Thermal management integrated module, thermal management integrated system and vehicle

Abstract

This invention provides a thermal management integrated module, a thermal management integrated system, and a vehicle, relating to the field of thermal management system technology. The thermal management integrated module includes: a base plate; a flow channel plate located on the base plate, with at least one of a high-pressure interface and a low-pressure interface on the base plate and the flow channel plate, the flow channel plate having a high-pressure refrigerant flow channel for high-pressure refrigerant; a heat exchange component connected to the flow channel plate through the high-pressure interface; and a jumper pipe connected to the heat exchange component through the low-pressure interface, the jumper pipe having a low-pressure refrigerant flow channel for low-pressure refrigerant. The low-pressure refrigerant flow channel and the high-pressure refrigerant flow channel are connected to form a heat exchange loop to perform heat exchange operations on the heat exchange component, solving the problem in the prior art where the refrigerant flow channels are all arranged on the flow channel plate, resulting in severe heat loss during operation.

Description

Technical Field

[0001] This invention relates to the field of thermal management system technology, and more specifically, to a thermal management integrated module, a thermal management integrated system, and a vehicle. Background Technology

[0002] With the application of air conditioning heat pump systems in new energy vehicles, the thermal management system has many components that are scattered, resulting in complex layout, difficulty in assembly, and low assembly efficiency. The emergence of thermal management integrated modules has solved the problem of scattered components. However, the refrigerant channels of current thermal management integrated modules are all arranged on the flow channel plate, and the temperature difference between the high and low pressure sides can reach 80°C. During operation, heat loss is serious, affecting the heat exchange effect. Moreover, the flow channel plates of current thermal management integrated modules are made of aluminum alloy, which is heavy. Summary of the Invention

[0003] The main objective of this invention is to provide a thermal management integrated module, a thermal management integrated system, and a vehicle to solve the problem that in the prior art, the refrigerant flow channels are all arranged on the flow channel plate, resulting in severe heat loss during operation.

[0004] To achieve the above objectives, according to one aspect of the present invention, a thermal management integrated module is provided. The thermal management integrated module includes: a substrate; a flow channel plate located on the substrate, the substrate and the flow channel plate having at least one of a high-pressure interface and a low-pressure interface, the flow channel plate having a high-pressure refrigerant flow channel for flowing high-pressure refrigerant; a heat exchange assembly communicating with the flow channel plate via the high-pressure interface; and a jumper, the heat exchange assembly communicating with the jumper via the low-pressure interface, the jumper having a low-pressure refrigerant flow channel for flowing low-pressure refrigerant, the low-pressure refrigerant flow channel communicating with the high-pressure refrigerant flow channel to form a heat exchange loop for heat exchange operations on the heat exchange assembly.

[0005] Furthermore, the high-pressure interface includes a first interface, which is disposed on the substrate and is used to connect to the exhaust port of the compressor, which is used to compress high-temperature and high-pressure gaseous refrigerant.

[0006] Further, the heat exchange assembly includes: a heat exchanger assembly connected to at least one of a high-pressure port and a low-pressure port, the heat exchanger assembly being located downstream of the compressor; a sensing assembly disposed on a flow channel plate and a jumper pipe, the sensing assembly being used to collect temperature and pressure within the high-pressure refrigerant flow channel, and the sensing assembly being used to collect temperature and pressure within the low-pressure refrigerant flow channel; and a valve assembly connected to the high-pressure port, at least a portion of the valve assembly being disposed at the boundary between the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel, the valve assembly being used to throttle the high-pressure refrigerant into low-pressure refrigerant.

[0007] Furthermore, the high-pressure interface also includes a second interface and a third interface arranged adjacent to each other. The heat exchanger assembly includes: a first condenser, which is located downstream of the compressor and is connected to the compressor's exhaust port; and a second condenser, which is located downstream of the first condenser, with its inlet connected to the second interface and its outlet connected to the third interface. The first and second condensers are used to condense the high-temperature, high-pressure gaseous refrigerant into a medium-low-temperature, high-pressure liquid refrigerant.

[0008] Furthermore, the valve assembly includes: a first electronic expansion valve, which is disposed on the flow channel plate and located between the first condenser and the second condenser.

[0009] Furthermore, the valve assembly also includes: a second electronic expansion valve, which is disposed on the flow channel plate and located downstream of the second condenser; and a third electronic expansion valve, which is disposed on the flow channel plate and located downstream of the second condenser. The medium-low temperature and high-pressure liquid refrigerant condensed by the second condenser is throttled into a low-temperature and low-pressure gas-liquid mixture refrigerant through the second electronic expansion valve and the third electronic expansion valve, respectively.

[0010] Furthermore, the low-pressure interface includes a fourth interface and a fifth interface, which are disposed on the flow channel plate. The fourth interface is disposed near the second electronic expansion valve. The heat exchanger assembly also includes an evaporator, which is disposed downstream of the second electronic expansion valve. The inlet of the evaporator is connected to the fourth interface, and the outlet of the evaporator is connected to the fifth interface. The low-temperature and low-pressure gas-liquid mixture refrigerant after being throttled by the second electronic expansion valve is evaporated into a low-temperature and low-pressure gaseous refrigerant through the evaporator.

[0011] Furthermore, the low-pressure interface also includes a sixth interface and a seventh interface, which are disposed on the substrate. The heat exchanger assembly also includes a refrigeration device, which is disposed downstream of the third electronic expansion valve. The inlet of the refrigeration device is connected to the sixth interface, and the outlet of the refrigeration device is connected to the seventh interface. The jumper includes a first jumper, the first end of which is connected to the third electronic expansion valve, and the second end of which is connected to the sixth interface. The low-temperature and low-pressure gas-liquid mixed refrigerant after being throttled by the third electronic expansion valve flows into the refrigeration device through the first jumper and evaporates into a low-temperature and low-pressure gaseous refrigerant.

[0012] Furthermore, the jumper includes: a second jumper, the first end of which is connected to the seventh interface; a third jumper, the first end of which is connected to the outlet of the evaporator, and the second end of which is connected to the second end of the second jumper; and a fourth jumper, the first end of which is connected to the second end of the third jumper and the second end of the second jumper, the second end of which is connected to the inlet of the gas-liquid separator, and the outlet of the gas-liquid separator is connected to the compressor inlet 8 of the compressor.

[0013] Furthermore, the sensing component includes: at least two temperature sensors, one temperature sensor disposed between the compressor and the first condenser, and the other temperature sensor disposed at the outlet of the evaporator; at least two high-pressure sensors, one high-pressure sensor disposed downstream of the first condenser, and the other high-pressure sensor disposed downstream of the second condenser; and a low-pressure sensor disposed downstream of the refrigeration equipment.

[0014] According to another aspect of the present invention, a thermal management integrated system is provided, including a thermal management integrated module, wherein the thermal management integrated module is the thermal management integrated module of the above embodiment.

[0015] According to another aspect of the present invention, a vehicle is provided, including a thermal management integrated system, wherein the thermal management integrated system is the thermal management integrated system of the above embodiment.

[0016] By applying the technical solution of the present invention, a flow channel plate and a jumper tube are provided on the substrate. The flow channel plate has a high-pressure refrigerant flow channel, and the jumper tube 40 has a low-pressure refrigerant flow channel. A heat exchange component is provided to throttle the high-pressure refrigerant into a low-pressure refrigerant, thereby separating the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel, reducing heat loss during refrigerant operation, and improving heat exchange efficiency. Attached Figure Description

[0017] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings:

[0018] Figure 1 A schematic diagram of the structure of a first embodiment of the thermal management integrated module according to the present invention is shown;

[0019] Figure 2 A schematic diagram of a second embodiment of the thermal management integrated module according to the present invention is shown;

[0020] Figure 3 A schematic diagram of a third embodiment of the thermal management integrated module according to the present invention is shown;

[0021] Figure 4 A schematic diagram of a fourth embodiment of the thermal management integrated module according to the present invention is shown;

[0022] Figure 5 A schematic diagram of a fifth embodiment of the thermal management integrated module according to the present invention is shown.

[0023] The above figures include the following reference numerals:

[0024] 10. Substrate;

[0025] 20. Flow channel plate;

[0026] 211. First interface; 212. Second interface; 213. Third interface; 214. Fourth interface; 215. Fifth interface; 216. Sixth interface; 217. Seventh interface; 218. Compressor inlet;

[0027] 30. Heat exchange components;

[0028] 31. Heat exchanger assembly; 311. First condenser; 312. Second condenser; 313. Evaporator; 314. Refrigeration equipment;

[0029] 32. Sensing component; 321. Temperature sensor; 322. High-voltage sensor; 323. Low-voltage sensor;

[0030] 33. Valve assembly; 331. First electronic expansion valve; 332. Second electronic expansion valve; 333. Third electronic expansion valve;

[0031] 40. Jump tube; 41. First jump tube; 42. Second jump tube; 43. Third jump tube; 44. Fourth jump tube;

[0032] 50. Compressor;

[0033] 60. Gas-liquid separator. Detailed Implementation

[0034] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0035] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.

[0036] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such terms can be used interchangeably where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0037] Exemplary embodiments according to this application will now be described in more detail with reference to the accompanying drawings. However, these exemplary embodiments may be implemented in many different forms and should not be construed as being limited to the embodiments set forth herein. It should be understood that these embodiments are provided so that the disclosure of this application is thorough and complete, and that the concept of these exemplary embodiments is fully conveyed to those skilled in the art. In the drawings, for clarity, the thickness of layers and regions may be exaggerated, and the same reference numerals are used to denote the same devices, and therefore their description will be omitted.

[0038] Combination Figures 1 to 5 As shown in the figure, a thermal management integrated module is provided according to a specific embodiment of the present invention.

[0039] Specifically, such as Figure 1 As shown, the thermal management integrated module includes: a base plate 10; a flow channel plate 20 located on the base plate 10, with at least one of a high-pressure interface and a low-pressure interface on the base plate 10 and the flow channel plate 20, and the flow channel plate 20 having a high-pressure refrigerant flow channel for high-pressure refrigerant; a heat exchange component 30 connected to the flow channel plate 20 through the high-pressure interface; and a jumper pipe 40 connected to the heat exchange component 30 through the low-pressure interface, the jumper pipe 40 having a low-pressure refrigerant flow channel for low-pressure refrigerant, the low-pressure refrigerant flow channel being connected to the high-pressure refrigerant flow channel to form a heat exchange loop for heat exchange operation of the heat exchange component 30.

[0040] In this embodiment, by setting a flow channel plate 20 and a jumper pipe 40 on the substrate, the flow channel plate 20 has a high-pressure refrigerant flow channel and the jumper pipe 40 has a low-pressure refrigerant flow channel, and setting a heat exchange component 30 to throttle the high-pressure refrigerant into low-pressure refrigerant, the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel are separated, reducing heat loss when the refrigerant is working and improving heat exchange efficiency.

[0041] Furthermore, the high-pressure interface includes a first interface 211, which is disposed on the substrate 10. The first interface 211 is used to connect to the exhaust port of the compressor 50, which is used to compress high-temperature, high-pressure gaseous refrigerant. The compressor 50 is an electric compressor.

[0042] Further, the heat exchange assembly 30 includes: a heat exchanger assembly 31, which is connected to at least one of a high-pressure port and a low-pressure port, and is located downstream of the compressor 50; a sensing assembly 32, which is disposed on the flow channel plate 20 and the jumper pipe 40, and is used to collect the temperature and pressure in the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel; and a valve assembly 33, which is connected to the high-pressure port, and at least part of the valve assembly 33 is disposed at the boundary between the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel, and is used to throttle the high-pressure refrigerant into low-pressure refrigerant.

[0043] Specifically, the heat exchanger assembly 31 is located downstream of the compressor 50, which helps to utilize the high-pressure heat energy generated by the compressor and improve the energy efficiency of the entire heat exchange system. The sensing assembly 32, located on the flow channel plate 20 and the jumper tube 40, can accurately monitor the temperature and pressure within the high-pressure and low-pressure refrigerant flow channels. This real-time monitoring helps control the system's operation, ensuring the refrigerant operates under optimal conditions. The valve assembly 33, connected to the high-pressure interface and located at the boundary between the high-pressure and low-pressure refrigerant flow channels, is used to throttle the high-pressure refrigerant to low-pressure refrigerant. This precise throttling control helps maintain refrigerant flow balance within the system and improves refrigeration efficiency. Through the coordinated operation of the sensing assembly 32 and the valve assembly 33, the pressure and temperature within the system can be adjusted in real time, thereby improving the system's stability and reliability.

[0044] Furthermore, the high-pressure interface also includes a second interface 212 and a third interface 213 arranged adjacent to each other. The heat exchanger assembly 31 includes: a first condenser 311, which is located downstream of the compressor 50 and is connected to the exhaust port of the compressor 50; and a second condenser 312, which is located downstream of the first condenser 311. The inlet of the second condenser 312 is connected to the second interface 212, and the outlet of the second condenser 312 is connected to the third interface 213. The first condenser 311 and the second condenser 312 are used to condense the high-temperature and high-pressure gaseous refrigerant into a medium-low temperature and high-pressure liquid refrigerant.

[0045] Specifically, by using two condensers, multi-stage condensation of the high-temperature, high-pressure gaseous refrigerant can be achieved, improving condensation efficiency and enabling the refrigerant to more stably transform into a medium-low temperature, high-pressure liquid state. The first and second condensers can be controlled independently, adjusting their respective operating states according to actual needs to achieve more precise temperature control. During the condensation process, as the refrigerant temperature decreases, its pressure also decreases accordingly, helping to reduce pressure loss in the system and improve the overall system efficiency.

[0046] Furthermore, the valve assembly 33 includes a first electronic expansion valve 331, which is disposed on the flow channel plate 20 and located between the first condenser 311 and the second condenser 312. The first electronic expansion valve 331 is used to further throttle the high-pressure refrigerant.

[0047] Furthermore, the valve assembly 33 also includes: a second electronic expansion valve 332, which is disposed on the flow channel plate 20 and located downstream of the second condenser 312; and a third electronic expansion valve 333, which is disposed on the flow channel plate 20 and located downstream of the second condenser 312. The medium-low temperature and high-pressure liquid refrigerant condensed by the second condenser 312 is throttled into a low-temperature and low-pressure gas-liquid mixture refrigerant through the second electronic expansion valve 332 and the third electronic expansion valve 333, respectively.

[0048] The electronic expansion valve, controlled electronically, regulates the refrigerant flow to achieve precise control of system temperature and pressure. Within the thermal management integrated module, the electronic expansion valve can precisely adjust the refrigerant flow according to the system's actual needs, thus achieving accurate temperature and pressure control. By precisely controlling the refrigerant flow, the electronic expansion valve can reduce the amount of refrigerant circulating in the system, thereby reducing energy consumption and improving the overall energy efficiency of the system. The electronic expansion valve can quickly respond to changes in external temperature and pressure, adjusting the refrigerant flow in a timely manner to maintain stable system operation.

[0049] Furthermore, the low-pressure interface includes a fourth interface 214 and a fifth interface 215, which are disposed on the flow channel plate 20. The fourth interface 214 is disposed near the second electronic expansion valve 332. The heat exchanger assembly 31 also includes an evaporator 313, which is disposed downstream of the second electronic expansion valve 332. The inlet of the evaporator 313 is connected to the fourth interface 214, and the outlet of the evaporator 313 is connected to the fifth interface 215. The low-temperature and low-pressure gas-liquid mixture refrigerant after being throttled by the second electronic expansion valve 332 is evaporated into a low-temperature and low-pressure gaseous refrigerant through the evaporator 313.

[0050] Specifically, by positioning the evaporator 313 downstream of the second electronic expansion valve 332, it is ensured that the gas-liquid mixed refrigerant fully evaporates as it flows through the evaporator 313, improving heat exchange efficiency. The second electronic expansion valve 332 can precisely control the refrigerant flow rate, thereby controlling the evaporation rate and pressure in the evaporator 313, achieving precise control of the refrigeration system. By connecting the evaporator inlet to the fourth interface and the outlet to the fifth interface, the refrigerant flow path can be optimized, reducing pressure loss and improving the overall system performance. Placing the fourth and fifth interfaces on the flow channel plate saves space, making the entire system more compact and facilitating installation and maintenance.

[0051] In some alternative embodiments, the size and shape of the evaporator can be adjusted to suit different application requirements and cooling needs.

[0052] Furthermore, the low-pressure interface also includes a sixth interface 216 and a seventh interface 217, which are disposed on the substrate 10. The heat exchanger assembly 31 also includes a refrigeration device 314, which is disposed downstream of the third electronic expansion valve 333. The inlet of the refrigeration device 314 is connected to the sixth interface 216, and the outlet of the refrigeration device 314 is connected to the seventh interface 217. The jump pipe 40 includes a first jump pipe 41, the first end of which is connected to the third electronic expansion valve 333, and the second end of which is connected to the sixth interface 216. The low-temperature and low-pressure gas-liquid mixed refrigerant after being throttled by the third electronic expansion valve 333 flows into the refrigeration device 314 through the first jump pipe 41 and evaporates into a low-temperature and low-pressure gaseous refrigerant.

[0053] Specifically, this configuration allows the low-pressure, low-temperature gas-liquid mixture refrigerant, after being throttled by the third electronic expansion valve 333, to flow into the refrigeration equipment 314 via the first jump pipe 41. This separates the low-pressure refrigerant flow path from the high-pressure refrigerant flow path at the third electronic expansion valve 333, reducing heat loss of the refrigerant and improving working efficiency.

[0054] Further, the jumper pipe 40 includes: a second jumper pipe 42, the first end of which is connected to the seventh interface 217; a third jumper pipe 43, the first end of which is connected to the outlet of the evaporator 313, and the second end of which is connected to the second end of the second jumper pipe 42; and a fourth jumper pipe 44, the first end of which is connected to the second end of the third jumper pipe 43 and the second end of the second jumper pipe 42, and the second end of which is connected to the inlet of the gas-liquid separator 60, and the outlet of the gas-liquid separator 60 is connected to the compressor inlet 218 of the compressor 50.

[0055] Specifically, at least one of the first jump pipe 41, the second jump pipe 42, the third jump pipe 43, and the fourth jump pipe 44 includes a jump pipe line and a flange joint. The jump pipes are connected to each other through the flange joint, which makes the connection between the jump pipes flexible.

[0056] In this embodiment, four jumpers are provided. In other embodiments, the number of jumpers is not limited to this and can also be five, six, etc.

[0057] Furthermore, the sensing assembly 32 includes: at least two temperature sensors 321, one temperature sensor 321 being disposed between the compressor 50 and the first condenser 311, and the other temperature sensor 321 being disposed at the outlet of the evaporator 313; at least two high-pressure sensors 322, one high-pressure sensor 322 being disposed downstream of the first condenser 311, and the other high-pressure sensor 322 being disposed downstream of the second condenser 312; and a low-pressure sensor 323 being disposed downstream of the refrigeration device 314.

[0058] Specifically, temperature sensor 321, located between compressor 50 and first condenser 311, is used to collect the temperature of refrigerant in the high-pressure refrigerant channel, and temperature sensor 321 at the outlet of evaporator 313 is used to collect the temperature of refrigerant in the low-pressure refrigerant channel. High-pressure sensor 322, located downstream of first condenser 311, is used to collect the pressure of the high-pressure refrigerant after condensation in first condenser 311, and high-pressure sensor 322, located downstream of second condenser 312, is used to collect the pressure of the high-pressure refrigerant after condensation in second condenser 312. There is a pressure difference between the two; low-pressure sensor is used to collect the pressure of low-pressure refrigerant.

[0059] In some optional embodiments, the thermal management integrated module has a cooling mode, a heat pump mode, and a dehumidification mode.

[0060] like Figure 2 , Figure 3 As shown, when the thermal management integrated module is in cooling mode, the compressor 50 compresses a high-temperature, high-pressure gaseous refrigerant, which is condensed into a medium-low temperature, high-pressure liquid refrigerant through the first condenser 311 and the second condenser 312. One branch is throttled by the second electronic expansion valve 332 into a low-temperature, low-pressure gas-liquid mixture refrigerant, which is then evaporated by the evaporator 313 into a low-temperature, low-pressure gaseous refrigerant, and finally returns to the compressor 50 through the gas-liquid separator 60. The other branch is throttled by the third electronic expansion valve 333 into a low-temperature, low-pressure gas-liquid mixture refrigerant, which is then evaporated by the refrigeration equipment 314 into a low-temperature, low-pressure gaseous refrigerant, and finally returns to the compressor 50 through the gas-liquid separator 60.

[0061] The compressor 50's exhaust port is connected to the first interface 211, flows through the integrated module channel to the second interface 212, passes through the second condenser to the third interface 213, passes through the high-pressure sensor 322, one branch passes through the third electronic expansion valve 333, flows through the sixth interface 216, the refrigeration equipment 314 and the seventh interface 217, flows through the second jump pipe 42 and the fourth jump pipe 44 through the gas-liquid separator 60, and finally returns to the compressor 50 through the compressor inlet 218. Another branch passes through the second electronic expansion valve 332, flows through the evaporator 313, the fifth interface 215 and the third jump pipe 43, flows through the fourth jump pipe 44 through the gas-liquid separator 60, and finally returns to the compressor 50 through the compressor inlet 218.

[0062] like Figure 4 As shown, when the thermal management integrated module is in heat pump mode, the compressor 50 compresses a high-temperature, high-pressure gaseous refrigerant, which is condensed into a medium-low temperature, high-pressure liquid refrigerant by the first condenser 311, throttled by the first electronic expansion valve 331 into a low-temperature, low-pressure gas-liquid mixture refrigerant, evaporated into a low-temperature, low-pressure gaseous refrigerant by the second condenser 312, further evaporated into a low-temperature, low-pressure gaseous refrigerant by the refrigeration equipment 314, and finally returned to the compressor 50 by the gas-liquid separator 60.

[0063] The compressor 50's exhaust port is connected to the first interface 211, flows through the integrated module channel to the second interface 212, flows through the second condenser to the third interface 213, passes through the high-pressure sensor 322, one branch flows through the third electronic expansion valve 333, flows through the sixth interface 216, the refrigeration equipment 314 and the seventh interface 217, flows through the second jump pipe 42 and the fourth jump pipe 44 through the gas-liquid separator 60, and finally returns to the compressor 50 through the compressor inlet 218.

[0064] like Figure 5 As shown, when the thermal management integrated module is in dehumidification mode, the compressor 50 compresses a medium-low temperature and high pressure gaseous refrigerant, which is condensed into a medium-low temperature and high pressure liquid refrigerant by the first condenser 311, throttled into a low temperature and low pressure gas-liquid mixture refrigerant by the second electronic expansion valve 332, evaporated into a low temperature and low pressure gaseous refrigerant by the evaporator 313, and finally returned to the compressor 50 by the gas-liquid separator 60.

[0065] The compressor 50's exhaust port is connected to the first interface 211, flows through the integrated module flow channel to the second interface 212, flows through the second condenser to the third interface 213, through the second electronic expansion valve 332, flows through the evaporator 313, the fifth interface 215 and the third jump pipe 43, flows through the fourth jump pipe 44 through the gas-liquid separator 60, and finally returns to the compressor 50 through the compressor inlet 218.

[0066] According to another aspect of the present invention, a thermal management integrated system is provided, including a thermal management integrated module, which is the thermal management integrated module of the above embodiment. The thermal management integrated module includes: a substrate 10; a flow channel plate 20 located on the substrate 10, with at least one of a high-pressure interface and a low-pressure interface provided on the substrate 10 and the flow channel plate 20, the flow channel plate 20 having a high-pressure refrigerant flow channel for flowing high-pressure refrigerant; a heat exchange assembly 30 connected to the flow channel plate 20 via the high-pressure interface; and a jumper pipe 40 connected to the heat exchange assembly 30 via the low-pressure interface, the jumper pipe 40 having a low-pressure refrigerant flow channel for flowing low-pressure refrigerant, the low-pressure refrigerant flow channel and the high-pressure refrigerant flow channel being connected to form a heat exchange loop for heat exchange operation of the heat exchange assembly 30. By setting a flow channel plate 20 and a jumper tube 40 on the substrate, the flow channel plate 20 has a high-pressure refrigerant flow channel and the jumper tube 40 has a low-pressure refrigerant flow channel. The heat exchange component 30 is set to throttle the high-pressure refrigerant into low-pressure refrigerant, so that the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel are separated, reducing the heat loss when the refrigerant is working and improving the heat exchange efficiency.

[0067] According to another aspect of the present invention, a vehicle is provided, including a thermal management integrated system, which is the thermal management integrated system of the above embodiment. The thermal management integrated module includes: a base plate 10; a flow channel plate 20 located on the base plate 10, with at least one of a high-pressure interface and a low-pressure interface provided on the base plate 10 and the flow channel plate 20, the flow channel plate 20 having a high-pressure refrigerant flow channel for flowing high-pressure refrigerant; a heat exchange assembly 30 connected to the flow channel plate 20 via the high-pressure interface; and a jumper pipe 40 connected to the heat exchange assembly 30 via the low-pressure interface, the jumper pipe 40 having a low-pressure refrigerant flow channel for flowing low-pressure refrigerant, the low-pressure refrigerant flow channel and the high-pressure refrigerant flow channel being connected to form a heat exchange loop for heat exchange operation of the heat exchange assembly 30. By setting a flow channel plate 20 and a jumper tube 40 on the substrate, the flow channel plate 20 has a high-pressure refrigerant flow channel and the jumper tube 40 has a low-pressure refrigerant flow channel. The heat exchange component 30 is set to throttle the high-pressure refrigerant into low-pressure refrigerant, so that the high-pressure refrigerant flow channel and the low-pressure refrigerant flow channel are separated, reducing the heat loss when the refrigerant is working and improving the heat exchange efficiency.

[0068] In some optional embodiments, the flow channel plate 20 in the thermal management integrated module is injection molded with pre-embedded fixing nuts. The flow channel plate 20 is made of PPS material, thereby reducing the weight of the thermal management integrated module. At the same time, it is more heat-insulating than metal materials, resulting in less heat loss during operation and improving heat exchange efficiency.

[0069] In some alternative embodiments, the substrate 10 in the thermal management integrated module is made of PPS material to reduce the weight of the thermal management integrated module.

[0070] In some optional embodiments, the piping of the jumper 40 is made of nylon, which reduces the weight of the thermal management integrated module, reduces heat loss during operation, and improves heat exchange efficiency.

[0071] In some optional embodiments, the flange joint of the jumper pipe 40 is made of PPS injection molding to reduce the weight of the thermal management integrated module, reduce heat loss during operation, and improve heat exchange efficiency. The piping of the jumper pipe 40 and the flange joint of the jumper pipe 40 are heat-fused welded.

[0072] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0073] In addition to the above, it should be noted that the terms "one embodiment," "another embodiment," and "embodiment" used in this specification refer to specific features, structures, or characteristics described in connection with that embodiment, which are included in at least one embodiment described in the general description of this application. The appearance of the same expression in multiple places in the specification does not necessarily refer to the same embodiment. Furthermore, when a specific feature, structure, or characteristic is described in connection with any embodiment, the intention is to suggest that implementing such a feature, structure, or characteristic in conjunction with other embodiments also falls within the scope of this invention.

[0074] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0075] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A thermal management integrated module, characterized in that, include: base(10); The flow channel plate (20) is located on the substrate (10). The substrate (10) and the flow channel plate (20) are provided with at least one of a high-pressure interface and a low-pressure interface. The flow channel plate (20) has a high-pressure refrigerant flow channel for the flow of high-pressure refrigerant. A heat exchange assembly (30) is connected to the flow channel plate (20) through the high-pressure interface; The heat exchange assembly (30) is connected to the jump pipe (40) through the low-pressure interface. The jump pipe (40) has a low-pressure refrigerant flow channel for flowing low-pressure refrigerant. The low-pressure refrigerant flow channel is connected to the high-pressure refrigerant flow channel to form a heat exchange circuit to perform heat exchange operation on the heat exchange assembly (30). The high-pressure interface includes a first interface (211), which is disposed on the substrate (10). The first interface (211) is used to connect to the exhaust port of the compressor (50), which is used to compress a high-temperature and high-pressure gaseous refrigerant. The heat exchange assembly (30) includes: A heat exchanger assembly (31) is connected to at least one of the high-pressure port and the low-pressure port, and the heat exchanger assembly (31) is located downstream of the compressor (50). The sensing component (32) is disposed on the flow channel plate (20) and the jumper pipe (40). The sensing component (32) is used to collect the temperature and pressure in the high-pressure refrigerant flow channel and the sensing component (32) is used to collect the temperature and pressure in the low-pressure refrigerant flow channel. Valve assembly (33) is connected to the high-pressure interface. At least a portion of the valve assembly (33) is located at the boundary between the high-pressure refrigerant channel and the low-pressure refrigerant channel. The valve assembly (33) is used to throttle the high-pressure refrigerant into low-pressure refrigerant.

2. The thermal management integrated module according to claim 1, characterized in that, The high-pressure interface also includes a second interface (212) and a third interface (213) arranged adjacent to each other, and the heat exchanger assembly (31) includes: The first condenser (311) is disposed downstream of the compressor (50) and is disposed in communication with the exhaust port of the compressor (50). The second condenser (312) is located downstream of the first condenser (311). The inlet of the second condenser (312) is connected to the second interface (212), and the outlet of the second condenser (312) is connected to the third interface (213). The first condenser (311) and the second condenser (312) are used to condense the high-temperature and high-pressure gaseous refrigerant into a medium-low temperature and high-pressure liquid refrigerant.

3. The thermal management integrated module according to claim 2, characterized in that, The valve assembly (33) includes: The first electronic expansion valve (331) is disposed on the flow channel plate (20) and is located between the first condenser (311) and the second condenser (312).

4. The thermal management integrated module according to claim 3, characterized in that, The valve assembly (33) also includes: The second electronic expansion valve (332) is disposed on the flow channel plate (20) and is located downstream of the second condenser (312); The third electronic expansion valve (333) is disposed on the flow channel plate (20) and is located downstream of the second condenser (312). The medium-low temperature and high pressure liquid refrigerant after being condensed by the second condenser (312) is throttled into a low-temperature and low-pressure gas-liquid mixture refrigerant by the second electronic expansion valve (332) and the third electronic expansion valve (333).

5. The thermal management integrated module according to claim 4, characterized in that, The low-pressure interface includes a fourth interface (214) and a fifth interface (215), which are disposed on the flow channel plate (20). The fourth interface (214) is disposed near the second electronic expansion valve (332). The heat exchanger assembly (31) further includes: Evaporator (313), the evaporator (313) is located downstream of the second electronic expansion valve (332), the inlet of the evaporator (313) is connected to the fourth interface (214), and the outlet of the evaporator (313) is connected to the fifth interface (215). The low-temperature and low-pressure gas-liquid mixture refrigerant after being throttled by the second electronic expansion valve (332) is evaporated into a low-temperature and low-pressure gaseous refrigerant through the evaporator (313).

6. The thermal management integrated module according to claim 5, characterized in that, The low-pressure interface further includes a sixth interface (216) and a seventh interface (217), the sixth interface (216) and the seventh interface (217) being disposed on the substrate (10), and the heat exchanger assembly (31) further includes: A refrigeration device (314) is disposed downstream of the third electronic expansion valve (333). The inlet of the refrigeration device (314) is connected to the sixth interface (216), and the outlet of the refrigeration device (314) is connected to the seventh interface (217). The jumper (40) includes a first jumper (41). The first end of the first jumper (41) is connected to the third electronic expansion valve (333), and the second end of the first jumper (41) is connected to the sixth interface (216). The low-temperature, low-pressure gas-liquid mixture refrigerant, after being throttled by the third electronic expansion valve (333), flows through the first jump pipe (41) into the refrigeration equipment (314) and evaporates into a low-temperature, low-pressure gaseous refrigerant.

7. The thermal management integrated module according to claim 6, characterized in that, The jumper tube (40) includes: The second jumper (42) has its first end connected to the seventh interface (217); The third jumper tube (43) has its first end connected to the outlet of the evaporator (313) and its second end connected to the second end of the second jumper tube (42). The fourth jump pipe (44) has its first end connected to the second end of the third jump pipe (43) and the second end of the second jump pipe (42), and its second end connected to the inlet of the gas-liquid separator (60). The outlet of the gas-liquid separator (60) is connected to the compressor inlet (218) of the compressor (50).

8. The thermal management integrated module according to claim 7, characterized in that, The sensing component (32) includes: At least two temperature sensors (321), one of which is located between the compressor (50) and the first condenser (311), and the other is located at the outlet of the evaporator (313); At least two high-pressure sensors (322), one of which is located downstream of the first condenser (311) and the other of which is located downstream of the second condenser (312); A low-pressure sensor (323) is disposed downstream of the refrigeration device (314).

9. A thermal management integrated system, comprising a thermal management integrated module, characterized in that, The thermal management integrated module is the thermal management integrated module as described in any one of claims 1 to 8.

10. A vehicle comprising a thermal management integrated system, characterized in that, The thermal management integrated system is the thermal management integrated system as described in claim 9.

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