Die bonding turret device and die bonding equipment

Abstract

The invention is suitable for the technical field of semiconductor equipment, and provides a die bonding turret device and die bonding equipment, and the die bonding turret device comprises a rotation driving mechanism, a positioning disc group, a swing arm driving unit and a swing arm mechanism. The die bonding equipment comprises any one of the die bonding turret devices. Compared with a previous single-side single-arm / single-side two-arm structure, the number of the swing arm mechanisms is increased, the multiple first mounting faces are evenly provided with the multiple swing arm mechanisms around the first axis, the multiple swing arm mechanisms are connected to the first mounting faces in a sliding mode, the rotation angle of each swing arm mechanism each time can be the same, control over the swing arm assembly is more convenient, and the stability of the swing arm assembly is improved. The motion angle of a single swing arm mechanism is reduced, and vibration generated when the swing arm mechanism moves the chip is also reduced. In addition, a plurality of independent stations capable of continuously rotating are provided, and during working, a plurality of swing arm mechanisms can be used for continuously sucking chips at a chip supply position to a mounting substrate, so that the die bonding efficiency is effectively improved, and the die bonding efficiency is multiple times of that of conventional die bonding equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor equipment, and in particular relates to a crystal bonding turret device and crystal bonding equipment. Background Art

[0002] The die bonder is one of the equipment used in semiconductor device manufacturing. Its function is to connect semiconductor wafers with other components. In the operation of the die bonder, the die ring is usually supported by the die supply platform, and then the chip on the die ring is separated from the blue film by the ejector device. Finally, the swing arm structure drives the nozzle structure to move and absorb the chip on the die ring, and then the chip is transported and firmly connected to the solder joints between the package substrate to achieve die bonding. However, most of the existing die bonders have the problem of low die bonding efficiency. Summary of the invention

[0003] The object of the present invention is to provide a crystal bonding turret device and a crystal bonding equipment, aiming to solve the technical problem of low crystal bonding efficiency that most crystal bonding equipment in the prior art have when in use.

[0004] The present invention is implemented as follows. In the first aspect, a crystal bonding turret device is provided, and the crystal bonding turret device includes a rotation drive mechanism, a positioning plate group, a swing arm drive unit and a swing arm mechanism. The positioning plate group has the freedom to rotate around a first axis. The positioning plate group has multiple first mounting surfaces, and the multiple first mounting surfaces are evenly distributed around the first axis. The driving end of the rotation drive mechanism is connected to the positioning plate group for driving the positioning plate group to rotate around the first axis. The number of the swing arm mechanisms is multiple, and the multiple swing arm mechanisms are respectively slidably mounted on the first mounting surfaces and are used to absorb or place chips. The number of the swing arm drive units is multiple, and they are arranged one by one with the swing arm mechanisms. The multiple swing arm drive units are all arranged on the positioning plate group and are used to drive the corresponding swing arm mechanisms to reciprocate along the first axis.

[0005] In an optional embodiment, the swing arm mechanism includes a nozzle structure, a swing arm body and a nozzle driving unit, the nozzle structure is used to suck the chip through negative pressure, the swing arm body has a crystal bonding end and a mounting end relatively arranged, the mounting end is slidably connected to the first mounting surface, the nozzle structure is rotatably arranged at the crystal bonding end of the swing arm body, the nozzle driving unit is arranged in the area of ​​the swing arm body close to the mounting end, and is used to drive the nozzle structure to rotate to adjust the chip, and a transmission unit is arranged between the nozzle driving unit and the nozzle structure.

[0006] In an optional embodiment, the swing arm body includes a bottom portion and two side portions spaced apart from each other, the bottom portion is connected between the two side portions, the two side portions and the bottom portion enclose a accommodating space, the driving ends of the transmission unit and the nozzle driving unit are both located in the accommodating space, the bottom portion is a closed structure, and a through hole is further provided on the side portion, and the through hole is used to reduce the resistance of the swing arm body during horizontal rotation.

[0007] In an optional embodiment, the suction nozzle structure includes a main sleeve, a working component and an elastic member, the main sleeve is rotatably set at the end of the swing arm body, the main sleeve has a first channel, the first channel has a first opening and a second opening, the working component includes a suction nozzle guide rod and a suction nozzle body, the first end of the suction nozzle guide rod is movably inserted in the first channel, the second end of the suction nozzle guide rod extends outside the main sleeve through the first opening, the suction nozzle body is arranged at the second end of the suction nozzle guide rod, the suction nozzle body is used to adsorb chips, and the suction nozzle guide rod is provided with a second channel for connecting the suction nozzle body with the first channel, the elastic member is located in the first channel, the elastic member abuts against the first end of the suction nozzle guide rod, and the elastic member is used to deform when the suction nozzle body is squeezed to buffer the working component.

[0008] In an optional embodiment, an elastic adjustment piece is provided at the second opening, and the elastic adjustment piece has the freedom to move along the axis of the first channel relative to the main sleeve, one end of the elastic piece abuts against the elastic adjustment piece, and the other end abuts against the suction nozzle guide rod, and the elastic adjustment piece is used to adjust the initial compression amount of the elastic piece by changing its own position, and the elastic adjustment piece has a third channel for connecting the first channel with the outside.

[0009] In an optional embodiment, a mounting end cover is also fixedly provided on the swing arm body, a sealing structure is provided between the main sleeve and the mounting end cover, the main sleeve is sealed and connected to the mounting end cover through the sealing structure and can rotate relatively, and a fourth channel is also provided on the mounting end cover, and the fourth channel is used to connect the second opening with the external air circuit.

[0010] In an optional embodiment, a sliding structure is arranged between the swing arm mechanism and the positioning plate group, the sliding structure includes a sliding block and a slide rail unit, the sliding block is slidably arranged on the first mounting surface through the slide rail unit, the swing arm mechanism is fixedly installed on the sliding block, and the driving end of the swing arm driving unit is connected to the sliding block.

[0011] In an optional embodiment, the interior of the positioning plate group is a hollow structure, the multiple swing arm drive units are located in the positioning plate group, and at least part of the sliding block extends into the positioning plate group and is connected to the driving end of the swing arm drive unit.

[0012] In an optional embodiment, a mounting opening is provided on the side of the positioning disk assembly facing away from the driving end of the rotary drive mechanism, and the mounting opening is used to connect the internal space of the positioning disk assembly with the outside. A sealing bottom plate is also provided at the mounting opening for removing the cover.

[0013] In a second aspect, a crystal bonding device is provided, comprising the crystal bonding turret device described in any one of the above items.

[0014] The technical effect of the first aspect of the present invention is: the driving end of the rotary drive mechanism is connected to the positioning plate group, so that the positioning plate group can rotate around the first axis under the action of the rotary drive mechanism. At the same time, the positioning plate group has multiple first mounting surfaces evenly distributed around the first axis, and multiple swing arm mechanisms are respectively slidably mounted on the first mounting surfaces. At the same time, multiple swing arm driving units corresponding to the swing arm mechanisms are also arranged on the positioning plate group. While the positioning plate group and the multiple swing arm mechanisms can be driven to rotate around the first axis by the rotary drive mechanism, the swing arm mechanisms can also be driven to reciprocate along the first axis direction by the swing arm driving units. Compared with the crystal bonding equipment in the prior art, the method of installing multiple swing arm mechanisms on the positioning plate group realizes the coordinated and continuous work between multiple workstations. Compared with the previous single-arm / single-arm two-arm structure, the number of swing arm mechanisms is increased, and multiple first mounting surfaces are evenly arranged around the first axis. Multiple swing arm mechanisms are respectively slidably connected to the first mounting surfaces, so that each swing arm mechanism can rotate at the same angle each time, making the control of the swing arm assembly more convenient, reducing the movement angle of a single swing arm mechanism, and reducing the vibration of the swing arm mechanism when moving the chip. In addition, it has multiple independent workstations that rotate continuously. When working, it can continuously absorb the chips from the supply position to the mounting substrate through multiple swing arm mechanisms, which effectively improves the efficiency of die bonding, thus making the die bonding efficiency several times that of conventional die bonding equipment.

[0015] It can be understood that the beneficial effects of the second aspect mentioned above can be found in the relevant description of the first aspect mentioned above, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments of the present invention or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a schematic structural diagram of a crystal bonding turret device provided in an embodiment of the present invention;

[0018] Figure 2 The structure of the swing arm mechanism used in the embodiment of the present invention is shown in FIG. Figure 1 ;

[0019] Figure 3 The structure of the swing arm mechanism used in the embodiment of the present invention is shown in FIG. Figure 2 ;

[0020] Figure 4 is a schematic structural diagram of a nozzle structure used in an embodiment of the present invention;

[0021] Figure 5 is a schematic cross-sectional view of a nozzle structure used in an embodiment of the present invention;

[0022] Figure 6 Schematic diagram of the exploded structure of the nozzle structure used in the embodiment of the present invention;

[0023] Figure 7 yes Figure 5 A schematic diagram of the enlarged structure at A in the middle;

[0024] Figure 8 is a structural schematic diagram of a positioning plate assembly provided by an embodiment of the present invention;

[0025] Fig. 9 is a schematic diagram of the exploded structure of the positioning disk assembly provided by an embodiment of the present invention;

[0026] Fig.10 It is a schematic diagram of the positioning plate assembly provided by an embodiment of the present invention after removing the sealing bottom plate.

[0027] Description of reference numerals:

[0028] 100, swing arm mechanism; 200, positioning plate assembly; 300, swing arm drive unit; 400, rotation drive mechanism; 500, gas path rotary joint; 600, wireless slip ring assembly; 700, crystal fixing bracket;

[0029] 11. swing arm body; 111. crystal bonding end; 112. mounting end; 113. side surface; 114. bottom surface; 115. through hole; 116. inclined rib; 117. mounting hole; 12. nozzle structure; 121. main sleeve; 1211. first channel; 1212. first opening; 1213. second opening; 122. working assembly; 1221. nozzle guide rod; 1222. nozzle body; 1223 , second channel; 1224, anti-slip part; 123, elastic member; 124, elastic force adjustment member; 1241, third channel; 125, limit member; 126, installation end cover; 1261, fourth channel; 1262, pipeline connection column; 127, rotation positioning sleeve; 128, sealing structure; 13, nozzle drive unit; 14, transmission unit; 141, first pulley; 142, second pulley; 143, transmission belt;

[0030] 21. Main disk body; 22. Main cylinder body; 221. First mounting surface; 222. Second mounting surface; 223. Mounting groove; 224. Heat dissipation hole; 23. Mounting opening; 24. Sliding structure; 241. Sliding block; 2411. Main body; 2412. Connecting part; 242. Slide rail unit; 25. Connecting handle; 26. Controller; 27. Air circuit control group; 28. Sealed chassis; 281. Oil tank structure; 29. ​​First axis. DETAILED DESCRIPTION

[0031] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0032] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0033] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0034] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0035] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments.

[0036] Please refer to Figure 1 As shown, in an embodiment of the present invention, in the first aspect, a die bonding turret device is provided, the above-mentioned die bonding turret device includes a rotation drive mechanism 400, a positioning plate group 200, a swing arm drive unit 300 and a swing arm mechanism 100, the positioning plate group 200 has the freedom to rotate around a first axis, the positioning plate group 200 has a plurality of first mounting surfaces 221, and the plurality of first mounting surfaces 221 are evenly distributed around the first axis, the driving end of the rotation drive mechanism 400 is connected to the positioning plate group 200, and is used to drive the positioning plate group 200 to rotate around the first axis, the number of the swing arm mechanisms 100 is multiple, and the plurality of swing arm mechanisms 100 are respectively slidably mounted on the first mounting surfaces 221, and are used to absorb or place chips, the number of the swing arm drive units 300 is multiple, and they are arranged one by one with the swing arm mechanisms 100, and the plurality of swing arm drive units 300 are all arranged on the positioning plate group 200, and are used to drive the corresponding swing arm mechanisms 100 to reciprocate along the first axis direction.

[0037] Specifically, the rotary drive mechanism 400 refers to a component or assembly that can output torque and drive an object to rotate. The rotary drive mechanism 400 can be a component such as a motor or a hydraulic motor, and a heat sink and an ion fan and other heat dissipation components can also be arranged on the outside of the rotary drive mechanism 400. The positioning plate group 200 refers to a component or assembly with a certain volume. The positioning plate group 200 can be a block, a column or a combination of multiple shapes. The first mounting surface 221 refers to a surface structure arranged on the outer periphery of the positioning plate group 200. The first mounting surface 221 can be a plane structure or a curved surface structure. The swing arm mechanism 100 refers to a component structure with a certain length. One end of the swing arm mechanism 100 can be slidably connected to the first mounting surface 221 through a sliding structure 24. The other end of the swing arm mechanism 100 can be provided with a crystal absorption structure, for example, a chip can be absorbed by negative pressure or the negative pressure can be disconnected to place the chip. The swing arm drive unit 300 refers to a component that can drive an object to move in a straight line. The swing arm drive unit 300 can be a cylinder, a hydraulic cylinder or a voice coil motor.

[0038] The die-bonding turret device provided by the embodiment of the present invention connects the driving end of the rotary drive mechanism 400 to the positioning disk group 200, so that the positioning disk group 200 can rotate around the first axis under the action of the rotary drive mechanism 400. At the same time, the positioning disk group 200 has a plurality of first mounting surfaces 221 evenly distributed around the first axis, and a plurality of swing arm mechanisms 100 are slidably mounted on the first mounting surfaces 221, respectively. At the same time, a plurality of swing arm driving units 300 corresponding to the swing arm mechanisms 100 are also arranged on the positioning disk group 200. While the rotary drive mechanism 400 drives the positioning disk group 200 and the plurality of swing arm mechanisms 100 to rotate around the first axis, the swing arm driving unit 300 can also be used to drive the swing arm mechanism 100 to reciprocate along the first axis. Compared with the crystal bonding equipment in the prior art, the method of installing multiple swing arm mechanisms 100 on the positioning plate group 200 realizes the coordinated and continuous work between multiple workstations. Compared with the previous single-arm / single-arm two-arm structure, the number of swing arm mechanisms 100 is increased, and multiple first mounting surfaces 221 are evenly arranged around the first axis and are slidably connected to the first mounting surfaces 221, so that each swing arm mechanism 100 can rotate at the same angle each time, making the control of the swing arm assembly more convenient, reducing the movement angle of a single swing arm mechanism 100, and reducing the vibration of the swing arm mechanism 100 when moving the chip. In addition, it has multiple independent workstations that rotate continuously, and can continuously absorb the chips from the crystal supply position to the mounting substrate through multiple swing arm mechanisms 100 during operation, so that the efficiency of crystal bonding is effectively improved, and the crystal bonding efficiency reaches several times that of conventional crystal bonding equipment.

[0039] In one embodiment, see Figure 2 and Figure 3 The swing arm mechanism 100 includes a nozzle structure 12, a swing arm body 11 and a nozzle driving unit 13. The nozzle structure 12 is used to suck the chip through negative pressure. The swing arm body 11 has a crystal bonding end 111 and a mounting end 112 that are relatively arranged. The mounting end 112 is slidably connected to the first mounting surface 221. The nozzle structure 12 is rotatably arranged at the crystal bonding end 111 of the swing arm body 11. The nozzle driving unit 13 is arranged in the area of ​​the swing arm body 11 close to the mounting end 112, and is used to drive the nozzle structure 12 to rotate to adjust the chip. A transmission unit 14 is arranged between the nozzle driving unit 13 and the nozzle structure 12.

[0040] Specifically, the nozzle structure 12 refers to a component or assembly used to absorb and place the chip. The working principle of the nozzle structure 12 is that when working, the vacuum system generates negative pressure at the nozzle head through the internal channel of the nozzle. This negative pressure enables the nozzle to firmly absorb the chip, and when the chip needs to be placed, the chip can be separated from the nozzle structure 12 by disconnecting the connection with the vacuum system. The swing arm body 11 refers to a component with a certain length. The swing arm body 11 can be plate-shaped, columnar or strip-shaped, etc., and the swing arm body 11 can also be a combination of multiple shapes. The solid crystal end 111 and the mounting end 112 can refer to the two ends of the swing arm body 11 respectively, wherein the mounting end 112 can be connected to the driving end of the power unit by means of snap connection, fastener connection or plug-in, wherein the power unit can be a voice coil motor, etc. The solid crystal end 111 refers to the end of the swing arm body 11 away from the power unit, and a mounting hole 117 can be provided on the solid crystal end 111, so that the nozzle structure 12 can be rotatably set in the mounting hole 117. The nozzle drive unit 13 refers to a component or assembly that can output torque, and the nozzle drive unit 13 can be a private servo motor, etc. The transmission unit 14 refers to a structure or assembly that transmits power and motion, and the transmission unit 14 can adopt a transmission method such as a belt, a chain or a gear.

[0041] In this embodiment, by providing a swing arm body 11 having a crystal-fixing end 111 and a mounting end 112, and by connecting the mounting end 112 to the driving end of the power unit, the swing arm body 11 can be driven to move by the power unit. At the same time, the nozzle structure 12 can be rotatably arranged at the crystal-fixing end 111 of the swing arm body 11. In addition, a nozzle driving unit 13 is also arranged in the area of ​​the swing arm body 11 close to the mounting end 112, and a transmission unit 14 is also arranged between the driving end of the nozzle driving unit 13 and the nozzle structure 12. When performing crystal fixing, while the nozzle structure 12 moves with the swing arm body 11, the nozzle driving unit 13 can also drive the nozzle structure 12 to rotate, so that the offset of the chip can be corrected during crystal fixing, thereby ensuring the accuracy of crystal fixing. At the same time, the nozzle driving unit 13 and the nozzle structure 12 are both arranged on the swing arm body 11, so that the distance between the driving end of the nozzle driving unit 13 and the nozzle structure 12 will not change due to the movement or installation of the swing arm body 11, thereby making the transmission between the driving end of the nozzle driving unit 13 and the nozzle structure 12 more precise, thereby ensuring the rotation accuracy of the nozzle assembly during work and improving the accuracy of crystal bonding.

[0042] In one embodiment, see Figure 2 and Figure 3The swing arm body 11 includes a bottom portion 114 and two side portions 113 spaced apart from each other. The bottom portion 114 is connected between the two side portions 113. The two side portions 113 and the bottom portion 114 enclose an accommodation space. The driving ends of the transmission unit 14 and the nozzle driving unit 13 are both located in the accommodation space. The bottom portion 114 is a closed structure. A through hole 115 is provided on the side portion 113, and the through hole 115 is used to reduce the resistance of the swing arm body 11 when it rotates horizontally.

[0043] Specifically, the side surface portion 113 and the bottom surface portion 114 are both plate-like components with a certain thickness, and the bottom surface portion 114 and the side surface portion 113 may be an integrally formed structure. The bottom surface portion 114 and the side surface portion 113 may also be a separate structure, and the bottom surface portion 114 and the side surface portion 113 may be connected to form a whole by welding, fasteners, or clamping. The through hole 115 refers to a through-hole structure that allows an object or airflow to pass through, and the through holes 115 on the two side surfaces 113 may be arranged correspondingly.

[0044] In this embodiment, by arranging the two side portions 113 at intervals and connecting the bottom portion 114 between the two side portions 113, the two side portions 113 and the bottom portion 114 are surrounded by a receiving space, and the driving ends of the transmission unit 14 and the nozzle driving unit 13 can be located in the receiving space, so that the overall structure of the swing arm body 11 is more concise. At the same time, the bottom portion 114 is located in the bottom area of ​​the entire swing arm body 11 and the bottom portion 114 is a closed structure, and a through hole 115 is provided on the side portion 113, so that when the swing arm body 11 swings in a direction parallel to the bottom portion 114 (usually in the horizontal direction), the wind resistance of the swing arm body 11 can be reduced, making the rotation of the swing arm body 11 more convenient. At the same time, the disturbance caused by the movement of the swing arm body 11 on the blue film can be reduced, so that the jitter of the wafer blue film is smaller.

[0045] In an alternative embodiment, see Figure 2 and Figure 3 The bottom portion 114 and the two side portions 113 are all integrally formed structures. Specifically, the bottom portion 114 and the two side portions 113 can be integrally formed by machining, die casting or injection molding, which can make the overall strength of the swing arm body 11 better, thereby improving the stability of the solid crystal.

[0046] In another alternative embodiment, see Figure 2, support ribs are also provided between the two side portions 113. Specifically, the support ribs refer to components with a certain volume, and the support ribs may be block-shaped, plate-shaped, or strip-shaped. By providing support ribs on the two side portions 113, the overall strength of the swing arm body 11 can be improved. At the same time, an avoidance structure may be provided on the support ribs to prevent the support ribs from blocking the through holes 115 relatively arranged on the two side portions 113, so that the gas flow at the through holes 115 is smoother, thereby reducing the wind resistance encountered by the swing arm body 11 when it rotates horizontally, and also reducing the airflow generated when the swing arm body 11 rotates.

[0047] In one embodiment, see Figure 2 , the bottom portion 114 has an inclined rib 116 arranged along the length direction of the swing arm body 11, and the inclined rib 116 is located in the accommodating space. Specifically, the inclined rib 116 refers to a component with a certain volume, and the inclined rib 116 can be in the shape of a block, a plate, or a strip, etc. The provision of the inclined rib 116 increases the strength of the swing arm body 11 at the bottom portion 114, and also enhances the overall strength of the swing arm body 11. Similarly, an avoidance structure can be provided on the inclined rib 116 to prevent the inclined rib 116 from blocking the through holes 115 relatively arranged on the two side portions 113, so that the gas flow at the through holes 115 is smoother, thereby reducing the wind resistance of the swing arm body 11 during movement.

[0048] In one embodiment, see Figures 4 to 7 The nozzle structure 12 includes a main sleeve 121, a working assembly 122 and an elastic member 123. The main sleeve 121 is rotatably disposed at the end of the swing arm body 11. The main sleeve 121 has a first channel 1211. The first channel 1211 has a first opening 1212 and a second opening 1213. The working assembly 122 includes a nozzle guide rod 1221 and a nozzle body 1222. The first end of the nozzle guide rod 1221 is movably inserted into the first channel 1211. The second end of the nozzle guide rod 1221 is inserted into the first channel 1211. An opening 1212 extends outside the main sleeve 121, and the nozzle body 1222 is arranged at the second end of the nozzle guide rod 1221. The nozzle guide rod 1221 is provided with a second channel 1223 for connecting the nozzle body 1222 with the first channel 1211. The elastic member 123 is located in the first channel 1211, and the elastic member 123 abuts against the first end of the nozzle guide rod 1221. The elastic member 123 is used to deform when the nozzle body 1222 is squeezed to buffer the working component 122.

[0049] Specifically, the main sleeve 121 refers to a component with a certain length, and the main sleeve 121 may be columnar, rod-shaped, or block-shaped, etc. The first channel 1211 refers to a channel structure with a certain length, and the first channel 1211 may be arranged along the axial direction of the main sleeve 121, and the first channel 1211 may have a first opening 1212 and a second opening 1213 arranged opposite to the first opening 1212, wherein the first opening 1212 and the second opening 1213 may be located at two ends of the main sleeve 121, respectively.

[0050] The working component 122 refers to a component or part used to absorb the chip. The working component 122 includes a nozzle guide rod 1221 and a nozzle body 1222. The nozzle guide rod 1221 and the nozzle body 1222 can be split structures and can be fixed by means of snap connection, plug-in connection or bonding. The nozzle guide rod 1221 and the nozzle body 1222 can also be an integrated structure, that is, two different parts of the same component. The nozzle guide rod 1221 refers to a component with a certain length. The nozzle guide rod 1221 can be columnar, rod-shaped or block-shaped. The nozzle body 1222 refers to a component or component used to absorb an object. A suction port is provided on the nozzle body 1222. It usually uses a negative pressure (lower than atmospheric pressure) generated at the suction port to absorb the object or new product. The second channel 1223 also refers to a channel structure with a certain length. Both ends of the second channel 1223 are open. The second channel 1223 can be set along the axis direction of the nozzle guide rod 1221. Connecting the nozzle body 1222 with the first channel 1211 means connecting the suction port on the nozzle body 1222 with the first channel 1211 through the second channel 1223 .

[0051] The elastic member 123 refers to a component that can be elastically deformed when subjected to an external force, and the elastic member 123 usually has a certain length. The elastic member 123 can be a metal spring, a rubber column, or a nitrogen spring. At least a portion of the elastic member 123 abuts against the first end of the nozzle guide rod 1221, and the other portion is fixed by means of a clamping, abutting, or fastener connection, so that the elastic member 123 can be compressed after being subjected to a force, and exert a reaction force on the nozzle guide rod 1221.

[0052] In this embodiment, the main sleeve 121 is provided with a first channel 1211 arranged along the axial direction of the main sleeve 121, and the first channel 1211 has a first opening 1212 and a second opening 1213. When the working assembly 122 is assembled with the main sleeve 121, the first end of the nozzle guide rod 1221 can be movably inserted into the first channel 1211, and the second end of the nozzle guide rod 1221 extends to the outside of the main sleeve 121 through the first opening 1212, and the nozzle body 1222 is installed at the second end of the nozzle guide rod 1221, and the second channel 1223 for connecting the nozzle body 1222 with the first channel 1211 is also provided on the nozzle guide rod 1221. In addition, an elastic member 123 is provided in the first channel 1211, and the elastic member 123 abuts against the first end of the nozzle guide rod 1221, and is used for deforming when the nozzle body 1222 is squeezed, so as to buffer the overall movement of the working component 122, making crystal suction and crystal fixing safer.

[0053] When the crystal is sucked, the second opening 1213 on the main sleeve 121 can be connected to the external air circuit. At this time, a passage connecting the suction nozzle body 1222 and the external air circuit is formed through the first channel 1211 and the second channel 1223, so that negative pressure can be generated at the suction nozzle body 1222 to suck the chip. In addition, an elastic member 123 is also provided in the first channel 1211 to abut against the first end of the suction nozzle guide rod 1221. The elastic member 123 can be deformed when the suction nozzle body 1222 contacts the chip and is squeezed, so that the elastic member 123 can buffer the entire working component 122, thereby avoiding the problem that the suction nozzle is easy to damage the chip due to the movement inertia of the swing arm body 11, and improving the quality and accuracy of the solid crystal.

[0054] In addition, it should be noted that in this embodiment, by arranging the elastic member 123 in the first channel 1211, the overall volume of the entire nozzle structure 12 can be made smaller. At the same time, the elastic member 123 is arranged in the first channel 1211 to buffer the working component 122, so there is no need to set an additional buffer structure inside the working component 122, so that the overall structure of the working component 122 can be simpler, and the overall manufacturing cost and production cost of the working component 122 can be reduced.

[0055] In one embodiment, see Figure 6 and Figure 7, an elastic adjustment member 124 is provided at the second opening 1213, and the elastic adjustment member 124 has the freedom to move along the axis of the first channel 1211 relative to the main sleeve 121, one end of the elastic member 123 abuts against the elastic adjustment member 124, and the other end abuts against the nozzle guide rod 1221, and the elastic adjustment member 124 is used to adjust the initial compression of the elastic member 123 by changing its own position, and the elastic adjustment member 124 has a third channel 1241 for connecting the first channel 1211 with the outside. Specifically, the elastic adjustment member 124 refers to a component with a certain volume, and the elastic adjustment member 124 can be completely located in the first channel 1211, or only partially located in the first channel 1211. The elastic adjustment member 124 can be connected by sliding or threaded connection, so that it can be installed while having the freedom to move along the axis of the main sleeve 121.

[0056] During operation, the elastic member 123 is generally in a compressed state, wherein the initial compression of the elastic member 123 refers to the length of the elastic member 123 compressed when the nozzle guide rod 1221 is not subjected to the extrusion force. The initial compression of the elastic member 123 is different. When the elastic member 123 is compressed again by the same distance based on the initial compression, the force applied by the elastic member 123 to the nozzle guide rod 1221 will also be different. When the nozzle body 1222 contacts the chip, the force applied by the nozzle body 1222 to the chip will also be different. When the elastic force adjustment member 124 moves toward the nozzle guide rod 1221, the initial compression of the elastic member 123 increases. At this time, the force applied by the elastic member 123 to the nozzle guide rod 1221 will increase. When the nozzle body 1222 contacts the chip, the force applied by the nozzle body 1222 to the chip will also increase. After the elastic force adjusting member 124 moves away from the nozzle guide rod 1221, the initial compression amount of the elastic member 123 decreases, the force exerted by the elastic member 123 on the nozzle guide rod 1221 decreases, and the force exerted by the nozzle body 1222 on the chip when the nozzle body 1222 contacts the chip also decreases. The third channel 1241 refers to a channel structure with a certain length, and the third channel 1241 is set through the elastic force adjusting member 124.

[0057] In this embodiment, the elastic force adjusting member 124 is arranged at the second opening 1213, and the elastic member 123 is located between the elastic force adjusting member 124 and the first end of the working assembly 122, and the elastic force adjusting member 124 has the freedom to move along the axial direction of the main sleeve 121 relative to the main sleeve 121. The position of the elastic force adjusting member 124 can be adjusted along the axial direction of the main sleeve 121, so that the initial compression amount of the elastic member 123 can be adjusted, and then the elastic force of the elastic member 123 when working can be adjusted, so that the extrusion force applied by the suction nozzle to the chip when it contacts the chip, that is, the crystal bonding force, can be controlled, making the suction nozzle structure 12 more convenient to use. At the same time, a third channel 1241 is also arranged on the elastic force adjusting member 124, and the second opening 1213 is connected to the outside through the third channel 1241. On the premise of realizing the torque adjustment of the elastic member 123 by the elastic force adjusting member 124, it is possible to avoid the elastic force adjusting member 124 affecting the connection between the second opening 1213 and the external air path.

[0058] In addition, by setting the elastic adjustment member 124 at the second opening 1213, the second opening 1213 is located in the end area of ​​the main sleeve 121. After the main sleeve 121 is installed, the second opening 1213 and the elastic adjustment member 124 are usually located at the topmost position of the main sleeve 121, avoiding the elastic adjustment member 124 from being blocked by other components, thereby making it easier to adjust the force of the elastic member 123.

[0059] In one embodiment, see Figure 7 , the elastic adjustment member 124 is connected to the inner wall of the first channel 1211 by threads. Specifically, the elastic adjustment member 124 is connected to the inner wall of the first channel 1211 by threads, so that the installation of the elastic adjustment member 124 can be more secure and reliable. When the position of the elastic adjustment member 124 needs to be adjusted, by rotating the elastic adjustment member 124 along its own axis, the elastic adjustment member 124 can be moved along the axis of the main sleeve 121 under the action of the threads, so that the position adjustment of the elastic adjustment member 124 is more convenient and more accurate.

[0060] In one embodiment, see Figure 6 The second end of the nozzle guide rod 1221 is detachably connected to the nozzle body 1222. By detachably connecting the nozzle body 1222 and the nozzle guide rod 1221, after the working component 122 has been used for a long time, only the nozzle body 1222 that is prone to wear needs to be replaced, thereby reducing the cost loss in the production process.

[0061] In one embodiment, see Figure 5 and Figure 6The first opening 1212 is also provided with a disassembled limiter 125, on which a avoidance structure is provided, and the avoidance structure is used to allow the nozzle guide rod 1221 to pass through the limiter 125, and an anti-slip portion 1224 is provided at the first end of the nozzle guide rod 1221, and the anti-slip portion 1224 is used to cooperate with the limiter 125 to prevent the first end of the nozzle guide rod 1221 from slipping out of the first channel 1211. Specifically, the limiter 125 refers to a component with a certain volume, and the limiter 125 may be block-shaped, column-shaped, or rod-shaped. The avoidance structure refers to a structure used to avoid other objects, and the avoidance structure may be an avoidance hole, an avoidance groove, or an avoidance opening. The anti-slip portion 1224 also refers to a component with a certain volume, and the anti-slip portion 1224 may be block-shaped, column-shaped, or plate-shaped. In this embodiment, the limit piece 125 is disassembled and set at the first opening 1212, and an avoidance structure is set on the limit piece 125, and an anti-slip portion 1224 is set at the first end of the nozzle guide rod 1221. When the nozzle guide rod 1221 is installed, the nozzle guide rod 1221 can pass through the avoidance structure to achieve relative movement with the limit piece 125, and then the limit piece 125 is installed to the first opening 1212, so that the anti-slip portion 1224 is blocked by the limit piece 125, and the purpose of preventing the first end of the nozzle guide rod 1221 from slipping out of the first channel 1211 is achieved without affecting the movement of the nozzle guide rod 1221, so that the installation of the nozzle guide rod 1221 is more stable, and the stability of the nozzle structure 12 is also improved.

[0062] In one embodiment, see Figure 5 and Figure 6 , a mounting end cover 126 is also fixedly provided on the swing arm body 11, a sealing structure 128 is provided between the main sleeve 121 and the mounting end cover 126, the main sleeve 121 is sealed and connected to the mounting end cover 126 through the sealing structure 128 and can rotate relatively, and a fourth channel 1261 is also provided on the mounting end cover 126, and the fourth channel 1261 is used to connect the second opening 1213 with the external air path. Specifically, the mounting end cover 126 refers to a component with a certain volume, and the mounting end cover 126 can be fixedly installed on the swing arm body 11 by means of snap connection, welding or fastener connection. The fourth channel 1261 refers to a channel structure with a certain length, one end opening of the fourth channel 1261 can be connected to the second opening 1213, and the other end opening is used for external air path communication. The sealing structure 128 refers to a structure or component that can seal the connection area of ​​two components, wherein the sealing structure 128 can be a sealing ring, a sealing bearing or a sealing gasket, etc.

[0063] In this embodiment, by rotating the main sleeve 121 to the swing arm body 11, the angle of the crystal can be fine-tuned by rotating the main sleeve 121 during the crystal absorption operation, so that the position and posture of the chip during crystal bonding are more accurate, and the crystal bonding is also more accurate. At the same time, the mounting end cover 126 is fixed to the swing arm body 11, and the mounting end cover 126 is also provided with a fourth channel 1261, which is used to connect the second opening 1213 with the external air path, so that the main sleeve 121 can still be connected to the external air path through the fourth channel 1261 while rotating. In addition, a sealing structure 128 is provided between the main sleeve 121 and the mounting end cover 126, so that the main sleeve 121 can also maintain a sealed connection with the mounting end cover 126 during the rotation process, so that the sealing performance of the connection between the fourth channel 1261 and the second opening 1213 is better.

[0064] In an alternative embodiment, see Figure 7 The sealing structure 128 includes a sealing ring, which is arranged around the axis of the main sleeve 121. Specifically, the sealing ring refers to an annular component with a certain elasticity, and the sealing ring can be made of rubber. The sealing ring can be sleeved on the outside of the main sleeve 121, and extrusion surfaces are provided on the outside of the main sleeve 121 and the mounting end cover 126. The sealing ring is pressed and fixed by the two extrusion surfaces to achieve a static sealing connection and a dynamic sealing connection between the main sleeve 121 and the mounting end cover 126.

[0065] In another alternative embodiment, see Figure 7 , an accommodating groove is also provided on the installation end cover 126, and the first end of the main sleeve 121 can be extended into the accommodating groove, and the second opening 1213 is provided at the first end of the main sleeve 121, and one end opening of the fourth channel 1261 is provided at the bottom of the accommodating groove. At the same time, a sealing ring can be arranged around the mouth of the accommodating groove, so that the first channel 1211 and the fourth channel 1261 are more convenient to connect, and the second opening 1213 and the fourth channel 1261 are better sealed, so that the installation of the main sleeve 121 and the installation end cover 126 is more stable.

[0066] In one embodiment, see Figure 6, a pipeline connection column 1262 is provided on the mounting end cover 126, and the pipeline connection column 1262 is used for plugging and matching with the connecting pipe, and the fourth channel 1261 runs through the mounting end cover 126 and the pipeline connection column 1262, and the fourth channel 1261 is arranged along the axial direction of the pipeline connection column 1262. Specifically, the pipeline connection column 1262 refers to a component with a certain height, and the pipeline connection column 1262 can be columnar, rod-shaped or block-shaped. In this embodiment, by providing the pipeline connection column 1262 on the mounting end cover 126, and the fourth channel 1261 runs through the mounting end cover 126 and the pipeline connection column 1262, when the fourth channel 1261 is connected to the external gas circuit, the pipeline in the external gas circuit can be sleeved on the outside of the pipeline connection column 1262, so that the fourth channel 1261 can be connected to the external gas circuit more firmly and stably, thereby improving the stability and safety of the nozzle structure 12.

[0067] In one embodiment, see Figure 2 and Figure 4 The transmission unit 14 includes a first pulley 141, a second pulley 142 and a transmission belt 143. The first pulley 141 is disposed on the main sleeve 121, and the first pulley 141 and the main sleeve 121 are coaxially disposed. The second pulley 142 is disposed on the driving end of the nozzle driving unit 13, and the transmission belt 143 is wound around the outside of the first pulley 141 and the second pulley 142. Specifically, the first pulley 141 and the second pulley 142 are both disc-shaped components with a certain diameter. The transmission belt 143 is a flexible component that is annular as a whole. In this embodiment, the first pulley 141 is arranged coaxially with the main sleeve 121, the second pulley 142 is arranged on the driving end of the nozzle drive unit 13, and the transmission belt 143 is simultaneously wound around the outside of the first pulley 141 and the second pulley 142. The torque output by the nozzle drive unit 13 can be transmitted to the main sleeve 121 through the transmission belt 143, thereby driving the main sleeve 121 to rotate, making the overall adjustment of the nozzle structure 12 more convenient.

[0068] In an alternative embodiment, see Figure 4 The first pulley 141 and the main sleeve 121 are an integrally formed structure. By integrally forming the first pulley 141 and the main sleeve 121, the structural position of the main sleeve 121 can be reasonably arranged, and the length of the nozzle surface hanging out of the swing arm body 11 can be reduced, thereby improving the accuracy of the nozzle structure 12 during crystal suction and crystal bonding.

[0069] In one embodiment, see Figure 6The swing arm body 11 is provided with a mounting hole 117, the main sleeve 121 is rotatably arranged in the mounting hole 117, and a rotation positioning sleeve 127 is provided on the outside of the main sleeve 121, the outer ring of the rotation positioning sleeve 127 is in contact with the inner wall of the mounting hole 117, and there are two rotation positioning sleeves 127, which are respectively located on both sides of the first pulley 141. Specifically, the rotation positioning sleeve 127 refers to a sleeve-shaped component with a certain length, and the swing arm body 11 is usually provided with a mounting hole 117 for mounting and accommodating the main sleeve 121, and the rotation positioning sleeve 127 is located between the inner wall of the mounting hole 117 and the outer surface of the main sleeve 121, and the rotation positioning sleeve 127 can limit the position of the main sleeve 121 along its own radial direction, so that the installation position of the main sleeve 121 along its own radial direction is more accurate. The two rotating positioning sleeves 127 are respectively located on both sides of the transmission structure to limit the main sleeve body 121 along the axial direction of the main sleeve body 121, so that the installation of the main sleeve body 121 along its own axial direction is more stable, thereby improving the stability of the nozzle structure 12.

[0070] In an alternative embodiment, see Figure 5 and Figure 6 The rotating positioning sleeve 127 can be a rotating bearing, the inner ring of the rotating bearing is sleeved on the outer surface of the main sleeve body 121, and the outer ring of the rotating bearing abuts against the inner wall of the mounting hole 117 on the swing arm body 11. By setting the rotating bearing, the rotation of the main sleeve body 121 can be more flexible and convenient.

[0071] In one embodiment, see Figure 1 and Figure 8, a sliding structure 24 is provided between the swing arm mechanism 100 and the positioning plate group 200, and the sliding structure 24 includes a sliding block 241 and a slide rail unit 242. The sliding block 241 is slidably provided on the first mounting surface 221 through the slide rail unit 242, the swing arm mechanism 100 is fixedly installed on the sliding block 241, and the driving end of the swing arm driving unit 300 is connected to the sliding block 241. Specifically, the sliding structure 24 refers to a component used to connect two objects so that the two objects can slide relative to each other. The sliding block 241 refers to a component with a certain volume, and the sliding block 241 can be a block, a plate, or a combination of multiple shapes. The slide rail unit 242 refers to a component or component used to connect two components so that the two components can slide relative to each other. For example, the slide rail unit 242 can adopt a cross rail, which is a high-precision linear motion guide device composed of two guide rails with V-shaped raceways, a roller cage, a cylindrical roller, etc. In this embodiment, a sliding structure 24 is provided between the swing arm mechanism 100 and the first mounting surface 221 of the positioning plate assembly 200, and the sliding structure 24 includes a sliding block 241 and a slide rail unit 242, and the driving end of the swing arm driving unit 300 is connected to the sliding block 241, so that the swing arm mechanism 100 can slide more conveniently along the first axis direction.

[0072] In one embodiment, see Figures 8 to 10 The interior of the positioning plate group 200 is a hollow structure, and the plurality of swing arm drive units 300 are all located in the positioning plate group 200, and at least a portion of the sliding block 241 extends into the positioning plate group 200 and is connected to the drive end of the swing arm drive unit 300. Specifically, the interior of the positioning plate group 200 is a hollow structure, which means that a receiving space is also provided inside the positioning plate group 200, so that the interior of the positioning plate group 200 can receive objects. The swing arm drive unit 300 can be connected to the inner wall of the positioning plate group 200 by means of a snap connection or a fastener connection. In this embodiment, by setting the interior of the positioning plate group 200 as a hollow structure, and locating multiple swing arm drive units 300 inside the positioning plate group 200, and extending at least a portion of the sliding block 241 into the interior of the positioning plate group 200 and connected to the driving end of the swing arm drive unit 300, the swing arm drive unit 300 can be installed as close to the first axis as possible, so that the overall weight of the positioning plate group 200 and the swing arm drive unit 300 can be concentrated in the direction close to the first axis, thereby reducing the rotational inertia of the positioning plate group 200, making the stopping position of the swing arm mechanism 100 more accurate, and improving the crystal bonding accuracy of the crystal bonding equipment.

[0073] In an alternative embodiment, see Fig.10The sliding block 241 includes a main body 2411 and a connecting portion 2412. The main body 2411 is slidably connected to the first mounting surface 221, and the connecting portion 2412 is connected between the main body 2411 and the driving end of the swing arm driving unit 300. Specifically, the main body 2411 and the connecting portion 2412 both refer to components with a certain volume. The main body 2411 and the connecting portion 2412 can be block-shaped, plate-shaped, or a combination of multiple shapes. The main body 2411 and the connecting portion 2412 can be an integral structure, such as made by machining or casting. The main body 2411 and the connecting portion 2412 can also be a split structure, such as the main body 2411 and the connecting portion 2412 can be connected by plugging, welding, or fastener connection. In this embodiment, an avoidance opening for avoiding the connection part 2412 can be set on the positioning plate assembly 200. When the main body 2411 needs to be connected to the driving end of the swing arm driving unit 300, the connection part 2412 can pass through the avoidance opening to connect to the driving structure.

[0074] In one embodiment, see Fig. 9 and Fig.10 The side of the positioning disk assembly 200 facing away from the driving end of the rotary drive mechanism 400 is provided with an installation opening 23, and the installation opening 23 is used to connect the internal space of the positioning disk assembly 200 with the outside, and a sealing chassis 28 is also provided at the installation opening 23. Specifically, the installation opening 23 refers to an opening structure with a certain area, and the shape of the opening structure can be a circle, a regular polygon or other shapes. The sealing chassis 28 refers to a plate-like component with a certain area, and the shape of the sealing chassis 28 can match the shape of the installation opening 23. The sealing chassis 28 can be detachably connected with the positioning disk assembly 200 by means of snap connection, plug-in connection or fastener connection. In this embodiment, by providing an installation opening 23 on the positioning plate group 200, it can be more convenient to install the swing arm drive unit 300 into the interior of the positioning plate group 200. At the same time, a sealing chassis 28 is also provided at the installation opening 23. After the components inside the positioning plate group 200 are installed, the installation opening 23 can be sealed through the sealing chassis 28 to prevent other components from entering the interior of the positioning plate group 200 through the installation opening 23, making the use of the positioning plate group 200 safer.

[0075] In an alternative embodiment, see Fig. 9A support connection block is provided between the sealing chassis 28 and the positioning disk assembly 200. Specifically, the support connection block refers to a component with a certain volume, and the support connection block can be a block, column or plate structure. By providing the support connection block between the sealing chassis 28 and the positioning disk assembly 200, a clearance gap can be formed between the sealing chassis 28 and the positioning disk assembly 200 after installation, so that at least part of the sliding block 241 can extend through the clearance gap into the positioning disk assembly 200 and connect with the driving end of the swing arm driving unit 300, thereby avoiding the damage to the strength of the positioning disk assembly 200 caused by the avoidance structure provided on the positioning disk assembly 200, and ensuring the strength of the positioning disk assembly 200 while ensuring that the sliding block 241 is more conveniently connected to the swing arm driving unit 300.

[0076] In one embodiment, see Fig. 9 , a plurality of oil groove structures 281 are provided on the side of the sealing chassis 28 facing the positioning plate assembly 200, and the oil groove structures 281 are used to accommodate foreign objects dropped from the slide rail unit 242, and the plurality of oil groove structures 281 are respectively located in the lower area of ​​the slide rail unit 242 along the first axis direction. Specifically, the oil groove structure 281 refers to a accommodating structure with a certain space, wherein the oil groove structure 281 can be a groove structure, a guide groove, etc. In this embodiment, by arranging the cross rail between the sliding block 241 and the first mounting surface 221, the sliding of the sliding block 241 can be made more convenient, and the sliding of the sliding block 241 can also be made more stable and precise. At the same time, a plurality of oil groove structures 281 for accommodating foreign objects dropped from the slide rail unit 242, such as lubricating oil dropped from the slide rail unit 242, are arranged on the side of the sealing chassis 28 facing the positioning plate assembly 200. The plurality of oil groove structures 281 are all located in the lower area of ​​the slide rail unit 242 along the first axis direction, that is, directly below the slide rail unit 242. This can prevent oil stains or foreign objects from dropping onto the chip during operation, making the die bonding of the die bonding machine safer and more reliable.

[0077] In an alternative embodiment, see Figures 9 and 10A plurality of mounting grooves 223 are arranged on the outer circumference of the positioning plate assembly 200. The plurality of mounting grooves 223 are evenly distributed around the first axis, and the depth directions of the plurality of mounting grooves 223 are arranged along a direction perpendicular to the first axis, and the first mounting surface 221 is located on the bottom surface of the mounting groove 223. Specifically, the mounting groove 223 refers to a groove structure with a certain depth. By arranging a plurality of mounting grooves 223 on the outer circumference of the positioning plate assembly 200, and the first mounting surface 221 is located on the bottom surface of the mounting groove 223, the position where the sliding block 241 and the slide rail unit 242 are installed can be as close to the first axis as possible, so that the overall weight of the entire positioning plate mechanism can be concentrated in the direction close to the first axis, so that the inertia of the positioning plate assembly 200 during rotation can be reduced, and then the swing arm mechanism 100 can stop at a more accurate position after moving into position, thereby improving the accuracy of the solid crystal.

[0078] In one embodiment, see Fig.10 The positioning plate mechanism also includes a controller 26, which is used to control the working state of the electrical components on the positioning plate group 200. The controller 26 is fixed to the inner wall of the positioning plate group 200, and the center of gravity of the controller 26 is located on the first axis. Specifically, the controller 26 refers to a device for controlling the operation of other devices or electrical components, wherein in this embodiment, it refers to the controller 26 in a physical sense, and the controller 26 itself has a certain volume and weight. The controller 26 can be a PLC (Programmable Logic Controller), an MCU (Micro-Controller Unit) or a DCS (Distributed Control System). The controller 26 can be fixed inside the positioning plate group 200 by means of snap connection, bonding or fastener connection. By locating the center of gravity of the controller 26 on the first axis, the overall weight of the positioning plate group 200 and the controller 26 can be close to the first axis after the controller 26 is installed, so that the rotation of the positioning plate group 200 can be more stable, and the rotational inertia of the positioning plate group 200 can also be reduced, thereby improving the accuracy of the solid crystal.

[0079] In one embodiment, see Figure 8 and Fig. 9, the outer circumference of the positioning plate group 200 is provided with a second mounting surface 222, the second mounting surface 222 is located between the two first mounting surfaces 221, the number of the second mounting surfaces 222 is multiple, and the multiple second mounting surfaces 222 are also evenly distributed around the first axis. Specifically, the second mounting surface 222 refers to a surface structure with a certain area, and the second mounting surface 222 can be a plane structure, or a curved surface structure. In this embodiment, by providing multiple second mounting surfaces 222 on the outer circumference of the positioning plate group 200, the swing arm mechanism 100 can be installed on the first mounting surface 221, and other components, such as the air path control group 27, can be installed on the second mounting surface 222, so that the integration of the entire positioning plate mechanism is higher. And the multiple second mounting surfaces 222 are also evenly distributed around the first axis, and the second mounting surfaces 222 are located between the two first mounting surfaces 221, and the two are arranged alternately in sequence. The components installed on the second mounting surface 222 can also be evenly distributed around the first axis, thereby improving the stability of the positioning plate group 200 when rotating.

[0080] In an alternative embodiment, see Fig.10 , heat dissipation holes 224 for airflow can also be provided on the second mounting surface 222, and heat dissipation holes 224 for airflow can be provided on the sealing chassis 28. The heat dissipation holes 224 refer to a through-hole structure provided through an object, and the number of heat dissipation holes 224 is usually multiple, and the multiple heat dissipation holes 224 are evenly distributed in a designated area. By providing heat dissipation holes 224 on the second mounting surface 222 and the sealing chassis 28, the interior of the positioning plate assembly 200 can exchange airflow with the outside, avoiding overheating of the components installed inside the positioning plate assembly 200 due to heat accumulation, making the components located inside the positioning plate assembly 200 safer to use, and thus making the use of the entire positioning plate mechanism safer and more reliable.

[0081] In one embodiment, see Figure 8 and Fig. 9 , an air circuit control group 27 is provided on the second mounting surface 222, and the air circuit control group 27 is used to control the connection and disconnection of the air circuit at the suction nozzle structure 12. Specifically, the air circuit control group 27 refers to a component or assembly used to control the connection and disconnection of the air circuit, and the air circuit control group 27 may include components such as a solenoid valve. In this embodiment, by providing the air circuit control group 27 on the second mounting surface 222, and connecting the control end of the air circuit control group 27 to the controller 26, the suction nozzle structure 12 on each swing arm mechanism 100 can be controlled more conveniently, and the weight distribution of the positioning plate group 200 in the direction around the first axis after the air circuit control group 27 is installed can be kept balanced, so that the rotation of the positioning plate group 200 is more stable.

[0082] In one embodiment, see Figure 8The positioning disk assembly 200 includes a main disk body 21 and a main cylinder body portion 22. The main disk body 21 is covered at the end of the main cylinder body portion 22. The first mounting surface 221 is located at the outer periphery of the main cylinder body portion 22 and is evenly distributed around the axis of the main cylinder body portion 22. Specifically, the main disk body 21 refers to a plate-like structure with a certain area. One side of the main disk body 21 is used to connect with the driving end of the rotating drive mechanism 400, and the other side of the main disk body 21 abuts against an opening of the main cylinder body portion 22. The main cylinder body portion 22 refers to a cylindrical component with a certain height, which is formed by surrounding the plate-like component. The main disk body 21 and the main cylinder body portion 22 can be integrally formed, for example, by die casting, machining or casting, so that the overall strength of the positioning disk assembly 200 is better. The main disk body 21 and the main cylinder body portion 22 can also be a split structure. The main disk body 21 and the main cylinder body portion 22 can be connected to each other by welding, fastener connection or clamping, etc., which can reduce the manufacturing cost. In this embodiment, the main disk body 21 is covered on the end of the main cylinder body 22 to form a positioning disk assembly 200, and the first mounting surface 221 is located on the outer periphery of the main cylinder body 22 and evenly distributed around the axis of the main cylinder body 22, so that the structure of the entire positioning disk assembly 200 can be simpler.

[0083] In an alternative embodiment, see Figure 8 and Fig. 9 A connecting handle 25 is also provided on the side of the main disk body 21 away from the main cylinder body 22. The first end of the connecting handle 25 is used to connect with the driving end of the rotation drive mechanism 400, and the second end of the connecting handle 25 is connected to the side of the main disk body 21. The second end of the connecting handle 25 can be connected to the main disk body 21 by means of snap connection, plug connection or fasteners. Specifically, the connecting handle 25 refers to a component with a certain length, and the connecting handle 25 can be columnar or block-shaped. By providing the connecting handle 25 on the side of the main disk body 21 away from the main cylinder body 22, the connection between the positioning disk assembly 200 and the rotation drive mechanism 400 can be more convenient and more secure.

[0084] In one embodiment, see Figure 8 , the cross section of the main cylinder body 22 is a regular polygon, and the shape of the main disk body 21 matches the cross section of the main cylinder body 22. Specifically, the regular polygon can be a hexagon. By making the cross section of the main cylinder body 22 a regular polygon and matching the shape of the main disk body 21 with the cross section of the main cylinder body 22, the first mounting surface 221 and the second mounting surface 222 can be both arranged outside the main cylinder body 22, so that the first mounting surface 221 and the second mounting surface 222 can both be planar structures, thereby making the installation of the swing arm structure or other components more convenient. The cross section of the main cylinder body 22 is a regular polygon, which also makes the overall strength of the main cylinder body 22 better.

[0085] In an alternative embodiment, see Figure 1 The crystal bonding turret device may also include an air circuit rotary joint 500 and a wireless slip ring assembly 600. When the positioning disk assembly 200 and the swing arm mechanism 100 rotate, the air circuits on the positioning disk assembly 200 and the swing arm mechanism 100 may be connected to the outside through the air circuit rotary joint 500. The electrical components (such as the controller 26 or the solenoid valve, etc.) on the positioning disk assembly 200 and the swing arm mechanism 100 may also be electrically connected to the external main control unit through the wireless slip ring assembly 600, making the use and control of the crystal bonding turret device more convenient. The specific structures of the air circuit rotary joint 500 and the wireless slip ring assembly 600 are conventional technical means in the prior art and will not be described in detail here.

[0086] In a second aspect, a die bonding device is provided, comprising any of the above-mentioned die bonding turret devices. It can be understood that the beneficial effects of the above-mentioned second aspect can refer to the relevant description in the first aspect.

[0087] In an optional embodiment, the crystal bonding turret device can be set on the base, and an image acquisition unit can also be set on the base. The image acquisition unit is located on the movement path of the suction nozzle structure 12 on the swing arm mechanism 100. The image acquisition unit is used to capture the chip status during transportation, wherein the chip status includes the rotation angle of the chip, etc., and transmit the chip status data to the controller 26, so that the suction nozzle angle and the rotation angle of the chip are adjusted by the suction nozzle driving unit 13, thereby improving the accuracy of crystal bonding.

[0088] The image acquisition unit may use a CCD (Charge-coupled Device) camera, and adopt a static flying shooting method to improve shooting efficiency and make the image clearer.

[0089] The above are only preferred embodiments of the present invention, and only specifically describe the technical principles of the present invention. These descriptions are only for explaining the principles of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations here, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention, and other specific implementations of the present invention that can be associated with by technicians in this field without creative labor, should be included in the scope of protection of the present invention.

Claims

1. A crystal bonding turret device, characterized in that: It includes a rotation drive mechanism, a positioning plate group, a swing arm drive unit and a swing arm mechanism, the positioning plate group has the freedom to rotate around a first axis, the positioning plate group has multiple first mounting surfaces, and the multiple first mounting surfaces are evenly distributed around the first axis, the driving end of the rotation drive mechanism is connected to the positioning plate group, and is used to drive the positioning plate group to rotate around the first axis, the number of the swing arm mechanisms is multiple, and the multiple swing arm mechanisms are respectively slidably installed on the first mounting surfaces, and are used to absorb or place chips, the number of the swing arm drive units is multiple, and they are arranged one by one with the swing arm mechanisms, and the multiple swing arm drive units are all arranged on the positioning plate group, and are used to drive the corresponding swing arm mechanisms to reciprocate along the first axis direction.

2. The crystal bonding turret device according to claim 1, characterized in that: The swing arm mechanism includes a nozzle structure, a swing arm body and a nozzle driving unit. The nozzle structure is used to suck chips through negative pressure. The swing arm body has a crystal bonding end and a mounting end that are relatively arranged. The mounting end is slidably connected to the first mounting surface. The nozzle structure is rotatably arranged at the crystal bonding end of the swing arm body. The nozzle driving unit is arranged in the area of ​​the swing arm body close to the mounting end, and is used to drive the nozzle structure to rotate to adjust the chip. A transmission unit is arranged between the nozzle driving unit and the nozzle structure.

3. The crystal bonding turret device according to claim 2, characterized in that: The swing arm body includes a bottom portion and two side portions spaced apart from each other, the bottom portion is connected between the two side portions, the two side portions and the bottom portion enclose a accommodating space, the driving ends of the transmission unit and the suction nozzle driving unit are both located in the accommodating space, the bottom portion is a closed structure, and the side portions are further provided with through holes, and the through holes are used to reduce the resistance of the swing arm body when it rotates horizontally.

4. The crystal bonding turret device according to claim 2, characterized in that: The suction nozzle structure includes a main sleeve, a working component and an elastic member, the main sleeve is rotatably arranged at the end of the swing arm body, the main sleeve has a first channel, the first channel has a first opening and a second opening, the working component includes a suction nozzle guide rod and a suction nozzle body, the first end of the suction nozzle guide rod is movably inserted in the first channel, the second end of the suction nozzle guide rod extends outside the main sleeve through the first opening, the suction nozzle body is arranged at the second end of the suction nozzle guide rod, the suction nozzle body is used to adsorb chips, and the suction nozzle guide rod is provided with a second channel for connecting the suction nozzle body with the first channel, the elastic member is located in the first channel, the elastic member abuts against the first end of the suction nozzle guide rod, and the elastic member is used to deform when the suction nozzle body is squeezed to buffer the working component.

5. The crystal bonding turret device according to claim 4, characterized in that: An elastic adjusting piece is provided at the second opening. The elastic adjusting piece has the freedom to move along the axis of the first channel relative to the main sleeve. One end of the elastic piece abuts against the elastic adjusting piece, and the other end abuts against the nozzle guide rod. The elastic adjusting piece is used to adjust the initial compression amount of the elastic piece by changing its own position. The elastic adjusting piece has a third channel for connecting the first channel with the outside.

6. The crystal bonding turret device according to claim 5, characterized in that: A mounting end cover is also fixedly provided on the swing arm body, a sealing structure is provided between the main sleeve and the mounting end cover, the main sleeve is sealed and connected to the mounting end cover through the sealing structure and can rotate relatively, and a fourth channel is also provided on the mounting end cover, and the fourth channel is used to connect the second opening with the external air path.

7. The crystal bonding turret device according to claim 1, characterized in that: A sliding structure is provided between the swing arm mechanism and the positioning plate group, and the sliding structure includes a sliding block and a slide rail unit. The sliding block is slidably arranged on the first mounting surface through the slide rail unit, the swing arm mechanism is fixedly installed on the sliding block, and the driving end of the swing arm driving unit is connected to the sliding block.

8. The crystal bonding turret device according to claim 7, characterized in that: The interior of the positioning plate group is a hollow structure, the plurality of swing arm driving units are all located in the positioning plate group, and at least a portion of the sliding block extends into the positioning plate group and is connected to the driving end of the swing arm driving unit.

9. The crystal bonding turret device according to claim 8, characterized in that: A mounting opening is provided on the side of the positioning disc assembly away from the driving end of the rotary drive mechanism, and the mounting opening is used to connect the internal space of the positioning disc assembly with the outside. A sealing bottom plate is also provided at the mounting opening for disassembly of the cover.

10. A die bonding device, characterized in that: It comprises the crystal bonding turret device as described in any one of claims 1 to 9.

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