the segments of the carrier structure. The carrier structure can be a flexible circuit carrier. For example, the carrier structure can be implemented in foil-like or similar form. For example, the carrier structure can be an elongated strip of a flexible circuit carrier, from which different, for example rectangular, segments are formed. The carrier structure and the individual segments can also be designed in a circular form. In particular, the segments can be arranged around a centrally arranged segment. Thus, by the flexible design of the carrier structure, flexible connection areas are simultaneously formed between the segments.

[0009] In one embodiment of the sensor device, the carrier structure is elongated and the flexible connections between the segments are formed by the elongated carrier structure. The carrier structure can be an elongated strip of a flexible circuit carrier. The different rectangular segments can be formed by the strip, which are then arranged one after the other. The flexible connections between adjacently arranged segments can be formed by the narrower regions of the strip-shaped carrier structure, so that a high degree of flexibility is achieved here.

[0010] In one embodiment of the invention, at least one segment has a trapezoidal base surface. The segment surface can have, for example, a rectangular, trapezoidal or similar base surface. Due to the trapezoidal design of the segment surface, the bends, i.e. the connecting areas between the segments, are not aligned parallel to one another, so that individual adaptation to the local conditions at the location of use of the sensor device is achieved.

[0011] In one embodiment of the invention, at least one segment at least partially surrounds at least one other segment. The segments can be formed by the carrier structure so that at least one segment at least partially surrounds the central segment. For example, the carrier structure and the segments can be formed circularly, and the segments can be arranged concentrically around the central segment. A rectangular central segment can also be provided, which is surrounded by the other segments. Areas of the carrier structure are formed between the segments, through which the segments are flexibly connected to each other. The connecting areas between the segments can be formed in particular on the carrier structure with free space that is not occupied by components.

[0012] In one embodiment of the invention, at least one segment has a rounded portion. For example, the segment can have a circular, elliptical or similar shape. The segment can be arranged completely around a central, middle segment, for example in the form of a ring. It can also be provided that the segment is arranged at least partially around a non-central, laterally displaced segment.

[0013] In one embodiment of the invention, the segments are designed to be essentially circular and the segments are arranged essentially concentrically. For example, the central segment can be designed to be circular. The other segments can be arranged at least partially in the form of a ring around the segment. For example, a structure-borne sound sensor can be arranged on the central segment. Evaluation devices, power supplies, etc. can be arranged on other segments. Unoccupied, for example, ring-shaped areas of the carrier structure can be arranged between the segments, through which flexible connecting areas are formed between the likewise ring-shaped segments. The flexible connection of the segments can achieve vibration decoupling of the segments, so that the central segment is not affected by the other segments.

[0014] In one embodiment of the invention, the flexible connection between two adjacent segments is formed by web-like sections of the support structure. Free spaces can be arranged between the webs connecting the segments to one another. The free spaces can be formed by recesses in the support structure. A particularly high flexibility between the segments is achieved by the connection by means of the webs and the free spaces arranged therebetween.

[0015] In a modified form of the present invention, at least two adjacent sections are surrounded by a protective body, and the minimum angle between the two sections is limited by the external shape of the corresponding protective body. At least one section of the sensor device, preferably all sections, can be surrounded by a protective body. For example, the protective body can be a housing. The protective body is preferably a sheath with a protective medium, such as epoxy resin. The epoxy resin or the protective housing can have such a shape that the bending of the two adjacent sections to each other is limited by the shape, that is, the minimum angle between the two sections is preset. Therefore, the two adjacent sections can be bent toward each other until the protective bodies contact each other. In particular, the protective body can have a greater strength or a greater thickness in the middle of the section along the longitudinal extension of the carrier structure than in the transition area to the adjacent section. In the direction of the longitudinal extension from one section end to the next section end, the thickness of the protective body can first increase relative to the carrier structure, then have a constant area, and then decrease again. The protective body can be arranged on both sides of the carrier structure, that is, above and below the carrier structure. Here, in a side view, different slopes of the protective body can be provided on both sides of the carrier structure. By shaping the protective bodies of two adjacent segments in an ascending or descending manner, the two segments can be bent toward each other so that, for example, the entire sensor device describes a radius, wherein the minimum angle between the two segments is spatially limited by the design of the protective bodies. The connecting regions between the segments can be surrounded by a protective medium that is different from the segments themselves.

[0016] In one embodiment of the invention, the protective body has side regions facing the connecting region between two segments, and the side regions each open an angle with the carrier structure. In particular, the protective body of the segment can have a central region arranged essentially parallel to the carrier structure. The protective body can have a maximum thickness in said region. The side regions descending towards the carrier structure can be arranged on both sides of said central region. An imaginary plane opened by the side regions opens an angle with the carrier structure. The minimum angle between two adjacent segments is preset by the angle between the side regions and the carrier structure.

[0017] In one embodiment of the invention, the first section has the sensor element and the second section has the power supply. A modular structure of the sensor device is achieved by arranging the different components of the sensor device on different sections. For example, a fixed section for the power supply, for example a battery or the like, can be provided, which can be combined with different sections with different sensor elements. Thus, cost-effective production of the sensor device and cost-effective adaptation to different requirements are achieved.

[0018] In one embodiment of the invention, the further segments have data-conducting interfaces and / or at least one further segment has an evaluation device. The data-conducting interface can be, for example, a plug for connecting to a wired data line of the vehicle, a radio transmitter, such as a Bluetooth transmitter, etc. By arranging the corresponding components on different segments, a modular adaptation of the sensor device to the corresponding requirements is achieved. For example, a prefabricated segment with a data-conducting interface, an evaluation device and a power supply can be used in combination with different sensor elements. The evaluation device can be, for example, a microcontroller or a similar computing device.

[0019] In one embodiment of the invention, the minimum angle between two adjacent segments is limited by the spacing between the segments. For example, the protective body can also be designed in a substantially square manner. In order to achieve a flexible connection of two adjacent segments to each other, the protective bodies of the adjacent segments can have such a large spacing from each other that the mobility of the two segments is not disturbed by the protective bodies. The larger spacing between the protective bodies also enables a longer flexible section of the carrier structure between the segments, so that a higher mobility of the segments relative to each other is ensured. In the case of a sufficiently large spacing, the two segments can be moved almost freely relative to each other.

[0020] In one embodiment of the invention, at least one segment has a mounting area for mounting the sensor device. Preferably, all segments have a mounting area, via which the individual segments and thus the entire sensor device can be mounted at the desired location. For example, the sensor device can be mounted on the inner side of the wheel arch via the mounting area of ​​the segment. For example, the mounting area can be a volume provided for this purpose on one side of the protective housing; that is, a reservoir in which an adhesive can be accommodated. In this way, the individual segments can be glued to the component to be monitored. In addition, projections or recesses can be provided in the protective body, which correspond to corresponding clips and / or locking devices, for example, provided at the mounting location, in order to establish a locking or clip connection.

[0021] In a development of the invention, at least one segment has a rigidly designed region for receiving the component to be welded. To allow the receiving and welding of the component to be welded, the region of at least one segment can be rigidly designed, for example by a perforated plate or the like.

[0022] In one embodiment of the invention, the sensor element is formed by a piezoelectric element. The sensor device can be, for example, a sensor device for detecting structure-borne sound signals. For example, the structure-borne sound signals can be used to detect moisture that has been blown up on the roadway. The piezoelectric element for detecting structure-borne sound signals can be arranged on a section of the sensor device and, for example, be connected by adhesive bonding in contact with the component to be monitored in a manner that conducts the structure-borne sound signals, i.e., in a manner that transmits vibrations.

[0023] In a further development of the invention, the section with the piezoelectric element has a lower mass than the other sections. In order to achieve a vibration transmission that is as direct, undisturbed and unaffected as possible from the object to be monitored to the section with the structure-borne sound sensor, the section has as low a mass as possible. This should also prevent the sensor device from strongly influencing the waves propagating on the component to be monitored.

[0024] In a development of the invention, an acoustic impedance jump is formed between at least two adjacent segments. In order to improve the sensitivity of the sensor device, in particular in order to improve the sensitivity of a segment with a structure-borne sound sensor (i.e. a piezoelectric element), an acoustic impedance jump is established between the segment in which the sensing is performed and the adjacent segment. This can be achieved, for example, by changing the cross section of the segment, i.e., by changing the thickness of the protective body or by changing the size of the segment. At the location where the cross section changes, reflections of the propagating waves occur, so that, for example, vibrations are not transmitted from one segment to the next. An impedance jump can also be caused at the transition from a segment to a connection area. For example, a flexible connection can be formed by a narrower area of ​​the carrier structure, so that a change in cross section is obtained. The higher the acoustic impedance jump, the better the attenuation of the structure-borne sound transmission. As a result, changes in adjacent segments have less influence on the sensor element (i.e., on the signal chain).

[0025] Another aspect of the present invention relates to a method for manufacturing a sensor device, in particular a sensor device according to the present invention, wherein a carrier structure is provided, wherein it is important for the present invention that the segments are manufactured from the carrier structure and a flexible connection is formed between the segments. The carrier structure is preferably a flexible, for example foil-shaped circuit carrier, on which printed conductors or other can be applied or can be applied. The carrier structure is cut so that separate, continuous segments are formed. These segments are flexibly connected to each other, wherein in particular a flexible connection is formed by a flexible carrier structure. The segments can be provided with a protective body, wherein the protective body can be formed by a protective medium. For example, sensor elements, power supply elements, data transmission elements, etc. can now be arranged in the cavity of the protective body. Injection molding can be used for manufacturing. Here, a tool with a switching plug is used for different types of sensors. Therefore, a simple adaptability of the tool to the corresponding sensor device to be produced is achieved. The modular design of the sensor device is achieved by the segment-shaped structure of the sensor device. The individual segments of the sensor device can also be manufactured by applying a protective body to the carrier structure.

[0026] In a development of the method, the flexible connection of the segments is formed by a carrier structure. By forming the carrier structure on a flexible material, the segments can be made partly from the carrier material so that they are connected by sections of the carrier material. Thus, a flexible connection of the segments is provided by the flexible carrier material. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In the following, the present invention is further explained based on the embodiments shown in the accompanying drawings. The schematic diagram shows in detail:

[0028] Figure 1 A sensor device having two sections is shown;

[0029] Figure 2 A sensor device having three sections is shown;

[0030] Figure 3 A sensor device having four sections is shown;

[0031] Figure 4 A sensor device having a communication section is shown;

[0032] Figure 5 The sensor device according to the invention is shown in the wheel arch housing;

[0033] Figure 6 A section with an adhesive reservoir is shown;

[0034] Figure 7 A sensor device is shown with protectively covered connection locations between segments;

[0035] Figure 8 A sensor device having a segment with a rigid region is shown;

[0036] Fig. 9 A sensor device having a trapezoidal section is shown;

[0037] Fig.10 A sensor device having a protective body is shown;

[0038] Fig.11 A sensor device is shown with the segments in a non-bent state;

[0039] Fig.12 Show according to Fig.11 The sensor device in a bent state and

[0040] Fig.13 shows a sensor device having concentrically arranged circular segments;

[0041] Fig.14 A sensor device having a circular segment is shown;

[0042] Fig.15 Show according to Fig.13 A perspective view of a sensor device with a circular segment and

[0043] Fig.16 Shows the installation on the wheel arch shell Fig.13 sensor equipment. DETAILED DESCRIPTION

[0044] exist Figure 1 , a sensor device 1 having a carrier structure 2 and segments 3 and 4 is shown. The carrier structure 2 is formed by a flexible circuit carrier, in particular a foil-shaped circuit carrier. The segments 3 and 4 each have a protective body 5, which can be formed, for example, by a protective medium. The segment 3 has a sensing element, i.e. a sensor element 6. The segment 4 has an evaluation device 7. The segment 4 additionally has an interface 8 in the form of a plug. The interface 8 can be used, for example, for data transmission connections or for power supply. Depending on the requirements, the plug can be made at different angles relative to the carrier structure 2, for example, at an angle of 45°, 60° or 90°. The segments 3 and 4 are connected to each other in a bendable manner via a connection 16, which is formed by the flexible carrier structure 2. The protective body 5 has an inclined surface 25 at the connection 16, which limits the minimum angle between the segments 3 and 4 when bending.

[0045] exist Figure 2, a sensor device 1 having segments 3, 4 and 9 is shown. In this embodiment, segment 3 has a sensor element 6 and an evaluation device (not shown). In this embodiment, segment 4 has a component 10 for voltage protection and voltage transformation, and segment 9 has a plug 8. In this case, segments 4 and 9 can be standard segments that can be used in a variety of sensor devices, while segment 3 having the sensor element 6 is adapted to the respective application.

[0046] exist Figure 3 , a sensor device 1 is shown having four segments 3 , 4 , 9 , 11 . In this embodiment, segment 3 has a sensor element 6 , segment 4 has an evaluation device 7 , segment 9 has a voltage protector or voltage transformer 10 , and segment 11 has an interface 8 .

[0047] exist Figure 4 , a sensor device 1 with a plurality of segments 3 is shown. By increasing the number of segments, the bending radius can also be increased, so that the sensor device 1 can be adapted more flexibly to the curvature of the base. In addition to the number of segments, the spacing between the segments can also be increased.

[0048] exist Figure 5 2 shows a sensor device 1 in a wheel arch 12 of a vehicle. The flexible arrangement of the section 3 makes it possible to adapt the sensor device 1 to the rounding of the wheel arch 12 .

[0049] exist Figure 6 3 shows a section 3 with a reservoir 13 for an adhesive. An adhesive can be accommodated in the reservoir 13 , by means of which the sensor device 1 can be attached to an object 14 to be monitored.

[0050] exist Figure 7 1 shows a sensor device 1 having sections 3 and 4 , wherein a connection region 16 is surrounded by a protective medium 15 . In this case, the connection point 16 can be formed by a section of the flexible carrier structure 2 .

[0051] exist Figure 8 , a sensor device 1 is shown with sections 3 , 4 and 9 . Section 4 has a rigid section 17 , which is formed by a rigid circuit carrier. This allows electronic components 18 to be soldered to terminal blocks 19 .

[0052] exist Fig. 9 2 shows a sensor device 1 having a trapezoidal section 20 . The sensor device 1 is shaped by the trapezoidal section 20 . In particular, the folding axis 21 can extend at an angle α relative to the longitudinal axis 22 of the support structure 2 .

[0053] exist Fig.10 In FIG. 2 , the section 3 is of rectangular design and the fold axis 21 has an angle of 90° with respect to the longitudinal axis 22 .

[0054] exist Fig.11 , a side view of a sensor device 1 with segments 3 is shown. The segments 3 each have a protective body 5 . The side regions of the protective body 5 are designed such that they predetermine a minimum folding angle between two adjacent segments. The connecting region 16 is formed by a flexible section of the carrier structure 2 .

[0055] exist Fig.12 According to Fig.11 The sensor device 1 is in a bent state.

[0056] exist Fig.13 2 shows a sensor device 1 having a circular carrier structure 32 with circular segments 26, 27, 28. Segments 27 and 28 are arranged around a centrally arranged segment 26 and concentrically therewith. Segments 26, 27, 28 are connected to one another via a flexible connection 16. Connection region 16 is formed by a section of carrier structure 2.

[0057] exist Fig.14 2 shows a sensor device 1 with circular segments 26, 27, 28. Segments 27 and 28 partially surround segment 26. Segments 26, 27, 28 are connected to one another via a flexible connection, wherein the connection is formed by web-like segments 29 of a support structure 32 and free spaces 30 arranged therebetween.

[0058] exist Fig.15 According to Fig.13 A perspective view of a sensor device 1 having circular segments 26 , 27 , 28 is shown.

[0059] exist Fig.16 , a cross-sectional view of a sensor device 1 installed in a wheel arch 31 of a vehicle is shown. In this case, the sensor device 1 can be designed to detect liquids that are lifted up by the tires by means of structure-borne sound. In this case, the central section 26 has the structure-borne sound sensor. Due to the flexible connection to the other sections, the section 26 is vibration-damped.

Claims

1. A sensor device comprising at least one sensor element (6), at least one data-conducting interface (8), at least one power supply device and at least one carrier structure, It is characterized in that The carrier structure (2, 32) comprises at least two sections (3, 4, 9, 11, 26-28) and The segments (3, 4, 9, 11, 26-28) are flexibly connected to one another.

2. The sensor device according to claim 1, characterized in that The support structure (2, 32) is flexibly designed, and the flexible connection between the segments (3, 4, 9, 11, 26-28) is formed by sections of the support structure (2, 32).

3. The sensor device according to claim 1 or 2, characterized in that The support structure (2) is of elongated design, and the segments (3, 4, 9, 11) and the flexible connections between the segments (3, 4, 9, 11) are formed by the elongated support structure (2).

4. The sensor device according to claim 3, characterized in that At least one section (3, 4, 9, 11) has a trapezoidal (20) base area.

5. The sensor device according to claim 1 or 2, characterized in that At least one segment (26-28) at least partially surrounds at least one other segment (26-28).

6. The sensor device according to claim 5, characterized in that At least one section (26-28) has a rounded portion.

7. The sensor device according to claim 5 or 6, characterized in that The sections (26-28) are of substantially circular design and are arranged substantially concentrically.

8. The sensor device according to claims 1 to 7, characterized in that The flexible connection between two adjacent sections (26-28) is formed by a web-like section (29) of the support structure (32).

9. The sensor device according to any one of claims 1 to 8, characterized in that At least two adjacent sections (3, 4, 9, 11) are respectively surrounded by a protective body (5), and a minimum angle between the two sections (3, 4, 9, 11) is limited by the outer shape of the corresponding protective body (5).

10. The sensor device according to claim 9, characterized in that The protective body (5) has side regions (25) which face the connecting region (16) between two sections (3, 4, 9, 11) and which each extend at an angle to the support structure (2, 32).

11. The sensor device according to any one of claims 1 to 10, characterized in that The first section (3, 4, 9, 11, 26-28) has a sensor element (6), and the second section (3, 4, 9, 11, 26-28) has a power supply (10).

12. The sensor device according to claim 11, characterized in that At least one further segment (3, 4, 9, 11, 26-28) has a data-conducting interface (8) and / or at least one further segment (3, 4, 9, 11, 26-28) has an evaluation device (7).

13. The sensor device according to any one of claims 1 to 12, characterized in that The minimum angle between two adjacent segments (3, 4, 9, 11, 26-28) is limited by the distance between the segments (3, 4, 9, 11, 26-28).

14. The sensor device according to any one of claims 1 to 13, characterized in that At least one section (3, 4, 9, 11, 26-28) has a mounting area (13) for mounting the sensor device (1).

15. The sensor device according to any one of claims 1 to 14, characterized in that At least one section (3, 4, 9, 11, 26-28) has at least one rigidly designed region (17) for receiving a component (18) to be welded.

16. The sensor device according to any one of claims 1 to 15, characterized in that At least one sensor element (6) is formed by a piezoelectric element.

17. The sensor device according to claim 16, characterized in that The segment (3, 4, 9, 11, 26-28) having the piezoelectric element has a lower mass than the other segments (3, 4, 9, 11, 26-28).

18. The sensor device according to any one of claims 16 or 17, characterized in that An acoustic impedance jump is formed between at least two sections (3, 4, 9, 11, 26-28).

19. A vehicle having a sensor arrangement according to any one of the preceding claims.

20. A method for producing a sensor device, in particular a sensor device according to any one of claims 1 to 18, wherein a carrier structure is provided, It is characterized in that manufacturing segments (3, 4, 9, 11, 26-28) from the carrier structure (2, 32), A flexible connection is formed between the sections (3, 4, 9, 11, 26-28).

21. The method for manufacturing a sensor device according to claim 20, characterized in that The flexible connection of the segments (3, 4, 9, 11, 26-28) is formed by the carrier structure (2, 32).

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