A wafer rotation processing device

Abstract

The present invention relates to the technical field of wafer processing, and discloses a wafer rotary processing device, which includes a housing. A rotary mechanism for driving the wafer to rotate is provided on the housing, and a first motor for driving the rotary mechanism to rotate is provided inside the housing. The rotary mechanism includes a rotary table. Multiple layers of negative pressure annular cavities are provided at the top of the rotary table, and the negative pressure annular cavities are communicated through connection grooves. A liftable negative pressure generating mechanism is provided at the bottom of the rotary table. A lifting mechanism is provided inside the housing, and the lifting mechanism drives the negative pressure generating mechanism to complete the lifting action. A positioning mechanism is provided at the top of the lifting mechanism, and the positioning mechanism clamps the wafer axially and radially to make the axis of the wafer coincide with the axis of the rotary table. This device realizes the automatic positioning and fixing work before wafer processing, can replace the rotary mechanisms in most wafer processing equipment, and can be used alone as a split-type rotary device, which is more comprehensive and efficient.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer processing, and specifically refers to a wafer rotary processing device. Background Art

[0002] A wafer is a basic material in the semiconductor manufacturing process, usually made of single crystal silicon. Its main application is as a basic platform for integrated circuits and other semiconductor devices. After lithography, etching, deposition, ion implantation, cleaning, polishing, and cutting, chips are formed. In the above processing technologies, most require a rotating mechanism. The rotating mechanism in existing wafer processing equipment consists of a motor, a transmission mechanism, and a rotating platform, which provides a rotating motion for wafer processing.

[0003] During the wafer processing, multiple devices are required to complete the transformation from a silicon wafer to a chip. The process is relatively complex and requires a corresponding large number of devices. Each time the wafer is transferred between different devices, positioning and fixing steps need to be completed, and there are relatively many additional auxiliary devices, increasing the construction cost. There is a need for a rotating mechanism with strong functionality, capable of autonomously realizing positioning and fixing functions, and adaptable to different usage scenarios, so as to improve the functionality and economy of rotary processing. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to overcome the above difficulties and provide a wafer rotary processing device.

[0005] To solve the above technical problem, the technical solution provided by the present invention is: a wafer rotary processing device, including a housing, on which there is a rotating mechanism for driving the wafer to rotate, and a first motor for driving the rotating mechanism to rotate is arranged inside the housing;

[0006] The rotating mechanism includes a rotating table, on the top of which there are multiple layers of negative pressure ring cavities, and the negative pressure ring cavities are communicated through connecting grooves. At the bottom of the rotating table, there is a liftable negative pressure generating mechanism, which includes a mounting plate, and a plurality of arc-shaped plates are evenly arranged on the top of the mounting plate. A first sliding cavity for sliding cooperation with the arc-shaped plates is arranged in the negative pressure ring cavity;

[0007] An elevating mechanism is arranged inside the housing, which includes a cylinder and a lifting ring platform. The output end of the cylinder is connected to the lifting ring platform, and the lifting ring platform is slidably arranged outside the rotating table. The lifting ring platform drives the negative pressure generating mechanism to complete the lifting action. A positioning mechanism is arranged on the top of the lifting ring platform, which radially clamps the wafer through an axis to make the axis of the wafer coincide with the axis of the rotating table.

[0008] As an improvement: A limiting mechanism is provided inside the mounting disc. The limiting mechanism includes a plug rod and an unlocking platform. The plug rod is slidably arranged in a first radial chute provided inside the mounting disc. The front end of the plug rod is inserted and fitted with a slot on the inner side of the bottom of the rotating platform. A first spring is provided at the rear end of the plug rod. The unlocking platform is slidably arranged in a second axial chute provided inside the mounting disc. The inclined surface on the unlocking platform is slidably fitted with the inclined surface at the middle through hole of the plug rod.

[0009] As an improvement: A protection mechanism is provided on the rotating platform. The protection mechanism includes a piston and a clamping platform. A second sliding cavity is provided inside the negative pressure ring cavity. The piston and the clamping platform are slidably arranged in the second sliding cavity. A threaded column is provided at the bottom of the piston. A threaded hole matching the threaded column is provided at the top of the clamping platform. A clamping ring is provided on the outer side of the bottom of the clamping platform. The clamping ring is clamped with a groove on the inner side of the second sliding cavity. A ventilation groove is provided on the side of the clamping platform. A ventilation hole penetrating the rotating platform is provided at the bottom of the second sliding cavity.

[0010] As an improvement: A connecting platform is provided at the bottom of the lifting ring platform. A transmission plate is provided inside the connecting platform. Wing plates connected to the connecting platform are provided on the outer side of the transmission plate. A pushing platform is provided at the top of the transmission plate. The pushing platform is in contact and cooperation with the bottom of the mounting disc. A pulling plate is provided at the top of the lifting ring platform. The pulling plate is in contact and cooperation with a groove on the top of the mounting disc.

[0011] As an improvement: A pressing plate is provided at the bottom of the unlocking platform. A second spring is provided between the pressing plate and the bottom of the mounting disc. The pressing plate is in contact and cooperation with the top of the lifting ring platform. After the plug rod disengages from the slot, the pushing platform is in contact with the bottom of the mounting disc.

[0012] As an improvement: The positioning mechanism includes a second motor, a rotating ring and a gripper. The second motor is arranged inside the lifting ring platform. The rotating ring is rotatably arranged in a rotating groove inside the lifting ring platform. A second gear is provided at the output end of the second motor. A toothed ring meshing with the second gear is provided at the bottom of the rotating ring. The gripper slides radially on the lifting ring platform, and the lifting ring platform drives the gripper to move radially.

[0013] As an improvement: The gripper includes a moving platform. A spiral groove is provided at the top of the rotating ring. A driving platform matching the spiral groove is provided at the bottom of the moving platform. A clamping plate is provided at the front side of the moving platform. A sliding rod is provided at the rear side of the clamping plate. The sliding rod is slidably fitted with a through hole on the moving platform. A third spring is provided on the outer side of the moving platform.

[0014] As an improvement: A rotating shaft is provided at the bottom of the rotating platform. A limiting ring is provided on the rotating shaft. A retaining platform rotatably fitted with the limiting ring is provided on the inner side of the housing. A first gear is provided at the bottom of the rotating shaft. The output end of the first motor is in transmission cooperation with the first gear through a gear set.

[0015] The beneficial effects of the present invention compared with the prior art are as follows: This device realizes the automatic positioning and fixing work before wafer processing, can replace the rotating mechanisms in most wafer processing equipment, and can be used alone as a split-type rotating device, which is more comprehensive and efficient. Specifically:

[0016] 1. Through the cooperation of the negative pressure generating mechanism and the lifting mechanism, the lifting action of the arc-shaped plate generates negative pressure in the negative pressure ring cavity, thereby fixing the wafer on the rotating table. Through the pushing of the lifting mechanism, the wafer is separated from the rotating table, facilitating transfer.

[0017] 2. Through the cooperation of the positioning mechanism and the lifting mechanism, the positioning of the wafer is achieved. Through the synchronous radial movement and clamping of multiple grippers, the axis of the wafer coincides with the axis of the rotating table, facilitating subsequent processing.

[0018] 3. Through the limiting mechanism, the mounting disk is fixed after descending to a certain position, thereby stabilizing the negative pressure in the negative pressure ring cavity and also forming a movable fit between the transmission plate and the mounting disk. During the rotation of the rotating table, the load and friction are reduced, improving the rotation efficiency.

[0019] 4. Through the protection mechanism, the functions of adjusting the preset negative pressure value and reducing the negative pressure protection when the negative pressure exceeds the critical value are achieved, which can effectively avoid the problem of wafer damage caused by excessive negative pressure and protect the wafer. Description of the Drawings

[0020] Figure 1 is a schematic structural diagram of a wafer rotating processing device of the present invention.

[0021] Figure 2 is an exploded view of a wafer rotating processing device of the present invention.

[0022] Figure 3 is a cross-section of a wafer rotating processing device of the present invention Figure 1 .

[0023] Figure 4 is a cross-section of a wafer rotating processing device of the present invention Figure 2 .

[0024] Figure 5 is a schematic structural diagram of the rotating mechanism and the negative pressure generating mechanism of a wafer rotating processing device of the present invention.

[0025] Figure 6 is an exploded view of the rotating mechanism and the negative pressure generating mechanism of a wafer rotating processing device of the present invention.

[0026] Figure 7 is a cross-sectional view of the rotating mechanism and the negative pressure generating mechanism of a wafer rotating processing device of the present invention.

[0027] Figure 8 is a cross-sectional view of the limiting mechanism of a wafer rotating processing device of the present invention.

[0028] Figure 9 is a schematic structural diagram of the protection mechanism of a wafer rotating processing device of the present invention.

[0029] Figure 10 It is a schematic structural diagram of the lifting mechanism and positioning mechanism of a wafer rotating processing device according to the present invention.

[0030] Figure 11 It is a cross-sectional view of the lifting mechanism and positioning mechanism of a wafer rotating processing device according to the present invention.

[0031] Figure 12 It is an exploded view of the lifting mechanism and positioning mechanism of a wafer rotating processing device according to the present invention.

[0032] Figure 13 It is a schematic structural diagram of the positioning mechanism of a wafer rotating processing device according to the present invention.

[0033] Figure 14 It is a schematic structural diagram of the gripper of a wafer rotating processing device according to the present invention.

[0034] As shown in the figure: 01, wafer; 1, housing; 2, rotating mechanism; 3, negative pressure generating mechanism; 4, limiting mechanism; 5, protection mechanism; 6, lifting mechanism; 7, positioning mechanism; 8, motor one; 11, limiting groove; 12, holding table; 21, rotating table; 22, rotating shaft; 221, limiting ring; 23, gear one; 24, negative pressure ring cavity; 25, connecting groove; 26, sliding cavity one; 27, sliding cavity two; 28, ventilation hole; 29, slot; 31, mounting plate; 311, sliding groove one; 312, sliding groove two; 32, arc plate; 321, ball; 41, inserting rod; 42, spring one; 43, unlocking table; 44, abutting plate; 45, spring two; 51, piston; 511, threaded column; 52, clamping position table; 521, clamping ring; 522, ventilation groove; 61, cylinder; 62, lifting ring table; 621, connecting table; 622, limiting plate; 623, rotating groove; 624, liquid discharge hole; 63, transmission plate; 631, wing plate; 632, pushing table; 633, pulling plate; 71, motor two; 711, gear two; 72, rotating ring; 721, spiral groove; 722, toothed ring; 73, gripper; 731, moving table; 732, driving table; 733, clamping plate; 734, sliding rod; 735, spring three; 81, gear three; 82, gear four; 83, gear five. Specific embodiments

[0035] The following further elaborates on the present invention with reference to the accompanying drawings.

[0036] Combined with the attached Figure 1 、attached Figure 2 、attached Figure 3 and attached Figure 5As shown in the figure, a wafer rotating processing device includes a housing 1. A rotating mechanism 2 for driving the rotation of the wafer 01 is provided on the housing 1. A first motor 8 for driving the rotation of the rotating mechanism 2 is provided inside the housing 1. The rotating mechanism 2 includes a rotating table 21. A plurality of layers of negative pressure ring cavities 24 are provided on the top of the rotating table 21. The negative pressure ring cavities 24 are communicated with each other through connecting grooves 25. A liftable negative pressure generating mechanism 3 is provided at the bottom of the rotating table 21. A lifting mechanism 6 is provided inside the housing 1. The lifting mechanism 6 drives the negative pressure generating mechanism 3 to complete the lifting action. A positioning mechanism 7 is provided at the top of the lifting mechanism 6. The positioning mechanism 7 clamps the wafer 01 in the axial and radial directions to make the axis of the wafer 01 coincide with the axis of the rotating table 21.

[0037] Combined with the attached Figure 6 、attached Figure 7 、attached Figure 8 and attached Figure 12 As shown in the figure, the negative pressure generating mechanism 3 includes a mounting plate 31. A plurality of arc-shaped plates 32 are evenly provided on the top of the mounting plate 31. Ball bearings 321 are provided in the ball grooves at the tops of the arc-shaped plates 32. A first sliding cavity 26 for slidingly cooperating with the arc-shaped plates 32 is provided in the negative pressure ring cavity 24. A limiting mechanism 4 is provided inside the mounting plate 31. The limiting mechanism 4 includes a plug rod 41 and an unlocking platform 43. The plug rod 41 is slidably arranged in a first radial chute 311 provided inside the mounting plate 31. The front end of the plug rod 41 is inserted and cooperated with a slot 29 on the inner side of the bottom of the rotating table 21. A first spring 42 is provided at the rear end of the plug rod 41. The unlocking platform 43 is slidably arranged in a second axial chute 312 provided inside the mounting plate 31. The inclined surface on the unlocking platform 43 is slidably cooperated with the inclined surface at the middle through hole of the plug rod 41. A pressing plate 44 is provided at the bottom of the unlocking platform 43. A second spring 45 is provided between the pressing plate 44 and the bottom of the mounting plate 31. The pressing plate 44 is in contact and cooperation with the top of the lifting ring platform 62. After the plug rod 41 disengages from the slot 29, the pushing platform 632 is in contact with the bottom of the mounting plate 31.

[0038] The working principle of the negative pressure generating mechanism 3 and the limiting mechanism 4 is as follows: the wafer 01 is placed on the top of the mounting plate 31. After the center is positioned by the positioning mechanism 7, the mounting plate 31 is driven to descend by the lifting mechanism 6. The arc plate 32 descends with the mounting plate 31, and the arc plate 32 descends in the slide cavity 26, thereby generating negative pressure in the negative pressure ring cavity 24, and the wafer 01 is adsorbed and fixed on the mounting plate 31. During the descending process of the mounting plate 31, after the slide groove 311 is aligned with the slot 29, the insertion rod 41 in the slide groove 311 is inserted into the slot 29 under the push of the spring 42, so that the mounting plate 31 is fixed in position, thereby stabilizing the negative pressure in the negative pressure ring cavity 24. When the lifting ring platform 62 and the transmission plate 63 of the lifting mechanism 6 rise, the transmission plate 63 first contacts the abutment plate 44, pushing the unlocking platform 43 to rise, and the inclined surface of the unlocking platform 43 slides with the inclined surface at the middle through hole of the insertion rod 41 to push the insertion rod 41 to reset, so that the limit mechanism 4 is unlocked. At this time, the negative pressure generating mechanism 3 will rise a distance due to the negative pressure. After the transmission plate 63 continues to rise, the pushing platform 632 contacts the bottom of the mounting plate 31, pushing the mounting plate 31 and the arc plate 32 to rise, and the ball on the top of the arc plate 32 contacts the back of the wafer 01 and pushes the wafer 01 to rise, which is convenient for workers to take it away, the robot to transfer it, and the positioning of the positioning mechanism 7.

[0039] Combined with Figure 7 and attached Figure 9 As shown, a protection mechanism 5 is provided on the rotating table 21, and the protection mechanism 5 includes a piston 51 and a positioning platform 52. A sliding cavity 27 is provided in the negative pressure ring cavity 24. The piston 51 and the positioning platform 52 are slidably arranged in the sliding cavity 27. A threaded column 511 is provided at the bottom of the piston 51, and a threaded hole matching the threaded column 511 is provided at the top of the positioning platform 52. A retaining ring 521 is provided on the outer side of the bottom of the positioning platform 52, and the retaining ring 521 is clamped with the groove on the inner side of the sliding cavity 27. A ventilation groove 522 is provided on the side of the positioning platform 52, and a ventilation hole 28 that passes through the rotating table 21 is provided at the bottom of the sliding cavity 27.

[0040] Working principle of protection mechanism 5: In order to avoid excessive negative pressure in the negative pressure ring cavity 24 and damage to wafer 01, protection mechanism 5 needs to adjust the preset negative pressure value and the negative pressure protection when the negative pressure exceeds the critical value. According to the size and model of wafer 01, before installing wafer 01, the position of piston 51 in sliding cavity 27 is adjusted by rotating piston 51. Since the descending amount of arc plate 32 is fixed, the negative pressure space size is adjusted by adjusting the height of piston 51. When piston 51 is at a high position, the negative pressure space is small and the negative pressure generated becomes smaller, otherwise it becomes larger. Through the ventilation groove 522 and the ventilation hole 28, an air pressure difference is generated on the upper and lower sides of piston 51, and protection mechanism 5 is subjected to an upward force. After the negative pressure exceeds the critical value, the retaining ring 521 disengages from the inner groove of sliding cavity 27, thereby causing piston 51 to rise, reducing the negative pressure space, thereby reducing the negative pressure value and protecting wafer 01.

[0041] Combined withFigure 3 、Attached Figure 10 、Attached Figure 11 and attached Figure 12 As shown in the attached figures, the lifting mechanism 6 includes a cylinder 61 and a lifting ring platform 62. The output end of the cylinder 61 is connected to the lifting ring platform 62. The lifting ring platform 62 is slidably arranged outside the rotating platform 21. A connecting platform 621 is provided at the bottom of the lifting ring platform 62. A limiting plate 622 is provided outside the connecting platform 621. A limiting groove 11 that cooperates with the limiting plate 622 is provided inside the housing 1. A transmission plate 63 is provided inside the connecting platform 621. A wing plate 631 connected to the connecting platform 621 is provided outside the transmission plate 63. A pushing platform 632 is provided at the top of the transmission plate 63. The pushing platform 632 is in contact and cooperation with the bottom of the mounting plate 31. A pulling plate 633 is provided at the top of the lifting ring platform 62. The pulling plate 633 is in contact and cooperation with the groove at the top of the mounting plate 31.

[0042] Working principle of the lifting mechanism 6: The cylinder 61 pushes the lifting ring platform 62 to rise and fall. The transmission plate 63 moves along with the lifting ring platform 62. When the transmission plate 63 rises, it will cooperate with the limiting mechanism 4 through the transmission plate 63 to unlock the limiting mechanism 4. Then, the pushing platform 632 pushes the mounting plate 31 and the arc plate 32 to rise, so that the arc plate 32 jacks up the wafer 01. When the lifting ring platform 62 descends, the pulling plate 633 cooperates with the groove at the top of the mounting plate 31 to pull the mounting plate 31 down.

[0043] Combined with the attached Figure 11 、Attached Figure 12 、Attached Figure 13 and attached Figure 14 As shown in the attached figures, the positioning mechanism 7 includes a second motor 71, a rotating ring 72 and a gripper 73. The second motor 71 is arranged inside the lifting ring platform 62. The rotating ring 72 is rotatably arranged in a rotating groove 623 inside the lifting ring platform 62. A second gear 711 is provided at the output end of the second motor 71. A toothed ring 722 meshing with the second gear 711 is provided at the bottom of the rotating ring 72. The gripper 73 slides radially on the lifting ring platform 62. The lifting ring platform 62 drives the gripper 73 to move radially. A liquid discharge hole 624 communicating with the rotating groove 623 is provided outside the lifting ring platform 62. A liquid blocking boss is provided inside the rotating groove 623 near the second gear 711. The gripper 73 includes a moving platform 731. A spiral groove 721 is provided at the top of the rotating ring 72. A driving platform 732 cooperating with the spiral groove 721 is provided at the bottom of the moving platform 731. A clamping plate 733 is provided at the front side of the moving platform 731. A sliding rod 734 is provided at the rear side of the clamping plate 733. The sliding rod 734 is slidably matched with a through hole on the moving platform 731. A third spring 735 is provided outside the moving platform 731.

[0044] Working principle of the positioning mechanism 7: After the lifting ring platform 62 rises to a certain position, the wafer 01 is lifted by the arc-shaped plate 32 at this time and does not contact the rotating table 21. During positioning, the second motor 71 drives the second gear 711 to rotate. Through the meshing transmission between the second gear 711 and the toothed ring 722, the rotating ring 72 rotates. Through the cooperation between the spiral groove 721 and the driving platform 732, the moving platform 731 moves horizontally in the radial direction. During the process of the moving platform 731 approaching the wafer 01, the clamping plate 733 contacts the edge of the wafer 01 and pushes the wafer 01 to move on the ball 321 on the top of the arc-shaped plate 32 until the wafer contacts multiple clamping plates 733, making the axis of the wafer 01 coincide with the axis of the rotating table 21. After the positioning is completed, the positioning mechanism 7 resets and descends with the lifting ring platform 62. At least 4 sets of clamps 73 are provided to avoid the influence of the positioning trimming of the wafer 01 on the positioning.

[0045] Combined with the attached Figure 2 and the attached Figure 4 As shown, a rotating shaft 22 is provided at the bottom of the rotating table 21. A limiting ring 221 is provided on the rotating shaft 22. An inner side of the housing 1 is provided with a holding platform 12 that is rotationally matched with the limiting ring 221. A first gear 23 is provided at the bottom of the rotating shaft 22. The output end of the first motor 8 is in transmission cooperation with the first gear 23 through a gear set. A third gear 81 is provided at the output end of the first motor 8. A fourth gear 82 and a fifth gear 83 that are coaxially connected are rotatably provided in the housing 1. The third gear 81 meshes with the fourth gear 82, and the fifth gear 83 meshes with the first gear 23.

[0046] Working principle of the rotation of the rotating table 21: The first motor 8 drives the third gear 81 to rotate. Through the meshing transmission between the third gear 81 and the fourth gear 82, the fourth gear 82 rotates, driving the fifth gear 83 that is coaxially connected with the fourth gear 82 to rotate. Through the meshing transmission between the fifth gear 83 and the first gear 23, the rotating shaft 22 rotates, driving the rotating table 21 to rotate. The negative pressure generating mechanism 3, the limiting mechanism 4, and the protection mechanism 5 rotate with the rotating table 21.

[0047] When the present invention is specifically implemented, during the installation stage of the wafer 01, the lifting ring platform 62 rises, and the negative pressure generating mechanism 3 rises accordingly. The wafer 01 is placed on the arc-shaped plate 32, and the wafer is positioned by the positioning mechanism 7. After the positioning is completed, the positioning mechanism 7 and the lifting mechanism 6 reset. During the descent of the lifting ring platform 62, the negative pressure generating mechanism 3 is driven to descend, causing the wafer 01 to fall onto the rotating table 21 and generating negative pressure in the negative pressure ring cavity 24 to fix the wafer 01 on the rotating table 21. During this process, the wafer 01 is protected by the protection mechanism 5 to avoid damage to the wafer 01 caused by excessive negative pressure. The mounting disk 31 is fixed by the limiting mechanism 4. Subsequently, the lifting ring platform 62 rises a certain distance again, so that the transmission plate 63 does not contact the mounting disk 31. Subsequently, the first motor 8 drives the rotating table 21 to rotate, driving the wafer 01 to rotate and processing the wafer 01.

[0048] This device can be installed separately in deposition equipment, cleaning equipment, and polishing equipment to replace the rotating mechanism of the equipment, or installed on a multi-axis robotic arm. In an integrated processing space, the wafer 01 can be transferred and processed in multiple equipment by gripping this device with the robotic arm. This device can also adopt a split process, with fixed points, positioning points, and power-on contacts set outside the housing 1, and this device can be used as a transfer mechanism, a rotating mechanism, and a positioning mechanism.

[0049] The above describes the present invention and its implementation manners. Such description is not restrictive. What is shown in the drawings is only one of the implementation manners of the present invention, and the actual structure is not limited thereto. In general, if those of ordinary skill in the art are inspired by it and, without departing from the purpose of the present invention, design similar structural manners and embodiments to this technical solution without creative efforts, they shall fall within the protection scope of the present invention.

Claims

1. A wafer rotation processing device, comprising a housing (1), a rotating mechanism (2) for driving a wafer (01) to rotate is disposed on the housing (1), and a motor (8) for driving the rotating mechanism (2) to rotate is disposed in the housing (1), characterized in that: The rotating mechanism (2) comprises a rotating table (21), a top of the rotating table (21) is provided with a plurality of negative pressure annular cavities (24), the negative pressure annular cavities (24) are connected to each other via a connecting groove (25), a bottom of the rotating table (21) is provided with a negative pressure generating mechanism (3) that can be raised and lowered, the negative pressure generating mechanism (3) comprises a mounting plate (31), a top of the mounting plate (31) is evenly provided with a plurality of arc-shaped plates (32), and a sliding cavity (26) that slidably cooperates with the arc-shaped plates (32) is provided in the negative pressure annular cavity (24); A lifting mechanism (6) is provided in the shell (1), the lifting mechanism (6) comprising a cylinder (61) and a lifting ring platform (62), the output end of the cylinder (61) is connected to the lifting ring platform (62), the lifting ring platform (62) is slidably arranged outside the rotating table (21), the lifting ring platform (62) drives the negative pressure generating mechanism (3) to complete the lifting action, and a positioning mechanism (7) is provided on the top of the lifting ring platform (62), the positioning mechanism (7) clamps the wafer (01) in the radial direction of the axis so that the axis of the wafer (01) coincides with the axis of the rotating table (21); The rotating table (21) is provided with a protection mechanism (5), the protection mechanism (5) comprising a piston (51) and a positioning platform (52), a second sliding chamber (27) is provided in the negative pressure ring chamber (24), the piston (51) and the positioning platform (52) are slidably arranged in the second sliding chamber (27), a threaded column (511) is provided at the bottom of the piston (51), a threaded hole matching the threaded column (511) is provided at the top of the positioning platform (52), a clamping ring (521) is provided at the outer side of the bottom of the positioning platform (52), the clamping ring (521) is clamped with the inner groove of the second sliding chamber (27), a ventilation groove (522) is provided on the side of the positioning platform (52), and a ventilation hole (28) penetrating the rotating table (21) is provided at the bottom of the second sliding chamber (27); A limiting mechanism (4) for limiting the descending position of the mounting plate (31) is provided inside the mounting plate (31).

2. The wafer rotation processing device according to claim 1, characterized in that: The limiting mechanism (4) comprises an insert rod (41) and an unlocking platform (43); the insert rod (41) is slidably arranged in a first slide groove (311) radially arranged inside the mounting plate (31); the front end of the insert rod (41) is plugged into a slot (29) on the inner side of the bottom of the rotating platform (21); a spring (42) is provided at the rear end of the insert rod (41); the unlocking platform (43) is slidably arranged in a second slide groove (312) axially arranged inside the mounting plate (31); and the inclined surface on the unlocking platform (43) is slidably matched with the inclined surface at the middle through hole of the insert rod (41).

3. The wafer rotation processing device according to claim 2, characterized in that: The bottom of the lifting ring platform (62) is provided with a connecting platform (621), the inner side of the connecting platform (621) is provided with a transmission plate (63), the outer side of the transmission plate (63) is provided with a wing plate (631) connected to the connecting platform (621), the top of the transmission plate (63) is provided with a push platform (632), the push platform (632) is in contact with the bottom of the mounting plate (31), and the top of the lifting ring platform (62) is provided with a pull plate (633), the pull plate (633) is in contact with a groove at the top of the mounting plate (31).

4. The wafer rotation processing device according to claim 3, characterized in that: A stop plate (44) is provided at the bottom of the unlocking platform (43), and a second spring (45) is provided between the stop plate (44) and the bottom of the mounting plate (31). The stop plate (44) is in contact with the top of the lifting ring platform (62), and after the insertion rod (41) is separated from the slot (29), the push platform (632) is in contact with the bottom of the mounting plate (31).

5. The wafer rotation processing device according to claim 1, characterized in that: The positioning mechanism (7) comprises a second motor (71), a rotating ring (72) and a clamp (73); the second motor (71) is arranged in the lifting ring platform (62); the rotating ring (72) rotates in a rotating groove (623) arranged inside the lifting ring platform (62); a second gear (711) is arranged at the output end of the second motor (71); a gear ring (722) meshing with the second gear (711) is arranged at the bottom of the rotating ring (72); the clamp (73) radially slides on the lifting ring platform (62); and the lifting ring platform (62) drives the clamp (73) to move radially.

6. The wafer rotation processing device according to claim 5, characterized in that: The clamp (73) comprises a moving platform (731), a vortex groove (721) is provided on the top of the rotating ring (72), a driving platform (732) matched with the vortex groove (721) is provided on the bottom of the moving platform (731), a clamping plate (733) is provided on the front side of the moving platform (731), a sliding rod (734) is provided on the rear side of the clamping plate (733), the sliding rod (734) is slidably matched with a through hole on the moving platform (731), and a spring three (735) is provided on the outer side of the moving platform (731).

7. The wafer rotation processing device according to claim 1, characterized in that: A rotating shaft (22) is provided at the bottom of the rotating platform (21), a limiting ring (221) is provided on the rotating shaft (22), a retaining platform (12) rotatably matched with the limiting ring (221) is provided on the inner side of the housing (1), a gear one (23) is provided at the bottom of the rotating shaft (22), and an output end of the motor one (8) is transmission-matched with the gear one (23) via a gear set.

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