A steady-state thermal resistance testing device for semiconductor devices

Abstract

The present invention belongs to the field of semiconductor testing technology, and discloses a steady-state thermal resistance testing device for semiconductor devices, which includes a box body. On one side inside the box body, control equipment is provided, and on the other side, an operating table is provided. On the top of the operating table, a test board is provided. On both sides of the operating table, support frames are provided. In the middle of the support frames, a moving structure is provided. At the bottom of the moving structure, a test sensor is provided. In the middle of the test board, a test slot is opened, and a semiconductor device is arranged inside the test slot. The semiconductor device is clamped and fixed by a clamping block and a moving block. At the same time, the semiconductor device is cleaned by a cleaning structure to prevent dust and impurities from adhering to the surface, which may cause the surface of the semiconductor device to be uneven. Then, through the movement of a scraper, thermal paste is evenly applied to the surface of the semiconductor device, effectively filling the gaps and enhancing the heat conduction effect, thereby preventing the generation of contact thermal resistance and affecting the test effect.

Description

Technical Field

[0001] The present invention belongs to the technical field of semiconductor testing, and particularly relates to a steady-state thermal resistance testing device for semiconductor devices. Background Art

[0002] Semiconductor devices are electronic devices with electrical conductivity between that of good conductors and insulators, which utilize the special electrical properties of semiconductor materials to perform specific functions. They can be used to generate, control, receive, transform, amplify signals, and perform energy conversion. The semiconductor materials of semiconductor devices are silicon, germanium, or gallium arsenide, and can be used as rectifiers, oscillators, light emitters, amplifiers, photodetectors, etc. To distinguish them from integrated circuits, they are sometimes also called discrete devices. The basic structure of most two-terminal devices (i.e., crystal diodes) is a PN junction. When users test semiconductor devices, they need to use a steady-state thermal resistance testing device for semiconductor devices, which is a device used to measure the thermal resistance of semiconductor devices in a steady state. Its main functions include measuring parameters such as the steady-state thermal resistance, transient thermal impedance, and heat capacity of semiconductor devices, and being able to analyze the thermal structure inside the device package.

[0003] In the prior art, if there are gaps, unevenness, etc. at the contact interface between the semiconductor device and the testing device, contact thermal resistance will be generated, which will make the overall measured thermal resistance value larger than the actual intrinsic thermal resistance value of the device, resulting in the inability to accurately reflect the true thermal performance of the device. Moreover, the contact thermal resistance may fluctuate due to slight differences during each installation of the device, affecting the test results. Summary of the Invention

[0004] The present invention proposes the following technical solutions for the problems in the prior art:

[0005] A steady-state thermal resistance testing device for semiconductor devices, comprising a box body. On one side inside the box body, control equipment is provided, and on the other side, an operating table is provided. On the top of the operating table, a test board is provided. On both sides of the operating table, support frames are provided. In the middle of the support frames, a moving structure is provided. At the bottom of the moving structure, a test sensor is provided. In the middle of the test board, a test slot is opened. Inside the test slot, a semiconductor device is provided. On both sides of the test slot and on the top of the test board, moving slots are opened. Inside the inner wall of the moving slot, a first electric push rod is fixedly installed. One end of the first electric push rod is fixedly installed with a moving block. On the top of the moving block, a clamping block is provided. Between the moving block and the clamping block, a second electric push rod is provided. Inside the inner side wall of the clamping block, an installation slot is opened. Inside the installation slot, a cleaning structure is provided. On one side of the test board, a fixed block is provided. Inside the fixed block, a first motor is provided. The output end of the first motor is in transmission connection with a rotating rod. The top of the rotating rod is rotationally connected to the inner wall of the fixed block. The bottom of the fixed block is rotationally connected to the top of the operating table. On one side of the fixed block, a connecting block is fixedly installed. At the top of one end of the connecting block, a storage box is fixedly installed. At the bottom of the storage box, a connecting pipe is fixedly installed. On the other side of the fixed block, an installation block is fixedly installed. At the bottom of the installation block, a sliding slot is opened. Inside the sliding slot, a second motor is provided. The output end of the second motor is in transmission connection with a threaded rod. One end of the threaded rod is in threaded connection with a scraping plate. The top of the scraping plate is slidably connected to the inner wall of the sliding slot.

[0006] As a preference of the above technical solution, the first electric push rod, the moving block and the clamping block are symmetrically arranged with respect to the center of the test slot. The sides of the moving block and the clamping block that are close to each other are in contact. The semiconductor device is located between the moving block and the clamping block. The top of the clamping block is flush with the top of the semiconductor device.

[0007] As a preference of the above technical solution, on one side of the left clamping block and one side of the right moving block, inserting rods are fixedly installed. On one side of the right clamping block and one side of the left moving block, inserting slots are opened. The inserting rods are inserted into the inserting slots. The bottom of the moving block is slidably connected to the inner wall of the bottom of the moving slot.

[0008] As a preference of the above technical solution, a placing slot is opened at the bottom of the moving block. The second electric push rod is fixedly installed in the placing slot. One end of the second electric push rod passes through the bottom of the clamping block and extends into the installation slot. At the top of the second electric push rod, a pushing block is fixedly installed. On both sides of the top of the pushing block and the top of the second electric push rod, limiting structures are provided.

[0009] As a preference of the above technical solution, thermal paste is provided inside the storage box. One end of the connecting pipe passes through the connecting block and extends to the top of the semiconductor device. The test sensor is located above the storage box and the semiconductor device. The installation block and the connecting block are perpendicular to each other. The bottom of the first motor is fixedly installed on the top of the operating table. The second motor is fixedly installed on the inner wall of the sliding slot. One end of the threaded rod away from the second motor is rotationally connected to the inner wall of the sliding slot.

[0010] As a preference of the above technical solution, the cleaning structure includes a first cleaning block. First racks are fixedly installed on both sides of the first cleaning block. A gear is meshed with one side of each first rack. A movable rod is fixedly installed in the middle of the gear. A second rack is meshed with one side of the gear. A connecting plate is fixedly installed on one side of the second rack. A second cleaning block is fixedly installed on one side of the connecting plate. An activity groove is formed on the side of the first rack away from the gear. An electric telescopic rod is fixedly installed inside the activity groove. One end of the electric telescopic rod is fixedly installed with the inner wall of the installation groove.

[0011] As a preference of the above technical solution, the first cleaning block and the second cleaning block are located at the notch of the installation groove. The first rack and the second rack are both slidably connected with the inner wall of the installation groove. The movable rod is rotatably connected with the inner wall of the installation groove inside the left clamping block. The gear and the movable rod are both located inside the left installation groove. One end of the second rack passes through the right installation groove and extends to the inside of the left installation groove. The first cleaning block, the second cleaning block, the connecting plate, the first rack, the second rack, the gear, the movable rod and the electric telescopic rod are all symmetrically arranged with the center of the clamping block.

[0012] As a preference of the above technical solution, the limiting structure includes two limiting blocks. The tops of the two limiting blocks are slidably connected with the inner wall of the installation groove. The two limiting blocks are located on both sides of the pushing block. A connecting rod is fixedly installed on the side of the two limiting blocks away from the pushing block. A connecting spring is fixedly installed at one end of the connecting rod. One end of the connecting spring is fixedly installed with the inner wall of the installation groove. A limiting hole is formed at the end of the second electric push rod close to the pushing block. A limiting rod is inserted inside the limiting hole. One end of the limiting rod passes through the installation groove and extends to the outside of the clamping block. A movable block is fixedly installed at one end of the limiting rod.

[0013] As a preference of the above technical solution, the opposite sides of the two limiting blocks and the pushing block are in contact with each other, and the contacting sides are both inclined surfaces. The connecting rod and the connecting spring are both located on the top of the electric telescopic rod. The limiting rod is located at the bottom of the electric telescopic rod. The movable block is located on both sides of the clamping block. The two limiting blocks, the connecting rod, the limiting rod and the connecting spring are all located on one side of the first cleaning block and the second cleaning block, and they are symmetrically arranged with the center of the installation groove.

[0014] The beneficial effects of the present invention are as follows:

[0015] (1) The present invention clamps and fixes the semiconductor device through the clamping block and the moving block, and at the same time cleans the semiconductor device through the cleaning structure to prevent dust and impurities from adhering to the surface, making the surface of the semiconductor device uneven. Then, the heat-conducting paste is evenly applied to the surface of the semiconductor device by the movement of the scraping plate, effectively filling the gaps and enhancing the heat conduction effect, thereby preventing the generation of contact thermal resistance and affecting the test effect;

[0016] (2) In the present invention, the second electric push rod is limited within the installation groove inside the clamping block through a defined structure, which facilitates the first electric push rod to drive the moving block and the clamping block to move stably. And by pulling the movable block, the limiting rod no longer limits the second electric push rod. Then, by moving the clamping block upward, the limiting block no longer limits the second electric push rod and the clamping block, enabling the clamping block to be removed from the moving block, facilitating the cleaning of the remaining thermal paste and being able to clean the cleaning structure, thus facilitating reuse and improving the cleaning effect of the semiconductor device, and facilitating the improvement of the testing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 Fig. shows the overall structural schematic diagram of the embodiment;

[0018] Figure 2 Fig. shows the structural diagram of the operating table, support frame and moving structure of the embodiment;

[0019] Figure 3 Fig. shows the front view of the operating table, support frame and moving structure of the embodiment;

[0020] Figure 4 Fig. shows the structural diagram of the operating table and the test board of the embodiment;

[0021] Figure 5 Fig. shows the bottom structural diagram of the fixed block, connecting block and mounting block of the embodiment;

[0022] Figure 6 Fig. shows the structural diagram of the operating table, test board, clamping block and moving block of the embodiment;

[0023] Figure 7 Fig. shows the structural diagram of the clamping block and the moving block of the embodiment;

[0024] Figure 8 Fig. shows the structural diagram of the clamping block and the cleaning structure of the embodiment;

[0025] Figure 9 Fig. shows the sectional view of the clamping block of the embodiment;

[0026] Figure 10 Fig. shows the structural diagram of the cleaning mechanism and the limiting structure of the embodiment.

[0027] In the figure: 1. Box body; 2. Control device; 3. Operating table; 4. Test board; 5. Support frame; 6. Moving structure; 7. Test sensor; 8. Semiconductor device; 9. First electric push rod; 10. Moving block; 11. Clamping block; 12. Second electric push rod; 13. Cleaning structure; 131. First cleaning block; 132. First rack; 133. Gear; 134. Second rack; 135. Connecting plate; 136. Second cleaning block; 137. Electric telescopic rod; 14. Fixed block; 15. First motor; 16. Rotating rod; 17. Connecting block; 18. Storage box; 19. Connecting pipe; 20. Mounting block; 21. Second motor; 22. Threaded rod; 23. Scraper; 24. Insert rod; 25. Pushing block; 26. Limiting block; 27. Connecting rod; 28. Connecting spring; 29. Limiting rod; 30. Movable block. Detailed implementation manners

[0028] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0029] The present invention provides a steady-state thermal resistance testing device for semiconductor devices, as Figures 1 to 7As shown in the figure, it includes a box body 1. On one side inside the box body 1, a control device 2 is provided, and on the other side, an operating table 3 is provided. On the top of the operating table 3, a test board 4 is provided. On both sides of the operating table 3, support frames 5 are provided. In the middle of the support frames 5, a moving structure 6 is provided. At the bottom of the moving structure 6, a test sensor 7 is provided. In the middle of the test board 4, a test slot is opened. Inside the test slot, a semiconductor device 8 is provided. On both sides of the test slot and on the top of the test board 4, moving slots are opened. Inside the inner wall of the moving slot, a first electric push rod 9 is fixedly installed. One end of the first electric push rod 9 is fixedly installed with a moving block 10. On the top of the moving block 10, a clamping block 11 is provided. Between the clamping block 11 and the moving block 10, a second electric push rod 12 is provided. Inside the inner side wall of the clamping block 11, an installation slot is opened. Inside the installation slot, a cleaning structure 13 is provided. On one side of the test board 4, a fixed block 14 is provided. Inside the fixed block 14, a first motor 15 is provided. The output end of the first motor 15 is drivingly connected with a rotating rod 16. The top of the rotating rod 16 is rotationally connected with the inner wall of the fixed block 14. The bottom of the fixed block 14 is rotationally connected with the top of the operating table 3. On one side of the fixed block 14, a connecting block 17 is fixedly installed. On the top of one end of the connecting block 17, a storage box 18 is fixedly installed. At the bottom of the storage box 18, a connecting pipe 19 is fixedly installed. On the other side of the fixed block 14, an installation block 20 is fixedly installed. At the bottom of the installation block 20, a sliding slot is opened. Inside the sliding slot, a second motor 21 is provided. The output end of the second motor 21 is drivingly connected with a threaded rod 22. One end of the threaded rod 22 is threadedly connected with a scraper 23. The top of the scraper 23 is slidably connected with the inner wall of the sliding slot. Inside the storage box 18, a heat-conducting paste is provided. One end of the connecting pipe 19 passes through the connecting block 17 and extends to the top of the semiconductor device 8. The test sensor 7 is located above the storage box 18 and the semiconductor device 8. The installation block 20 and the connecting block 17 are arranged perpendicularly. The bottom of the first motor 15 is fixedly installed on the top of the operating table 3. The second motor 21 is fixedly installed on the inner wall of the sliding slot. One end of the threaded rod 22 away from the second motor 21 is rotationally connected with the inner wall of the sliding slot.

[0030] By placing the semiconductor device 8 inside the test slot of the test board 4 and starting the first electric push rod 9 to drive the moving block 10 and the clamping block 11 to move, the moving block 10 and the clamping block 11 move closer to each other and move to both sides of the semiconductor device 8 to clamp and fix the semiconductor device 8, preventing the semiconductor device 8 from moving during testing and affecting the test effect. When the moving block 10 and the clamping block 11 move to both sides of the semiconductor device 8, start the second electric push rod 12 to drive the clamping block 11 to move upward, so that the cleaning structure 13 inside the clamping block 11 moves above the clamping block 11. By starting the cleaning structure 13, clean the top of the semiconductor device 8 to remove impurities and dust on the surface of the semiconductor device 8, preventing the impurities and dust from adhering and causing the top of the semiconductor device 8 to be uneven, creating a gap between the semiconductor device 8 and the test sensor 7 and affecting the test results. After cleaning, use the second electric push rod 12 to move the clamping block 11 and the cleaning structure 13 back to their original positions. Then, transfer the thermal paste inside the storage box 18 to the top of the semiconductor device 8 through the connecting pipe 19. By starting the first motor 15 inside the fixing block 14 to drive the threaded rod 22 to rotate, the fixing block 14 drives the connecting block 17 to rotate along the top of the operating table 3. The fixing block 14 rotates 90 degrees, causing the connecting block 17, the storage box 18, and the connecting pipe 19 to rotate to one side of the test board 4, so that the mounting block 20 and the scraper 23 rotate to the top of the semiconductor device 8. Start the second motor 21 to drive the threaded rod 22 to rotate, causing the scraper 23 to move back and forth along the threaded rod 22 and evenly apply the thermal paste at the bottom of the scraper 23 to the top of the semiconductor device 8. Then, use the second motor 21 to drive the rotating rod 16 and the fixing block 14 to rotate, causing the fixing block 14 to rotate 90 degrees again, rotating the connecting block 17, the storage box 18, and the connecting pipe 19 to the rear side of the fixing block 14, and the mounting block 20 and the scraper 23 to rotate to one side of the test board 4. Then, apply the set electrical parameters to the semiconductor device 8 through the control device 2 to make it start to heat up and enter the heat transfer process. At the same time, install and fix the moving structure 6 through the support frame 5. Use the control device 2 to make the moving structure 6 drive the test sensor 7 to move to the top of the semiconductor device 8 and fit with it, and automatically collect relevant data such as temperature and power according to the sampling frequency. By cleaning the top of the semiconductor device 8 and evenly applying the thermal paste, the gap between the semiconductor device 8 and the test sensor 7 can be effectively filled, and at the same time, the heat conduction effect can be enhanced, thus facilitating the prevention of contact thermal resistance and facilitating testing.

[0031] As Figures 3 to 4 shown, the first electric push rod 9, the moving block 10, and the clamping block 11 are symmetrically arranged with respect to the center of the test slot. The sides of the moving block 10 and the clamping block 11 that are close to each other are in contact. The semiconductor device 8 is located between the moving block 10 and the clamping block 11, and the top of the clamping block 11 is flush with the top of the semiconductor device 8.

[0032] Through the symmetrically arranged first electric push rod 9, moving block 10 and clamping block 11, and then the first electric push rod 9 is used to push the moving block 10 and the clamping block 11 to move closer to each other, so that the sides facing each other are in contact, which is convenient for improving the stability of clamping the semiconductor device 8. Since the top of the clamping block 11 is flush with the top of the semiconductor device 8, it is convenient to improve the uniformity of applying thermal paste when applying thermal paste, and prevent the thermal paste from being applied to the edge of the semiconductor device 8, thus making it inconvenient to clean.

[0033] As Figures 7 to 8 shown, on one side of the left clamping block 11 and one side of the right moving block 10, inserting rods 24 are fixedly installed. On one side of the right clamping block 11 and one side of the left moving block 10, inserting slots are provided. The inserting rods 24 are inserted into the inserting slots, and the bottom of the moving block 10 is slidably connected to the inner wall of the bottom of the moving slot.

[0034] When the first electric push rod 9 pushes the moving block 10 and the clamping block 11 to move towards the semiconductor device 8, the clamping block 11 and one side of the moving block 10 move closer to each other, and the inserting rods 24 are inserted into the inserting slots, improving the stability of the moving block 10 and the clamping block 11 outside the semiconductor device 8, facilitating the limitation of the semiconductor device 8, and preventing the semiconductor device 8 from moving during testing and affecting the testing effect.

[0035] As Figures 9 to 10 shown, a placing groove is provided at the bottom of the moving block 10, and the push rod of the second motor 21 is fixedly installed in the placing groove. One end of the second electric push rod 12 passes through the bottom of the clamping block 11 and extends into the installation groove. A pushing block 25 is fixedly installed at the top of the second electric push rod 12, and limiting structures are provided on both sides of the top of the pushing block 25 and the top of the second electric push rod 12.

[0036] The placing groove facilitates the installation of the second electric push rod 12 on the moving block 10, and then the pushing block 25 is limited through the limiting structure, enabling the second electric push rod 12 and the pushing block 25 to be fixed to the clamping block 11. Thus, when the moving block 10 moves, under the action of the second electric push rod 12, the pushing block 25 and the limiting structure, the clamping block 11 can be driven to move together, facilitating the limitation of the semiconductor device 8. At the same time, by moving the limiting structure and no longer limiting the pushing block 25, the second electric push rod 12 is started to drive the pushing block 25 to move out of the installation groove of the clamping block 11, facilitating the removal of the clamping block 11, enabling the cleaning structure 13 inside the installation groove to be cleaned, thus facilitating reuse and improving the cleaning effect of the semiconductor device 8, and facilitating the improvement of the testing effect.

[0037] As Figures 7 to 9As shown in the figure, the cleaning structure 13 includes a first cleaning block 131. First racks 132 are fixedly installed on both sides of the first cleaning block 131. A gear 133 is meshed with one side of the first rack 132. A movable rod is fixedly installed in the middle of the gear 133. A second rack 134 is meshed with one side of the gear 133. A connecting plate 135 is fixedly installed on one side of the second rack 134. A second cleaning block 136 is fixedly installed on one side of the connecting plate 135. An activity groove is formed on the side of the first rack 132 away from the gear 133. An electric telescopic rod 137 is fixedly installed inside the activity groove. One end of the electric telescopic rod 137 is fixedly installed on the inner wall of the installation groove.

[0038] When the moving block 10 is attached to one side of the clamping block 11, the first cleaning block 131 and the second cleaning block 136 are located on both sides of the semiconductor device 8. First, start the second electric push rod 12 to drive the clamping block 11 to move above the semiconductor device 8. Then, start the electric telescopic rod 137 to push the first rack 132 to move away from the installation groove, so that the gear 133 drives the movable rod to rotate, thereby driving the second rack 134 to drive the connecting plate 135 and the second cleaning block 136 to move away from the installation groove, making the first cleaning block 131 and the second cleaning block 136 move closer to each other. By the telescopic movement of the electric telescopic rod 137, the first cleaning block 131 and the second cleaning block 136 move back and forth on the top of the semiconductor device 8 for cleaning, so as to remove the dust and impurities on the top of the semiconductor device 8, prevent the surface of the semiconductor device 8 from being uneven, cause a gap between the test sensor 7 and the semiconductor device 8, affect the heat conduction effect, and make it inconvenient for detection.

[0039] As Figures 8 to 10 shown in the figure, the first cleaning block 131 and the second cleaning block 136 are located at the notch of the installation groove. The first rack 132 and the second rack 134 are both slidably connected to the inner wall of the installation groove. The movable rod is rotatably connected to the inner wall of the installation groove inside the left clamping block 11. The gear 133 and the movable rod are both located inside the left installation groove. One end of the second rack 134 passes through the right installation groove and extends to the inside of the left installation groove. The first cleaning block 131, the second cleaning block 136, the connecting plate 135, the first rack 132, the second rack 134, the gear 133, the movable rod and the electric telescopic rod 137 are all symmetrically arranged with the center of the clamping block 11.

[0040] When the moving block 10 and the clamping block 11 move closer to each other, the second rack 134 moves into the inner part of the left mounting groove and meshes with the gear 133. When the electric telescopic rod 137 drives the first cleaning block 131 to move from the mounting groove opening to the top of the semiconductor device 8, the first rack 132 moves along the inner wall of the mounting groove, causing the gear 133 to drive the movable rod to rotate along the inner wall of the mounting groove, driving the second rack 134 to drive the connecting plate 135 to move along the inner wall of the mounting groove, so that the second cleaning block 136 moves from the mounting groove opening to the top of the semiconductor device 8, thus facilitating cleaning. Through the symmetrically arranged first cleaning block 131, second cleaning block 136, connecting plate 135, first rack 132, second rack 134, gear 133, movable rod and electric telescopic rod 137, it is convenient to improve the stability of the movement of the first cleaning block 131 and the second cleaning block 136 and enhance the cleaning effect, thus facilitating use.

[0041] As Figures 9 to 10 shown, the limiting structure includes two limiting blocks 26. The tops of the two limiting blocks 26 are slidably connected to the inner wall of the mounting groove. The two limiting blocks 26 are located on both sides of the pushing block 25. One end of the connecting rod 27 is fixedly installed on the side of the two limiting blocks 26 away from the pushing block 25. One end of the connecting spring 28 is fixedly installed on the inner wall of the mounting groove. A limiting hole is opened at one end of the second electric push rod 12 close to the pushing block 25. A limiting rod 29 is inserted into the limiting hole. One end of the limiting rod 29 passes through the mounting groove and extends to the outside of the clamping block 11. One end of the limiting rod 29 is fixedly installed with a movable block 30.

[0042] When the movable block 30 is moved to both sides of the clamping block 11, the movable block 30 drives the limiting rods 29 to move away from each other and no longer insert into the limiting holes. Then, the second electric push rod 12 is started to drive the pushing block 25 to move downward, so that the pushing block 25 no longer fits against one side of the two limiting blocks 26 and no longer presses the limiting blocks 26. The connecting spring 28 is no longer pressed, driving the connecting rod 27 and the limiting blocks 26 to move, causing the limiting blocks 26 to move closer to each other, so that the clamping block 11, the second electric push rod 12, and the pushing block 25 are no longer limited. The clamping block 11 is moved upward to remove and replace it, and the residual thermal paste on the clamping block 11 is cleaned, so that the first cleaning block 131 and the second cleaning block 136 inside the mounting groove can be cleaned and replaced, thus facilitating the cleaning effect of the first cleaning block 131 and the second cleaning block 136.

[0043] As Figure 10As shown, two limiting blocks 26 are attached to the opposite side of the pushing block 25, and the attached sides are both inclined planes. The connecting rod 27 and the connecting spring 28 are both located at the top of the electric telescopic rod 137, the limiting rod 29 is located at the bottom of the electric telescopic rod 137, and the movable block 30 is located on both sides of the clamping block 11. The two limiting blocks 26, the connecting rod 27, the limiting rod 29 and the connecting spring 28 are all located on one side of the first cleaning block 131 and the second cleaning block 136, and are symmetrically arranged with the center of the installation groove.

[0044] By fitting the inclined planes of the two limiting blocks 26 with the inclined plane on one side of the pushing block 25, and through the action of the connecting spring 28 and the connecting rod 27, the stability is improved, so that the pushing block 25 and the second electric push rod 12 can be fixed inside the installation groove and connected to the clamping block 11. Since the connecting rod 27 and the connecting spring 28 are both located at the top of the electric telescopic rod 137 and the limiting rod 29 is located at the bottom of the electric telescopic rod 137, the limiting rod 29 and the connecting rod 27 will not block the movement of the electric telescopic rod 137, thus affecting the movement of the first cleaning block 131 and the second cleaning block 136. Through the symmetrically arranged two limiting blocks 26, the connecting rod 27, the limiting rod 29 and the connecting spring 28, the stability of the limitation of the second electric push rod 12 and the pushing block 25 is improved.

[0045] Working principle: When in use, place the semiconductor device 8 inside the test slot of the test board 4, and start the first electric push rod 9 to drive the moving block 10 and the clamping block 11 to move, so that the moving block 10 and the clamping block 11 move closer to each other and move to both sides of the semiconductor device 8. Insert and connect through the slots and jacks to clamp and fix the semiconductor device 8. When the moving block 10 and the clamping block 11 move to both sides of the semiconductor device 8, the second rack 134 moves into the left installation slot and meshes with the gear 133. Then start the second electric push rod 12 to drive the clamping block 11 to move upward, so that the clamping block 11 moves above the semiconductor device 8. Then start the electric telescopic rod 137 to push the first rack 132 to move away from the installation slot, so that the gear 133 drives the movable rod to rotate along the inner wall of the installation slot, thereby driving the second rack 134, the connecting plate 135 and the second cleaning block 136 to move away from the installation slot, so that the first cleaning block 131 and the second cleaning block 136 move closer to each other. Through the telescopic movement of the electric telescopic rod 137, the first cleaning block 131 and the second cleaning block 136 move back and forth on the top of the semiconductor device 8 to clean it, so that the dust and impurities on the top of the semiconductor device 8 can be removed. After cleaning, through the action of the electric telescopic rod 137, the first rack 132, the gear 133 and the second rack 134, the first cleaning block 131 and the second cleaning block 136 are moved back to their original positions. Then, through the second electric push rod 12, the clamping block 11 is moved downward to a state flush with the semiconductor device 8. Then, the thermal paste inside the storage box 18 is conveyed to the top of the semiconductor device 8 through the connecting pipe 19. By starting the first motor 15 inside the fixing block 14 to drive the threaded rod 22 to rotate, the fixing block 14 drives the connecting block 17 to rotate along the top of the operating table 3. The fixing block 14 rotates 90 degrees, so that the connecting block 17, the storage box 18 and the connecting pipe 19 rotate to one side of the test board 4, so that the mounting block 20 and the scraper 23 rotate to the top of the semiconductor device 8. Start the second motor 21 to drive the threaded rod 22 to rotate, so that the scraper 23 moves back and forth along the threaded rod 22, and the bottom of it spreads the thermal paste on the top of the semiconductor device 8 evenly. Then, drive the rotating rod 16 and the fixing block 14 to rotate through the second motor 21, so that the fixing block 14 rotates 90 degrees again, rotates the connecting block 17, the storage box 18 and the connecting pipe 19 to the rear side of the fixing block 14, and rotates the mounting block 20 and the scraper 23 to one side of the test board 4. Then, apply the set electrical parameters to the semiconductor device 8 through the control device 2, so that it starts to heat up and enters the heat transfer process. Through the control device 2, the moving structure 6 drives the test sensor 7 to move to the top of the semiconductor device 8 and fit with it, and automatically collects relevant data such as temperature and power according to the sampling frequency.

[0046] When it is necessary to replace the cleaning clamping block 11, the first cleaning block 131 and the second cleaning block 136, move the movable block 30 to both sides of the clamping block 11. The movable block 30 drives the limiting rods 29 to move away from each other and no longer insert into the limiting holes. Then start the second electric push rod 12 to drive the pushing block 25 to move downward, so that the pushing block 25 no longer fits against one side of the two limiting blocks 26 and no longer presses the limiting blocks 26. The connecting spring 28 is no longer squeezed, and the pushing connecting rod 27 and the limiting blocks 26 are moved, so that the limiting blocks 26 move closer to each other, so that the clamping block 11 is no longer limited by the second electric push rod 12 and the pushing block 25. Move the clamping block 11 upward to remove and replace the clamping block 11, clean the residual thermal paste on the clamping block 11, and enable the first cleaning block 131 and the second cleaning block 136 inside the installation groove to be cleaned and replaced, thus facilitating the cleaning effect of the first cleaning block 131 and the second cleaning block 136.

[0047] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them.

Claims

1. A semiconductor device steady-state thermal resistance test device, comprising a box (1), characterized in that: A control device (2) is arranged on one side of the box body (1), and an operating table (3) is arranged on the other side thereof; a test board (4) is arranged on the top of the operating table (3); support frames (5) are arranged on both sides of the operating table (3); a moving structure (6) is arranged in the middle of the support frame (5); a test sensor (7) is arranged at the bottom of the moving structure (6); a test slot is arranged in the middle of the test board (4); a semiconductor device (8) is arranged inside the test slot; moving slots are arranged on both sides of the test slot and on the top of the test board (4); a first electric push rod (9) is fixedly mounted on the inner wall of the moving slot; a moving block (10) is fixedly mounted on one end of the first electric push rod (9); a clamping block (11) is arranged on the top of the moving block (10); a second electric push rod (12) is arranged in the middle of the clamping block (11) and the moving block (10); an installation slot is arranged on the inner wall of the clamping block (11); a cleaning structure (13) is arranged inside the installation slot; A fixed block (14) is provided on one side of the test plate (4), a first motor (15) is provided inside the fixed block (14), an output end of the first motor (15) is drivingly connected to a rotating rod (16), a top of the rotating rod (16) is rotatably connected to an inner wall of the fixed block (14), a bottom of the fixed block (14) is rotatably connected to a top of the operating table (3), a connecting block (17) is fixedly installed on one side of the fixed block (14), a storage box (18) is fixedly installed on the top of one end of the connecting block (17), a connecting pipe (19) is fixedly installed on the bottom of the storage box (18), a mounting block (20) is fixedly installed on the other side of the fixed block (14), a sliding groove is provided at the bottom of the mounting block (20), a second motor (21) is provided inside the sliding groove, an output end of the second motor (21) is drivingly connected to a threaded rod (22), one end of the threaded rod (22) is threadedly connected to a scraper (23), and the top of the scraper (23) is slidably connected to the inner wall of the sliding groove.

2. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: The first electric push rod (9), the moving block (10) and the clamping block (11) are symmetrically arranged around the center of the test slot; the moving block (10) and the clamping block (11) are in contact with each other on one side; the semiconductor device (8) is located between the moving block (10) and the clamping block (11); and the top of the clamping block (11) is flush with the top of the semiconductor device (8).

3. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: An insertion rod (24) is fixedly mounted on one side of the left clamping block (11) and one side of the right moving block (10). A slot is provided on one side of the right clamping block (11) and one side of the left moving block (10). The insertion rod (24) is plugged into the slot. The bottom of the moving block (10) is slidably connected to the inner wall of the bottom of the moving groove.

4. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: A placement groove is provided at the bottom of the moving block (10); a push rod of the second motor (21) is fixedly mounted in the placement groove; one end of the second electric push rod (12) passes through the bottom of the clamping block (11) and extends into the installation groove; a push block (25) is fixedly mounted on the top of the second electric push rod (12); and limiting structures are provided on both sides of the top of the push block (25) and the second electric push rod (12).

5. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: The storage box (18) is provided with thermal conductive paste inside, one end of the connecting tube (19) passes through the connecting block (17) and extends to the top of the semiconductor device (8), the test sensor (7) is located between the storage box (18) and the top of the semiconductor device (8), the mounting block (20) and the connecting block (17) are arranged vertically, the bottom of the first motor (15) is fixedly mounted on the top of the operating table (3), the second motor (21) is fixedly mounted on the inner wall of the slide groove, and the end of the threaded rod (22) away from the second motor (21) is rotatably connected to the inner wall of the slide groove.

6. The semiconductor device steady-state thermal resistance testing device according to claim 1, characterized in that: The cleaning structure (13) comprises a first cleaning block (131), first racks (132) are fixedly mounted on both sides of the first cleaning block (131), a gear (133) is meshed on one side of the first rack (132), a movable rod is fixedly mounted in the middle of the gear (133), a second rack (134) is meshed on one side of the gear (133), a connecting plate (135) is fixedly mounted on one side of the second rack (134), a second cleaning block (136) is fixedly mounted on one side of the connecting plate (135), a movable groove is formed on the side of the first rack (132) away from the gear (133), an electric telescopic rod (137) is fixedly mounted inside the movable groove, and one end of the electric telescopic rod (137) is fixedly mounted to the inner wall of the mounting groove.

7. The semiconductor device steady-state thermal resistance testing device according to claim 6, characterized in that: The first cleaning block (131) and the second cleaning block (136) are located at the notch of the mounting groove, the first rack (132) and the second rack (134) are both slidably connected to the inner wall of the mounting groove, the movable rod is rotatably connected to the inner wall of the mounting groove inside the left clamping block (11), the gear (133) and the movable rod are both located inside the left mounting groove, one end of the second rack (134) passes through the right mounting groove and extends to the inside of the left mounting groove, and the first cleaning block (131), the second cleaning block (136), the connecting plate (135), the first rack (132), the second rack (134), the gear (133), the movable rod and the electric telescopic rod (137) are all symmetrically arranged around the center of the clamping block (11).

8. The semiconductor device steady-state thermal resistance testing device according to claim 4, characterized in that: The limiting structure comprises two limiting blocks (26), the tops of the two limiting blocks (26) are slidably connected to the inner wall of the installation groove, the two limiting blocks (26) are located on both sides of the pushing block (25), a connecting rod (27) is fixedly installed on the side of the two limiting blocks (26) away from the pushing block (25), a connecting spring (28) is fixedly installed on one end of the connecting rod (27), and one end of the connecting spring (28) is fixedly installed on the inner wall of the installation groove, and a limiting hole is opened at one end of the second electric push rod (12) close to the pushing block (25), a limiting rod (29) is inserted into the limiting hole, one end of the limiting rod (29) passes through the installation groove and extends to the outside of the clamping block (11), and one end of the limiting rod (29) is fixedly installed with a movable block (30).

9. The semiconductor device steady-state thermal resistance testing device according to claim 8, characterized in that: The two limiting blocks (26) are fitted with one side opposite to the pushing block (25), and the fitting sides are both inclined surfaces. The connecting rod (27) and the connecting spring (28) are both located at the top of the electric telescopic rod (137). The limiting rod (29) is located at the bottom of the electric telescopic rod (137). The movable block (30) is located at both sides of the clamping block (11). The two limiting blocks (26), the connecting rod (27), the limiting rod (29) and the connecting spring (28) are all located at one side of the first cleaning block (131) and the second cleaning block (136), and are symmetrically arranged around the center of the mounting groove.

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