Thick copper plate pressing device

Abstract

The invention relates to the technical field of PCB pressing, and particularly provides a thick copper plate pressing device which comprises a rack, a plurality of heating pressing plates are arranged on the rack, each heating pressing plate comprises a first heating plate and a second heating plate, and spiral flow guide pipes are arranged in the first heating plates and the second heating plates. The liquid inlet is formed in the middle of the first heating plate and the second heating plate, so that the first heating plate and the second heating plate can melt the middle part and then gradually melt towards the periphery when heating the PP semi-solidified laminate, and when the PP semi-solidified laminate is melted to generate bubbles, the non-melted area of the PP semi-solidified laminate can serve as a bubble discharging channel at the moment; the bubbles can be discharged from the periphery, so that the problem that the bubbles cannot be discharged when the PP semi-solidified laminate is uniformly melted is effectively avoided.

Description

Technical Field

[0001] The invention relates to the technical field of PCB board pressing, in particular to a thick copper plate pressing device. Background Art

[0002] Thick copper board pressing device is a kind of equipment specially used for manufacturing thick copper PCB (Printed Circuit Board). It is designed to firmly combine multi-layer thick copper circuit boards and their insulation layers together through high temperature and high pressure.

[0003] In the prior art, the medium-thick copper plate pressing device uses a hot pressing plate to press the raw materials at high temperature and high pressure under a vacuum environment. However, the pressing surface with uniform temperature will make the melting speed of the PP semi-cured layer between the copper plates consistent. Since there are some gaps on the surface of the copper plate for better bonding, when the PP semi-cured layer melts and enters the gaps of the copper plate, the air in it will enter the PP semi-cured layer to form bubbles, and the melting of the outer PP semi-cured layer will affect the discharge of the middle bubbles.

[0004] Bubbles in the PP semi-cured layer will cause the insulation between circuits to decrease, increasing the risk of short circuits. Bubbles will also form a thermal damping zone inside the PCB board, resulting in uneven heat distribution and increased thermal stress. Bubbles will also reduce the bonding area of ​​the PP semi-cured layer, thereby reducing the connection strength of the entire copper board. Summary of the invention

[0005] Based on this, it is necessary to provide a thick copper plate pressing device to address the problem that bubbles are easily generated between the PP semi-cured layer and the copper plate during the pressing process of the current PCB board.

[0006] The above purpose is achieved through the following technical solutions: A thick copper plate pressing device, comprising: A frame, on which a plurality of heating press plates are slidably arranged, and spaces are provided between adjacent heating press plates to fill copper foil and PP prepreg laminate; A pressurizing assembly, which is capable of pressing a plurality of heating plates close to each other to press the copper foil and the PP prepreg laminate; The heating platen includes a first heating plate and a second heating plate arranged up and down, the first heating plate and the second heating plate are hollow inside, and both are provided with a spiral guide pipe inside, the first heating plate and the second heating plate are provided with a liquid inlet at the center, the liquid inlet is connected to the guide pipe, and high-temperature liquid enters the spiral guide pipe through the liquid inlet, and the temperature of the first heating plate and the second heating plate gradually increases from the inside to the outside.

[0007] Furthermore, there are four spiral guide tubes in the first heating plate and the second heating plate, the four spiral guide tubes are in the same plane, one end of the four spiral guide tubes is connected to the liquid inlet, the other end of the four spiral guide tubes is respectively located at four right angles of the first heating plate and the second heating plate, the four right angles are respectively connected to the liquid outlet pipes, and the four spiral guide tubes are respectively connected to the liquid outlet pipes.

[0008] Furthermore, a telescopic cavity is provided between the first heating plate and the second heating plate, a liquid infusion port is provided on a side wall of the telescopic cavity, the liquid infusion port can deliver heated liquid, and the telescopic cavity is connected with liquid inlets on the first heating plate and the second heating plate; In the initial state, the volume of the telescopic cavity is at its minimum, and the heating liquid in the telescopic cavity quickly enters the liquid inlet to gradually heat the PP semi-cured layer. After the PP semi-cured layer is completely melted, the heating liquid in the telescopic cavity increases, the volume of the telescopic cavity increases, and the first heating plate and the second heating plate move away from each other.

[0009] Furthermore, there are four infusion ports, all of which are arranged in a clockwise or counterclockwise direction, and the four infusion ports deliver the heated liquid simultaneously.

[0010] Furthermore, a first rectangular plate frame is fixedly provided on the end surface of the first heating plate close to the second heating plate, and a second rectangular plate frame is fixedly provided on the end surface of the second heating plate close to the first heating plate. The first rectangular plate frame and the second rectangular plate frame are slidably connected to each other to form the telescopic cavity.

[0011] Furthermore, an adjusting component is provided in the telescopic cavity, and the adjusting component can adjust the opening size of the infusion port, and the opening size of the infusion port is positively correlated with the volume of the telescopic cavity.

[0012] Furthermore, the adjustment component includes an upper liquid outlet plate and a lower liquid outlet plate, the upper liquid outlet plate is fixedly arranged on the end surface of the first heating plate close to the second heating plate, the lower liquid outlet plate is fixedly arranged on the end surface of the second heating plate close to the first heating plate, the infusion port is formed between the upper liquid outlet plate and the lower liquid outlet plate, and the upper liquid outlet plate and the lower liquid outlet plate move relative to each other to adjust the size of the infusion port.

[0013] Furthermore, a heat spreader is disposed on the end surfaces of the first heating plate and the second heating plate that are close to each other.

[0014] Furthermore, the pressurizing assembly includes a telescopic member, a fixed end of the telescopic member is fixed on the frame, and the telescopic end of the telescopic member abuts against the uppermost first heating plate.

[0015] Furthermore, the telescopic member is a telescopic cylinder or a hydraulic telescopic cylinder.

[0016] The beneficial effects of the present invention are: The present invention arranges a spiral guide tube inside the first heating plate and the second heating plate, and opens a liquid inlet in the middle of the first heating plate and the second heating plate, so that when the first heating plate and the second heating plate heat the PP semi-cured layer, the middle part can be melted and then gradually melted around. When the PP semi-cured layer melts to generate bubbles, the unmelted area of ​​the PP semi-cured layer can be used as a bubble discharge channel, so that the bubbles can be discharged from all sides, thereby effectively avoiding the problem that the bubbles cannot be discharged when the PP semi-cured layer is uniformly melted.

[0017] The present invention improves the heating rates of the first heating plate and the second heating plate by arranging four spiral flow guide pipes, thereby improving the pressing efficiency.

[0018] The present invention provides a telescopic cavity, and the volume of the telescopic cavity increases when the PP semi-cured layer is completely melted, thereby pushing the first heating plate and the second heating plate away from each other, so that the first heating plate and the second heating plate squeeze the copper core and the PP semi-cured layer in contact with them, so that the melted PP semi-cured layer can be more evenly attached to the copper foil, thereby improving the pressing quality of the copper plate.

[0019] The present invention provides an adjustment component capable of adjusting the opening size of the infusion port, so that the size of the infusion port increases as the volume of the telescopic cavity increases, thereby enabling the heated liquid to be more evenly distributed in the telescopic cavity. As the infusion port increases, the eddy current speed inside the telescopic cavity is reduced, and the heated liquid flows slowly in the telescopic cavity, making the internal heat more uniform. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of a thick copper plate pressing device provided in one embodiment of the present invention; Figure 2 A schematic cross-sectional view of a thick copper plate pressing device provided in one embodiment of the present invention; Figure 3 for Figure 1 A front view of a thick copper plate pressing device provided in one embodiment; Figure 4 for Figure 3 A cross-sectional view of a thick copper plate pressing device along AA provided in an embodiment; Figure 5 for Figure 3 A cross-sectional view of a thick copper plate pressing device along line BB provided in an embodiment; Figure 6 A schematic diagram of the structure of an adjustment component of a thick copper plate pressing device provided in one embodiment of the present invention; Figure 7 for Figure 6 A schematic cross-sectional view of an adjustment component of a thick copper plate pressing device provided in an embodiment; Figure 8 for Figure 1 A top view of a thick copper plate pressing device provided in one embodiment; Fig. 9 for Figure 8 A cross-sectional view taken along CC when the telescopic cavity of the thick copper plate pressing device provided in the first embodiment is in the initial state; Fig.10 for Fig. 9 A partial enlarged view of part X of the thick copper plate pressing device provided in one embodiment; Fig.11 for Figure 8 A cross-sectional view along CC of a thick copper plate pressing device provided in an embodiment of the present invention when the telescopic cavity is in the maximum state; Fig.12 for Fig.11 A partial enlarged view of part Y of the thick copper plate pressing device provided in one embodiment.

[0021] in: 100, heating plate; 110, first heating plate; 120, second heating plate; 130, liquid inlet; 140, spiral flow guide pipe; 150, liquid outlet pipe; 160, sliding hole; 170, heat plate; 200, telescopic cavity; 210, first rectangular plate frame; 211, first limit plate; 220, second rectangular plate frame; 221, second limit plate; 230, infusion channel; 240, infusion port; 250, adjustment component; 260, upper liquid outlet plate; 261, connecting rod; 270, lower liquid outlet plate; 271, connecting plate; 280, side liquid outlet plate. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0023] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in the present invention, unless otherwise specified, include direct and indirect connections (couplings). In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0024] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0025] Refer to the following Figure 1-Figure 12 To describe a thick copper plate pressing device provided by the present invention.

[0026] A thick copper plate pressing device is suitable for pressing ultra-thick copper multi-layer plates, comprising a frame (not shown in the figure), on which a plurality of heating platens 100 are arranged at intervals, the plurality of heating platens 100 are arranged in the vertical direction, each heating platen 100 can slide in the vertical direction, and the thick copper plates to be pressed, that is, multi-layer copper foils and multi-layer PP semi-cured laminates, are placed between adjacent heating platens 100, the copper foils and PP semi-cured laminates are arranged alternately, that is, when pressing four-layer plates, the order of adding the copper foils and PP semi-cured laminates is: copper foil-PP semi-cured laminates-core laminates-PP semi-cured laminates-copper foil, which are then pressed and formed by heating and pressurizing the adjacent heating platens 100, and a pressurizing assembly (not shown in the figure) is arranged on the frame, the heating assembly can press the plurality of heating platens 100, so that the plurality of heating platens 100 can be close to each other to press the copper foils and PP semi-cured laminates.

[0027] When extruding the copper foil and the PP semi-cured laminate, since the pressing devices in the prior art uniformly heat the copper foil and the PP semi-cured laminate, the PP semi-cured laminate is uniformly melted, that is, the melting rate is the same. After the copper foil is etched, the surface will have depressions and protrusions. When the PP semi-cured laminate is melted, bubbles will be generated at the groove position. The PP semi-cured laminate is uniformly melted, so the periphery of the PP semi-cured laminate has been bonded to the surface of the copper core, resulting in the inability to discharge the bubbles. The bubbles in the PP semi-cured laminate will reduce the insulation performance between the circuits and reduce the bonding area of ​​the PP semi-cured layer, thereby reducing the connection strength of the entire PCB board. At the same time, a thermal damping area is easily formed at the bubble position, resulting in a local temperature increase, which affects the heat dissipation of the PCB board.

[0028] The heating platen 100 of the present invention comprises a first heating plate 110 and a second heating plate 120, the first heating plate 110 and the second heating plate 120 are arranged up and down, the first heating plate 110 and the second heating plate 120 both have cavities inside, and the cavities are both provided with spiral guide tubes 140, such as Figure 2 As shown, a liquid inlet 130 is provided at the center of one end of the first heating plate 110 and the second heating plate 120, and one end of the spiral guide tube 140 is connected to the liquid inlet 130, and the other end of the spiral guide tube 140 is connected to the outside of the cavity. A heating liquid conveyor (not shown in the figure) is arranged on the frame, and the heating liquid conveyor can input the heating liquid from the liquid inlet 130 to the spiral guide tube 140. Since the liquid inlet 130 is located at the center of the first heating plate 110 and the second heating plate 120, the heating liquid will first heat the center of the first heating plate 110 and the second heating plate 120 when entering the spiral guide tube 140. As the heating liquid flows, the heating liquid gradually heats the first heating plate 110 and the second heating plate 120 in circles in the spiral guide tube 140. The liquid flows around the first heating plate 110 and the second heating plate 120, thereby gradually heating the first heating plate 110 and the second heating plate 120. That is to say, the temperature of the first heating plate 110 and the second heating plate 120 gradually increases from the center to the periphery, so that the copper core in contact with the first heating plate 110 and the second heating plate 120 can also be gradually heated from the center to the periphery. The same is true for the PP semi-cured layer, so that the PP semi-cured layer starts to melt from the middle to the periphery. When the PP semi-cured layer melts to produce bubbles, the unmelted area of ​​the PP semi-cured layer can be used as a bubble discharge channel, so that the bubbles can be discharged from the periphery, thereby effectively solving the problem that the bubbles cannot be discharged when the PP semi-cured layer is uniformly melted.

[0029] It should be noted that in order to facilitate the sliding of multiple first heating plates 110 and multiple second heating plates 120 on the rack, sliding holes 160 are opened near four right-angle positions of the first heating plate 110 and the second heating plate 120, and four mutually parallel and vertically distributed guide rods (not shown in the figure) are arranged on the rack. The four guide rods are slidably inserted into the sliding holes 160, so that the first heating plate 110 and the second heating plate 120 can slide vertically on the rack.

[0030] In a further embodiment, four spiral flow guide tubes 140 are disposed in the cavities of the first heating plate 110 and the second heating plate 120. Figure 4 As shown, the four spiral guide tubes 140 are on the same plane, the four spiral guide tubes 140 are arranged in an alternating manner, the other ends of the four spiral guide tubes 140 are connected to the liquid inlet 130, and the other ends of the four spiral guide tubes 140 are respectively located at four right angles of the first heating plate 110 and the second heating plate 120, the four right angles are respectively connected to the liquid outlet pipes 150, and the four spiral guide tubes 140 are respectively connected to the four liquid outlet pipes 150.

[0031] By arranging four spiral flow guide tubes 140 inside the cavities of the first heating plate 110 and the second heating plate 120, when the heating liquid is introduced into the liquid inlet 130, the heating liquid can enter the four spiral flow guide tubes 140 at the same time. Compared with one spiral flow guide tube 140, the flow distance of the heating liquid is reduced, thereby reducing the heat loss of the heating liquid. The heating liquid can heat the first heating plate 110 and the second heating plate 120 more efficiently, so that the rate of heating of the first heating plate 110 and the second heating plate 120 from the middle to the surrounding areas increases, which can speed up the discharge speed of bubbles and improve the copper plate pressing efficiency.

[0032] In a further embodiment, in order to improve the pressing effect of the first heating plate 110 and the second heating plate 120 on the copper foil and the PP semi-cured layer, a telescopic cavity 200 is arranged between the first heating plate 110 and the second heating plate 120, and the telescopic cavity 200 is connected to the liquid inlet 130 of the first heating plate 110 and the second heating plate 120. An infusion port 240 is opened on the side wall of the telescopic cavity 200, and the infusion port 240 is connected to a heating liquid conveyor. The heating liquid conveyor conveys the heating liquid into the telescopic cavity 200, and the heating liquid can enter the spiral guide tube 140 through the telescopic cavity 200.

[0033] The volume of the telescopic chamber 200 can change. In the initial state, when no heating liquid is input, the volume of the telescopic chamber 200 is in the minimum state. The heating liquid can fill the telescopic chamber 200 in a short time and enter the spiral guide tube 140 to gradually heat the first heating plate 110 and the second heating plate 120. The first heating plate 110 and the second heating plate 120 gradually heat the PP semi-cured layer. When the PP semi-cured layer is completely melted, the heating liquid conveyor increases the conveying power, so that the amount of heating liquid entering the telescopic chamber 200 increases. Since the size of the liquid inlet 130 does not change, the pressure in the telescopic chamber 200 gradually increases, thereby increasing the volume of the telescopic chamber 200. The telescopic chamber 200 pushes the first heating plate 110 and the second heating plate 120 away from each other, so that the first heating plate 110 and the second heating plate 120 squeeze the copper foil and the PP semi-cured layer in contact with them, so that the melted PP semi-cured layer can be more evenly attached to the copper foil, improving the lamination quality of the copper plate.

[0034] Specifically, the telescopic chamber 200 in this embodiment is composed of the following structures: A first rectangular plate frame 210 is fixedly disposed on the end surface of the second heating plate 120 close to the first heating plate 110, and a second rectangular plate frame 220 is fixedly disposed on the end surface of the second heating plate 120 close to the first heating plate 110. Figure 2 and Fig.11 As shown, the first rectangular plate frame 210 and the second rectangular plate frame 220 are slidably connected together to form the telescopic chamber 200, the outer wall of the first rectangular plate frame 210 and the inner wall of the second rectangular plate frame 220 are slidably sealed, and a first limiting plate 211 is arranged on the outer wall of the first rectangular plate frame 210, and a second limiting plate 221 is fixedly arranged on the inner wall of the second rectangular plate frame 220, and the first limiting plate 211 and the second limiting plate 221 are used to prevent the first rectangular plate frame 210 and the second rectangular plate frame 220 from being separated. Fig. 9 and 10 As shown, when the first limiting plate 211 and the second limiting plate 221 are farthest apart, the telescopic cavity 200 is in an initial state, that is, the volume of the telescopic cavity 200 is in a minimum state, at which the lower end of the first rectangular plate frame 200 abuts against the upper end surface of the second heating plate 120, and the upper end of the second rectangular plate frame 220 abuts against the lower end surface of the first heating plate 110; Fig.11 and Fig.12 As shown, when the first limiting plate 211 and the second limiting plate 221 are in contact with each other, the telescopic cavity 200 is in a state of maximum volume.

[0035] In a further embodiment, four infusion ports 240 are provided in the telescopic cavity 200, and the four infusion ports 240 are respectively located at four right angles of the first rectangular plate frame 210, as shown in FIG. Figure 5As shown, the four infusion ports 240 are oriented generally in a clockwise or counterclockwise direction, for example, Figure 5 In the counterclockwise direction shown, the infusion port 240 in the upper left corner faces downward, the infusion port 240 in the lower left corner faces right, the infusion port 240 in the lower right corner faces upward, and the infusion port 240 in the upper right corner faces left, thereby forming a direction similar to counterclockwise rotation. When the heated liquid conveyor delivers heated liquid to the four infusion ports 240, the heated liquid is simultaneously input into the telescopic cavity 200, causing the heated liquid to generate vortexes. The reason for this phenomenon is that the four infusion ports 240 are oriented clockwise or counterclockwise, and the flow velocity of the heated liquid will increase when the vortex is generated, thereby further reducing the time for the heated liquid to flow to the liquid inlet 130.

[0036] In a further embodiment, an adjustment component 250 is provided in the telescopic chamber 200, and the adjustment component 250 can adjust the opening size of the infusion port 240, and when the volume of the telescopic chamber 200 is the smallest, the opening of the infusion port 240 is smaller, and when the volume of the telescopic chamber 200 increases, the opening of the infusion port 240 increases simultaneously with the volume of the telescopic chamber 200, so that the heating liquid can be more evenly distributed in the telescopic chamber 200. As the infusion port 240 increases, the eddy current speed inside the telescopic chamber 200 is reduced, and the heating liquid flows slowly in the telescopic chamber 200, making the internal heat more uniform.

[0037] Specifically, Fig.10 and Fig.12 As shown, the regulating assembly 250 of this embodiment includes an upper liquid outlet plate 260 and a lower liquid outlet plate 270. The upper liquid outlet plate 260 is fixed on the end surface of the first heating plate 110 close to the second heating plate 120 and is located at four right angles. The lower liquid outlet plate 270 is fixed on the end surface of the second heating plate 120 close to the first heating plate 110 and is located at four right angles. Three side liquid outlet plates 280 are also arranged on the end surface of the second heating plate 120 close to the first heating plate 110. The upper liquid outlet plate 260, the lower liquid outlet plate 270 and the three side liquid outlet plates 280 are collectively surrounded to form an infusion port 240, and at the second Infusion channels 230 are provided at four right-angle positions of the heating plate 120, and the infusion channels 230 are connected to the infusion port 240 formed by the above-mentioned enclosed portion. When the volume of the telescopic chamber 200 is at its minimum, the distance between the upper liquid outlet plate 260 and the lower liquid outlet plate 270 is relatively close. When the volume of the telescopic chamber 200 gradually increases, that is, when the first heating plate 110 and the second heating plate 120 move away from each other, the upper liquid outlet plate 260 slides on the two side liquid outlet plates 280 and the distance between the two increases, while the distance between the side liquid outlet plates 280 at two symmetrical positions remains unchanged, and at this time, the opening of the infusion port 240 gradually increases.

[0038] More specifically, Figure 6 and Figure 7As shown, the sides of the three side liquid outlet plates 280 in this embodiment are connected to each other, and the two ends of the three side liquid outlet plates 280 respectively abut against the first heating plate 110 and the second heating plate 120 when the telescopic chamber 200 is in the minimum volume state, the upper liquid outlet plate 260 is fixed to the first heating plate 110 by a connecting rod 261, and the lower liquid outlet plate 270 is fixedly connected to the second heating plate 120 by a connecting plate 271, and the connecting plate 271 is fixedly connected to two symmetrical side liquid outlet plates 280, so that the three side liquid outlet plates 280 and the connecting plate 271 are connected to the opening of the infusion channel 230, so that the heated liquid in the infusion channel 230 passes through the three side liquid outlet plates 280 and the connecting plate 271 and then enters the telescopic chamber 200 through the infusion port 240.

[0039] In a further embodiment, a heat spreader 170 is installed on the end surfaces of the first heating plate 110 and the second heating plate 120 that are close to each other. The heat spreader 170 can make the temperature distribution in the telescopic cavity 200 more uniform when the telescopic cavity 200 gradually increases.

[0040] It can be understood that when the telescopic cavity 200 is in the initial state and the heating liquid starts to be input, the heating liquid flows quickly and can quickly enter the spiral guide tube 140, and the heat spreader 170 has not yet taken effect. When the volume of the telescopic cavity 200 begins to increase, there is more heating liquid in the telescopic cavity 200. At this time, the heat spreader 170 begins to work, so that the heat distribution in the telescopic cavity 200 is uniform, thereby reducing the impact on the first heating plate 110 and the second heating plate 120, so that the first heating plate 110 and the second heating plate 120 can evenly adhere the completely melted PP semi-cured layer to the copper foil, thereby improving the connection strength of the PCB board.

[0041] Specifically, the pressurizing component in the present invention includes a telescopic member (not shown in the figure), the fixed end of the telescopic member is fixed on the frame, and the telescopic end of the telescopic member abuts against the end surfaces of the first heating plate 110 or the second heating plate 120 that are away from each other. When the telescopic member is extended, it can squeeze the multiple first heating plates 110 and the second heating plates 120 closer to each other, thereby pressing the copper plates to complete the copper plate pressing operation.

[0042] It should be noted that the telescopic member in this embodiment can be a hydraulic telescopic cylinder or a telescopic air cylinder, etc., any structure that can provide a relatively large pressure and can be telescopic, and no specific limitation is made here.

[0043] The specific working process of a thick copper plate pressing device provided by the present invention is described in combination with the above embodiments: Loading: The multi-layer copper foil and multi-layer PP semi-cured laminate to be laminated are placed between adjacent heating platens 100 , and the infusion tube of the heating liquid conveyor (not shown in the figure) is connected to the infusion channel 230 .

[0044] start up: The heated liquid conveyor is started, and the heated liquid conveyor conveys the heated liquid into the telescopic chamber 200. When the conveying starts, the volume of the telescopic chamber 200 is at its minimum, and the upper liquid outlet plate 260 and the lower liquid outlet plate 270 in the telescopic chamber 200 are close to each other. Since the four infusion ports 240 are oriented counterclockwise, the heated liquid is in a vortex state when entering the telescopic chamber 200, and the flow speed of the heated liquid is relatively fast. In addition, under the premise that the volume of the telescopic chamber 200 is relatively small, the heated liquid quickly enters the spiral guide tube 140 inside the first heating plate 110 and the second heating plate 120 respectively through the two liquid inlets 130, and the heated liquid flows into the spiral guide tube 140 inside the first heating plate 110 and the second heating plate 120. The hot liquid flows rapidly in the spiral guide tube 140 so that the temperature in the middle of the first heating plate 110 and the second heating plate 120 is the highest and the temperature gradually increases in a spreading manner. The first heating plate 110 and the second heating plate 120 heat the copper foil and the PP semi-cured layer on their end surfaces from the middle to the surroundings, so that the PP semi-cured layer starts to melt from the middle and spreads to the surroundings. At the same time, the telescopic member gradually extends to squeeze the multiple first heating plates 110 and the second heating plates 120, so that the bubbles formed by the PP semi-cured layer can be discharged to the surroundings, effectively reducing the bubbles in the pressed PCB board.

[0045] When the PP semi-cured laminates on the first heating plate 110 and the second heating plate 120 are completely melted, the conveying power of the heating liquid conveyor is increased, the amount of heating liquid conveyed increases, and the telescopic cavity 200 between the first heating plate 110 and the second heating plate 120 gradually extends to push the first heating plate 110 and the second heating plate 120 away from each other. The first heating plate 110 and the second heating plate 120 evenly squeeze the copper foil and the melted PP semi-cured laminate. At this time, the infusion port 240 in the telescopic cavity 200 is enlarged, so that the heating liquid in the telescopic cavity 200 is more evenly distributed. At the same time, the presence of the heat plate 170 improves the uniformity of the temperature distribution of the heating liquid in the telescopic cavity 200, so that the heating temperature of the first heating plate 110 and the second heating plate 120 gradually becomes uniform, and the telescopic member further pressurizes the first heating plate 110 and the second heating plate 120, thereby completing the pressing operation of the PCB board.

[0046] The present invention provides a method for manufacturing an ultra-thick copper plate multilayer board, using the above-mentioned thick copper plate pressing device, and the specific steps are as follows: For the inner layer production, the copper foil is half-etched and then embedded in the pre-grooved (pre-grooving refers to a pre-processing operation on the PCB board before the finished board is cut. The main purpose is to perform preliminary grooving on the outline, mounting holes or areas that need to be divided on the board, that is, cutting with CNC or grooving equipment) grooved PP semi-cured layer board. After lamination, the other half of the residual copper thickness is etched to form the inner layer core board required for one lamination.

[0047] Wherein, step S1: use 14OZ copper foil and cut it into the required size of the panel, prepare a bare substrate with the same size as the copper foil, and adjust the thickness of the copper foil coating according to the board thickness requirement; Step S2: drilling pressing alignment holes, target holes and exhaust holes on the copper foil to prepare for subsequent pressing and processing; Step S3: controlling the etching depth to about 1 / 2 of the thickness of the copper foil to form a partially etched copper column; Step S4: Making process holes on the edge of the substrate for clamping and alignment.

[0048] Multi-layer board pressing production: The PP semi-cured layer is pre-pressed, and the pre-pressed PP semi-cured layer is pressed against the inner core board circuit protrusions to form a multi-layer board pressing.

[0049] Among them, step S1: press the copper foil, PP prepreg laminate and bare substrate together using the above-mentioned thick copper plate pressing device, so that the half-etched copper column is pressed into the pre-groove, and the pressing and filling of the adhesive are completed to form a semi-finished product structure; S2: Remove the remaining copper on the surface of the copper foil to form the inner layer circuit.

[0050] The other half of the remaining copper thickness of the pressed copper plate is etched to form an outer layer circuit, and so on, the required multi-layer board can be produced.

[0051] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. A thick copper plate pressing device, characterized in that: include: A frame, on which a plurality of heating press plates are slidably arranged, and spaces are provided between adjacent heating press plates to fill copper foil and PP prepreg laminate; A pressurizing assembly, which is capable of pressing a plurality of heating plates close to each other to press the copper foil and the PP prepreg laminate; The heating platen includes a first heating plate and a second heating plate arranged up and down, the first heating plate and the second heating plate are hollow inside, and both are provided with a spiral guide pipe inside, the first heating plate and the second heating plate are provided with a liquid inlet at the center, the liquid inlet is connected to the guide pipe, and high-temperature liquid enters the spiral guide pipe through the liquid inlet, and the temperature of the first heating plate and the second heating plate gradually increases from the inside to the outside.

2. The thick copper plate pressing device according to claim 1, characterized in that: There are four spiral guide tubes in the first heating plate and the second heating plate, and the four spiral guide tubes are in the same plane. One end of the four spiral guide tubes is connected to the liquid inlet, and the other end of the four spiral guide tubes is respectively located at four right angles of the first heating plate and the second heating plate, and the four right angles are respectively connected to liquid outlet pipes, and the four spiral guide tubes are respectively connected to the liquid outlet pipes.

3. The thick copper plate pressing device according to claim 1, characterized in that: A telescopic cavity is provided between the first heating plate and the second heating plate, a liquid infusion port is provided on a side wall of the telescopic cavity, the liquid infusion port can deliver heated liquid, and the telescopic cavity is connected to liquid inlets on the first heating plate and the second heating plate; In the initial state, the volume of the telescopic cavity is at its minimum, and the heating liquid in the telescopic cavity quickly enters the liquid inlet to gradually heat the PP semi-cured layer. After the PP semi-cured layer is completely melted, the heating liquid in the telescopic cavity increases, the volume of the telescopic cavity increases, and the first heating plate and the second heating plate move away from each other.

4. The thick copper plate pressing device according to claim 3, characterized in that: There are four infusion ports in total, and all of the four infusion ports are arranged in a clockwise or counterclockwise direction, and the four infusion ports deliver the heated liquid at the same time.

5. The thick copper plate pressing device according to claim 3, characterized in that: A first rectangular plate frame is fixedly arranged on the end surface of the first heating plate close to the second heating plate, and a second rectangular plate frame is fixedly arranged on the end surface of the second heating plate close to the first heating plate. The first rectangular plate frame and the second rectangular plate frame are slidably connected to each other to form the telescopic cavity.

6. The thick copper plate pressing device according to claim 5, characterized in that: An adjusting component is arranged in the telescopic cavity, and the adjusting component can adjust the opening size of the infusion port. The opening size of the infusion port is positively correlated with the volume of the telescopic cavity.

7. The thick copper plate pressing device according to claim 6, characterized in that: The adjustment component includes an upper liquid outlet plate and a lower liquid outlet plate, wherein the upper liquid outlet plate is fixedly arranged on the end surface of the first heating plate close to the second heating plate, and the lower liquid outlet plate is fixedly arranged on the end surface of the second heating plate close to the first heating plate, and the infusion port is formed between the upper liquid outlet plate and the lower liquid outlet plate, and the upper liquid outlet plate and the lower liquid outlet plate move relative to each other to adjust the size of the infusion port.

8. The thick copper plate pressing device according to claim 1, characterized in that: A heat spreader is disposed on the end surfaces of the first heating plate and the second heating plate that are close to each other.

9. The thick copper plate pressing device according to claim 1, characterized in that: The pressurizing assembly comprises a telescopic member, a fixed end of which is fixed on the frame, and the telescopic end of which abuts against the uppermost first heating plate.

10. The thick copper plate pressing device according to claim 9, characterized in that: The telescopic member is a telescopic cylinder or a hydraulic telescopic cylinder.

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