IC substrate processing equipment based on positioning structure

Abstract

The present invention relates to the technical field of manufacturing electrical component assemblies, and discloses an IC substrate processing device based on a positioning structure, wherein the IC substrate processing device comprises a substrate body and a drilling machine body, wherein a bearing portion for positioning the substrate body is provided on the transport platform of the drilling machine body, and the bearing portion comprises a carrier frame for carrying the substrate body. The invention is provided with a support member, which passes through the limit frame of the movable frame until the fixed block is completely engaged with the inner side of the limit frame. At this time, a connecting rod is provided below the cavity of the carrier frame. The staff can change the position of the fixed block inside the limit frame by rotating the knob at different angles, thereby realizing the overall adjustment of the position of the connecting rod, and accurately adjusting the support block through the cavity of the carrier frame. The position of the support block outside the connecting rod is changed by the fixing pin, so that the support member can perform different support positioning on substrate bodies with various different drilling requirements.

Description

Technical Field

[0001] The present invention relates to the technical field of manufacturing electrical component assemblies, and in particular to an IC carrier processing device based on a positioning structure. Background Art

[0002] An IC substrate is a base plate used to package bare IC (integrated circuit) chips. It serves as the intermediate product connecting the chip and the circuit board. In the advanced packaging field, IC substrates have replaced traditional lead frames and become an indispensable component of chip packaging. They not only provide support, heat dissipation, and protection for the chip, but also provide an electronic connection between the chip and the PCB motherboard, playing a connecting role.

[0003] During the processing of IC carrier boards, it is necessary to drill holes in the substrate using a drilling machine. In the prior art, in order to ensure that no positioning error occurs during the drilling of the substrate, the bottom surface of the substrate is positioned completely flat on the workbench and then single-sided drilling is performed. However, with the increasing complexity of people's demands for electronic components, the positions of the circuit boards that need to be drilled are also more diverse. Relying solely on the pressure on the circuit board from one side cannot guarantee the stability of the circuit board during the hole rotation process. In addition, during the drilling process of the circuit board, its bottom surface needs to be close to the workbench to ensure that the circuit board will not be offset due to vibration during the drilling process. However, the drill bit can easily pass through the circuit board during drilling, causing damage to the surface of the workbench that is in contact with it. The workbench that has been drilled multiple times is not suitable for being set under circuit boards with other drilling requirements, and the workbench needs to be replaced, causing unnecessary losses. In view of this, the present invention provides an IC carrier board processing device based on a positioning structure. Summary of the Invention

[0004] Technical problems solved

[0005] In response to the above-mentioned shortcomings of the prior art, the present invention provides an IC substrate processing equipment based on a positioning structure, which can effectively solve the problem that during the drilling process of the IC substrate in the prior art, the drill bit penetrates the substrate, causing the workbench supporting it to be easily damaged and requiring frequent replacement.

[0006] Technical Solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions:

[0008] The present invention provides an IC substrate processing device based on a positioning structure, comprising a substrate body;

[0009] A drilling machine body, wherein a carrying portion for positioning a substrate body is provided on the drilling machine body transport platform, wherein the carrying portion includes a carrying frame for carrying the substrate body, wherein a positioning member for all-round limiting the surface of the substrate body is provided inside the carrying frame, wherein the bottom end of the carrying frame is fixedly connected to a movable frame, wherein the inside of the movable frame is slidably connected to a limiting frame, wherein a supporting member for supporting and positioning the bottom end of the substrate body is provided inside the limiting frame;

[0010] Wherein, the support member includes a support block for supporting and cleaning the periphery of the drilling hole of the substrate body;

[0011] The four inner walls of the carrier are all provided with side grooves, wherein a pair of the inner walls of the side grooves are provided with guide grooves, and compression springs are elastically connected to the positions of the side grooves near the center of the carrier;

[0012] The positioning member includes an electric push rod arranged on the outside of the carrier frame, a side pressure plate is provided at the output end of the electric push rod, a main shaft is fixedly connected to both ends of the side pressure plate, the main shaft is slidably connected to the inner wall of the guide groove, a push ring is slidably connected to the side of the guide groove away from the side pressure plate, a connecting rod is affixed to the other end of the push ring, the outer side of the connecting rod is movably connected to a limit plate, and the inner side of the connecting rod is elastically connected to a telescopic spring;

[0013] Among them, a magnetic part 1 is fixedly connected to the top of the limit frame, and the magnetic part 1 is magnetically connected to the magnetic part 2 fixed on the top of the inner wall of the movable frame. When the supporting frame has not entered the drilling space of the drilling machine body, the magnetic part 1 and the magnetic part 2 have the same magnetic properties. When the supporting frame enters the drilling space of the drilling machine body, the magnetic part 1 and the magnetic part 2 have opposite magnetic properties.

[0014] Furthermore, the support member also includes a fixing frame engaged with the limit frame, a positioning block engaged with the limit frame is symmetrically arranged on the inner side of the fixing frame, a knob is rotatably connected to the middle part of the outer side of the fixing frame, the knob is fixedly connected to the limit block on the side close to the fixing frame, the other end of the limit block is movably connected to the positioning plate, the other end of the positioning plate is fixedly connected to the connecting rod, and a plurality of support blocks are detachably connected to the outer side of the connecting rod.

[0015] Furthermore, the top of the support block is set to be a plane, the side of the top of the support block is set to be an arc, the inner side of the support block is slidably connected to a rubber block, the rubber block can form a complete arc with the top of the support block, and the bottom of the rubber block is elastically connected to a support spring.

[0016] Beneficial effects

[0017] Compared with the prior art, the technical solution provided by the present invention has the following beneficial effects:

[0018] The present invention is provided with a support member, and the support member is first passed through the limit frame of the movable frame until the fixed block is fully engaged with the inner side of the limit frame. At this time, the connecting rod is passed through and arranged under the cavity of the carrier frame. Then the knob is rotated, and the rotation of the knob drives the limit block to rotate. The rotation of the limit block squeezes the positioning block, so that the positioning block slides along the positioning groove to the concave groove provided inside the compression spring, thereby completing the positioning of the fixed block. When the knob is rotated ninety degrees, the positioning block is fully engaged with the concave groove, and the fixed block will not move. When the rotation angle of the knob is less than ninety degrees, the positioning block is not fully engaged with the concave groove, and the fixed block can be in the concave groove. The staff can slide under the restriction of the shaped groove, and the staff can change the position of the fixed block on the inner side of the limit frame by rotating the knob at different angles, thereby realizing the overall adjustment of the connecting rod position. After the installation position of the connecting rod is determined, the position of the support block is determined. The staff can check the position of each support block before installing the support member, or after the support member is installed, the support block can be precisely adjusted through the cavity of the carrier frame. The fixing pin connected to the outside of the support block is engaged, and the position of the support block on the outside of the connecting rod is changed by the fixing pin, so that the support member can perform different support positioning for the substrate body with various different drilling requirements.

[0019] The present invention provides a support block, and the limit frame moves upward to drive the support member engaged therein to move upward as a whole, and the rubber block on the upper surface of the support block moves to the inside of the support block. At this time, the fixed plane on the upper surface of the support block fits with the bottom end of the substrate body, thereby stably supporting the bottom end of the substrate body. When the drilling operation is performed, the support block on the side of the hole wall can support the drilling position, avoiding the situation where stress concentration occurs on the substrate body due to drilling. The drill bit of the drilling machine body will not contact the support member after passing through the substrate body. The dispersed fixed blocks can not only provide sufficient support for the bottom end of the substrate body, but also will not be damaged due to the drill bit passing through the carrier, thereby improving the service life of the device. , reducing the waste of resources. After the drilling operation is completed, the substrate body moves out of the drilling machine space, and the magnetic field direction of the magnetic part 2 is restored to a state of mutual repulsion with the magnetic part 1. The limit frame is forced to slide to the bottom end of the inner wall of the movable frame. At this time, the rubber block in the support block is restored to a state of close fit with the bottom end of the substrate body. The staff pulls the knob, and the knob drives the limit block to slide inside the fixed block. The movement of the limit block drives the positioning plate to move, and the positioning plate drives the connecting rod to move horizontally to the position of a hole wall. The connecting rod drives the support block to move. At the same time, the support block moves and the rubber block that is closely fitted with the bottom end of the substrate body moves. The reciprocating movement of the rubber block can clean the burrs at the bottom end of the drilled hole.

[0020] The present invention sets a movable frame. Before the drilling structure of the drilling machine body moves down to drill the substrate main body, the magnetic field direction of the magnetic part two is the same as the magnetic field direction of the magnetic part one. The magnetic part two and the magnetic part one have the same magnetism and repel each other, ensuring that the limit frame is located at the bottom end of the inner wall of the movable frame before the drilling operation is performed. When the drilling structure of the drilling machine body moves down to drill the substrate main body, the magnetic field direction of the magnetic part two is opposite to the magnetic field direction of the magnetic part one. The magnetic part two and the magnetic part one have the same magnetism and attract each other. The limit frame is located at the top end of the inner wall of the movable frame when the drilling operation is performed.

[0021] The present invention provides a positioning piece, and in the process of the main shaft moving to the side edge of the guide groove to drive the side pressure plate to move down to apply pressure on both sides of the upper surface of the substrate main body, as the main shaft gets closer to the side edge of the guide groove, the main shaft will contact the push ring, and the push ring will be squeezed by the main shaft, and the push ring will slide along the open groove of the guide groove. The push ring moves to squeeze the slider of the connecting rod, and the slider of the connecting rod overcomes the elastic force of the telescopic spring and slides along the long rod. The movement of the slider drives the connecting rod to rotate, and the rotation of the connecting rod will move out the limit plate embedded in the inner side of the side groove, and the small-sized arc-shaped limit strips on the outer side of the limit plate squeeze the other two side edges of the substrate main body, and the large-sized arc-shaped limit strips on the outer side of the limit plate will move to the upper surface of the substrate main body, thereby limiting the other two sides of the upper surface of the substrate main body, realizing all-round limitation of the substrate main body, and improving the stability of the substrate main body during drilling. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. Those skilled in the art can also derive other drawings based on these drawings without inventive effort.

[0023] Figure 1 A schematic diagram of a positioning process flow of an IC substrate processing device according to an embodiment of the present invention;

[0024] Figure 2 Schematic diagram of the overall structure of an embodiment of the present invention;

[0025] Figure 3 Schematic diagram of the structure of the bearing portion according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the connection structure of the positioning member according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic structural diagram of the carrier frame according to an embodiment of the present invention when no circuit board is carried;

[0028] Figure 6A schematic diagram of a support structure according to an embodiment of the present invention;

[0029] Figure 7 Schematic diagram of the movable frame structure according to an embodiment of the present invention.

[0030] The numbers in the figure represent: 1. Drilling machine body; 2. Bearing part; 21. Bearing frame; 211. Side groove; 212. Guide groove; 213. Compression spring; 22. Positioning member; 221. Electric push rod; 222. Side pressure plate; 223. Push ring; 224. Telescopic spring; 225. Connecting rod; 226. Limit plate; 227. Spindle; 23. Movable frame; 231. Limit frame; 232. Magnetic part 1; 233. Magnetic part 2; 24. Support member; 241. Fixed frame; 242. Connecting rod; 243. Support block; 245. Positioning block; 246. Limit block; 247. Knob; 248. Positioning plate; 3. Base plate body. DETAILED DESCRIPTION

[0031] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0032] The present invention will be further described below with reference to the embodiments.

[0033] Example

[0034] See also Figure 2-Figure 7 The present invention provides an IC substrate processing device based on a positioning structure, including a drilling body 1 for performing a drilling operation, and a carrying portion 2 is placed on the upper surface of the drilling body 1.

[0035] refer to Figure 2 、 Figure 3 and Figure 4 The carrying portion 2 includes a carrier 21 for placing the substrate body 3, and a positioning member 22 is provided on the inner wall of the side of the carrier 21 for pressing and limiting the side of the substrate body 3. Figure 5 As shown, the carrier 21 is set to a hollow state. The rectangle at the bottom of the carrier 21 is smaller than the size of the substrate body 3, and the rectangular groove in the middle of the carrier 21 is larger than the size of the substrate body 3. Therefore, the substrate body 3 can fall smoothly into the carrier 21. The carrier 21 supports and positions the bottom of the circuit board. The inner wall of the carrier 21 is provided with a side groove 211 for limiting the positioning member 22. Figure 4As shown, there are two symmetrically arranged side grooves 211, and the two side grooves 211 are fixedly connected to the position away from the center of the carrier frame 21 with an electric push rod 221, the output end of the electric push rod 221 is hingedly connected to the fixed block, and the other end of the fixed block is fixedly connected to the side pressure plate 222, and the two ends of the side pressure plate 222 are fixedly connected to the main shaft 227, and the main shaft 227 is slidably connected to the guide groove 212 opened on the inner wall of the side groove 211, and the guide groove 212 consists of a notch and an oblique groove connected to the bottom of the notch.

[0036] In the initial state, the main shaft 227 is located above the inner inclined groove of the slot. As the electric push rod 221 extends and pushes the side pressure plate 222, the side pressure plate 222 moves and drives the side pressure plate 222 to move. The side pressure plate 222 slides along the side groove 211, and the side pressure plate 222 drives the main shaft 227 to slide. The moving trajectory of the electric push rod 221 is the same as the sliding trajectory of the main shaft 227 inside the guide groove 212. Under the push of the electric push rod 221, the side pressure plate 222 moves from the position completely embedded in the side groove 211 to the position where its outer end passes through the side groove 211 and is located above the side of the substrate body 3. Position, when the main shaft 227 moves to the bottom end position of the inclined groove of the guide groove 212, the side pressure plate 222 moves downward, and the fixed block between the side pressure plate 222 and the electric push rod 221 rotates, and the side pressure plate 222 presses the upper surface of the substrate body 3, and the inner wall of the side groove 211 is elastically connected to the position near the center of the carrier 21. When the side pressure plate 222 moves downward to press the upper surface of the substrate body 3, further pressure is applied to ensure that the side pressure plate 222 can provide sufficient pressure on the upper surface of the substrate body 3 to avoid vibration of the substrate body 3 during rotation.

[0037] The bottom end of the inclined groove of the guide groove 212 is provided with an open groove on one side, and a push ring 223 is slidably connected to the inside of the open groove. A connecting rod 225 is provided at the other end of the push ring 223. The connecting rod 225 includes a slider fixedly connected to the side of the push ring 223. In the initial state, the slider fits the side of the guide groove 212, and the limit plate 226 is completely embedded in the inner side of the side groove 211. When the main shaft 227 moves to the side position of the bottom end of the guide groove 212, the main shaft 227 squeezes the push ring 223, and the push ring 223 moves out of the open groove to apply thrust to the slider fit therewith. A long rod is provided through the center of the slider, and the slider slides along the long rod. The two ends of the long rod are respectively connected to the side The inner wall of the groove 211 is fixedly connected, and the slider is rotatably connected to a connecting rod near the center of the carrier 21. The connecting rods are rotatably connected by a rotating shaft, and the connecting rod connection is embedded in the rectangular block on the side of the limit plate 226. A telescopic spring 224 is also sleeved on the outside of the long rod. The two ends of the telescopic spring 224 are respectively fitted with the slider. In the initial state, when the other side of the slider is fitted with the open groove of the guide groove 212, the telescopic spring 224 is in a normal state. Two arc-shaped limit strips are provided on the other side of the limit plate 226. The larger arc-shaped limit strip is located at the top, and the smaller arc-shaped limit strip is located at the bottom, and the height of the limit plate 226 is greater than the height of the side pressure plate 222.

[0038] In the process of the main shaft 227 moving to the side of the guide groove 212 to drive the side pressure plate 222 to move down and pressurize both sides of the upper surface of the substrate body 3, as the main shaft 227 gets closer to the side of the guide groove 212, the main shaft 227 will contact the push ring 223, and the push ring 223 will be squeezed by the main shaft 227. The push ring 223 slides along the open groove of the guide groove 212, and the push ring 223 moves to squeeze the slider of the connecting rod 225. The slider of the connecting rod 225 overcomes the elasticity of the telescopic spring 224. The force slides along the long rod, and the movement of the slider drives the connecting rod to rotate. The rotation of the connecting rod will move out the limit plate 226 embedded in the inner side of the side groove 211, and the small-sized arc-shaped limit strip on the outside of the limit plate 226 will squeeze the other two sides of the substrate body 3. The large-sized arc-shaped limit strip on the outside of the limit plate 226 will move to the upper surface of the substrate body 3, thereby limiting the other two sides of the upper surface of the substrate body 3, realizing all-round limitation of the substrate body 3, and improving the stability of the substrate body 3 during the hole rotation process.

[0039] refer to Figure 5 、 Figure 6 and Figure 7The bottom of the supporting frame 21 is fixedly connected to a movable frame 23, and the inner side of the movable frame 23 is slidably connected to the limit frame 231. In the initial state, the limit frame 231 is located at the bottom end of the inner wall of the movable frame 23. The inner wall of the movable frame 23 is provided with a groove for limiting the side of the limit frame 231, so as to ensure the smooth sliding of the limit frame 231. The top of the limit frame 231 is fixedly connected to a magnetic piece 1 232, and the bottom end of the inner wall of the movable frame 23 is fixedly connected to a magnetic piece 233 that is magnetically connected to the magnetic piece 1 232. Before the drilling structure of the drilling machine body 1 moves down to drill the substrate main body 3, the magnetic piece 233 is fixedly connected to the magnetic piece 232. The magnetic field direction of magnetic part 233 is the same as that of magnetic part 1 232. Magnetic part 233 and magnetic part 1 232 have the same magnetism and repel each other, ensuring that the limit frame 231 is located at the top of the inner wall of the movable frame 23 before the drilling operation is performed. When the drilling structure of the drilling machine body 1 moves down to perform the drilling operation on the substrate main body 3, the magnetic field direction of magnetic part 233 is opposite to that of magnetic part 1 232. Magnetic part 2 233 and magnetic part 1 232 have the same magnetism and attract each other. The limit frame 231 is located at the top of the inner wall of the movable frame 23 when the drilling operation is performed.

[0040] A support member 24 is provided on the inner side of the limit frame 231. The support member 24 includes a fixing frame 241 embedded in the inner side of the limit frame 231. A positioning groove is provided inside the fixing frame 241. A positioning block 245 is slidably connected to the inner side of the positioning groove. Two positioning blocks 245 are symmetrically arranged. The size of the positioning block 245 is equal to the size of the concave groove provided in the middle part of the inner side of the limit frame 231, and rubber strips are fixedly connected on both sides of the positioning block 245. When the positioning block 245 is inserted into the inner side of the concave groove, the friction between the two can be increased to ensure the stability of the engagement of the two. At the same time, the positioning block 245 that is not subjected to external force can be limited to prevent it from being moved from the fixed position due to its own gravity. The limit block 246 slides down in the positioning groove, and the middle part of the positioning groove is rotated to connect with the limiting block 246. The limiting block 246 includes a circular shaft, and the outer surface of the circular shaft is symmetrically fixedly connected with an arc plate. The side of the arc plate fits with the positioning block 245, and the positioning block 245 that is completely embedded in the inner side of the positioning groove in the initial state can be squeezed out of the positioning groove. The outer end of the limiting block 246 is fixedly connected with a knob 247 for easy operation by the staff. The other end of the limiting block 246 is engaged in the circular groove on the inner wall of the positioning plate 248. The limiting block 246 can rotate inside the circular groove. The other end of the positioning plate 248 is fixedly connected with a connecting rod 242, and a plurality of support blocks 243 are detachably connected to the outer side of the connecting rod 242.

[0041] Before the carrier 21 carries the substrate body 3, the support member 24 is first passed through the limit frame 231 of the movable frame 23 until the fixed frame 241 is fully engaged with the inner side of the limit frame 231. At this time, the connecting rod 242 is passed through the lower cavity of the carrier 21, and then the knob 247 is rotated. The rotation of the knob 247 drives the limit block 246 to rotate. The limit block 246 rotates to squeeze the positioning block 245, so that the positioning block 245 slides along the positioning groove to the concave groove set inside the compression spring 213, thereby completing the positioning of the fixed frame 241. When the knob 247 is rotated 90 degrees, the positioning block 245 is fully engaged with the concave groove, and the fixed frame 241 will not move. When the rotation angle of the knob 247 is less than 90 degrees, the positioning block 245 is not fully engaged with the concave groove. The fixing frame 241 can slide under the restriction of the concave groove, and the staff can change the position of the fixing frame 241 on the inner side of the limit frame 231 through the different rotation angles of the knob 247, thereby realizing the overall adjustment of the position of the connecting rod 242. After the installation position of the connecting rod 242 is determined, the position of the support block 243 is determined. The staff can check the position of each support block 243 before installing the support member 24, or after the support member 24 is installed, the support block 243 can be precisely adjusted through the cavity of the carrier 21. The fixing pin connected to the outside of the support block 243 is engaged, and the position of the support block 243 on the outside of the connecting rod 242 is changed through the fixing pin, so that the support member 24 can perform different support positioning on the substrate body 3 with various different drilling requirements.

[0042] A support spring is elastically connected to the inner side of the support block 243, and a rubber block is elastically connected to the top of the support spring. In the initial state, the rubber block is supported by the support spring so that the upper surface of the support block 243 is a complete arc. When the rubber block is squeezed by external force, the rubber block is embedded in the inner side of the support block 243. At this time, the top of the support block 243 is a horizontal plane.

[0043] After the substrate body 3 is placed in the carrier 21, the bottom end of the substrate body 3 contacts the rubber block on the upper surface of the support block 243, and the rubber block fits tightly with the bottom end of the substrate body 3. The upper surface of the substrate body 3 is limited by the positioning member 22, and the lower surface is supported by the support member 24. When the drilling machine body 1 performs a drilling operation on the substrate body 3, the direction of the magnetic field of the magnetic member 233 changes, and the limiting frame 231 moves upward quickly under the action of the magnetic field of the magnetic member 1 232. The upward movement of the limiting frame 231 drives the support member 24 engaged therein to move upward as a whole, and the rubber block on the upper surface of the support block 243 moves to the support block On the inner side of 243, the fixed plane on the upper surface of the support block 243 is in contact with the bottom end of the substrate body 3, thereby stably supporting the bottom end of the substrate body 3. When drilling, the support block 243 on the side of the hole wall can support the drilling position to avoid stress concentration on the substrate body 3 due to drilling. The drill bit of the drilling machine body 1 will not contact the support member 24 after passing through the substrate body 3. The dispersed fixing frames 241 can not only provide sufficient support for the bottom end of the substrate body 3, but also will not be damaged due to the drill bit passing through the carrier 21, thereby improving the service life of the device and reducing the waste of resources.

[0044] After the drilling operation is completed, the substrate body 3 moves out of the space of the drilling machine body 1, and the magnetic field direction of the magnetic part 233 is restored to the state of mutual repulsion with the magnetic part 1 232. The limit frame 231 is forced to slide to the bottom end of the inner wall of the movable frame 23. At this time, the rubber block in the support block 243 is restored to a state of close fit with the bottom end of the substrate body 3. The staff pulls the knob 247, and the knob 247 drives the limit block 246 to slide on the inside of the fixed frame 241. The movement of the limit block 246 drives the positioning plate 248 to move, and the positioning plate 248 drives the connecting rod 242 to move horizontally to the position of a hole wall. The connecting rod 242 drives the support block 243 to move. At the same time as the support block 243 moves, the rubber block that is closely fitted with the bottom end of the substrate body 3 moves. The reciprocating movement of the rubber block can clean the burrs at the bottom end of the drilled hole.

[0045] See also Figure 1 On the other hand, the present invention provides a positioning process for IC substrate processing equipment based on a positioning structure, characterized in that it includes the following steps:

[0046] S1. Material preparation: Select appropriate substrate, copper foil, dielectric material, and adhesive according to design requirements;

[0047] S2. Substrate fabrication: Copper foil and dielectric material are alternately laminated to form an undrilled substrate. The multiple layers are then hot-pressed and bonded together.

[0048] S3, positioning drilling: fix the substrate on the drilling machine and use the drilling machine to drill the substrate to form through holes for subsequent electroplating;

[0049] S4, hole wall treatment: remove the residue on the hole wall after drilling, and perform electroplating on the hole wall to form a conductive hole wall;

[0050] S5. Surface treatment: Treat the surface of the carrier board, apply solder resist, mark and anti-oxidation treatment;

[0051] S6, processing and forming: cutting the carrier board to the required size and shape, and performing contour processing operations such as chamfering and drilling on its outer shape;

[0052] S7, Processing and Forming: Conduct electrical testing on the carrier board to ensure that all circuit paths meet the design requirements, clean the carrier board to remove residues from the processing process, conduct appearance inspection and functional inspection to ensure quality, and package the qualified products.

[0053] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the various embodiments of the present invention.

Claims

1. An IC substrate processing device based on a positioning structure, characterized in that: include: substrate body; A drilling machine body, wherein a carrying portion for positioning a substrate body is provided on the drilling machine body transport platform, wherein the carrying portion includes a carrying frame for carrying the substrate body, wherein a positioning member for all-round limiting the surface of the substrate body is provided inside the carrying frame, wherein the bottom end of the carrying frame is fixedly connected to a movable frame, wherein the inside of the movable frame is slidably connected to a limiting frame, wherein a supporting member for supporting and positioning the bottom end of the substrate body is provided inside the limiting frame; Wherein, the support member includes a support block for supporting and cleaning the periphery of the drilling hole of the substrate body; The four inner walls of the carrier are all provided with side grooves, wherein a pair of the inner walls of the side grooves are provided with guide grooves, and compression springs are elastically connected to the positions of the side grooves near the center of the carrier; The positioning member includes an electric push rod arranged on the outside of the carrier frame, a side pressure plate is provided at the output end of the electric push rod, a main shaft is fixedly connected to both ends of the side pressure plate, the main shaft is slidably connected to the inner wall of the guide groove, a push ring is slidably connected to the side of the guide groove away from the side pressure plate, a connecting rod is affixed to the other end of the push ring, the outer side of the connecting rod is movably connected to a limit plate, and the inner side of the connecting rod is elastically connected to a telescopic spring; Among them, a magnetic part 1 is fixedly connected to the top of the limit frame, and the magnetic part 1 is magnetically connected to the magnetic part 2 fixed on the top of the inner wall of the movable frame. When the supporting frame has not entered the drilling space of the drilling machine body, the magnetic part 1 and the magnetic part 2 have the same magnetic properties. When the supporting frame enters the drilling space of the drilling machine body, the magnetic part 1 and the magnetic part 2 have opposite magnetic properties.

2. The IC substrate processing equipment based on the positioning structure according to claim 1, characterized in that: The support member also includes a fixing frame engaged with the limit frame, a positioning block engaged with the limit frame is symmetrically arranged on the inner side of the fixing frame, a knob is rotatably connected to the middle part of the outer side of the fixing frame, and the knob is fixedly connected to the limit block on the side close to the fixing frame, and the other end of the limit block is movably connected to the positioning plate, and the other end of the positioning plate is fixedly connected to the connecting rod, and a plurality of support blocks are detachably connected to the outer side of the connecting rod.

3. The IC substrate processing equipment based on the positioning structure according to claim 2, characterized in that: The top of the support block is set as a plane, the side of the top of the support block is set as an arc, the inner side of the support block is slidably connected to a rubber block, the rubber block can form a complete arc with the top of the support block, and the bottom of the rubber block is elastically connected to a support spring.

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