Sorting mechanism of a silicon wafer sorter

Abstract

The present invention discloses a sorting mechanism for a silicon wafer sorting machine, which relates to the field of silicon wafer production technology and includes a support unit, including a support frame, a shaft sleeve arranged on the end face of the support frame, a rotating shaft arranged inside the shaft sleeve, a fixed sleeve arranged on the outer wall of the rotating shaft, a sliding sleeve rod arranged inside the fixed sleeve, a fixed rod arranged inside the sliding sleeve rod, and a supporting plate arranged at the end of the fixed rod. The beneficial effects of the present invention are that the linkage mechanism between the sliding block and the connecting member can achieve effective transportation of silicon wafers and automatic discharge of defective products; when the sliding block moves vertically, it drives the supporting plate to protrude from the surface of the conveyor belt; further movement causes the supporting plate to flip along an arc trajectory, smoothly removing defective silicon wafers; and the device uses a single control unit, which can not only simplify the production line structure, reduce hardware investment and maintenance costs, but also improve space utilization and production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer production, in particular to a sorting mechanism of a silicon wafer sorting machine. Background Art

[0002] Silicon wafers, as an important raw material for solar cells, are widely used in the production of solar cells, circuit boards and other products. During the production process of silicon wafers, silicon wafer sorters, as terminal equipment for quality control, detect and grade silicon wafers based on aspects such as size, dirt, cracks, holes, and resistivity to ensure the quality of solar cells, circuit boards and other products manufactured from silicon wafers.

[0003] In the silicon wafer sorting process, the main problems currently faced are the increase in detection production line costs and the reduction in equipment manufacturing efficiency. After the screening process is completed, multiple sets of transmission equipment are needed to control and push unqualified or defective silicon wafers off the production line. This not only complicates the production process, but also increases unnecessary hardware investment and maintenance costs, thereby affecting overall production efficiency and economic benefits. Summary of the Invention

[0004] In view of the above problems or problems existing in the prior art, the present invention is proposed.

[0005] Therefore, the object of the present invention is to provide a sorting mechanism for a silicon wafer sorter, which solves the problem of the existing need for multiple sets of transmission equipment to increase costs in order to push unqualified silicon wafers out of the production line.

[0006] To solve the above technical problems, the present invention provides the following technical solutions: A sorting mechanism for a silicon wafer sorter, comprising: a support unit, including a support frame, a shaft sleeve disposed on an end surface of the support frame, a rotating shaft disposed inside the shaft sleeve, a fixed sleeve disposed on an outer wall of the rotating shaft, a sliding sleeve rod disposed inside the fixed sleeve, a fixed rod disposed inside the sliding sleeve rod, and a supporting plate disposed at an end of the fixed rod;

[0007] The unloading unit includes a cross frame arranged inside the support frame, a sliding block arranged inside the cross frame, a connecting piece linked to the sliding block, and a hinge seat arranged on the surface of the carrying plate.

[0008] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the rotating shaft is connected to the fixed sleeve;

[0009] The fixing sleeve includes a waist hole opened on its side wall;

[0010] The sliding sleeve includes a guide rod provided on a side wall thereof;

[0011] The waist hole is adapted to the guide rod, and the waist hole passes through the guide rod and extends to the outside thereof;

[0012] The fixed sleeve is slidably connected to the sliding sleeve rod.

[0013] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the fixing rod is connected to the carrying plate;

[0014] The fixed rod is slidably connected to the sliding sleeve rod;

[0015] The rotating shaft flips along the axis of the sleeve, thereby changing the angle of the bearing plate.

[0016] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the horizontal frame is connected to the supporting frame;

[0017] The cross frame includes a through hole extending through the surface thereof;

[0018] The sliding block is adapted to the through hole, and the outer wall of the sliding block is in conflict with the inner wall of the through hole.

[0019] As a preferred solution of the sorting mechanism of the silicon wafer sorter of the present invention, wherein: the connecting member includes a hinge plate, and a connecting plate provided at the end of the hinge plate;

[0020] The sliding block includes a groove formed inside the sliding block and a guide rail formed on a side wall of the sliding block;

[0021] The connecting plate is adapted to the guide rail, and the connecting plate passes through the guide rail and extends outwards.

[0022] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the end of the hinged plate protrudes from the surface of the sliding block;

[0023] The hinge plate is hinged to the hinge seat.

[0024] As a preferred solution of the sorting mechanism of the silicon wafer sorter of the present invention, wherein: the connecting member further comprises guide pillars provided at both ends of the connecting plate;

[0025] The guide post protrudes from the side wall of the sliding block;

[0026] The side wall of the through hole is provided with a displacement groove;

[0027] The guide column is adapted to the displacement groove.

[0028] As a preferred solution of the sorting mechanism of the silicon wafer sorter of the present invention, wherein: the displacement slot includes a vertical portion;

[0029] The sliding block moves along the inner wall of the through hole, and the guide column moves along the inside of the vertical portion, thereby pushing the carrying plate to move along the vertical direction.

[0030] As a preferred solution of the sorting mechanism of the silicon wafer sorting machine of the present invention, wherein: the displacement slot further includes an inclined portion;

[0031] The sliding block moves along the inner wall of the through hole, and the guide column moves along the inside of the inclined portion, thereby pushing the carrying plate to flip at a certain angle.

[0032] As a preferred solution of the sorting mechanism of the silicon wafer sorter of the present invention, wherein: a driving unit, wherein the output end of the driving unit is connected to the sliding block;

[0033] The transmission unit is installed inside the transmission unit.

[0034] The beneficial effects of the present invention are as follows: the present invention utilizes the linkage mechanism between the connecting member and the sliding block to realize the effective transportation of silicon wafers; when the sliding block moves in the vertical direction, it drives the connecting member to move up and down synchronously, so that the supporting plate connected to the connecting member protrudes from the surface of the conveyor belt; as the sliding block moves further, the connecting member moves along a preset arc trajectory, so that the supporting plate can be flipped at a certain angle, and unqualified silicon wafers can be smoothly transported out of the production line; and this device can adopt a single control unit to realize the transportation of silicon wafers, which can not only simplify the production line structure, reduce hardware investment and maintenance costs, but also improve space utilization and production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0036] Figure 1 It is a structural schematic diagram of the support unit and the transmission unit of the present invention.

[0037] Figure 2 It is a schematic diagram of the support unit structure of the present invention.

[0038] Figure 3 It is a schematic diagram of the explosion structure of the unloading unit of the present invention.

[0039] Figure 4 It is a partial cross-sectional view of the carrying plate of the present invention.

[0040] Figure 5 For the present invention Figure 4 A partial enlarged view of point A.

[0041] Figure 6 It is a structural schematic diagram of the sorting device of the present invention. DETAILED DESCRIPTION

[0042] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0043] In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0044] Secondly, the term "one embodiment" or "embodiment" herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in various places throughout this specification does not necessarily refer to the same embodiment, nor does it constitute a separate or selective embodiment that is mutually exclusive with other embodiments.

[0045] Example 1

[0046] Reference Figures 1 to 3 , which is the first embodiment of the present invention, provides a sorting mechanism of a silicon wafer sorter, which includes a support unit 1, including a support frame 11, a shaft sleeve 12 arranged on the end surface of the support frame 11, a rotating shaft 13 arranged on the inner side of the shaft sleeve 12, a fixed sleeve 14 arranged on the outer wall of the rotating shaft 13, a sliding sleeve rod 15 arranged inside the fixed sleeve 14, a fixed rod 16 arranged on the inner side of the sliding sleeve rod 15, and a supporting plate 17 arranged at the end of the fixed rod 16.

[0047] In this embodiment, the supporting plate 17 can play a certain supporting role on the silicon wafer, so that the silicon wafer can be set on the surface of the supporting plate 17; the sleeve 12 is installed on the surface of the support frame 11, and the rotating shaft 13 passes through the sleeve 12 and can rotate along its axial direction.

[0048] The support frame 11 is a rectangular frame structure, and support columns are installed at the four corners of the bottom thereof to ensure that there is a certain movement space between the support frame 11 and the ground.

[0049] The shaft sleeve 12 is connected to the support frame 11 by bolts, and the shaft sleeve 12 is installed at a position on one side of the frame of the support frame 11.

[0050] The fixed sleeve 14 is welded and fixed to the rotating shaft 13, and the fixed sleeve 14 is slidably connected to the sliding sleeve rod 15; the rotating shaft 13 and the fixed sleeve 14 rotate synchronously;

[0051] The sliding sleeve rod 15 is slidably connected to the fixed rod 16, and one end of the fixed rod 16 is welded and fixed to the supporting plate 17; through the linkage between the fixed rod 16 and the fixed sleeve 14, the rotation of the rotating shaft 13 can drive the supporting plate 17 to flip and move the angle.

[0052] Specifically, a limit block is provided on the side wall of the sliding sleeve rod 15 , and a limit groove cooperating with the limit block is provided inside the fixed sleeve 14 , so that the sliding sleeve rod 15 and the fixed sleeve 14 will not be completely separated.

[0053] It should be noted that the cooperation mode between the fixed rod 16 and the sliding sleeve rod 15 can refer to the cooperation mode between the fixed sleeve 14 and the sliding sleeve rod 15 .

[0054] Specifically, the fixing rod 16 is disposed on a side of the supporting plate 17 close to an edge thereof, and the fixing rod 16 and the supporting plate 17 are fixed by welding.

[0055] Furthermore, the unloading unit 2 includes a cross frame 21 arranged inside the support frame 11, a sliding block 22 arranged inside the cross frame 21, a connecting member 23 linked to the sliding block 22, and a hinge seat 24 arranged on the surface of the supporting plate 17.

[0056] In this embodiment, the welding machine is fixed between the cross frame 21 and the support frame 11, and the cross frame 21 is arranged at the center of the support frame 11; a through sliding groove is opened on the surface of the cross frame 21; and the sliding block 22 slides inside the cross frame 21.

[0057] The sliding block 22 and the connecting member 23 are linked to each other, and the sliding block 22 can drive the connecting member 23 to move when it moves in the vertical direction. The sliding block 22 can drive the connecting member 23 to move in two motion states when it moves in the vertical direction.

[0058] The sliding block 22 moves in the vertical direction and can drive the connecting member 23 to move in the vertical direction, and then the sliding block 22 continues to move to drive the connecting member 23 to move along an inclined track, so that the connecting member 23 can move along a certain arc track.

[0059] The hinge seat 24 is welded and fixed to the supporting plate 17, and the hinge seat 24 is located in the center of the supporting plate 17. The hinge seat 24 is close to the middle position of the supporting plate 17 to ensure that the sliding block 22 moves in the vertical direction and can push the supporting plate 17 to move in the vertical direction.

[0060] The articulated seat 24 and the connecting member 23 are hinged and rotated; when the connecting member 23 moves along the arc trajectory, it can drive the articulated seat 24 to move, and then cooperate with the linkage between the rotating shaft 13 and the fixed rod 16, so as to drive the supporting plate 17 to flip a certain angle; thereby, the silicon wafer located on the surface of the supporting plate 17 can be transported.

[0061] In summary, the present invention utilizes the linkage mechanism between the connecting member and the sliding block to realize the effective transportation of silicon wafers; when the sliding block moves in the vertical direction, it drives the connecting member to move up and down synchronously, so that the supporting plate connected to the connecting member protrudes from the surface of the conveyor belt; as the sliding block moves further, the connecting member moves along a preset arc trajectory, so that the supporting plate can be flipped at a certain angle, and unqualified silicon wafers can be smoothly transported out of the production line; and this device can adopt a single control unit to realize the transportation of silicon wafers, which can not only simplify the production line structure, reduce hardware investment and maintenance costs, but also improve space utilization and production efficiency.

[0062] Example 2

[0063] Reference Figures 1 to 6 , which is the second embodiment of the present invention, and is different from the first embodiment in that: it also includes: a rotating shaft 13 connected to a fixed sleeve 14; the fixed sleeve 14 includes a waist hole 141 opened on its side wall; the sliding sleeve rod 15 includes a guide rod 151 set on its side wall; the waist hole 141 is adapted to the guide rod 151, and the waist hole 141 passes through the guide rod 151 and extends to the outside thereof.

[0064] In this embodiment, there are two groups of shaft sleeves 12 , which are symmetrically arranged on both sides of the support frame 11 ; and there is one group of rotating shafts 13 , which passes through the two groups of shaft sleeves 12 and extends outward.

[0065] There are two sets of fixing sleeves 14 , which are sleeved on the outside of the rotating shaft 13 and connected to the rotating shaft 13 via bolts. The two sets of fixing sleeves 14 are symmetrically arranged at both ends of the rotating shaft 13 .

[0066] The number of the sliding sleeve rods 15 corresponds to the number of the fixed sleeves 14 , and the fixed sleeves 14 and the sliding sleeve rods 15 can slide relative to each other, ensuring that the fixed sleeves 14 and the sliding sleeve rods 15 will not be completely separated.

[0067] Specifically, a guide rod 151 is provided on the outside of the sliding sleeve rod 15, and a waist hole 141 is opened on the inner wall of the fixed sleeve 14; through the cooperation between the guide rod 151 and the waist hole 141, it is ensured that the fixed sleeve 14 and the sliding sleeve rod 15 can slide while not completely separating.

[0068] Furthermore, the fixed rod 16 is connected to the bearing plate 17; the fixed rod 16 is slidably connected to the sliding sleeve rod 15; the rotating shaft 13 is flipped along the axis of the sleeve 12, thereby enabling the angle of the bearing plate 17 to change.

[0069] In this embodiment, the number of fixed rods 16 corresponds to the number of sliding sleeve rods 15, and the two sets of fixed rods 16 are symmetrically arranged on both sides of the carrier plate 17. The linkage between the fixed sleeve 14 and the fixed rods 16 can provide good support for the carrier plate 17, thereby ensuring that the carrier plate 17 maintains a stable movement state during movement or flipping.

[0070] Specifically, the fixed sleeve 14 and the fixed rod 16 cooperate to form a two-stage telescopic mechanism, which can increase the distance between the supporting plate 17 and the rotating shaft 13, thereby ensuring that the rotating shaft 13 and the supporting plate 17 always maintain a linked state during the flipping process of the supporting plate 17.

[0071] Furthermore, the cross frame 21 is connected to the support frame 11 ; the cross frame 21 includes a through hole 211 extending through the surface thereof; the sliding block 22 is adapted to the through hole 211 , and the outer wall of the sliding block 22 is in contact with the inner wall of the through hole 211 .

[0072] In this embodiment, the cross frame 21 and the support frame 11 are fixed by bolt connection, and the cross frame 21 is installed at the center of the support frame 11.

[0073] The through hole 211 is opened at the center of the horizontal frame 21 , and the through hole 211 is adapted to the sliding block 22 . The sliding block 22 can move back and forth in the vertical direction along the inner wall of the through hole 211 .

[0074] Specifically, the inner wall of the through hole 211 contacts the outer wall of the sliding block 22 , and the sliding block 22 is limited by the through hole 211 so that the sliding block 22 can move in the vertical direction.

[0075] Furthermore, the connecting member 23 includes a hinge plate 231 and a connecting plate 232 arranged at the end of the hinge plate 231; the sliding block 22 includes a groove 221 opened therein and a guide rail 222 opened on the side wall of the sliding block 22; the connecting plate 232 is adapted to the guide rail 222, and the connecting plate 232 passes through the guide rail 222 and extends outward.

[0076] In this embodiment, the hinge plate 231 includes a head and a rod; and the connecting plate 232 is welded and fixed to the rod; the head of the hinge plate 231 is connected to the hinge seat 24; the groove 221 is located in the center position of the sliding block 22, and the guide rail 222 passes through the side wall of the sliding block 22, and the guide rail 222 and the groove 221 are connected.

[0077] The rod portion of the hinge plate 231 is located inside the groove 221 , and the groove 221 provides corresponding movement space for the movement of the rod portion of the hinge plate 231 .

[0078] The connecting plate 232 passes through the guide rail 222 and extends outward, and the connecting plate 232 is configured to slide inside the guide rail 222 .

[0079] Furthermore, the end of the hinge plate 231 protrudes from the surface of the sliding block 22 ; the hinge plate 231 is hinged to the hinge seat 24 .

[0080] Specifically, the hinge plate 231 is hinged and rotated with the hinge seat 24 , and the head of the hinge plate 231 is positioned to protrude from the surface of the sliding block 22 , so that there is enough space for the hinge plate 231 to be connected with the hinge seat 24 .

[0081] Furthermore, the connecting member 23 further includes guide posts 233 provided at both ends of the connecting plate 232 ; the guide posts 233 protrude from the side wall of the sliding block 22 ; a displacement groove 212 is formed on the side wall of the through hole 211 ; and the guide posts 233 are adapted to the displacement groove 212 .

[0082] It should be noted that the guide posts 233 are arranged at both ends of the connecting plate 232, and the guide posts 233 pass through the guide rail 222 and extend to its outside; the guide posts 233 are adapted to the displacement groove 212, and the guide posts 233 can move along the track inside the displacement groove 212. The movement track of the hinge plate 231 can be limited by the cooperation between the guide posts 233 and the displacement groove 212.

[0083] Furthermore, the displacement slot 212 includes a vertical portion 2121 ; the sliding block 22 moves along the inner wall of the through hole 211 , and the guide post 233 moves along the inside of the vertical portion 2121 , thereby pushing the supporting plate 17 to move along the vertical direction.

[0084] It should be noted that the displacement groove 212 includes a vertical portion 2121. When the guide column 233 slides inside the vertical portion 2121, the sliding block 22 moves along the inner wall of the through hole 211. At this time, the guide column 233 slides along the inside of the vertical portion 2121; thereby, the sliding block 22 moves in the vertical direction, which can drive the connecting member 23 to move in the vertical direction; and then, it can drive the supporting plate 17 connected to the connecting member 23 and the hinge seat 24 to move; so that the supporting plate 17 can move a certain distance in the vertical direction.

[0085] Furthermore, 212 further includes an inclined portion 2122 ; the sliding block 22 moves along the inner wall of the through hole 211 , and the guide post 233 moves along the inside of the inclined portion 2122 , thereby being able to push the supporting plate 17 to flip to a certain angle.

[0086] It should be noted that the vertical portion 2121 further has an inclined portion 2122 near the upper portion, and the vertical portion 2121 and the inclined portion 2122 are connected; and there is a certain angle between the vertical portion 2121 and the inclined portion 2122, and the angle is greater than 90 degrees;

[0087] When the guide post 233 moves to the top position along the vertical portion 2121, the sliding block 22 continues to move along the through hole 211; at this time, the guide post 233 moves to the inner side of the inclined portion 2122. As the sliding block 22 moves upward, the connecting member 23 is subjected to an upward extrusion force, and since the inclined portion 2122 is an inclined structure, the guide post 233 is squeezed by the inner wall of the inclined portion 2122 during the movement, so that the guide post 233 is subjected to a horizontal force, so that the connecting plate 232 can move along the track inside the guide rail 222.

[0088] Specifically, the hinge plate 231 is subjected to the upward force of the sliding block 22 to move upward, and at the same time is subjected to the reverse force of the inner wall of the inclined portion 2122 to enable the hinge plate 231 to move in the horizontal direction, thereby making the movement trajectory of the hinge plate 231 arc-shaped; and the hinge plate 231 is hinged to the hinge seat 24, and the hinge plate 231 can drive the hinge seat 24 to move along its movement trajectory during the movement. When the hinge seat 24 moves, it can also drive the supporting plate 17 connected to it to move, thereby causing the supporting plate 17 to flip along the axial direction of the rotating shaft 13.

[0089] When in use, when the inspection equipment detects unqualified silicon wafers, the control system is used to transport the silicon wafers to the surface of the carrier plate 17; the carrying plate 17 can then be pushed by the actuator to move, so that the carrying plate 17 moves a certain distance and then flips over to send the defective silicon wafers out of the production line; specifically, the sliding block 22 is pushed to move along the inner wall of the through hole 211, so that the sliding block 22 moves in the vertical direction. At this time, the guide post 233 is located inside the vertical portion 2121, and the cooperation between the guide post 233 and the vertical portion 2121 makes the connecting member 23 and the sliding block 22 move synchronously; as the connecting member 23 continues to move, the carrying plate 17 is subjected to an upward force, and as the carrying plate 17 moves, the fixed rod 16 and the sliding sleeve rod 15 can be driven to slide relative to each other, so that the distance between the fixed rod 16 and the sliding sleeve rod 15 increases; then the carrying plate 17 can be lifted to a certain height in the vertical direction; and then the sliding When the sliding block 22 continues to move along the inner wall of the through hole 211, the guide post 233 moves to the inside of the inclined portion 2122; through the cooperation between the guide post 233 and the inclined portion 2122, when the sliding block 22 continues to move upward, the guide post 233 is squeezed by the inner wall of the inclined portion 2122, so that the height of the hinge plate 231 is increased, and the connecting plate 232 slides along the inner wall of the guide rail 222; in this state, the movement trajectory of the hinge plate 231 is an arc structure; and the hinge plate 231 is hinged to the hinge seat 24, so that the hinge seat 24 drives the carrying plate 17 to move along the movement trajectory of the hinge plate 231; and the carrying plate 17 flips along the axial direction of the rotating shaft 13. When the carrying plate 17 flips, it can drive the cooperation between the fixing rod 16 and the fixing sleeve 14 to gradually increase, so that the telescopic member is in an open state; then the carrying plate 17 flips to transport the silicon wafer placed on its surface.

[0090] In summary, by cooperating with the connecting member 23 and the sliding block 22 with the displacement groove 212, the carrier plate 17 can be driven to flip after the upward movement angle, so that the silicon wafer can be efficiently transported out of the production line. By using a single actuator, the working process is more efficient and faster, which can save costs to a certain extent.

[0091] Example 3

[0092] Reference Figures 1 to 3 and Figure 6 The third embodiment of the present invention is different from the first two embodiments in that it includes a driving unit 3 , the output end of the driving unit 3 is connected to the sliding block 22 ; and a transmission unit 4 , the driving unit 3 is installed inside the transmission unit 4 .

[0093] In this embodiment, the transmission unit 4 uses a rotating wheel to drive a conveyor belt to transport silicon wafers; the transmission unit 4 is installed on the silicon wafer production line, and a corresponding silicon wafer detection unit M is installed on the production line; the silicon wafer detection unit M can quickly identify defective or unqualified silicon wafers.

[0094] It should be noted that the output end of the drive unit 3 is connected to the sliding block 22; the drive unit 3 adopts a pneumatic telescopic rod, and its output end can push the sliding block 22 to move along the inner wall of the through hole 211 in the vertical direction, thereby achieving the purpose of first moving the supporting plate 17 upward in the vertical direction, and then flipping the supporting plate 17 along the axis of the rotating shaft 13.

[0095] Specifically, a large number of displacement sensors and control elements are installed on the silicon wafer, and their cooperation can ensure efficient and stable movement of the silicon wafer.

[0096] Under normal conditions, the height of the carrier plate 17 is lower than the surface of the transmission unit 4 , so that the silicon wafers will not be disturbed by the carrier plate 17 during transportation, thereby ensuring efficient and stable transportation of the silicon wafers.

[0097] When it is necessary to push unqualified silicon wafers out of the production line, the drive unit 3 can control the carrier plate 17 to move a certain distance in the vertical direction so that the carrier plate 17 can protrude from the surface of the transmission unit 4, and then as the output end of the drive unit 3 continues to move, the carrier plate 17 is flipped along the axial direction of the rotating shaft 13, so that the silicon wafer can be transported to the outside of the production line.

[0098] When a defective silicon wafer is detected, the output end of drive unit 3 connects to slide block 22. Using a pneumatic telescopic rod, slide block 22 is pushed vertically, causing carrier plate 17 to first move upward and then flip along the axis of shaft 13, thereby removing the defective silicon wafer from the production line. This mechanism ensures that even during the transport of silicon wafers, carrier plate 17 does not interfere with the normal conveying process, ensuring efficient and stable silicon wafer transportation.

[0099] It is important to note that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the preferred embodiments, those skilled in the art should understand that the technical solutions of the present invention may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should all be included in the scope of the claims of the present invention.

Claims

1. A sorting mechanism of a silicon wafer sorting machine, characterized by: include, A support unit (1) comprises a support frame (11), a shaft sleeve (12) arranged on an end surface of the support frame (11), a rotating shaft (13) arranged on the inner side of the shaft sleeve (12), a fixed sleeve (14) arranged on the outer wall of the rotating shaft (13), a sliding sleeve rod (15) arranged inside the fixed sleeve (14), a fixed rod (16) arranged on the inner side of the sliding sleeve rod (15), and a bearing plate (17) arranged at the end of the fixed rod (16); A discharge unit (2) includes a cross frame (21) disposed inside the support frame (11), a sliding block (22) disposed inside the cross frame (21), a connecting member (23) linked to the sliding block (22), and a hinge seat (24) disposed on the surface of the carrier plate (17); The cross frame (21) is connected to the support frame (11); The cross frame (21) includes a through hole (211) penetrating its surface; The sliding block (22) is adapted to the through hole (211), and the outer wall of the sliding block (22) is in conflict with the inner wall of the through hole (211); The connecting member (23) comprises a hinge plate (231) and a connecting plate (232) arranged at the end of the hinge plate (231); The sliding block (22) includes a groove (221) formed inside the sliding block, and a guide rail (222) formed on a side wall of the sliding block (22); The connecting plate (232) is adapted to the guide rail (222), and the connecting plate (232) passes through the guide rail (222) and extends outward; The end of the hinge plate (231) protrudes from the surface of the sliding block (22); The hinge plate (231) is hinged to the hinge seat (24); The connecting member (23) further includes guide pillars (233) provided at both ends of the connecting plate (232); The guide column (233) protrudes from the side wall of the sliding block (22); A displacement groove (212) is provided on the side wall of the through hole (211); The guide column (233) is adapted to the displacement groove (212); The displacement groove (212) includes a vertical portion (2121); The sliding block (22) moves along the inner wall of the through hole (211), and the guide column (233) moves along the inside of the vertical portion (2121), thereby pushing the supporting plate (17) to move along the vertical direction; The displacement groove (212) further includes an inclined portion (2122); The sliding block (22) moves along the inner wall of the through hole (211), and the guide column (233) moves along the inside of the inclined portion (2122), thereby being able to push the supporting plate (17) to flip at a certain angle.

2. The sorting mechanism of the silicon wafer sorting machine according to claim 1, wherein: The rotating shaft (13) is connected to the fixing sleeve (14); The fixing sleeve (14) includes a waist hole (141) formed on a side wall thereof; The sliding sleeve rod (15) includes a guide rod (151) arranged on a side wall thereof; The waist hole (141) is adapted to the guide rod (151), and the waist hole (141) passes through the guide rod (151) and extends to the outside thereof; The fixed sleeve (14) is slidably connected to the sliding sleeve rod (15).

3. The sorting mechanism of the silicon wafer sorting machine according to claim 1 or 2, wherein: The fixing rod (16) is connected to the bearing plate (17); The fixed rod (16) is slidably connected to the sliding sleeve rod (15); The rotating shaft (13) flips along the axis of the shaft sleeve (12), thereby enabling the angle of the supporting plate (17) to change.

4. The sorting mechanism of the silicon wafer sorting machine according to claim 3, wherein: Also includes, A drive unit (3), wherein an output end of the drive unit (3) is connected to the sliding block (22); A transmission unit (4), wherein the driving unit (3) is installed inside the transmission unit (4).

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