Controller and vehicle

Abstract

The invention relates to the technical field of controllers, and discloses a controller and a vehicle, the controller comprises a heat dissipation part, a heating part, a pushing assembly and a detection piece, and the heating part and the heat dissipation part are bonded through a heat conduction glue layer; the pushing assembly abuts against at least one of the heat dissipation component and the heating component, and the pushing assembly can adjust the distance between the heat dissipation component and the heating component. The detection piece is used for detecting the target quantity of the heat-conducting glue layer, and the target quantity can represent the thickness of the heat-conducting glue layer.

Description

Technical Field

[0001] The present application relates to but is not limited to the field of controller technology, and in particular to a controller and a vehicle. Background Art

[0002] As a core electronic device, controllers are widely used in various fields. Controllers usually include heat-generating components and heat-conducting components. The heat-generating components and heat-conducting components are bonded by a thermally conductive adhesive layer, which mainly plays the role of heat conduction and buffering vibration reduction.

[0003] In the related art, it is difficult to unify the thickness of the thermal conductive adhesive layer on the controller, and the thickness of the thermal conductive adhesive layer cannot be adjusted independently, thus affecting the product quality of the controller. Summary of the invention

[0004] The present application provides a controller, which includes a heat dissipation component, a heating component, a push assembly and a detection component, wherein the heating component and the heat dissipation component are bonded to each other through a thermally conductive adhesive layer; the push assembly abuts against at least one of the heat dissipation component and the heating component, and the push assembly can adjust the distance between the heat dissipation component and the heating component; the detection component is used to detect a target amount of the thermally conductive adhesive layer, and the target amount can represent the thickness of the thermally conductive adhesive layer.

[0005] In an implementation method provided in the present application, the controller also includes a shell, the shell has a accommodating cavity, the heat dissipation component and the heat generation component are both arranged in the accommodating cavity, one of the heat dissipation component and the heat generation component is fixed relative to the shell, and the other of the heat dissipation component and the heat generation component is abutted against the push assembly.

[0006] In an implementable method provided in the present application, the accommodating cavity has a first side wall and a second side wall arranged opposite to each other, the heat dissipation component is fixedly arranged on the first side wall, and the pushing assembly includes a pushing piece, and the side of the heat-generating component facing away from the heat dissipation component abuts against the pushing piece.

[0007] In an implementation method provided in the present application, the pushing member is a bolt having a pushing end and an operating end. The bolt thread is installed on the second side wall, the pushing end abuts against the heat-generating component, and the operating end is exposed in the accommodating cavity for tightening the bolt.

[0008] In an implementable manner provided in the present application, the push assembly further includes an elastic structure, and the push member abuts against the heat-generating component through the elastic structure.

[0009] In an implementable method provided in the present application, the push assembly also includes a support plate and a guide member. Along the thickness direction of the thermal conductive adhesive layer, the support plate is movably installed in the accommodating cavity through the guide member. The support plate has a first side and a second side that are relatively arranged. The first side abuts against the heat-generating component, and the second side abuts against the elastic structure. The elastic structure abuts against the heat-generating component through the support plate.

[0010] In an implementable manner provided in the present application, the detection component is a pressure sensor, the pressure sensor is disposed on the thermal conductive adhesive layer, and the target quantity is the pressure exerted on the thermal conductive adhesive layer in the thickness direction thereof.

[0011] In an implementation provided in the present application, a plurality of pressure sensors are disposed on the thermally conductive adhesive layer, and the plurality of pressure sensors are distributed at different positions of the thermally conductive adhesive layer.

[0012] In an implementation provided in the present application, the pressure sensor is disposed on a side of the thermal conductive adhesive layer that is away from the heat generating component.

[0013] In the second aspect, the present application provides a vehicle, which includes a body and a controller, wherein the controller is mounted on the body, and the controller includes a heat dissipation component, a heat generating component, a push assembly and a detection component, wherein the heat generating component and the heat dissipation component are bonded to each other through a thermally conductive adhesive layer; the push assembly abuts against at least one of the heat dissipation component and the heat generating component to adjust the distance between the heat dissipation component and the heat generating component; the detection component is used to detect a target amount of the thermally conductive adhesive layer, and the target amount can characterize the thickness of the thermally conductive adhesive layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 A cross-sectional schematic diagram of a controller provided in an embodiment of the present application;

[0015] Figure 2 An exploded diagram of a controller provided in an embodiment of the present application;

[0016] Figure 3 for Figure 1 A schematic diagram of the structure of the middle support plate and the guide member;

[0017] Figure 4 It is a schematic diagram of the thickness and pressure curve of the thermal conductive adhesive layer;

[0018] Figure 5 A schematic diagram of the process for adjusting the thickness of the thermal conductive adhesive layer;

[0019] Figure 6 is a schematic diagram of the position of the detection element on the thermal conductive adhesive layer (first example);

[0020] Figure 7 Schematic diagram of the position of the detection element on the thermal conductive adhesive layer (second example).

[0021] Description of reference numerals:

[0022] 1-heat dissipation component; 2-heat generating component; 21-printed circuit; 22-chip; 223-thermal conductive adhesive layer; 4-push assembly; 41-push member; 411-push end; 412-operating end; 42-elastic structure; 43-support plate; 431-guide hole; 432-push protrusion; 44-guide member; 5-detection member; 6-housing; 61-accommodating cavity; 611-first side wall; 612-second side wall. DETAILED DESCRIPTION

[0023] It should be noted that, in the absence of conflict, the embodiments and technical features in the embodiments of the present application can be combined with each other, and the detailed description in the specific implementation method should be understood as an explanation of the purpose of the present application and should not be regarded as an improper limitation on the present application.

[0024] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the specific technical solution of the present application will be further described in detail below in conjunction with the drawings in the embodiments of the present application. The following embodiments are used to illustrate the present application, but are not used to limit the scope of the present application.

[0025] In the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, unless otherwise specified, "multiple" means two or more.

[0026] In addition, in the embodiments of the present application, directional terms such as "up", "down", "left" and "right" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they may change accordingly according to the changes in the orientation of the components in the drawings.

[0027] In the embodiments of the present application, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0028] In the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0029] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of the present application should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific way.

[0030] In the embodiments of the present application, for the convenience of describing the directions, Figure 1 There are directions in the diagram, where the first direction is the height direction of the controller, and is also the thickness direction of the thermal conductive adhesive layer 3; the second direction is the width direction of the controller, and the first direction and the second direction are perpendicular to each other. It should be noted that the direction marking is only used to describe the present application, but is not used to limit the scope of the present application.

[0031] As a core electronic device, the controller is widely used in various fields. It can receive and process signals, control equipment operation, and realize automatic and intelligent operation. The controller usually includes a heat-generating component and a heat-conducting component. The heat-generating component and the heat-conducting component are bonded by a thermally conductive adhesive layer. The thermally conductive adhesive layer mainly plays the role of heat conduction and buffering vibration reduction. When setting the thermally conductive adhesive layer, the thickness of the thermally conductive adhesive layer cannot be too thick, because the thickness of the thermally conductive adhesive layer will lead to excessive thermal resistance of the thermally conductive adhesive layer, thereby affecting the heat dissipation effect of the heat-generating component; at the same time, the thickness of the thermally conductive adhesive layer cannot be too thin, because the thickness of the thermally conductive adhesive layer will make the thermally conductive adhesive layer easy to crack, which increases the probability of collision between the heat-generating component and the heat-conducting component, thereby affecting the normal use of the controller.

[0032] In the related art, the glue layer between the heat-generating component and the heat-conducting component is mainly set by dispensing. Due to the uncertainty of the dispensing amount of the dispensing equipment, it is difficult to unify the thickness of the thermal conductive glue layer on the controller, and the thickness of the thermal conductive glue layer cannot be adjusted separately, thus affecting the product quality of the controller.

[0033] In order to solve the above problems, the embodiment of the present application provides a controller. Here, it should be explained that the controller mentioned in the embodiment of the present application can be a domain controller, a microcontroller, or a combination logic controller, and the embodiment of the present application does not limit this. In an implementable manner provided in the embodiment of the present application, the controller is a domain controller.

[0034] Reference Figure 1 In the embodiment of the present application, the controller includes a heat dissipation component 1, a heating component 2, a push assembly 4 and a detection component 5. The heating component 2 and the heat dissipation component 1 are bonded by a thermal conductive adhesive layer 3; the push assembly 4 abuts against at least one of the heat dissipation component 1 and the heating component 2, and the push assembly 4 can adjust the distance between the heat dissipation component 1 and the heating component 2; the detection component 5 is used to detect a target amount of the thermal conductive adhesive layer 3, and the target amount can represent the thickness of the thermal conductive adhesive layer 3.

[0035] In the embodiment of the present application, the function of the heat dissipation component 1 is to reduce the temperature of the heat generating component 2. Therefore, the structure of the heat dissipation component 1 has many possibilities. For example, the heat dissipation component 1 can be a heat sink, which has a large surface area and can transfer heat from the inside of the controller to the environment by natural convection or forced convection. Alternatively, the heat dissipation component 1 can also be a heat pipe, which can be used to quickly transfer the heat of the heat generating component 2 to the housing 6 of the controller to improve the heat dissipation efficiency of the heat generating component 2.

[0036] In the embodiment of the present application, the heat-generating component 2 refers to a component that generates heat due to the passage of current, energy conversion or other physical processes during operation. Therefore, the structural form of the heat-generating component 2 has many possibilities. For example, the heat-generating component 2 can be a control chip or a power module, and the embodiment of the present application does not limit this.

[0037] In the embodiment of the present application, the heat-generating component 2 and the heat-dissipating component 1 are bonded by a thermally conductive adhesive layer 3. Here, the thermally conductive adhesive layer 3 can play a role of bonding and fixing on the one hand, and can play a role of heat conduction and buffering and shock absorption on the other hand. The structural form of the thermally conductive adhesive layer 3 has many possibilities. For example, the thermally conductive adhesive layer 3 can be thermally conductive silica gel, thermally conductive gel, or epoxy thermally conductive adhesive. The embodiment of the present application does not limit this.

[0038] In the embodiment of the present application, when the pushing assembly 4 adjusts the distance between the heat dissipation component 1 and the heat generating component 2, the pushing assembly 4 can abut against one of the heat dissipation component 1 and the heat generating component 2, or can abut against both the heat dissipation component 1 and the heat generating component 2 at the same time, and the embodiment of the present application does not impose any restrictions on this.

[0039] In the embodiment of the present application, the pushing component 4 adjusts the distance between the heat dissipation component 1 and the heat generating component 2 by adjusting the pushing force on the component abutting therewith. Specifically, when it is necessary to reduce the distance between the heat dissipation component 1 and the heat generating component 2, the pushing component 4 can increase the pushing force on the component abutting therewith, and the thermal conductive adhesive layer 3 is compressed and thinned to store force, thereby reducing the distance between the heat dissipation component 1 and the heat generating component 2; when it is necessary to increase the distance between the heat dissipation component 1 and the heat generating component 2, the pushing component 4 can reduce the pushing force on the component abutting therewith, and the thermal conductive adhesive layer 3 recovers to the corresponding thickness under the action of its own elastic force, thereby driving the distance between the heat dissipation component 1 and the heat generating component 2 to increase.

[0040] In the embodiment of the present application, the function of the detection component 5 is to detect the target quantity of the thermally conductive adhesive layer 3, so as to characterize the thickness of the thermally conductive adhesive layer 3 with the target quantity. Therefore, the structural form of the detection component 5 is related to the type of the target quantity. For example, when the target quantity is thermal conductivity, the detection component 5 can be a thermal conductivity tester. According to the formula Q=k·A·ΔT / d (Q is the heat conduction rate, k is the thermal conductivity of the thermally conductive adhesive layer 3, A is the heat transfer area, and ΔT is the temperature difference between the heat source and the cold source), it can be known that when other conditions remain unchanged (that is, Q, A and ΔT remain constant), the thermal conductivity k is inversely proportional to the thickness d. Therefore, the thickness of the thermally conductive adhesive layer 3 can be obtained based on the thermal conductivity of the thermally conductive adhesive layer 3. Alternatively, when the target quantity is the pressure on the thermally conductive adhesive layer 3, the detection component 5 can be a pressure detection component 5. Since the thickness of the thermally conductive adhesive layer 3 is related to the pressure on the thermally conductive adhesive layer 3, that is, as the pressure on the thermally conductive adhesive layer 3 increases, the thickness of the thermally conductive adhesive layer 3 gradually decreases. Therefore, the thickness of the thermally conductive adhesive layer 3 can be known according to the pressure on the thermally conductive adhesive layer 3.

[0041] In the technical solution provided in the embodiment of the present application, the controller includes a heat dissipation component 1, a heating component 2, a push assembly 4 and a detection component 5, wherein the heating component 2 and the heat dissipation component 1 are bonded by a thermally conductive adhesive layer 3. When adjusting the thickness of the thermally conductive adhesive layer 3, the distance between the heat dissipation component 1 and the heating component 2 can be adjusted by the push assembly 4, so as to adjust the thickness of the thermally conductive adhesive layer 3. At the same time, the target amount of the thermally conductive adhesive layer 3 can be detected by the detection component 5 to obtain the thickness of the thermally conductive adhesive layer 3 through the target amount. When the thickness of the thermally conductive adhesive layer 3 matches the target adjustment thickness, the adjustment of the distance between the heat dissipation component 1 and the heating component 2 is stopped.

[0042] Compared with the solution in the related art that the thermally conductive adhesive layer 3 between the heat-generating component 2 and the heat-conducting component is mainly set by dispensing, in the embodiment of the present application, the controller includes a push assembly 4 and a detection component 5. After the thermally conductive adhesive layer 3 is set between the heat-generating component 2 and the heat-conducting component, the distance between the heat-dissipating component 1 and the heat-generating component 2 is adjusted by the push assembly 4 to adjust the thickness of the thermally conductive adhesive layer 3. At the same time, the target amount of the thermally conductive adhesive layer 3 is detected by the detection component 5 to determine the thickness of the thermally conductive adhesive layer 3 until the thickness of the thermally conductive adhesive layer 3 matches the target adjustment thickness. In this way, the thickness of the thermally conductive adhesive layer 3 on the controller can be unified, and the thickness of the thermally conductive adhesive layer 3 can also be adjusted individually according to actual conditions, thereby improving the product quality of the controller.

[0043] In the embodiment of the present application, the controller may include a housing 6 or may not include a housing 6. When the controller does not include a housing 6, the controller may include a mounting bracket, and the heat dissipation component 1 and the heat generation component 2 may be arranged on the mounting bracket.

[0044] Reference Figure 1 In a possible embodiment of the present application, the controller further includes a housing 6, the housing 6 having a housing cavity 61, the heat dissipation component 1 and the heat generating component 2 are both arranged in the housing cavity 61, one of the heat dissipation component 1 and the heat generating component 2 is fixed relative to the housing 6, and the other of the heat dissipation component 1 and the heat generating component 2 is abutted against the push assembly 4. Here, the controller includes a housing 6, the housing 6 having a housing cavity 61, the heat dissipation component 1 and the heat generating component 2 are both arranged in the housing cavity 61, so that the housing 6 can provide protection for the heat dissipation component 1 and the heat generating component 2, reduce the probability of damage to the heat dissipation component 1 and the heat generating component 2 due to collision during use, and help to extend the service life of the controller; one of the heat dissipation component 1 and the heat generating component 2 is fixed relative to the housing 6, and the other of the heat dissipation component 1 and the heat generating component 2 is abutted against the push assembly 4, which helps to simplify the structural form of the push assembly 4 and can facilitate the manufacture and assembly of the push assembly 4.

[0045] In the embodiment of the present application, when the heat dissipation component 1 and the heat generating component 2 are both arranged in the accommodating cavity 61, the heat dissipation component 1 can be fixed relative to the outer shell 6, and the heat generating component 2 can abut against the pushing assembly 4; or, the heat generating component 2 can be fixed relative to the outer shell 6, and the heat dissipation component 1 can abut against the pushing assembly 4, and the embodiment of the present application does not limit this.

[0046] In the embodiment of the present application, there are many possible arrangements of the heat dissipation component 1 and the heat generating component 2 in the accommodating cavity 61. For example, the accommodating cavity 61 has a first side wall 611 and a second side wall 612 that are relatively arranged. The heat generating component 2 is fixedly arranged on the first side wall 611. In a direction perpendicular to the arrangement direction of the first side wall 611 and the second side wall 612, the pushing assembly 4 abuts against the heat dissipation component 1.

[0047] Reference Figure 1 In a possible embodiment of the present application, the accommodating cavity 61 has a first side wall 611 and a second side wall 612 that are arranged opposite to each other, the heat dissipating component 1 is fixedly arranged on the first side wall 611, and the pushing assembly 4 includes a pushing member 41, and the side of the heat dissipating component 2 that is away from the heat dissipating component 1 abuts against the pushing member 41. In this way, when the pushing member 41 pushes the heat dissipating component 2, the direction of the pushing force exerted by the pushing member 41 on the heat dissipating component 2 is parallel to the arrangement direction of the first side wall 611 and the second side wall 612, and the first side wall 611 can provide a reliable supporting foundation for the heat dissipating component 2 and the heat dissipating component 1, reducing the probability of the heat dissipating component 1 moving under the action of the pushing member 41, and improving the reliability of the controller when in use.

[0048] In the embodiment of the present application, there are many possible ways to set the heat dissipation component 1 on the first side wall 611. For example, the heat dissipation component 1 can be set on the first side wall 611 by a fastener; or, the heat dissipation component 1 can also be set on the first side wall 611 by bonding, and the embodiment of the present application does not limit this.

[0049] In the embodiment of the present application, the structural form of the pushing member 41 has many possibilities. For example, the pushing member 41 can be a pushing slider. Along the arrangement direction of the first side wall 611 and the second side wall 612, the pushing slider is movably assembled in the accommodating cavity 61, and in the movable stroke of the pushing slider, the pushing slider has a plurality of fixed positions that are clamped and fixed with the inner wall of the accommodating cavity 61. By changing the position of the pushing slider, the distance between the heat dissipation component 1 and the heat generation component 2 can be adjusted.

[0050] Reference Figure 1 and Figure 2In a possible embodiment of the present application, the push member 41 is a bolt, the bolt has a push end 411 and an operating end 412, the bolt thread is installed on the second side wall 612, the push end 411 is in contact with the heat generating component 2, and the operating end 412 is exposed in the accommodating cavity 61 for screwing the bolt. Here, the push member 41 is a bolt, the bolt thread is installed on the second side wall 612, and the push force of the push end 411 on the heat generating component 2 can be adjusted by screwing the bolt, thereby completing the adjustment of the spacing between the heat dissipation component 1 and the heat generating component 2. Since the bolt and the second side wall 612 cooperate through the threaded structure, a small displacement adjustment can be achieved when screwing the bolt, which helps to improve the adjustment accuracy. In addition, the threaded structure can meet the self-locking condition. In the absence of loosening torque, the bolt will not loosen, so that the bolt can continuously provide a push force for the heat generating component 2, which helps to keep the heat conductive adhesive layer 3 at the target adjustment thickness after the thickness of the heat conductive adhesive layer 3 is adjusted, thereby improving the reliability of the controller. The bolt has a push end 411 and an operating end 412. The push end 411 abuts against the heat generating component 2, and the operating end 412 is exposed from the accommodating cavity 61 for screwing the bolt. In this way, when adjusting the thickness of the thermal conductive adhesive layer 3, the operating end 412 can be screwed outside the housing 6 without opening the housing 6 for adjustment, thereby improving the convenience of the controller operation.

[0051] In the embodiment of the present application, there are many possible contact modes between the push member 41 and the heat generating component 2. For example, the push member 41 and the heat generating component 2 may be directly in contact or indirectly in contact, and the embodiment of the present application does not limit this. Figure 1 and Figure 2 In a possible embodiment of the present application, the push assembly 4 further includes an elastic structure 42, and the push piece 41 abuts against the heat generating component 2 through the elastic structure 42. Here, the push piece 41 abuts against the heat generating component 2 through the elastic structure 42. On the one hand, since the elastic structure 42 can be elastically deformed under the action of external force, the change of external force can be adapted through the deformation of the elastic structure 42, thereby increasing the pressure adjustment range of the heat generating component 2; on the other hand, the elastic structure 42 can absorb vibration and impact, so that the thrust of the push piece 41 can be smoothly transmitted to the heat generating component 2, which helps to improve the pressure adjustment accuracy.

[0052] In the embodiment of the present application, the elastic structure 42 has various possible structural forms, for example, the elastic structure 42 may be a leaf spring, through which the push member 41 abuts against the heating component 2. Alternatively, the elastic structure 42 may also be a rubber pad, through which the push member 41 abuts against the heating component 2.

[0053] Reference Figure 1 and Figure 2In a possible embodiment of the present application, the elastic structure 42 is a compression spring, and the push member 41 abuts against the heat generating component 2 through the compression spring. In order to make the push member 41 and the compression spring fit reliably, the compression spring is sleeved at the push end 411 of the push member 41.

[0054] In the embodiment of the present application, there are many possibilities for the relationship between the number of the push piece 41 and the compression spring. For example, only one push piece 41 may be provided, and three positioning protrusions are provided on the side of the push piece 41 facing the heat-generating component 2, and the number of the compression springs is also three, and the three compression springs are respectively mounted on the corresponding positioning protrusions. Alternatively, four push pieces 41 may be provided, and only one positioning protrusion is provided on the side of the push piece 41 facing the heat-generating component 2, and the number of the compression springs is the same as that of the push pieces 41, and the four compression springs are respectively mounted on the corresponding positioning protrusions of the push piece 41.

[0055] In the embodiment of the present application, in order to prevent the elastic structure 42 from scratching the heating component 2 when it abuts against the heating component 2, refer to Figure 1 and Figure 2 , the push assembly 4 also includes a support plate 43 and a guide member 44. Along the thickness direction of the thermal conductive adhesive layer 3, the support plate 43 is movably installed in the accommodating cavity 61 through the guide member 44. The support plate 43 has a first side and a second side that are relatively arranged. The first side abuts against the heat-generating component 2, and the second side abuts against the elastic structure 42. The elastic structure 42 abuts against the heat-generating component 2 through the support plate 43. Here, the push assembly 4 also includes a support plate 43 and a guide member 44. Along the thickness direction of the thermal conductive adhesive layer 3, the support plate 43 is movably installed in the accommodating cavity 61 through the guide member 44, so that the support plate 43 can only move in the thickness direction of the thermal conductive adhesive layer 3, thereby improving the reliability of the support plate 43 and the elastic structure 42, and reducing the probability of lateral bending of the elastic structure 42 during the compression process. In addition, when there are multiple elastic structures 42, the support plate 43 can also play the role of balancing the force of the elastic structure 42, so that the pressure on the thermal conductive adhesive layer 3 is more balanced, which helps to further improve the adjustment accuracy of the thickness of the thermal conductive adhesive layer 3.

[0056] In the embodiment of the present application, the guide member 44 is used to guide the support plate 43. Therefore, the structure of the guide member 44 has many possibilities. For example, referring to Figure 1 The guide member 44 may be a guide rod, and the support plate 43 may have a guide hole 431 that movably cooperates with the guide rod; or, the guide member 44 may be a guide rail, and the support plate 43 may have a guide groove that movably cooperates with the guide rail, which is not limited in this embodiment of the present application.

[0057] In the present application, refer to Figure 1 , Figure 2 and Figure 3The heat generating component 2 includes a printed circuit board 21 and a chip 22 arranged on the printed circuit board 21. A push protrusion 432 is provided on the side of the support plate 43 facing the printed circuit board 21, and the support plate 43 abuts against the heat generating component 2 through the push protrusion 432. In this way, the contact area between the support plate 43 and the printed circuit board 21 can be reduced, so that as many electrical components as possible can be arranged on the side of the printed circuit board 21 facing the support plate 43, thereby improving the space utilization rate of the surface of the printed circuit board 21.

[0058] In the present application, refer to Figure 1 and Figure 2 , the detection element 5 is a pressure sensor, which is arranged on the thermal conductive adhesive layer 3, and the target value is the pressure on the thermal conductive adhesive layer 3 in the thickness direction. Before adjusting the thickness of the thermal conductive adhesive layer 3, refer to Figure 4 , it is necessary to first test and obtain the thickness and pressure curve of the thermal conductive adhesive layer 3. The horizontal axis in the figure is the pressure on the thermal conductive adhesive layer 3, and the vertical axis is the thickness of the thermal conductive adhesive layer 3. According to the figure, it can be seen that the thickness of the thermal conductive adhesive layer 3 and the pressure on the thermal conductive adhesive layer 3 are in a monotonically decreasing functional relationship; secondly, refer to Figure 5 , determine the pressure calibration value of the thermal conductive adhesive layer 3 at this thickness according to the target adjustment thickness; then screw the bolt so that the bolt squeezes the compression spring, and the applied force acts on the support plate 43 and the heat-generating component 2 in turn through the compression spring, and finally converts into pressure on the thermal conductive adhesive layer 3. At this time, the pressure sensor is used to detect the pressure of the thermal conductive adhesive layer 3 to determine whether the pressure of the thermal conductive adhesive layer 3 is close to the pressure calibration value. If the pressure of the thermal conductive adhesive layer 3 is close to the pressure calibration value, the thickness of the thermal conductive adhesive layer 3 reaches the target adjustment thickness, and the adjustment of the bolt is stopped; if there is a gap between the pressure of the thermal conductive adhesive layer 3 and the pressure calibration value, it is necessary to continue to adjust the screw-in amount of the bolt until the pressure of the thermal conductive adhesive layer 3 is close to the pressure calibration value. This solution uses the relationship between the thickness of the thermal conductive adhesive layer 3 and the pressure on the thermal conductive adhesive layer 3 to adjust the thickness of the thermal conductive adhesive layer 3. It does not require the use of high-precision machine tools and detection equipment to achieve precise control of the thickness of the thermal conductive adhesive layer 3, thereby reducing the production cost of the controller.

[0059] It should be noted that the pressure of the thermal conductive adhesive layer 3 is close to the pressure calibration value, which means that the difference between the pressure of the thermal conductive adhesive layer 3 and the pressure calibration value is small. For example, the pressure of the thermal conductive adhesive layer is 20psi, and the pressure calibration value is 21psi. At this time, it can be determined that the pressure of the thermal conductive adhesive layer 3 is close to the pressure calibration value. However, depending on the accuracy of the adjustment requirements, the difference between the pressure of the thermal conductive adhesive layer 3 and the pressure calibration value shall not be greater than the maximum allowable error, and the embodiments of the present application do not limit this.

[0060] In the embodiment of the present application, the thickness of the thermally conductive adhesive layer 3 can be precisely controlled to a smaller value, such as 0.3 mm. In this way, the thermally conductive adhesive layer 3 can have both high thermal conductivity and guaranteed strength of the thermally conductive adhesive layer 3, thereby improving the product quality of the controller.

[0061] In the embodiment of the present application, there are many possible settings for the number of pressure sensors. For example, only one pressure sensor may be provided. Figure 6 and Figure 7 In a possible embodiment of the present application, a plurality of pressure sensors are provided on the thermally conductive adhesive layer 3, and the plurality of pressure sensors are distributed at different positions of the thermally conductive adhesive layer 3. In this way, the pressure sensor can cover a larger measurement area, which helps to improve the measurement accuracy of the pressure on the thermally conductive adhesive layer 3, thereby improving the adjustment accuracy of the thickness of the thermally conductive adhesive layer 3.

[0062] In the embodiment of the present application, when a plurality of pressure sensors are distributed at different positions of the thermal conductive adhesive layer 3, refer to Figure 6 , multiple pressure sensors can be evenly distributed at different positions of the thermal conductive adhesive layer 3; or, referring to Figure 7 , multiple pressure sensors can also be irregularly distributed at different positions of the thermal conductive adhesive layer 3, and the embodiment of the present application is not limited to this.

[0063] In the embodiment of the present application, there are many possible locations for the pressure sensor. For example, the pressure sensor can be arranged on the side of the thermal conductive adhesive layer 3 facing away from the heat dissipation component 1. Figure 2 In a possible embodiment of the present application, the pressure sensor can be arranged on the side of the thermal conductive adhesive layer 3 facing away from the heat generating component 2. In this way, the arrangement of the pressure sensor will not affect the contact area between the thermal conductive adhesive layer 3 and the heat generating component 2, which helps to improve the heat dissipation effect of the heat generating component 2.

[0064] In the embodiment of the present application, in order to reduce the influence of the pressure sensor on heat dissipation, the pressure sensor can be embedded in the heat dissipation component 1. In addition, a smaller pressure sensor can also be used, for example, the sensor area is about 18mm 2 , the thickness is about 0.1mm. In this way, the influence of the pressure sensor on heat dissipation can also be reduced.

[0065] On this basis, an embodiment of the present application also provides a vehicle, which includes a body and a controller, the controller is installed on the body, and the controller includes a heat dissipation component 1, a heating component 2, a push assembly 4 and a detection component 5, the heating component 2 and the heat dissipation component 1 are bonded by a thermal conductive adhesive layer 3; the push assembly 4 abuts against at least one of the heat dissipation component 1 and the heating component 2 to adjust the distance between the heat dissipation component 1 and the heating component 2; the detection component 5 is used to detect a target amount of the thermal conductive adhesive layer 3, and the target amount can characterize the thickness of the thermal conductive adhesive layer 3.

[0066] The vehicle mentioned in the embodiments of the present application may refer to a large car, a small car, a special-purpose vehicle, etc. For example, according to the vehicle model, the vehicle in the embodiments of the present application may refer to a sedan model, an off-road vehicle model, a multi-purpose vehicle (MPV) or other models.

[0067] In the embodiment of the present application, there are many possible installation positions of the controller on the vehicle body. For example, the controller can be installed under the hood, under the dashboard, or inside the engine compartment. The embodiment of the present application does not limit this.

[0068] The vehicle provided in the embodiment of the present application also has the same technical effect because it includes the controller of the embodiment of the present application, that is, the thickness of the thermal conductive adhesive layer 3 on the controller can be adjusted individually according to actual conditions, thereby improving the product quality of the controller.

[0069] The above are only preferred embodiments of the present application and are not intended to limit the scope of protection of the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.

Claims

1. A controller, comprising: Heat dissipation components; A heat-generating component, wherein the heat-generating component and the heat-dissipating component are bonded together by a heat-conducting adhesive layer; A push assembly, the push assembly abutting against at least one of the heat dissipation component and the heat generation component, the push assembly being capable of adjusting the distance between the heat dissipation component and the heat generation component; A detection member is used to detect a target amount of the thermally conductive adhesive layer, and the target amount can represent the thickness of the thermally conductive adhesive layer.

2. The controller according to claim 1 further comprises a shell, the shell having a accommodating cavity, the heat dissipation component and the heat generation component are both arranged in the accommodating cavity, one of the heat dissipation component and the heat generation component is fixed relative to the shell, and the other of the heat dissipation component and the heat generation component is abutted against the push assembly.

3. According to the controller of claim 2, the accommodating cavity has a first side wall and a second side wall arranged opposite to each other, the heat dissipation component is fixedly arranged on the first side wall, the pushing assembly includes a pushing piece, and the side of the heat-generating component facing away from the heat dissipation component abuts against the pushing piece.

4. According to the controller according to claim 3, the pushing member is a bolt, and the bolt has a pushing end and an operating end. The bolt is threadedly mounted on the second side wall, the pushing end abuts against the heat-generating component, and the operating end is exposed from the accommodating cavity for screwing the bolt. 5 . The controller according to claim 3 , wherein the push assembly further comprises an elastic structure, and the push member abuts against the heat generating component via the elastic structure.

6. According to the controller of claim 5, the push assembly also includes a support plate and a guide member, and along the thickness direction of the thermal conductive adhesive layer, the support plate is movably installed in the accommodating cavity through the guide member, and the support plate has a first side and a second side that are relatively arranged, the first side abuts against the heat-generating component, and the second side abuts against the elastic structure, and the elastic structure abuts against the heat-generating component through the support plate.

7. The controller according to any one of claims 1 to 4, wherein the detection element is a pressure sensor, the pressure sensor is arranged on the thermal conductive adhesive layer, and the target amount is the pressure applied to the thermal conductive adhesive layer in the thickness direction thereof. 8 . The controller according to claim 7 , wherein a plurality of pressure sensors are disposed on the thermally conductive adhesive layer, and the plurality of pressure sensors are distributed at different positions of the thermally conductive adhesive layer. 9 . The controller according to claim 7 , wherein the pressure sensor is arranged on a side of the thermal conductive adhesive layer facing away from the heat generating component.

10. A vehicle comprising: Car body; A controller is installed on the vehicle body, and the controller includes a heat dissipation component, a heating component, a push assembly and a detection component, the heating component and the heat dissipation component are bonded by a thermally conductive adhesive layer; the push assembly abuts against at least one of the heat dissipation component and the heating component to adjust the distance between the heat dissipation component and the heating component; the detection component is used to detect a target amount of the thermally conductive adhesive layer, and the target amount can represent the thickness of the thermally conductive adhesive layer.

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