A crystal rod rounding processing apparatus and a crystal rod rounding processing method

Abstract

This disclosure provides a crystal ingot rounding processing apparatus and method. The apparatus includes a crystal ingot tail clamping assembly and a crystal ingot tail rounding assembly. The crystal ingot tail rounding assembly includes: a grinding unit with a rotatable grinding wheel; a measuring unit with its measuring end facing the crystal ingot for measuring the distance from the measuring end to the surface of the crystal ingot; a moving unit on which both the grinding unit and the measuring unit are mounted, the moving unit driving the grinding unit and the measuring unit to move axially and radially along the crystal ingot; a control unit for determining the tail grinding starting point based on the distance data measured by the measuring unit; controlling the moving unit to move the grinding unit to the tail grinding starting point, and causing the grinding wheel to move radially along the crystal ingot to a preset position; controlling the moving unit to drive the grinding wheel to move axially and radially along the crystal ingot, and controlling the rotation of the grinding wheel to round the tail of the crystal ingot. The crystal ingot rounding processing apparatus and method provided by this disclosure can round the tail of a crystal ingot.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing technology, and in particular to a crystal rod rounding processing apparatus and a crystal rod rounding processing method. Background Technology

[0002] In semiconductor manufacturing, sampling and testing of ingots are necessary to ensure crystal quality. Some of these tests require wafers to be taken from the tail of the ingot. However, current rounding machines can only round the ingot body, leaving the tail untouched. When testing of the tail is required, wafers must be taken from the ingot body, resulting in reduced yield. Summary of the Invention

[0003] To address at least one of the technical problems in the prior art, this disclosure provides a crystal rod rounding processing apparatus and a crystal rod rounding processing method.

[0004] The technical solutions provided in this disclosure are as follows:

[0005] In a first aspect, embodiments of this disclosure provide a crystal ingot rounding processing apparatus, including a crystal ingot tail clamping assembly and a crystal ingot tail rounding assembly; the crystal ingot tail rounding assembly includes:

[0006] The grinding unit includes a rotatable grinding wheel;

[0007] A measuring unit, wherein the measuring end of the measuring unit faces the crystal rod, and is used to measure the distance from the measuring end to the surface of the crystal rod;

[0008] A moving unit is disposed on the crystal rod tail clamping assembly. Both the grinding unit and the measuring unit are disposed on the moving unit. The moving unit is configured to drive the grinding unit and the measuring unit to move along the axial direction and radial direction of the crystal rod.

[0009] The control unit is connected to the moving unit, the grinding unit, and the measuring unit, respectively.

[0010] The control unit is used for:

[0011] The starting point for tail grinding is determined based on the distance data measured by the measuring unit.

[0012] The moving unit is controlled to move the grinding unit to the grinding start point at the tail, and the grinding wheel is moved radially along the crystal rod to a preset position;

[0013] The moving unit is controlled to drive the grinding wheel to move along the axial and radial directions of the crystal rod, and the grinding wheel is controlled to rotate, so as to perform rounding processing on the tail of the crystal rod.

[0014] For example, the moving unit includes:

[0015] The first connection platform is located on the crystal rod tail clamping assembly;

[0016] The first moving mechanism disposed on the first connecting platform includes a first lead screw, a first driving member and a second connecting platform. The first lead screw extends along the axial direction of the crystal rod, and the second connecting platform is movable along the first lead screw under the drive of the first driving member.

[0017] A second moving mechanism is provided on the first connecting platform. The second moving mechanism includes a second lead screw, a second driving member, and a third connecting platform. The second lead screw extends radially along the crystal rod, and the third connecting platform is movable along the second lead screw under the drive of the second driving member.

[0018] Both the grinding unit and the measuring unit are mounted on the third connecting platform.

[0019] For example, the grinding unit further includes a third driving member, a driving wheel, a driven wheel, and a transmission belt, wherein the transmission belt is drivingly connected between the driving wheel and the driven wheel, the driving wheel is rotatable under the drive of the third driving member, and the grinding wheel is drivingly connected to the driven wheel.

[0020] For example, the control unit is specifically used for:

[0021] The moving unit is controlled to move the measuring unit along the crystal rod axis between a first axial position corresponding to the tail of the crystal rod and a second axial position corresponding to the body of the crystal rod.

[0022] Based on the distance data obtained by the measuring unit during its movement between the first axial position and the second axial position, a correspondence between the distance data and the axial position of the crystal rod is obtained, wherein, in the correspondence, the distance difference in the corresponding distance data from the first position point to the second axial position is within a threshold value;

[0023] The first position point is determined as the starting point of the tail grinding.

[0024] For example, the control unit is further configured to:

[0025] Record the first travel distance of the moving unit along the axial direction of the crystal rod when the grinding unit is at the tail grinding starting point;

[0026] Based on the first travel distance and the distance between the measuring unit and the grinding unit along the axial direction of the crystal rod, determine the second travel distance of the moving unit when the grinding unit is at the tail grinding starting point;

[0027] Based on the second travel distance, the moving unit is controlled to drive the grinding unit to the tail grinding starting point, and the grinding wheel is moved radially along the crystal rod to a preset position.

[0028] For example, the control unit is further configured to:

[0029] When the moving unit drives the grinding unit to the grinding start point at the tail end, and the grinding wheel moves radially along the crystal rod to a preset position, the grinding wheel is controlled to rotate. Based on the first preset travel distance, the moving unit drives the grinding unit to move a distance axially along the crystal rod to control the axial grinding length at the tail end of the crystal rod. Based on the second preset travel distance, the moving unit drives the grinding unit to move a distance radially along the crystal rod to control the grinding diameter at the tail end of the crystal rod.

[0030] Secondly, this disclosure also provides a method for crystal ingot rounding, applied to the crystal ingot rounding apparatus described above, the method comprising:

[0031] The starting point for tail grinding is determined based on the distance data measured by the measuring unit.

[0032] The moving unit is controlled to move the grinding unit to the grinding start point at the tail, and the grinding wheel is moved radially along the crystal rod to a preset position;

[0033] The moving unit is controlled to drive the grinding wheel to move along the axial and radial directions of the crystal rod, and the grinding wheel is controlled to rotate, so as to perform rounding processing on the tail of the crystal rod.

[0034] For example, determining the tail grinding starting point based on the distance data measured by the measuring unit specifically includes:

[0035] The moving unit is controlled to move the measuring unit along the crystal rod axis between a first axial position corresponding to the tail of the crystal rod and a second axial position corresponding to the body of the crystal rod.

[0036] Based on the distance data obtained by the measuring unit during its movement between the first axial position and the second axial position, a correspondence between the distance data and the axial position of the crystal rod is obtained, wherein the distance difference in the distance data corresponding to the first position point to the second axial position is within a threshold value in the correspondence.

[0037] The first position point is determined as the starting point of the tail grinding.

[0038] For example, controlling the moving unit to move the grinding unit to the grinding start point at the tail end, and causing the grinding wheel to move radially along the crystal rod to a preset position, specifically includes:

[0039] Record the first travel distance of the moving unit along the axial direction of the crystal rod when the grinding unit is at the tail grinding starting point;

[0040] Based on the first travel distance and the distance between the measuring unit and the grinding unit along the axial direction of the crystal rod, determine the second travel distance of the moving unit when the grinding unit is at the tail grinding starting point;

[0041] Based on the second travel distance, the moving unit is controlled to drive the grinding unit to the tail grinding starting point, and the grinding wheel is moved radially along the crystal rod to a preset position.

[0042] For example, the control of the moving unit drives the grinding wheel to move along the axial and radial directions of the crystal rod, and controls the grinding wheel to rotate, so as to perform rounding processing on the tail of the crystal rod, specifically including:

[0043] The grinding wheel is controlled to rotate, and according to a first preset travel distance, the moving unit is controlled to drive the grinding unit to move the crystal rod axially a certain distance, so as to control the axial grinding length of the crystal rod tail; according to a second preset travel distance, the moving unit is controlled to drive the grinding unit to move the crystal rod radially a certain distance, so as to control the grinding diameter of the crystal rod tail.

[0044] The beneficial effects of the embodiments disclosed herein are as follows:

[0045] In the crystal rod rounding processing apparatus and method provided in this disclosure, a crystal rod tail rounding component is provided on the crystal rod tail clamping assembly to perform rounding processing on the crystal rod tail. The crystal rod tail rounding component includes a grinding unit, a moving unit, a measuring unit, and a control unit. The moving unit can drive the grinding unit and the measuring unit to move along the axial and radial directions of the crystal rod. The measuring unit can measure the distance from its measuring end to the surface of the crystal rod. The control unit can determine the grinding start point of the crystal rod tail based on the distance data measured by the measuring unit. The grinding unit can move to the grinding start point of the tail under the drive of the moving unit to perform rounding processing on the crystal rod.

[0046] Thus, based on the crystal rod rounding processing apparatus and method provided in this disclosure, the measuring unit can measure and determine the starting point position of the tail grinding of the crystal rod, and control the moving unit to move the grinding unit to the tail grinding starting point, and make the grinding wheel move radially along the crystal rod to a preset position; control the moving unit to drive the grinding wheel to move along the axial and radial directions of the crystal rod, and control the grinding wheel to rotate, so as to perform rounding processing on the tail of the crystal rod, thereby processing the tail of the crystal rod into a cylindrical shape of equal diameter. In the tail testing project of the crystal rod, wafers can be directly taken from the tail of the crystal rod, improving measurement accuracy and reducing production yield loss. Attached Figure Description

[0047] Figure 1 This is a front view of the structure of the crystal rod rounding processing apparatus provided in the embodiments of this disclosure;

[0048] Figure 2 express Figure 1 A bottom view. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0050] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0051] The features such as "parallel," "perpendicular," and "identical" used in the embodiments of this disclosure include features in the strict sense of "parallel," "perpendicular," and "identical," as well as cases where "approximately parallel," "approximately perpendicular," and "approximately identical" include certain tolerances. Taking into account the measurement and the tolerances associated with the measurement of a specific quantity (e.g., limitations of the measurement system), they represent the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of said value.

[0052] Furthermore, throughout this document, unless otherwise defined, the terms “substantially,” “essentially,” “approximately,” and “about” are used to describe and explain small variations. When used with an event or situation, these terms can cover situations where the event or situation occurs precisely or approximately. For example, when used with a numerical value, these terms can include a range of variation of the numerical value less than or equal to 10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term “substantially coplanar” can refer to two surfaces arranged along the same plane within a micrometer range, for example, within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm.

[0053] In semiconductor processing, since the current rounding machine can only round the main body of the crystal ingot, but not the tail of the crystal ingot, in projects that test the tail of the crystal ingot, the wafer can only be taken from the main body of the crystal ingot, which will result in a loss of yield.

[0054] In current crystal ingot rounding processing equipment, the tail of the crystal ingot is held by a crystal ingot tail clamping assembly. The tail of the crystal ingot is partially embedded in the crystal ingot tail clamping assembly. To round the tail of the crystal ingot, the portion of the tail that is not embedded in the crystal ingot tail clamping assembly needs to be rounded, so that the tail of the crystal ingot is processed into a cylindrical shape of equal diameter, and then the wafer is picked up from the tail to complete the tail testing.

[0055] However, since the tail of the crystal rod is irregular and the length and diameter of the tail portion that is not embedded in the crystal rod tail clamping assembly are unknown, if the tail of the crystal rod is to be processed, it is necessary to confirm the grinding starting point position of the crystal rod tail in order to determine the feed point of the grinding wheel.

[0056] Based on this, the present disclosure provides a crystal rod rounding processing apparatus and a crystal rod rounding processing method, which can achieve the purpose of rounding the tail of the crystal rod, so as to facilitate the removal of wafers from the tail of the crystal rod, complete the crystal rod tail testing items, and reduce yield loss.

[0057] like Figure 1 and Figure 2 As shown, the crystal rod rounding processing apparatus provided in this embodiment includes a crystal rod tail clamping assembly 10 and a crystal rod tail rounding assembly disposed on the crystal rod tail clamping assembly 10.

[0058] The crystal rod tail clamping assembly 10 is used to clamp the tail of the crystal rod 1, and the crystal rod tail rounding assembly is used to round the tail of the crystal rod 1.

[0059] The crystal rod tail rounding assembly includes:

[0060] The grinding unit 210 includes a rotatable grinding wheel 211;

[0061] Measurement unit 220, the measuring end of the measurement unit 220 facing the crystal rod 1, is used to measure the distance from the measuring end to the surface of the crystal rod 1;

[0062] A moving unit 230 is disposed on the crystal rod tail clamping assembly 10. The grinding unit 210 and the measuring unit 220 are both disposed on the moving unit 230. The moving unit 230 is configured to move the grinding unit 210 and the measuring unit 220 along the axial direction X and radial direction Y of the crystal rod 1.

[0063] The control unit (not shown in the figure) is connected to the moving unit 230, the grinding unit 210 and the measuring unit 220 respectively;

[0064] The control unit is used for:

[0065] The starting point for tail grinding is determined based on the distance data measured by the measuring unit 220.

[0066] The moving unit 230 is controlled to drive the grinding unit 210 to the grinding start point at the tail, and the grinding wheel 211 is moved along the radial Y of the crystal rod 1 to a preset position;

[0067] The moving unit 230 is controlled to drive the grinding wheel 211 to move along the axial direction X and radial direction Y of the crystal rod 1, and the grinding wheel 211 is controlled to rotate to perform rounding processing on the tail of the crystal rod 1.

[0068] In the above scheme, by setting the crystal rod tail rounding assembly on the crystal rod tail clamping assembly 10, the tail of the crystal rod 1 can be rounded. The crystal rod tail rounding assembly includes a grinding unit 210, a moving unit 230, a measuring unit 220 and a control unit. The moving unit 230 can drive the grinding unit 210 and the measuring unit 220 to move along the axial direction X and radial direction Y of the crystal rod 1. The measuring unit 220 can measure the distance from its measuring end to the surface of the crystal rod 1. The control unit can determine the grinding start point of the tail of the crystal rod 1 based on the distance data measured by the measuring unit 220. The grinding unit 210 can move to the grinding start point of the tail under the drive of the moving unit 230 to perform rounding processing on the crystal rod 1.

[0069] Thus, based on the crystal rod rounding processing apparatus provided in this embodiment, the measuring unit 220 can measure and determine the starting point position of the tail grinding of the crystal rod 1, and control the moving unit 230 to drive the grinding unit 210 to move to the tail grinding starting point, and cause the grinding wheel 211 to move along the radial Y of the crystal rod 1 to a preset position; control the moving unit 230 to drive the grinding wheel 211 to move along the axial X and radial Y of the crystal rod 1, and control the grinding wheel 211 to rotate, so as to perform rounding processing on the tail of the crystal rod 1, thereby processing the tail of the crystal rod 1 into a cylindrical shape of equal diameter. In the tail testing project of the crystal rod 1, wafers can be directly taken from the tail of the crystal rod 1, improving measurement accuracy and reducing production yield loss.

[0070] In some embodiments, such as Figure 1 and Figure 2 As shown, the moving unit 230 includes:

[0071] The first connecting platform 231 is disposed on the crystal rod tail clamping assembly 10;

[0072] The first moving mechanism 232, which is provided on the first connecting platform 231, includes a first lead screw 2321, a first driving member 2322 and a second connecting platform 2323. The first lead screw 2321 extends along the axial direction X of the crystal rod 1, and the second connecting platform 2323 is movable along the first lead screw 2321 under the drive of the first driving member 2322.

[0073] A second moving mechanism 233 is provided on the first connecting platform 231. The second moving mechanism 233 includes a second lead screw 2331, a second driving member 2332 and a third connecting platform 2333. The second lead screw 2331 extends radially Y along the crystal rod 1. The third connecting platform 2333 is movable along the second lead screw 2331 under the drive of the second driving member 2332.

[0074] The grinding unit 210 and the measuring unit 220 are both mounted on the third connecting platform 2333.

[0075] In the above scheme, the first moving mechanism 232 can realize the purpose of the grinding unit 210 and the measuring unit 220 moving along the X axis of the crystal rod 1, and the second moving mechanism 233 can realize the purpose of the grinding unit 210 and the measuring unit 220 moving along the Y axis of the crystal rod 1.

[0076] Specifically, the first connecting platform 231 serves as a support platform, primarily responsible for the connection with the crystal rod tail clamping assembly 10, and for providing an extension platform for the first lead screw 2321.

[0077] The first driving component 2322 can be implemented by a servo motor or the like, and the first lead screw 2321 can be implemented by a lead screw or the like. The first driving component 2322 drives the first lead screw to rotate so that the second connecting platform 2323 connected to the first lead screw 2321 moves along the first lead screw 2321, that is, moves along the axial direction X of the crystal rod 1.

[0078] The second driving component 2332 can be implemented by a servo motor or the like, and the second lead screw 2331 can be implemented by a lead screw or the like. The second driving component 2332 drives the second lead screw to rotate so that the third connecting platform 2333 connected to the second lead screw 2331 moves along the second lead screw 2331, that is, moves along the radial Y direction of the crystal rod 1.

[0079] Since both the measuring unit 220 and the grinding unit 210 are mounted on the third connecting platform 2333, the movement of the measuring unit 220 and the grinding unit 210 along the axial direction X of the crystal rod 1 can be controlled by controlling the working state of the first driving member 2322, and the movement of the measuring unit 220 and the grinding unit 210 along the radial direction Y of the crystal rod 1 can be controlled by controlling the working state of the second driving member 2332.

[0080] It should be noted that the above is only an example of the structure of the moving unit 230, and the implementation of the moving unit 230 is not limited to this.

[0081] Furthermore, in some embodiments, such as Figure 1 and Figure 2As shown, the grinding unit 210 further includes a third driving member 212, a driving wheel 213, a driven wheel 214, and a transmission belt 215. The transmission belt 215 is driven between the driving wheel 213 and the driven wheel 214. The driving wheel 213 is rotatable under the drive of the third driving member 212. The grinding wheel 211 is driven by the driven wheel 214.

[0082] Using the above scheme, the third driving component 212 drives the driving wheel 213 to rotate, thereby driving the transmission belt 215 to rotate. The transmission belt 215 drives the driven wheel 214 to rotate, thus realizing the rotation of the grinding wheel 211. Using the transmission belt 215 to drive the grinding wheel 211 provides smooth transmission during operation, reduces vibration and noise, simplifies maintenance, increases transmission efficiency, and ensures transmission accuracy. However, it is understood that in other embodiments, the specific structure of the grinding unit 210 is not limited to this.

[0083] In addition, in some embodiments, the measuring unit 220 may be a distance sensor.

[0084] A distance sensor is a component used to measure the distance between an object and the sensor. Distance sensors can be categorized into various types, such as non-contact distance sensors, including ultrasonic sensors, laser sensors, infrared sensors, electromagnetic wave sensors, optical sensors, and capacitive sensors.

[0085] Laser sensors calculate distance by emitting a laser beam and measuring the time it takes for the laser to reflect back. The linear propagation characteristic of laser beams makes them highly accurate for long-distance measurements. Infrared sensors determine distance by emitting infrared light and measuring the intensity or time of the reflected light. Ultrasonic sensors emit high-frequency sound waves (ultrasound), which reflect back when they encounter an obstacle. The sensor receives the reflected wave and calculates the distance to the obstacle based on the sound wave's propagation time. Electromagnetic wave sensors use electromagnetic waves (such as microwaves) for distance measurement. The sensor emits electromagnetic waves, which reflect upon encountering an object; the sensor receives the reflected wave and calculates the distance. Optical sensors determine distance by measuring changes in light intensity or phase difference; optical sensors can use light sources such as lasers or LEDs. Capacitive sensors determine the distance to an object by measuring changes in capacitance. Capacitance changes as an object approaches. For example, in some embodiments, the distance sensors described in this disclosure can be any suitable sensor, such as a laser sensor or an infrared sensor.

[0086] Alternatively, the measuring unit 220 can also be a contact-type distance sensor. Contact-type distance sensors typically operate through physical contact or contact sensing. For example, mechanical contact distance sensors that rely on physical contact to measure distance, or electrical signal distance sensors that provide distance information through electrical signals.

[0087] In some exemplary embodiments, the control unit is specifically used for:

[0088] The moving unit 230 is controlled to drive the measuring unit 220 to move along the X-axis of the crystal rod 1 between a first axial position corresponding to the tail of the crystal rod 1 and a second axial position corresponding to the body of the crystal rod 1.

[0089] Based on the distance data obtained by the measuring unit 220 during its movement between the first axial position and the second axial position, the correspondence between the distance data and the axial X position of the crystal rod 1 is obtained, wherein, in the correspondence, the distance difference in the corresponding distance data from the first position point to the second axial position is within a threshold value;

[0090] The first position point is determined as the starting point of the tail grinding.

[0091] In the above scheme, when determining the tail grinding starting point through the measuring unit 220, the measuring unit 220 can be moved from the side where the tail of the crystal rod 1 is located to the side where the main body of the crystal rod 1 is located through the moving unit 230, that is, from the first axial position to the second axial position. During the above movement, the measuring unit 220 will acquire a series of distance data, which correspond to the axial X position of the crystal rod 1. Since the diameter of the tail of the crystal rod 1 gradually increases from the side away from the main body of the crystal rod 1 to the side closer to the main body of the crystal rod 1, and the main body of the crystal rod 1 has a constant diameter, therefore, in the above... During the movement, among the series of distance data acquired by the measuring unit 220, when the measuring unit 220 is at the tail of the crystal rod 1, the distance value gradually changes as the measuring unit 220 moves. After the measuring unit 220 reaches the main body of the crystal rod 1, the distance value remains unchanged as the measuring unit 220 moves (i.e., the distance difference is within the threshold). Therefore, the first axial X position point when the distance value remains unchanged can be found from the above series of distance data. This first axial X position point is the first position point, and the first position point is determined as the tail grinding starting point.

[0092] In some embodiments, exemplarily, the control unit is further configured to:

[0093] Record the first travel distance of the moving unit 230 in the X-axis of the crystal rod 1 when the grinding unit 210 is at the grinding start point at the tail end;

[0094] Based on the first travel distance and the distance between the measuring unit 220 and the grinding unit 210 along the X-axis of the crystal rod 1, the second travel distance corresponding to the moving unit 230 when the grinding unit 210 is at the tail grinding starting point is determined;

[0095] Based on the second travel distance, the moving unit 230 is controlled to move the grinding unit 210 to the tail grinding starting point, and the grinding wheel 211 is moved radially Y along the crystal rod 1 to a preset position.

[0096] In the above scheme, after determining the tail grinding starting point, the first travel distance of the moving unit 230 in the X-axis of the crystal rod 1 when the measuring unit 220 is at the tail grinding starting point can be recorded. Since the measuring unit 220 and the grinding unit 210 have a certain distance in the X-axis of the crystal rod 1, the second travel distance of the moving unit 230 when the grinding unit 210 is exactly at the tail grinding starting point can be determined according to the first travel distance and the distance.

[0097] Specifically, when the measuring unit 220 is at the tail grinding starting point, the first travel distance of the moving unit 230 along the axial direction X of the crystal rod 1 is X1. Taking the grinding unit 210 located on the side of the measuring unit 220 near the tail of the crystal rod 1 along the axial direction X of the crystal rod 1 as an example, the distance between the grinding unit 210 and the measuring unit 220 along the axial direction X of the crystal rod 1 is L. Therefore, when the grinding unit 210 is at the tail grinding starting point, the travel distance of the moving unit 230 along the axial direction X of the crystal rod 1 is determined to be a second travel distance X2, where X2 = X1 + L. Therefore, based on the second travel distance X2, the grinding unit 210 can be moved to the tail grinding starting point.

[0098] It should be noted that the distance between the grinding unit 210 and the measuring unit 220 along the axial direction X of the crystal rod 1 specifically refers to the distance between the contact point between the grinding wheel and the crystal rod 1 and the measuring unit 220 along the axial direction X of the crystal rod 1.

[0099] After the grinding unit 210 is moved to the tail grinding starting point, the moving unit 230 can be controlled by the control unit to move the grinding wheel 211 radially Y along the crystal rod 1 to a preset position. For example, the grinding wheel 211 can be moved radially Y along the crystal rod 1 to a position 2 mm away from the surface of the main body of the crystal rod 1. The preset position is not specifically limited.

[0100] Furthermore, in some exemplary embodiments, the control unit is specifically used for:

[0101] When the moving unit 230 drives the grinding unit 210 to the tail grinding starting point, and the grinding wheel 211 moves along the radial Y direction of the crystal rod 1 to a preset position, the grinding wheel 211 is controlled to rotate. According to the first preset travel distance, the moving unit 230 drives the grinding unit 210 to move a distance along the axial X direction of the crystal rod 1 to control the axial X grinding length of the tail of the crystal rod 1. According to the second preset travel distance, the moving unit 230 drives the grinding unit 210 to move a distance along the radial Y direction of the crystal rod 1 to control the grinding diameter of the tail of the crystal rod 1.

[0102] Using the above scheme, during the processing of the tail of the crystal rod 1 by the grinding wheel 211, the grinding length of the tail of the crystal rod 1 is controlled by controlling the distance the moving unit 230 drives the grinding unit 210 to move along the X-axis of the crystal rod 1, and the grinding diameter of the tail of the crystal rod 1 is controlled by controlling the distance the moving unit 230 drives the grinding unit 210 to move along the Y-axis of the crystal rod 1. After the tail of the crystal rod 1 is ground to the predetermined specification, the grinding unit 210 can be returned to the initial position by the moving unit 230.

[0103] Secondly, this disclosure also provides a method for crystal ingot rounding, which is applied to the crystal ingot rounding apparatus provided in this disclosure, the method comprising:

[0104] The starting point for tail grinding is determined based on the distance data measured by the measuring unit 220.

[0105] The moving unit 230 is controlled to drive the grinding unit 210 to the grinding start point at the tail, and the grinding wheel 211 is moved along the radial Y of the crystal rod 1 to a preset position;

[0106] The moving unit 230 is controlled to drive the grinding wheel 211 to move along the axial direction X and radial direction Y of the crystal rod 1, and the grinding wheel 211 is controlled to rotate to perform rounding processing on the tail of the crystal rod 1.

[0107] For example, determining the tail grinding starting point based on the distance data measured by the measuring unit 220 specifically includes:

[0108] The moving unit 230 is controlled to drive the measuring unit 220 to move along the X-axis of the crystal rod 1 between a first axial position corresponding to the tail of the crystal rod 1 and a second axial position corresponding to the body of the crystal rod 1.

[0109] Based on the distance data obtained by the measuring unit 220 during its movement between the first axial position and the second axial position, the correspondence between the distance data and the axial X position of the crystal rod 1 is obtained, wherein the distance difference in the distance data corresponding to the first position point to the second axial position is within a threshold value in the correspondence.

[0110] The first position point is determined as the starting point of the tail grinding.

[0111] For example, controlling the moving unit 230 to move the grinding unit 210 to the tail grinding starting point, and causing the grinding wheel 211 to move radially Y along the crystal rod 1 to a preset position, specifically includes:

[0112] Record the first travel distance of the moving unit 230 in the X-axis of the crystal rod 1 when the grinding unit 210 is at the grinding start point at the tail end;

[0113] Based on the first travel distance and the distance between the measuring unit 220 and the grinding unit 210 along the X-axis of the crystal rod 1, the second travel distance corresponding to the moving unit 230 when the grinding unit 210 is at the tail grinding starting point is determined;

[0114] Based on the second travel distance, the moving unit 230 is controlled to move the grinding unit 210 to the tail grinding starting point, and the grinding wheel 211 is moved radially Y along the crystal rod 1 to a preset position.

[0115] For example, the control unit 230 drives the grinding wheel 211 to move along the axial direction X and radial direction Y of the crystal rod 1, and controls the grinding wheel 211 to rotate, so as to perform rounding processing on the tail of the crystal rod 1, specifically including:

[0116] The grinding wheel 211 is controlled to rotate, and according to the first preset travel distance, the moving unit 230 is controlled to drive the grinding unit 210 to move the crystal rod 1 axially X by a distance, so as to control the axial X grinding length of the tail of the crystal rod 1; according to the second preset travel distance, the moving unit 230 is controlled to drive the grinding unit 210 to move the crystal rod 1 radially Y by a distance, so as to control the grinding diameter of the tail of the crystal rod 1.

[0117] Since the principle of the crystal rod rounding processing method is similar to that of the crystal rod rounding processing device described above, the embodiments of the crystal rod rounding processing method provided in this disclosure can refer to the embodiments of the crystal rod rounding processing device described above in this disclosure, and will not be repeated here.

[0118] Furthermore, this disclosure also provides an apparatus including a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the steps of the method described above. Because the above-described apparatus can implement the methods described above when its processor executes the computer program, it can similarly complete the wafer tail rounding process.

[0119] In one embodiment, this disclosure also provides a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the steps in the above method embodiments.

[0120] The aforementioned computer-readable storage medium, since the computer program stored in its memory is executed by a processor to implement the steps in the above method embodiments, can similarly automatically complete the wafer tail rounding process.

[0121] Those skilled in the art will understand that all or part of the processes in the methods of the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium, and when executed, it can include the processes of the embodiments of the methods described above. Any references to memory, storage, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, or optical storage, etc. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM), etc.

[0122] The following points need to be explained:

[0123] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0124] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0125] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0126] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A crystal rod rounding processing apparatus, characterized in that, It includes a crystal ingot tail clamping assembly and a crystal ingot tail rounding assembly; the crystal ingot tail rounding assembly includes: The grinding unit includes a rotatable grinding wheel; A measuring unit, wherein the measuring end of the measuring unit faces the crystal rod, and is used to measure the distance from the measuring end to the surface of the crystal rod; A moving unit is disposed on the crystal rod tail clamping assembly. Both the grinding unit and the measuring unit are disposed on the moving unit. The moving unit is configured to drive the grinding unit and the measuring unit to move along the axial direction and radial direction of the crystal rod. The control unit is connected to the moving unit, the grinding unit, and the measuring unit, respectively. The control unit is used for: The starting point for tail grinding is determined based on the distance data measured by the measuring unit. The moving unit is controlled to move the grinding unit to the grinding start point at the tail, and the grinding wheel is moved radially along the crystal rod to a preset position; The moving unit is controlled to drive the grinding wheel to move along the axial and radial directions of the crystal rod, and the grinding wheel is controlled to rotate, so as to perform rounding processing on the tail of the crystal rod; Specifically, the control unit is used for: The moving unit is controlled to move the measuring unit along the crystal rod axis between a first axial position corresponding to the tail of the crystal rod and a second axial position corresponding to the body of the crystal rod. Based on the distance data obtained by the measuring unit during its movement between the first axial position and the second axial position, a correspondence between the distance data and the axial position of the crystal rod is obtained, wherein, in the correspondence, the distance difference in the corresponding distance data from the first position point to the second axial position is within a threshold value; The first position point is determined as the starting point of the tail grinding.

2. The crystal rod rounding processing apparatus according to claim 1, characterized in that, The mobile unit includes: The first connection platform is located on the crystal rod tail clamping assembly; The first moving mechanism disposed on the first connecting platform includes a first lead screw, a first driving member and a second connecting platform. The first lead screw extends along the axial direction of the crystal rod, and the second connecting platform is movable along the first lead screw under the drive of the first driving member. A second moving mechanism is provided on the first connecting platform. The second moving mechanism includes a second lead screw, a second driving member, and a third connecting platform. The second lead screw extends radially along the crystal rod, and the third connecting platform is movable along the second lead screw under the drive of the second driving member. Both the grinding unit and the measuring unit are mounted on the third connecting platform.

3. The crystal rod rounding processing apparatus according to claim 1, characterized in that, The grinding unit also includes a third driving member, a driving wheel, a driven wheel, and a transmission belt, wherein the transmission belt is drivingly connected between the driving wheel and the driven wheel, the driving wheel is rotatable under the drive of the third driving member, and the grinding wheel is drivingly connected to the driven wheel.

4. The crystal rod rounding processing apparatus according to claim 1, characterized in that, The control unit is further specifically used for: Record the first travel distance of the moving unit along the axial direction of the crystal rod when the grinding unit is at the tail grinding starting point; Based on the first travel distance and the distance between the measuring unit and the grinding unit along the axial direction of the crystal rod, determine the second travel distance of the moving unit when the grinding unit is at the tail grinding starting point; Based on the second travel distance, the moving unit is controlled to drive the grinding unit to the tail grinding starting point, and the grinding wheel is moved radially along the crystal rod to a preset position.

5. The crystal rod rounding processing apparatus according to claim 1, characterized in that, The control unit is further specifically used for: When the moving unit drives the grinding unit to the grinding start point at the tail end, and the grinding wheel moves radially along the crystal rod to a preset position, the grinding wheel is controlled to rotate; according to the first preset travel distance, the moving unit drives the grinding unit to move a distance along the axial direction of the crystal rod to control the axial grinding length at the tail end of the crystal rod; according to the second preset travel distance, the moving unit drives the grinding unit to move a distance along the radial direction of the crystal rod to control the grinding diameter at the tail end of the crystal rod.

6. A method for rounding crystal rods, characterized in that, The method, applied to the crystal rod rounding apparatus as described in any one of claims 1 to 5, comprises: The starting point for tail grinding is determined based on the distance data measured by the measuring unit. The moving unit is controlled to move the grinding unit to the grinding start point at the tail, and the grinding wheel is moved radially along the crystal rod to a preset position; The moving unit is controlled to drive the grinding wheel to move along the axial and radial directions of the crystal rod, and the grinding wheel is controlled to rotate, so as to perform rounding processing on the tail of the crystal rod; Specifically, determining the tail grinding starting point based on the distance data measured by the measuring unit includes: The moving unit is controlled to move the measuring unit along the crystal rod axis between a first axial position corresponding to the tail of the crystal rod and a second axial position corresponding to the body of the crystal rod. Based on the distance data obtained by the measuring unit during its movement between the first axial position and the second axial position, a correspondence between the distance data and the axial position of the crystal rod is obtained, wherein the distance difference in the distance data corresponding to the first position point to the second axial position is within a threshold value in the correspondence. The first position point is determined as the starting point of the tail grinding.

7. The method for rounding crystal rods according to claim 6, characterized in that, The control of the moving unit to move the grinding unit to the grinding start point at the tail end, and to move the grinding wheel radially along the crystal rod to a preset position, specifically includes: Record the first travel distance of the moving unit along the axial direction of the crystal rod when the grinding unit is at the tail grinding starting point; Based on the first travel distance and the distance between the measuring unit and the grinding unit along the axial direction of the crystal rod, determine the second travel distance of the moving unit when the grinding unit is at the tail grinding starting point; Based on the second travel distance, the moving unit is controlled to drive the grinding unit to the tail grinding starting point, and the grinding wheel is moved radially along the crystal rod to a preset position.

8. The method for rounding crystal rods according to claim 6, characterized in that, The control unit drives the grinding wheel to move along the axial and radial directions of the crystal rod, and controls the grinding wheel to rotate, so as to perform rounding processing on the tail of the crystal rod, specifically including: The grinding wheel is controlled to rotate, and the moving unit is controlled to move the grinding unit along the axial direction of the crystal rod according to a first preset travel distance, so as to control the axial grinding length of the tail of the crystal rod; the moving unit is controlled to move the grinding unit along the radial direction of the crystal rod according to a second preset travel distance, so as to control the grinding diameter of the tail of the crystal rod.

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