Dynamic heat dissipation regulation and control method, device, equipment and medium

Abstract

The invention discloses a dynamic heat dissipation regulation and control method and device, equipment and a medium, and belongs to the technical field of heat dissipation, and the method comprises the steps: determining a first pulse width modulation signal duty ratio value of a first fan according to a temperature value of each piece of equipment in a first equipment set and a corresponding heat dissipation curve; determining a first pulse width modulation signal duty ratio change difference value of the first fan according to the type and the number of the second equipment set; determining a target pulse width modulation signal duty ratio value of the first fan according to the first pulse width modulation signal duty ratio value and the first pulse width modulation signal duty ratio change difference value; and setting the rotating speed of a first fan according to the duty ratio value of the target pulse width modulation signal so as to dynamically regulate and control heat dissipation of the system in a partitioned manner. According to the method and the device, the influence on server performance due to overtemperature of the PCIE equipment can be avoided, meanwhile, the fan power consumption can be reduced, and the problem of loud noise of the server is solved.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to a dynamic heat dissipation control method, device, equipment and medium. Background Art

[0002] At present, heat dissipation is a common problem in server operation. For some models with multiple PCIE devices, during the operation of the server, some PCIE devices (such as network cards, disk array cards, etc.) do not have temperature sensors, and some network card optical modules do not support temperature reading. When there are devices whose temperatures cannot be obtained, or when a large number of devices with abnormal temperatures are inserted on an adapter card, PCIE devices are prone to overheating. If they are not detected in time, the performance of such devices will be affected, affecting the operating efficiency of the server. Generally, the overall basic speed will be increased by adjusting the ambient temperature sensor. However, if the overall basic speed is increased, the server will have high power consumption and loud fan noise, which may easily cause customer complaints. Summary of the invention

[0003] In order to overcome the above technical defects, the purpose of this application is to provide a dynamic heat dissipation control method, device, equipment and medium, the method comprising: obtaining the in-place information and temperature information of the several devices to be cooled; adding the devices to be cooled that are in place and can obtain temperature information to the first device set; adding the devices to be cooled that are in place but cannot obtain temperature information to the second device set; determining the first pulse width modulation signal duty cycle value of the first fan according to the temperature value of each device in the first device set and the corresponding heat dissipation curve; determining the first pulse width modulation signal duty cycle change difference of the first fan according to the type and number of the second device set; determining the target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference; setting the first fan speed by the target pulse width modulation signal duty cycle value, so as to dynamically control the heat dissipation of the system by partition. This application can avoid overheating of PCIE devices, affecting server performance, and at the same time reduce fan power consumption and solve the problem of high server noise.

[0004] The specific technical solutions provided by the embodiments of this application are as follows:

[0005] In a first aspect, the present application provides a dynamic heat dissipation control method, which is applied to a dynamic heat dissipation control system, wherein the system includes a plurality of heat dissipation devices, an expansion card, and a target fan corresponding to the expansion card, wherein the plurality of heat dissipation devices are connected to the expansion card, and the target fan includes a first fan, and the method includes:

[0006] Obtaining the presence information and temperature information of the plurality of devices to be cooled;

[0007] Adding the devices to be cooled that are in place and whose temperature information can be obtained to the first device set;

[0008] Add the device to be cooled that is in place but cannot obtain temperature information to the second device set;

[0009] Determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve;

[0010] Determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value;

[0011] The first fan speed is set by the target pulse width modulation signal duty cycle value to dynamically control the heat dissipation of the system by partition.

[0012] In one embodiment, determining the duty cycle value of the first pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the corresponding heat dissipation curve includes:

[0013] Determine a duty cycle value of a pulse width modulation signal of the first fan according to a temperature value of each device in the first device set and a heat dissipation curve of the corresponding device;

[0014] The maximum value of the duty cycle values ​​of the pulse width modulation signals of the plurality of devices corresponding to the first fan is set as the duty cycle value of the first pulse width modulation signal.

[0015] In one embodiment, the target fan includes a second fan, the second fan is adjacent to the first fan, and the step of determining the duty cycle change difference of the first pulse width modulation signal of the first fan according to the type and quantity of the second device set includes:

[0016] Obtain the type and quantity of the second device set;

[0017] When the number of the second device set is a first preset value, the first fan speed duty cycle difference is set as a first threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold;

[0018] When the number of the second device set is greater than or equal to a second preset value, the first fan speed duty cycle difference is set to a second threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated according to the second threshold; the second fan speed duty cycle difference is set to a first threshold, and the second fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold;

[0019] When the number of the second device sets of each expansion board is greater than or equal to a second preset value, the duty cycle variation difference of the first pulse width modulation signal of the first fan is determined according to the type of the second device set.

[0020] In one embodiment, determining the duty cycle change difference of the first pulse width modulation signal of the first fan according to the type of the second device set includes:

[0021] When the second device set type includes a network card and a disk array card, the duty cycle change difference of the pulse width modulation signal of the disk array card corresponding to the first fan is calculated according to the speed duty cycle difference of the disk array card corresponding to the first fan, and the duty cycle change difference of the pulse width modulation signal of the disk array card corresponding to the first fan is set as the first pulse width modulation signal duty cycle change difference;

[0022] When one of the devices in the second device set includes several models, the maximum speed duty cycle difference corresponding to the first fan in the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference.

[0023] In one embodiment, determining a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value includes:

[0024] Obtaining the duty cycle value of the first pulse width modulation signal and the duty cycle change difference of the first pulse width modulation signal;

[0025] The sum of the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference is used as the target pulse width modulation signal duty cycle value of the first fan.

[0026] In one embodiment, determining the duty cycle value of the pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device includes:

[0027] Obtain a temperature value T(K) of one of the devices in the first device set at time K, a temperature value T(K-1) of the device K-1, and a temperature value T(K-2) of the device K-2;

[0028] Obtain the duty cycle value of the pulse width modulation signal of the first fan at time K-1 of one of the devices in the first device set Preset value Tref, p factor item Kp, i factor item Ki, d factor item Kd;

[0029] Through the first heat dissipation curve formula: Calculating a duty cycle value FS(K) of a pulse width modulation signal of the first fan;

[0030] The step of determining the duty cycle value of the pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes:

[0031] Obtaining a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of one of the devices in the first device set;

[0032] Determine a linear control rate a according to a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of a corresponding device;

[0033] Obtain a current temperature value X of one of the devices in the first device set;

[0034] The duty cycle value Y of the pulse width modulation signal of the first fan is calculated by the second heat dissipation curve formula: Y=aX.

[0035] In one embodiment, the system further includes a temperature control device, and the method includes:

[0036] When a failure occurs in the dynamic control of the system heat dissipation partition, the weight ratio of the duty cycle value of the pulse width modulation signal of the fan corresponding to each temperature control device is determined according to the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device;

[0037] By increasing the weight ratio of the duty cycle of the fan pulse width modulation signals corresponding to all expansion cards in stages, the heat dissipation of the system is dynamically regulated.

[0038] In a second aspect, the present application further provides a dynamic heat dissipation control device, the device comprising:

[0039] An acquisition module, used to acquire the presence information and temperature information of the plurality of devices to be cooled;

[0040] A setting module, used for adding the heat dissipation device which is in place and can obtain temperature information to the first device set;

[0041] Add the device to be cooled that is in place but cannot obtain temperature information to the second device set;

[0042] A first determining module, configured to determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve;

[0043] A second determination module is used to determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; and determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value;

[0044] The control module is used to set the speed of the first fan according to the target pulse width modulation signal duty cycle value, so as to dynamically control the heat dissipation of the system in different zones.

[0045] In a third aspect, a dynamic heat dissipation control device is also provided, including:

[0046] one or more processors;

[0047] A storage device for storing one or more programs;

[0048] When the one or more programs are executed by the one or more processors, the one or more processors implement the dynamic heat dissipation control method as described in any one of the first aspects.

[0049] In a fourth aspect, the present application further provides a computer device, the device comprising:

[0050] A memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the dynamic heat dissipation control method as described in any one of the first aspects.

[0051] In a fifth aspect, the present application further provides a computer program product, including a computer program, which, when executed by a processor, implements the steps of any of the dynamic heat dissipation control methods described in the first aspect.

[0052] In a sixth aspect, the present application further provides a computer storage medium, the medium comprising:

[0053] A computer program is stored thereon, and when the computer program is executed by a processor, the steps of any of the dynamic heat dissipation control methods described in the first aspect are implemented.

[0054] Compared with the prior art, the method of the technical solution provided in the embodiment of the present application includes: obtaining the in-place information and temperature information of the several devices to be cooled; adding the in-place devices to be cooled that can obtain temperature information to the first device set; adding the in-place devices to be cooled that cannot obtain temperature information to the second device set; determining the first pulse width modulation signal duty cycle value of the first fan according to the temperature value of each device in the first device set and the corresponding heat dissipation curve; determining the first pulse width modulation signal duty cycle change difference of the first fan according to the type and number of the second device set; determining the target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference; setting the speed of the first fan by the target pulse width modulation signal duty cycle value to dynamically control the heat dissipation of the system. The present application can optimize the heat dissipation requirements of PCIE devices that do not support temperature acquisition or abnormal temperature; avoid overheating of in-place and temperature noreading devices, affecting the performance of devices and servers; compared with the previous situation of raising the basic speed by modifying the heat dissipation curve of the ambient temperature sensor, the fan power consumption can be reduced here to solve the problem of high server noise.

[0055] The technical solution provided in the embodiment of the present application performs dynamic heat dissipation zoning control on PCIE devices with abnormal temperatures based on BMC, and can increase the fan speed corresponding to the location according to different device types, locations, quantities, and models, thereby ensuring the performance of PCIE devices and servers while reducing noise and power consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0056] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0057] Figure 1 A first flow chart of the dynamic heat dissipation control method provided in Example 1 of the present application;

[0058] Figure 2 A second flow chart of the dynamic heat dissipation control method provided in Embodiment 2 of the present application;

[0059] Figure 3 A specific flow chart of dynamic heat dissipation control provided in Example 2 of the present application;

[0060] Figure 4 A structural diagram of a dynamic heat dissipation control device provided in Example 3 of the present application;

[0061] Figure 5The exemplary system provided for Embodiment 7 of the present application can be used to implement the various embodiments described in the present application. DETAILED DESCRIPTION

[0062] In order to make the purpose, technical solutions and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below in conjunction with the drawings in the embodiments of this application. Obviously, the described embodiments are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0063] It should be noted that, unless the context clearly requires otherwise, words such as “include”, “including” and similar words throughout the specification and claims should be interpreted as including rather than exclusive or exhaustive; that is, the meaning is “including but not limited to”.

[0064] Furthermore, in the description of the present application, unless otherwise specified, “plurality” means two or more.

[0065] The heat dissipation zoning control of the related technology can configure the fan speed weight according to the heat dissipation curve of different device sensors to realize the heat dissipation zoning control; as shown in Table 1: central processing unit CPU heat dissipation control, when the heat dissipation curve of cpu0 is controlled, the fan speed weight of fan0 and fan1 in its corresponding area is 1, that is, 100%; the fan speed weight of fan2 and fan3 corresponding to cpu1 is 0.8; CPU1 heat dissipation control is the opposite; but at this time, the noreading PCIE device sensor heat dissipation control does not participate in the heat dissipation control because there is no temperature, so overheating is prevented by increasing the basic speed of all fans.

[0066] Fan0 Fan1 Fan2 Fan3 CPU0 1 1 0.8 0.8 CPU1 0.8 0.8 1 1 PCIE devices 1 1 1 1

[0067] Table 1

[0068] The existing heat dissipation partition control can implement heat dissipation partition control by configuring fan speed weights according to the heat dissipation curves of different device sensors; however, because there are some devices that do not support temperature acquisition, the device is in place but the temperature is 0 or ff, which is defined as a noreading device. That is, the temperature of the related noreading device is abnormal, and the heat dissipation curve of the corresponding device will not be regulated; therefore, the existing partition heat dissipation curve control method for noreading devices cannot meet the heat dissipation requirements; and by adjusting the heat dissipation curve parameters of the ambient temperature sensor to increase the overall basic speed, the fan power consumption and noise will be high.

[0069] Embodiment 1

[0070] The present application embodiment provides a dynamic heat dissipation control method, such as Figure 1 As shown, the method is applied to a dynamic heat dissipation control system, the system includes a plurality of devices to be cooled, an expansion card, and a target fan corresponding to the expansion card, the plurality of devices to be cooled are connected to the expansion card, the target fan includes a first fan, and the method includes:

[0071] Obtaining the presence information and temperature information of the plurality of devices to be cooled;

[0072] Adding the devices to be cooled that are in place and whose temperature information can be obtained to the first device set;

[0073] Add the device to be cooled that is in place but cannot obtain temperature information to the second device set;

[0074] Determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve;

[0075] Determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value;

[0076] The first fan speed is set by the target pulse width modulation signal duty cycle value to dynamically control the heat dissipation of the system by partition.

[0077] Specifically, for a noreading PCIE device, the present application determines the adapter card where the device is located through the location of the device after the server is turned on, confirms the type, model, and quantity of the noreading device on the adapter riser card, and calculates the speed of the corresponding fan that needs to be increased based on the type, model, and quantity; for example, if by default there is only one noreading PCIE device on the adapter riser card, a 5% duty is applied; if there are two or more noreading PCIE devices on the adapter riser card, a 10% duty is applied, or the speeds of adjacent fans are increased at the same time; and in special circumstances, it is necessary to configure special speed control according to the device type and model.

[0078] Here, PCIE devices refer to devices plugged into adapter cards, such as graphics processors (GPUs), disk array cards (RAIDs), network interface cards (NICs), solid-state drives (SSDs), and fixed-position OCP network cards and RAID cards.

[0079] The beneficial effects of the technical solution provided by the embodiment of the present application are:

[0080] This application can optimize the cooling requirements of PCIE devices that do not support temperature acquisition or have abnormal temperatures; avoid overheating of devices that are in place and have no reading temperature, affecting the performance of the device and server; compared with the previous situation of increasing the basic speed by modifying the cooling curve of the ambient temperature sensor, here the fan power consumption can be reduced and the problem of high server noise can be solved.

[0081] The technical solution provided in the embodiment of the present application performs dynamic heat dissipation zoning control on PCIE devices with abnormal temperatures based on BMC, and can increase the fan speed corresponding to the location according to different device types, locations, quantities, and models, thereby ensuring the performance of PCIE devices and servers while reducing noise and power consumption.

[0082] Embodiment 2

[0083] The present application embodiment provides a dynamic heat dissipation control method, such as Figure 2 As shown, the method is applied to a dynamic heat dissipation control system, the system includes a plurality of devices to be cooled, an expansion card, and a target fan corresponding to the expansion card, the plurality of devices to be cooled are connected to the expansion card, the target fan includes a first fan, and the method includes:

[0084] Step S01, obtaining the presence information and temperature information of the plurality of devices to be cooled;

[0085] Adding the devices to be cooled that are in place and whose temperature information can be obtained to the first device set;

[0086] Add the device to be cooled that is in place but cannot obtain temperature information to the second device set;

[0087] A duty cycle value of a first pulse width modulation signal of the first fan is determined according to a temperature value of each device in the first device set and a corresponding heat dissipation curve.

[0088] Specifically, polling the plurality of devices to be cooled to detect the presence information of the plurality of devices to be cooled;

[0089] Determining corresponding positions of the plurality of heat dissipation devices and fans;

[0090] Determine the quantity relationship between the plurality of devices to be cooled and the corresponding adapter cards.

[0091] Taking network cards and disk array RAID cards as examples, network cards are divided into PCIE network cards and OCP cards. Due to different interfaces, OCP network cards and RAID cards do not have PCIE interface positions, but the position of OCP network cards is fixed and is connected to the adapter card riser0 by default.

[0092] Temperature noreading device confirmation: After the server is turned on, the system BIOS sends all PCIE device location information to the baseboard management controller (BMC, Baseboard Management Controller), polls all several devices to be cooled, and checks the status and temperature of all several devices to be cooled. If there is a device to be cooled and the temperature is unavailable, it meets the condition that the temperature abnormal device needs to increase the fan speed;

[0093] Confirm the location and number of the temperature noreading device; confirm the riser card where the device with abnormal temperature is located according to the PCIE interface position, such as PCIE0, 1, 2, which is on the riser card riser0; PCIE3, 4, 5 are on riser1; PCIE6, 7 are on riser2; OCP network card and RAID card are fixed in position and are counted on the riser card riser0 by default.

[0094] After the pulse width modulation signal duty cycle value of the fan (first fan) corresponding to each device in the first device set is calculated through all sensor heat dissipation curves, the maximum value of the pulse width modulation signal duty cycle values ​​corresponding to the fans of several devices is set as the first pulse width modulation signal duty cycle value.

[0095] Step S01 also includes:

[0096] Step S011, determining a duty cycle value of a pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a heat dissipation curve of the corresponding device;

[0097] The maximum value of the duty cycle values ​​of the pulse width modulation signals of the plurality of devices corresponding to the first fan is set as the duty cycle value of the first pulse width modulation signal.

[0098] Step S011 also includes:

[0099] Step S0111, obtaining a temperature value T(K) of one of the devices in the first device set at time K, a temperature value T(K-1) of the device K-1, and a temperature value T(K-2) of the device K-2;

[0100] Obtain a pulse width modulation signal duty cycle value FS_act(K-1), a preset value Tref, a p factor item Kp, an i factor item Ki, and a d factor item Kd of a first fan at a time K-1 of one of the first device set;

[0101] The duty cycle value FS(K) of the pulse width modulation signal of the first fan is calculated by the first heat dissipation curve formula: FS(K)=FS_act(K-1)+Kp*(T(K)-T(K-1))+Ki*(T(K)-Tref)+Kd*((T(K)-2*T(K-1)+T(K-2));

[0102] The step of determining the duty cycle value of the pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes:

[0103] Obtaining a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of one of the devices in the first device set;

[0104] Determine a linear control rate a according to a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of a corresponding device;

[0105] Obtain a current temperature value X of one of the devices in the first device set;

[0106] The duty cycle value Y of the pulse width modulation signal of the first fan is calculated by the second heat dissipation curve formula: Y=aX.

[0107] Specifically, PID control uses setpoint (Tref), kp, ki, kd parameters; such as PSU control parameters: sp: 50kp: 5ki: 0.5kd: 1;

[0108] The duty cycle value FS(K) of the pulse width modulation signal of the first fan is calculated by the first heat dissipation curve formula: FS(K)=FS_act(K-1)+Kp*(T(K)-T(K-1))+Ki*(T(K)-Tref)+Kd*((T(K)-2*T(K-1)+T(K-2)).

[0109] Linear control, i.e. segmented control, such as inlet control, for example (15, 51)(20, 91)(25, 130)(30, 169)(37, 204)(38, 230); if the temperature is between 15 and 20 degrees, use (15, 51)(20, 91) segment control. Calculate the k value through the history (temperature value, pwm value), when x=17, then substitute y=kx, and calculate the duty cycle value Y of the pulse width modulation signal of the first fan.

[0110] Step S02: determining a duty cycle variation difference of a first pulse width modulation signal of the first fan according to the type and quantity of the second device set.

[0111] Step S02 also includes:

[0112] Step S021, obtaining the type and quantity of the second device set;

[0113] When the number of the second device set is a first preset value (1), the first fan speed duty cycle difference is set to a first threshold value (5% duty), and the first fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold value;

[0114] When the number of the second device set is greater than or equal to a second preset value (2), the first fan speed duty cycle difference is set to a second threshold value (10% duty), and the first fan pulse width modulation signal duty cycle change difference is calculated according to the second threshold value; the second fan speed duty cycle difference is set to a first threshold value, and the second fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold value;

[0115] When the number of the second device sets of each expansion board is greater than or equal to the second preset value (2), the duty cycle change difference of the first pulse width modulation signal of the first fan is determined according to the type of the second device set.

[0116] Specifically, the fan duty cycle required to be raised by the fan at the corresponding position of the riser card is calculated according to the type, model and number of noreading devices, wherein the noreading device types include network cards, disk array cards, GPU cards and PCIE SSDs; different PCIE devices have different temperature changes during operation, and the above number is the number of noreading devices on the same riser card, as shown in Table 2. If there is only one noreading device on the riser card, only a 5% duty duty cycle of the corresponding fan is pulled; if there are two or more noreading devices on the riser card, a 10% duty duty cycle of the corresponding fan is pulled, and adjacent fans are pulled at a 5% duty duty cycle; when the number of noreading devices on each adapter card is greater than 2, the pull-up duty cycle of the corresponding fan takes the maximum value; if there is a mixed insertion of devices of different types or models, the highest value is used; if the network card has a duty cycle of 5% and 10% duty, and the raid card needs to have a duty cycle of 10% and 15% duty, then the pull-up duty cycle of the raid card is finally taken as 10% and 15% duty.

[0117]

[0118]

[0119] Table 2

[0120] Step S022, when the second device set type includes a network card and a disk array card, calculating a duty cycle change difference of a pulse width modulation signal of the disk array card corresponding to the first fan according to a speed duty cycle difference of the disk array card corresponding to the first fan, and setting the duty cycle change difference of the pulse width modulation signal of the disk array card corresponding to the first fan as the first pulse width modulation signal duty cycle change difference;

[0121] When one of the devices in the second device set includes several models, the maximum speed duty cycle difference corresponding to the first fan in the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference.

[0122] Specifically, for devices of the same type, such as network cards, different models or manufacturers may have large differences in operating temperature changes. A distinction is made here between models. PCIE device types can be configured by unique device types, or noreading devices of the same type but different models (such as 100G, 200G, and 300G) can be distinguished by unique device IDs. A noreading device list is created, and the device IDs that require special regulation and the fan duty cycles that need to be increased are configured. Polling is performed first. If the noreading device ID that requires special regulation is in this list, the fan duty cycle that needs to be increased is taken, and the maximum value is taken if there are multiple devices. If it is not in the list, the default duty cycle value is used according to the device type.

[0123] Here, the duty cycle that needs to be increased is a fixed value, which gives the fan PWM pulse width modulation, where the 1% duty cycle (corresponding to the fan speed duty cycle difference) is 2.55pwm (the duty cycle of the PWM signal, corresponding to the fan's pulse width modulation signal duty cycle change difference).

[0124] Among them, the riser card is a server expansion card, which is mainly used to provide additional expansion slots in the limited space of the server chassis to install more hardware devices, such as GPU cards, network adapters, hard disk controllers, etc.; the riser card is usually installed on the PCIe slot of the server motherboard, and can transfer the expansion slot on the motherboard to a position more suitable for the server chassis, thereby making full use of the internal space of the server and enhancing the scalability and flexibility of the server.

[0125] Step S03: determining a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference.

[0126] Step S03 also includes:

[0127] Step S031, obtaining the duty cycle value of the first pulse width modulation signal and the duty cycle change difference of the first pulse width modulation signal;

[0128] The sum of the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference is used as the target pulse width modulation signal duty cycle value of the first fan.

[0129] Specifically, the final target pulse width modulation signal duty cycle value is passed to the fan. After the pulse width modulation signal duty cycle value is calculated for all sensor heat dissipation curves, the maximum fan pulse width modulation signal duty cycle value in the first device set is taken, and the first pulse width modulation signal duty cycle change difference of the second device set is added to this value, and the final pulse width modulation signal duty cycle value is output to the first fan, thereby realizing dynamic control of the heat dissipation of the heat dissipation device.

[0130] Among them, the duty cycle refers to the ratio of the high level to the cycle time in the PWM signal. When the duty cycle is 100%, the fan runs at the highest speed and outputs the maximum air volume. When the duty cycle is 0%, the fan stops running and outputs zero air volume.

[0131] Step S04: setting the speed of the first fan by the target pulse width modulation signal duty cycle value to dynamically control the heat dissipation of the system by partition.

[0132] Step S05, when a failure occurs in the dynamic control of the system heat dissipation partition, the weight ratio of the duty cycle value of the pulse width modulation signal of the fan corresponding to each temperature control device is determined according to the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device;

[0133] By increasing the weight ratio of the duty cycle of the fan pulse width modulation signals corresponding to all expansion cards in stages, the heat dissipation of the system is dynamically regulated.

[0134] Specifically, however, by adjusting the heat dissipation curve parameters of the ambient temperature sensor to increase the weight ratio of the basic pulse width modulation signal duty cycle value of the overall device, problems of high power consumption and high noise may occur.

[0135] like Figure 3As shown, the present application confirms the location, type, model and quantity of the noreading device, and calculates the corresponding fan duty cycle difference that needs to be increased according to the location, type, model and quantity of the noreading device. Because different devices have different frequency reduction temperatures and temperature fluctuations, the fan speed is dynamically partitioned and controlled according to the location, type, model and quantity of the noreading device. Based on the BMC, dynamic heat dissipation partitioning control is performed on PCIE devices with abnormal temperatures. The fan speed corresponding to the location can be increased according to different device types, locations, quantities and models, thereby ensuring the performance of PCIE devices and servers while reducing noise and power consumption.

[0136] In addition, the determining the duty cycle change difference of the first pulse width modulation signal of the first fan according to the type of the second device set further includes:

[0137] Create the second PCIE device list;

[0138] Set the PCIE device that needs special regulation as the first PCIE device;

[0139] Polling the second PCIE device list;

[0140] Determine whether the first PCIE device is in the second PCIE device list;

[0141] If so, the fan speed duty cycle difference corresponding to the first PCIE device is set as the third threshold value, and the duty cycle change difference of the pulse width modulation signal of the first fan corresponding to the first PCIE device is calculated according to the third threshold value; when the first PCIE device includes multiple models, the maximum speed duty cycle difference corresponding to the first fan in the first PCIE device model is set as the second speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan corresponding to the first PCIE device is calculated according to the second speed duty cycle difference;

[0142] If not, the duty cycle difference of the first fan speed corresponding to the remaining one of the PCIE devices is set as a fourth threshold, and the duty cycle change difference of the pulse width modulation signal of the first fan corresponding to the remaining one of the PCIE devices is calculated according to the fourth threshold.

[0143] This application can dynamically control the fan duty cycle according to the location, type, model and number of noreading devices based on the different PCIE device frequency reduction temperatures and temperature fluctuations.

[0144] The method for dynamic heat dissipation control provided in the embodiment of the present application may be further improved and optimized without departing from the technical solution of the present application, and these improvements and optimizations should also be regarded as within the scope of protection of the present application.

[0145] This technical solution can not only dynamically adjust the heat dissipation of the server's rear noreading PCIE device, but also dynamically adjust the partitions of the SAS SATA hard disks on the front backplane that do not support direct temperature acquisition; because SAS SATA hard disks do not support BMC to directly obtain temperature, BMC can only monitor the temperature through the RAID card, but because the RAID card polls too much information, the more hard disks there are, the slower the temperature acquisition speed, the harder disk temperature is more likely to fluctuate, and the fan speed will also fluctuate greatly; and slow heat dissipation control will also cause the hard disk to overheat, affecting the normal operation of the server. Here, the partition heat dissipation can be dynamically adjusted according to the number and position of the SAS SATA hard disks on the backplane to avoid the hard disk overheating problem.

[0146] The beneficial effects of the technical solution provided by the embodiment of the present application are:

[0147] This application can optimize the cooling requirements of PCIE devices that do not support temperature acquisition or have abnormal temperatures; avoid overheating of devices that are in place and have no reading temperature, affecting the performance of the device and server; compared with the previous situation of increasing the basic speed by modifying the cooling curve of the ambient temperature sensor, here the fan power consumption can be reduced and the problem of high server noise can be solved.

[0148] The technical solution provided in the embodiment of the present application performs dynamic heat dissipation zoning control on PCIE devices with abnormal temperatures based on BMC, and can increase the fan speed corresponding to the location according to different device types, locations, quantities, and models, thereby ensuring the performance of PCIE devices and servers while reducing noise and power consumption.

[0149] Embodiment 3

[0150] The present application provides a dynamic heat dissipation control device, such as Figure 4 As shown, the device includes: an acquisition module, a first determination module, a setting module, a second determination module, a control module, and a post-processing module.

[0151] In this embodiment, the acquisition module is used to obtain the presence information and temperature information of the plurality of devices to be cooled;

[0152] A setting module, used for adding the heat dissipation device which is in place and can obtain temperature information to the first device set;

[0153] Add the device to be cooled that is in place but cannot obtain temperature information to the second device set;

[0154] A first determining module, configured to determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve;

[0155] A second determination module is used to determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; and determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value;

[0156] The control module is used to set the speed of the first fan according to the target pulse width modulation signal duty cycle value, so as to dynamically control the heat dissipation of the system in different zones.

[0157] In one of the embodiments, the first determination module is used to determine the duty cycle value of the pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device;

[0158] The maximum value of the duty cycle values ​​of the pulse width modulation signals of the plurality of devices corresponding to the first fan is set as the duty cycle value of the first pulse width modulation signal.

[0159] In one embodiment, the first determination module is used to obtain a temperature value T(K) of one of the devices in the first device set at time K, a temperature value T(K-1) of the device K-1, and a temperature value T(K-2) of the device K-2;

[0160] Obtain a pulse width modulation signal duty cycle value FS_act(K-1), a preset value Tref, a p factor item Kp, an i factor item Ki, and a d factor item Kd of a first fan at a time K-1 of one of the first device set;

[0161] The duty cycle value FS(K) of the pulse width modulation signal of the first fan is calculated by the first heat dissipation curve formula: FS(K)=FS_act(K-1)+Kp*(T(K)-T(K-1))+Ki*(T(K)-Tref)+Kd*((T(K)-2*T(K-1)+T(K-2));

[0162] The step of determining the duty cycle value of the pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes:

[0163] Obtaining a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of one of the devices in the first device set;

[0164] Determine a linear control rate a according to a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of a corresponding device;

[0165] Obtain a current temperature value X of one of the devices in the first device set;

[0166] The duty cycle value Y of the pulse width modulation signal of the first fan is calculated by the second heat dissipation curve formula: Y=aX.

[0167] In one of the embodiments, the second determining module is used to obtain the type and quantity of the second device set;

[0168] When the number of the second device set is a first preset value, the first fan speed duty cycle difference is set as a first threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold;

[0169] When the number of the second device set is greater than or equal to a second preset value, the first fan speed duty cycle difference is set to a second threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated according to the second threshold; the second fan speed duty cycle difference is set to a first threshold, and the second fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold;

[0170] When the number of the second device sets of each expansion board is greater than or equal to a second preset value, the duty cycle variation difference of the first pulse width modulation signal of the first fan is determined according to the type of the second device set.

[0171] In one of the embodiments, the second determination module is used to calculate the duty cycle change difference of the pulse width modulation signal of the disk array card corresponding to the first fan according to the speed duty cycle difference of the disk array card corresponding to the first fan when the second device set type includes a network card and a disk array card, and set the duty cycle change difference of the pulse width modulation signal of the disk array card corresponding to the first fan as the first pulse width modulation signal duty cycle change difference;

[0172] When one of the devices in the second device set includes several models, the maximum speed duty cycle difference corresponding to the first fan in the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference.

[0173] In one of the embodiments, the second determination module is used to obtain the duty cycle value of the first pulse width modulation signal and the duty cycle change difference of the first pulse width modulation signal;

[0174] The sum of the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference is used as the target pulse width modulation signal duty cycle value of the first fan.

[0175] In one of the embodiments, the post-processing module is used to determine the weight ratio of the duty cycle value of the pulse width modulation signal of the fan corresponding to each temperature control device according to the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device when a failure occurs in the dynamic control of the system heat dissipation partition;

[0176] By increasing the weight ratio of the duty cycle of the fan pulse width modulation signals corresponding to all expansion cards in stages, the heat dissipation of the system is dynamically regulated.

[0177] The beneficial effects of the technical solution provided by the embodiment of the present application are:

[0178] This application can optimize the cooling requirements of PCIE devices that do not support temperature acquisition or have abnormal temperatures; avoid overheating of devices that are in place and have no reading temperature, affecting the performance of the device and server; compared with the previous situation of increasing the basic speed by modifying the cooling curve of the ambient temperature sensor, here the fan power consumption can be reduced and the problem of high server noise can be solved.

[0179] The technical solution provided in the embodiment of the present application performs dynamic heat dissipation zoning control on PCIE devices with abnormal temperatures based on BMC, and can increase the fan speed corresponding to the location according to different device types, locations, quantities, and models, thereby ensuring the performance of PCIE devices and servers while reducing noise and power consumption.

[0180] Embodiment 4

[0181] The present invention also provides a dynamic heat dissipation control device, comprising:

[0182] one or more processors;

[0183] A storage device for storing one or more programs;

[0184] When the one or more programs are executed by the one or more processors, the one or more processors execute the following dynamic heat dissipation control method:

[0185] Obtaining the presence information and temperature information of the plurality of devices to be cooled;

[0186] Adding the devices to be cooled that are in place and whose temperature information can be obtained to the first device set;

[0187] Add the device to be cooled that is in place but cannot obtain temperature information to the second device set;

[0188] Determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve;

[0189] Determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value;

[0190] The first fan speed is set by the target pulse width modulation signal duty cycle value to dynamically control the heat dissipation of the system by partition.

[0191] The beneficial effects of the technical solution provided by the embodiment of the present application are:

[0192] This application can optimize the cooling requirements of PCIE devices that do not support temperature acquisition or have abnormal temperatures; avoid overheating of devices that are in place and have no reading temperature, affecting the performance of the device and server; compared with the previous situation of increasing the basic speed by modifying the cooling curve of the ambient temperature sensor, here the fan power consumption can be reduced and the problem of high server noise can be solved.

[0193] The technical solution provided in the embodiment of the present application performs dynamic heat dissipation zoning control on PCIE devices with abnormal temperatures based on BMC, and can increase the fan speed corresponding to the location according to different device types, locations, quantities, and models, thereby ensuring the performance of PCIE devices and servers while reducing noise and power consumption.

[0194] Embodiment 5

[0195] The present application provides a computer device, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the following dynamic heat dissipation control method can be executed:

[0196] Obtaining the presence information and temperature information of the plurality of devices to be cooled;

[0197] Adding the devices to be cooled that are in place and whose temperature information can be obtained to the first device set;

[0198] Add the device to be cooled that is in place but cannot obtain temperature information to the second device set;

[0199] Determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve;

[0200] Determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value;

[0201] The first fan speed is set by the target pulse width modulation signal duty cycle value to dynamically control the heat dissipation of the system by partition.

[0202] The beneficial effects of the technical solution provided by the embodiment of the present application are:

[0203] This application can optimize the cooling requirements of PCIE devices that do not support temperature acquisition or have abnormal temperatures; avoid overheating of devices that are in place and have no reading temperature, affecting the performance of the device and server; compared with the previous situation of increasing the basic speed by modifying the cooling curve of the ambient temperature sensor, here the fan power consumption can be reduced and the problem of high server noise can be solved.

[0204] The technical solution provided in the embodiment of the present application performs dynamic heat dissipation zoning control on PCIE devices with abnormal temperatures based on BMC, and can increase the fan speed corresponding to the location according to different device types, locations, quantities, and models, thereby ensuring the performance of PCIE devices and servers while reducing noise and power consumption.

[0205] Embodiment 6

[0206] The present application also provides a computer program product, including a computer program, which can implement the following dynamic heat dissipation control method when executed by a processor:

[0207] Obtaining the presence information and temperature information of the plurality of devices to be cooled;

[0208] Adding the devices to be cooled that are in place and whose temperature information can be obtained to the first device set;

[0209] Add the device to be cooled that is in place but cannot obtain temperature information to the second device set;

[0210] Determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve;

[0211] Determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value;

[0212] The first fan speed is set by the target pulse width modulation signal duty cycle value to dynamically control the heat dissipation of the system by partition.

[0213] The beneficial effects of the technical solution provided by the embodiment of the present application are:

[0214] This application can optimize the cooling requirements of PCIE devices that do not support temperature acquisition or have abnormal temperatures; avoid overheating of devices that are in place and have no reading temperature, affecting the performance of the device and server; compared with the previous situation of increasing the basic speed by modifying the cooling curve of the ambient temperature sensor, here the fan power consumption can be reduced and the problem of high server noise can be solved.

[0215] The technical solution provided in the embodiment of the present application performs dynamic heat dissipation zoning control on PCIE devices with abnormal temperatures based on BMC, and can increase the fan speed corresponding to the location according to different device types, locations, quantities, and models, thereby ensuring the performance of PCIE devices and servers while reducing noise and power consumption.

[0216] Embodiment 7

[0217] The present application provides a computer storage medium, including a memory, a processor, and a computer program stored in the memory and executable on the processor. When the processor executes the computer program, the following steps are implemented:

[0218] Obtaining the presence information and temperature information of the plurality of devices to be cooled;

[0219] Adding the devices to be cooled that are in place and whose temperature information can be obtained to the first device set;

[0220] Add the device to be cooled that is in place but cannot obtain temperature information to the second device set;

[0221] Determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve;

[0222] Determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value;

[0223] The first fan speed is set by the target pulse width modulation signal duty cycle value to dynamically control the heat dissipation of the system by partition.

[0224] In one embodiment, determining the duty cycle value of the first pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the corresponding heat dissipation curve includes:

[0225] Determine a duty cycle value of a pulse width modulation signal of the first fan according to a temperature value of each device in the first device set and a heat dissipation curve of the corresponding device;

[0226] The maximum value of the duty cycle values ​​of the pulse width modulation signals of the plurality of devices corresponding to the first fan is set as the duty cycle value of the first pulse width modulation signal.

[0227] In one embodiment, the target fan includes a second fan, the second fan is adjacent to the first fan, and the step of determining the duty cycle change difference of the first pulse width modulation signal of the first fan according to the type and quantity of the second device set includes:

[0228] Obtain the type and quantity of the second device set;

[0229] When the number of the second device set is a first preset value, the first fan speed duty cycle difference is set as a first threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold;

[0230] When the number of the second device set is greater than or equal to a second preset value, the first fan speed duty cycle difference is set to a second threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated according to the second threshold; the second fan speed duty cycle difference is set to a first threshold, and the second fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold;

[0231] When the number of the second device sets of each expansion board is greater than or equal to a second preset value, the duty cycle variation difference of the first pulse width modulation signal of the first fan is determined according to the type of the second device set.

[0232] In one embodiment, determining the duty cycle change difference of the first pulse width modulation signal of the first fan according to the type of the second device set includes:

[0233] When the second device set type includes a network card and a disk array card, the duty cycle change difference of the pulse width modulation signal of the disk array card corresponding to the first fan is calculated according to the speed duty cycle difference of the disk array card corresponding to the first fan, and the duty cycle change difference of the pulse width modulation signal of the disk array card corresponding to the first fan is set as the first pulse width modulation signal duty cycle change difference;

[0234] When one of the devices in the second device set includes several models, the maximum speed duty cycle difference corresponding to the first fan in the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference.

[0235] In one embodiment, determining a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value includes:

[0236] Obtaining the duty cycle value of the first pulse width modulation signal and the duty cycle change difference of the first pulse width modulation signal;

[0237] The sum of the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference is used as the target pulse width modulation signal duty cycle value of the first fan.

[0238] In one embodiment, determining the duty cycle value of the pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device includes:

[0239] Obtain a temperature value T(K) of one of the devices in the first device set at time K, a temperature value T(K-1) of the device K-1, and a temperature value T(K-2) of the device K-2;

[0240] Obtain the duty cycle value of the pulse width modulation signal of the first fan at time K-1 of one of the devices in the first device set Preset value Tref, p factor item Kp, i factor item Ki, d factor item Kd;

[0241] Through the first heat dissipation curve formula: Calculating a duty cycle value FS(K) of a pulse width modulation signal of the first fan;

[0242] The step of determining the duty cycle value of the pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes:

[0243] Obtaining a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of one of the devices in the first device set;

[0244] Determine a linear control rate a according to a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of a corresponding device;

[0245] Obtain a current temperature value X of one of the devices in the first device set;

[0246] The duty cycle value Y of the pulse width modulation signal of the first fan is calculated by the second heat dissipation curve formula: Y=aX.

[0247] In one embodiment, the system further includes a temperature control device, and the method includes:

[0248] When a failure occurs in the dynamic control of the system heat dissipation partition, the weight ratio of the duty cycle value of the pulse width modulation signal of the fan corresponding to each temperature control device is determined according to the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device;

[0249] By increasing the weight ratio of the duty cycle of the fan pulse width modulation signals corresponding to all expansion cards in stages, the heat dissipation of the system is dynamically regulated.

[0250] This application can prevent PCIE devices from overheating and affecting server performance, while reducing fan power consumption and solving the problem of high server noise.

[0251] Figure 5 An exemplary system provided for Embodiment 7 of the present application that can be used to implement various embodiments described in the present application;

[0252] like Figure 5 As shown, in some embodiments, the system can be used as any of the above-mentioned devices for dynamic heat dissipation control in each of the embodiments. In some embodiments, the system may include one or more computer-readable media (e.g., system memory or NVM / storage device) having results and one or more processors (e.g., (one or more) processors) coupled to the one or more computer-readable media and configured to execute the results to implement the module to perform the actions described in this application.

[0253] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM).

[0254] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0255] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A dynamic heat dissipation control method, characterized in that: The method is applied to a dynamic heat dissipation control system, the system comprising a plurality of devices to be cooled, an expansion card, and a target fan corresponding to the expansion card, the plurality of devices to be cooled are connected to the expansion card, the target fan comprises a first fan, and the method comprises: Obtaining the presence information and temperature information of the plurality of devices to be cooled; Adding the devices to be cooled that are in place and whose temperature information can be obtained to the first device set; Add the device to be cooled that is in place but cannot obtain temperature information to the second device set; Determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve; Determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value; The first fan speed is set by the target pulse width modulation signal duty cycle value to dynamically control the heat dissipation of the system by partition.

2. The dynamic heat dissipation control method according to claim 1, characterized in that: The step of determining a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve includes: Determine a duty cycle value of a pulse width modulation signal of the first fan according to a temperature value of each device in the first device set and a heat dissipation curve of the corresponding device; The maximum value of the duty cycle values ​​of the pulse width modulation signals of the plurality of devices corresponding to the first fan is set as the duty cycle value of the first pulse width modulation signal.

3. The dynamic heat dissipation control method according to claim 1, characterized in that: The target fan includes a second fan, the second fan is adjacent to the first fan, and determining the duty cycle change difference of the first pulse width modulation signal of the first fan according to the type and quantity of the second device set includes: Obtain the type and quantity of the second device set; When the number of the second device set is a first preset value, the first fan speed duty cycle difference is set as a first threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold; When the number of the second device set is greater than or equal to a second preset value, the first fan speed duty cycle difference is set to a second threshold, and the first fan pulse width modulation signal duty cycle change difference is calculated according to the second threshold; the second fan speed duty cycle difference is set to a first threshold, and the second fan pulse width modulation signal duty cycle change difference is calculated according to the first threshold; When the number of the second device sets of each expansion board is greater than or equal to a second preset value, the duty cycle variation difference of the first pulse width modulation signal of the first fan is determined according to the type of the second device set.

4. The dynamic heat dissipation control method according to claim 3, characterized in that: The step of determining a duty cycle variation difference of a first pulse width modulation signal of the first fan according to the type of the second device set includes: When the second device set type includes a network card and a disk array card, the duty cycle change difference of the pulse width modulation signal of the disk array card corresponding to the first fan is calculated according to the speed duty cycle difference of the disk array card corresponding to the first fan, and the duty cycle change difference of the pulse width modulation signal of the disk array card corresponding to the first fan is set as the first pulse width modulation signal duty cycle change difference; When one of the devices in the second device set includes several models, the maximum speed duty cycle difference corresponding to the first fan in the device model is set as the first speed duty cycle difference, and the first pulse width modulation signal duty cycle difference of the first fan is calculated based on the first speed duty cycle difference.

5. The dynamic heat dissipation control method according to claim 1, characterized in that: Determining a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value includes: Obtaining a duty cycle value of the first pulse width modulation signal and a duty cycle change difference of the first pulse width modulation signal; The sum of the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference is used as the target pulse width modulation signal duty cycle value of the first fan.

6. The dynamic heat dissipation control method according to claim 2, characterized in that: The step of determining the duty cycle value of the pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device includes: Obtain a temperature value T(K) of one of the devices in the first device set at time K, a temperature value T(K-1) of the device K-1, and a temperature value T(K-2) of the device K-2; Obtain a pulse width modulation signal duty cycle value FS_act(K-1), a preset value Tref, a p factor item Kp, an i factor item Ki, and a d factor item Kd of a first fan at a time K-1 of one of the first device set; The duty cycle value FS(K) of the pulse width modulation signal of the first fan is calculated by the first heat dissipation curve formula: FS(K)=FS_act(K-1)+Kp*(T(K)-T(K-1))+Ki*(T(K)-Tref)+Kd*((T(K)-2*T(K-1)+T(K-2)); The step of determining the duty cycle value of the pulse width modulation signal of the first fan according to the temperature value of each device in the first device set and the heat dissipation curve of the corresponding device further includes: Obtaining a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of one of the devices in the first device set; Determine a linear control rate a according to a duty cycle value of a pulse width modulation signal of the first fan and a temperature value of a corresponding device; Obtain a current temperature value X of one of the devices in the first device set; The duty cycle value Y of the pulse width modulation signal of the first fan is calculated by the second heat dissipation curve formula: Y=aX.

7. The dynamic heat dissipation control method according to claim 1, characterized in that: The system further includes a temperature control device, and the method includes: When a failure occurs in the dynamic control of the system heat dissipation partition, the weight ratio of the duty cycle value of the pulse width modulation signal of the fan corresponding to each temperature control device is determined according to the temperature of each temperature control device and the heat dissipation curve of the corresponding temperature control device; By increasing the weight ratio of the duty cycle of the fan pulse width modulation signals corresponding to all expansion cards in stages, the heat dissipation of the system is dynamically regulated.

8. A dynamic heat dissipation control device, characterized in that: The device comprises: An acquisition module, used to acquire the presence information and temperature information of the plurality of devices to be cooled; A setting module is used to add the heat dissipation device that is in place and can obtain temperature information to the first device set; and to add the heat dissipation device that is in place but cannot obtain temperature information to the second device set; A first determining module, configured to determine a duty cycle value of a first pulse width modulation signal of a first fan according to a temperature value of each device in the first device set and a corresponding heat dissipation curve; A second determination module is used to determine a first pulse width modulation signal duty cycle change difference value of the first fan according to the type and quantity of the second device set; and determine a target pulse width modulation signal duty cycle value of the first fan according to the first pulse width modulation signal duty cycle value and the first pulse width modulation signal duty cycle change difference value; The control module is used to set the speed of the first fan according to the target pulse width modulation signal duty cycle value, so as to dynamically control the heat dissipation of the system in different zones.

9. A computer device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the computer program, the steps of the dynamic heat dissipation control method according to any one of claims 1 to 7 are implemented.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the steps of the dynamic heat dissipation control method according to any one of claims 1 to 7 are implemented.

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