Energy-saving far infrared ceramic heat dissipating device

Through the combination of far-infrared ceramic materials and air cooling mechanism, the limitations of traditional heat conduction heat dissipation methods are solved, and efficient heat radiation and air cooling are combined to adapt to different equipment shapes, thereby improving heat dissipation efficiency and adaptability.

CN119629958BActive Publication Date: 2025-10-17GUANGDONG SHENGYILONG HOME PROD CO LTD
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Patent Information

Application Number
CN202411837626.8
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-12-13
Publication Date
2025-10-17
Estimated Expiration
2044-12-13

AI Technical Summary

Technical Problem

The existing heat conduction heat dissipation method has limitations, especially the problem of heat accumulation in the air, and traditional heat dissipation materials are difficult to meet the needs of efficient heat dissipation in electronic devices.

Method used

The heat dissipation device is made of far-infrared ceramic material, combined with an air cooling mechanism and a heat-conducting component. It uses the thermal radiation properties of far-infrared ceramics to dissipate heat, expands the air cooling range by tilting the fan, reduces the rotational resistance of the swivel, and uses lubricating oil to lubricate the balls to improve heat dissipation efficiency.

Benefits of technology

It realizes the combination of efficient heat radiation heat dissipation and air cooling, improves the heat dissipation effect of electronic devices, adapts to different equipment shapes, reduces rotational resistance, and enhances the adaptability and cooling capacity of the heat dissipation device.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application relates to the technical field of heat dissipation, and discloses an energy-saving far-infrared ceramic heat dissipation device, which comprises a main plate, a heat dissipation frame and a heat conduction assembly, the heat dissipation frame is fixedly connected with the main plate through a plurality of heat dissipation plates, the heat conduction assembly is arranged on the heat dissipation plate and is used for being attached to equipment and conducting heat, the heat conduction assembly comprises a heat conduction rod, a sliding hole is arranged on the heat dissipation plate, the heat conduction rod is slidably arranged in the sliding hole, the main plate, the heat dissipation frame and the heat conduction rod are all made of far-infrared ceramic material, and the energy-saving far-infrared ceramic heat dissipation device further comprises a mounting assembly, the mounting assembly comprises a plurality of mounting plates, the mounting plates are fixedly connected at equal angles outside the heat dissipation frame, and mounting holes for passing through a rope are arranged on the mounting plates.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of heat dissipation technology, in particular to an energy-saving far-infrared ceramic heat dissipation device. BACKGROUND

[0002] Far-infrared ceramic is a branch of new type ceramic, which is different from ordinary ceramic composed of silica, alumina and other kaolin components. Far-infrared ceramic is a special ceramic material capable of radiating specific wavelength far-infrared rays, which is made of more than 20 inorganic compounds and trace amounts of metals or specific natural minerals in different proportions and then calcined at 1200-1600 ℃.

[0003] The heat generated by electronic devices is increasing with the improvement of integration, which seriously affects the service life of the electric appliance. In the fields of electronics, construction, aerospace, etc., the problem of how to quickly and efficiently dissipate heat is faced. The commonly used heat dissipation methods are mainly based on heat conduction, but there are limitations of heat accumulation in air and other application scenarios. The radiation heat dissipation material has high infrared emissivity and can realize the heat dissipation function. Since the ceramic material has the advantages of high radiation rate, high strength, corrosion resistance, high temperature resistance and long service life, it is an important infrared radiation heat dissipation material. Therefore, we propose an energy-saving far-infrared ceramic heat dissipation device to improve the heat dissipation effect. SUMMARY

[0004] The present application proposes an energy-saving far-infrared ceramic heat dissipation device, which solves the problem of limitations of heat conduction in the prior art.

[0005] The technical scheme of the present application is as follows: an energy-saving far-infrared ceramic heat dissipation device, comprising:

[0006] a main board;

[0007] a heat dissipation frame fixedly connected with the main board through a plurality of heat dissipation plates;

[0008] a heat conduction assembly arranged on the heat dissipation plate for being attached to and conducting heat with the device, the heat conduction assembly comprising:

[0009] a heat conduction rod, a sliding hole is formed in the heat dissipation plate, and the heat conduction rod is slidably arranged in the sliding hole;

[0010] a plurality of heat dissipation fins fixedly connected to one end of the heat dissipation plate away from the device;

[0011] The main board, the heat dissipation frame, the heat conduction rod and the heat dissipation fin are all made of far-infrared ceramic material.

[0012] To improve the cooling effect, a forced air cooling mechanism is further included, which comprises:

[0013] A fan is installed on the heat dissipation frame through a mounting bracket.

[0014] To install the heat dissipation device, a mounting assembly is further included, which comprises:

[0015] A plurality of mounting plates are provided and fixed at equal angles outside the heat dissipation frame, and mounting holes for passing through the ropes are formed on the mounting plates.

[0016] To ensure the stability of the heat conduction rod, a limiting assembly is further included, which comprises:

[0017] A limiting plate is provided inside the limiting groove through a compression spring, and the limiting plate is in contact with the heat conduction rod.

[0018] To further improve the cooling effect, a rotating ring is rotatably connected outside the heat dissipation frame, the fan is fixedly connected to the rotating ring through a mounting bracket, and the fan is arranged in an inclined manner.

[0019] To reduce the resistance of the rotating ring, a rotating groove is formed on the heat dissipation frame, the rotating ring is located inside the rotating groove, a plurality of rolling balls are rotatably connected to the top end, the bottom end and the inner wall of the rotating ring, and the rolling balls are in contact with the inner wall of the rotating groove.

[0020] To further reduce the resistance of the rotating ring, a lubricating assembly is further included, which is used for lubricating between the rotating ring and the heat dissipation frame, and the lubricating assembly comprises:

[0021] A sponge is located inside the oil storage groove, the inside of the sponge absorbs lubricating oil, and the part of the rolling balls located inside the oil storage groove is in contact with the sponge.

[0022] To reduce the influence of dust on heat dissipation, a cleaning assembly is further included, which is used for cleaning the heat dissipation fins, and the cleaning assembly comprises:

[0023] A driving rod is rotatably connected to the mounting bracket, and one end of the driving rod is coaxially fixedly connected to the fan blade.

[0024] A cleaning rod is rotatably connected to the mounting bracket, and the cleaning rod is in transmission connection with the driving rod.

[0025] A brush is detachably connected outside the cleaning rod, and the brush is in contact with the heat dissipation fins.

[0026] In order to make the heat conduction rod and the equipment needing heat dissipation fit, the heat conduction rod is fixedly connected with the heat conduction block at one end close to the equipment.

[0027] The working principle and beneficial effects of the present application are:

[0028] 1、In the present application, the ropes are tied on the corresponding mounting holes, and the heat dissipation device can be tied outside the equipment through the ropes, the heat conduction block is in contact with the surface of the equipment by pushing the heat conduction rod, and the heat dissipation plate, the heat dissipation frame and the heat dissipation fin can dissipate heat to the equipment through the good heat radiation performance of the far infrared ceramic material.

[0029] 2、In the present application, the fan blows air to the equipment, and the equipment and the heat dissipation frame are air-cooled and cooled at the same time, and the fan is inclined, part of the wind force is divided into the tangent direction of the rotating ring, the rotating ring is pushed to rotate, the fan rotates around the heat dissipation frame, the air cooling range is expanded, and the heat dissipation effect of the equipment is improved.

[0030] 3、In the present application, the rotation of the ball can reduce the resistance of the rotating ring, and the lubricating oil in the sponge can be applied to the inside of the rotating groove during the rotation of the ball, so as to further reduce the resistance of the ball and the rotating ring, and reduce the work of the fan.

[0031] 4、Therefore, compared with the heat conduction heat dissipation mode in the prior art, the present application can make the main board, the heat dissipation plate, the heat dissipation frame and the heat dissipation fin dissipate heat to the equipment efficiently through the heat radiation performance of the far infrared ceramic material, the fan can air-cool and cool the equipment, the rotating ring is pushed to rotate in the opposite direction during the blowing process of the fan, the blowing range of the fan is expanded, the heat dissipation and cooling effect of the equipment is improved, the resistance of the rotating ring is reduced by the rotation of the ball, and the ball is lubricated by the lubricating oil, so as to further reduce the resistance of the rotating ring, and the heat dissipation effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0032] The present application will be further described in detail below in combination with the drawings and specific embodiments.

[0033] Figure 1 It is a structural schematic view of the first perspective of the present application;

[0034] Figure 2 It is a structural schematic view of the second perspective of the present application;

[0035] Figure 3 It is a structural schematic view of the main board, the heat dissipation frame, the heat dissipation fin and the heat dissipation plate of the present application;

[0036] Figure 4 It is a structural schematic view of the present application Figure 3 It is a structural schematic view of the present application

[0037] Figure 5 It is a structural schematic view of the rotating ring, the air cooling mechanism and the lubricating assembly of the present application;

[0038] Figure 6 For the application Figure 5 The structure diagram of local amplification at B in the application is shown in the figure.

[0039] Figure 7 The structure diagram of the air cooling mechanism and the cleaning assembly of the application is shown in the figure.

[0040] In the figure:

[0041] 1, main board; 2, heat dissipation frame; 3, heat dissipation fin; 4, heat dissipation plate; 5, rotating ring; 6, ball bearing;

[0042] 101, heat conduction rod; 102, heat conduction block;

[0043] 201, limiting plate; 202, compression spring;

[0044] 301, mounting plate;

[0045] 401, fan; 402, mounting bracket;

[0046] 501, sponge;

[0047] 601, driving rod; 602, cleaning rod; 603, brush; 604, driving bevel gear; 605, transmission bevel gear; 606, replacement bracket. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the embodiments of the application. Obviously, the described embodiments are only a part of the embodiments of the application, rather than all the embodiments of the application. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative work are within the protection scope of the application.

[0049] As Figures 1 to 7 shown, the embodiment provides an energy-saving far infrared ceramic heat dissipation device, which comprises a main board 1, a heat dissipation frame 2, a heat conduction assembly and a heat dissipation fin 3. Compared with the heat conduction heat dissipation mode in the prior art, the application uses the heat radiation performance of the far infrared ceramic material to make the main board 1, the heat dissipation plate 4, the heat dissipation frame 2 and the heat dissipation fin 3 efficiently dissipate heat from the equipment. The fan 401 is used to air cool the equipment, and the fan 401 reversely drives the rotating ring 5 to rotate during the blowing process, thereby expanding the blowing range of the fan 401 and improving the heat dissipation and cooling effect on the equipment. The rotation of the ball bearing 6 reduces the resistance of the rotating ring 5, and the lubricating oil lubricates the ball bearing 6, thereby further reducing the resistance of the rotating ring 5, and the heat dissipation effect is good.

[0050] The heat dissipation frame 2 is fixedly connected with the plurality of heat dissipation plates 4 and the main plate 1, the heat dissipation frame 2 is annular, the heat dissipation plates 4 are arranged along the radial direction of the heat dissipation frame 2, the device is in contact with the main plate 1, the heat dissipation plates 4 and the heat dissipation frame 2, and heat conduction is performed on the device, meanwhile, heat is radiated to the external environment by heat radiation, heat dissipation of the device is realized, and a certain gap exists between the two adjacent heat dissipation plates 4, so that air passes through and heat dissipation is accelerated.

[0051] The heat conduction assembly is arranged on the heat dissipation plate 4 and is used for being attached to the device and conducting heat, the heat conduction assembly comprises a heat conduction rod 101, a sliding hole is formed in the heat dissipation plate 4, the heat conduction rod 101 is slidably arranged in the sliding hole, a heat conduction block 102 is fixedly connected to one end of the heat conduction rod 101 close to the device, the position of the heat conduction block 102 can be adjusted through the sliding cooperation of the heat conduction rod 101 and the heat dissipation plate 4, the end surfaces of the main plate 1, the heat dissipation plate 4 and the heat dissipation frame 2 are flush, heat dissipation of the device with an external flat surface is realized, the heat conduction block 102 is attached to the surface of the device through the sliding of the heat conduction rod 101, heat dissipation of the device with an external arc surface or irregular surface is realized, the heat conduction block 102 can be adapted to heat dissipation of devices with different shapes, heat of the device is transmitted to the heat dissipation plate 4 through the heat conduction block 102 and the heat conduction rod 101, and heat dissipation is performed through the heat dissipation plate 4, and the heat conduction block 102 has a hemispherical outer surface, so that the heat conduction block 102 can be better attached to the surface of the device.

[0052] In order to ensure the stability of the heat conduction rod 101, a limiting assembly is further arranged, the limiting assembly comprises a limiting plate 201, a limiting groove is formed in the heat dissipation plate 4, the limiting groove is communicated with the sliding hole, the limiting plate 201 is arranged in the limiting groove through a compression spring 202, the limiting plate 201 is in contact with the heat conduction rod 101, the limiting plate 201 is pressed on the surface of the heat conduction rod 101 through the compression spring 202, and a large sliding damping exists between the limiting plate 201 and the heat conduction rod 101, so that the stability of the heat conduction rod 101 is ensured, and the attachment between the heat conduction block 102 and the device is ensured, thereby stably dissipating heat of the device.

[0053] A plurality of heat dissipation fins 3 are arranged, the heat dissipation fins 3 are fixedly connected to one end of the heat dissipation plate 4 away from the device, the main plate 1, the heat dissipation frame 2, the heat conduction rod 101 and the heat dissipation fins 3 are all made of far-infrared ceramic material, the far-infrared ceramic can radiate far-infrared rays with specific wavelengths, heat dissipation is performed through heat radiation, the contact area with the external environment is further increased through the heat dissipation fins 3, and the effects of heat conduction and heat radiation are further improved.

[0054] For installing the heat dissipation device, the installation assembly is further included, the installation assembly includes a plurality of installation plates 301, the plurality of installation plates 301 are fixedly connected at equal angles outside the heat dissipation frame 2, installation holes for the rope to pass through are formed in the installation plates 301, the rope can be tied inside the corresponding installation hole, and one end of the rope is tied around the equipment inside the other installation hole or on the surface of the equipment, so that the energy-saving far infrared ceramic heat dissipation device is installed on the equipment, and the rope can be adapted to the installation of equipment of different models and sizes, and the adaptability is good.

[0055] To improve the cooling effect, the air cooling mechanism is further included, the air cooling mechanism includes a fan 401, the fan 401 is installed on the heat dissipation frame 2 through a mounting bracket 402, a rotating ring 5 is rotatably connected outside the heat dissipation frame 2, the fan 401 is fixedly connected to the rotating ring 5 through the mounting bracket 402, the fan 401 is inclinedly arranged, a battery matched with the fan 401 is installed on the fan 401, the fan 401 can be driven to rotate, air blowing of the fan 401 can be used for air cooling and cooling of the surface of the equipment, and the fan 401 is inclinedly arranged, part of the air force is directed to the tangent direction of the rotating ring 5, the rotating ring 5 can be driven to rotate in the rotating groove through the reaction force of air blowing, the fan 401 is driven to rotate around the heat dissipation frame 2, and the air blowing range is expanded, so that the air flow at the energy-saving far infrared ceramic heat dissipation device is enhanced, and the air cooling and cooling effect of the equipment is improved.

[0056] To reduce the resistance of the rotating ring 5, a rotating groove is formed in the heat dissipation frame 2, the rotating ring 5 is located inside the rotating groove, a plurality of balls 6 are rotatably connected to the top end, the bottom end and the inner wall of the rotating ring 5, the balls 6 are in contact with the inner wall of the rotating groove, the rotating resistance of the rotating ring 5 can be reduced through the rotation of the balls 6, so that the fan 401 can smoothly rotate, and the air cooling and cooling range is expanded.

[0057] To further reduce the resistance of the rotating ring 5, the lubricating assembly is further included, the lubricating assembly is used for lubricating between the rotating ring 5 and the heat dissipation frame 2, the lubricating assembly includes a sponge 501, an oil storage groove is formed in the inside of the rotating ring 5, the sponge 501 is located inside the oil storage groove, lubricating oil is adsorbed in the inside of the sponge 501, part of the balls 6 located inside the oil storage groove is in contact with the sponge 501, the lubricating oil is adsorbed in the inside of the sponge 501, the overflow in the rotating process can be reduced, the balls 6 are in contact with the sponge 501, the lubricating oil can be spread on the balls 6 and coated on the inside of the rotating groove in the rotating process of the rotating ring 5, the damping between the balls 6 and the rotating groove is further reduced, the rotating ring 5 can smoothly rotate, the resistance of the rotating ring 5 is further reduced, and an oil filling pipe is communicated with the rotating ring 5, so that the lubricating oil can be regularly added to the inside of the sponge 501, and the lubricating effect of the balls 6 is ensured.

[0058] In order to reduce the influence of dust on heat dissipation, a cleaning component is also included. The cleaning component is used to clean the heat sink 3. The cleaning component includes a driving rod 601, a cleaning rod 602 and a brush 603. The driving rod 601 is rotatably connected to the mounting bracket 402. One end of the driving rod 601 is coaxially fixedly connected to the fan blades of the fan 401. The cleaning rod 602 is rotatably connected to the mounting bracket 402. The cleaning rod 602 and the driving rod 601 are transmission-connected. The ends of the cleaning rod 602 and the driving rod 601 are fixedly connected to a driving bevel gear 604. The mounting bracket 402 is rotatably connected to a transmission bevel gear 605. The transmission bevel gear 605 is located between the two driving bevel gears 604 and meshes with the two driving bevel gears 604. The brush 603 is detachably connected to the outside of the cleaning rod 602. The outside of the cleaning rod 602 is detachably connected to a replacement bracket 606 by bolts. The brush 603 is fixedly connected to the replacement bracket 606. The brush 603 contacts the heat sink 3, and the fan 401 can drive the driving rod 601 to rotate during the rotation. Under the transmission action of the driving bevel gear 604 and the transmission bevel gear 605, the cleaning rod 602 and the brush 603 can be driven to rotate. During the rotation of the brush 603, the surface of the heat sink 3 is cleaned to prevent dust from adhering to the surface of the heat sink 3 and affecting the heat dissipation. At the same time, when the brush 603 cleans the heat sink 3, the heat sink 3 generates a reaction force on the brush 603, which assists in pushing the cleaning rod 602 and the fan 401 to rotate. The reaction force of the heat sink 3 on the brush 603 is in the same direction as the reaction force of the fan 401 blowing air, which can assist the fan 401 to rotate around the heat dissipation frame 2. Loosening the bolts can remove the replacement frame 606 from the cleaning rod 602, and the brush 603 can be replaced, or the brush 603 can be cleaned regularly to prevent dust and impurities from accumulating on the brush 603 and affecting the cleaning effect.

[0059] The working principle or use process of this energy-saving far-infrared ceramic heat sink is as follows:

[0060] Tie a rope inside the mounting hole and use the rope to fix the energy-saving far-infrared ceramic heat sink to the surface of the device that needs heat dissipation, so that the mainboard 1 and the heat dissipation frame 2 fit the surface of the device, and press the heat conducting rod 101 to make the heat conducting block 102 fit the surface of the device;

[0061] The heat conducting block 102 and the heat conducting rod 101 transfer the heat of the device to the heat sink 4 and the heat sink frame 2. The heat sink 4, the heat sink frame 2 and the heat sink 3 dissipate heat from the device through heat conduction and heat radiation. The fan 401 is turned on and blows air to the surface of the device to cool it down. At the same time, the reaction force of the blowing air pushes the fan 401 to rotate around the heat sink frame 2.

[0062] The fan 401 drives the driving rod 601 to rotate, drives the cleaning rod 602 and the brush 603 to rotate, the brush 603 sweeps the heat dissipation fin 3, and the reaction force of the heat dissipation fin 3 pushes the cleaning rod 602 and the fan 401 to rotate, expands the range of air cooling, and the lubricating oil lubricates the inside of the ball 6 and the rotating groove during the rotation of the rotating ring 5 and the fan 401.

[0063] The above only is the preferred embodiment of the present application, and does not limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims

1. An energy-saving far-infrared ceramic heat sink, characterized in that: include: Mainboard (1); A heat dissipation frame (2), the heat dissipation frame (2) being fixedly connected to the main board (1) via a plurality of heat dissipation plates (4); A heat-conducting component is provided on the heat dissipation plate (4) and is used for adhering to the device and conducting heat. The heat-conducting component comprises: A heat-conducting rod (101), wherein a sliding hole is provided on the heat dissipation plate (4), and the heat-conducting rod (101) is slidably arranged inside the sliding hole; The mainboard (1), the heat dissipation frame (2) and the heat conducting rod (101) are all made of far-infrared ceramic material; It also includes an air cooling mechanism, which includes: A fan (401), the fan (401) being mounted on the heat dissipation frame (2) via a mounting frame (402); The heat dissipation frame (2) is rotatably connected to a rotating ring (5) on the outside, and the fan (401) is fixedly connected to the rotating ring (5) via a mounting frame (402). The fan (401) is arranged in an inclined manner; part of the wind force is directed toward the tangent direction of the rotating ring (5); It also includes a heat sink (3), a plurality of heat sinks (3) are provided, and the heat sink (3) is fixedly connected to an end of the heat sink (4) away from the device; It also includes a cleaning component, which is used to clean the heat sink (3), and the cleaning component includes: A driving rod (601), the driving rod (601) being rotatably connected to the mounting frame (402), and one end of the driving rod (601) being coaxially fixedly connected to a blade of the fan (401); A cleaning rod (602), the cleaning rod (602) being rotatably connected to the mounting frame (402), and the cleaning rod (602) being transmission-connected to the driving rod (601); A brush (603) is detachably connected to the outside of the cleaning rod (602), and the brush (603) is in contact with the heat sink (3).

2. The energy-saving far-infrared ceramic heat sink according to claim 1, characterized in that: Also included is an installation component, the installation component comprising: A plurality of mounting plates (301) are provided, and the plurality of mounting plates (301) are fixedly connected to the outside of the heat dissipation frame (2) at equal angles. The mounting plates (301) are provided with mounting holes for the rope to pass through.

3. The energy-saving far-infrared ceramic heat sink according to claim 2, characterized in that: It also includes a limiting component, which includes: A limiting plate (201) is provided on the heat dissipation plate (4), the limiting groove is communicated with the sliding hole, the limiting plate (201) is arranged inside the limiting groove via a compression spring (202), and the limiting plate (201) is in contact with the heat conducting rod (101).

4. The energy-saving far-infrared ceramic heat sink according to claim 3, characterized in that: A rotation groove is provided on the heat dissipation frame (2), the rotating ring (5) is located inside the rotation groove, and a plurality of balls (6) are rotatably connected to the top end, the bottom end and the inner wall of the rotating ring (5), and the balls (6) are in contact with the inner wall of the rotation groove.

5. The energy-saving far-infrared ceramic heat sink according to claim 4, characterized in that: It also includes a lubrication component, which is used to lubricate the space between the rotating ring (5) and the heat dissipation frame (2), and the lubrication component includes: A sponge (501) is provided inside the rotating ring (5), an oil storage tank is provided inside the sponge (501), lubricating oil is adsorbed inside the sponge (501), and a portion of the ball (6) located inside the oil storage tank contacts the sponge (501).

6. The energy-saving far-infrared ceramic heat sink according to claim 5, characterized in that: One end of the heat-conducting rod (101) close to the device is fixedly connected to a heat-conducting block (102).

Citation Information

Patent Citations

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    CN214228764U

  • Ceramic chip heat dissipation device for electronic component

    CN216700837U