An up-and-down loading device applicable to a large number of semi-sliced silicon wafers

Abstract

A loading and unloading device applicable to a large number of semi-sliced silicon wafers, comprising a tray and a transmission component for driving the tray to horizontally traverse. A vertical lifting component for synchronously driving the tray and the transmission component to lift is provided at the bottom of the transmission component; a plurality of silicon wafer carriers for loading silicon wafers are placed on the tray. A handling component for handling the silicon wafer carriers is provided above the tray, and a feeding component for transmitting the silicon wafer carriers is provided on one side of the tray; the silicon wafer carrier includes a carrier frame and a carrier body placed in the carrier frame. Clamping pieces are formed on both sides of the carrier frame and are arranged oppositely. A clamping station for clamping the silicon wafers is formed between the oppositely arranged clamping pieces and the carrier frame; compared with the prior art, by providing a silicon wafer carrier for loading silicon wafers, during the handling process of the silicon wafers, the silicon wafers and the silicon wafer carrier move synchronously, ensuring that the silicon wafers are always in a vertical state, thereby facilitating the plating around the top of the silicon wafers.

Description

Technical Field

[0001] The present invention relates to the technical field of photovoltaic cell manufacturing, and particularly relates to a loading and unloading device suitable for a large number of half-cut silicon wafers. Background Art

[0002] Currently, in the field of battery manufacturing in the photovoltaic industry, silicon wafers are important materials for manufacturing integrated circuits. By means of texturing, atomic layer coating, etc. on the silicon wafers, silicon wafers required for photovoltaic power generation can be made. The photovoltaic panels made of silicon wafers have great assistance in national green power generation, energy transformation, and carbon neutralization.

[0003] When the silicon wafers are produced, since the resistance in the silicon wafers is too large when using the whole silicon wafers for direct power generation, the silicon wafers are cut by laser in the process, so that the silicon wafers are evenly divided into two half wafers from a whole wafer. However, when the silicon wafers are cut by laser, due to the problems of the silicon wafer material and process, the cutting surface of the silicon wafers will have a serrated fracture surface, and this fracture surface will affect the photovoltaic power generation efficiency by about 0.6%. Now, the fracture surface is wrapped with oxides by a plating equipment, which can improve the power generation efficiency of the photovoltaic panel by about 0.4%. However, due to the large production capacity of the equipment during loading and unloading, it is very difficult for the loading and unloading equipment to meet its production capacity.

[0004] Chinese Patent Publication No. CN117902318A discloses a silicon wafer limiting hanger and a silicon wafer loading and unloading device. By arranging a plurality of silicon wafer loading spaces on a hanger, the silicon wafer unit suction cups on the loading and unloading mechanism correspond to the distribution positions of the silicon wafer loading spaces one by one, and a plurality of silicon wafers can be loaded or unloaded simultaneously, ensuring the processing efficiency of copper plating of the silicon wafers.

[0005] The above-mentioned disclosed loading and unloading device loads a plurality of silicon wafers through a vertically arranged hanger, grabs the silicon wafers through a loading and unloading mechanism, and a vertically arranged unit suction cup is formed on the hanger for adsorbing the silicon wafers. Due to the certain gravity of the silicon wafers themselves, it is difficult for the unit suction cup to immediately adsorb the silicon wafers at the moment when the loading and unloading mechanism releases the silicon wafers, thus affecting the installation accuracy of the silicon wafers on the hanger, and then affecting the subsequent copper plating effect. At the same time, a plurality of silicon wafers of the above-mentioned loading and unloading device are all located on the same vertical plane of the same hanger, increasing the difficulty of subsequent copper plating of the silicon wafers. Summary of the Invention

[0006] The present invention is to overcome the above-mentioned defects in the prior art, and provides a loading and unloading device suitable for a large number of half-cut silicon wafers with accurate positioning and convenient for realizing plating of the silicon wafers.

[0007] To achieve the above-mentioned invention object, the present invention adopts the following technical solutions: A loading and unloading device applicable to a large number of semi-sliced silicon wafers, comprising a tray and a transmission component for driving the tray to horizontally traverse. A vertical lifting component for synchronously driving the tray and the transmission component to lift is provided at the bottom of the transmission component; a plurality of wafer carriers for loading silicon wafers are placed on the tray. A handling component for handling the wafer carriers is provided above the tray, and a feeding component for transmitting the wafer carriers is provided on one side of the tray; the wafer carrier includes a carrier frame and a carrier body placed in the carrier frame. Clamping members are formed on both sides of the carrier frame and are arranged oppositely. A clamping station for clamping silicon wafers is formed between the oppositely arranged clamping members and the carrier frame.

[0008] As a preferred solution of the present invention, a plurality of the wafer carriers are arranged in an array on the tray, and a plurality of positioning pins for positioning each wafer carrier are provided on the tray. A positioning hole matching with the positioning pin is formed at the bottom of the carrier frame.

[0009] As a preferred solution of the present invention, the vertical lifting component includes a lifting frame and vertical plates provided on opposite sides of the lifting frame. A lifting control member for synchronously lifting both sides of the lifting frame is provided on the vertical plates, and a guiding strip for limiting and guiding the lifting direction of the lifting frame is provided on the vertical plates.

[0010] As a preferred solution of the present invention, the lifting control member includes a lifting block formed on the side of the lifting frame and a lead screw threadedly connected to the lifting block. A driving motor for driving the lead screw to rotate is provided on the vertical plate.

[0011] As a preferred solution of the present invention, a plurality of positioning protrusions arranged in an array are formed on the lifting frame. Connection blocks for connecting the transmission component are installed on the positioning protrusions, and a belt-passing gap is formed between adjacent connection blocks.

[0012] As a preferred solution of the present invention, the transmission component includes a transmission frame and a plurality of conveyor belts installed on the transmission frame. A synchronous motor for driving the plurality of conveyor belts to synchronously convey is provided on the transmission frame. The plurality of conveyor belts are all in contact with the bottom of the tray, and the plurality of conveyor belts are arranged corresponding to the belt-passing gaps.

[0013] As a preferred solution of the present invention, the handling component includes a transverse track and a longitudinal track slidably connected to the transverse track. A handling member is slidably connected to the longitudinal track.

[0014] As a preferred solution of the present invention, the transverse track is connected to the end of the longitudinal track, and a support track parallel to the transverse track is provided at the other end of the longitudinal track. A transverse movement motor for driving the longitudinal track to move is provided at the end of the longitudinal track.

[0015] As a preferred embodiment of the present invention, a longitudinal moving motor for driving the moving member to move is provided on the longitudinal track. The moving member includes a moving main body and a clamping head mounted at the bottom of the moving main body. A lifting cylinder for driving the clamping head to lift is provided at the top of the moving main body, and an adjusting cylinder for adjusting the opening and closing size of the clamping head is provided at the bottom of the moving main body. A mating hole engaged with the clamping head is formed on the carrier frame.

[0016] As a preferred embodiment of the present invention, the feeding assembly includes a feeding track and a feeding plate slidably connected to the feeding track. A plurality of wafer carriers arranged in an array are placed on the feeding plate, and a rodless cylinder for driving the feeding plate to move is provided in the middle of the feeding plate.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: By providing a wafer carrier for loading wafers, during the handling process of the wafers, the wafers and the wafer carrier move synchronously, ensuring that the wafers are always in a vertical state, thereby facilitating the circumferential plating operation on the top of the wafers. At the same time, under the action of the wafer carrier, during the handling process of the wafers, the handling assembly does not directly contact the wafers, reducing the external force impact on the wafers and ensuring the stable loading of the wafers on the wafer carrier;

[0018] The up and down lifting assembly uses a screw double-station synchronous motion mechanism, effectively solving the problem of insufficient lifting force and meeting the large-batch loading and unloading requirements of wafers;

[0019] The transmission assembly transports the trays by the synchronous rotation of multiple conveyor belts, solving the problem of insufficient belt friction when transporting the trays and meeting the transmission requirements for a large number of wafers at the same time;

[0020] The wafer carrier adopts a split structure, and the tray and the wafer carrier are positioned by positioning pins, making the positioning of the wafer carrier on the tray more accurate. At the same time, the split-structured wafer carrier allows the wafer carrier to be flexibly and conveniently transferred between the transmission assembly and the tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 is a schematic structural diagram of the present invention;

[0022] Figure 2 is a schematic structural diagram of the feeding assembly;

[0023] Figure 3 is a schematic structural diagram of the handling assembly;

[0024] Figure 4 is a schematic structural diagram of the moving member;

[0025] Figure 5 is a schematic structural diagram of the wafer carrier;

[0026] Figure 6It is a schematic structural diagram of a vehicle frame;

[0027] Figure 7 It is a loading schematic diagram of a silicon wafer carrier;

[0028] Figure 8 It is a schematic structural diagram of an up - and - down lifting component;

[0029] Figure 9 It is a schematic structural diagram of a tray;

[0030] Figure 10 It is a schematic structural diagram of a transmission component;

[0031] Reference numerals: Tray 1, positioning pin 11, transmission component 2, transmission rack 21, conveyor belt 22, synchronous motor 23, silicon wafer carrier 3, carrier body 31, carrier frame 32, clamping member 33, clamping station 34, positioning hole 35, mating hole 36, up - and - down lifting component 4, lifting frame 41, vertical plate 42, lifting control member 43, lifting block 44, lead screw 45, drive motor 46, positioning projection 47, connecting block 48, guide bar 49, handling component 5, transverse rail 51, longitudinal rail 52, longitudinal movement motor 521, support rail 53, transverse movement motor 54, handling member 55, handling body 56, lifting cylinder 57, clamping head 58, adjusting cylinder 59, feeding component 6, feeding rail 61, feeding plate 62, rodless cylinder 63. Detailed implementation manners

[0032] The embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0033] As Figures 1 - 10 shown, a loading and unloading device applicable to a large number of semi - sliced silicon wafers includes a tray 1 and a transmission component 2 for driving the tray 1 to horizontally traverse. A up - and - down lifting component 4 for synchronously driving the tray 1 and the transmission component 2 to lift is provided at the bottom of the transmission component 2; A number of silicon wafer carriers 3 for loading silicon wafers are placed on the tray 1. A handling component 5 for handling the silicon wafer carriers 3 is provided above the tray 1, and a feeding component 6 for transporting the silicon wafer carriers 3 is provided on one side of the tray 1; The silicon wafer carrier 3 includes a carrier frame 32 and a carrier body 31 placed in the carrier frame 32. Clamping members 33 are formed on both sides of the carrier frame 32, and a clamping station 34 for clamping silicon wafers is formed between the relatively arranged clamping members 33 and the carrier frame 32.

[0034] The clamping member 33 is used to clamp the side of the silicon wafer. Under the action of the clamping member 33, two clamping members 33 simultaneously clamp the opposite two sides of the silicon wafer, thereby restricting the horizontal degree of freedom of the silicon wafer. At the same time, when the bottom of the silicon wafer is placed on the feeding component 6, the bottom of the silicon wafer is in contact with the surface of the feeding component 6 at this time, thereby restricting the height of the silicon wafer. When the handling component 5 clamps the silicon wafer carrier 3, the bottom of the silicon wafer is in a suspended state at this time. Under the action of the gravity of the silicon wafer itself, the silicon wafer may slide downward along the clamping member 33. However, when the handling component 5 places the silicon wafer carrier 3 on the tray 1, the bottom of the silicon wafer is in contact with the surface of the tray 1 at this time. Thus, under the abutting action of the surface of the tray 1, further correction of the height of the silicon wafer can be achieved, and under the supporting action of the surface of the tray 1, it can be ensured that the silicon wafers on all the silicon wafer carriers 3 are in the same height state.

[0035] The tray 1 is used to load a number of silicon wafer carriers 3 arranged in an array, and the silicon wafer carrier 3 is used to load silicon wafers. One silicon wafer carrier 3 loads one silicon wafer. Under the action of the silicon wafer carrier 3, the loading and handling of the silicon wafer are realized. At the same time, under the action of the tray 1, the synchronous handling of a number of silicon wafer carriers 3 on the tray 1 can be realized, and the synchronous handling of multiple silicon wafers can be realized.

[0036] The carrier main body 31 is a weight structure for supporting the carrier frame 32. Under the action of the carrier main body 31, the stable state of the carrier frame 32 is ensured. At the same time, since the silicon wafer is clamped on the clamping station 34 on one side of the carrier frame 32, the carrier main body 31 is used to keep the center of gravity of the silicon wafer carrier 3 loaded with the silicon wafer always located in the middle of the silicon wafer carrier 3, ensuring the stability of the silicon wafer carrier 3 during the handling process.

[0037] A number of silicon wafer carriers 3 are placed on the tray 1 in an array, and a number of positioning pins 11 for positioning each silicon wafer carrier 3 are provided on the tray 1. A positioning hole 35 matching with the positioning pin 11 is formed at the bottom of the carrier frame 32.

[0038] The number of silicon wafer carriers 3 is set according to actual needs and the size of the tray 1. A number of silicon wafer carriers 3 placed on the tray 1 in an array make the overall force of the tray 1 stable. At the same time, under the cooperation of the positioning pin 11 and the positioning hole 35, it is ensured that the silicon wafer carrier 3 is always located at the relative position of the tray 1, and during the movement of the tray 1, collisions between adjacent silicon wafer carriers 3 will not occur, and at the same time, the accurate positioning placement of the silicon wafer carrier 3 on the tray 1 is also ensured.

[0039] The up and down lifting component 4 includes a lifting frame 41 and vertical plates 42 arranged on opposite sides of the lifting frame 41. A lifting control member 43 for synchronously lifting both sides of the lifting frame 41 is provided on the vertical plates 42, and a guiding strip 49 for limiting and guiding the lifting direction of the lifting frame 41 is provided on the vertical plates 42.

[0040] The vertical plate 42 is connected to the frame or the support frame. Under the support of the vertical plate 42, the overhead setting of the lifting frame 41 is ensured. A slider sleeved on the guide bar 49 is provided on the lifting frame 41. Under the action of the slider, the lifting angle of the lifting frame 41 is guided and limited, so as to ensure that the lifting frame 41 is always in a horizontal state during the lifting process.

[0041] The lifting control member 43 includes a lifting block 44 formed on the side of the lifting frame 41 and a lead screw 45 threadedly connected to the lifting block 44. A driving motor 46 for driving the lead screw 45 to rotate is provided on the vertical plate 42.

[0042] Support seats for supporting both ends of the lead screw 45 are installed on the vertical plate 42, and bearings sleeved on the lead screw 45 are provided in the support seats. The end of the lead screw 45 is connected to the output end of the driving motor 46. Under the action of the driving motor 46, the rotation of the lead screw 45 is driven. At the same time, the lifting block 44 always abuts against the vertical plate 42. Thus, during the rotation of the lead screw 45, the lifting block 44 moves up and down along the inner wall of the vertical plate 42.

[0043] The lifting control members 43 on both sides of the lifting frame 41 are always in a synchronous operation state, so as to realize the synchronous lifting of the lifting blocks 44 on both sides of the lifting frame 41, so as to ensure that the lifting frame 41 is always in a horizontal state during the lifting process. At the same time, under the action of the two lifting control members 43, the lifting force requirements for the tray 1 and the transmission assembly 2 are effectively met.

[0044] A number of positioning protrusions 47 arranged in an array are formed on the lifting frame 41. Connection blocks 48 for connecting the transmission assembly 2 are installed on the positioning protrusions 47, and a belt passing gap is formed between adjacent connection blocks 48.

[0045] The lifting frame 41 is composed of multiple connecting rods and support plates connected to both ends of the connecting rods. The positioning protrusions 47 are formed on the upper surface of the connecting rods, and a number of positioning protrusions 47 are arranged at equal intervals along the length direction of the connecting rods. The positioning protrusions 47 on multiple connecting rods are arranged in an array, so as to form a linear belt passing gap.

[0046] The connection block 48 is used to raise the installation position of the transmission assembly 2, so that there is a belt passing gap between the bottom of the transmission assembly 2 and the lifting frame 41.

[0047] The transmission assembly 2 includes a transmission frame 21 and a number of conveyor belts 22 installed on the transmission frame 21. A synchronous motor 23 for driving the synchronous transmission of the number of conveyor belts 22 is provided on the transmission frame 21. The number of conveyor belts 22 are all in contact with the bottom of the tray 1, and the number of conveyor belts 22 are arranged corresponding to the belt passing gap.

[0048] A number of conveyor belts 22 are connected to the same connecting shaft, and the connecting shaft is connected to a synchronous motor 23. Under the action of the synchronous motor 23, the synchronous transmission of a number of conveyor belts 22 is driven synchronously. Under the action of the overbelt gap, the operation of each conveyor belt 22 is not affected.

[0049] The handling assembly 5 includes a transverse track 51 and a longitudinal track 52 slidably connected to the transverse track 51. A handling member 55 is slidably connected to the longitudinal track 52.

[0050] The transverse track 51 and the longitudinal track 52 are arranged crosswise and perpendicular to each other. The handling member 55 can move along the length direction of the longitudinal track 52, and the longitudinal track 52 can move along the length direction of the transverse track 51, so as to meet the horizontal transverse and longitudinal movement of the handling member 55.

[0051] The transverse track 51 is connected to the end of the longitudinal track 52, and a support track 53 parallel to the transverse track 51 is provided at the other end of the longitudinal track 52. A transverse movement motor 54 for driving the longitudinal track 52 to move is provided at the end of the longitudinal track 52.

[0052] The support track 53 is used to connect to the end of the longitudinal track 52 to guide and limit the transverse movement of the longitudinal track 52. A gear is provided at the output end of the transverse movement motor 54, and a rack meshing with the gear is provided on the transverse track 51. During the rotation of the gear, the longitudinal track 52 is driven to move along the length direction of the rack, so as to meet the movement of the longitudinal track 52 along the length direction of the transverse track 51.

[0053] A longitudinal movement motor 521 for driving the handling member 55 to move is provided on the longitudinal track 52. The handling member 55 includes a handling main body 56 and a clamping head 58 installed at the bottom of the handling main body 56. A lifting cylinder 57 for driving the clamping head 58 to lift is provided at the top of the handling main body 56, and an adjusting cylinder 59 for adjusting the opening and closing size of the clamping head 58 is provided at the bottom of the handling main body 56. A mating hole 36 engaged with the clamping head 58 is formed on the carrier frame 32.

[0054] The output end of the longitudinal movement motor 521 can be connected to a lead screw threadedly connected to the handling main body 56. Under the rotation of the lead screw, the handling main body 56 is driven to move along the length direction of the longitudinal track 52, so as to adjust the moving position of the handling main body 56 on the longitudinal track 52.

[0055] The clamping head 58 can be lifted under the action of the lifting cylinder 57, so as to realize the lowering of the clamping head 58 to grasp the wafer carrier 3. The adjusting cylinder 59 is used to adjust the opening and closing size of the clamping head 58. At the same time, during the clamping process, the opening and closing of the clamping head 58 can also be driven, so that the clamping head 58 is inserted into the mating hole 36 to realize the clamping of the clamping head 58 to the carrier frame 32.

[0056] The feeding assembly 6 includes a feeding track 61 and a feeding plate 62 slidably connected to the feeding track 61. A plurality of wafer carriers 3 arranged in an array are placed on the feeding plate 62, and a rodless cylinder 63 for driving the movement of the feeding plate 62 is provided in the middle of the feeding plate 62.

[0057] The size of the feeding plate 62 can be set according to actual needs. The rodless cylinder 63 drives the feeding plate 62 to move along the length direction of the feeding track 61, thereby driving the movement of a plurality of wafer carriers 3.

[0058] During actual use, when the wafer carriers 3 are being loaded, the feeding assembly 6 moves a plurality of wafer carriers 3 to the loading and grasping position. The handling assembly 5 grasps the wafer carriers 3 and places them at the designated positions on the tray 1 until the tray 1 is full of wafer carriers 3. The up and down lifting assembly 4 moves downward, synchronously driving the downward movement of the tray 1 and the transmission assembly 2 until the up and down lifting assembly 4 lowers the tray 1 to the working position. The transmission assembly 2 drives the conveyor belt 22 to convey, moving the tray to the next working station, thereby realizing the loading of the wafer carriers 3.

[0059] When the wafer carriers 3 are being unloaded, the transmission assembly 2 drives the conveyor belt 22 to convey in the reverse direction, moving the tray 1 to the end of the transmission assembly 2. The up and down lifting assembly 4 moves upward, synchronously driving the upward movement of the tray 1 and the transmission assembly 2 until the up and down lifting assembly 4 raises the tray 1 to the unloading working position. The handling assembly 5 grasps the wafer carriers 3 and places them at the designated positions on the feeding assembly 6, and the feeding assembly 6 conveys the wafer carriers 3 outward.

[0060] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather will be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0061] Although the following terms are used more frequently in this text: tray 1, positioning pin 11, transfer assembly 2, transfer rack 21, conveyor belt 22, synchronous motor 23, wafer carrier 3, carrier body 31, carrier frame 32, clamping member 33, clamping station 34, positioning hole 35, mating hole 36, vertical lifting assembly 4, lifting frame 41, vertical plate 42, lifting control member 43, lifting block 44, lead screw 45, drive motor 46, positioning protrusion 47, connecting block 48, guide bar 49, handling assembly 5, transverse rail 51, longitudinal rail 52, longitudinal movement motor 521, support rail 53, transverse movement motor 54, handling member 55, handling body 56, lifting cylinder 57, clamping head 58, adjusting cylinder 59, feeding assembly 6, feeding rail 61, feeding plate 62, rodless cylinder 63, etc., the possibility of using other terms is not excluded. These terms are used only for the convenience of describing and explaining the essence of the present invention; interpreting them as any additional limitation is contrary to the spirit of the present invention.

Claims

1. A loading and unloading device suitable for large quantities of half-sliced ​​silicon wafers, comprising a tray (1) and a transmission component (2) for driving the tray (1) to move horizontally, and an up-and-down lifting component (4) for synchronously driving the tray (1) and the transmission component (2) to move upward and downward; the device is characterized in that: A plurality of silicon wafer carriers (3) for loading silicon wafers are placed on the tray (1), a transport assembly (5) for transporting the silicon wafer carriers (3) is provided above the tray (1), and a feeding assembly (6) for transferring the silicon wafer carriers (3) is provided on one side of the tray (1); the silicon wafer carrier (3) comprises a carrier frame (32) and a carrier body (31) placed in the carrier frame (32), and clamping members (33) arranged opposite to each other are formed on both sides of the carrier frame (32), and the clamping members (33) arranged opposite to each other are arranged opposite to each other. A clamping station (34) for clamping the silicon wafer is formed between the carrier frames (32); during the transportation of the silicon wafer, the silicon wafer and the silicon wafer carrier (3) move synchronously, the silicon wafer is always in a vertical state, and the top of the silicon wafer is subjected to a winding plating operation. Under the action of the silicon wafer carrier (3), the transport component (5) does not directly contact the silicon wafer during the transportation of the silicon wafer; when the silicon wafer carrier (3) is clamped by the transport component (5), the bottom of the silicon wafer is in a suspended state; the silicon wafer carrier (3) is used to load A silicon wafer is provided, and one silicon wafer carrier (3) is loaded with one silicon wafer; the transport assembly (5) comprises a transverse track (51) and a longitudinal track (52) slidably connected to the transverse track (51), a transport member (55) being slidably connected to the longitudinal track (52); a longitudinal movement motor (521) for driving the transport member (55) to move is provided on the longitudinal track (52), the transport member (55) comprises a transport body (56) and a clamping head (58) mounted at the bottom of the transport body (56), A lifting cylinder (57) for driving the clamping head (58) to move up and down is provided at the top of the transport body (56), and an adjusting cylinder (59) for adjusting the opening and closing size of the clamping head (58) is provided at the bottom of the transport body (56). A matching hole (36) for engaging with the clamping head (58) is formed on the carrier frame (32); during the clamping process, the clamping head (58) is driven to open and close, so that the clamping head (58) is inserted into the matching hole (36), thereby achieving the clamping of the clamping head (58) to the carrier frame (32).

2. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 1, characterized in that: A plurality of the silicon wafer carriers (3) are placed in an array on a tray (1), and a plurality of positioning pins (11) for positioning each silicon wafer carrier (3) are provided on the tray (1), and a positioning hole (35) matching with the positioning pins (11) is formed at the bottom of the carrier frame (32).

3. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 1, characterized in that: The up-and-down lifting assembly (4) comprises a lifting frame (41) and vertical plates (42) arranged on opposite sides of the lifting frame (41); a lifting control member (43) for synchronously lifting the two sides of the lifting frame (41) is provided on the vertical plates (42); a guide bar (49) for limiting and guiding the lifting direction of the lifting frame (41) is provided on the vertical plates (42); and a driving motor (46) for driving the screw rod (45) to rotate is provided on the vertical plates (42).

4. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 3, characterized in that: The lifting control component (43) comprises a lifting block (44) formed on the side of the lifting frame (41) and a screw rod (45) threadedly connected to the lifting block (44).

5. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 3, characterized in that: The lifting frame (41) is provided with a plurality of positioning protrusions (47) arranged in an array, and connection blocks (48) for connecting the transmission assembly (2) are mounted on the positioning protrusions (47), with belt-passing gaps formed between adjacent connection blocks (48).

6. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 5, characterized in that: The transmission assembly (2) comprises a transmission frame (21) and a plurality of conveyor belts (22) mounted on the transmission frame (21); a synchronous motor (23) is provided on the transmission frame (21) for driving the plurality of conveyor belts (22) for synchronous transmission; the plurality of conveyor belts (22) are in contact with the bottom of the tray (1), and the plurality of conveyor belts (22) are arranged corresponding to the belt-passing gaps.

7. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 1, characterized in that: The transverse track (51) is connected to the end of the longitudinal track (52), and the other end of the longitudinal track (52) is provided with a support track (53) arranged parallel to the transverse track (51), and the end of the longitudinal track (52) is provided with a transverse movement motor (54) for driving the longitudinal track (52) to move.

8. The loading and unloading device suitable for large batches of half-cut silicon wafers according to claim 1, characterized in that: The feed assembly (6) comprises a feed track (61) and a feed plate (62) slidably connected to the feed track (61); a plurality of silicon wafer carriers (3) arranged in an array are placed on the feed plate (62); and a rodless cylinder (63) for driving the feed plate (62) to move is provided in the middle of the feed plate (62).

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