Pressure maintaining machine for FPC

By designing a press holder for FPC, the mold clamping structure of the upper mold assembly and the lower mold assembly is used to achieve efficient bonding of the FPC plate and the thermal film or the pressure-sensitive film, solving the problem of uneven bonding firmness in existing equipment and improving the stability of production quality.

CN119629858APending Publication Date: 2025-03-14DONGGUAN HUAYAN ELECTRONIC TECH CO LTD
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Patent Information

Application Number
CN202411742053.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-11-29
Publication Date
2025-03-14

AI Technical Summary

Technical Problem

When existing pressure-holding equipment presses FPC boards and thermal films or pressure-sensitive films, the bonding firmness within a unit area is uneven, which affects the stability of production quality.

Method used

A press holder for FPC is designed, including an upper mold assembly and a lower mold assembly. The upper mold assembly is provided with several pressure holders, each pressure holder includes a fixture, a pressure sensor and a pressure head. The lower mold assembly is provided with several lower convex columns. After the mold is closed, the lower convex column is pressed and the pressure sensor senses the pressure, thereby improving the controllability of the pressure.

Benefits of technology

By improving the controllability of the pressure per unit area during the pressure holding process, the bonding between the FPC plate and the thermal film or the pressure-sensitive film is enhanced, and the stability of the production and processing quality is improved.

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Abstract

The invention relates to the technical field of pressure maintaining procedures after an FPC board and a thermosensitive film are attached, in particular to a pressure maintaining machine for an FPC. Comprising a rack, an upper die assembly, a lower die assembly, a lifting mechanism and a conveying assembly. The upper die assembly comprises a mounting plate and a plurality of pressure maintaining assemblies. Each pressure maintaining assembly comprises a fixing piece, a pressure sensor and a pressure head part, the fixing piece is arranged on the mounting plate, the pressure sensor is connected with the fixing piece, the pressure head part comprises a metal plate and a high-temperature-resistant piece, the metal plate is in sliding connection with the fixing piece, and the high-temperature-resistant piece is connected with the metal plate and protrudes out of the bottom surface of the metal plate; the lower die assembly comprises a lower die plate, the lower die plate comprises a plurality of lower convex columns, and after the upper die assembly and the lower die assembly are assembled, one pressure sensor is used for sensing the pressure between one high-temperature-resistant piece and one lower convex column; the controllability of pressure in unit area in the pressure maintaining process is improved, and the stability of production and machining quality is improved.
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Description

Technical Field

[0001] The invention relates to the technical field of a pressure-maintaining process after an FPC board and a heat-sensitive film are bonded together, and in particular to a pressure-maintaining machine for an FPC. Background Art

[0002] FPC / FPC board, also known as flexible circuit board / flexible circuit board / soft circuit board / soft circuit board; because of its softness and bendability, it is widely used and is often used in various smaller electrical devices, such as mobile phones, battery modules, etc. According to the production process requirements, the heat-sensitive film or pressure-sensitive film needs to be attached to the specified position of the FPC board as required, and it is placed in a pressure-holding machine for pressing, so that the heat-sensitive film or pressure-sensitive film is firmly connected to the FPC board. However, when the existing pressure-holding equipment presses the FPC board and the heat-sensitive film or pressure-sensitive film, the connection firmness of the FPC board and the heat-sensitive film or pressure-sensitive film per unit area varies, which affects the stability of production quality, does not meet production requirements, and needs to be improved. Summary of the invention

[0003] In order to overcome the problem of poor bonding firmness between the FPC board and the heat-sensitive film or pressure-sensitive film in the prior art, the purpose of the present invention is to provide a pressure-maintaining machine for FPC to improve the bonding firmness and improve the controllability of production quality.

[0004] To achieve the above object, the technical solution of the present invention is:

[0005] A pressure-maintaining machine for FPC, comprising a frame, an upper die assembly, a lower die assembly, a lifting mechanism for driving the upper die assembly to move, and a conveying assembly for conveying the lower die assembly;

[0006] The upper mold assembly includes a mounting plate and a plurality of pressure-maintaining assemblies;

[0007] Each pressure-maintaining assembly includes a fixing part, a pressure sensor and a pressure head, wherein the fixing part is arranged on a mounting plate, and the pressure sensor is connected to the fixing part;

[0008] The pressure head comprises a metal plate and a high temperature resistant part, the metal plate is slidably connected to the fixing part, and the high temperature resistant part is connected to the metal plate and protrudes out of the bottom surface of the metal plate;

[0009] The lower mold assembly includes a lower mold plate, and the lower mold plate includes a plurality of lower bosses. After the upper mold assembly and the lower mold assembly are molded together, one of the high-temperature resistant parts presses one of the lower bosses, and a pressure sensor is used to sense the pressure between a high-temperature resistant part and one of the lower bosses.

[0010] Furthermore, the fixing member includes an upper plate, a guide column and a lower plate connected in sequence, the upper plate and the lower plate are arranged at a distance, the pressure sensor is fixedly connected to the upper plate, and the pressure head is slidably connected to the lower plate.

[0011] Furthermore, the pressure head part is also provided with a movable part, the movable part is located between the upper plate part and the lower plate part and is arranged close to the lower plate part, the movable part is connected to the metal plate, and the movable part slides along the guide column.

[0012] Furthermore, the pressure-maintaining assembly also includes a buffer and a macro-adjustment member, the two ends of the buffer are respectively connected to the pressure sensor and the movable member, the mounting plate is provided with a plurality of upper through holes, the fixing member is provided with a lower through hole, a fixing member is arranged in an upper through hole, a lower through hole of a fixing member coincides with the central axis of the upper through hole, and a macro-adjustment member passes through an upper through hole and a lower through hole to contact the pressure sensor.

[0013] Furthermore, the pressure sensor includes a mounting seat, a sensor, and a pressure plate. The mounting seat is fixedly connected to the upper plate, the sensor is connected to the mounting seat, the sensor is in contact with the pressure plate, and the pressure plate is connected to the buffer.

[0014] Furthermore, the lower mold assembly also includes a bottom plate, a first heat insulation plate, a heating assembly, a second heat insulation plate and a temperature control sensor. The bottom plate, the first heat insulation plate, the heating assembly and the lower mold plate are arranged in sequence from bottom to top, the second heat insulation plate is arranged on the side surface of the first heat insulation plate, and the second heat insulation plate is arranged on the side surface of the heating assembly;

[0015] There are two groups of temperature control sensing components, and the two groups of temperature control sensing components respectively sense the temperature of the end surfaces on both sides of the length direction of the lower template;

[0016] The conveying assembly is connected to the base plate.

[0017] Furthermore, the heating assembly includes a first plate body and a plurality of heating rods, and the heating rods are arranged along the length direction of the first plate body.

[0018] Furthermore, the first plate body is provided with a plurality of axial holes, and a distance is set between two adjacent axial holes, and the axial holes are arranged along the length direction of the first plate body. A heating rod is arranged in an axial hole, and a distance is set between the axial hole and the lower template, and a distance is set between the axial hole and the first thermal insulation board, and a distance is set between the axial hole and the second thermal insulation board.

[0019] Furthermore, the lower mold assembly also includes a positioning pin, which is arranged on the upper surface of the lower mold plate and extends in a direction away from the lower mold plate.

[0020] Furthermore, the temperature control sensing element includes a bracket and an infrared sensing element, one end of the bracket is connected to the bottom plate, and the other end of the bracket is connected to the infrared sensing element, and the infrared sensing element is located obliquely above the heating component.

[0021] The beneficial effects of the present invention are as follows: by arranging a plurality of pressure-maintaining components on the upper mold assembly, each pressure-maintaining component includes a fixing part, a pressure sensor and a pressure head part, and arranging a plurality of lower protrusions on the lower mold plate, after the upper mold assembly and the lower mold assembly are molded together, one of the high-temperature resistant parts presses one of the lower protrusions, thereby improving the controllability of the pressure per unit area during the pressure-maintaining process and improving the stability of the production and processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1-1 It is a schematic diagram of the three-dimensional structure of the present invention;

[0023] Figure 1-2 It is a schematic diagram of the internal structure of the present invention;

[0024] Figure 1-3 It is a schematic diagram of the upper mold assembly and the lower mold assembly of the present invention in the disassembled state;

[0025] Figure 2-1 It is a schematic diagram of the structure of the upper mold assembly of the present invention;

[0026] Figure 2-2 It is a schematic diagram of the structure of the pressure-maintaining component of the present invention;

[0027] Figure 2-3 It is a plan cross-sectional view of the pressure-maintaining component of the present invention;

[0028] Figure 2-4 It is a schematic diagram of the cross-sectional structure of the mounting plate and the pressure-maintaining assembly of the present invention;

[0029] Figure 3-1 It is a schematic diagram of the structure of the lower mold assembly of the present invention;

[0030] Figure 3-2 It is a schematic diagram of the disassembled structure of the lower mold assembly of the present invention.

[0031] Reference numerals include:

[0032] 100—upper mold assembly 11—mounting plate 1101—upper through hole

[0033] 12—pressure-maintaining component 121—fixing member 1211—upper plate

[0034] 1212—guide column 1213—lower plate 122—pressure sensor

[0035] 1221—Mounting seat 1222—Sensor 1223—Pressure plate

[0036] 1201—lower through hole

[0037] 123—Pressure head 1231—Metal plate 1232—High temperature resistant part

[0038] 1233—movable part 124—buffer 1241—spring

[0039] 1242—Spring column 125—Macro adjustment piece

[0040] 200—lower mold assembly 21—bottom plate 22—first heat insulation board

[0041] 23—heating assembly 231—first plate 2311—axial hole

[0042] 232—heating rod 24—lower template 241—lower convex column

[0043] 25—Second heat insulation board 26—Temperature control sensor 261—Bracket

[0044] 2611—first plate 2612—second plate 2613—third plate

[0045] 262—Infrared sensor 27—Location pin

[0046] 300—lifting mechanism 400—conveying assembly 500—carrier. DETAILED DESCRIPTION

[0047] In order to facilitate the understanding of those skilled in the art, the present invention is further described below in conjunction with embodiments and drawings. The contents mentioned in the implementation modes are not intended to limit the present invention.

[0048] See also Figure 1-1 to Figure 3-2 The present invention provides a pressure-maintaining machine for FPC, comprising a frame, an upper mold assembly 100, a lower mold assembly 200, a lifting mechanism 300 for driving the upper mold assembly 100 to move, and a conveying assembly 400 for conveying the lower mold assembly 200;

[0049] The upper mold assembly 100 includes a mounting plate 11 and a plurality of pressure-maintaining assemblies 12;

[0050] Each pressure-maintaining assembly 12 includes a fixing member 121, a pressure sensor 122 and a pressure head 123. The fixing member 121 is disposed on the mounting plate 11, and the pressure sensor 122 is connected to the fixing member 121.

[0051] The pressure head 123 includes a metal plate 1231 and a high temperature resistant member 1232. The metal plate 1231 is slidably connected to the fixing member 121. The high temperature resistant member 1232 is connected to the metal plate 1231 and protrudes out of the bottom surface of the metal plate 1231.

[0052] The lower mold assembly 200 includes a lower mold plate 24, and the lower mold plate 24 includes a plurality of lower bosses 241. After the upper mold assembly 100 and the lower mold assembly 200 are molded together, one of the high temperature resistant parts 1232 presses one of the lower bosses 241, and a pressure sensor 122 is used to sense the pressure between one of the high temperature resistant parts 1232 and one of the lower bosses 241.

[0053] Specifically, in this embodiment, the external carrier 500 carries the FPC board with the thermal film attached, and the carrier 500 enters directly below the upper mold assembly 100 under the transmission and transportation of the conveying assembly 400, and then the lifting mechanism 300 drives the mounting plate 11 to move downward, and several pressure-holding assemblies 12 move downward synchronously until the high-temperature resistant part 1232 is pressed on the upper surface of the lower convex column 241. Preferably, the number of pressure-holding assemblies 12 is the same as the number of lower convex columns 241. One pressure-holding assembly 12 cooperates with one lower convex column 241 to press the external thermal film on the external FPC board, so as to achieve the purpose of controlling the bonding pressure of each bonding part separately. The pressure head 123 includes a metal plate 1231 and a high-temperature resistant part 1232. The temperature component 1232 is made of high-temperature resistant silicone to increase the service life of the pressure head 123. The setting of the metal plate 1231 makes the reaction force generated by the high-temperature resistant component 1232 during the working process evenly distributed on the metal plate 1231, thereby increasing the overall deformation resistance of the pressure head 123, thereby ensuring the stability of the fitting pressure. A fixing component 121 is provided with a pressure sensor 122, and a pressure sensor 122 is used to sense the pressure between a high-temperature resistant component 1232 and a lower protrusion 241, so as to achieve the purpose of real-time observation and separate adjustment of the pressure value of each fitting part, so that the pressure of each fitting part is within an effective range, thereby improving the controllability of processing quality and improving product quality stability.

[0054] By setting a plurality of pressure-holding components 12 on the upper mold assembly 100, each pressure-holding component 12 includes a fixing part 121, a pressure sensor 122 and a pressure head part 123, and setting a plurality of lower bosses 241 on the lower mold plate 24, after the upper mold assembly 100 and the lower mold assembly 200 are molded together, a pressure sensor 122 is used to sense the pressure between a high-temperature resistant part 1232 and one of the lower bosses 241, thereby improving the controllability of the pressure per unit area during the pressure-holding process and improving the stability of the production and processing quality.

[0055] The fixing member 121 includes an upper plate 1211, a guide column 1212 and a lower plate 1213 which are connected in sequence. The upper plate 1211 and the lower plate 1213 are spaced apart. The pressure sensor 122 is fixedly connected to the upper plate 1211. The pressure head 123 is slidably connected to the lower plate 1213 to ensure the stability of the pressure head 123 in the up and down movement directions. The pressure sensor 122 is located between the upper plate 1211 and the lower plate 1213 to protect the pressure sensor 122.

[0056] The pressure head part 123 is also provided with a movable part 1233, and the movable part 1233 is located between the upper plate 1211 and the lower plate 1213 and is arranged close to the lower plate 1213, and the movable part 1233 is connected to the metal plate 1231, and the movable part 1233 slides along the guide column 1212. Preferably, the lower plate 1213 is provided with a through hole, and the movable part 1233 includes an upper connecting part and a lower connecting part connected in sequence, and the radial specification of the upper connecting part is greater than the radial specification of the lower connecting part, and the lower connecting part is connected to the metal plate 1231 through the through hole, so that the pressure head part 123 can move up and down along the guide column 1212, and can also contact with the external part to be bonded, thereby meeting the use requirements.

[0057] The pressure-maintaining assembly 12 further includes a buffer 124 and a micro-adjustment member 125, the two ends of the buffer 124 are respectively connected to the pressure sensor 122 and the movable member 1233, the mounting plate 11 is provided with a plurality of upper through holes 1101, the fixing member 121 is provided with a lower through hole 1201, a fixing member 121 is arranged in an upper through hole 1101, the lower through hole 1201 of a fixing member 121 coincides with the central axis of the upper through hole 1101, a micro-adjustment member 125 passes through an upper through hole 1101 and a lower through hole 1201 and contacts with the pressure sensor 122; preferably, the buffer 124 includes a spring 1241 and a spring column 1242, one end of the spring column 1242 is fixedly connected to the movable member 1233 Then, the other end of the spring column 1242 is movably connected to the pressure sensor 122, and the spring 1241 is sleeved outside the spring column 1242. When the pressure maintaining assembly 12 is pressed down as a whole, the pressure head 123 first contacts the lower protrusion 241. Under the action of the buffer 124, the pressure sensed by the pressure sensor 122 gradually increases from a small value to a constant value, thereby avoiding the instantaneous generation of a large pressure, which causes a pressure sensing error in the pressure sensor 122, and further ensures the accuracy of the pressure parameters. The macro adjustment part 125 adopts a micrometer to adjust the longitudinal position of the pressure sensor 122 as needed, so that the vertical distance between the pressure sensor 122 and the buffer 124 is within the effective range, thereby improving the sensing sensitivity and authenticity of the pressure sensor 122.

[0058] The pressure sensor 122 includes a mounting seat 1221, a sensor 1222, and a pressure plate 1223. The mounting seat 1221 is fixedly connected to the upper plate 1211, the sensor 1222 is connected to the mounting seat 1221, the sensor 1222 is in conflict with the pressure plate 1223, the pressure plate 1223 is connected to the buffer 124, the mounting seat 1221 is fixedly connected to the upper plate 1211, the mounting seat 1221 is used to install the sensor 1222, the pressure plate 1223 is provided with a blind hole, the blind hole starts from the lower end surface of the pressure plate 1223, the spring column 1242 of the buffer 124 protrudes into the blind hole and slides up and down along the blind hole, so that the pressure sensor 122 compresses the spring 1241 during the downward pressing process, so that the pressure sensed by the pressure sensor 122 gradually increases from small to constant, and the pressure range is further accurately corrected.

[0059] The lower mold assembly 200 also includes a bottom plate 21, a first heat insulation plate 22, a heating assembly 23, a second heat insulation plate 25 and a temperature control sensor 26. The bottom plate 21, the first heat insulation plate 22, the heating assembly 23 and the lower mold plate 24 are arranged in sequence from bottom to top. The second heat insulation plate 25 is arranged on the side surface of the first heat insulation plate 22, and the second heat insulation plate 25 is arranged on the side surface of the heating assembly 23. The first heat insulation plate 22 is synthesized by glass fiber material and a high heat-resistant composite material, and the second heat insulation plate 25 is processed by heat insulation cotton. The number of the second heat insulation plates 25 is two, and the two second heat insulation plates 25 are respectively attached to the two side surfaces of the lower mold assembly 200 in the length direction. Preferably, the second heat insulation plate 25 is attached to the side surfaces of the first heat insulation plate 22 and the heating assembly 23 to effectively isolate the heat generated by the heating assembly 23 from the outside air, thereby further improving the thermal energy utilization rate of the heating assembly 23.

[0060] There are two groups of temperature control sensing elements 26, which sense the temperature of the two side end surfaces of the lower template 24 in the length direction, and monitor the temperature of the two ends of the lower template 24 in the length direction in real time, so that the overall working temperature of the lower template 24 is within the preset range, further ensuring the stability of the processing quality;

[0061] The conveying assembly 400 is connected to the base plate 21 .

[0062] The heating assembly 23 includes a first plate 231 and a plurality of heating rods 232. The heating rods 232 are arranged along the length direction of the first plate 231. The first plate 231 is in the shape of a flat plate. The heating rods 232 are connected to an external power source to convert electrical energy into thermal energy. The heating rods 232 are arranged at equal intervals on the first plate 231, thereby ensuring that the heat generated in a unit volume of the first plate 231 is balanced.

[0063] The first plate body 231 is provided with a plurality of axial holes 2311, and two adjacent axial holes 2311 are arranged at intervals, and the axial holes 2311 are arranged along the length direction of the first plate body 231. A heating rod 232 is arranged in one axial hole 2311, and the axial hole 2311 is arranged at intervals from the lower template 24, and the axial hole 2311 is arranged at intervals from the first heat insulation board 22, and the axial hole 2311 is arranged at intervals from the second heat insulation board 25. The arrangement of the through hole 2311 arranges the heating rod 232 in the first plate body 231, thereby providing safety protection for the heating rod 232 and improving the safety of use and service life.

[0064] The lower mold assembly 200 also includes a positioning pin 27, which is disposed on the upper surface of the lower mold plate 24 and extends in a direction away from the lower mold plate 24. The provision of the positioning pin 27 facilitates the precise connection between the external carrier 500 and the lower mold plate 24, further improving the stability of production quality.

[0065] The temperature control sensor 26 includes a bracket 261 and an infrared sensor 262. One end of the bracket 261 is connected to the bottom plate 21, and the other end of the bracket 261 is connected to the infrared sensor 262. The infrared sensor 262 is used to timely detect the working temperature of the lower template 24, so as to ensure that the working temperature of the lower template 24 is within the set range. The infrared sensor 262 is located obliquely above the heating component 23, so as to avoid the heat generated by the heating component 23 from affecting the detection of the infrared sensor 262, thereby further ensuring the accuracy of the production process parameters.

[0066] The bracket 261 includes a first plate 2611, a second plate 2612, and a third plate 2613 connected in sequence. The first plate 2611 and the second plate 2612 are arranged to intersect each other, and the third plate 2613 and the second plate 2612 are arranged to intersect each other. The first plate 2611 and the third plate 2613 are respectively located on the left and right sides of the second plate 2612, and the first plate 2611 and the third plate 2613 are respectively located on the upper and lower sides of the second plate 2612. The first plate 2611 is connected to the bottom plate 21, and the infrared sensor 262 and the third plate 2613 are connected to each other. Connection, preferably, the first plate 2611, the second plate 2612, and the third plate 2613 are connected in sequence, the first plate 2611 and the second plate 2612 are connected in an L shape, and the second plate 2612 and the third plate 2613 are connected in an L shape, so that the third plate 2613 is away from the lower template 24, and the infrared sensing element 262 is installed on the third plate 2613, so that the infrared sensing element 262 and the heating component 23 are set at a distance, further reducing the influence of the heat generated by the heating component 23 on the sensed temperature of the infrared sensing element 262, thereby improving the authenticity of the infrared sensing element 262 in detecting the temperature of the lower template 24.

[0067] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The content of this specification should not be understood as limiting the present invention.

Claims

1. A pressure-maintaining machine for FPC, comprising a frame, characterized in that: It also includes an upper mold assembly (100), a lower mold assembly (200), a lifting mechanism (300) for driving the upper mold assembly (100) to move, and a conveying assembly (400) for conveying the lower mold assembly (200); The upper mold assembly (100) comprises a mounting plate (11) and a plurality of pressure-maintaining assemblies (12); Each pressure-maintaining component (12) comprises a fixing component (121), a pressure sensor (122) and a pressure head portion (123); the fixing component (121) is arranged on the mounting plate (11), and the pressure sensor (122) is connected to the fixing component (121); The pressure head portion (123) comprises a metal plate (1231) and a high temperature resistant component (1232), wherein the metal plate (1231) is slidably connected to the fixing component (121), and the high temperature resistant component (1232) is connected to the metal plate (1231) and protrudes out of the bottom surface of the metal plate (1231); The lower mold assembly (200) comprises a lower mold plate (24), and the lower mold plate (24) comprises a plurality of lower bosses (241). After the upper mold assembly (100) and the lower mold assembly (200) are molded together, one of the high-temperature resistant parts (1232) presses one of the lower bosses (241), and a pressure sensor (122) is used to sense the pressure between one of the high-temperature resistant parts (1232) and one of the lower bosses (241).

2. The pressure-maintaining machine for FPC according to claim 1, characterized in that: The fixing member (121) comprises an upper plate (1211), a guide column (1212) and a lower plate (1213) which are connected in sequence, the upper plate (1211) and the lower plate (1213) are arranged at a distance, the pressure sensor (122) is fixedly connected to the upper plate (1211), and the pressure head (123) is slidably connected to the lower plate (1213).

3. The pressure-maintaining machine for FPC according to claim 2, characterized in that: The pressure head part (123) is also provided with a movable part (1233), and the movable part (1233) is located between the upper plate part (1211) and the lower plate part (1213) and is arranged close to the lower plate part (1213). The movable part (1233) is connected to the metal plate (1231), and the movable part (1233) slides along the guide column (1212).

4. The pressure-maintaining machine for FPC according to claim 3, characterized in that: The pressure-maintaining component (12) further comprises a buffer component (124) and a micro-adjustment component (125), the two ends of the buffer component (124) are respectively connected to the pressure sensor (122) and the movable component (1233), the mounting plate (11) is provided with a plurality of upper through holes (1101), the fixing component (121) is provided with a lower through hole (1201), a fixing component (121) is arranged in an upper through hole (1101), the lower through hole (1201) of a fixing component (121) coincides with the central axis of the upper through hole (1101), and a micro-adjustment component (125) passes through an upper through hole (1101) and a lower through hole (1201) to contact the pressure sensor (122).

5. The pressure-maintaining machine for FPC according to claim 4, characterized in that: The pressure sensor (122) comprises a mounting seat (1221), a sensor (1222), and a pressure plate (1223); the mounting seat (1221) is fixedly connected to the upper plate (1211); the sensor (1222) is connected to the mounting seat (1221); the sensor (1222) is in contact with the pressure plate (1223); and the pressure plate (1223) is connected to the buffer (124).

6. The pressure-maintaining machine for FPC according to claim 1, characterized in that: The lower mold assembly (200) further comprises a bottom plate (21), a first heat insulation plate (22), a heating assembly (23), a second heat insulation plate (25) and a temperature control sensing element (26); the bottom plate (21), the first heat insulation plate (22), the heating assembly (23) and the lower mold plate (24) are arranged in sequence from bottom to top; the second heat insulation plate (25) is arranged on the side surface of the first heat insulation plate (22); and the second heat insulation plate (25) is arranged on the side surface of the heating assembly (23); The number of the temperature control sensing components (26) is two groups, and the two groups of temperature control sensing components (26) respectively sense the temperature of the end surfaces on both sides of the length direction of the lower template (24); The conveying assembly (400) is connected to the bottom plate (21).

7. The pressure-maintaining machine for FPC according to claim 6, characterized in that: The heating assembly (23) comprises a first plate body (231) and a plurality of heating rods (232), wherein the heating rods (232) are arranged along the length direction of the first plate body (231).

8. The pressure-maintaining machine for FPC according to claim 7, characterized in that: The first plate body (231) is provided with a plurality of axial holes (2311), and two adjacent axial holes (2311) are arranged at intervals, and the axial holes (2311) are arranged along the length direction of the first plate body (231), and a heating rod (232) is arranged in an axial hole (2311), and the axial hole (2311) and the lower template (24) are arranged at intervals, and the axial hole (2311) and the first heat insulation board (22) are arranged at intervals, and the axial hole (2311) and the second heat insulation board (25) are arranged at intervals.

9. The pressure-maintaining machine for FPC according to claim 1, characterized in that: The lower mold assembly (200) further comprises a positioning pin (27), wherein the positioning pin (27) is arranged on the upper surface of the lower mold plate (24) and extends in a direction away from the lower mold plate (24).

10. The pressure-maintaining machine for FPC according to claim 6, characterized in that: The temperature control sensing element (26) comprises a bracket (261) and an infrared sensing element (262), one end of the bracket (261) is connected to the bottom plate (21), and the other end of the bracket (261) is connected to the infrared sensing element (262), and the infrared sensing element (262) is located obliquely above the heating component (23).

Citation Information

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