Camera module and electronic endoscope

Abstract

The invention relates to a camera module and an electronic endoscope, and is applied to the field of electronic endoscopes, the camera module is electrically connected with an operation part of the electronic endoscope through a transmission part of the electronic endoscope, and the operation part is connected with a host of the electronic endoscope through a cable; the camera module comprises a light path assembly, a flexible board assembly and an image sensor group, the light path assembly comprises a prism unit and a support unit. The support unit and the prism unit are fixedly assembled. The light path assembly is used for reflecting image light of an object to be inspected to the image sensor group; the support unit is connected with the flexible board assembly, and the flexible board assembly is electrically connected with the image sensor group. The support unit and the flexible board assembly form a surrounding structure for the image sensor group; and the image sensor group is positioned in the surrounding structure and is used for converting the received image light into an electric signal. According to the invention, the dustproof effect of the image sensor is realized, and the output resolution of the image sensor is improved.

Description

Technical Field

[0001] The present application relates to the field of endoscopic imaging, and in particular to a camera module and an electronic endoscope. Background Art

[0002] Electronic endoscopes have been widely used in minimally invasive surgeries. Electronic endoscopes place image sensors at the front end of the mirror pole. 3D electronic endoscopes need to place two image sensors. Since the mirror pole is small (generally around 10 mm in diameter), the size of the image sensor is limited. In order to obtain higher image resolution in the electronic endoscope, the two image sensors in the 3D electronic endoscope are placed in a periscope style.

[0003] However, in the solution where the image sensor is placed in a periscope style, CSP (Chip Scale Package) packaging can be used, and COB (Chip On Board) packaging can also be used. When CSP packaging is used, a cover glass layer is provided on the image sensor to prevent dust, but the output resolution of the image sensor cannot be maximized at this time; when COB packaging is used, the output resolution of the image sensor is improved compared to the CSP packaging method, but because the prism is fixed on the support frame, the image sensor cannot be dustproof at this time. Therefore, in the prior art, it is difficult to achieve the effect of improving the output resolution of the image sensor while realizing dustproofing of the image sensor.

[0004] It is difficult to realize the effect of improving the output resolution of the image sensor while realizing dust prevention of the image sensor in the related art, and currently no effective solution has been proposed. Summary of the invention

[0005] In this embodiment, a camera module and an electronic endoscope are provided to solve the problem in the related art that it is impossible to improve the output resolution of the image sensor while achieving dust protection for the image sensor.

[0006] In a first aspect, a camera module is provided in this embodiment, wherein the camera module is electrically connected to an operating unit of the electronic endoscope through a transmission unit of the electronic endoscope; the operating unit is connected to a host of the electronic endoscope through a cable; the camera module comprises: an optical path component, a soft board component and an image sensor group;

[0007] The optical path component comprises a prism unit and a bracket unit; the bracket unit is fixedly assembled with the prism unit; the optical path component is used to reflect the image light of the object to be inspected onto the image sensor;

[0008] The bracket unit is connected to the soft board assembly, and the soft board assembly is electrically connected to the image sensor group;

[0009] The image sensor group is located in the enclosing structure formed by the bracket unit and the soft board assembly, and is used to convert the received image light into an electrical signal.

[0010] In some of the embodiments, the image sensor group includes a first sensor and a second sensor; the soft board assembly includes a first soft board and a second soft board; the bracket unit includes a first bracket and a second bracket;

[0011] The first sensor, the first soft board, the second soft board and the second sensor are stacked, the first sensor and the first soft board are electrically connected, and the second sensor and the second soft board are electrically connected;

[0012] The first bracket and the first sensor do not contact each other; the second bracket and the second sensor do not contact each other.

[0013] In some embodiments, the prism unit includes a first prism and a second prism; the first prism is fixedly connected to the first bracket; and the second prism is fixedly connected to the second bracket.

[0014] In some of the embodiments, the optical path assembly further comprises an objective lens unit; the objective lens unit comprises a first objective lens and a second objective lens;

[0015] The first objective lens is used to receive the first image light reflected or excited by the object to be inspected; the second objective lens is used to receive the second image light reflected or excited by the object to be inspected.

[0016] In some embodiments, the first prism is used to transmit the first image light to the first sensor; the second prism is used to transmit the second image light to the second sensor.

[0017] In some of the embodiments, the first sensor is used to receive the first image light and convert the first image light into a first electrical signal;

[0018] The second sensor is used to receive the second image light and convert the second image light into a second electrical signal.

[0019] In some embodiments, the first flexible board and the second flexible board are both electrically connected to a transmission part of the electronic endoscope, and are used to send the first electrical signal and the second electrical signal to the transmission part, respectively.

[0020] In some of the embodiments, the soft board assembly and the objective lens unit do not contact each other.

[0021] In some of the embodiments, the soft board component is a flexible circuit board.

[0022] According to a second aspect, an electronic endoscope is provided in this embodiment, and the electronic endoscope includes an insertion portion, a transmission portion, and an operation portion; the insertion portion includes a camera module as described in any one of the first aspects.

[0023] Compared with the related art, a camera module and an electronic endoscope provided in this embodiment, by setting the image sensor in the enclosing structure formed by the bracket unit and the soft board assembly for the image sensor, and fixing the bracket and the prism, avoid dust contamination of the image sensor during the subsequent assembly of the electronic mirror; at the same time, no reinforcement plate is used, only the soft board assembly is used for signal transmission and support, and the thickness of the original reinforcement plate is reduced to further increase the height of the prism used to reflect light to the image sensor, and by increasing the height of the prism to increase the light area received by the image sensor, the output resolution of the image sensor is improved.

[0024] Details of one or more embodiments of the present application are set forth in the following drawings and description to make other features, objects, and advantages of the present application more readily apparent. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The drawings described herein are used to provide a further understanding of the present application and constitute a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0026] Figure 1 It is a system schematic diagram of an existing electronic endoscope;

[0027] Figure 2 It is a structural schematic diagram of a camera module provided in the prior art;

[0028] Figure 3 is a schematic diagram of the connection structure of the camera module provided in an embodiment of the present application;

[0029] Figure 4 It is a cross-sectional view of the camera module provided in an embodiment of the present application.

[0030] Reference numerals: 100, camera module; 1, optical path component; 10, light source; 11, prism unit; 111, first prism; 112, second prism; 12, bracket unit; 121, first bracket; 122, second bracket; 13, objective lens unit; 131, first objective lens; 132, second objective lens; 2, soft board component; 21, first soft board; 22, second soft board; 3, image sensor group; 31, first sensor; 32, second sensor ; 200, transmission unit; 300, operating unit; 40, supporting unit; 311a, first objective lens group; 311b, second objective lens group; 312a, first prism group; 312b, second prism group; 313, supporting component; 314a, first sensor device; 314b, second sensor device; 315a, first soft board component; 315b, second soft board component; 316, fixed substrate; 101, host; 102, insertion unit; 103, display. DETAILED DESCRIPTION

[0031] In order to more clearly understand the purpose, technical solutions and advantages of the present application, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments.

[0032] Unless otherwise defined, the technical terms or scientific terms involved in this application shall have the general meaning understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the", "these" and the like in this application do not represent quantitative restrictions, and they can be singular or plural. The terms "include", "comprise", "have" and any variants thereof involved in this application are intended to cover non-exclusive inclusions; for example, a process, method and system, product or device comprising a series of steps or modules (units) is not limited to the listed steps or modules (units), but may include unlisted steps or modules (units), or may include other steps or modules (units) inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether directly or indirectly. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there can be three relationships. For example, "A and / or B" can mean: A exists alone, A and B exist at the same time, and B exists alone. Usually, the character " / " indicates that the objects associated with each other are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0033] Figure 1 This is a system diagram of an electronic endoscope. Figure 1The electronic endoscope system mainly includes a light source 10, a host 101, an insertion part 102, a transmission part 200, an operating part 300 and a display 103. Among them, a camera module and a light source fiber bundle are built in the insertion part 102, and the camera module is used to capture image signal data. The light source 10 is used to provide a light beam to the insertion part 102, and irradiate the light beam to a specific inspection part of the object to be inspected through the light source fiber bundle. The operating part 300 includes an operating handle housing, a controller and an image signal processing component; the controller is used to realize different functions according to the signal input by the operator; the image signal processing component is used to process the electrical signal transmitted by the transmission part 200, that is, to perform signal conversion. The transmission part 200 is arranged between the operating part 300 and the insertion part 102, and the image signal data captured by the insertion part 102 is transmitted to the operating part 300 through the transmission part 200, and after the data conversion is performed by the operating part 300, it is transmitted to the host 101 through a cable. The host 101 is the control center of the entire electronic endoscope, and is responsible for receiving the image signal data transmitted through the transmission unit 200, the operation unit 300 and the cable. At the same time, the image signal data is processed in real time and the image quality is optimized through the image processing unit in the host 101; at the same time, the host 101 is also connected to the display 103 through a cable, and the display 103 is used to receive the processed image data for the operator to view.

[0034] When using a medical electronic endoscope, the insertion part 102 of the electronic endoscope is inserted into the surgical area of ​​the body of the object to be examined for clinical surgery. The light emitted by the light source is irradiated to the human body cavity through the light guide (optical fiber), and the light reflected from the cavity enters the insertion part 102. At this time, the insertion part 102 converts the image light signal into an electrical signal, which is then sent to the operating part 300 through the transmission part 200. After data conversion by the operating part 300, it is transmitted to the host 101 by a cable. At the same time, the image data of the electronic endoscope processed by the image processing unit in the host 101 will be displayed on the display 103. The operator of the electronic endoscope views the endoscopic image displayed on the display 103, and receives the operator's input signal by controlling the operating part 300 to realize different functions, and performs signal processing on the electrical signal transmitted by the transmission part.

[0035] The 3D electronic endoscope is an advanced medical device that combines traditional endoscope technology with three-dimensional (3D) imaging technology. This device allows doctors to obtain stereoscopic images of the patient's internal structures during endoscopic examinations. In the prior art, due to the limitation of the maximum width of the insertion part of the 3D electronic endoscope, it is generally required to control the maximum width of the camera module in the insertion part within 10.5mm, that is, the size of the camera module cannot be made too large. In order to achieve high-resolution images and high-quality output, it is hoped that a sensor with a larger photosensitive surface will be used. Figure 2It is a structural schematic diagram of a camera module provided in the prior art. The camera module includes a first optical path component, a second optical path component, a first sensor device 314a, a second sensor device 314b, a first soft board component 315a, a second soft board component 315b and a fixed substrate 316. The first soft board component 315a and the second soft board component 315b assume the function of a circuit board, transmitting electrical signals to the transmission part; the first optical path component includes a first objective lens group 311a and a first prism group 312a, and the second optical path component includes a second objective lens group 311b and a second prism group 312b; and also includes a supporting component 313, on which the first optical path component and the second optical path component are arranged.

[0036] Among them, the first objective lens group 311a is used to receive the first image light reflected or excited by a specific part; the first prism group 312a is used to reflect or transmit the first image light to the first sensor device 314a; the first sensor device 314a is electrically connected to the first soft board 315a, and converts the first image light into a first electrical signal; the second objective lens group 311b is used to receive the second image light reflected or excited by a specific part; the second prism group 312b is used to reflect or transmit the second image light to the second sensor device 314b; the second sensor device 314b is electrically connected to the second soft board 315b, and converts the second image light into a second electrical signal. Thereafter, the relative position of the first sensor component 314a or the second sensor component 314b connected to the first soft board component 315a or the second soft board component 315b is adjusted by adjusting the position of the first soft board component 315a or the second soft board component 315b, so that the relative position of the first sensor component 314a and the second sensor component 314b can be more conveniently aligned, calibration can be facilitated, and imaging quality can be improved.

[0037] It can be known that in the prior art, the position of the flexible board is adjusted, thereby adjusting the relative position of the sensor connected to the flexible board to improve the imaging quality.

[0038] Compared with the prior art, a camera module 100 is provided in an embodiment of the present application. The image sensor is arranged in an enclosure structure formed by a bracket unit 12 and a soft board assembly 2 for the image sensor, and the bracket and the prism are fixedly arranged, thereby avoiding dust contamination of the image sensor during the subsequent assembly of the electronic mirror. At the same time, a fixed substrate, i.e., a reinforcement plate, is not used, and only the soft board assembly 2 is used for signal transmission and support, thereby reducing the thickness of the original reinforcement plate to further increase the height of the prism, thereby improving the output resolution of the image sensor.

[0039] Specifically, in an embodiment of the present application, a camera module 100 is provided, and the camera module 100 is electrically connected to an operating part 300 of the electronic endoscope through a transmission part 200 of the electronic endoscope, and the operating part 300 is connected to a host 101 of the electronic endoscope through a cable; the camera module 100 includes: an optical path component 1, a soft board component 2 and an image sensor group 3; the optical path component 1 includes a prism unit 11 and a bracket unit 12; the bracket unit 12 is fixedly assembled with the prism unit 11; the optical path component 1 is used to reflect the image light of the object to be inspected onto the image sensor group 3; the bracket unit 12 is connected to the soft board component 2, and the soft board component 2 is electrically connected to the image sensor group 3; the image sensor group 3 is located in an enclosing structure formed by the bracket unit 12 and the soft board component 2, and is used to convert the received image light into an electrical signal.

[0040] The main function of the camera module 100 in the electronic endoscope is to collect and transmit images, providing medical professionals with high-quality internal views to assist in diagnosis and treatment. Figure 3 is a schematic diagram of the connection structure of the camera module 100 provided in the embodiment of the present application. In this embodiment, reference Figure 3 , the camera module 100 is provided with an optical path component 1, a soft board component 2 and an image sensor group 3. The optical path component 1 is used to capture the image light reflected or excited by the specific part of the object to be inspected, and reflect or excite the image light to the image sensor group 3, so that the image sensor group 3 receives the image light and converts the optical signal of the image light into an electrical signal; then the soft board component 2 connected to the image sensor sends the electrical signal to the operating part 300 through the transmission part 200 of the electronic endoscope, and after the data is converted by the operating part 300, it is transmitted to the host 101 by the cable. An image signal processing unit is provided in the host 101, specifically, the image signal processing unit is an image signal processor. After the electrical signal is sent to the host 101, the image signal processor can process the received electrical signal, that is, extract and optimize the image information from the original electrical signal data output by the image sensor group 3, and finally output an image that can be displayed, stored or further processed. Additionally, the image processed by the image signal processor is displayed on the display 103 , so that the electronic endoscope operator controls the operation section 300 according to the content in the display to adjust the insertion section 102 of the electronic endoscope.

[0041] The optical path component 1 includes a prism unit 11, which is used to transmit light from the objective lens unit 13 to the image sensor group 3. When the objective lens receives the image light reflected or stimulated by a specific part of the object to be inspected, the prism can turn the light from the optical axis direction of the objective lens to the light-receiving surface of the image sensor group 3, ensuring that the light can be correctly transmitted to the image sensor group 3, so as to collect high-quality images. At the same time, the optical path component 1 also includes a bracket unit 12 fixedly assembled with the prism unit 11; illustratively, the fixed connection between the prism unit 11 and the bracket unit 12 is similar to the connection of the mobile phone lens module, such as welding, board-to-board connection, use of adhesives, etc., which is not specifically limited here.

[0042] At the same time, the bracket unit 12 fixedly connected to the prism unit 11 is also fixedly connected to the soft board component 2, and the soft board component 2 here is set as a flexible circuit board. Compared with the connection of the soft board of the camera module 100 in the prior art, the embodiment of the present application does not directly use a fixed substrate to connect the image sensor group 3 or set a fixed substrate between the soft boards, but only uses a flexible circuit board as the soft board component 2 to transmit electrical signals, which is conducive to reducing the thickness of the soft board component 2, thereby increasing the height of the prism used to reflect light to the image sensor, so as to increase the illumination area of ​​the subsequent reflection to the image sensor, thereby improving the output resolution of the image sensor.

[0043] In some of the embodiments, the image sensor group 3 includes a first sensor 31 and a second sensor 32; the soft board assembly 2 includes a first soft board 21 and a second soft board 22; the bracket unit 12 includes a first bracket 121 and a second bracket 122; the first sensor 31, the first soft board 21, the second soft board 22 and the second sensor 32 are stacked, the first sensor 31 and the first soft board 21 are electrically connected, and the second sensor 32 and the second soft board 22 are electrically connected; the first bracket 121 and the first sensor 31 do not contact each other; the second bracket 122 and the second sensor 32 do not contact each other.

[0044] Figure 4 1 is a cross-sectional view of a camera module 100 provided in an embodiment of the present application. Figure 4In this embodiment, the image sensor group 3 of the camera module 100 includes two sensors, namely, a first sensor 31 and a second sensor 32; correspondingly, the soft board assembly 2 includes a first soft board 21 and a second soft board 22 electrically connected to the first sensor 31 and the second sensor 32 respectively; the bracket unit 12 includes a first bracket 121 and a second bracket 122 connected to the first soft board 21 and the second soft board 22 respectively. The first bracket 121 and the first soft board 21 form a first enclosing structure for the first sensor 31, and the first sensor 31 is arranged in the first enclosing structure; the second bracket 122 and the second soft board 22 form a second enclosing structure for the second sensor 32, and the second sensor 32 is arranged in the second enclosing structure. At the same time, the first bracket 121 and the first sensor 31 do not contact each other, and the distance between the first bracket 121 and the first sensor 31 is set to the minimum; the second bracket 122 and the second sensor 32 do not contact each other, and the distance between the second bracket 122 and the second sensor 32 is set to the minimum.

[0045] Exemplarily, both sensors in the image sensor group 3 adopt the COB packaging process, which reduces the thickness of the protective glass, can effectively reduce the volume required to set up the sensor, and release more space for the optical path component 1, so that the optical lens group in the optical path component 1 is maximized, thereby obtaining more image light.

[0046] In some embodiments, the prism unit 11 includes a first prism 111 and a second prism 112; the first prism 111 is fixedly connected to the first bracket 121; the second prism 112 is fixedly connected to the second bracket 122. The optical path assembly 1 also includes an objective lens unit 13; the objective lens unit 13 includes a first objective lens 131 and a second objective lens 132; the first objective lens 131 is used to receive a first image light reflected or excited by the object to be inspected; the second objective lens 132 is used to receive a second image light reflected or excited by the object to be inspected; the first prism 111 is used to transmit the first image light to the first sensor 31; the second prism 112 is used to transmit the second image light to the second sensor 32.

[0047] In this embodiment, reference Figure 4The optical path component 1 includes an objective lens unit 13 and a prism unit 11. The objective lens unit 13 is arranged at an end farther away from the electronic endoscope operating unit 300 relative to the prism unit 11. The objective lens of the objective lens unit 13 is located at the front end of the electronic endoscope and is responsible for collecting light reflected or transmitted from the surface of the object to be inspected. The objective lens unit 13 focuses the collected light to form an inverted, reduced real image. The prism is used to change the direction of the light path so that the light can be effectively transmitted in a limited space while maintaining the image quality; since the image formed by the objective lens is inverted, the prism can flip the image by reflection to transmit the forward image light to the image sensor group 3. The cooperative work of the objective lens and the prism ensures efficient and high-quality optical transmission from the object to be inspected to the image sensor.

[0048] When the first objective lens 131 receives the first image light reflected or excited by the object to be inspected, the first image light is transmitted to the first sensor 31 through the first prism 111; when the second objective lens 132 receives the second image light reflected or excited by the object to be inspected, the second image light is transmitted to the second sensor 32 through the second prism 112. The flexible board assembly 2 and the objective lens unit 13 do not contact each other.

[0049] By setting two independent first objective lenses 131 and second objective lenses 132, each objective lens can capture a slightly different perspective, can produce a stereoscopic image, and provide depth perception. At the same time, setting the first prism 111 and the second prism 112, respectively, in conjunction with the two objective lenses, can help adjust the optical path to ensure that the image captured by each objective lens can be accurately transmitted to the corresponding image sensor. By setting two objective lenses and two prisms in the optical path component 1, it is beneficial to improve the imaging quality. The two objective lenses and prisms can also be used for spectroscopic applications, such as splitting the incident light into spectra of different wavelengths to simultaneously acquire color and fluorescent images, or for advanced imaging technologies such as multi-spectral imaging; different imaging modes can also be achieved, such as one for standard white light imaging and the other for special imaging technologies such as narrow-band imaging and laser confocal microscopy, thereby providing a variety of diagnostic tools in the same device; the field of view angle and magnification can also be flexibly adjusted without changing the overall design to meet different inspection needs.

[0050] In some embodiments, the first sensor 31 is used to receive the first image light and convert the first image light into a first electrical signal; the second sensor 32 is used to receive the second image light and convert the second image light into a second electrical signal.

[0051] In this embodiment, reference Figure 4When the first objective lens 131 receives the first image light reflected or excited by the object to be inspected, the first image light is transmitted to the first sensor 31 through the first prism 111. The first sensor 31 receives the first image light and converts the first image light into a first electrical signal. When the second objective lens 132 receives the second image light reflected or excited by the object to be inspected, the second image light is transmitted to the second sensor 32 through the second prism 112. The second sensor 32 receives the second image light and converts the second image light into a second electrical signal.

[0052] In some of the embodiments, the first flexible board 21 and the second flexible board 22 are both electrically connected to the transmission unit 200 of the electronic endoscope, and are used to send the first electrical signal and the second electrical signal to the transmission unit 200, respectively.

[0053] In this embodiment, since the first sensor 31 is electrically connected to the first soft board 21, and the second sensor 32 is electrically connected to the second soft board 22, the first sensor 31 transmits the first electrical signal to the operating unit 300 through the first soft board 21 and the transmission unit 200 of the electronic endoscope connected to the first soft board 21; the second sensor 32 transmits the second electrical signal to the operating unit 300 through the first soft board 21 and the transmission unit 200 of the electronic endoscope connected to the second soft board 22. After receiving the first electrical signal and the second electrical signal, the image signal processor in the host 101 processes the first electrical signal and the second electrical signal, and displays the data-processed images corresponding to the first electrical signal and the second electrical signal on the display 103, so that the operator can observe and operate the operating unit 300 for subsequent operations.

[0054] In some of the embodiments, the camera module in this embodiment also includes a support portion 40, which is arranged on the optical path component 1 to fix the optical path component 1 and the soft board component 2 together. In addition, the back side of the prism in the prism unit needs to be parallel to and supported by the support portion 40.

[0055] In some of the embodiments, the light-emitting end face of the prism unit 11 is a rectangle, the long side of the rectangle is consistent with the axial direction of the long tube, and the short side is perpendicular to the axial direction of the long tube. In a special embodiment, the long side is equal to the short side, that is, the light-emitting end face is a square. Alternatively, the short side of the prism assembly is greater than or equal to the height, and the long side is greater than or equal to the short side, thereby making full use of the prism height to maximize the effective image surface and output a higher resolution image.

[0056] In the actual production process, the fixed substrate used to provide support in the prior art is deleted, and the FPC (Flexible Printed Circuit) soft board is directly used for production, which maximizes the height of the prism, thereby increasing the image light area reflected to the image sensor, so as to improve the output resolution of the image sensor. At the same time, compared with the image sensor in the prior art that uses a CSP package with a cover glass, the present application uses a COB packaged image sensor, and at the same time, the prism assembly is fixed on the bracket assembly, and then the module with the prism assembly fixed is fixed on the FPC soft board, ensuring the dustproof requirements of the COB image sensor. At the same time, the FPC soft board is used as the substrate of the COB image sensor, which reduces the thickness of the substrate as much as possible, increases the height of the prism, and then increases the image light area reflected to the image sensor, thereby improving the output resolution of the image sensor.

[0057] In this embodiment, an electronic endoscope is also provided, which includes an insertion portion 102 and an operating portion 300; the insertion portion 102 includes the camera module 100 and the transmission portion 200 in the above embodiment.

[0058] The electronic endoscope including the camera module 100 in the above embodiment is conducive to improving the resolution and clarity of the image output by the image processor without changing the overall width of the camera module 100. By increasing the height of the prism as much as possible, the image light area reflected to the image sensor is increased, thereby improving the output resolution of the image sensor. In addition, in order to solve the dust prevention problem during the transportation of the image sensor, the production difficulty of the 3D electronic endoscope is reduced.

[0059] The camera module provided in this embodiment is used to implement the above-mentioned embodiments and preferred implementation modes, and those that have been described will not be repeated. The terms "module", "unit", "subunit", etc. used below can implement a combination of software and / or hardware of predetermined functions. Although the devices described in the following embodiments are preferably implemented in software, the implementation of hardware, or a combination of software and hardware, is also possible and conceivable.

[0060] It should be noted that the above modules can be functional modules or program modules, and can be implemented by software or hardware. For modules implemented by hardware, the above modules can be located in the same processor; or the above modules can be located in different processors in any combination.

[0061] It should be understood that the specific embodiments described herein are only used to explain the application, rather than to limit it. Based on the embodiments provided in this application, all other embodiments obtained by ordinary technicians in this field without creative work are within the protection scope of this application.

[0062] Obviously, the drawings are only some examples or embodiments of the present application. For ordinary technicians in the field, the present application can also be applied to other similar situations based on these drawings without creative work. In addition, it is understandable that although the work done in this development process may be complicated and lengthy, for ordinary technicians in the field, certain changes in design, manufacturing or production based on the technical content disclosed in this application are only conventional technical means and should not be regarded as insufficient content disclosed in this application.

[0063] The term "embodiment" in this application refers to a specific feature, structure or characteristic described in conjunction with the embodiment that can be included in at least one embodiment of the present application. The appearance of this phrase in various locations in the specification does not necessarily mean the same embodiment, nor does it mean that it is mutually exclusive with other embodiments and is independent or optional. It is clearly or implicitly understood by those of ordinary skill in the art that the embodiments described in this application can be combined with other embodiments without conflict.

[0064] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of patent protection. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the attached claims.

Claims

1. A camera module, wherein the camera module is electrically connected to an operating unit of the electronic endoscope through a transmission unit of the electronic endoscope; the operating unit is connected to a host of the electronic endoscope through a cable; characterized in that: The camera module includes: an optical path component, a soft board component and an image sensor group; The optical path component comprises a prism unit and a bracket unit; the bracket unit is fixedly assembled with the prism unit; the optical path component is used to reflect the image light of the object to be inspected onto the image sensor group; The bracket unit is connected to the soft board assembly, and the soft board assembly is electrically connected to the image sensor group; The image sensor group is located in the enclosing structure formed by the bracket unit and the soft board assembly, and is used to convert the received image light into an electrical signal.

2. The camera module according to claim 1, characterized in that: The image sensor group includes a first sensor and a second sensor; the soft board assembly includes a first soft board and a second soft board; the bracket unit includes a first bracket and a second bracket; The first sensor, the first soft board, the second soft board and the second sensor are stacked, the first sensor and the first soft board are electrically connected, and the second sensor and the second soft board are electrically connected; The first bracket and the first sensor do not contact each other; the second bracket and the second sensor do not contact each other.

3. The camera module according to claim 2, characterized in that: The prism unit includes a first prism and a second prism; the first prism is fixedly connected to the first bracket; and the second prism is fixedly connected to the second bracket.

4. The camera module according to claim 3, characterized in that: The optical path assembly further comprises an objective lens unit; the objective lens unit comprises a first objective lens and a second objective lens; The first objective lens is used to receive the first image light reflected or excited by the object to be inspected; The second objective lens is used to receive the second image light reflected or excited by the object to be inspected.

5. The camera module according to claim 4, characterized in that: The first prism is used to transmit the first image light to the first sensor; The second prism is used to transmit the second image light to the second sensor.

6. The camera module according to claim 4, characterized in that: The first sensor is used to receive the first image light and convert the first image light into a first electrical signal; The second sensor is used to receive the second image light and convert the second image light into a second electrical signal.

7. The camera module according to claim 6, characterized in that: The first soft board and the second soft board are both electrically connected to the transmission part of the electronic endoscope, and are used to send the first electrical signal and the second electrical signal to the transmission part respectively.

8. The camera module according to claim 4, characterized in that: The soft board assembly and the objective lens unit do not contact each other.

9. The camera module according to any one of claims 1 to 8, characterized in that: The soft board component is a flexible circuit board.

10. An electronic endoscope, characterized in that: The electronic endoscope includes an insertion portion, a transmission portion, and an operation portion; the insertion portion includes a camera module as described in any one of claims 1 to claim 9.

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