Optical interconnect packaging method

Abstract

The present invention relates to the technical field of optical communication packaging, and more specifically, to an optical interconnect packaging method. The optical fiber waveguide and single-core optical fiber array to be packaged are stacked in a two-dimensional manner, with the end faces of the optical fiber waveguide and the single-core optical fiber array facing the same direction and the port cross sections uniformly facing vertically upward. A common objective lens imaging system can be used to directly locate the port position in the image, avoiding a complex and high-precision side fiber core identification system. Based on the identified two port positions, an optical polymer connecting waveguide between the ports is designed and processed using two-photon 3D printing technology. The entire packaging process is relatively simple to operate, saving costs. Furthermore, the optical interconnect packaging method proposed by the present invention has a wider range of applications.

Description

Technical Field

[0001] The present invention relates to the technical field of optical communication packaging, and more particularly, to an optical interconnect packaging method. Background Art

[0002] Optical interconnect packaging technology is a core supporting technology in the fields of optical communications and optical computing. With the rapid development of high-bandwidth applications such as data centers, 5G networks, and artificial intelligence, its importance is becoming increasingly prominent. Optical interconnect uses optical signals as a transmission medium, and has the advantages of high bandwidth, low latency, and resistance to electromagnetic interference, making it the key to breaking through bottlenecks. However, the implementation of optical interconnect technology requires efficient coupling of photonic chips and optical fibers, high-precision packaging processes, and structural compatibility. Modern optical interconnect packaging technology must not only meet the requirements of miniaturization and low cost, but also take into account high performance and high reliability. It is the fundamental guarantee for the realization of future high-speed optical communications and optical computing.

[0003] In the practical application of multi-core optical fibers, multi-core optical fibers need to be coupled and connected with single-core optical fibers, other multi-core optical fibers or optical device chips. However, the cross-section of a multi-core optical fiber is generally a circularly symmetrical figure, and most of the cores are arranged symmetrically, which makes it difficult to identify a single core. The prior art discloses an innovative technology for connecting a photonic chip with an optical fiber or other optical device. By aligning the optical axis of the device to be packaged and placing it flat on a substrate, a high-precision positioning system is used to perform sub-micron alignment of the photonic chip, optical fiber or module to ensure the positional accuracy of the input and output interfaces. Using two-photon polymerization processing technology, a free-form optical waveguide is processed between the input and output interfaces. The waveguide has an adjustable curvature and cross-section, and can be optimized according to the mode requirements of the interface. Compared with traditional direct coupling or grating coupling methods, this packaging technology is more flexible and can adapt to the non-standard interface coupling requirements between different devices, while avoiding dependence on complex V-grooves or grating structures. In the above scheme, because the optical chip and optical fiber are both placed flat on the substrate, with the fiber core end face oriented parallel to the substrate, the optical measurement system cannot directly image the position of the fiber core. It can only determine the position of the fiber sidewall from above the substrate. Then, a confocal 3D scanning method is used to accurately image the area near the core end face, thereby actually determining the specific position of the core end face. The entire process is relatively complex and easily affected by the quality of the confocal imaging system. In particular, for non-central cores in multi-core optical fibers, the lens refraction effect of the laser on the fiber's cylindrical structure further affects the precise position of the confocal imaging, reducing coupling accuracy and increasing packaging losses. Summary of the Invention

[0004] The purpose of the present invention is to overcome the shortcomings of the prior art in that the optical interconnect packaging process is complicated, and to provide an optical interconnect packaging method that effectively simplifies the packaging steps and is easy to operate.

[0005] In order to solve the above technical problems, the technical solution adopted by the present invention is:

[0006] A method for optical interconnect packaging is provided, comprising the following steps:

[0007] S1. The optical fiber waveguide to be packaged is bonded to the upper or lower surface of the single-core optical fiber array, and the end faces of the optical fiber waveguide and the single-core optical fiber array are oriented in the same direction to form a stacked three-dimensional waveguide array structure; and the three-dimensional waveguide array structure is fixed vertically as a whole, so that the end face is vertically upward;

[0008] S2. Apply curing glue to the connection to align the end face of the optical fiber waveguide with the end face of the single-core optical fiber array. After the structures are aligned, irradiate the curing glue to cure the entire structure to obtain a bonded structure;

[0009] S3. Use a fixture to vertically secure the bonded structure to the displacement platform of the two-photon polymerization system. After dripping photoresist onto the end face of the bonded structure, move it to the center of the imaging system. Using a machine vision algorithm, determine the precise XY coordinates of each port of the optical fiber waveguide and each port of the core of the single-core optical fiber array. Control the Z-axis piezoelectric translation stage to scan the imaging focal plane, determine the optimal imaging heights of the optical fiber waveguide port and the core port of the single-core optical fiber array, and ultimately obtain the three-dimensional coordinates of each port.

[0010] S4. Based on the three-dimensional coordinates obtained in step S2, a polymer connecting waveguide is directly printed on the end face of the glued structure using two-photon 3D printing technology, and the optical fiber waveguide is connected to the single-core optical fiber array through the polymer connecting waveguide;

[0011] S5. After all ports are connected, remove the glued structure and remove excess photoresist. Then, drip curing glue to cover all polymer connection waveguides. Irradiate the curing glue to solidify it.

[0012] The optical interconnect packaging method of the present invention stacks optical fiber waveguides and single-core optical fiber arrays to be packaged in a two-dimensional manner, orients the end faces of the optical fiber waveguides and single-core optical fiber arrays in the same direction, and orients the port cross sections vertically upward. A common objective lens imaging system can be used to directly locate the port positions in an image, avoiding a complex and high-precision side fiber core identification system. Based on the identified two port positions, an optical polymer connecting waveguide between the ports is designed and processed using two-photon 3D printing technology. The entire packaging process is relatively simple to operate, saving costs. Moreover, the optical interconnect packaging method proposed by the present invention has a wider range of applications.

[0013] Furthermore, the optical fiber waveguide includes an array optical waveguide chip, a multi-core optical fiber or a single-core optical fiber.

[0014] Furthermore, in step S1, when the optical fiber waveguide is an arrayed optical fiber waveguide chip, glue is dispensed on the single-core optical fiber array. Two-photon 3D printing technology can be used to print a support structure around the single-core optical fiber array, and the arrayed optical fiber waveguide chip is placed on the support structure. Then, a glue dispensing needle is used to evenly apply ultraviolet curing glue on the seams on both sides to cure and shape the overall structure.

[0015] Furthermore, in step S1, when the optical fiber waveguide is a multi-core optical fiber or a single-core optical fiber, a femtosecond laser processing system is first used to etch a groove on a glass sheet. The multi-core optical fiber or the single-core optical fiber is clamped using a displacement clamping platform and placed in the groove of the glass sheet. The displacement clamping platform is adjusted so that the end face of the multi-core optical fiber or the single-core optical fiber is in the same vertical plane as the side wall of the glass sheet. Then, the glass sheet is placed on the upper surface of the single-core optical fiber array, and the side wall of the glass surface is aligned with the end face of the single-core optical fiber array. Finally, curing glue is applied to the groove and the overall structure is cured. Preferably, the groove structure is a long V-shaped groove.

[0016] Further, in step S4, based on the acquired three-dimensional coordinates (X WG ,Y WG ,Z WG ), the first tapered waveguide is printed at the fiber waveguide port using two-photon 3D printing technology, and then the three-dimensional coordinates (X F ,Y F ,Z F ), a second tapered waveguide is printed at the core port of the single-core optical fiber array using two-photon 3D printing technology, and finally, a connecting waveguide is printed using two-photon 3D printing technology to connect the first tapered waveguide and the second tapered waveguide.

[0017] Furthermore, the lower cross-sectional diameter of the first tapered waveguide matches the mode field size of the optical fiber waveguide, and the mode field of the transmitted light is amplified by the first tapered waveguide; the lower cross-sectional diameter of the second tapered waveguide matches the mode field size of the single-core optical fiber array, and the mode field of the transmitted light is reduced by the second tapered waveguide; the heights of the first tapered waveguide and the second tapered waveguide are equal.

[0018] Furthermore, the connecting waveguide is a U-shaped connecting waveguide with a bending radius of Existing technologies are limited by the size of the femtosecond laser scanning writing field, which limits the mode field transition distance and maximum bending radius of the optical interconnect waveguide, increasing connection losses. In the optical interconnect packaging method proposed in this invention, the port cross-sections are all vertically upward, and the optical interconnect waveguide adopts an inverted U-shaped design, which can extend infinitely upward, increasing design freedom.

[0019] Furthermore, the connecting waveguide is a reflecting prism with a bevel angle of 45° and a cylindrical waveguide; in step S4, a reflecting prism with a bevel angle of 45° is 3D printed at the ports of the first tapered waveguide and the second tapered waveguide, respectively, which can deflect the optical axis 90° parallel to the end face, and the emission directions are aligned with each other; finally, the 3D printed cylindrical waveguides are respectively connected to the two ends of the two reflecting prisms.

[0020] Furthermore, in step S5, a polymer connection waveguide is printed to connect the ports of each group of optical fiber waveguides to be connected to the core ports of the single-core optical fiber array. After all ports are connected, the glued structure is taken out and immersed in a developer to remove excess unexposed photoresist; ultraviolet curing glue is dripped onto the end face of the glued structure, and the amount of glue is controlled to ensure that the glue layer covers all the polymer connection waveguides. The glue is cured by irradiation with an ultraviolet lamp, and is shaped and cured to ensure the stability of the polymer connection waveguide.

[0021] Furthermore, in step S2, the structural alignment includes making the height of the end face of the optical fiber waveguide consistent with the height of the end face of the single-core optical fiber array, so that the two end faces are in the same horizontal plane.

[0022] Compared with the prior art, the present invention has the following beneficial effects:

[0023] 1. The present invention proposes an optical interconnect packaging method, which is based on a three-dimensional stacking structure and uniformly orients the port cross-section vertically upward. The port position can be directly located in the image using an ordinary objective lens imaging system, without the need for a complex high-precision positioning system, thus simplifying the process and reducing costs.

[0024] 2. The present invention proposes an optical interconnect packaging method in which the port cross-sections are all vertically upward, and the polymer connection waveguide adopts an inverted U-shaped design, which can be infinitely extended upward, thereby increasing the design freedom.

[0025] 3. The optical interconnect packaging method proposed in the present invention has a wider range of applications. It can directly identify the image of any optical fiber with any core arrangement or special core mode. Compared with the existing technology that can only identify single-mode single-core optical fibers, it has the characteristics of a wide range of applicable scenarios. In terms of application examples, the patent of this invention can be used to build an automatic coupling packaging system for array optical waveguide chips and single-core optical fiber arrays or single-core optical fiber arrays and multi-core optical fibers. By obtaining the core position of the single-core optical fiber or multi-core optical fiber, the relative position of the cores on both sides is adjusted to achieve core-to-core optical field coupling. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 This is a schematic flow chart of the method in Example 1;

[0027] Figure 2 is a schematic diagram of the glued structure in Example 2;

[0028] Figure 3 Schematic diagram of the polymer-connected waveguide processed in Example 2;

[0029] Figure 4 Schematic diagram of UV curing adhesive packaging in Example 2;

[0030] Figure 5 Schematic diagram of the bonding structure in Example 3;

[0031] Figure 6 Schematic diagram of processing polymer-connected waveguides in Example 3.

[0032] In the accompanying drawings: 1. Single-core optical fiber array; 2. Array optical fiber waveguide chip; 3. Multi-core optical fiber; 4. Glass sheet; 5. Fiber core; 6. Optical waveguide; 7. Groove; 8. Second tapered waveguide; 9. First tapered waveguide; 10. U-shaped connecting waveguide; 11. Objective lens; 12. Cylindrical waveguide. DETAILED DESCRIPTION

[0033] The present invention is further described below with reference to specific embodiments. The accompanying drawings are for illustrative purposes only and are schematic, not actual, representations. They should not be construed as limiting this patent. To better illustrate the embodiments of the present invention, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted from the drawings.

[0034] The same or similar numbers in the drawings of the embodiments of the present invention correspond to the same or similar parts; in the description of the present invention, it should be understood that if the terms "upper", "lower", "left", "right" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as limiting this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0035] Example 1

[0036] This embodiment is a first embodiment of an optical interconnect packaging method, comprising the following steps:

[0037] S1. The optical fiber waveguide to be packaged is fitted to the upper or lower surface of the single-core optical fiber array 1, and the end faces of the optical fiber waveguide and the single-core optical fiber array 1 are oriented in the same direction to form a stacked three-dimensional waveguide array structure; and the three-dimensional waveguide array structure is fixed vertically as a whole, so that the end face is vertically upward;

[0038] S2. Coating a curing glue at the connection point to align the end face of the optical fiber waveguide with the end face of the single-core optical fiber array 1. After the structure is aligned, irradiate the curing glue to cure the entire structure and obtain a bonded structure after curing and shaping;

[0039] S3. Use a fixture to vertically secure the bonded structure to the displacement platform of the two-photon polymerization processing system. After dripping photoresist onto the end face of the bonded structure, move it to the center of the imaging system screen. Based on a machine vision algorithm, determine the precise XY coordinates of each port of the optical fiber waveguide and each port of the core 5 of the single-core optical fiber array 1. Control the Z-axis piezoelectric translation stage to scan the imaging focal plane, determine the optimal imaging heights of the optical fiber waveguide port and the core 5 port of the single-core optical fiber array 1, and ultimately obtain the three-dimensional coordinates of the two ports.

[0040] S4. Based on the three-dimensional coordinates obtained in step S2, a polymer connecting waveguide is printed directly on the end face of the glued structure using two-photon 3D printing technology, and the optical fiber waveguide is connected to the single-core optical fiber array 1 through the polymer connecting waveguide;

[0041] S5. After all ports are connected, remove the glued structure and remove excess photoresist. Then, drip curing glue to cover all polymer connection waveguides. Irradiate the curing glue to solidify it.

[0042] An optical interconnect packaging method of the present invention stacks the optical fiber waveguide and the single-core optical fiber array 1 to be packaged in a two-dimensional manner, directs the end faces of the optical fiber waveguide and the single-core optical fiber array 1 in the same direction, and uniformly directs the port cross sections vertically upward. A common objective lens 11 imaging system can be used to directly locate the port position in the image, avoiding a complex and high-precision side fiber core 5 identification system; based on the identified two port positions, an optical polymer connecting waveguide between the ports is designed and processed using two-photon 3D printing technology; the entire packaging process is relatively simple to operate, saving costs; and the optical interconnect packaging method proposed by the present invention has a wider range of applications.

[0043] Example 2

[0044] This embodiment is a second embodiment of an optical interconnect packaging method. This embodiment is similar to the first embodiment, except that this embodiment takes the packaging of the array optical waveguide 6 chip and the single-core optical fiber array 1 as an example.

[0045] The following steps are involved:

[0046] Step 1: First, align the lower surface of the arrayed optical waveguide chip (6) to be packaged with the upper surface of the single-core optical fiber array (1). Use a dispensing needle to evenly apply UV-curable adhesive to the joints on both sides. Grasp the entire structure with tweezers and press the front end onto a clean glass sheet (4). Ensure that the end faces of the arrayed optical waveguide chip (6) and the single-core optical fiber array (1) face the same direction, align their height, and maintain level alignment. Once aligned, use a UV lamp to cure the adhesive, solidifying the entire structure and creating a three-dimensional stacked adhesive structure.

[0047] Step 2: Use a fixture to vertically secure the bonded structure to the displacement platform of the two-photon polymerization system. After dripping an appropriate amount of photoresist onto the end face of the bonded structure, the bonded structure is moved to the center of the imaging system. Using a machine vision algorithm, the precise XY coordinates of the port of the arrayed optical waveguide chip 6 and the port of the core 5 of the single-core fiber array 1 are determined. The Z-axis piezoelectric translation stage is controlled to scan the imaging focal plane, determining the optimal imaging heights for the port of the arrayed optical waveguide chip 6 and the port of the core 5 of the single-core fiber array 1, ultimately obtaining the three-dimensional coordinates of each port.

[0048] Step 3: Assume that the three-dimensional coordinates of the array optical waveguide 6 chip port are (X WG ,Y WG ,Z W G), the three-dimensional coordinates of the core 5 port of the single-core optical fiber array 1 are (X F ,Y F ,Z F ). Using two-photon 3D printing technology, firstly, the first tapered waveguide 9 is processed based on the port coordinates of the array optical waveguide 6 chip. The lower cross-sectional diameter of the first tapered waveguide 9 matches the mode field size of the chip waveguide (generally 2 to 3um). The mode field of the transmitted light is amplified by 8um through the 60um high first tapered waveguide 9. Then, the second tapered waveguide 8 is processed based on the port coordinates of the core 5 of the single-core optical fiber array 1. The lower cross-sectional diameter of the second tapered waveguide 8 is 12um, which matches the mode field diameter of the single-mode core 5. The mode field of the transmitted light is reduced to 8um through the second tapered waveguide 8. The height of the second tapered waveguide 8 is 60um+(Z F –Z WG ), thereby maintaining a high degree of consistency in the upper cross-sections of the two tapered waveguides. Finally, a U-shaped connecting waveguide 10 is fabricated to connect the two tapered waveguides. The connecting waveguide has a bending radius of . Ultimately, the chip port of the array optical waveguide 6 is coupled to the core 5 port of the single-core optical fiber array 1 via an inverted U-shaped connecting waveguide 10.

[0049] Step 4: Repeat Step 3 for each set of six array waveguide chip ports to be connected to five core ports of single-core fiber array 1. Once all ports are connected, remove the bonded structure and soak it in developer (PGME and IPA) to remove any excess unexposed photoresist. Apply low-refractive-index UV-curable adhesive to the end faces of the bonded structure, controlling the amount of adhesive to ensure coverage of all polymer waveguides. Use a UV lamp to cure the adhesive, allowing it to set and solidify to ensure the stability of the polymer waveguides.

[0050] Example 3

[0051] This embodiment is the third embodiment of an optical interconnect packaging method. This embodiment is similar to the first embodiment, except that this embodiment is a package of a single-core optical fiber array 1 and a multi-core optical fiber 3. Compared with the second embodiment, the multi-core optical fiber 3 itself is in the form of a thin strip and cannot be directly bonded to the optical fiber array plane. An additional glass substrate with a V-groove is required for auxiliary fixation.

[0052] The following steps are involved:

[0053] Step 1: Using a femtosecond laser processing system, a V-shaped strip groove 7 with a depth of 50 μm and an angle of 60° is etched on the surface of a 200 μm thick glass sheet 4.

[0054] Step 2: Use a precision translation stage to clamp the multi-core optical fiber 3. Under microscope observation, place the multi-core optical fiber 3 in the V-groove 7 of the glass sheet 4. Adjust the translation stage so that the end face of the multi-core optical fiber 3 is aligned with the side wall of the glass sheet 4. Use a dispensing needle to evenly apply UV-curable adhesive to the V-groove 7 and cure it under a UV lamp.

[0055] Step 3: Lay the lower surface of the glass sheet 4 against the upper surface of the single-core fiber array 1. Use a dispensing needle to evenly apply UV-curable adhesive to the joints on both sides. Hold the entire structure with tweezers and press the front end against the clean glass sheet 4, aligning the height and level of the end faces of the glass sheet 4 and the single-core fiber array 1. Once aligned, use a UV lamp to cure the adhesive and solidify the structure.

[0056] Step 4: Use a fixture to vertically secure the bonded structure to the displacement platform of the two-photon polymerization system. After dripping an appropriate amount of photoresist onto the end face of the bonded structure, it is then moved to the center of the imaging system. Using a machine vision algorithm, the precise XY coordinates of the single-core fiber array (1 core, 5 ports) and the multi-core fiber (3 cores, 5 ports) are determined. The Z-axis piezoelectric stage is controlled to scan the imaging focal plane, determining the optimal imaging height of each port, ultimately obtaining their respective 3D coordinates.

[0057] Step 5: Assume that the three-dimensional coordinates of the port 5 of the core 1 of the single-core fiber array are (X FA ,Y FA ,ZFA ), the three-dimensional coordinates of the core 5 port of the multi-core optical fiber 3 are (X MCF ,Y MCF ,Z MCF ). Using two-photon 3D printing technology, firstly, the first tapered waveguide 9 is processed based on the coordinates of the core 5 port of the single-core optical fiber array 1. The lower cross-sectional diameter of the first tapered waveguide 9 is 12um to match the mode field diameter of the single-mode optical fiber core 5. The mode field of the transmitted light is reduced to 8um through the 60um high first tapered waveguide 9. Then, the second tapered waveguide 8 is processed based on the coordinates of the core 5 port of the multi-core optical fiber 3. The lower cross-sectional diameter of the second tapered waveguide 8 is also 12um. The mode field of the transmitted light is reduced to 8um through the second tapered waveguide 8. The height of the second tapered waveguide 8 is 60um+(Z MCF -Z FA ), ensuring that the upper cross-sections of the two tapered waveguides are highly consistent. A reflecting prism with a 45° bevel angle is fabricated at the ends of each tapered waveguide, bending the optical axis 90° parallel to the end face and aligning the emission directions. Finally, a cylindrical waveguide 12 with an 8 μm diameter is fabricated to connect the first and second tapered waveguides 9 and 8 at both ends.

[0058] Step 6: Repeat Step 5 for each set of core 5 ports of single-core fiber array 1 and core 5 ports of multi-core fiber 3 to be connected. After all ports are connected, remove the bonded structure and soak it in PGME and IPA developer solutions, respectively, to remove excess unexposed photoresist. Apply low-refractive-index UV-curable adhesive to the end faces of the bonded structure, controlling the amount of adhesive to ensure that all polymer waveguides are covered. Use UV light to cure the adhesive and solidify it to ensure the stability of the bonded waveguides.

[0059] In the specific contents of the above-mentioned specific implementation methods, the various technical features can be combined in any non-contradictory manner. In order to make the description concise, not all possible combinations of the above-mentioned technical features are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0060] Obviously, the above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the claims of the present invention.

Claims

1. An optical interconnect packaging method, characterized in that: The following steps are involved: S1. The optical fiber waveguide to be packaged is bonded to the upper or lower surface of the single-core optical fiber array, and the end faces of the optical fiber waveguide and the single-core optical fiber array are oriented in the same direction to form a stacked three-dimensional waveguide array structure; and the three-dimensional waveguide array structure is fixed vertically as a whole, so that the end face is vertically upward; S2. Apply curing glue to the connection to align the end face of the optical fiber waveguide with the end face of the single-core optical fiber array. After the structures are aligned, irradiate the curing glue to cure the entire structure to obtain a bonded structure; S3. Use a fixture to vertically secure the bonded structure to the displacement platform of the two-photon polymerization system. After dripping photoresist onto the end face of the bonded structure, move it to the center of the imaging system. Using a machine vision algorithm, determine the precise XY coordinates of each port of the optical fiber waveguide and each port of the core of the single-core optical fiber array. Control the Z-axis piezoelectric translation stage to scan the imaging focal plane, determine the optimal imaging heights of the optical fiber waveguide port and the core port of the single-core optical fiber array, and ultimately obtain the three-dimensional coordinates of each port. S4. Based on the three-dimensional coordinates obtained in step S2, a polymer connecting waveguide is directly printed on the end face of the glued structure using two-photon 3D printing technology, and the optical fiber waveguide is connected to the single-core optical fiber array through the polymer connecting waveguide; S5. After all ports are connected, remove the glued structure and remove excess photoresist. Then, drip curing glue to cover all polymer connection waveguides. Irradiate the curing glue to solidify it.

2. The optical interconnect packaging method according to claim 1, wherein: The optical fiber waveguide includes an array optical waveguide chip, a multi-core optical fiber or a single-core optical fiber.

3. The optical interconnect packaging method according to claim 2, wherein: In step S1, when the optical fiber waveguide is an arrayed optical fiber waveguide chip, glue is dispensed on the arrayed optical fiber waveguide chip, and a support structure is printed around the arrayed optical fiber waveguide chip using two-photon 3D printing technology. The single-core optical fiber array is placed on the support structure, and then a glue dispensing needle is used to evenly apply ultraviolet curing glue on the seams on both sides to cure and shape the overall structure.

4. The optical interconnect packaging method according to claim 2, wherein: In step S1, when the optical fiber waveguide is a multi-core optical fiber or a single-core optical fiber, a femtosecond laser processing system is first used to etch a groove on a glass sheet, and a displacement clamping platform is used to clamp the multi-core optical fiber or the single-core optical fiber so that it is placed in the groove of the glass sheet. The displacement clamping platform is adjusted so that the end face of the multi-core optical fiber or the single-core optical fiber is in the same vertical plane as the side wall of the glass sheet; then, the glass sheet is placed on the upper surface of the single-core optical fiber array, and the side wall of the glass surface is aligned with the end face of the single-core optical fiber array; finally, curing glue is applied in the groove to cure the overall structure.

5. The optical interconnect packaging method according to claim 3, wherein: In step S4, based on the acquired three-dimensional coordinates (X WG ,Y WG ,Z WG ), the first tapered waveguide is printed at the fiber waveguide port using two-photon 3D printing technology, and then the three-dimensional coordinates (X F ,Y F ,Z F ), a second tapered waveguide is printed at the core port of the single-core optical fiber array using two-photon 3D printing technology, and finally, a connecting waveguide is printed using two-photon 3D printing technology to connect the first tapered waveguide and the second tapered waveguide.

6. The optical interconnect packaging method according to claim 5, wherein: The lower cross-sectional diameter of the first tapered waveguide matches the mode field size of the optical fiber waveguide, and the mode field of the transmitted light is amplified by the first tapered waveguide; the lower cross-sectional diameter of the second tapered waveguide matches the mode field size of the single-core optical fiber array, and the mode field of the transmitted light is reduced by the second tapered waveguide; the heights of the first tapered waveguide and the second tapered waveguide are equal.

7. The optical interconnect packaging method according to claim 6, wherein: The connecting waveguide is a U-shaped connecting waveguide with a bending radius of 8. The optical interconnect packaging method according to claim 7, wherein: The connecting waveguide includes a reflecting prism with a bevel angle of 45° and a cylindrical waveguide; in step S4, a reflecting prism with a bevel angle of 45° is 3D printed at the ports of the first tapered waveguide and the second tapered waveguide, respectively, so as to deflect the optical axis by 90° parallel to the end face, and align the emission directions with each other; finally, the 3D printed cylindrical waveguides are respectively connected to the two ends of the two reflecting prisms.

9. The optical interconnect packaging method according to any one of claims 1 to 8, characterized in that: In step S5, a polymer connecting waveguide is printed to connect the ports of each group of optical fiber waveguides to be connected with the core ports of the single-core optical fiber array. After all ports are connected, the glued structure is removed and immersed in a developer to remove excess unexposed photoresist. UV curing glue is dripped onto the end face of the glued structure, and the amount of glue is controlled to ensure that the glue layer covers all the polymer connecting waveguides. The glue is cured using an ultraviolet lamp and is shaped and cured to ensure the stability of the polymer connecting waveguide.

10. The optical interconnect packaging method according to any one of claims 1 to 8, characterized in that: In step S2, the structural alignment includes making the height of the end face of the optical fiber waveguide consistent with the height of the end face of the single-core optical fiber array, so that the two end faces are in the same horizontal plane.

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