Semiconductor etching cavity part spraying clamping mechanism and thermal spraying processing method

Abstract

The invention relates to the technical field of new material processing, in particular to a spraying clamping mechanism of a semiconductor etching cavity part and a thermal spraying processing method of the spraying clamping mechanism. The clamping mechanism comprises a clamping arm, a rotary table and a clamping tool, the clamping tool is provided with a plurality of clamping arms distributed in an annular array mode, fixing holes and mounting holes are formed in the clamping arms, and workpieces of different specifications and shapes can be fixed. The needle gauge is matched with the fixing hole, and fastening clamping is achieved through the oval grabbing part of the needle gauge. The clamping arms are designed to be cuboids, one end of each clamping arm is of a triangular structure with an included angle of 120 degrees, and the mounting holes and the fixing holes have specific hole diameters and intervals. The clamping mechanism can adapt to different workpieces, and clamping is carried out by moving the needle gauge position. The thermal spraying machining method comprises the steps of part pretreatment, carrying and positioning, clamping, spraying, turn-over spraying, aftertreatment and the like, and the high-quality thermal spraying effect is achieved by accurately controlling spraying parameters and temperature. The spraying and clamping mechanism and method are suitable for automatic and high-precision spraying of semiconductor etching cavity components.

Description

Technical Field

[0001] The invention belongs to the technical field of new material processing, and in particular relates to a spraying clamping mechanism for semiconductor etching chamber components and a thermal spraying processing method. Background Art

[0002] With the booming development of the integrated circuit field, the performance requirements of semiconductor etching chamber components are becoming increasingly stringent. These components are subjected to high temperature, high pressure and corrosive gas erosion during the etching process, so their surface quality and material properties are crucial to ensure the stability and efficiency of the entire etching process. In order to increase the service life of components and reduce the impact on the etching process, the surface of core components is usually anodized or sprayed with Al2O3, Y2O3, YF3, YOF and other coatings.

[0003] However, due to the different shapes and sizes of semiconductor etching chamber components and the complexity of the spraying area, such as outer circle, plane, inner hole, small hole, flip, eccentricity and local spraying, the traditional spraying method faces many challenges. In the past, the spraying of these parts mainly relied on manual operation, including the handling, positioning, clamping of parts, temperature control during spraying, and teaching of spraying area. This method is not only inefficient, but also easily affected by human factors, resulting in unstable spraying quality.

[0004] In recent years, with the rapid development of automation technology, people have begun to try to apply automation technology to the thermal spraying process of semiconductor etching chamber components. However, the existing automated spraying equipment and technology are mainly suitable for parts with regular shapes and simple structures. For semiconductor etching chamber parts with complex and irregular shapes, there are still many technical difficulties. For example, the automatic clamping and positioning of parts, precise temperature control during the spraying process, and the uniformity and consistency of the spraying quality are all key issues that need to be solved by the existing technology.

[0005] Therefore, for the thermal spraying method of semiconductor etching chamber components, it is necessary to develop an efficient, precise and automated spraying system suitable for most parts, so as to overcome the shortcomings of the existing technology, improve the spraying efficiency and quality, and meet the high requirements of the integrated circuit industry for key components. Summary of the invention

[0006] One of the purposes of the present invention is to provide a spray clamping mechanism for semiconductor etching chamber components and a thermal spray processing method thereof, aiming to achieve efficient and accurate workpiece clamping and spraying to meet the processing requirements of semiconductor etching chamber components of different specifications and shapes.

[0007] In order to solve the above technical problems, the present invention provides a spray clamping mechanism for semiconductor etching chamber components, characterized in that it includes a clamping arm, a turntable and a clamping tool, the clamping arm is used to transfer the workpiece, the clamping tool is installed on the turntable, the clamping tool includes a plurality of clamping arms distributed in a circular array, the clamping arm is provided with a fixing hole for fixing the workpiece and a mounting hole for installing a chuck, the mounting holes are arranged in a plurality and distributed at the center of the clamping arm close to the clamping tool, the fixing holes are arranged in parallel in a plurality of rows and distributed in an array along the length direction of the clamping arm, and are used to fix workpieces of different specifications and shapes;

[0008] The clamping tool also includes a pin gauge arranged in cooperation with the fixing hole, the pin gauge includes a gripping portion and a plug-in portion, the gripping portion is arranged in an elliptical shape; the elliptical shape satisfies: 2a=4d-2r and 2b=2d-2r;

[0009] Wherein, 2a represents the major axis of the ellipse, 2b represents the minor axis of the ellipse, and d represents the center distance between adjacent fixing holes along the length direction of the clamp arm.

[0010] In addition to the above technical features, the present invention also makes improvements in the following aspects:

[0011] In some embodiments, the clamp arm is configured as a rectangular parallelepiped structure, one end of the clamp arm of the rectangular parallelepiped structure is configured as an end of a triangular structure, and the included angle of the end of the triangular structure is 120°.

[0012] In some embodiments, the diameter of the mounting hole on the clamp arm is φ5-8 mm, the spacing between adjacent mounting holes is 8-12 mm, and the taper at the opening is 45°.

[0013] In some embodiments, the diameter of the fixing hole on the clamp arm is φ5-8 mm, the spacing between adjacent fixing holes is 8-12 mm, and the taper at the opening is 15°;

[0014] The clamp arm is provided with four rows of fixing holes, which are arranged in parallel with each other, and the distance between two adjacent rows of holes is 1.5 times the hole spacing. The two middle rows of fixing holes and the two rows of fixing holes arranged on both sides are staggered, and the offset spacing between adjacent fixing holes is 1 / 2 of the hole spacing.

[0015] In some embodiments, the pin gauge is set to a variety of specifications to match the fixing holes on the clamping arm; for workpieces of different specifications, the pin gauge is inserted into the fixing hole by moving it to adapt to the clamping of different workpieces.

[0016] In some embodiments, when performing a clamping operation, the clamping arm places the component at a preset position, inserts the pin gauge into the fixing hole of the clamping arm and rotates it to abut against the workpiece, and the long axis section of the elliptical cylindrical structure of the pin gauge abuts against the edge of the workpiece to clamp and tighten the workpiece.

[0017] In some embodiments, when a component has a complex surface and needs to be flipped, the clamping arm is used to remove the pin gauge and flip the workpiece for secondary clamping and fixing of the workpiece.

[0018] Another object of the present invention is to provide a method for thermal spraying semiconductor etching chamber components, which specifically comprises the following steps:

[0019] Workpiece pretreatment: The workpiece surface is sandblasted and the surface roughness of the workpiece after sandblasting is controlled between Ra4 and 6;

[0020] Workpiece handling and positioning: The pre-processed workpiece is transported to the visual recognition point by the AGV trolley. After the workpiece is recognized by the visual sensor, the clamping arm transports the workpiece to the workpiece rotating device and fixes it with a pin gauge.

[0021] Workpiece clamping: Use visual sensors to identify the workpiece diameter, select the appropriate combination of pin gauge and hole, and use the spray clamping mechanism of the semiconductor etching chamber component to clamp the workpiece;

[0022] Workpiece spraying: A spraying robot is used to select the corresponding material and process for workpiece spraying according to the workpiece model identified by the visual sensor;

[0023] Flip and back spraying: After one-side spraying is completed, the workpiece is flipped over by the clamping arm and the back is sprayed. During the spraying process, the infrared thermometer monitors the workpiece temperature in real time and automatically adjusts the air cooling intensity of the cooling device according to the temperature change to ensure that the workpiece temperature is always controlled between 60-120℃.

[0024] Post-processing: After spraying is completed, the clamping arm moves the workpiece to the AGV cart and transports it to the post-processing area.

[0025] In some embodiments, the workpiece spraying step further includes a spraying interruption and spraying recovery procedure, wherein:

[0026] When the workpiece temperature exceeds 110°C, the spray robot will enable the interrupt program and leave the spraying area after the current spraying cycle is completed;

[0027] When the workpiece temperature drops below 80°C, the spraying robot will resume the spraying program and inherit the original spraying progress.

[0028] By adopting the above technical solution, the present invention has at least one of the following beneficial effects:

[0029] 1. The present invention has efficient and flexible clamping capabilities. The clamping arm of the clamping tool is provided with multiple rows of fixed holes distributed in an array and multiple mounting holes, which can fix workpieces of different specifications and shapes, greatly improving the versatility of the clamping mechanism, and can be applied to the clamping needs of various types of workpieces in the production process of semiconductor etching chamber components, reducing the time cost of frequently replacing the clamping tool due to different workpiece specifications, and improving production efficiency. The needle gauge is set to a variety of specifications and can be moved and inserted into different positions of the fixed hole, further enhancing the adaptability to workpieces of different sizes. By adjusting the position of the needle gauge, various workpieces can be effectively clamped accurately to ensure the stability of the workpiece during the spraying process.

[0030] 2. The present invention can achieve accurate clamping of the workpiece and improve the stability of the clamping. The gripping part of the needle gauge is set to an ellipse, and the ratio of the length of the major axis to the minor axis and the spacing between the fixed holes meet the fixed hole radius and the center distance. There is a specific calculation formula, which can ensure that when clamping, the long axis section of the elliptical columnar structure of the needle gauge can accurately abut against the edge of the workpiece. The long axis section of the elliptical columnar structure abuts against the edge of the workpiece for clamping and tightening, which effectively prevents the workpiece from displacement or shaking during the spraying process, and ensures the accuracy and quality of the spraying.

[0031] 3. The present invention is convenient and efficient in operation. The clamping arm is set as a rectangular parallelepiped structure and one end is a triangular end with a specific angle, which is convenient for the clamping arm to place the workpiece in a preset position and perform subsequent needle gauge insertion operations, reducing interference and operational difficulty during the clamping process and improving clamping efficiency. When parts have complex surfaces that need to be flipped, the clamping arm can easily remove the needle gauge and flip the workpiece for secondary clamping and fixing. The whole process is easy to operate and does not require complicated tooling switching or adjustment, which is conducive to shortening the turnaround time of workpiece spraying and improving production efficiency. It is particularly suitable for mass production of semiconductor etching chamber parts.

[0032] 4. The present invention can realize efficient and stable spraying process and quality control. The thermal spraying processing method combines technologies such as automated handling, visual recognition, precise clamping and intelligent spraying, realizing a fully automated process from workpiece pretreatment to post-processing. The spraying robot selects the corresponding material and process for spraying according to the workpiece model identified by the visual sensor, ensuring the consistency and stability of the spraying. At the same time, the infrared thermometer monitors the workpiece temperature in real time, and automatically adjusts the air cooling intensity of the cooling device according to the temperature changes, avoiding problems such as coating quality degradation or workpiece deformation caused by excessive temperature.

[0033] 5. The present invention has intelligent control and interruption recovery functions: The spraying robot has intelligent control functions and can automatically adjust the spraying strategy according to the temperature of the workpiece. When the temperature of the workpiece exceeds the set threshold, the robot will automatically interrupt the spraying and leave the spraying area. After the temperature of the workpiece drops to a safe range, the spraying program will be resumed and the original spraying progress will be inherited. This design not only protects the workpiece and spraying equipment, but also ensures the continuity and stability of the spraying process.

[0034] 6. The present invention improves production efficiency and reduces costs: The spray clamping mechanism and thermal spray processing method of the present invention greatly improve production efficiency and reduce labor costs through highly automated and intelligent design. At the same time, precise clamping and positioning as well as stable spraying process reduce scrap rate and rework rate, further reducing production costs.

[0035] To sum up, the spray clamping mechanism for semiconductor etching chamber components and the thermal spray processing method thereof provided by the present invention have high flexibility, precision, stability and intelligence, significantly improve production efficiency and quality, reduce production costs, and provide strong technical support and solutions for the spray processing of semiconductor etching chamber components. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] The drawings described herein are used to provide further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute improper limitations on the present invention.

[0037] Figure 1 Schematic diagram of the distribution structure of the clamp arm;

[0038] Figure 2 It is a schematic diagram of the overall structure of the clamping mechanism in the present invention;

[0039] Figure 3 This is a schematic diagram of the structure after the clamp arm is installed with the workpiece;

[0040] Figure 4 It is a schematic diagram of the long axis side, short axis measurement and top view of the needle gauge;

[0041] Figure 5 It is a partial longitudinal section view of the clamp arm and the turntable after being assembled;

[0042] Figure 6 It is a structural schematic diagram and longitudinal cross-sectional view of a single clamp arm;

[0043] Figure 7 This is a flow chart of the thermal spraying method for semiconductor etching chamber components of the present invention;

[0044] Figure 8 It is a schematic diagram of the overall structure of the thermal spraying system for semiconductor etching chamber components of the present invention.

[0045] The numbers in the figure are as follows:

[0046] 100. Spraying room; 200. Visual sensor; 300. Rotating mechanism; 312. Clamping arm; 321. Fixing hole; 322. Mounting hole; 313. Pin gauge; 3131. Gripping part; 3132. Connecting part; 400. Handling robot; 500. Spraying robot. DETAILED DESCRIPTION

[0047] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative and is not intended to be any limitation on the present invention and its application or use. The present invention can be implemented in other different forms and is not limited to the embodiments described herein.

[0048] 1. Explanation of Descriptive Terms in the Present Invention

[0049] The embodiments of the present invention in combination with the technical solutions are intended to make the present invention more thorough and complete, and to fully express the scope of the present invention to those skilled in the art. It should be noted that unless otherwise specifically described in the present invention, the relative arrangement of the components described in these embodiments should be interpreted as merely exemplary, rather than as a limitation to the technical solutions of the present invention.

[0050] If the present invention involves the use of directional terms such as "upper", "lower", "left", "right", "bottom", "top", etc., they are defined relative to the directions in the respective drawings and are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. These or other directional terms should not be understood as restrictive terms.

[0051] In the present invention, the words "a", "an", "a", "the" and the like do not indicate a quantity limitation and may indicate the singular or plural. The terms "include", "comprises", "has" and any variations thereof involved in the present invention are intended to cover non-exclusive inclusions; the terms "first", "second", "third" and the like involved in the present invention are merely used to distinguish similar objects and do not represent a specific ordering of the objects.

[0052] In the present invention, when a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device. When a specific device is described as being connected to other devices, the specific device may be directly connected to the other devices without an intermediate device, or may not be directly connected to the other devices but have an intermediate device.

[0053] In addition, the present invention does not discuss in detail the techniques and devices known to ordinary technicians in the relevant fields, but where appropriate, the techniques and devices should be considered as part of the specification.

[0054] Second, in the thermal spraying process of semiconductor etching chamber components, technical problems emerge one after another. These parts have complex and irregular shapes, which brings great challenges to automatic clamping and precise positioning, and seriously restricts the accuracy and production efficiency of spraying.

[0055] Thermal spraying has extremely high requirements for temperature control, but it is difficult to achieve precise temperature control with existing technologies, which may lead to unstable or even reduced coating performance. In addition, the diverse shapes and sizes of parts and the complexity of the spraying area make it difficult to ensure the uniformity and consistency of the spraying quality, which may cause performance differences or early failure of parts.

[0056] Current automated spraying equipment is mainly suitable for parts with regular shapes and simple structures. It is inadequate for semiconductor etching chamber parts with complex and irregular shapes and cannot meet the needs of efficient and precise spraying. The present invention particularly provides a technical solution to the above problems. The technical solution, working principle and technical effects of the present invention are described in detail below in conjunction with specific embodiments.

[0057] like Figure 1 , Figure 2 , Figure 5 , Figure 6 As shown, the spray clamping mechanism of the semiconductor etching chamber component of the present invention is mainly composed of a clamping arm, a turntable and a clamping tool. The clamping arm is responsible for the transfer of the workpiece, and the clamping tool is installed on the turntable to achieve the fixation and rotation of the workpiece.

[0058] The core of the clamping tool is the clamping arms 312 distributed in a circular array.

[0059] Each clamping arm 312 is provided with a plurality of fixing holes 321 for fixing the workpiece and a mounting hole 322 for mounting the chuck.

[0060] like Figure 3 , Figure 4 As shown, in addition, each clamping arm 312 is also equipped with a pin gauge 313 that is arranged in cooperation with the fixing hole 321, and the pin gauge 313 is composed of a gripping portion 3131 and an inserting portion 3132, wherein the gripping portion 3131 is designed to be elliptical so as to closely abut against the edge of the workpiece to achieve stable clamping.

[0061] Design of the fixing holes 321: The fixing holes 321 are arranged in a multi-row array along the length direction of the clamp arm 312 to accommodate workpieces of different specifications and shapes. The radius of the fixing holes 321 is r, and the center distance is d.

[0062] In this embodiment, when r=3 cm, d=10 cm, according to the formulas 2a=4d-2r and 2b=2d-2r, the ellipse length of the needle gauge 313 should be 34 cm, and the ellipse width should be 14 cm. Such a design ensures a good fit between the needle gauge 313, the fixing hole 321 and the workpiece.

[0063] The clamp arm 312 is designed as a rectangular parallelepiped structure to enhance its strength and stability. One end of the clamp arm 312 is designed as a triangular structure with an end angle of 120°. This design helps to disperse stress and improve the durability of the clamp arm 312. At the same time, the triangular structure is also convenient for forming a stable support point with the edge of the workpiece.

[0064] As an optimization, multiple mounting holes 322 are set, and multiple mounting holes 322 are distributed at the center of the clamping arm 312 close to the clamping tooling. The hole diameter is φ5-8mm, the hole spacing between adjacent mounting holes 322 is 8~12mm, and the taper at the opening is 45° to facilitate the installation and fixation of the chuck.

[0065] The fixing holes 321 are also φ5-8 mm, and the hole spacing between adjacent fixing holes 321 is also 8-12 mm, but the taper at the opening is 15° to facilitate the insertion and rotation of the needle gauge 313.

[0066] There are four rows of fixing holes 321 on the clamp arm 312, which are arranged in parallel with each other, and the distance between two adjacent rows of holes is 1.5 times the hole spacing. The two rows of fixing holes 321 in the middle are staggered with the two rows of fixing holes 321 on both sides, and the offset spacing between adjacent fixing holes 321 is 1 / 2 of the hole spacing. This design improves the flexibility and stability of workpiece fixing.

[0067] Based on the spraying and clamping mechanism of the semiconductor etching chamber component described in the above embodiment, the spraying and clamping operation process is as follows:

[0068] Workpiece placement: The clamping arm places the semiconductor etching chamber parts to be sprayed at the preset position.

[0069] Insertion and rotation of the pin gauge 313: insert a pin gauge 313 of appropriate specifications into the fixing hole 321 of the clamp arm 312, and rotate the pin gauge 313 so that the long axis section of the elliptical gripping portion 3131 is tightly abutted against the edge of the workpiece, thereby achieving clamping and fastening of the workpiece.

[0070] Workpiece rotation and spraying: Start the turntable to make the workpiece rotate evenly during the spraying process to ensure the uniformity and consistency of the spraying. At the same time, the spraying robot 500 performs the spraying operation according to the preset program and parameters.

[0071] Workpiece flipping and secondary clamping: When the workpiece has a complex surface and needs to be flipped, the clamping arm will first remove the pin gauge 313, then flip the workpiece to the other side, and reinsert the pin gauge 313 for secondary clamping. Then the spraying operation will be carried out again.

[0072] like Figure 8 As shown, the present invention describes a thermal spraying system for semiconductor etching chamber components, which consists of a spraying room 100, a high-precision visual sensor 200, a flexible rotating mechanism 300, an efficient transport robot 400, a spraying robot 500 and an integrated control unit.

[0073] The spray booth 100 adopts a rectangular floor-mounted suction structure with a reasonable design, which facilitates the smooth entry and exit of the AGV. It is also equipped with an automated door and optimized air inlets and outlets, providing a stable and efficient working environment for the spraying process.

[0074] The visual sensor 200 is precisely installed at the warehouse door, and can capture the shape, type and exact position of parts in real time, providing accurate data support for subsequent operations.

[0075] The Rotary Mechanism 300 is composed of a stable base, a flexible turntable, a precise chuck and an innovative clamping mechanism. The base is equipped with a high-performance servo motor to ensure that the parts can be accurately rotated and positioned.

[0076] like Figure 1 , Figure 3 As shown, the clamping mechanism part adopts a clamping arm 312 and a needle gauge 313 of various specifications. This unique design enables the system to easily adapt to the clamping needs of parts of various shapes and sizes.

[0077] The clamping arm 312 is composed of three rectangular parallelepiped structures distributed in a circular array. One end of the rectangular parallelepiped structure is processed into a 120° angle to meet the clamping requirements of parts of different shapes and sizes.

[0078] The various specifications of the pin gauges 313 are closely matched with the holes on the clamp arm 312 to ensure that the parts are firmly clamped and accurately positioned.

[0079] In this embodiment, the clamp arm 312 is composed of three rectangular aluminum blocks (350×50×20mm) distributed in a circular array, one end of which is processed into a 120° angle. The clamp arm is punched with holes every 2.5mm with a diameter of 80 to 690mm, with a hole diameter of φ4±0.1, and a taper of 15° is set at the opening of the hole.

[0080] There are 10 specifications of needle gauge 313. You can achieve clamping with smaller gaps by reducing the intervals and increasing the specifications of needle gauge 313.

[0081] The selection of a suitable combination of pin gauge 313 and hole can achieve the clamping of parts with a clearance less than 0.25 mm.

[0082] Through the precise design of the hole position on the clamp arm 312 and the strict calculation of the hole diameter, depth and taper, a perfect match with the needle gauge 313 is ensured, thereby improving the clamping stability and accuracy.

[0083] The handling robot 400 is equipped with a flexible gripper and is responsible for efficiently handling parts between the AGV and the rotating mechanism 300. The spraying robot 500 is closely connected to the visual sensor 200 and can receive and process visual signals in real time, automatically identify the type of parts, and select the most suitable spraying program for precise spraying.

[0084] In order to further improve the automation level of the system, the present invention introduces a visual sensor, which can quickly identify the diameter of the part through machine vision, and automatically adjust the clamping force of the three-jaw chuck 311 and select the appropriate combination of the pin gauge 313 and the clamp arm 312 hole position to achieve automatic clamping and positioning of the part.

[0085] The present invention also performs well in temperature control. The present invention is equipped with an advanced temperature control system and cooling system, wherein the cooling system uses multiple sets of high-efficiency air cooling devices to evenly and accurately cool the parts through flat nozzles. The temperature of the parts during the entire thermal spraying process needs to be controlled between 60-120°C. The cooling nozzle air outlet adopts a duckbill shape, using 0.4MPa, 50±5cm away from the parts, and 45°±5° angle to blow towards the parts, effectively controlling the temperature of the parts during the spraying process.

[0086] The temperature control system uses a high-precision infrared thermometer to monitor and adjust the temperature of parts in real time to ensure the stability and consistency of spraying quality.

[0087] In addition, the present invention also fully considers environmental protection and cleaning issues. In order to reduce dust pollution generated during the spraying process, the system is equipped with a dust removal device and a dust collection device. The dust collector is arranged outside the spraying room 100 and is connected to the air outlet at the bottom of the spraying room 100 through a ventilation pipeline to effectively collect and treat the dust generated during the spraying process. The dust collection device is located below the dust collector and is used to store and treat the collected spray dust in a safe and environmentally friendly manner.

[0088] Based on the above description, in order to more clearly illustrate the technical solution of the present application, its working principle is now specifically described as follows:

[0089] 1. System startup and parts preparation

[0090] AGV trolley transportation: After the system is started, the AGV (automatic guided vehicle) trolley automatically transports the semiconductor etching chamber components to be sprayed from the storage area to the entrance of the spray room 100.

[0091] Automatic door control: The automatic door of the spray booth 100 automatically opens upon sensing the arrival of the AGV, allowing the vehicle and parts to smoothly enter the spray booth 100. Subsequently, the door closes to ensure the closedness and stability of the spray environment.

[0092] 2. Parts identification and precise positioning

[0093] Visual sensor 200 identification: The high-precision visual sensor 200, installed near the warehouse door, captures the incoming parts in real time and identifies their shape, type and precise location.

[0094] Data transmission and processing: Identification data is instantly transmitted to the integrated control unit, which processes the data and provides precise guidance for subsequent operations.

[0095] 3. Automatic clamping of parts

[0096] Operation of the handling robot 400: The handling robot 400 uses flexible grippers to remove parts from the AGV trolley and accurately places them on the chuck of the rotating mechanism 300 according to the instructions of the control unit.

[0097] Automatic identification and adjustment: The visual sensor quickly identifies the diameter of the part through machine vision, and at the same time, selects the appropriate combination of the pin gauge 313 and the hole position on the clamp arm 312 to ensure the stability of the part clamping and the accuracy of positioning.

[0098] 4. Spraying preparation and temperature control

[0099] Selection of spraying program: The spraying robot 500 is closely connected with the visual sensor 200, receives the processed visual signals in real time, and automatically selects the most suitable spraying program according to the part type.

[0100] Temperature monitoring and preheating: The temperature control system monitors the real-time temperature of the parts through a high-precision infrared thermometer. Before spraying, the parts need to be preheated to ensure good adhesion of the spray material.

[0101] 5. Precision spraying process

[0102] Spraying operation: The spraying robot 500 sprays the parts evenly and accurately according to the preset spraying program. During the spraying process, the robot will adjust the spraying path and speed according to the shape and size of the parts to ensure the spraying quality.

[0103] Temperature and cooling control: The temperature control system continuously monitors the temperature of the parts and automatically adjusts the cooling intensity of the cooling system as needed. Multiple sets of high-efficiency air cooling devices cool the parts evenly through flat nozzles to ensure that the temperature during the spraying process is controlled within the optimal range.

[0104] 6. Spraying completion and parts unloading

[0105] Spraying completion judgment: When the spraying robot 500 completes all preset spraying programs, it will send a spraying completion signal to the control unit.

[0106] Part rotation and unloading: The rotating mechanism 300 rotates the part to the unloading position according to the instruction of the control unit. The handling robot 400 uses the gripper to remove the part from the chuck again and transports it to the AGV.

[0107] AGV trolley transports the parts out of the spray room: The AGV trolley carries the sprayed parts and automatically drives out of the spray room 100 to prepare for the next process or storage.

[0108] 7. Environmental protection and cleaning

[0109] Dust collection and treatment: During the entire spraying process, the dust removal device is connected to the bottom air outlet of the spraying room 100 through the ventilation duct to continuously collect and treat the dust generated during the spraying process. The dust collection device is responsible for storing and treating the dust safely and environmentally friendly.

[0110] In summary, the thermal spraying system for semiconductor etching chamber components proposed in the present invention realizes fully automated operations from parts identification, clamping, spraying to unloading through a series of precise automated processes and control mechanisms. At the same time, the system also focuses on temperature control and environmentally friendly cleaning treatment to ensure the stability and consistency of the spraying quality, as well as the cleanliness and environmental protection of the working environment. This innovative system provides strong technical support for the high-quality development of the semiconductor industry.

[0111] like Figure 7 As shown, the present invention also describes a method for thermal spraying semiconductor etching chamber components, which specifically includes the following steps:

[0112] S100, Parts Pretreatment

[0113] Sandblasting: Use appropriate sandblasting equipment and abrasives to evenly sandblast the surface of the parts. The surface roughness of the parts after sandblasting is controlled between Ra4 and 6, preferably between Ra4.5 and 5.5.

[0114] In addition, additional steps such as anodizing, degreasing and masking can be performed according to the material and requirements of the parts. Ensure that the surface of the treated parts is clean, free of oil and oxide layer, and protect the areas that do not need to be sprayed.

[0115] S200, parts handling and positioning

[0116] S201, AGV trolley transportation: Use AGV trolley to transport the pre-processed parts from the storage area to the visual recognition point of the spray room.

[0117] S202, visual sensor recognition: the visual sensor recognizes the part and obtains the shape, type and position information of the part. The recognition result signal is transmitted to the control unit through the analog input interface.

[0118] S203, handling robot positioning: The control unit automatically calls the corresponding handling program according to the recognition result of the visual sensor. The handling robot uses the gripper to accurately grasp the part and transport it to the part rotating device.

[0119] S300, Parts Clamping

[0120] S301, Visual sensor recognition: The visual sensor recognizes the diameter of the part through machine vision. According to the recognition result, the clamping force of the three-jaw chuck is automatically adjusted, and the appropriate pin gauge is selected to combine with the hole on the clamp arm.

[0121] S302, Clamping mechanism: Use the clamping mechanism (clamping arm and pin gauge) to firmly clamp the parts. Ensure that the parts will not loosen or deviate during the spraying process.

[0122] S400, parts spraying

[0123] S401, preheating step: the spraying robot first preheats the parts. When the preheating temperature reaches 60°C, powder spraying begins.

[0124] S402, select spraying program: the spraying robot selects the corresponding spraying material and process parameters according to the part model recognized by the visual sensor.

[0125] S403, spraying operation: the spraying robot sprays the parts evenly according to the set program. During the spraying process, the infrared thermometer monitors the temperature of the parts in real time.

[0126] S500, flip and back spraying

[0127] S501, flipping operation: After one-side spraying is completed, the handling robot flips the parts over to ensure that the parts are positioned accurately after flipping to facilitate back-side spraying.

[0128] S502, back spraying: spray the back of the turned over part. During the spraying process, continue to monitor the temperature of the part and adjust the air cooling intensity of the cooling device as needed.

[0129] S503, Temperature control: When the temperature of the part rises by 10℃, a group of air cooling devices is turned on for cooling. When the temperature of the part reaches 100℃, all cooling devices are turned on, and the flat nozzle blows 0.4MPa compressed air to cool the part. The nozzle is kept 50±5cm away from the surface of the part and blows at the part at an angle of 45°±5° to ensure that the temperature of the part is always controlled between 60-120℃.

[0130] S600, spraying interruption and recovery

[0131] S601, spraying interruption: When the temperature of the part exceeds 110°C, the spraying robot will activate the interruption program. After completing the current cycle, the spraying robot leaves the spraying area and waits for the part temperature to drop.

[0132] S602, spraying recovery: When the temperature of the part drops below 80°C, the spraying robot will resume the spraying program. The spraying robot inherits the original spraying progress and continues to spray the part.

[0133] S700, post-processing

[0134] S701, transport to AGV: After spraying is completed, the handling robot removes the parts from the parts rotating device. Then the parts are transported to the AGV and prepared to be transported to the post-processing area.

[0135] S702, post-processing operation:

[0136] The AGV transports the parts to the post-processing area for further inspection, cleaning, packaging and other operations.

[0137] Through the method steps of the above specific implementation methods, the thermal spraying method for semiconductor etching chamber components provided by the present invention can realize efficient, automated and precise spraying operation, while ensuring that the temperature of the parts during the spraying process is effectively controlled, thereby improving the spraying quality and production efficiency.

[0138] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0139] In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it; when the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

Claims

1. A spraying clamping mechanism for semiconductor etching chamber components, characterized in that: It comprises a clamping arm, a turntable and a clamping tool, wherein the clamping arm is used to transfer the workpiece, the clamping tool is installed on the turntable, the clamping tool comprises a plurality of clamping arms distributed in a circular array, the clamping arm is provided with a fixing hole for fixing the workpiece and a mounting hole for installing a chuck, the mounting holes are provided in a plurality and are distributed at the center of the clamping arm close to the clamping tool, the fixing holes are arranged in parallel in a plurality of rows and are distributed in an array along the length direction of the clamping arm, and are used to fix workpieces of different specifications and shapes; The clamping tool also includes a pin gauge arranged in cooperation with the fixing hole, the pin gauge includes a gripping portion and a plug-in portion, the gripping portion is arranged in an elliptical shape; the elliptical shape satisfies: 2a=4d-2r and 2b=2d-2r; Wherein, 2a represents the major axis of the ellipse, 2b represents the minor axis of the ellipse, and d represents the center distance between adjacent fixing holes along the length direction of the clamp arm.

2. The spraying clamping mechanism for semiconductor etching chamber components according to claim 1, characterized in that: The clamp arm is configured as a rectangular parallelepiped structure, one end of the clamp arm of the rectangular parallelepiped structure is configured as an end of a triangular structure, and the included angle of the end of the triangular structure is 120°.

3. The spraying clamping mechanism for semiconductor etching chamber components according to claim 1 or 2, characterized in that: The diameter of the mounting hole on the clamp arm is φ5-8mm, the hole spacing between adjacent mounting holes is 8-12mm, and the taper at the opening is 45°.

4. The spraying clamping mechanism for semiconductor etching chamber components according to claim 3, characterized in that: The diameter of the fixing holes on the clamp arm is φ5-8mm, the spacing between adjacent fixing holes is 8-12mm, and the taper at the opening is 15°; The clamp arm is provided with four rows of fixing holes, which are arranged in parallel with each other, and the distance between two adjacent rows of holes is 1.5 times the hole spacing. The two middle rows of fixing holes and the two rows of fixing holes arranged on both sides are staggered, and the offset spacing between adjacent fixing holes is 1 / 2 of the hole spacing.

5. The spraying clamping mechanism for semiconductor etching chamber components according to claim 1, characterized in that: The pin gauge is provided with various specifications for matching with the fixing holes on the clamping arm; for workpieces of different specifications, the position of the pin gauge inserted into the fixing hole is moved to adapt to the clamping of different workpieces.

6. The spraying clamping mechanism for semiconductor etching chamber components according to claim 1, characterized in that: When performing the clamping operation, after the clamping arm places the component at a preset position, the pin gauge is inserted into the fixing hole of the clamping arm and rotated to abut against the workpiece, and the long axis section of the elliptical cylindrical structure of the pin gauge abuts against the edge of the workpiece to clamp and tighten the workpiece.

7. The spraying clamping mechanism for semiconductor etching chamber components according to claim 6, characterized in that: When a component has a complex surface and needs to be turned over, the clamping arm is used to remove the pin gauge and turn the workpiece over, and is used to perform secondary clamping and fixing of the workpiece.

8. A thermal spraying method for semiconductor etching chamber components, characterized in that: A spraying clamping mechanism for semiconductor etching chamber components using any one of claims 1 to 7 specifically comprises the following steps: Workpiece pretreatment: The workpiece surface is sandblasted and the surface roughness of the workpiece after sandblasting is controlled between Ra4 and 6; Workpiece handling and positioning: The pre-processed workpiece is transported to the visual recognition point by the AGV trolley. After the workpiece is recognized by the visual sensor, the clamping arm transports the workpiece to the workpiece rotating device and fixes it with a pin gauge. Workpiece clamping: Use visual sensors to identify the workpiece diameter, select the appropriate combination of pin gauge and hole, and use the spray clamping mechanism of the semiconductor etching chamber component to clamp the workpiece; Workpiece spraying: A spraying robot is used to select the corresponding material and process for workpiece spraying according to the workpiece model identified by the visual sensor; Flip and back spraying: After one-side spraying is completed, the workpiece is flipped over by the clamping arm and the back side is sprayed; During the spraying process, the infrared thermometer monitors the workpiece temperature in real time and automatically adjusts the air cooling intensity of the cooling device according to the temperature changes to ensure that the workpiece temperature is always controlled between 60-120℃; Post-processing: After spraying is completed, the clamping arm moves the workpiece to the AGV cart and transports it to the post-processing area.

9. The thermal spraying method according to claim 8, characterized in that: The workpiece spraying step further includes a spraying interruption and spraying recovery procedure, wherein: When the workpiece temperature exceeds 110°C, the spray robot will enable the interrupt program and leave the spraying area after the current spraying cycle is completed; When the workpiece temperature drops below 80°C, the spraying robot will resume the spraying program and inherit the original spraying progress.

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