Internal recirculation cooling module

Abstract

Improved cooling modules and methods are configured to recirculate liquid coolant fluid within the cooling module such that the same liquid coolant fluid impacts the surface of a heat generating electronic component (or a cooling plate in thermal exchange with the heat generating electronic component) multiple times before exiting the cooling module, thereby reusing a given flow of coolant fluid multiple times. With each reuse of the coolant fluid, the flow requirement is reduced, thereby reducing the infrastructure required to achieve higher performance in direct and indirect micro-convection impingement cooling applications.

Description

TECHNICAL FIELD

[0001] The present invention relates generally to the field of liquid cooling modules for data centers, servers, power inverters, and other liquid cooled modular computing components, and more particularly to micro-convective impinging jet impingement liquid cooling devices and methods. BACKGROUND

[0002] Cooling performance of direct chip single phase liquid cooling (DLC) devices is typically measured in terms of heat transfer coefficient. Impingement cooling modules produce very high local heat transfer coefficients. Performance of cooling modules utilizing impingement cooling is affected by both flow rate and pressure drop. Impingement cooling performs best when the flow rate of the cooling module is 2 to 4 times higher than that of more mature cooling technologies such as microchannels. Even though the flow consumption is relatively high, there are inherent advantages of employing impingement cooling modules such as more uniform processor temperature distribution, no thermal impedance of heat and other advantages.

[0003] However, existing cooling infrastructure in a given application area can not be able to support a 2 to 4 times increase in flow rate. Therefore, jet impingement cooling modules can not be able to achieve peak performance in these environments. Therefore, jet impingement modules would benefit from the ability to reduce flow requirements to ensure more desirable impingement performance even at lower flow rates. SUMMARY

[0004] Embodiments of the present invention provide improved cooling modules and cooling methods for cooling heat generating electronic components attached to printed circuit boards in servers and other data processing equipment. The improved cooling modules and cooling methods are configured to recirculate liquid coolant fluid within the cooling module such that the same liquid coolant fluid impinges the surface of the heat generating electronic components (or cooling plates in thermal communication with the heat generating electronic components) multiple times before exiting the cooling module, thereby reusing the coolant fluid multiple times for a given flow rate. Each time the coolant fluid is reused, the flow rate requirement is reduced. For example, a single recirculation of the coolant fluid in a cooling module constructed and operative in accordance with the devices and techniques described herein can typically reduce the flow rate requirement of the cooling module by approximately 50% without a significant reduction in cooling performance. Triple recirculation of the coolant fluid within the cooling module can typically reduce the flow rate requirement by 67%, and so on. Advantageously, the internal recirculation implemented in accordance with the present invention does not increase the number of external seals required, limits pressure losses in the internal manifold components, and allows for prioritized cooling areas on the chipsets to be addressed first by proper segmentation of the impingement areas within the cooling module.

[0005] In general, embodiments of the present invention provide a cooling module with reduced flow requirements by implementing internal recirculation of the liquid coolant fluid within the cooling module such that the liquid coolant fluid impacts the surface to be cooled multiple times before the liquid coolant fluid exits the cooling module. The internal recirculation allows the exhaust fluid from a given portion within the cooling module to be delivered to the inlet of a second portion without exiting the cooling module housing. This technique of efficiently collecting and re-delivering coolant fluid that has already impacted the cooling surface allows a greater portion of the liquid coolant fluid to remain within the primary outer sealed boundary of the cooling module for a longer period of time while its cooling potential is still effectively utilized. Thus, the advantages of using embodiments of the present invention include, but are not limited to:

[0006] 1) allows for multiple re-use of the coolant fluid, thereby significantly reducing flow requirements.

[0007] 2) efficiently delivers the coolant fluid to minimize manifold pressure drop.

[0008] 3) avoids additional external seal failure sites and additional pressure drop associated with externally recirculating coolant fluid.

[0009] The coolant fluid passing through a cooling module constructed and operative in accordance with embodiments of the present invention is internally recirculated multiple times after impingement, enabling it to be "re-used" multiple times to cool multiple portions of the cooling surface. The coolant fluid is also accelerated onto the surface to be cooled by the use of a micro-convective nozzle array. However, rather than being exhausted from the cooling module after a single impingement, the coolant fluid is recaptured and re-accelerated by additional micro-convective nozzle arrays in one or more additional stages. By connecting multiple different portions of micro-convective nozzle arrays in series, flow can be reduced. In some embodiments, multiple different portions of nozzle arrays can be connected in series and in parallel to one another.

[0010] The devices and techniques disclosed herein can be implemented in both direct and indirect cooling modules. Direct cooling modules apply coolant directly to the surface of a heat source to effect heat transfer. Indirect cooling modules apply coolant to a plate that is part of the cooling module, where the plate is in thermal contact with a heat source to effect heat transfer.

[0011] In one embodiment, the present invention provides a cooling module, wherein the cooling module comprises: a jet plate; a housing; a ceiling between the jet plate and the housing; a base plate; a fastening system; and the fastening system for fastening the cooling module to a circuit board (or server) containing heat-generating electronic components. The jet plate has: an upper surface; a lower surface; a first section comprising a first array of micro-jet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; and a second section comprising a second array of micro-jet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate. The ceiling disposed between the jet plate and the housing comprises: a first ceiling mounting border extending from the ceiling to the upper surface of the jet plate; and a second ceiling mounting border extending from the ceiling to the upper surface of the jet plate. The base plate comprises: a cooling surface; a first cooling surface mounting border extending from the cooling surface to the lower surface of the jet plate; and a second cooling surface mounting border extending from the cooling surface to the lower surface of the jet plate.

[0012] The jet plate, the ceiling, the cooling surface of the base plate, the first ceiling mounting border, the second ceiling mounting border, the first cooling surface mounting border, and the second cooling surface mounting border are all arranged to define: a first inlet chamber between the ceiling and the first array of micro-jet nozzles; a second inlet chamber between the ceiling and the second array of micro-jet nozzles; a first impingement volume between the first array of micro-jet nozzles and the cooling surface; a second impingement volume between the second array of micro-jet nozzles and the cooling surface; and a first couch passage fluidly communicating the first impingement volume with the second inlet chamber.

[0013] The fastening system, which can include screws, pins, or tensioning plates, for example, attaches the cooling module to a circuit board having one or more heat-generating electronic components attached thereto. In one embodiment, the fastening system attaches the cooling module to the circuit board such that the cooling surface of the base plate will be in direct thermal communication with the one or more heat-generating electronic components on the circuit board. In this configuration, the cooling surface of the base plate is able to absorb heat generated by the heat-generating electronic components when the circuit board is in an operational state.

[0014] The cooling module also includes an inlet fitting attached to the housing that is configured to allow pressurized coolant fluid delivered from an external source, such as an external pump or a central distribution unit (CDU), to enter the cooling module. An inlet flow channel inside the cooling module carries the pressurized coolant fluid from the inlet fitting to a first inlet chamber. When the pressurized coolant fluid enters the first inlet chamber, a first array of micro-jet nozzles in a first section of the jet plate is configured to receive the pressurized coolant fluid from the first inlet chamber and accelerate the pressurized coolant fluid while directing the accelerated pressurized coolant fluid to flow at high velocity into a first impingement volume underneath the jet plate to impinge a first portion of the cooling surface of the bottom plate, thereby removing heat that has been absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components.

[0015] At this point, the benchway is configured to carry the portion of the pressurized coolant fluid that impinged the first portion of the cooling surface out of the first impingement volume and into a second inlet chamber. Then, a second array of micro-jet nozzles in the jet plate introduces the pressurized coolant fluid from the second inlet chamber, accelerates the pressurized coolant fluid, and directs the accelerated pressurized coolant fluid to flow at high velocity into a second impingement volume to impinge a second portion of the cooling surface of the bottom plate, thereby removing heat that has been absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components.

[0016] In preferred embodiments, the cooling module of the present invention also includes one or more effluent collection channels to capture the portion of the pressurized coolant fluid in the first and second impingement volumes and to deliver the captured pressurized coolant fluid to an outlet fitting attached to the housing for discharge from the cooling module.

[0017] Note that the ceiling can or can not be manufactured as an integral part of the housing. In some embodiments, the cooling module of the present invention can include an embedded plate disposed between the housing and the jet plate, and the ceiling is integrated into the embedded plate rather than the housing.

[0018] In another embodiment, the bottom plate of the cooling module has an opening on the bottom side rather than the cooling surface, which allows the coolant fluid accelerated by the micro-jet array in the jet plate to directly impinge the surface of the heat-generating electronic components multiple times, rather than impinging the cooling surface that is in thermal contact with the heat-generating electronic components. After the first impingement, the cooling fluid is then carried by the benchway to a downstream inlet chamber to be accelerated and directed by a second (third or fourth) array of micro-jet nozzles in the jet plate for a second (third or fourth) direct impingement on other portions of the heat-generating electronic components.

[0019] In yet another embodiment, a method for cooling one or more heat-generating electronic components attached to a circuit board is provided. Step 1 of the method is to provide a cooling module comprising: a jet plate; a housing; a ceiling disposed between the jet plate and the housing; a floor having a cooling surface; and a fastening system for fastening the cooling module to the circuit board. For this step, the jet plate comprises a first section comprising a first array of micro-jet nozzles extending through the jet plate and a second section comprising a second array of micro-jet nozzles extending through the jet plate. The jet plate, the ceiling, the cooling surface of the floor, a first ceiling mounting border, a second ceiling mounting border, a first cooling surface mounting border, and a second cooling surface mounting border are all arranged to define: a first inlet chamber between the ceiling and the first array of micro-jet nozzles; a second inlet chamber between the ceiling and the second array of micro-jet nozzles; a first impingement volume between the first array of micro-jet nozzles and the cooling surface; a second impingement volume between the second array of micro-jet nozzles and the cooling surface; and a first bench passage in fluid communication with the second inlet chamber and the first impingement volume.

[0020] Step 2 is to attach the cooling module to the circuit board using the fastening system such that the cooling surface of the floor will be in thermal communication with the one or more heat-generating electronic components on the circuit board and absorb heat generated by the one or more heat-generating electronic components when the circuit board is in an operational state. Step 3 of the method is to connect an external source for pressurized coolant fluid to an inlet port on the housing of the cooling module. Step 4 is to pass the pressurized coolant fluid received at the inlet port into the first inlet chamber of the jet plate.

[0021] In step 5, a first array of micro-jet nozzles in a first section of the jet plate receives pressurized coolant fluid from the first inlet chamber, accelerates the pressurized cooling fluid, and directs the accelerated pressurized cooling fluid to flow at high velocity into a first impingement volume to impinge on a first portion of the cooling surface of the base plate, thereby removing heat that has been absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components. Typically, but not necessarily, the coolant exits via the boundaries of the impingement volume. In step 6, a bench passage in the cooling module passes at least a portion of the pressurized coolant fluid used to impinge on the first portion of the cooling surface from the first impingement volume to a second inlet chamber. And finally, in step 6, a second array of micro-jet nozzles in the jet plate receives pressurized coolant fluid from the second inlet chamber, accelerates the pressurized coolant fluid, and then directs the accelerated pressurized coolant fluid to flow at high velocity into a second impingement volume to impinge on a second portion of the cooling surface of the base plate without allowing the pressurized coolant fluid to exit the cooling module prior to entering the second inlet chamber, thereby removing heat that has been absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate preferred embodiments of the present application and, together with the description, serve to explain the principles of the present application. In the drawings:

[0023] FIG. 1 shows a prior art cooling module in cross-section. Cryogenic inlet coolant enters the entire jet plate and is accelerated through the jet plate towards the surface to be cooled (direct module) or the base plate (indirect module). The coolant, which has increased in temperature by heat transfer, is collected and flows to the outlet.

[0024] FIGS. 2A, 2B, and 2C show an example of an internal recirculation cooling module according to one embodiment of the present application in cross-section. In this example, the cooling module has four stages.

[0025] Figure 3 The difference between the flow path of a conventional prior art cooling module (A) and a cooling module equipped with internal recirculation according to an embodiment of the present application (B) is shown.

[0026] Figure 4 It is shown that the segmentation of the sections of the jet plate can be arbitrary within a given cooling module.

[0027] Figure 5A schematic view of the surface segmentation is shown, where the initial central impact zone is connected to two separate subsequent jet plate sections, both of which deliver their outflow into a common annular collection channel for flow to the outlet.

[0028] Figure 6A and 6B An isometric cutaway view of an indirect cooling module 600 with internal recirculation, constructed according to one embodiment of the present application (Example A), is shown.

[0029] Figure 7 The same cooling module (Example A) is shown with the housing removed to better identify the bench channel between the impact volume of each jet plate section and the inlet side of the downstream section. For this example, the bench channel repeats at both ends of the cooling module (A and B).

[0030] Figure 8 An exploded view of another example of a cooling module (Example B) constructed according to another embodiment of the present application is shown, with the housing removed to better illustrate some of the internal components.

[0031] Figure 9 A partial cutaway view of the cooling module 900 (Example B) shown in the exploded view of Figure 8 is shown.

[0032] Figure 10 A cooling module assembly (Example C) constructed according to the present application as described herein is shown.

[0033] Figure 11 An exploded view of Example C of an embodiment of the present application is shown. The base plate contains a number of channel features to help form the bench channel with the jet plate and housing.

[0034] Figure 12 A partial top view of the example cooling module assembly (Example C) shown in Figure 10 is shown.

[0035] Figure 13 The flow path in the example cooling module shown in Figures 10 to 12 is further illustrated.

[0036] Figure 14 An exploded view of another cooling module (Example D) constructed according to one embodiment of the present application is shown. The cooling module shown is mounted directly to a heat source and is therefore considered a direct (contact) cooling module.

[0037] Figure 15 The flow arrangement in the direct contact cooling module (Example D) shown in Figure 14 is shown.

[0038] Figure 16A and 16B A partial cross-sectional view of a direct contact cooling module (Example D) is shown in Figure 14 A partial cross-sectional view of a direct contact cooling module (Example D) is shown in DETAILED DESCRIPTION

[0039] Preferred embodiments of the present application will now be described in detail with reference to the drawings, wherein examples of the same are shown. Note that the following drawings and examples are not intended to limit the scope of the present application or its embodiments or equivalents. For this detailed discussion, the terms "portion" and "segment" can be used interchangeably and thus can be considered to have the same meaning unless otherwise specifically noted.

[0040] SUMMARY

[0041] The present application utilizes the geometry of the jet plate, ceiling and floor to divide the internal cavity of the cooling module into several portions such that the flow passes through at least two portions in series, where the effluent from one or more portions is transferred to the inlet of a subsequent portion within the cooling module. By having the same coolant fluid make multiple contacts with the cooling surface (either the floor cooling surface or the heat source), the flow consumption of the cooling module is significantly reduced. By not allowing the coolant fluid to exit the external seal boundary of the cooling module for its re-cooling and recirculation, the number of external seals required is reduced and the overall pressure drop of the recirculation cooling module is reduced due to the more compact flow path.

[0042] There are many possibilities for internal manifold arrangements within the framework of both direct and indirect cooling modules to implement the present application. The flow passage that collects the effluent from one portion of the cold plate and transfers it to the inlet side of the next portion is referred to as a bench passage. The bench passage serves to isolate the effluent area of the starting jet plate portion from the effluent of any downstream jet plate portion. The bench passage can also be sealed to prevent coolant fluid flow through the next jet plate portion. The bench passage is formed by a combination of surfaces associated with other internal elements of the cooling module. Thus, the bench passage can be formed, for example, by the walls and structures of:

[0043] A) Jet plate (possibly with cutouts), ceiling and floor.

[0044] B) Jet plate (possibly with cutouts), embedded plate and floor.

[0045] C) Jet plate (possibly with cutouts), housing and embedded plate.

[0046] D) Jet plate (possibly with cutouts) and embedded plate.

[0047] E) Jet plate (possibly with cutouts), boundary extending from ceiling, embedded plate and floor.

[0048] Each segment of the jet plate includes an array of micro-jet nozzles configured for introducing a flow of coolant fluid from an adjacent inlet chamber, then accelerating the coolant fluid to flow at high velocity into and through an associated impingement volume beneath the jet plate, such that the accelerated coolant fluid impinges on a portion of a cooling surface, which can include a cooling surface on a floor of the cooling module or a cooling surface on a heat source, and thereby facilitates heat transfer from the heat source to the coolant fluid.

[0049] If an insert plate is present, the insert plate serves to help direct flow from the outlet of one segment to the inlet of the next segment. Modern manufacturing techniques can construct the jet plate, ceiling, or both as an integral part of the insert plate. Sealing the joints between the jet plate and the housing, insert plate, ceiling, and / or floor using shims, adhesives, or a welding process can improve cooling performance.

[0050] The fastening system can be directly engaged in the housing, i.e., the housing has mounting holes for connecting the cooling module to a heat source. The fastening system can also use an additional structure, sometimes referred to as a tension plate, that transfers the mounting force of the fasteners from the plate on which the heat-emitting components are mounted to the housing.

[0051] Additional geometry (e.g., walls or boundaries) can be added to a direct cooling module, an indirect cooling module, or both, to help form bench channels beneath the jet plate, thereby helping to ensure that flow does not short circuit between various effluent portions. The additional geometry is intended to simplify the geometry required of the floor, thereby reducing manufacturing and assembly costs. Optional assembly of the cooling module and implementation of the present invention in a cooling module can be achieved by constructing the housing in two parts, fastening, adhering, or welding the two parts together.

[0052] Furthermore, it can be beneficial to manufacture multiple segments of the jet plate as separate components and to retain those separate components within an assembly rather than using one continuous jet plate.

[0053] Turning to the drawings, FIG. 1 illustrates a prior art cooling module 100 in a cross-sectional view. As shown in FIG. 1, the prior art cooling module 100 generally includes a housing 102, an inlet 104, an outlet 106, and a jet plate 108. The housing 102 is attached to a surface 110 to be cooled. A cryogenic coolant enters the inlet 104, enters throughout the jet plate 108, and is accelerated through the jet plate 108 toward either a surface to be cooled 110 (direct module) or a floor (indirect module). The temperature of the coolant fluid is raised due to heat transfer from contact with the cooling surface 110. The coolant fluid is collected and flows to the outlet 106 to be expelled from the cooling module 100.

[0054] Figures 2A, 2B, and 2C illustrate, in cross-section, an example of an internal recirculation cooling module 200, according to one embodiment of the present application. In this example, the cooling module 200 has four stages, meaning that the same coolant fluid is accelerated through four separate sections 210a-210d of the fluidic sheet four separate times, for different regions on the surface 212 to be cooled. The surface 212 to be cooled can include a base plate in thermal contact with the surface of one or more heat-generating electronic devices, where the base plate is a component of the cooling module 200. In this configuration, the cooling module 200 is referred to as an "indirect" cooling module. Alternatively, the surface 212 to be cooled can include the heat-generating electronic devices themselves, in which case the cooling module 200 can be referred to as a "direct" cooling module.

[0055] As best shown in Figure 2A, the cooling module 200 includes an inlet port 202 connected to the housing 206, an outlet port 208 connected to the housing 206, and a segmented fluidic sheet 210a-210d. The cooling module 200 also includes a ceiling 216 located on the inside of the top wall of the housing 206. As best shown in Figure 2B, the ceiling 216 has a set of ceiling mounting boundaries 218a-218d (i.e., walls) that extend downward from the ceiling 216 to the upper surface of each different section 210a-210d of the fluidic sheet. If the cooling surface is a base plate (as in the indirect cooling version of the cooling module), the cooling surface 212 has a set of cooling surface mounting boundaries 220a-220d that extend from the base plate 212 up to the lower surface 222 of the fluidic sheet 210a-210d.

[0056] The shapes, arrangements, and relative positions of the fluidic sheet sections 210a-210d, the ceiling 216, the ceiling mounting boundaries 218a-218c, the cooling surface 212, and the cooling surface mounting boundaries 220a-220c together serve to define four inlet chambers 222a-222d located above the fluidic sheet sections 210a-210d, four impingement volumes 224a-224d located below the fluidic sheet sections 210a-210d, and three bench channels 214a-214c. See Figure 2C. The bench channels 214a-214c are configured to place the outlets of the impingement volumes 224a-224c in fluid communication with the inlets of the inlet chambers 222b-222d in the cooling module 200, such that cooling fluid that has entered the impingement volumes 224a-224c to impinge on different portions of the cooling surface 212 will next be delivered to the inlet chambers 222b-222d, where the coolant fluid will be introduced into and accelerated by subsequent micro-jet arrays in the fluidic sheet sections 210b-210d.

[0057] Figure 3 The difference between the flow path (A) for a conventional prior art cooling module and the flow path (B) for a cooling module equipped with internal recirculation according to an embodiment of the present application is shown. The bench pass connects the impingement volume beneath each segment of the jet plate to the inlet chamber of the subsequent portion of the jet plate. While it can be more efficient to form the bench pass by controlling the shape, arrangement and relative position of the boundaries extending from the ceiling and the cooling surface in the cooling module, it will be appreciated that in alternative embodiments of the present application the bench pass can comprise a physical tube or conduit (independent of the boundaries extending from the ceiling and the cooling surface).

[0058] Figure 4 The assignment of segments of the jet plate within a given cooling module can be arbitrary as shown here. Here, a central inlet connects from a central jet plate portion to a subsequent annular segment, which in turn connects to an annular outlet collection pass, and finally to an outlet.

[0059] Figure 5 A schematic of surface assignment is shown in which an initial central impingement zone connects to two separate subsequent jet plate portions, which in turn both deliver their effluent into a common annular collection pass to deliver flow to an outlet. This schematic demonstrates that not all jet plate segments need to be connected in series.

[0060] Figure 6A and 6B An isometric cutaway view of an indirect cooling module 600 with internal recirculation constructed according to one embodiment of the present application (Example A) is shown. The cooling module 600 has a housing 602, a jet plate 605, a floor 610, an inlet 615, and an outlet 620. The jet plate 605 is divided into three separate segments 605a-605c. The three segments 605a-605c are isolated from one another by two ceiling mounting boundaries 625a and 625b, which extend from a ceiling 630 on the interior side top wall of the housing 602. Suitably, seals 635a and 635b are located where the ceiling mounting boundaries 625a and 625b engage the jet plate 605 to prevent coolant fluid from flowing directly from one segment into another without flowing through the bench pass formed by the shape, arrangement and relative position of the jet plate or 605, the floor 610, the ceiling 630, and the ceiling mounting boundaries 625a and 625b (as best shown in FIGS. 6A-6C and discussed in detail below). An effluent collection pass 640 ensures that coolant fluid that has passed through the array of micro-jet nozzles in the jet plate segments 605a, 605b, and 605c is collected into the bench pass and / or the outlet of the cooling module 600. Figure 7 and Figure 12 as best shown in FIGS. 6A-6C and discussed in detail below). An effluent collection pass 640 ensures that coolant fluid that has passed through the array of micro-jet nozzles in the jet plate segments 605a, 605b, and 605c is collected into the bench pass and / or the outlet of the cooling module 600.

[0061] Figure 7 The same cooling module 600 shown in FIG. 6 (Example A) is shown, but with the housing 602 removed to show and identify the benchway passages 705a and 705b that are in fluid communication to the impingement volumes below each microfluidic nozzle array 715a, 715b, and 715c in each of the three fluidic plate segments and to the inlet chambers associated with the microfluidic nozzle arrays in the downstream fluidic plate segments. For this example, there are two benchway passages on each side (A-side and B-side) of each microfluidic array in the fluidic plate segments of the cooling module. As Figure 7 shown, the two benchway passages 705a (A-side and B-side) are configured to capture and direct coolant fluid that has undergone a first impingement by operation through the first microfluidic nozzle array 715a in the first segment of the fluidic plate. Figure 7 The two benchway passages 705b (A-side and B-side) are configured to capture and direct coolant fluid that has undergone a second impingement by operation through the second microfluidic nozzle array 715b in the second segment of the fluidic plate. And the two effluent passages 740 (A-side and B-side) capture and direct coolant fluid that has undergone a third impingement by operation through the third microfluidic nozzle array 715c in the third segment of the fluidic plate.

[0062] The benchway passage 705a directs coolant fluid from the impingement volume (not shown in Figure 7 but shown in FIG. 2) located below the microfluidic nozzle array 715a into the inlet chamber (also not shown in Figure 7 but shown in FIG. 2) located above the microfluidic nozzle array 715b. The benchway passage 705b passes coolant fluid from the impingement volume located below the microfluidic nozzle array 715b to the inlet chamber located above the microfluidic nozzle array 715c. And the effluent collection passage 740 is configured to pass coolant fluid from the impingement volume located below the microfluidic nozzle array 715c to an outlet in the cooling module 700.

[0063] Figure 8 An exploded view of another example (Example B) of a cooling module 800 constructed in accordance with another embodiment of the present application is shown, with the housing removed to better show some of the internal components. In this embodiment, an insert plate 805 and a gasket 810 are nested between the fluidic plate 815 and the housing (not shown). The fluidic plate 815 is divided into three segments, each containing a microfluidic nozzle array 817. After the coolant fluid has passed through the first and second microfluidic nozzle arrays to impinge on the cooling surface 825 of the base plate 820, the coolant fluid will be located in the impingement volume below the plane of the segmented fluidic plate 815. The benchway passages (not shown in Figure 7 andFigure 12 The bench passage is used to move coolant fluid from the impingement volume, located below the plane of the segmented jet plate 815, and into the inlet plenum, located above the plane of the segmented jet plate 815. Thus, as the bench passage moves coolant fluid from the impingement volume to the downstream inlet plenum, it is necessary to configure the bench passage to "lift" the coolant fluid from the level of the plane below the segmented jet plate 815 to the level of the plane above the segmented jet plate 815. Thus, at least some portion of the bench passage will exist below the plane of the segmented jet plate 815, while other portions of the bench passage will exist above the plane of the segmented jet plate 815.

[0064] The formation of the bench passage in the cooling module 800 can be facilitated by the embedding and use of an embedding plate 805, which includes a ceiling 807 on its bottom side, the ceiling 807 having ceiling mounting boundaries (and / or walls or supports) that extend downward. These ceiling mounting boundaries, in combination with the structure of the upper surface of the segmented jet plate 815 and the ceiling 807, can be conveniently used to form a portion of the bench passage that exists above the plane of the segmented jet plate 815. In some embodiments, the ceiling 807 is an integral component of the embedding plate 805. When the embedding plate is not used, the features of the ceiling 807 can be formed on the inner top wall of the housing. In other embodiments, the ceiling 807 can comprise separately manufactured components that can be embedded below the embedding plate 805 or the inner top wall of the housing. The bottom plate 820 includes a cooling surface 825 having cooling surface mounting boundaries 830 that extend upward, the cooling surface mounting boundaries being suitably shaped and arranged to cooperate with the structure of the lower surface of the segmented jet plate 815 and the cooling surface 825 to form a portion of the bench passage that exists below the plane of the segmented jet plate 815.

[0065] The gasket 810 prevents coolant fluid in one segment of the segmented jet plate 815 from flowing directly into another segment of the segmented jet plate 815 without passing through the bench passage. The cutout 840 in the segmented jet plate 815 and the corresponding portion of the gasket 810 are part of the bench passage that allows coolant to pass through the plane of the segmented jet plate 815 as it is lifted from the level below the plane of the segmented jet plate 815 to the level above the plane of the segmented jet plate 815.

[0066] Figure 9 It is shown Figure 8The exploded view shows a partial cross-sectional view of the cooling module 900 (Example B). In this case, an inlet flow channel 905 cut into the top of the insert plate 910 conveys cooling fluid from an inlet port on the housing (not shown) to approximately the center 915 of the cooling module 900. A first bench passage is formed by a combination of structures associated with the base plate 930, the segmented jet plate 925, and the boundaries in the insert plate 910. This first bench passage directs the coolant fluid back toward the inlet side of the segmented jet plate 920 before the coolant fluid flows through the nozzle array in the second segment 925 of the jet plate. The second bench passage 935 is also formed by the boundaries of the base plate 930, the jet plate 925, and the insert plate 910. The second bench passage 935 guides the coolant fluid from the second section of the segmented jet plate 925 to the third section, where the coolant fluid is collected in the third section after impact in the third section into the outflow collection passage 940 within the insert plate 910. It can then flow to the outlet port (not shown) via several external flow channels 950 located between the bottom side of the top wall of the housing and the top side of the insert plate 910.

[0067] Figure 10 A cooling module assembly 1000 (Example C) is shown, in which a cooling module 1005 with internal recirculation constructed according to an embodiment of the invention is used. In this example, the base plate 1010 of the cooling module 1005 is attached and secured to the surface 1015 to be cooled (in this example, the processor) using a fastening system. In this example, the fastening system includes a tension plate 1020 that transmits compressive forces from the processor mounting bracket 1025 (in this case, a support plate) and fasteners 1030 to the cooling module housing 1040. An inlet port 1050 attached to the housing 1040 is configured to allow pressurized coolant fluid generated by an external source to be introduced into the cooling module 1005, and an outlet port 1055 attached to the housing 1040 is configured to discharge coolant fluid from the cooling module 1005. The base plate 1010 of the cooling module is in thermal communication with the surface 1015 to be cooled using a thermal interface material (not shown).

[0068] Figure 11 It shows Figure 10 The exploded view of the cooling module assembly is shown. The cooling surface 1103 of the base plate 1105 includes a number of cooling surface mounting boundaries 1110 (walls, supports, or channel features), which, together with the structures and cutouts built into the jet plate 1015, the gasket 1020, and the housing 1025, help to form a properly configured bench passage to move cooling fluid from one section of the jet plate 1015 to the next.

[0069] Figure 12 It shows Figure 10A partial top view of the exemplary cooling module assembly shown. For clarity, the housing, inlet port, and outlet port have been removed from the image. Figure 12 As shown, the inlet flow of coolant fluid is divided between two parallel sections (section 1A and section 1B) of the jet plate, each section comprising an array of microjet nozzles containing multiple microjet nozzles. Exhaust from these parallel sections is collected together through multiple bench passages to direct coolant to section 2. The bench passages of section 2 deliver the flow to a top volume that is in fluid communication with the inlet chamber in section 3. Section 3 then has bench passages that connect section 3 to a fourth and final section. Example C illustrates the ability to combine the parallel sections (1A and 1B) to form further tandem sections (2, 3, 4). Figure 12 These sections are also shown to be able to be used to target specific areas of the processor chip to customize heat transfer in each area.

[0070] Figure 13 Further clarification in Figures 10-12 The flow path in the exemplary cooling module shown focuses on the formation of the bench passage from sections 1A and 1B to section 2. Note that base plate channel features, typically formed of copper, can be used to aid in the formation of the bench passage. These shape-locking features on the base plate (protruding from the copper) can also be implemented using separate components. Figure 13 The arrows in the diagram indicate the flow path taken by the coolant fluid as it travels through the bench passage, which connects the impact volume of section 1 to the inlet chamber of section 2.

[0071] Figure 14 An exploded view of another cooling module (Example D) constructed according to an embodiment of the present invention is shown. The cooling module shown is directly mounted to the heat source and is therefore considered a direct cooling module. In this example, there are no gaskets in the internal passageways. In this example, the jet plate comprises three separate sections, which are manufactured as three separate physical elements.

[0072] Figure 15 It shows Figure 14 The flow arrangement of the direct contact cooling module (Example D) is shown, and it is illustrated how a single jet plate section connected to the inlet is divided into two parallel sections (section 2A and section 2B), and then the effluent from these sections is brought together and delivered to the outlet (not shown).

[0073] Figure 16A and 16B It shows Figure 14Figure 16 is a partial cutaway view of the direct contact cooling module (Example D) shown in Figure 15. This cutaway view shows the flow path from Part 1 to Part 2A in more detail. The benchway in this example is formed by the jet plate, the lower half of the housing, and the surface being cooled. Figure 16 has an inset that provides a close-up of the flow path from Part 1 to Part 2A through the benchway.

[0074] The preferred embodiments described above are intended to be illustrative of the principles of the application, but not limiting thereof. Various other embodiments, modifications and equivalents thereof which, upon reading the above disclosure or otherwise learning the invention taught herein, can occur to persons skilled in the art are intended to be within the scope of the application. Such alterations, modifications and equivalents are intended to be part of this application and the appended claims.

Claims

1. A cooling module comprising: (a) a jet plate comprising: an upper surface; a lower surface; a first section comprising a first array of micro-jet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; and a second section comprising a second array of micro-jet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; and (b) a housing; (c) a ceiling disposed between the jet plate and the housing, the ceiling comprising: a first ceiling mounting border extending from the ceiling to the upper surface of the jet plate; and a second ceiling mounting border extending from the ceiling to the upper surface of the jet plate; (d) a floor comprising: a cooling surface; a first cooling surface mounting border extending from the cooling surface to the lower surface of the jet plate; and a second cooling surface mounting border extending from the cooling surface to the lower surface of the jet plate; (e) wherein the jet plate, the ceiling, the cooling surface of the floor, the first ceiling mounting border, the second ceiling mounting border, the first cooling surface mounting border, and the second cooling surface mounting border are all arranged to define: a first inlet chamber between the ceiling and the first array of micro-jet nozzles; a second inlet chamber between the ceiling and the second array of micro-jet nozzles; a first impingement volume between the first array of micro-jet nozzles and the cooling surface; a second impingement volume between the second array of micro-jet nozzles and the cooling surface; and a first benchway in fluid communication with the first impingement volume and the second inlet chamber; (f) a fastening system for attaching the cooling module to a circuit board having one or more heat-generating electronic components attached thereto, such that the cooling surface of the floor will be in thermal communication with the one or more heat-generating electronic components on the circuit board and absorb heat generated by the one or more heat-generating electronic components when the circuit board is in an operational state; and (g) an inlet fitting attached to the housing and configured to allow pressurized coolant fluid delivered from an external source to enter the cooling module; and (h) an inlet flow path for carrying pressurized liquid coolant fluid from the inlet fitting to the first inlet chamber; (i) wherein: (i) the first array of micro-jet nozzles in the first section of the jet plate is configured to receive pressurized coolant fluid from the first inlet chamber, accelerate the pressurized coolant fluid, and flow the accelerated pressurized coolant fluid at high velocity into the first impingement volume to impinge on a first portion of the cooling surface of the bottom plate, thereby removing heat that has been absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components; (ii) the benchway is configured to carry a portion of the pressurized coolant fluid of the first impingement volume and into the second inlet chamber; and (iii) the second array of micro-jet nozzles in the jet plate is configured to receive pressurized coolant fluid from the second inlet chamber, accelerate the pressurized coolant fluid, and flow the accelerated pressurized coolant fluid at high velocity into the second impingement volume to impinge on a second portion of the cooling surface of the bottom plate, thereby removing heat that has been absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components.

2. The cooling module of claim 1, further comprising: (a) an outlet fitting connected to the housing and configured to discharge the pressurized coolant fluid from the cooling module; (b) a first effluent collection channel configured to capture a portion of the pressurized coolant fluid from the first impingement volume and to convey the captured pressurized coolant fluid to the outlet fitting for discharge from the cooling module.

3. The cooling module of claim 1, wherein, the ceiling is fabricated as an integral component of the housing.

4. The cooling module of claim 1, wherein, the ceiling is not fabricated as an integral component of the housing.

5. The cooling module of claim 4, further comprising: (a) an embedded plate disposed between the housing and the jet plate; (b) wherein the ceiling is fabricated as an integral component of the embedded plate.

6. The cooling module of claim 1, further comprising a sealing gasket that prevents pressurized coolant fluid entering the first section of the jet plate from directly entering the second section of the jet plate without flowing through the first benchway.

7. The cooling module of claim 1, wherein: (a) the second section of the jet plate encircles and encompasses the first section of the jet plate; (b) the second ceiling mounting border of the ceiling encircles and encompasses the first ceiling mounting border; and (c) the second cooling surface mounting border of the bottom plate encircles and encompasses the first cooling surface mounting border.

8. The cooling module of claim 1, wherein: (a) the jet plate further comprises a third section comprising a third array of micro-jet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; (b) the ceiling further comprises a third ceiling mounting border extending from the ceiling to the upper surface of the jet plate; and (c) the bottom deck further comprises a third cooling surface mounting border extending from the cooling surface to the lower surface of the fluidic plate; (d) wherein the fluidic plate, the ceiling, the cooling surface of the bottom deck, the first ceiling mounting border, the second ceiling mounting border, the third ceiling mounting border, the first cooling surface mounting border, the second cooling surface mounting border, and the third cooling surface mounting border are all arranged to define: a third inlet chamber between the ceiling and the third array of microfluidic nozzles; a third impingement volume between the cooling surface and the third array of microfluidic nozzles; and a second benchway fluidly communicating the first or second impingement volume or both with the third inlet chamber; and (e) the third array of microfluidic nozzles in the fluidic plate is configured to receive pressurized coolant fluid from the third inlet chamber, accelerate the pressurized coolant fluid, and direct accelerated pressurized coolant fluid to flow at high velocity into the third impingement volume to impinge a third portion of the cooling surface of the bottom deck, thereby removing heat that has been absorbed by the third portion of the cooling surface from the one or more heat-generating electronic components.

9. The cooling module of claim 8, further comprising: (a) an outlet fitting connected to the housing and configured to discharge pressurized coolant fluid from the cooling module; (b) a first effluent collection channel configured to capture partial pressurized coolant fluid from the third impingement volume and convey the captured pressurized coolant fluid to the outlet fitting for discharge from the cooling module.

10. The cooling module of claim 8, further comprising a sealing gasket that prevents pressurized coolant fluid entering the first section of the fluidic plate from directly entering the second section of the fluidic plate without flowing through the second benchway.

11. The cooling module of claim 10, wherein, The sealing gasket prevents pressurized coolant fluid entering the second section of the fluidic plate from directly flowing into the third section of the fluidic plate without flowing through the second benchway.

12. The cooling module of claim 8, wherein: (a) the third section of the fluidic plate encircles and encompasses the first section of the fluidic plate and the second section of the fluidic plate; (b) the third ceiling mounting border of the ceiling encircles and encompasses the first ceiling mounting border and the second ceiling mounting border; and (c) the third cooling surface mounting border of the bottom deck encircles and encompasses the first cooling surface mounting border and the second cooling surface mounting border.

13. The cooling module of claim 8, wherein, The ceiling is manufactured as an integral component of the housing.

14. The cooling module of claim 8, wherein, The ceiling is not manufactured as an integral component of the housing.

15. The cooling module of claim 14, further comprising: (a) an insert plate arranged between the housing and the fluidic plate; (b) wherein the ceiling is manufactured as an integral part of the insert plate.

16. The cooling module of claim 1, further comprising: (a) a second fluidic plate comprising another upper surface, another lower surface, and a third section comprising a third array of micro-jet nozzles extending through the second fluidic plate from the another upper surface of the second fluidic plate to the another lower surface of the second fluidic plate; (b) wherein: (i) the ceiling further comprises a third ceiling mounting border extending from the ceiling to the another upper surface of the second fluidic plate, and (ii) the bottom plate further comprises a third cooling surface mounting border extending from the cooling surface to the another lower surface of the second fluidic plate, (iii) wherein the second fluidic plate, the ceiling, the cooling surface of the bottom plate, the first ceiling mounting border, the second ceiling mounting border, the third ceiling mounting border, the first cooling surface mounting border, the second cooling surface mounting border, and the third cooling surface mounting border are all arranged to define: a third inlet chamber between the ceiling and the third array of micro-jet nozzles; a third impingement volume between the cooling surface and the third array of micro-jet nozzles; and a second benchway fluidly communicating the first impingement volume or the second impingement volume or both with the third inlet chamber, and (iv) the third array of micro-jet nozzles in the second fluidic plate is configured to receive a pressurized coolant fluid from the third inlet chamber, accelerate the pressurized coolant fluid, and direct the accelerated pressurized coolant fluid to flow at high velocity into the third impingement volume to impinge a third portion of the cooling surface of the bottom plate, thereby removing a portion of heat that has been absorbed by the third portion of the cooling surface from the one or more heat-generating electronic components.

17. A method for cooling one or more heat-generating electronic components attached to a circuit board, the method comprising the steps of: (a) providing a cooling module comprising: a fluidic plate; a housing; a ceiling arranged between the fluidic plate and the housing; a bottom plate having a cooling surface; and a fastening system for fastening the cooling module to the circuit board; (b) wherein (i) the fluidic plate includes a first section and a second section, the first section including a first array of microfluidic nozzles extending through the fluidic plate, the second section including a second array of microfluidic nozzles extending through the fluidic plate, and (ii) the fluidic plate, the ceiling, the cooling surface of the bottom plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the first cooling surface mounting boundary, and the second cooling surface mounting boundary are all arranged to define: a first inlet chamber between the ceiling and the first array of microfluidic nozzles; a second inlet chamber between the ceiling and the second array of microfluidic nozzles; a first impingement volume between the first array of microfluidic nozzles and the cooling surface; a second impingement volume between the second array of microfluidic nozzles and the cooling surface; and a first benchway fluidly communicating the first impingement volume with the second inlet chamber; (c) attaching the cooling module to the circuit board with the fastening system such that the cooling surface of the bottom plate will be in thermal communication with the one or more heat-generating electronic components on the circuit board and absorb heat generated by the one or more heat-generating electronic components when the circuit board is in an operational state; (d) connecting an external source of pressurized coolant fluid to an inlet port on the housing of the cooling module; (e) passing pressurized coolant fluid received at the inlet port into the first inlet chamber of the fluidic plate; (f) receiving pressurized coolant fluid from the first inlet chamber with the first array of microfluidic nozzles in the first section of the fluidic plate, accelerating the pressurized cooling fluid, and directing accelerated pressurized cooling fluid to flow at high velocity into the first impingement volume to impinge a first portion of the cooling surface of the bottom plate, thereby removing heat that has been absorbed by the first portion of the cooling surface from the one or more heat-generating electronic components; (g) passing a portion of pressurized coolant fluid that impinged the first portion of the cooling surface from the first impingement volume to the second inlet chamber with the benchway; and (h) receiving pressurized coolant fluid from the second inlet chamber with the second array of microfluidic nozzles in the fluidic plate, accelerating the pressurized coolant fluid, and directing accelerated pressurized coolant fluid to flow at high velocity into the second impingement volume to impinge a second portion of the cooling surface of the bottom plate without allowing pressurized coolant fluid to exit the cooling module before entering the second inlet chamber, thereby removing heat that has been absorbed by the second portion of the cooling surface from the one or more heat-generating electronic components.

18. The method of claim 17, further comprising the steps of: (a) capturing a portion of the pressurized coolant fluid in the first impingement volume that is not passed to the second inlet chamber by the benchway; (b) passing the captured pressurized coolant fluid to an outlet fitting associated with the housing; and (c) discharging the pressurized coolant fluid from the cooling module.

19. The method of claim 17, wherein, The ceiling is manufactured as an integral part of the housing.

20. The method of claim 17, wherein, The ceiling is not manufactured as an integral part of the housing.

21. A cooling module, the cooling module comprising: (a) a jet plate comprising: an upper surface; a lower surface; a first section comprising a first array of micro-jet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; and a second section comprising a second array of micro-jet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate, and (b) a housing comprising a top cover and a bottom plate; (c) a ceiling disposed between the jet plate and the top cover of the housing, the ceiling comprising a first ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate and a second ceiling mounting boundary extending from the ceiling to the upper surface of the jet plate, (d) the bottom plate of the housing comprising: an opening; a flange surrounding the opening; a first flange mounting boundary; and a second flange mounting boundary, wherein both the first flange mounting boundary and the second flange mounting boundary extend past the opening in the bottom plate and abut the lower surface of the jet plate; (e) wherein the jet plate, the ceiling, the flange of the bottom plate, the first ceiling mounting boundary, the second ceiling mounting boundary, the first flange mounting boundary, and the second flange mounting boundary are arranged to define: a first inlet chamber between the ceiling and the first array of micro-jet nozzles; a second inlet chamber between the ceiling and the second array of micro-jet nozzles; a first impingement volume within the opening immediately below the first array of micro-jet nozzles; a second impingement volume within the opening and immediately below the second array of micro-jet nozzles; and a first benchway fluidly communicating the first impingement volume with the second inlet chamber; (f) a fastening system for attaching the cooling module to a circuit board having one or more heat-generating electronic components attached thereto, such that the one or more heat-generating electronic components on the circuit board will be inside or directly below the first inlet chamber and the second inlet chamber in the opening of the bottom plate; (g) an inlet fitting attached to the top cover and configured to allow pressurized coolant fluid delivered from an external source to enter the cooling module; and (h) an outlet fitting attached to the bottom plate and configured to allow pressurized coolant fluid to exit the cooling module. (h) an inlet flow passage for carrying pressurized coolant fluid from the inlet fitting to the first inlet chamber; (i) wherein: the first array of micro-jet nozzles in the first section of the fluidic plate is configured to receive pressurized coolant fluid from the first inlet chamber, accelerate the pressurized coolant fluid, and direct the accelerated pressurized coolant fluid to flow at high velocity into the first impingement volume to directly impinge a first portion of the one or more heat-generating electronic components, thereby removing heat generated by the first portion of the one or more heat-generating electronic components when the first portion of the one or more heat-generating electronic components is in an operational state, the bench passage is configured to carry pressurized coolant fluid that impinges portions of the one or more heat-generating electronic components out of the first impingement volume and into the second inlet chamber, and the second array of micro-jet nozzles in the fluidic plate is configured to receive pressurized coolant fluid from the second inlet chamber, accelerate the pressurized coolant fluid, and direct the accelerated pressurized coolant fluid to flow at high velocity into the second impingement volume to impinge a second portion of the one or more heat-generating electronic components, thereby removing a portion of the heat generated by the second portion of the one or more heat-generating components when the second portion of the one or more heat-generating electronic components is in an operational state.

22. The cooling module of claim 21, further comprising: (a) an outlet fitting connected to the top cover and configured to discharge pressurized coolant fluid from the cooling module; (b) a first effluent collection passage configured to capture a portion of the pressurized coolant fluid in the first impingement volume and to convey the captured pressurized coolant fluid to the outlet fitting for discharge from the cooling module.

23. The cooling module of claim 21, further comprising a second effluent collection passage configured to capture a portion of the pressurized coolant fluid in the second impingement volume and to convey the captured pressurized coolant fluid to the outlet fitting for discharge from the cooling module.

24. The cooling module of claim 21, wherein, the ceiling is manufactured as an integral component of the top cover.

25. The cooling module of claim 21, wherein, the ceiling is not manufactured as an integral component of the top cover.

26. The cooling module of claim 25, further comprising: (a) an inset plate disposed between the top cover and the fluidic plate; (b) wherein the ceiling is manufactured as an integral component of the inset plate.

27. The cooling module of claim 21, further comprising a sealing gasket that prevents pressurized coolant fluid that enters the first section of the fluidic plate from directly entering the second section of the fluidic plate without flowing through the first bench passage.

28. The cooling module of claim 21, wherein: (a) the second section of the fluidic plate encircles and surrounds the first section of the fluidic plate; (b) the second ceiling mounting perimeter of the ceiling surrounds and encloses the first ceiling mounting perimeter; and (c) the second flange mounting perimeter of the floor surrounds and encloses the first flange mounting perimeter.

29. The cooling module defined in claim 21, wherein: (a) the jet plate further comprises a third section, the third section comprising a third array of micro-jet nozzles, the third array of micro-jet nozzles extending through the jet plate from the upper surface of the jet plate to the lower surface of the jet plate; (b) the ceiling further comprises a third ceiling mounting perimeter, the third ceiling mounting perimeter extending from the ceiling to the upper surface of the jet plate; and (c) the floor further comprises a third flange mounting perimeter, the third flange mounting perimeter extending through the opening in the floor and abutting the lower surface of the jet plate; (d) wherein the jet plate, the ceiling, the flange of the floor, the first ceiling mounting perimeter, the second ceiling mounting perimeter, the third ceiling mounting perimeter, the first flange mounting perimeter, the second flange mounting perimeter, and the third flange mounting perimeter are all arranged to define: a third inlet chamber between the ceiling and the third array of micro-jet nozzles; a third impingement volume within the opening and immediately below the third array of micro-jet nozzles; and a second benchway that fluidly communicates the first impingement volume or the second impingement volume or both with the third inlet chamber; and (e) the third array of micro-jet nozzles in the jet plate is configured to draw pressurized coolant fluid from the third inlet chamber, accelerate the pressurized coolant fluid, and direct the accelerated pressurized coolant fluid to flow at high velocity into the third impingement volume to directly impinge a third portion of the one or more heat-generating electronic components, thereby removing heat generated by the third portion of the one or more heat-generating electronic components when the third portion of the one or more heat-generating electronic components is in an operational state.

30. The cooling module defined in claim 29, further comprising: (a) an outlet fitting connected to the ceiling and configured to expel pressurized coolant fluid from the cooling module; (b) a first effluent collection channel configured to capture a portion of the pressurized coolant fluid in the third impingement volume and convey the captured pressurized coolant fluid into the outlet fitting for expulsion from the cooling module.

31. The cooling module defined in claim 29, further comprising a sealing gasket that prevents pressurized coolant fluid entering the first section of the jet plate from directly entering the second section of the jet plate without flowing through the second benchway.

32. The cooling module of claim 31, wherein, the sealing gasket prevents pressurized coolant fluid entering the second section of the jet plate from directly flowing into the third section of the jet plate without flowing through the second benchway.

33. The cooling module of claim 29, wherein: (a) the third section of the jet plate surrounds and encloses the first section of the jet plate and the second section of the jet plate; (b) the third ceiling mounting boundary of the ceiling surrounds and encloses the first ceiling mounting boundary and the second ceiling mounting boundary; and (c) the third flange mounting boundary of the floor surrounds and encloses the first flange mounting boundary and the second flange mounting boundary.

34. The cooling module of claim 29, wherein, the ceiling is manufactured as an integral part of the roof.

35. The cooling module of claim 29, wherein, the ceiling is not manufactured as an integral part of the roof.

36. The cooling module of claim 35, further comprising: (a) an inset plate disposed between the roof and the jet plate; (b) wherein the ceiling is manufactured as an integral part of the inset plate.

Images