Wafer polishing and cleaning device and wafer processing method

Abstract

The invention discloses a wafer grinding and cleaning device and a wafer processing method. The wafer grinding and cleaning device comprises a processing shell, a grinding disc assembly, a cleaning assembly, a first rotating assembly and a second rotating assembly. A processing cavity is formed in the processing shell, and a wafer processing position is arranged in the processing cavity; the rotating end of the first rotating assembly is connected with the grinding disc assembly and is arranged below the wafer processing station; the rotating end of the second rotating assembly is connected with the grinding disc assembly, the cleaning assembly and the first rotating assembly, the grinding disc assembly and the cleaning assembly are arranged on the two sides of the wafer machining station, and the grinding disc assembly and the cleaning assembly can move around the wafer machining station in a surrounding mode in cooperation with the second rotating assembly. The precise processing and instant cleaning of the wafer edge are realized; wherein the millstone assembly is driven by the first rotating assembly, and the millstone assembly is used for machining the edge of the wafer. Through the arrangement, interference caused by bit precision and heat influence can be reduced, so that the edge processing quality of the wafer is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a wafer polishing and cleaning device and a wafer processing method. Background Art

[0002] With the continuous development of semiconductor processing equipment technology, the manufacturing accuracy and stability requirements of integrated circuits and high-performance electronic devices are also continuously improving; in the specific semiconductor manufacturing process, wafer edge processing is one of the important process steps, which affects the subsequent parameters of the wafer, such as mechanical strength, the yield of subsequent processes, etc.

[0003] Common wafer edge processing solutions include fixed grinding disc processing, robotic arm processing, etc. Fixed grinding disc processing is to fix the grinding disc on the equipment, and the wafer rotates around the grinding disc to complete the edge processing. It relies on the position control and speed control of the wafer. Once the position, speed and other parameters are offset, it will cause uneven wafer edge processing, resulting in reduced wafer quality; robotic arm processing fixes the wafer on the first robotic arm and installs the grinding disc on the second robotic arm. The dual robotic arms achieve precise positioning between the wafer and the grinding disc, but the motor on the robotic arm affects the processing environment. Once the motor is not completely cooled, its heat will affect the wafer, resulting in reduced wafer quality.

[0004] It can be seen that the wafer edge processing scheme in the prior art is limited by positioning accuracy and thermal influence factors, and it is difficult to further improve the edge processing quality of the wafer. Summary of the invention

[0005] The purpose of the present invention is to provide a wafer polishing and cleaning device and a wafer processing method to solve the technical problem that the wafer edge processing scheme in the prior art is limited by positioning accuracy and thermal influence factors, making it difficult to further improve the edge processing quality of the wafer.

[0006] To achieve this object, the present invention adopts the following technical solutions: A wafer polishing and cleaning device, comprising: A processing shell, wherein a processing cavity is formed in the processing shell, and a wafer processing position is arranged in the processing cavity; A grinding disc assembly, wherein the grinding disc assembly is arranged at one side of the wafer processing position along a horizontal direction; A cleaning component, the cleaning component is arranged on the other side of the wafer processing position along the horizontal direction; A first rotating assembly, wherein a rotating end of the first rotating assembly is connected to the grinding disc assembly and is disposed below the wafer processing position; A second rotating assembly, wherein the rotating ends of the second rotating assembly are respectively connected to the grinding disc assembly, the cleaning assembly and the first rotating assembly, and are used to drive the grinding disc assembly and the cleaning assembly to rotate around the wafer processing position; A moving assembly, the moving assembly comprising a lifting part that can move horizontally and rise and fall; A wafer fixing device, installed on the lifting part, for fixing the wafer; A positioning device is used to position the lifting part and the grinding disc assembly.

[0007] Optionally, the moving component includes: A horizontal moving device, the horizontal moving device comprising a moving part disposed above the wafer processing position and capable of moving in a horizontal direction; The lifting device comprises a lifting part which is arranged on the moving part and can move along the direction of gravity.

[0008] Optionally, the positioning device comprises a first positioning post and a second positioning post arranged on the rotating end of the second rotating assembly, and the wafer processing position is arranged between the first positioning post and the second positioning post; and the first positioning post and the second positioning post are both provided with positioning grooves; The positioning device further comprises a first positioning block and a second positioning block which are arranged on the lifting part, wherein the first positioning block is arranged corresponding to the positioning groove of the first positioning column, and the second positioning block is arranged corresponding to the positioning groove of the second positioning column; When the wafer on the wafer fixing device is moved to the wafer processing position by the lifting part, the first positioning block is inserted into the positioning groove of the first positioning column, and the second positioning block is inserted into the positioning groove of the second positioning column.

[0009] Optionally, the wafer fixing device comprises a fixing bracket arranged on the lifting part, and a suction cup unit for fixing the wafer is installed on the fixing bracket; The outer ring of the fixed bracket is provided with a bearing unit, and the outer ring of the bearing unit is fixedly connected to the first positioning block and the second positioning block respectively through a connecting ring.

[0010] Optionally, the rotating end of the second rotating component can rotate between a first position and a second position; when the rotating end of the second rotating component is at the first position, the first positioning post and the second positioning post are located on the moving path of the moving part; when the rotating end of the second rotating component is at the second position, the first positioning post is located on one side of the moving path of the moving part, and the second positioning post is located on the other side of the moving path of the moving part; The grinding disc assembly is installed on the first positioning column, and the cleaning assembly is installed on the second positioning column; the positioning device also includes a visual positioning unit installed on the first positioning column, and the visual positioning unit is used to position the suction cup unit.

[0011] Optionally, the first rotating assembly includes a first motor, a connecting rod and a connecting frame, the connecting rod is fixedly connected to the rotating end of the first motor, and the connecting frame is installed on the connecting rod; the first positioning column is installed at one end of the connecting frame, and the second positioning column is installed at the other end of the connecting frame.

[0012] Optionally, a mounting groove is provided at the end of the connecting rod connected to the connecting frame, and the second rotating assembly includes a second motor installed in the mounting groove and a gear box arranged on the connecting frame; the second motor drives the grinding disc assembly to rotate through the gear box.

[0013] Optionally, a recovery chamber is provided below the processing chamber; in the recovery chamber, a filtering assembly and a transport assembly are provided in sequence below the first rotating assembly, the filtering assembly is used to discharge waste, and the transport assembly is used to move the waste to a recovery tank.

[0014] A wafer processing method, applied to the wafer polishing and cleaning device as described above, comprises: Positioning the wafer at a wafer processing station; The grinding disc assembly is driven to rotate by the second rotating device, the grinding disc assembly is driven to rotate around the wafer processing position by the first rotating device, and the cleaning liquid is sprayed by the cleaning assembly.

[0015] A wafer processing method, applied to the wafer polishing and cleaning device as described above, comprises: Positioning the rotating end of the second rotating component at a second position; Moving the moving part of the horizontal moving device until the visual positioning device detects the suction cup unit, so that the rotating end of the second rotating component is located at the first position; The lifting device drives the lifting part to descend, so that the first positioning block is inserted into the positioning groove of the first positioning column, and the second positioning block is inserted into the positioning groove of the second positioning column, and the wafer is positioned at the wafer processing position; The grinding disc assembly is driven to rotate by the second rotating device, the grinding disc assembly is driven to rotate around the wafer processing position by the first rotating device, and the cleaning liquid is sprayed by the cleaning assembly.

[0016] Compared with the prior art, the present invention has the following beneficial effects: The wafer grinding and cleaning device and wafer processing method provided by the present invention arrange the grinding disc assembly and the cleaning assembly on both sides of the wafer processing position, cooperate with the second rotating assembly, so that the grinding disc assembly and the cleaning assembly can perform a circular motion around the wafer processing position, thereby realizing the precise processing and instant cleaning of the wafer edge; wherein, the grinding disc assembly is driven by the first rotating assembly, and the grinding disc assembly processes the wafer edge. Firstly, through the above-mentioned setting, it is only necessary to ensure that the center of the wafer passes through the rotation axis of the first rotating assembly, that is, to ensure the positioning accuracy between the wafer and the grinding disc assembly, so as to avoid the uneven phenomenon of wafer edge processing, thereby ensuring the processing quality of the wafer edge, and the positioning difficulty of this method is low; secondly, the cleaning assembly sprays the cleaning liquid to the wafer processing position, and the cleaning liquid flows from top to bottom, passing through the wafer processing position and the above-mentioned rotating device, on the one hand, completing the cleaning, and on the other hand, taking away the heat generated during the processing, reducing the influence of heat on the processing of the wafer. Therefore, the present wafer grinding and cleaning device and wafer processing method reduce the interference caused by the positioning accuracy and thermal influence, and further improve the edge processing quality of the wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0018] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention.

[0019] Figure 1 A schematic diagram of the overall structure of a wafer polishing and cleaning device provided in an embodiment of the present invention; Figure 2 A schematic diagram of a first partial structure of a wafer polishing and cleaning device provided in an embodiment of the present invention; Figure 3 A schematic diagram of a second partial structure of the wafer polishing and cleaning device provided in an embodiment of the present invention; Figure 4 for Figure 3 A schematic diagram of the local enlarged structure at point A; Illustrations: 100, processing housing; 101, processing chamber; 102, wafer processing position; 103, recovery chamber; 200, grinding disc assembly; 300, cleaning assembly; 400, first rotating assembly; 410, connecting rod; 420, connecting frame; 500, second rotating assembly; 510, gear box; 600, horizontal moving device; 610, moving part; 700, wafer fixing device; 710, fixing bracket; 720, suction cup unit; 730, bearing unit; 800, positioning device; 810, first positioning column; 820, second positioning column; 830, first positioning block; 840, second positioning block; 850, connecting ring; 860, visual positioning unit; 910, filtering assembly; 920, transport assembly. DETAILED DESCRIPTION

[0020] In order to make the purpose, features and advantages of the present invention more obvious and easy to understand, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the embodiments described below are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] In the description of the present invention, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention. It should be noted that when a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0022] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0023] Embodiment 1: The wafer polishing and cleaning device provided in this embodiment is suitable for scenarios of polishing and cleaning wafers, and is particularly suitable for scenarios of polishing the edges of wafers. In this embodiment, the wafer polishing and cleaning device is improved to reduce the interference caused by positioning accuracy and thermal effects, and improve the edge processing quality of the wafer. It also has the advantages of stable and compact structure.

[0024] like Figures 1 to 4As shown, a wafer polishing and cleaning device in this embodiment includes a processing shell 100, a grinding wheel assembly 200, a cleaning assembly 300, a first rotating assembly 400 and a second rotating assembly 500; a processing cavity 101 is formed in the processing shell 100, and a wafer processing position 102 is arranged in the processing cavity 101; the grinding wheel assembly 200 is arranged on one side of the wafer processing position 102 in a horizontal direction; the cleaning assembly 300 is arranged on the other side of the wafer processing position 102 in a horizontal direction, which can improve the stability of the center of gravity; the rotating end of the first rotating assembly 400 is connected to the grinding wheel assembly 200 and is arranged below the wafer processing position 102; the rotating ends of the second rotating assembly 500 are respectively connected to the grinding wheel assembly 200, the cleaning assembly 300 and the first rotating assembly 400, and are used to drive the grinding wheel assembly 200 and the cleaning assembly 300 to rotate around the wafer processing position 102. The grinding wheel assembly 200 is used for grinding the wafer on the wafer processing position 102, and the cleaning assembly 300 is used for spraying cleaning liquid on the wafer.

[0025] Specifically, the wafer polishing and cleaning device in this embodiment arranges the grinding wheel assembly 200 and the cleaning assembly 300 on both sides of the wafer processing position 102, and cooperates with the second rotating assembly 500 to enable the grinding wheel assembly 200 and the cleaning assembly 300 to perform a circular motion around the wafer processing position 102, thereby realizing precise processing and instant cleaning of the wafer edge; wherein, the grinding wheel assembly 200 is driven by the first rotating assembly 400, and the grinding wheel assembly 200 processes the wafer edge. First, through the above arrangement, it is only necessary to ensure that the center of the wafer passes through the axis of rotation of the first rotating assembly 400. The axis of rotation refers to the center line of rotation corresponding to the grinding wheel assembly 200 rotating around the center of the wafer, that is, to ensure the positioning accuracy between the wafer and the grinding wheel assembly 200, so as to avoid uneven processing of the wafer edge, thereby ensuring the processing quality of the wafer edge. This method has low positioning difficulty; secondly, the cleaning assembly 300 sprays cleaning liquid to the wafer processing position 102, and the cleaning liquid flows from top to bottom, passing through the wafer processing position 102 and the above rotating device. On the one hand, cleaning is completed, and on the other hand, it can take away the heat generated during the processing and reduce the influence of heat on the processing of the wafer. Therefore, the present wafer grinding and cleaning device reduces the interference caused by positioning accuracy and thermal influence, and further improves the edge processing quality of the wafer.

[0026] Furthermore, the wafer polishing and cleaning device also includes a moving component, a wafer fixing device 700 and a positioning device 800, and the moving component includes a lifting part that can move horizontally and lift. Among them, the moving component includes a horizontal moving device 600 and a lifting device. In addition, as other optional embodiments, the moving component can also use a structure similar to a three-axis robot arm that can move the wafer fixing device 700. The horizontal moving device 600 includes a moving part 610 that is arranged above the wafer processing position 102 and can move in the horizontal direction; wherein, the horizontal moving device 600 can adopt a slide rail structure in conjunction with a walking motor, so that the moving part 610 can move from the wafer loading position to the top of the wafer processing position 102, and then move to the wafer unloading position. The lifting device includes a lifting part which is arranged on the moving part 610 and can move along the direction of gravity, and a wafer fixing device 700 which is installed on the lifting part and is used to fix the wafer; the lifting device can control the up and down movement of the wafer fixing device 700 through an electric lifting drive or a pneumatic telescopic rod, so that the wafer on the wafer fixing device 700 can be moved to the wafer processing position 102; and the positioning device 800 is used to position the lifting part and the grinding wheel assembly 200, so as to ensure that the wafer is accurately moved to the wafer processing position 102 so as to be polished by the grinding wheel assembly 200.

[0027] In this embodiment, the positioning device 800 includes a first positioning column 810 and a second positioning column 820 arranged on the rotating end of the second rotating component 500, and the wafer processing position 102 is arranged between the first positioning column 810 and the second positioning column 820; the first positioning column 810 and the second positioning column 820 are both provided with positioning grooves; the positioning device 800 also includes a first positioning block 830 and a second positioning block 840 arranged on the lifting part, the first positioning block 830 corresponds to the positioning groove of the first positioning column 810, and the second positioning block 840 corresponds to the positioning groove of the second positioning column 820; when the wafer on the wafer fixing device 700 is moved to the wafer processing position 102 by the lifting part, the first positioning block 830 is inserted into the positioning groove of the first positioning column 810, and the second positioning block 840 is inserted into the positioning groove of the second positioning column 820.

[0028] The positioning device 800 includes two positioning columns, which are respectively arranged at the rotating ends of the second rotating assembly 500, and the wafer processing position 102 is arranged between the two positioning columns; positioning grooves are respectively provided on the two positioning columns to provide space for installation and connection of subsequent positioning blocks, and the setting of the positioning grooves can ensure the accuracy of the positioning blocks when plugged in, thereby further improving the stability of the wafer during processing. Next, the first positioning block 830 and the second positioning block 840 of the positioning device 800 are respectively arranged on the lifting part and correspond to the positioning grooves on the positioning columns. Whenever the wafer fixing device 700 moves to the wafer processing position 102 through the lifting part, the first positioning block 830 will be plugged into the positioning groove of the first positioning column 810, and the second positioning block 840 will be plugged into the positioning groove of the second positioning column 820, ensuring that the position of the wafer is fixed during processing, effectively avoiding slight deviation of the wafer, improving processing accuracy, and reducing the requirements for positioning accuracy. Through the above-mentioned positioning structure, the accuracy of the positioning device 800 is significantly improved, which can effectively reduce the processing errors caused by inaccurate wafer position, especially under high-precision processing requirements, and can ensure the flatness and consistency of the wafer edge, making the entire processing process more efficient and stable.

[0029] More specifically, the wafer fixing device 700 includes a fixing bracket 710 disposed on the lifting part, and a suction cup unit 720 for fixing the wafer is installed on the fixing bracket 710; a bearing unit 730 is disposed on the outer ring of the fixing bracket 710, and the outer ring of the bearing unit 730 is fixedly connected to the first positioning block 830 and the second positioning block 840 respectively through a connecting ring 850. The connecting ring 850 is provided with a matching groove corresponding to the outer ring of the bearing unit 730, and the matching groove is interference-fitted with the outer ring, so that when the positioning block rotates with the first rotating assembly 400, the inner ring can cooperate with the fixing bracket 710 to prevent the grinding disc assembly 200 from being offset during the turnover.

[0030] In this embodiment, the wafer fixing device 700 provides fixed support for the wafer through the fixed bracket 710 arranged on the lifting part, and the suction cup unit 720 firmly fixes the wafer on the fixed bracket 710 through suction. The design of the connecting ring 850, through cooperation with the bearing unit 730, enables the rotation of the positioning column to be transmitted to the positioning block, thereby avoiding inaccurate positioning due to vibration or offset; the fixed connection between the connecting ring 850 and the bearing unit 730 enables the positioning device 800 to be connected between the first rotating component 400 and the lifting component, that is, between the first rotating component 400 and the gantry of the horizontal moving device 600, thereby improving the overall stability and smoothness of movement, and further improving the positioning accuracy and working efficiency of the device.

[0031] On the basis of the above-mentioned embodiment, the first rotating assembly 400 includes a first motor (not shown), a connecting rod 410 and a connecting frame 420. The connecting rod 410 is fixedly connected to the rotating end of the first motor, and the connecting frame 420 is installed on the connecting rod 410; the first positioning column 810 is installed at one end of the connecting frame 420, and the second positioning column 820 is installed at the other end of the connecting frame 420. The end where the connecting rod 410 and the connecting frame 420 are connected is provided with a mounting groove, and the second rotating assembly 500 includes a second motor (not shown) installed in the mounting groove and a gear box 510 arranged on the connecting frame 420; the second motor drives the grinding disc assembly 200 to rotate through the gear box 510.

[0032] It is understandable that the first motor can drive the connecting rod 410, and then drive the positioning device 800, the grinding disc assembly 200 and the cleaning assembly 300 to rotate around the wafer processing position 102 through the connecting frame 420; and the fixed part of the second motor is embedded in the installation groove of the connecting rod 410, and cooperates with the gear box 510 on the connecting frame 420 to drive the grinding disc assembly 200 to rotate; the above structure can not only integrate the various components tightly and reduce the space occupied, but also effectively reduce the weight and volume of the equipment, making the layout of the entire device more compact; more importantly, this compact design ensures the efficient operation of the equipment while facilitating heat dissipation. Since the positions of the first motor and the second motor are arranged along the direction of gravity, the phenomenon of heat accumulation is avoided, and it is also convenient to use the cleaning fluid to flow downward along the connecting rod 410 to take away the heat, reducing the influence of high temperature on the wafer grinding process, and further improving the processing accuracy and stability.

[0033] On the basis of the above-mentioned embodiment, the rotating end of the second rotating component 500 can rotate between a first position and a second position; when the rotating end of the second rotating component 500 is located at the first position, the first positioning column 810 and the second positioning column 820 are located on the moving path of the moving part 610; when the rotating end of the second rotating component 500 is located at the second position, the first positioning column 810 is located on one side of the moving path of the moving part 610, and the second positioning column 820 is located on the other side of the moving path of the moving part 610; the grinding disc assembly 200 is installed on the first positioning column 810, and the cleaning assembly 300 is installed on the second positioning column 820; the positioning device 800 also includes a visual positioning unit 860 installed on the first positioning column 810, and the visual positioning unit 860 is used to position the suction cup unit 720. Among them, the visual positioning unit 860 includes but is not limited to a camera, a grayscale sensor, etc., which can preliminarily identify the position of the suction cup unit 720 and play the role of initial positioning. Combined with the guiding role of the subsequent positioning groove, it can ensure that the center of the wafer coincides with the rotation axis of the first rotating component 400, so that the grinding wheel assembly 200 can make a circular motion around the center of the wafer.

[0034] The second rotating assembly 500 in the present invention is designed to be able to rotate between at least the first position and the second position, so that the first positioning column 810 and the second positioning column 820 can adjust their positions as needed during the wafer processing process. Specifically, when the rotating end of the second rotating assembly 500 is located at the second position, the first positioning column 810 and the second positioning column 820 are cleverly offset to one side of the moving path to ensure that the moving part 610 can pass smoothly without obstruction. When the rotating end of the second rotating assembly 500 is located at the first position, the first positioning column 810 and the second positioning column 820 can match the positioning block to provide positioning and guiding functions for the descent of the wafer fixing device 700. Not only does it enhance the flexibility of the device, but it also optimizes space utilization, allowing the components to be arranged more compactly, thereby improving the stability and reliability of the equipment.

[0035] Furthermore, a recovery chamber 103 is provided below the processing chamber 101; in the recovery chamber 103, a filter assembly 910 and a transport assembly 920 are provided in sequence below the first rotating assembly 400, the filter assembly 910 is used to discharge waste, and the transport assembly 920 is used to move the waste to the recovery tank.

[0036] Embodiment 2: This embodiment also provides a wafer processing method, which is applied to the wafer polishing and cleaning device in the first embodiment, comprising: S11, positioning the wafer at the wafer processing position 102; S12, the grinding wheel assembly 200 is driven to rotate by the second rotating device, the grinding wheel assembly 200 is driven to rotate around the wafer processing position 102 by the first rotating device, and the cleaning liquid is sprayed by the cleaning assembly 300.

[0037] Further, the wafer processing method includes: S21, positioning the rotating end of the second rotating assembly 500 at a second position; S22, moving the moving part 610 of the horizontal moving device 600 until the visual positioning device 800 detects the suction cup unit 720, so that the rotating end of the second rotating component 500 is located at the first position; S23, driving the lifting part to descend through the lifting device, so that the first positioning block 830 is inserted into the positioning groove of the first positioning column 810, and the second positioning block 840 is inserted into the positioning groove of the second positioning column 820, and the wafer is positioned at the wafer processing position 102; S24, the grinding wheel assembly 200 is driven to rotate by the second rotating device, the grinding wheel assembly 200 is driven to rotate around the wafer processing position 102 by the first rotating device, and the cleaning liquid is sprayed by the cleaning assembly 300.

[0038] As described above, the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features thereof may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer polishing and cleaning device, characterized in that: include: A processing housing (100), wherein a processing cavity (101) is formed in the processing housing (100), and a wafer processing position (102) is arranged in the processing cavity (101); A grinding disc assembly (200), the grinding disc assembly (200) being arranged on one side of the wafer processing position (102) along a horizontal direction; a cleaning component (300), the cleaning component (300) being arranged on the other side of the wafer processing position (102) in a horizontal direction; A first rotating assembly (400), the rotating end of the first rotating assembly (400) being connected to the grinding wheel assembly (200) and being arranged below the wafer processing position (102); a second rotating assembly (500), wherein a rotating end of the second rotating assembly (500) is respectively connected to the grinding disc assembly (200), the cleaning assembly (300) and the first rotating assembly (400), and is used to drive the grinding disc assembly (200) and the cleaning assembly (300) to rotate around the wafer processing position (102); A moving assembly, the moving assembly comprising a lifting part that can move horizontally and rise and fall; A wafer fixing device (700), installed on the lifting part and used for fixing the wafer; A positioning device (800) is used to position the lifting portion and the grinding disc assembly (200).

2. A wafer polishing and cleaning device according to claim 1, characterized in that: The mobile assembly comprises: A horizontal moving device (600), the horizontal moving device (600) comprising a moving part (610) arranged above the wafer processing position (102) and capable of moving in a horizontal direction; A lifting device, comprising a lifting part which is arranged on the moving part (610) and can move along the direction of gravity.

3. A wafer polishing and cleaning device according to claim 2, characterized in that: The positioning device (800) comprises a first positioning column (810) and a second positioning column (820) which are arranged on the rotating end of the second rotating component (500); the wafer processing position (102) is arranged between the first positioning column (810) and the second positioning column (820); the first positioning column (810) and the second positioning column (820) are both provided with positioning grooves; The positioning device (800) further comprises a first positioning block (830) and a second positioning block (840) arranged on the lifting portion, wherein the first positioning block (830) is arranged corresponding to the positioning groove of the first positioning column (810), and the second positioning block (840) is arranged corresponding to the positioning groove of the second positioning column (820); When the wafer on the wafer fixing device (700) is moved to the wafer processing position (102) by the lifting part, the first positioning block (830) is inserted into the positioning groove of the first positioning column (810), and the second positioning block (840) is inserted into the positioning groove of the second positioning column (820).

4. The wafer polishing and cleaning device according to claim 3, characterized in that: The wafer fixing device (700) comprises a fixing bracket (710) arranged on the lifting part, and a suction cup unit (720) for fixing the wafer is installed on the fixing bracket (710); The outer ring of the fixed bracket (710) is provided with a bearing unit (730), and the outer ring of the bearing unit (730) is fixedly connected to the first positioning block (830) and the second positioning block (840) respectively through a connecting ring (850).

5. The wafer polishing and cleaning device according to claim 4, characterized in that: The rotating end of the second rotating component (500) is capable of rotating between a first position and a second position; when the rotating end of the second rotating component (500) is located at the first position, the first positioning column (810) and the second positioning column (820) are located on a moving path of the moving part (610); when the rotating end of the second rotating component (500) is located at the second position, the first positioning column (810) is located on one side of the moving path of the moving part (610), and the second positioning column (820) is located on the other side of the moving path of the moving part (610); The grinding disc assembly (200) is mounted on the first positioning column (810), and the cleaning assembly (300) is mounted on the second positioning column (820); the positioning device (800) further comprises a visual positioning unit (860) mounted on the first positioning column (810), and the visual positioning unit (860) is used to position the suction cup unit (720).

6. The wafer polishing and cleaning device according to claim 4, characterized in that: The first rotating assembly (400) comprises a first motor, a connecting rod (410) and a connecting frame (420); the connecting rod (410) is fixedly connected to the rotating end of the first motor, and the connecting frame (420) is mounted on the connecting rod (410); the first positioning column (810) is mounted on one end of the connecting frame (420), and the second positioning column (820) is mounted on the other end of the connecting frame (420).

7. The wafer polishing and cleaning device according to claim 6, characterized in that: An installation slot is provided at the end of the connecting rod (410) connected to the connecting frame (420); the second rotating assembly (500) comprises a second motor installed in the installation slot and a gear box (510) arranged on the connecting frame (420); the second motor drives the grinding disc assembly (200) to rotate via the gear box (510).

8. The wafer polishing and cleaning device according to claim 1, characterized in that: A recovery chamber (103) is arranged below the processing chamber (101); in the recovery chamber (103), a filtering assembly (910) and a transport assembly (920) are arranged in sequence below the first rotating assembly (400); the filtering assembly (910) is used to discharge waste, and the transport assembly (920) is used to move the waste to a recovery tank.

9. A wafer processing method, characterized in that: The device for polishing and cleaning a wafer as claimed in any one of claims 1 to 8 comprises: Positioning the wafer at a wafer processing station; The grinding disc assembly is driven to rotate by the second rotating device, the grinding disc assembly is driven to rotate around the wafer processing position by the first rotating device, and the cleaning liquid is sprayed by the cleaning assembly.

10. A wafer processing method, characterized in that: Applied to the wafer polishing and cleaning device as claimed in claim 5, comprising: Positioning the rotating end of the second rotating component at a second position; Moving the moving part of the horizontal moving device until the visual positioning device detects the suction cup unit, so that the rotating end of the second rotating component is located at the first position; The lifting device drives the lifting part to descend, so that the first positioning block is inserted into the positioning groove of the first positioning column, and the second positioning block is inserted into the positioning groove of the second positioning column, and the wafer is positioned at the wafer processing position; The grinding disc assembly is driven to rotate by the second rotating device, the grinding disc assembly is driven to rotate around the wafer processing position by the first rotating device, and the cleaning liquid is sprayed by the cleaning assembly.

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