Electroplating liquid recycling device and method for real-time online treatment

Abstract

The invention provides a real-time online treatment electroplating liquid recycling device and method.The device comprises an electroplating cavity, a flow guide pipe, a recycling cavity, a liquid sealing device, a pump body and a backflow pipe; a liquid outlet of the electroplating cavity is connected with a liquid inlet of the recycling cavity through a flow guide pipe, a liquid outlet of the recycling cavity is connected with a liquid inlet of the electroplating cavity through a backflow pipe, and the pump body and the liquid sealing device are arranged on the backflow pipe. The recycling cavity comprises a water removal device and an oxygen removal device, the water removal device is used for removing the water content exceeding a preset value in the electroplating liquid, and the oxygen removal device is used for removing oxygen in the electroplating liquid so that the oxygen content can be reduced to the ppm magnitude range. Oxygen and excessive water in the electroplating waste liquid are removed through the recycling cavity, the electroplating waste liquid is treated in time through the design of the flow guide pipe and the backflow pipe, and the treated electroplating waste liquid is input into the electroplating cavity in time, so that online recycling of the electroplating liquid is achieved, efficiency is greatly improved, stability of the electroplating liquid is maintained, and meanwhile, the production cost is reduced. The liquid sealing device is arranged on the return pipe, so that the electroplating liquid after deoxygenization operation is prevented from entering air again.

Description

Technical Field

[0001] This invention relates to the field of electroplating equipment technology, specifically to an electroplating solution recovery and circulation device and method for real-time online processing, and particularly to an oxygen-barrier circulation device and method for real-time online processing of electroplating solution recovery, dewatering, and deoxygenation quality control. Background Technology

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. It is a process that uses electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation (such as rust), improving wear resistance, conductivity, reflectivity, corrosion resistance (such as copper sulfate), and enhancing aesthetics.

[0003] The concentration of the electroplating solution and whether it contains oxygen are the two major factors affecting the electroplating effect of wafers.

[0004] During wafer electroplating, the water content in the plating solution increases over time, meaning the solution concentration decreases. Too low a concentration leads to weak adhesion, resulting in a thin or nonexistent coating on the wafer surface. It can also cause a dark coating with black spots, lack of luster, and noticeable haze. To maintain a stable plating solution concentration at the required level, existing technologies employ two solutions: First, continuously adding the missing substances to the plating chamber during electroplating—that is, adding the chemicals consumed in the electrolytic reaction. This method requires monitoring the concentration of chemicals consumed during the plating process, necessitating real-time precision chemical composition analyzers and corresponding calibration techniques and time limits, making it very costly. Second, replenishing the plating solution. However, since precious metal ion plating solutions are generally produced in small quantities and are expensive—for example, when plating gold—adding gold plating solution while plating using the above method could lead to excessively high consumable costs, impacting product competitiveness, and causing significant waste and environmental pollution of the gold plating solution. If the concentration of gold ions in the electroplating solution cannot be maintained at the level required for the reaction, the resulting plating layer will be thin or nonexistent on the wafer surface due to weak adhesion.

[0005] When the oxygen content in the electroplating solution exceeds a certain level, it can easily become unstable and prevent normal production. The oxygen in the electroplating solution mainly originates from two sources: First, because horizontal wafer electroplating cavities have an upward-facing structure, during electroplating, the plating head clamps the wafer and lowers it into the cavity. The agitation during this process creates negative pressure, thus introducing excess air into the electroplating solution. Second, during electroplating, oxidants (such as nitric acid and hydrogen peroxide) or water in the electroplating solution undergo electrolytic reactions, producing oxygen. Currently, there is no effective and convenient method to eliminate or reduce the oxygen content in the electroplating solution.

[0006] To address the aforementioned issues, existing technologies propose recycling electroplating wastewater. However, this recycling process is offline, meaning the wastewater is discharged and stored separately until recycling is completed before being reintroduced into the electroplating chamber. When plating precious metals such as gold, offline processing of the electroplating solution, which takes a considerable amount of time, makes it difficult to supply the necessary components to the solution in a timely manner. Furthermore, the instability of the electroplating solution can negatively impact the final wafer coating effect. Summary of the Invention

[0007] In view of the deficiencies in the prior art, the present invention aims to ensure the stability of the electroplating solution, save the electroplating solution to reduce waste and consumption, and prevent air bubbles from mixing into the electroplating solution. It provides an oxygen-free and pollution-free electroplating solution recycling and regeneration device and method that uses an oxygen-free liquid seal device, an electroplating tank, and an electroplating chamber for circulation.

[0008] To achieve the above-mentioned objectives, the present invention provides the following technical solution:

[0009] A real-time online electroplating solution recycling device includes an electroplating chamber, a guide pipe, a recycling chamber, a liquid sealing device, a pump body, and a return pipe.

[0010] The outlet of the electroplating chamber is connected to the inlet of the recovery chamber through a guide pipe, and the outlet of the recovery chamber is connected to the inlet of the electroplating chamber through a return pipe. The pump body and liquid seal device are installed on the return pipe.

[0011] The recovery chamber is equipped with a water removal device and a deoxygenation device. The water removal device is used to remove the portion of water content in the electroplating solution in the recovery chamber that exceeds a preset value, and the deoxygenation device is used to remove oxygen in the electroplating solution in the recovery chamber, reducing it to the ppm level.

[0012] This technical solution, through the aforementioned structural design, utilizes a recovery chamber to remove oxygen and excess moisture from the electroplating waste liquid. The design of the guide pipe and return pipe ensures timely treatment of the electroplating waste liquid, which is then promptly returned to the electroplating chamber. This achieves online electroplating solution recycling, significantly improving efficiency and maintaining the stability of the electroplating solution. Furthermore, this technical solution incorporates a liquid seal device on the return pipe to prevent the electroplating solution from re-entering the air after deoxygenation, thereby minimizing the oxygen content in the electroplating solution.

[0013] Preferably, the dewatering device includes a heating device that heats the electroplating solution to evaporate the portion of moisture exceeding a preset value.

[0014] In this technical solution, the water removal device installed in the recovery chamber is a heating device. The water content exceeding the preset value is evaporated by the operation of the heating device, thereby achieving the purpose of removing excess water from the electroplating solution. The structure is simple and the operation is convenient.

[0015] Preferably, the heating device heats the electroplating solution to 25–60°C.

[0016] Preferably, the deoxygenation device includes a negative pressure vacuum device, which removes oxygen by evacuating the electroplating chamber, reducing it to the ppm level.

[0017] In this technical solution, the deoxygenation device installed in the recovery chamber is a negative pressure vacuum device. The negative pressure vacuum device draws the electroplating chamber into a vacuum to remove oxygen from the electroplating solution, reducing it to the ppm level. The structure is simple and the operation is convenient.

[0018] Preferably, the negative pressure vacuum device increases the pressure of the electroplating chamber to -300 to -100 Pa.

[0019] Preferably, the liquid sealing device is a U-shaped pipeline.

[0020] In this technical solution, by adopting the above-described structural design, the U-shaped pipeline always contains electroplating solution, thereby preventing air from entering the recovery chamber through the return pipe and "contaminating" the treated electroplating solution again.

[0021] Preferably, it also includes a first monitoring device and a dewatering control device. The first monitoring device can monitor the water content of the electroplating solution or the humidity of the free surface of the electroplating solution in real time, and the dewatering control device controls the opening and closing status or operating parameters of the dewatering device based on the data fed back by the first monitoring device.

[0022] In this technical solution, the water content of the electroplating solution in the recovery chamber or the humidity of the free surface of the electroplating solution is monitored in real time by the first monitoring device. Based on this, the water removal control device is controlled to be in the open or closed state or the parameters of the water removal device are controlled, thereby realizing the closed-loop treatment of electroplating solution recovery and ensuring that the water content of the treated electroplating solution meets the expectations.

[0023] Preferably, it also includes a second monitoring device and a deoxygenation control device. The second monitoring device is used to monitor the oxygen content of the electroplating solution in real time, and the deoxygenation control device controls the opening and closing status or operating parameters of the deoxygenation device based on the data fed back by the second monitoring device.

[0024] In this technical solution, the oxygen concentration of the electroplating solution in the recovery chamber is monitored in real time by a second monitoring device, and the oxygen removal device is controlled to be on or off or its parameters are controlled by an oxygen removal control device, thereby achieving closed-loop treatment of electroplating solution recovery and ensuring that the oxygen content of the treated electroplating solution meets expectations.

[0025] Preferably, the inlet and outlet of the recovery chamber are connected to the outlet and inlet of a corresponding number of electroplating chambers through a number of guide pipes and return pipes, and each return pipe is equipped with a pump body and a liquid seal device.

[0026] In this technical solution, by adopting the above-described structural design, the recovery chamber receives electroplating waste liquid from multiple module electroplating chambers, performs deoxygenation and dehydration treatment, and then transports the electroplating liquid back to the corresponding electroplating chamber, thereby greatly simplifying the device and reducing costs.

[0027] A real-time online electroplating solution recycling method, employing any one of the above-described real-time online electroplating solution recycling devices, includes the following steps:

[0028] S1. Place the wafer into the electroplating chamber to carry out the electroplating process;

[0029] S2. Electroplating waste liquid generated during the electroplating process is transported to the recovery chamber through a guide pipe;

[0030] S3. The electroplating waste liquid is dehydrated and deoxygenated in the recovery chamber;

[0031] S4. The treated electroplating solution is pumped back into the electroplating chamber through the return pipe under the drive of the pump body;

[0032] S5. Repeat steps S2 to S4 until the wafer electroplating process is completed.

[0033] Preferably, in step S3, the electroplating solution is heated using a heating device to evaporate the portion of water content exceeding the preset value, and the heating temperature of the heating device is 25 to 60°C; the recovery chamber is evacuated using a vacuum negative pressure device to remove oxygen and reduce it to the ppm level, and the negative pressure vacuum device increases the pressure of the recovery chamber to -300 to -100 Pa.

[0034] In this technical solution, by adopting the method described above, water and oxygen are removed in the recovery chamber, enabling the electroplating solution to be recycled and reused, thereby greatly improving electroplating efficiency and quality and reducing electroplating costs.

[0035] Preferably, when the real-time online electroplating solution recycling device includes a first monitoring device and a dewatering control device, in step S3, when the water content of the electroplating solution or the free surface humidity of the electroplating solution detected by the first monitoring device is equal to or higher than a preset value, the dewatering control device controls or keeps the dewatering device in an open state; when the water content of the electroplating solution or the free surface humidity of the electroplating solution detected by the first monitoring device is lower than the preset value, the dewatering control device controls or keeps the dewatering device in a closed state.

[0036] In this technical solution, the water content of the electroplating solution in the recovery chamber or the humidity of the free surface of the electroplating solution is monitored in real time by the first monitoring device, and the water removal device is controlled by the water removal control device accordingly, thereby realizing the closed-loop treatment of electroplating solution recovery and ensuring that the water content of the treated electroplating solution meets the expectations.

[0037] Preferably, when the real-time online electroplating solution recycling device includes a second monitoring device and a deoxygenation control device, in step S3, when the oxygen content of the electroplating solution detected by the second monitoring device is equal to or higher than a preset value, the deoxygenation control device controls or keeps the deoxygenation device in the open state; when the oxygen content detected by the second monitoring device is lower than the preset value, the deoxygenation control device controls or keeps the deoxygenation device in the closed state.

[0038] In this technical solution, the oxygen concentration of the electroplating solution in the recovery chamber is monitored in real time by a second monitoring device, and the deoxygenation device is controlled by the deoxygenation control device accordingly, thereby realizing closed-loop treatment of electroplating solution recovery and ensuring that the oxygen content of the treated electroplating solution meets the expectations.

[0039] Compared with the prior art, the present invention has the following beneficial effects:

[0040] 1. The electroplating solution recycling and circulation device provided by the present invention removes oxygen and excess water from the electroplating waste solution using a recycling chamber. The design of the guide pipe and return pipe enables the electroplating waste solution to be processed in a timely manner and then promptly returned to the electroplating chamber, thereby achieving online electroplating solution recycling and circulation, greatly improving efficiency and maintaining the stability of the electroplating solution. At the same time, the present invention sets a liquid seal device on the return pipe to prevent the electroplating solution after the deoxygenation operation from re-entering the air, so as to minimize the oxygen content in the electroplating solution.

[0041] 2. The electroplating solution recycling device for real-time online processing provided by the present invention can be further designed such that the recycling chamber receives electroplating solutions from multiple electroplating chambers and transports the processed electroplating solutions back to the corresponding electroplating chambers, thereby further improving the efficiency of electroplating solution recycling and greatly simplifying the device.

[0042] 3. The electroplating solution recycling device and method for real-time online processing provided by the present invention can be designed as open-loop electroplating solution recycling and closed-loop electroplating solution recycling. The open-loop electroplating solution recycling refers to setting the relevant parameters (such as temperature, negative pressure value, time, etc.) of the dehydration device and the deoxygenation device based on the original offline values. The closed-loop electroplating solution recycling refers to adding a monitoring device to monitor the water and oxygen content in the electroplating solution in real time online, so as to control the dehydration device and the deoxygenation device accordingly, thereby ensuring that the water content and oxygen content of the treated electroplating solution meet the expectations.

[0043] 4. The electroplating solution recycling method provided by this invention can achieve the effect of maintaining the electroplating solution concentration stably with high efficiency, while minimizing the oxygen content in the electroplating solution, saving costs, improving electroplating efficiency, and ensuring electroplating quality. Attached Figure Description

[0044] Other features, objects, and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0045] Figure 1 This is a schematic diagram of the electroplating solution recycling device for real-time online processing described in Example 1;

[0046] Figure 2 This is a schematic diagram of the electroplating solution recycling device for real-time online processing described in Example 2;

[0047] Figure 3 This is a schematic diagram of the electroplating solution recycling device for real-time online processing described in Example 3;

[0048] Figure 4 This is a flowchart of the real-time online processing electroplating solution recycling method described in Example 4.

[0049] The diagram shows:

[0050] 100-Real-time online electroplating solution recovery and circulation device;

[0051] 10-Electroplation chamber;

[0052] 20-Guide tube;

[0053] 30 - Recovery chamber;

[0054] 40 - Liquid seal device;

[0055] 50 - Pump body;

[0056] 60 - Return pipe;

[0057] 71-First monitoring device;

[0058] 72 - Second monitoring device;

[0059] 81-Water removal control device;

[0060] 82-Deoxygenation control device;

[0061] 10a - Electroplating chamber;

[0062] 20a - Flow guide tube;

[0063] 40a - Liquid Seal Device;

[0064] 50a - Pump body;

[0065] 60a - Reflux tube;

[0066] 10b - Electroplating chamber;

[0067] 20b - Flow guide tube;

[0068] 40b - Liquid Seal Device;

[0069] 50b - Pump body;

[0070] 60b - Return pipe Detailed Implementation

[0071] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0072] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0073] It should be noted that similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. Furthermore, all directional indications (such as up, down, left, right, front, back, bottom, etc.) in this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indication will also change accordingly. Furthermore, descriptions involving "first," "second," etc., in this application are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated.

[0074] Example 1

[0075] like Figure 1 As shown, this embodiment provides a real-time online electroplating solution recycling device 100, which includes an electroplating chamber 10, a guide pipe 20, a recycling chamber 30, a liquid sealing device 40, a pump body 50, and a return pipe 60.

[0076] The electroplating chamber 10 contains electroplating solution, which provides the environment required for the electroplating process of the wafer. The electroplating chamber 10 is provided with an electroplating chamber inlet and an electroplating chamber outlet. The electroplating chamber inlet is used to input the electroplating solution required for wafer electroplating, and the electroplating chamber outlet is used to discharge electroplating waste liquid.

[0077] The recovery chamber 30 is provided with a recovery chamber inlet and a recovery chamber outlet. The electroplating chamber outlet is connected to the recovery chamber inlet via a guide pipe 20, and the recovery chamber outlet is connected to the electroplating chamber inlet via a return pipe 60, thus forming a closed-loop pipeline.

[0078] The recovery chamber 30 is equipped with a water removal device and a deoxygenation device. The water removal device includes a heating device, which is used to heat the electroplating waste liquid entering the recovery chamber 30 at a temperature of 25-60°C to evaporate the portion of water content in the electroplating liquid in the recovery chamber 30 that exceeds a preset value. The deoxygenation device includes a negative pressure vacuum device, which is used to evacuate the recovery chamber 30 to a pressure of -300 to -100 Pa to remove oxygen from the recovery chamber 30 and the electroplating liquid, reducing the oxygen level to the ppm range.

[0079] During wafer electroplating, the electroplating waste liquid generated in the electroplating chamber 10 enters the recovery chamber 30 through the guide pipe 20. After the recovery chamber 30 is dehydrated and deoxygenated, it enters the electroplating chamber 10 through the return pipe 60, thereby realizing the online treatment and recycling of the electroplating solution.

[0080] Furthermore, the liquid seal device 40 and the pump body 50 are disposed on the return pipe 60. The liquid seal device 40 is a U-shaped pipe containing electroplating solution, which is used to isolate air from entering the recovery chamber 30 through the return pipe 60. The pump body 50 is used to provide the driving force for the electroplating solution after the dewatering and deoxygenation operation to enter the electroplating chamber 10 from the recovery chamber 30 through the return pipe 60.

[0081] The electroplating solution recycling device 100 provided in this embodiment removes oxygen and excess water from the electroplating waste solution using the recycling chamber 30. The design of the guide pipe 20 and the return pipe 60 enables the electroplating waste solution to be processed in a timely manner and then promptly input into the electroplating chamber 10, thereby realizing online electroplating solution recycling, greatly improving efficiency and maintaining the stability of the electroplating solution. At the same time, this embodiment provides a liquid seal device 40 on the return pipe 60 to prevent the electroplating solution after the deoxygenation operation from re-entering the air, so as to minimize the oxygen content in the electroplating solution.

[0082] Example 2

[0083] like Figure 2 As shown, this embodiment provides an online electroplating solution recycling device 100, which is largely the same as the recycling device provided in Embodiment 1. The only difference is that in Embodiment 1, one electroplating chamber 10 corresponds to one recycling chamber 30, while in this embodiment, two electroplating chambers 10a and 10b correspond to one recycling chamber 30. In other embodiments, the number of electroplating chambers 10 can be further increased according to actual needs so that multiple module electroplating chambers are connected to one recycling chamber 30.

[0084] In this embodiment, the liquid inlets of electroplating chambers 10a and 10b are connected to the liquid inlet of recovery chamber 30 through guide pipes 20a and 20b, respectively. The liquid outlet of recovery chamber 30 is connected to the liquid inlets of electroplating chambers 10a and 10b through return pipes 60a and 60b, respectively. Pump bodies 50a and 50b and liquid sealing devices 40a and 40b are respectively installed on return pipes 60a and 60b.

[0085] The electroplating solution recycling device 100 provided in this embodiment allows the recycling chamber 30 to receive electroplating waste liquid from two electroplating chambers 10 and to transport the treated electroplating solution back to the corresponding electroplating chambers 10a and 10b, thereby further improving the efficiency of electroplating solution recycling and greatly simplifying the device.

[0086] Example 3

[0087] The electroplating solution recycling and circulation device 100 provided in Example 1 adopts an open-loop treatment for electroplating solution recycling. It does not have a specially designed monitoring device to monitor the moisture content of the electroplating solution in the recycling chamber 30 or the humidity of the free surface of the electroplating solution in the recycling chamber 30, nor does it monitor the oxygen concentration of the electroplating solution in the recycling chamber 30 online. It mainly relies on the values ​​of the original offline experiment to set the negative pressure value and action time of the deoxygenation device, as well as the heating temperature and action time of the dehydration device.

[0088] like Figure 3 As shown, this embodiment adds a monitoring device and a control device to the basis of embodiment 1 to perform closed-loop recycling treatment of the electroplating solution. The monitoring device includes a first monitoring device 71 and a second monitoring device 72, and the control device includes a dewatering control device 81 and a deoxygenation control device 82. The dewatering control device 81 and the deoxygenation control device 82 can be an integrated design or separate devices.

[0089] The dewatering control device 81 and the deoxygenation control device 82 are respectively connected to the first monitoring device 71 and the second monitoring device 72. The first monitoring device 71 includes a humidity monitoring sensor and a temperature monitoring sensor. The humidity monitoring sensor is used to monitor the water content of the electroplating solution in the recovery chamber 30 or the humidity of the free surface of the electroplating solution, and the temperature monitoring sensor is used to monitor the temperature of the electroplating solution. The first monitoring device 71 feeds back the monitored data to the dewatering control device 81. When the water content of the electroplating solution or the free surface humidity of the electroplating solution detected by its humidity monitoring sensor is equal to or higher than a preset value, the dewatering control device 81 controls the dewatering device to be in or kept in the open state to perform dewatering operation on the electroplating solution. During this process, the dewatering control device 81 can adjust the parameters (such as temperature value, action time, etc.) of the heating equipment included in the dewatering device according to the temperature of the electroplating solution fed back by the first monitoring device 71. When the water content of the electroplating solution or the free surface humidity of the electroplating solution detected by the first monitoring device 71 is lower than the preset value, it indicates that the current dewatering operation has been completed, and the dewatering control device 81 controls the dewatering device to be in the closed state.

[0090] The second monitoring device 72 includes an oxygen concentration monitoring sensor and a pressure monitoring sensor. The oxygen concentration monitoring sensor monitors the oxygen content of the electroplating solution in the recovery chamber 30, and the pressure monitoring sensor monitors the pressure in the recovery chamber 30. The second monitoring device 72 feeds back the monitored data to the deoxygenation control device 82. If the oxygen content value fed back is equal to or higher than a preset value, the deoxygenation control device 82 controls or keeps the deoxygenation device in the open state to perform deoxygenation operation. During this process, the deoxygenation control device 82 can adjust the parameters of the deoxygenation device (such as negative pressure value, action time, etc.) according to the pressure value of the recovery chamber 30 fed back by the second monitoring device 72. When the oxygen content of the electroplating solution in the recovery chamber 30 monitored by the second monitoring device 72 is lower than the preset value, it indicates that the current deoxygenation operation has been completed. At this time, the deoxygenation control device 82 can control the deoxygenation device to be in the closed state. Nitrogen gas can be injected into the recovery chamber 30 to restore normal pressure and maintain the electroplating solution at the expected low oxygen content state.

[0091] This embodiment ensures that the water and oxygen content of the treated electroplating solution meets expectations through the design of monitoring and control devices.

[0092] Example 4

[0093] like Figure 4 As shown, this embodiment provides a method for recycling electroplating solution, using the real-time online electroplating solution recycling device 100 described in Embodiment 1 or Embodiment 2, including the following steps:

[0094] S1. Place the wafer into the electroplating chamber 10 to carry out the electroplating process;

[0095] S2. Electroplating waste liquid generated during the electroplating process is transported to the recovery chamber 30 through the guide pipe 20.

[0096] S3. The electroplating waste liquid is dehydrated and deoxygenated in the recovery chamber 30 to obtain the treated electroplating liquid.

[0097] S4. The treated electroplating solution is pumped back into the electroplating chamber 10 through the return pipe 60 under the drive of the pump body 50.

[0098] S5. Repeat steps S2 to S4 until the wafer electroplating process is completed.

[0099] In step S3, the electroplating solution is heated using a heating device to evaporate the portion of water content exceeding the preset value. The heating temperature of the heating device is 25 to 60°C. The electroplating recovery chamber 30 is evacuated using a vacuum negative pressure device to remove oxygen and reduce it to the ppm level. The negative pressure vacuum device increases the pressure of the recovery chamber 30 to -300 to -100 Pa.

[0100] Example 5

[0101] This embodiment provides a method for recycling and reusing electroplating solutions, using the real-time online electroplating solution recycling device 100 described in Embodiment 3, and includes the following steps:

[0102] S1. Place the wafer into the electroplating chamber 10 to carry out the electroplating process;

[0103] S2. Electroplating waste liquid generated during the electroplating process is transported to the recovery chamber 30 through the guide pipe 20.

[0104] S3. The electroplating waste liquid is dehydrated and deoxygenated in the recovery chamber 30 to obtain the treated electroplating liquid.

[0105] S4. The treated electroplating solution is pumped back into the electroplating chamber 10 through the return pipe 60 under the drive of the pump body 50.

[0106] S5. Repeat steps S2 to S4 until the wafer electroplating process is completed.

[0107] In step S3, the electroplating solution is heated using a heating device to evaporate the portion of water content exceeding the preset value. The heating temperature of the heating device is 25 to 60°C. The electroplating recovery chamber 30 is evacuated using a vacuum negative pressure device to remove oxygen and reduce it to the ppm level. The negative pressure vacuum device increases the pressure of the recovery chamber 30 to -300 to -100 Pa.

[0108] Further, in step S3, the first monitoring device 71 monitors the water content or free surface humidity of the electroplating solution in the recovery chamber 30, as well as the temperature of the electroplating solution. When the water content or free surface humidity of the electroplating solution in the recovery chamber 30 monitored by the first monitoring device 71 is equal to or higher than a preset value, the dewatering control device 81 controls or keeps the dewatering device in the open state to perform dewatering operation on the electroplating solution. During this process, the dewatering control device 81 can also adjust the parameters of the dewatering device (such as temperature value, action time, etc.) according to the temperature of the electroplating solution fed back by the first monitoring device 71. When the water content or free surface humidity of the electroplating solution in the recovery chamber 30 monitored by the first monitoring device 71 is lower than the preset value, it indicates that the dewatering operation has been completed at this stage, and the dewatering control device 81 can control the dewatering device to be in the closed state.

[0109] Accordingly, in step S3, the oxygen content of the electroplating solution in the recovery chamber 30 and the pressure inside the recovery chamber 30 are monitored by the second monitoring device 72. When the oxygen content fed back by the second monitoring device 72 is equal to or higher than the preset value, the deoxygenation control device 82 controls or keeps the deoxygenation device in the open state to perform the deoxygenation operation. During this process, the deoxygenation control device 82 can also adjust the parameters of the deoxygenation device (such as negative pressure value, action time, etc.) according to the pressure of the recovery chamber 30 fed back by the second monitoring device 72. When the oxygen content of the electroplating solution in the recovery chamber 30 monitored by the second monitoring device 72 is lower than the preset value, it indicates that the deoxygenation operation has been completed at this stage. At this time, the deoxygenation control device 82 can control the deoxygenation device to be in the closed state. At this time, nitrogen can be injected into the recovery chamber 30 to restore the normal pressure to keep the electroplating solution in the expected low oxygen content state.

[0110] The specific embodiments of the present invention have been described above. Based on the above description, those skilled in the art can make various changes and modifications without departing from the technical concept of the present invention.

Claims

1. A real-time online processing electroplating solution recovery and circulation device, characterized in that: It includes an electroplating chamber, a flow guide tube, a recovery chamber, a liquid sealing device, a pump body and a reflux pipe; The liquid outlet of the electroplating chamber is connected to the liquid inlet of the recovery chamber through a guide pipe, and the liquid outlet of the recovery chamber is connected to the liquid inlet of the electroplating chamber through a reflux pipe, and the pump body and the liquid sealing device are arranged on the reflux pipe; The recovery chamber is provided with a dewatering device and a deoxygenating device, wherein the dewatering device is used to remove the water content in the electroplating solution in the recovery chamber that exceeds a preset value, and the deoxygenating device is used to remove oxygen in the electroplating solution in the recovery chamber to reduce it to the ppm level range.

2. The electroplating solution recycling device for real-time online processing according to claim 1 is characterized in that: The dewatering device comprises a heating device, which heats the electroplating solution to evaporate the water content exceeding a preset value.

3. The electroplating solution recycling device for real-time online processing according to claim 2 is characterized in that: The heating device heats the electroplating solution to 25-60°C.

4. The electroplating solution recycling device for real-time online processing according to claim 1 is characterized in that: The deoxygenation device comprises a negative pressure vacuum device, which removes oxygen by evacuating the electroplating chamber to reduce the oxygen to a ppm level range.

5. The electroplating solution recycling device for real-time online processing according to claim 4 is characterized in that: The negative pressure vacuum equipment increases the pressure of the electroplating chamber to -300 to -100Pa.

6. The electroplating solution recycling device for real-time online processing according to claim 1 is characterized in that: The liquid sealing device is a U-shaped pipeline.

7. The electroplating solution recycling device for real-time online processing according to claim 1 is characterized in that: It also includes a first monitoring device and a water removal control device. The first monitoring device can monitor the water content of the plating solution or the humidity of the free surface of the plating solution in real time. The water removal control device controls the opening and closing state or working parameters of the water removal device according to the data fed back by the first monitoring device.

8. The electroplating solution recycling device for real-time online processing according to claim 1 is characterized in that: It also includes a second monitoring device and a deoxygenation control device. The second monitoring device is used to monitor the oxygen content of the electroplating solution in real time. The deoxygenation control device controls the on / off state or working parameters of the deoxygenation device according to the data fed back by the second monitoring device.

9. The electroplating solution recycling device for real-time online processing according to claim 1 is characterized in that: The liquid inlet and outlet of the recovery chamber are connected to the liquid outlets and inlets of a corresponding number of electroplating chambers through a plurality of guide tubes and reflux tubes, respectively, and each reflux tube is provided with a pump body and a liquid sealing device.

10. A method for recycling electroplating solution, characterized in that: The electroplating solution recovery and circulation device for real-time online processing according to any one of claims 1 to 9 comprises the following steps: S1, placing the wafer into the electroplating chamber to implement the electroplating process; S2, transporting the electroplating waste liquid generated during the electroplating process to the recovery chamber through the guide pipe; S3, dewatering and deoxygenating the electroplating waste liquid in the recovery chamber to obtain a treated electroplating solution; S4. The treated electroplating liquid is transported back to the electroplating chamber through the reflux pipe under the drive of the pump body; S5. Repeat the above steps S2 to S4 until the wafer electroplating process is completed.

11. The method for recycling electroplating solution according to claim 10, characterized in that: In step S3, a heating device is used to heat the electroplating solution so that the water content exceeding the preset value is evaporated, and the heating temperature of the heating device is 25 to 60°C; a vacuum negative pressure device is used to evacuate the recovery chamber to remove oxygen and reduce it to the ppm level range, and the negative pressure vacuum device increases the pressure of the recovery chamber to -300 to -100 Pa.

12. The method for recycling electroplating solution according to claim 10, characterized in that: When the real-time online processing of the plating liquid recovery and circulation device includes a first monitoring device and a water removal control device, in step S3, when the water content of the plating liquid or the free surface humidity of the plating liquid monitored by the first monitoring device is equal to or higher than a preset value, the water removal control device controls or keeps the water removal device in an open state; when the water content of the plating liquid or the free surface humidity of the plating liquid monitored by the first monitoring device is lower than the preset value, the water removal control device controls or keeps the water removal device in a closed state.

13. The method for recycling electroplating solution according to claim 10, characterized in that: When the real-time online processing of the plating liquid recovery and circulation device includes a second monitoring device and a deoxygenation control device, in step S3, when the oxygen content of the plating liquid monitored by the second monitoring device is equal to or higher than a preset value, the deoxygenation control device controls or keeps the deoxygenation device in an open state; when the oxygen content monitored by the second monitoring device is lower than the preset value, the deoxygenation control device controls or keeps the deoxygenation device in a closed state.

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