A die bonder and a die bonding method

Abstract

The present invention relates to the technical field of chip mounting, and particularly relates to a die bonder and a die bonding method. The die bonder includes a track device, a feeding device, an adhesive device, a mounting device, a chip supply device, and a discharging device; the feeding device and the discharging device are respectively arranged at two ends of the track device in the length direction; the adhesive device is arranged at one end of the side of the track device close to the feeding device; the mounting device is arranged at one end of the side of the track device close to the discharging device, the mounting device and the adhesive device are located on the same side of the track device, and the mounting device includes a vision positioning member and a mounting member which are independently arranged; the chip supply device is arranged on the other side of the track device and corresponds to the mounting device. The die bonder provided by the present invention has a compact structure, reduces the moving distance of each link, and improves the mounting efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of chip mounting, and particularly relates to a die bonder and a die bonding method. Background Art

[0002] Currently, the manufacturing of electronic products has increasingly higher requirements for the die bonding process, pursuing higher precision and speed. However, most of the existing die bonding equipment has problems such as single function and low efficiency. Traditional die bonders usually can only perform a single soldering or bonding operation, and manual adjustment is required when changing products, which is not only time-consuming and laborious, but also prone to introducing errors. In addition, the existing equipment is often not compact enough in layout, occupying a large space and being unfavorable for the efficient layout of the production line. Summary of the Invention

[0003] In order to solve the problems of the large volume and low mounting efficiency of the existing die bonding equipment, the present invention provides a die bonder and a die bonding method.

[0004] To solve the above technical problems, the present invention provides the following technical solution: A die bonder includes a track device, a feeding device, an adhesive device, a mounting device, a chip supply device, and a discharging device; the feeding device and the discharging device are respectively arranged at both ends of the length direction of the track device; the adhesive device is arranged at one end of the side of the track device close to the feeding device; the mounting device is arranged at one end of the side of the track device close to the discharging device, the mounting device and the adhesive device are located on the same side of the track device, and the mounting device includes a vision positioning member and a mounting member that are independently arranged; the chip supply device is arranged on the other side of the track device and corresponds to the mounting device.

[0005] Preferably, the adhesive device includes a dispensing member and a dipping member, and the dispensing member and the dipping member are arranged in parallel along the length direction of the track device.

[0006] Preferably, the dipping member includes a dipping tray module, the dipping tray module includes a mounting seat, a magnetic drive assembly, and a dipping tray, the magnetic drive assembly is arranged on the mounting seat, the magnetic drive assembly includes a first magnetic drive member and a second magnetic drive member, the first magnetic drive member and the second magnetic drive member are magnetically connected in transmission, and the dipping tray is connected to the second magnetic drive member.

[0007] Preferably, magnetic members are respectively sleeved on adjacent ends of the first magnetic driving member and the second magnetic driving member. The magnetic members are cylindrical. The first magnetic driving member and the second magnetic driving member are in clearance fit. The first magnetic driving member drives the second magnetic driving member to rotate through the magnetic members. The first magnetic driving member is arranged on the upper surface of the mounting base. The second magnetic driving member is vertically arranged with respect to the first magnetic driving member and extends towards the lower surface of the mounting base.

[0008] Preferably, an adhesive area, a mounting area and a transfer table are provided on the track device. The adhesive area is correspondingly arranged with the adhesive device. The mounting area is correspondingly arranged with the chip supply device. The transfer table is arranged on one side of the mounting area close to the chip supply device.

[0009] Preferably, the mounting device includes a vision positioning member and a mounting member. The mounting member is arranged adjacent to the vision positioning member. The vision positioning member includes a bracket arranged above the track device. At least one first vision detector and at least one second vision detector are mounted on the bracket. The first vision detector is arranged above the mounting area. The second vision detector is arranged above the transfer table. The detection accuracy of the first vision detector is higher than that of the second vision detector.

[0010] Preferably, the chip supply device includes a die bonder and a lifting member. The lifting member is sleeved in the middle of the die bonder. The top end of the lifting member is lower than the working plane of the die bonder. The lifting member includes a top block assembly, a top rod assembly and an elastic assembly. The top block assembly is arranged above the top rod assembly. The elastic assembly abuts against the top block assembly and the top rod assembly respectively;

[0011] The top block assembly includes an outer top block, a middle top block and an inner top block which are sleeved in sequence; the top rod assembly includes an inner top rod and an outer top rod. A linkage member is sleeved on the inner top rod. The linkage member is located between the inner top rod and the middle top block;

[0012] A first clamping step is provided on the outer top rod. A second clamping step is provided on the middle top block. The first clamping step and the second clamping step respectively abut against the middle top block and the inner top block;

[0013] The upward movement of the outer top rod drives the outer top block, the middle top block and the inner top block to rise synchronously. The upward movement of the inner top rod drives the middle top block and the inner top block to rise synchronously through the linkage member. When the middle top block rises to the highest point, the inner top rod continues to drive the inner top block to rise, so that the inner top block is higher than the middle top block;

[0014] There is a first gap between the linkage member and the outer top block, and a second gap between the inner ejector rod and the middle top block. After the outer ejector rod rises to drive the outer top block, the middle top block, and the inner top block to rise synchronously, the outer ejector rod descends, causing the outer top block to descend and press the middle top block to slide downward, and the inner ejector rod descends to cause the inner top block in contact with it to slide downward.

[0015] To solve the above technical problems, the present invention provides another technical solution as follows: A die bonding method, using the die bonder described in any one of the above to perform die bonding, includes: The feeding device transports the substrate into the track device; the track device transfers the substrate to the corresponding position of the glue application device, and the glue application device performs dispensing and / or dipping treatment on the substrate; the chip supply device supplies chips to the track device; the track device transfers the substrate to the corresponding position of the mounting device, and the mounting device mounts the chips on the substrate; the discharging device takes out the substrate with the chips mounted from the track device; wherein, the above steps can be carried out synchronously.

[0016] Preferably, the chip supply device includes a wafer feeding member and a chip picking member. The chip supply device supplies chips to the track device, including: The wafer feeding member places the wafer on the expansion member; the expansion member performs a carrier film expansion treatment on the wafer; the lifting member pushes up the chip or pulls down the carrier film until the chip is separated from the carrier film; the chip picking member transfers the chip separated from the carrier film to the track device.

[0017] Preferably, the mounting device mounts the chips on the substrate, including: The vision detector performs positioning and identification on the substrate and chips to be mounted; the mounting member grabs the chips based on the detection results of the vision detector, and after position correction, mounts the chips on the substrate.

[0018] Compared with the prior art, the die bonder and die bonding method provided by the present invention have the following beneficial effects:

[0019] 1. The die bonder provided by the embodiment of the present invention completes the glue application process and the mounting process while transporting the substrate along the length direction of the track device, and compactly arranges the corresponding loading and unloading devices, glue application devices, mounting devices, chip supply devices, etc. around the track device, reducing the transportation distance of various materials, improving production efficiency, and at the same time making the equipment more miniaturized, which is beneficial to the efficient layout and optimization of the production line;

[0020] Secondly, by separating the vision positioning member and the mounting member, the weight of the mounting member is streamlined, enabling it to have better force control effect, capable of achieving more refined operations, and at the same time the vision positioning member and the mounting member can work synchronously, thereby improving efficiency.

[0021] 2. The glue application device in the embodiment of the present invention includes a dispensing member and a dipping member, which can be adapted to the chip packaging that requires dispensing or dipping. The dispensing member and the dipping member are arranged in parallel along the length direction of the track device and can work simultaneously, greatly improving the production efficiency.

[0022] 3. In the embodiment of the present invention, the dipping member drives the dipping tray to rotate through a magnetic force driving assembly. The magnetic force driving assemblies are driven by magnetic force, avoiding the problems of friction and wear in traditional mechanical transmission, thereby prolonging the service life of the equipment and reducing the maintenance cost of the equipment.

[0023] 4. The first magnetic force driving member and the second magnetic force driving member in the embodiment of the present invention are in clearance fit. The non-contact transmission between the two reduces energy loss, improves the transmission efficiency, and at the same time, the non-contact transmission has higher stability and is also convenient for maintenance and replacement.

[0024] 5. The transfer table in the embodiment of the present invention is arranged between the mounting area and the chip supply device, and the three are compactly arranged, greatly reducing the moving distance of chip mounting and improving the mounting efficiency.

[0025] 6. In the embodiment of the present invention, a first vision detector and a second vision detector with different detection precisions are respectively provided on the mounting area and the transfer table for identifying and positioning the substrate and the chip. It should be understood that the precisions required for identifying the substrate and the chip are different. According to the actual precision requirements, vision detectors with different precisions can be simultaneously used to detect different links, thereby reducing resource waste and improving the detection efficiency.

[0026] 7. The lifting member in the embodiment of the present invention includes a top block assembly and a top rod assembly. The top block assembly includes an outer top block, a middle top block, and an inner top block sleeved in sequence. The top rod assembly includes an inner top rod and an outer top rod. A linkage member is sleeved on the inner top rod, and the linkage member is located between the inner top rod and the middle top block. A first clamping step is provided on the outer top rod, and a second clamping step is provided on the middle top block. The first clamping step and the second clamping step respectively abut against the middle top block and the inner top block. When the outer top rod rises, it drives the outer top block, the middle top block, and the inner top block to rise synchronously. When the inner top rod rises, it drives the middle top block and the inner top block to rise synchronously through the linkage member. When the middle top block rises to the highest point, the inner top rod continues to drive the inner top block to rise, making the inner top block higher than the middle top block. There is a first gap between the linkage member and the outer top block, and a second gap between the inner top rod and the middle top block. After the outer top rod rises and drives the outer top block, the middle top block, and the inner top block to rise synchronously, the outer top rod descends, so that the outer top block descends and presses the middle top block to slide down, and the inner top rod descends to make the inner top block that abuts against it slide down.

[0027] Understandably, the lifting member of this embodiment has two different working modes. According to chips of different thicknesses, the method of lifting the chip upward or pulling down the chip carrier film can be selected to separate the chip from the carrier film, making the device have higher applicability.

[0028] 8. To solve the above technical problems, the present invention provides another technical solution as follows: A die bonding method using the die bonder described in any one of the above to perform die bonding, including: The loading device transports the substrate into the track device; the track device transfers the substrate to the corresponding position of the gluing device, and the gluing device performs dispensing and / or dipping on the substrate; the chip supply device supplies chips to the track device; the track device transfers the substrate to the corresponding position of the mounting device, and the mounting device mounts the chips on the substrate; the unloading device takes out the substrate with die bonding completed from the track device; wherein, the above steps can be carried out synchronously.

[0029] It has the same beneficial effects as the die bonder described in any one of the above, and will not be elaborated here.

[0030] 9. In the embodiment of the present invention, the chip carrier film is expanded by the expanding member, so that the distance between adjacent chips on the carrier film is increased, facilitating the demoulding and / or grasping operations of individual chips.

[0031] 10. In the embodiment of the present invention, the substrate and the chips are simultaneously detected by two vision detectors, improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for use in the embodiments or the description of the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0033] Figure 1 is a schematic structural diagram of the die bonder provided by the first embodiment of the present invention.

[0034] Figure 2 is a schematic structural diagram of the loading device provided by the first embodiment of the present invention.

[0035] Figure 3 is a schematic structural diagram of the dipping member provided by the first embodiment of the present invention.

[0036] Figure 4 is an exploded structural diagram of the dipping member provided by the first embodiment of the present invention.

[0037] Figure 5 is a schematic diagram of the movement track of the dipping member provided by the first embodiment of the present invention.

[0038] Figure 6 It is an exploded structural schematic diagram of the glue dipping tray module provided by the first embodiment of the present invention.

[0039] Figure 7 It is a structural schematic diagram of the chip supply device provided by the first embodiment of the present invention.

[0040] Figure 8 It is a cross-sectional view of the lifting member provided by the first embodiment of the present invention.

[0041] Figure 9 It is a step flowchart of the die bonding method provided by the second embodiment of the present invention.

[0042] Figure 10 It is a detailed step flowchart of step three of the die bonding method provided by the second embodiment of the present invention.

[0043] Figure 11 It is a detailed step flowchart of step four of the die bonding method provided by the second embodiment of the present invention.

[0044] Explanation of the attached drawing reference numerals:

[0045] 100, die bonder;

[0046] 1, track device; 11, glue area; 12, mounting area; 13, transfer table;

[0047] 2, loading device; 21, pushing member; 22, magazine loading member;

[0048] 3, glue application device; 31, dispensing member; 32, glue dipping member; 321, glue dipping tray module; 3211, mounting seat; 3212, first magnetic drive member; 3213, second magnetic drive member; 3214, magnetic member; 3215, glue dipping tray; 3216, scraping plate; 3217, adjusting knob; 3218, knob fixing block; 3219, fixing block; 322, glue dipping module; 3221, X-axis drive member; 3222, glue dipping head; 323, Z-axis module; 3231, Z-axis drive member;

[0049] 4, mounting device; 41, visual positioning member; 411, bracket; 412, first visual detector; 413, second visual detector; 42, mounting member;

[0050] 5. Chip supply device; 51. Die expansion member; 511. Wafer loading member; 512. Chip picking member; 52. Lifting member; 521. Top block assembly; 5211. Outer top block; 52111. First clamping step; 5212. Middle top block; 52121. Second clamping step; 5213. Inner top block; 522. Top rod assembly; 5221. Outer top rod; 5222. Inner top rod; 523. Elastic component; 5231. First elastic member; 5232. Second elastic member; 524. Linking member; 5241. First gap; 5242. Second gap;

[0051] 6. Unloading device. Detailed implementation manners

[0052] In order to make the objectives, technical solutions and advantages of the present invention clearer and more understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0053] In the embodiments provided by the present invention, it should be understood that "B corresponding to A" means that B is associated with A, and B can be determined according to A. However, it should also be understood that determining B according to A does not mean determining B only according to A, and B can also be determined according to A and / or other information.

[0054] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that a specific feature, structure or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, the "in one embodiment" or "in an embodiment" that appears throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. Those skilled in the art should also know that the embodiments described in the specification are all optional embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0055] In various embodiments of the present invention, it should be understood that the size of the serial numbers of each process does not necessarily mean the inevitable sequence of execution. The execution sequence of each process should be determined according to its function and internal logic, and should not constitute any limitation to the implementation process of the embodiments of the present invention.

[0056] The flowcharts and block diagrams in the accompanying drawings of the present invention illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a part of code that contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, which is determined based on the functions involved. It should be particularly noted that each block in the block diagram and / or flowchart, as well as combinations of blocks in the block diagram and / or flowchart, can be implemented by a dedicated hardware-based system that performs the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0057] Please refer to Figure 1 , a first embodiment of the present invention provides a die bonder 100, which includes a track device 1, a loading device 2, an adhesive device 3, a mounting device 4, a chip supply device 5, and an unloading device 6; the loading device 2 and the unloading device 6 are respectively arranged at two ends of the track device 1 in the length direction; the adhesive device 3 is arranged at one end of the track device 1 close to the loading device 2 on the side; the mounting device 4 is arranged at one end of the track device 1 close to the unloading device 6 on the side, the mounting device 4 and the adhesive device 3 are located on the same side of the track device 1, and the mounting device 4 includes a visually positioning member 41 and a mounting member 42 which are independently arranged; the chip supply device 5 is arranged on the other side of the track device 1 and corresponds to the mounting device 4.

[0058] It should be noted that the loading device 2 is used to convey a substrate to the track device 1. The substrate moves on the track device 1 in the direction of the unloading device 6. When it moves to the corresponding position, the adhesive device 3 and the mounting device 4 arranged on the side of the track device 1 perform the dispensing and / or dipping process and the mounting process on the substrate. Finally, the unloaded device 6 takes out the mounted substrate from the track device 1 and transfers it to the next process.

[0059] It can be understood that the die bonder 100 provided in this embodiment completes the gluing process and the mounting process while the substrate is flowing along the length direction of the track device 1, and compactly arranges the corresponding loading device 2, unloading device 6, adhesive device 3, mounting device 4, chip supply device 5, etc. around the track device 1. The space is reasonably utilized, the transportation distance of various materials is reduced, the production efficiency is improved, and at the same time, the equipment is made more miniaturized, which is beneficial to the efficient layout and optimization of the production line.

[0060] As a feasible implementation, the mounting device 4 includes a vision positioning member 41 and a mounting member 42 that are independently arranged. Separating the vision positioning member 41 and the mounting member 42 streamlines the weight of the mounting member 42, enabling it to have a better force control effect, achieve more refined operations, and at the same time, the vision positioning member 41 and the mounting member 42 can work synchronously, reducing the corresponding waiting time and thus improving work efficiency.

[0061] Further, please refer to Figure 2 , the loading device 2 includes a pusher member 21 and a magazine loading member 22.

[0062] Specifically, the magazine loading member 22 pushes the magazine stored thereon to the end of the track device 1, and the pusher member 21 pushes the carrier plate on the magazine and the substrate thereon into the track device 1 together. The substrate is carried by the carrier plate and moves in the length direction of the track device 1, so that the substrate is in a stable state during the entire movement process.

[0063] Optionally, one or more substrates can be placed on the carrier plate.

[0064] Further, please refer to Figure 1 and Figure 3 , the gluing device 3 includes a dispensing member 31 and a dipping member 32, and the dispensing member 31 and the dipping member 32 are arranged in parallel along the length direction of the track device 1.

[0065] As a feasible implementation, the dispensing member 31 and the dipping member 32 are arranged in parallel in the length direction of the track device 1 for performing the dispensing and dipping processes on the substrate.

[0066] Optionally, the dispensing member 31 and the dipping member 32 can work independently or simultaneously.

[0067] Through this design, the die bonder 100 can meet the mounting requirements of chips that need dispensing encapsulation and chips that need dipping encapsulation. When changing the mounted product, there is no need to replace the operating head, the operation is convenient, and it has stronger versatility.

[0068] Optionally, the dipping member 32 and the dispensing member 31 are arranged in sequence in the substrate moving direction.

[0069] It can be understood that in some cases, chip mounting requires the combined use of dispensing and dipping. At this time, the substrate can be moved under the dipping member 32 through the track device 1, and the dipping member 32 coats the glue on the chip or the substrate. Then, the substrate is moved down to the dispensing member 31, and the dispensing member 31 precisely replenishes the glue or strengthens specific positions of the substrate or the chip.

[0070] It should be noted that while the substrate moves to the dispensing member 31 for dispensing after completing the dipping process, the feeding device 2 conveys a new substrate to the track device 1. The new substrate moves to the dipping member 32 for dipping, that is, the dipping member 32 and the dispensing member 31 work simultaneously, thereby improving the efficiency of chip mounting.

[0071] As a feasible implementation, the dispensing member 31 and the dipping member 32 are provided with vision positioning modules. After the substrate moves to the corresponding area, the vision positioning modules first perform rapid and accurate positioning and identification of the substrate, and then perform dispensing or dipping operations. The vision positioning modules can quickly identify and accurately position substrates of various shapes and sizes, thereby providing precise guidance for dispensing or dipping operations, greatly shortening the preparation time before dispensing or dipping, and improving production efficiency; high-precision positioning can ensure that the glue can be accurately applied to the pins of the chip or the parts to be bonded, thereby avoiding glue overflow or misalignment, which may affect the performance and stability of the chip.

[0072] Further, please refer to Figures 3 - 6 , the dipping member 32 includes a dipping tray module 321. The dipping tray module 321 includes a mounting base 3211, a magnetic drive assembly, and a dipping tray 3215. The magnetic drive assembly is disposed on the mounting base 3211. The magnetic drive assembly includes a first magnetic drive member 3212 and a second magnetic drive member 3213. The first magnetic drive member 3212 and the second magnetic drive member 3213 are connected by magnetic force transmission. The dipping tray 3215 is connected to the second magnetic drive member 3213.

[0073] Specifically, magnetic members 3214 are respectively sleeved on the adjacent ends of the first magnetic drive member 3212 and the second magnetic drive member 3213. The magnetic members 3214 are cylindrical. The first magnetic drive member 3212 and the second magnetic drive member 3213 are in clearance fit. The first magnetic drive member 3212 drives the second magnetic drive member 3213 to rotate through the magnetic member 3214. The first magnetic drive member 3212 is disposed on the upper surface of the mounting base 3211. The second magnetic drive member 3213 is perpendicular to the first magnetic drive member 3212 and extends towards the lower surface of the mounting base 3211.

[0074] Optionally, the first magnetic drive member 3212 is a driving motor.

[0075] As a feasible implementation manner, the first magnetic driving member 3212 is fixed above the mounting base 3211. A magnetic member 3214 is sleeved on the rotating end thereof. The rotating shaft of the first magnetic driving member 3212 is parallel to the upper surface of the mounting base 3211. The rotating shaft of the second magnetic driving member 3213 is perpendicular to the upper surface of the mounting base 3211. A magnetic member 3214 is sleeved on one end of the second magnetic driving member 3213 close to the first magnetic driving member 3212. The end of the second magnetic driving member 3213 away from the magnetic member 3214 extends towards the lower surface of the mounting base 3211 and is connected to the glue dipping tray 3215.

[0076] Specifically, the first magnetic driving member 3212 drives the second magnetic driving member 3213 through magnetic force transmission via the magnetic member 3214. The two are in clearance fit. The first magnetic driving member 3212 drives the second magnetic driving member 3213 to rotate non - contact based on the magnetic principle, thereby driving the glue dipping tray 3215 connected thereto to rotate, avoiding taking glue at the same position each time and making the glue taking uneven.

[0077] It should be noted that the second magnetic driving member 3213 is arranged close to the edge of the mounting base 3211. The glue dipping tray 3215 is connected to the second magnetic driving member 3213 and is located below the mounting base 3211. The mounting base 3211 provides a certain wind - shielding effect for the glue dipping tray 3215 below it to slow down the air - drying speed of the glue on the glue dipping tray 3215.

[0078] The magnetic force transmission method provided in this embodiment avoids the problems of component friction and wear in traditional mechanical transmission, thereby prolonging the service life of the equipment and reducing the maintenance cost of the equipment. At the same time, since the first magnetic driving member 3212 and the second magnetic driving member 3213 are in clearance fit, that is, the two are non - contact transmissions, the energy loss during mechanical transmission can be reduced, the transmission efficiency can be improved, the transmission stability can be improved, and it is convenient for maintenance and replacement in case of failure.

[0079] Furthermore, the glue dipping component 32 further includes a Z - axis module 323 and a glue dipping module 322. The glue dipping tray module 321 is arranged on the side of the Z - axis module 323. The glue dipping module 322 is arranged on the side of the Z - axis module 323 close to the glue dipping tray 3215, so that the glue dipping tray 3215 and the glue dipping module 322 are compactly arranged, reducing the distance that the glue dipping module 322 needs to move to dip glue from the glue dipping tray 3215, and thus improving the glue dipping efficiency.

[0080] Specifically, a Z-axis driving member 3231 is provided on the Z-axis module 323, and the glue dipping module 322 is arranged on the Z-axis driving member 3231. The glue dipping module 322 moves up and down under the action of the Z-axis driving member 3231. The glue dipping module 322 includes an X-axis driving member 3221 and a glue dipping head 3222. The glue dipping head 3222 is connected to the X-axis driving member 3221 and moves left and right under the drive of the X-axis driving member 3221. The movement trajectory of the glue dipping head 3222 is as shown in Figure 5 the dotted line part in

[0081] In this embodiment, the Z-axis driving member 3231 is separated from the glue dipping module 322. While not affecting the movement effect of the glue dipping head 3222, the weight of the glue dipping module 322 is reduced, enabling the glue dipping module 322 to have a better force control effect and allowing the glue dipping head 3222 to perform more precise operations. At the same time, separating the driving members reduces the cost of part repair and replacement.

[0082] As a feasible implementation manner, a fixing block 3219 is provided at one end of the mounting seat 3211 close to the glue dipping tray 3215. A scraping plate 3216 that is rotationally matched with the glue dipping tray 3215 is connected to the fixing block 3219. The scraping plate 3216 is located above the glue dipping tray 3215 and is in clearance fit with the glue dipping tray 3215. Along the rotation direction of the glue dipping tray 3215, the clearance between the scraping plate 3216 and the glue dipping tray 3215 gradually increases.

[0083] It should be noted that the fixing block 3219 is movably connected to the mounting seat 3211. A knob fixing block 3218 is further provided on the mounting seat 3211. An adjusting knob 3217 is installed on the knob fixing block 3218. The adjusting knob 3217 penetrates through the knob fixing block 3218 and is connected to the fixing block 3219. By adjusting the adjusting knob 3217, the distance between the fixing block 3219 and the knob fixing block 3218 can be adjusted, thereby adjusting the spacing between the scraping plate 3216 and the glue dipping tray 3215.

[0084] Furthermore, please refer back to Figure 1 , a glue application area 11, a chip mounting area 12, and a transfer station 13 are provided on the track device 1. The glue application area 11 is correspondingly arranged with the glue application device 3, the chip mounting area 12 is correspondingly arranged with the chip supply device 5, and the transfer station 13 is arranged on one side of the chip mounting area 12 close to the chip supply device 5.

[0085] It can be understood that in the length direction of the track device 1, specifically, the glue application area 11 and the chip mounting area 12 are sequentially arranged in the moving direction of the substrate. When the substrate moves on the track device 1, relevant process treatments are carried out in the corresponding areas to avoid errors in the process treatment sequence.

[0086] Specifically, the adhesive area 11 is set corresponding to the position of the adhesive device 3, and the mounting area 12 is set corresponding to the position of the mounting device 4. By correspondingly and compactly setting the relative processing device and the process area, after the substrate moves to the designated area, the mounting area 12 or the mounting device 4 can timely perform relevant processing on the substrate, thus improving the production efficiency.

[0087] In addition, different processes are partitioned for processing, so that different processes can be simultaneously performed on the track device 1, thereby improving the production efficiency.

[0088] As a feasible implementation manner, a transfer station 13 for storing the chips to be mounted is further provided on the track device 1. The mounting area 12, the transfer station 13, and the chip supply device 5 are arranged in parallel in sequence, reducing the moving distance required for chip mounting and improving the mounting efficiency.

[0089] Optionally, the transfer station 13 is fixedly arranged on the side of the track device 1, so that the chip supply device 5 and the mounting device 4 can place or grab chips at fixed points, improving the convenience of the chip supply device 5 and the mounting device 4 for placing or grabbing chips. At the same time, the transfer station 13 is fixedly connected to the track device 1, avoiding errors in the positions of the chips on the transfer station 13 due to the movement of the transfer station 13.

[0090] Furthermore, the mounting device 4 includes a visually positioning member 41 and a mounting member 42 which are independently arranged. The mounting member 42 is adjacent to the visually positioning member 41. The visually positioning member 41 includes a bracket 411 arranged above the track device 1. At least one first visual detector 412 and at least one second visual detector 413 are installed on the bracket 411. The first visual detector 412 is arranged above the mounting area 12, and the second visual detector 413 is arranged above the transfer station 13. The detection accuracy of the first visual detector 412 is higher than that of the second visual detector 413.

[0091] It can be understood that the bracket 411 is erected above the track device 1 and corresponds to the mounting area 12 and the transfer station 13. The first visual detector 412 and the second visual detector 413 are arranged thereon. Specifically, the first visual detector 412 is arranged above the mounting area 12, and the second visual detector 413 is arranged above the transfer station 13 to identify and position the substrate or chip thereon. The mounting member 42 is signal-connected to the first visual detector 412 and the second visual detector 413. The first visual detector 412 and the second visual detector 413 transmit the recognition results of the substrate and the chip to the mounting member 42, thereby guiding the mounting member 42 to accurately mount the chip and improving the mounting accuracy.

[0092] It should be noted that in the actual mounting process, the accuracies required for identifying the substrate and the chip are different. Generally, the accuracy required for identifying the chip mounting points on the substrate is higher than that for identifying the chip position on the transfer table 13.

[0093] As a feasible implementation, a first vision detector 412 with a higher accuracy is used to identify the substrate in the mounting area 12, and a second vision detector 413 with a lower accuracy is used to identify the chips on the transfer table 13, which improves the identification efficiency of the chips and also avoids using a high-precision vision detector to identify processes with low accuracy requirements, thus causing waste of resources.

[0094] Optionally, by respectively arranging the first vision detector 412 and the second vision detector 413 above the mounting area 12 and the transfer table 13, the vision detectors at both places can work simultaneously, improving the identification efficiency, that is, the substrate on the mounting area 12 and the chips on the transfer table 13 can be identified synchronously, and then the corresponding identification information is transmitted to the mounting member 42 to guide the mounting member 42 to pick up the chips and perform the mounting, reducing the waiting time of the mounting member 42 for the identification result, thereby improving the overall mounting efficiency.

[0095] Furthermore, please refer to Figure 7 and Figure 8 , the chip supply device 5 includes an expansion member 51 and a lifting member 52. The lifting member 52 is sleeved in the middle of the expansion member 51. The top end of the lifting member 52 is lower than the working plane of the expansion member 51. The lifting member 52 includes a top block assembly 521, a top rod assembly 522, and an elastic assembly 523. The top block assembly 521 is arranged above the top rod assembly 522. The elastic assembly 523 abuts against the top block assembly 521 and the top rod assembly 522 respectively; the top block assembly 521 includes an outer top block 5211, a middle top block 5212, and an inner top block 5213 that are sequentially sleeved; the top block assembly 521 includes an inner top rod 5222 and an outer top rod 5221. A linkage member 524 is sleeved on the inner top rod 5222. The linkage member 524 is located between the inner top rod 5222 and the middle top block 5212;

[0096] A first clamping step 52111 is provided on the outer top rod 5221, and a second clamping step 52121 is provided on the middle top block 5212. The first clamping step 52111 and the second clamping step 52121 respectively abut against the middle top block 5212 and the inner top block 5213;

[0097] The outer ejector rod 5221 rises to drive the outer ejector block 5211, the middle ejector block 5212 and the inner ejector block 5213 to rise synchronously. The inner ejector rod 5222 rises to drive the middle ejector block 5212 and the inner ejector block 5213 to rise synchronously through the linkage member 524. When the middle ejector block 5212 rises to the highest point, the inner ejector rod 5222 continues to drive the inner ejector block 5213 to rise, making the inner ejector block 5213 higher than the middle ejector block 5212;

[0098] There is a first gap 5241 between the linkage member 524 and the outer ejector block 5211, and a second gap 5242 between the inner ejector rod 5222 and the middle ejector block 5212. After the outer ejector rod 5221 rises to drive the outer ejector block 5211, the middle ejector block 5212 and the inner ejector block 5213 to rise synchronously, the outer ejector rod 5221 descends, so that the outer ejector block 5211 descends and presses the middle ejector block 5212 to slide down, and the inner ejector rod 5222 descends to make the inner ejector block 5213 in contact with it slide down.

[0099] As a feasible implementation manner, the die bonder 51 is integrally in a hollow cylindrical shape. The wafer can be placed above the die bonder 51 and the carrier film is expanded under the action of the die bonder 51, so that the distance between adjacent chips is increased; a lifting member 52 is provided in the middle of the die bonder 51. The lifting member 52 is specifically arranged below the chip carrier film. When the chip carrier film is expanded, the lifting member 52 jacks up the chip or pulls down the carrier film, so that the chip is detached from the carrier film.

[0100] In a specific implementation manner, the elastic component 523 includes a first elastic member 5231 and a second elastic member 5232. The end of the outer ejector rod 5221 is connected to the outer ejector block 5211. The end of the inner ejector rod 5222 is connected to the middle ejector block 5212 through a linkage member 524. The bottom of the linkage member 524 is connected to the inner wall surface of the outer ejector rod 5221. At least part of the inner ejector block 5213 is located inside the inner ejector rod 5222 after passing through the linkage member 524 and the inner ejector rod 5222 in sequence; a first clamping step 52111 is provided on the outer ejector block 5211, and a second clamping step 52121 is provided on the middle ejector block 5212. The first clamping step 52111 and the second clamping step 52121 respectively abut against the middle ejector block 5212 and the inner ejector block 5213. Thus, when the outer ejector block 5211 rises, the middle ejector block 5212 and the inner ejector block 5213 are driven to rise through the first clamping step 52111 and the second clamping step 52121. There are a first gap 5241 and a second gap 5242 between the linkage member 524 and the outer ejector block 5211, and between the inner ejector rod 5222 and the middle ejector block 5212 respectively; the first elastic member 5231 sleeved on the inner ejector rod 5222 and the second elastic member 5232 sleeved on the linkage member 524. One end of the first elastic member 5231 far from the ejector block assembly 521 is fixed to the outer side wall of the inner ejector rod 5222, and both ends of the second elastic member 5232 are connected to the outer ejector block 5211 and the linkage member 524 respectively.

[0101] Optionally, the end of the outer ejector rod 5221 is connected to the outer ejector block 5211, the end of the inner ejector rod 5222 is connected to the middle ejector block 5212 through the linkage member 524, and at least part of the inner ejector block 5213 is located inside the inner ejector rod 5222 after passing through the linkage member 524 and the inner ejector rod 5222 once. The first elastic member 5231 is sleeved on the inner ejector rod 5222 and is fixed to the end of the inner ejector rod 5222 away from the ejector block assembly 521. The second elastic member 5232 is sleeved on the linkage member 524, and both ends of the second elastic member 5232 are respectively connected to the outer ejector block 5211 and the linkage member 524, so that when the linkage member 524 descends, it can drive the outer ejector block 5211 to descend.

[0102] As a feasible implementation manner, when the lifting member 52 works, first, the inner ejector block 5213, the middle ejector block 5212 and the outer ejector block 5211 are synchronously lifted to a certain height. The mounting member 42 moves above the chip and descends to adsorb the chip. Subsequently, when the inner ejector rod 5222 continues to lift, the first elastic member 5231 will be deformed and apply an upward lifting force to the linkage member 524. The linkage member 524 drives the middle ejector block 5212 and the inner ejector block 5213 to lift upward, so that the middle ejector block 5212 slides upward relative to the outer ejector block 5211 by a certain distance. At this time, the first gap 5241 gradually decreases until it disappears, that is, the sliding stroke of the middle ejector block 5212 relative to the outer ejector block 5211 reaches the limit. At this time, the outer layer of the chip is separated from the carrier film. Then, continue to push the inner ejector rod 5222 upward. Since the first gap 5241 has disappeared, the inner ejector rod 5222 further realizes the independent lifting of the inner ejector block 5213. At this time, the second gap 5242 also gradually decreases until it disappears, and the inner ejector block 5213 continues to slide upward relative to the middle ejector block 5212 by a certain distance. When the sliding stroke of the inner ejector block 5213 reaches the limit, the second gap 5242 between the inner ejector rod 5222 and the middle ejector block 5212 disappears. At this time, the mounting member 42 adsorbs the chip and continues to rise to completely separate the chip from the carrier film, completing the material taking.

[0103] It can be understood that after the mounting member 42 adsorbs the chip, the mounting member 42 needs to rise synchronously with the inner ejector block 5213 and the middle ejector block 5212, and keep the downward pressing force for material taking unchanged to avoid chip breakage.

[0104] As another feasible implementation manner, when the lifting member 52 is working, first, the inner lifting block 5213, the middle lifting block 5212, and the outer lifting block 5211 are synchronously lifted to a certain height. The mounting member 42 is moved above the chip and descends to adsorb the chip. Subsequently, when the outer ejector rod 5221 descends, the outer lifting block 5211 will slide downward relative to the middle lifting block 5212 for a certain distance under the action of gravity. At this time, the first gap 5241 will gradually decrease until it disappears, that is, the sliding stroke of the outer lifting block 5211 relative to the middle lifting block 5212 reaches the limit. Subsequently, the outer lifting block 5211 will press down the middle lifting block 5212 to make the middle lifting block 5212 also slide downward for a certain distance. Then, the inner ejector rod 5222 is continuously lowered to make the inner lifting block 5213 descend. Finally, the inner lifting block 5213 is lowered to completely separate the carrier film from the chip, and the mounting member 42 adsorbs the chip and ascends to complete the material taking.

[0105] It can be understood that during the process of the lifting block assembly 521 descending layer by layer, the downward pressing force for the mounting member 42 to take the material needs to be gradually reduced to 0 to avoid chip cracking due to the gradually increasing contact area.

[0106] The lifting member 52 provided in this embodiment realizes two different pushing block action modes of the pushing type and the pulling film type on the same set of structure through the limit of the spring and the mechanical mechanism. When in use, different action modes can be switched according to chips of different thicknesses, improving the compatibility of the pusher.

[0107] Please refer to Figure 9 , the second embodiment of the present invention provides a die bonding method, using the die bonder 100 as described in any one of the above to perform die bonding, including:

[0108] Step S1: The loading device transports the substrate into the track device;

[0109] Step S2: The track device transfers the substrate to the corresponding position of the gluing device, and the gluing device performs dot gluing and / or dipping gluing treatment on the substrate;

[0110] Step S3: The chip supply device supplies chips to the track device;

[0111] Step S4: The track device transfers the substrate to the corresponding position of the mounting device, and the mounting device mounts the chip on the substrate;

[0112] Step S5: The unloading device takes out the substrate with die bonding completed from the track device;

[0113] Among them, the above steps can be carried out synchronously.

[0114] Understandably, the die bonder 100 of this embodiment integrates processes such as dispensing, dipping glue, and die bonding required for chip mounting, and arranges the operation areas of each process along the track device 1 in sequence to achieve a pipeline-type mounting process from loading, dipping glue, die bonding to unloading, thereby improving the mounting efficiency.

[0115] This embodiment splits the processes required for chip mounting and executes them in different areas, so that each process step can be carried out simultaneously, greatly improving the working efficiency.

[0116] It should be understood that the die bonding method provided in this embodiment has the same beneficial effects as the die bonder 100 described in any one of the above, and will not be elaborated here.

[0117] Further, please refer to Figure 7 and Figure 10 The chip supply device 5 includes a wafer loading member 511 and a chip picking member 512. The chip supply device supplies chips to the track device, including:

[0118] Step S31: The wafer loading member places the wafer on the wafer expanding member;

[0119] Step S32: The wafer expanding member performs a carrier film expansion process on the wafer;

[0120] Step S33: The lifting member pushes up the chip or pulls down the carrier film until the chip is separated from the carrier film;

[0121] Step S34: The chip picking member transfers the chip separated from the carrier film to the track device.

[0122] It should be noted that after the wafer loading member 511 places the wafer on the wafer expanding member 51 in step S32, the wafer expanding member 51 clamps and fixes the wafer, so that the wafer carrier film covers the working plane of the wafer expanding member 51, and then the wafer expanding member 51 stretches the wafer carrier film to expand it, resulting in an increase in the distance between adjacent chips on the carrier film, facilitating subsequent grasping of the chips.

[0123] Optionally, the lifting member 52 can achieve chip demolding through two action modes of pushing and pulling the film, and can switch different action modes for different products, with higher applicability; and the function action switching does not require replacing parts, and the operation is convenient.

[0124] Further, please refer to Figure 11 , the die bonding device bonds the chip to the substrate, including:

[0125] Step S41: The vision detector performs positioning and recognition on the substrate and the chip to be die bonded;

[0126] Step S42: The mounting component grabs the chip based on the detection result of the vision detector, and after position correction, mounts the chip onto the substrate.

[0127] It should be noted that in this embodiment, two independent vision detectors are used to synchronously locate and identify the substrate in the mounting area 12 and the chip on the turntable 13 respectively, which improves the detection efficiency.

[0128] As a feasible implementation manner, the first vision detector 412 is used to identify the substrate on the mounting area 12, and the second vision detector 413 is used to identify the chip on the turntable 13. The mounting component 42, the first vision detector 412, and the second vision detector 413 are independently arranged, and both the first vision detector 412 and the second vision detector 413 are signal-connected to the mounting component 42. The mounting component 42 grabs the chip on the turntable 13 and corrects its position by receiving the detection results of the first vision detector 412 and the second vision detector 413, and finally mounts the calibrated chip onto the specified position of the substrate.

[0129] It can be understood that separating the first vision detector 412 and the second vision detector 413 from the mounting component 42 reduces the weight of the mounting component 42, enables it to have better force control, and can perform more refined operations on the chip to ensure the mounting accuracy.

[0130] Compared with the prior art, a die bonder and a die bonding method provided by the present invention have the following beneficial effects:

[0131] 1. A die bonder provided by an embodiment of the present invention completes the gluing process and the mounting process while the substrate is flowing along the length direction of the track device, and compactly arranges the corresponding loading and unloading devices, gluing devices, mounting devices, chip supply devices, etc. around the track device, reducing the transportation distance of various materials, improving the production efficiency, and at the same time making the equipment more miniaturized, which is beneficial to the efficient layout and optimization of the production line;

[0132] Secondly, by separating the vision positioning component and the mounting component, the weight of the mounting component is streamlined, enabling it to have better force control effect, capable of realizing more refined operations, and at the same time the vision positioning component and the mounting component can work synchronously, thereby improving the efficiency.

[0133] 2. The gluing device in the embodiment of the present invention includes a dispensing component and a dipping component, which can adapt to chip packaging that requires dispensing or dipping; the dispensing component and the dipping component are arranged in parallel along the length direction of the track device and can work simultaneously, greatly improving the production efficiency.

[0134] 3. In the embodiment of the present invention, the glue dipping member drives the glue dipping disk to rotate through the magnetic force driving assembly, and the magnetic force driving assemblies are driven by magnetic force transmission, avoiding the problems of friction and wear in traditional mechanical transmission, so that the service life of the equipment can be extended and the maintenance cost of the equipment can be reduced.

[0135] 4. The first magnetic force driving member and the second magnetic force driving member in the embodiment of the present invention are in clearance fit, and the non-contact transmission between the two reduces energy loss, improves transmission efficiency, and at the same time, the non-contact transmission has higher stability and is also convenient for maintenance and replacement.

[0136] 5. The transfer table in the embodiment of the present invention is arranged between the mounting area and the chip supply device, and the three are compactly arranged, greatly reducing the moving distance of chip mounting and improving the mounting efficiency.

[0137] 6. In the embodiment of the present invention, a vision detector is respectively arranged in the mounting area and on the transfer table for identifying and positioning the substrate and the chip. It should be understood that the accuracies required for identifying the substrate and the chip are different. According to the actual accuracy requirements, vision detectors with different accuracies can be simultaneously used to detect different links, so as to reduce resource waste and improve detection efficiency.

[0138] 7. The lifting member in the embodiment of the present invention can select to adopt the method of lifting the chip upward or pulling down the chip carrier film according to chips with different thicknesses to separate the chip from the carrier film, making the equipment have higher applicability.

[0139] 8. To solve the above technical problems, the present invention provides another technical solution as follows: A die bonding method, using the die bonder described in any one of the above to perform die bonding, including: The feeding device transports the substrate into the track device; The track device transfers the substrate to the corresponding position of the glue sticking device, and the glue sticking device performs dispensing and / or glue dipping on the substrate; The chip supply device supplies chips to the track device; The track device transfers the substrate to the corresponding position of the mounting device, and the mounting device mounts the chips on the substrate; The discharging device takes out the substrate with the mounting completed from the track device; Among them, the above steps can be carried out synchronously.

[0140] It has the same beneficial effects as the die bonder described in any one of the above, and will not be elaborated here.

[0141] 9. In the embodiment of the present invention, the chip carrier film is expanded by the expanding member, so that the distance between adjacent chips on the carrier film is increased, facilitating the demoulding and / or grasping operations of individual chips.

[0142] 10. In the embodiment of the present invention, the substrate and the chip are detected simultaneously by two vision detectors, improving the detection efficiency.

[0143] The above has introduced in detail a die bonder and a die bonding method disclosed in the embodiments of the present invention. Specific examples are used in this article to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A die bonding machine, characterized in that: It includes a track device, a loading device, a gluing device, a mounting device, a chip supply device and a unloading device; The loading device and the unloading device are respectively arranged at the two ends of the track device in the length direction; the gluing device is arranged on the side of the track device close to one end of the loading device; the mounting device is arranged on the side of the track device close to one end of the unloading device, the mounting device and the gluing device are located on the same side of the track device, and the mounting device includes a visual positioning component and a mounting component that are independently arranged; the chip supply device is arranged on the other side of the track device and corresponds to the mounting device; The chip supply device comprises a crystal expansion component and a lifting component, wherein the lifting component is sleeved in the middle of the crystal expansion component, and the top of the lifting component is lower than the working plane of the crystal expansion component, and the lifting component comprises a top block assembly, a top rod assembly and an elastic assembly, wherein the top block assembly is arranged above the top rod assembly, and the elastic assembly abuts against the top block assembly and the top rod assembly respectively; the top block assembly comprises an outer top block, a middle top block and an inner top block which are sleeved in sequence; the top rod assembly comprises an inner top rod and an outer top rod, and a linkage member is sleeved on the inner top rod, and the linkage member is located between the inner top rod and the middle top block; The end of the outer push rod is connected to the outer push block, the end of the inner push rod is connected to the middle push block through the linkage piece, the bottom of the linkage piece is connected to the inner wall surface of the outer push rod, at least part of the inner push block is located in the inner push rod after the linkage piece and the inner push rod are sequentially passed through, the outer push rod is provided with a first positioning step, and the middle push block is provided with a second positioning step, the first positioning step and the second positioning step respectively abut against the middle push block and the inner push block; the elastic component comprises a first elastic component sleeved on the inner push rod and a second elastic component sleeved on the linkage piece, one end of the first elastic component away from the push block assembly is fixed to the outer side wall of the inner push rod, and two ends of the second elastic component are respectively connected to the outer push block and the linkage piece; When the outer ejector rod rises, it drives the outer ejector block, the middle ejector block and the inner ejector block to rise synchronously. When the inner ejector rod rises, it drives the middle ejector block and the inner ejector block to rise synchronously through the linkage. When the middle ejector block rises to the highest point, the inner ejector rod continues to drive the inner ejector block to rise, so that the inner ejector block is higher than the middle ejector block. There is a first gap between the linkage and the outer top block, and a second gap between the inner top rod and the middle top block. After the outer top rod rises to drive the outer top block, the middle top block and the inner top block to rise synchronously, the outer top rod descends to make the outer top block descend and press the middle top block downward, and the inner top rod descends to make the inner top block that is against it slide downward.

2. The die bonding machine according to claim 1, characterized in that: The gluing device comprises a glue dispensing component and a glue dipping component, and the glue dispensing component and the glue dipping component are arranged in parallel along the length direction of the track device.

3. The die bonding machine according to claim 2, characterized in that: The glue dipping component includes a glue dipping tray module, and the glue dipping tray module includes a mounting seat, a magnetic drive component and a glue dipping tray. The magnetic drive component is arranged on the mounting seat, and the magnetic drive component includes a first magnetic drive component and a second magnetic drive component. The first magnetic drive component and the second magnetic drive component are connected by magnetic transmission, and the glue dipping tray is connected to the second magnetic drive component.

4. The die bonding machine according to claim 3, characterized in that: The adjacent ends of the first magnetic driving component and the second magnetic driving component are respectively sleeved with magnetic components, the magnetic components are cylindrical, the first magnetic driving component and the second magnetic driving component are loosely matched, the first magnetic driving component drives the second magnetic driving component to rotate through the magnetic component, the first magnetic driving component is arranged on the upper surface of the mounting seat, and the second magnetic driving component is arranged perpendicular to the first magnetic driving component and extends to the lower surface of the mounting seat.

5. The die bonding machine according to claim 1, characterized in that: The track device is provided with a gluing area, a mounting area and a transfer table. The gluing area is arranged corresponding to the gluing device, the mounting area is arranged corresponding to the chip supply device, and the transfer table is arranged on the mounting area close to the chip supply device.

6. The die bonding machine according to claim 5, characterized in that: The placement device includes a visual positioning component and a placement component, the placement component is arranged adjacent to the visual positioning component, the visual positioning component includes a bracket arranged above the track device, at least one first visual detector and at least one second visual detector are installed on the bracket, the first visual detector is arranged above the placement area, and the second visual detector is arranged above the transfer table. The first visual detector and the second visual detector are connected to the placement component signal, and the detection accuracy of the first visual detector is higher than the detection accuracy of the second visual detector.

7. A method for bonding a crystal, using the crystal bonding machine according to any one of claims 1 to 6, characterized in that: include: The loading device transports the substrate into the track device; The track device transfers the substrate to the corresponding position of the gluing device, and the gluing device performs glue dispensing and / or glue dipping treatment on the substrate; The chip supply device supplies chips to the track device; The track device transfers the substrate to the corresponding position of the mounting device, and the mounting device mounts the chip onto the substrate; The unloading device takes the mounted substrate out of the track device; The above steps can be performed simultaneously.

8. The die bonding method according to claim 7, characterized in that: The chip supply device includes a wafer loading component and a chip picking component. The chip supply device supplies chips to the track device, including: The wafer loading component places the wafer on the wafer expanding component; The wafer expansion component performs a carrying film expansion process on the wafer; The lifting component lifts up the chip or pulls down the carrier film until the chip is separated from the carrier film; The chip picking member transfers the chip separated from the carrier film to the track device.

9. The die bonding method according to claim 7, wherein: The placement device places the chip on the substrate, including: The visual detector locates and identifies the substrate and chip to be mounted; The mounting component grabs the chip based on the detection results of the visual detector, and mounts the chip on the substrate after position correction.

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